Composite material as well as preparation method, application and product thereof

Abstract

The invention relates to a composite material as well as a preparation method, application and a product thereof, belongs to the technical field of composite materials, and aims to solve the problems of poor toughness and relatively high expansion coefficient of the composite material so as to improve the barrier property and mechanical property of the composite material product. The composite material comprises a two-dimensional polymer and a high-molecular material matrix, wherein the high polymer material matrix is rubber or plastic. The two-dimensional polymer and the high-molecular material matrix have interface interaction and can better cooperate to bear stress together instead of being separated from each other, so that the overall performance of the material is improved; meanwhile, the two-dimensional polymer can limit thermal motion, caused by temperature, of a molecular structure of a high-molecular material matrix, so that the overall expansion degree of the composite material is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of composite materials, in particular to a composite material and a preparation method, application and product thereof. BACKGROUND

[0002] High polymer materials are a kind of materials widely used at present, which have high performance and are suitable for high-end fields such as aerospace, electronic packaging, new energy and biomedical treatment.

[0003] Generally, high polymer materials include resin, polyimide, rubber and plastic, etc. However, due to the disordered molecular chains in the high polymer materials, there are defects such as large gap and low density, and the toughness cannot meet the use requirements in low-temperature and high-pressure environments. In addition, the high polymer materials can be wound with carbon fibers to prepare products. However, there is a large difference in the expansion coefficients between the carbon fibers and the high polymer materials (for example, the expansion coefficient of carbon fibers at room temperature is about -0.74x10 -6 ℃ -1 , and the expansion coefficient of epoxy resin is about 60x10 -6 ℃ -1 ). Such difference will cause serious stress residual in the carbon fiber reinforced epoxy resin based composite material when used in a low-temperature environment (such as liquid hydrogen, liquid oxygen, liquid helium, etc.), thereby causing micro-cracks in the composite material. When the carbon fibers and the high polymer materials are prepared into pressure-containing sealing elements (such as pressure vessels) or products, the expansion and connection of the micro-cracks are easy to form leakage channels, thereby causing the leakage of gas molecules or liquid, and poor barrier property.

[0004] Therefore, there is an urgent need for a relatively optimal composite material and a product manufactured therefrom to improve the toughness of the composite material, reduce the expansion coefficient, and thereby improve the barrier property of the product or the product. SUMMARY

[0005] In view of the above analysis, the present application aims to provide a composite material and a preparation method, application and product thereof to solve the problems of poor toughness and relatively high expansion coefficient of the composite material, and thereby improve the barrier property and mechanical property of the composite material product.

[0006] In one aspect, the present application provides a composite material, which comprises a two-dimensional polymer and a high polymer material matrix.

[0007] The high polymer material matrix is rubber or plastic.

[0008] Further, the mass ratio of the two-dimensional polymer to the high polymer material matrix is 1:100-1:1.

[0009] Further, the plastic includes thermosetting plastic and thermoplastic.

[0010] Further, the thermosetting plastic comprises epoxy resin, polyimide, unsaturated polyester resin or phenolic resin.

[0011] Preferably, the epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, glycidyl amine type epoxy resin or alicyclic epoxy resin.

[0012] Further, the rubber material is styrene butadiene rubber, chloroprene rubber, nitrile rubber, ethylene propylene terpolymer rubber, isoprene rubber, butyl rubber, polysulfide rubber or polyurethane rubber.

[0013] Further, the thermoplastic plastic is polyethylene terephthalate, high-density polyethylene, polyvinyl chloride, low-density polyethylene, polypropylene or polystyrene.

[0014] Further, the two-dimensional polymer is two-dimensional polyaramid.

[0015] Further, the composite material further comprises one or more of interfacial compatibilizer, flame retardant and nano-barrier synergist;

[0016] Preferably, the interfacial compatibilizer is silane coupling agent and / or maleic anhydride grafting.

[0017] Preferably, the flame retardant is phosphorus-nitrogen flame retardant.

[0018] Preferably, the nano-barrier synergist is montmorillonite and / or nano-material.

[0019] In another aspect, the present application provides a preparation method of a composite material, comprising the following steps:

[0020] S1: exfoliation, adding the two-dimensional polymer into a high-polarity solvent, and then dispersing by ultrasonic;

[0021] S2: blending, adding a polymer material matrix into step S1 in proportion, and then stirring, purifying, pre-curing and degassing to obtain the composite material.

[0022] Further, the polymer material matrix is epoxy resin, unsaturated polyester resin or phenolic resin; and the viscosity of the epoxy resin, unsaturated polyester resin or phenolic resin is 0.1-0.5 Pa·s after being treated before step S2.

[0023] Further, when the polymer material matrix is polyimide, the preparation method further comprises step S3: imidization forming, using a ladder temperature program: 80℃ / 1h→150℃ / 1h→250℃ / 2h→300℃ / 1h, the temperature rising rate is ≤2℃ / min; and the pressure is controlled at 0.5-1 MPa.

[0024] Further, when the polymer material matrix is rubber material, the preparation method further comprises a step S3 mixing in an internal mixer; and a step S4 vulcanization.

[0025] Further, when the polymer material matrix is thermoplastic, the preparation method further comprises a step S3 molding.

[0026] The application provides application of the composite material in an article.

[0027] Further, the article comprises a plastic article and a rubber article, and the composite material is one of matrix materials of the article; or the composite material is a coating or an adhesive layer of the article.

[0028] The application provides a plastic-based composite material article, raw materials of the article comprising a two-dimensional polymer and a polymer material matrix.

[0029] The polymer material matrix is thermosetting plastic.

[0030] Further, the raw materials of the article further comprise carbon fibers.

[0031] Further, the raw materials of the article further comprise nanomaterials.

[0032] Preferably, the nanomaterials comprise SiO2 nanoparticles, Ti3C2T x nanosheets or graphene.

[0033] The application provides a plastic-based composite material article, raw materials of the article comprising a two-dimensional polymer and thermoplastic.

[0034] The application provides a rubber article, raw materials of the article comprising a two-dimensional polymer and rubber.

[0035] Compared with the prior art, the application can at least achieve one of the following beneficial effects:

[0036] 1、In the application, the two-dimensional polymer is compounded with the polymer material matrix to prepare the composite material, and there is an interface interaction between the two-dimensional polymer and the polymer material matrix. The interaction includes physical filling and chemical bonding, and the two can work better in cooperation to bear stress together instead of being separated from each other, so that the overall performance of the material is improved; at the same time, the two-dimensional polymer can limit the thermal motion of the molecular structure of the polymer material matrix caused by temperature, so that the expansion degree of the overall composite material is reduced.

[0037] 2. The application also provides a preparation method of the composite material, first pretreating the two-dimensional polymer, adding it into a high-polarity solvent for sheet layer peeling, and then blending with a polymer material matrix after ultrasonic treatment to obtain the composite material.

[0038] 3. The application can prepare products or articles by compounding the composite material or the composite material with carbon fibers, mainly including plastic articles and rubber articles.

[0039] The above technical solutions can be combined with each other in the application to achieve more preferred combination solutions. Other features and advantages of the application will be described in the subsequent specification, and some advantages will become apparent from the specification or be understood by implementing the application. The purposes and other advantages of the application can be achieved and obtained from the contents specifically indicated in the specification and the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0040] The accompanying drawings are included to provide a further understanding of the application and are incorporated herein and constitute a part of the application. The same reference numbers in the drawings refer to the same elements throughout.

[0041] Figure 1 Figure 4 is a schematic diagram of the molecular structure of the two-dimensional polymer mixed with thermosetting plastic;

[0042] Figure 2 Figure 5 is a schematic diagram of the high-strength barrier property of the two-dimensional polymer modified epoxy resin material;

[0043] Figure 3 Figure 6 is a contrast real object diagram of the two-dimensional polymer before and after adding rubber. DETAILED DESCRIPTION

[0044] The preferred embodiments of the application are specifically described below in combination with the drawings, wherein the drawings constitute a part of the application and are used to explain the principles of the application together with the embodiments of the application, but are not used to limit the scope of the application.

[0045] The polymer material is a kind of material widely used at present, has high performance, and is suitable for high-end fields such as aerospace, electronic packaging, new energy, and biomedical treatment.

[0046] General high polymer materials include resin, polyimide, rubber and plastic, etc. However, due to the disordered molecular chains in the high polymer materials, there are defects such as large gap and low density, and the toughness cannot meet the use in low temperature and low pressure environment. In addition, the high polymer material can be wound with carbon fiber to prepare a product. However, due to the large difference between the expansion coefficients of the carbon fiber and the high polymer material (for example, the expansion coefficient of the carbon fiber at room temperature is about -0.74*10 -6 ℃ -1 , and the expansion coefficient of the epoxy resin is about 60*10 -6 ℃ -1 ). This difference will cause serious stress residual in the carbon fiber reinforced epoxy resin based composite material when used in low temperature environment (such as liquid hydrogen, liquid oxygen, liquid helium, etc.), so that microcracks are generated in the composite material. When the carbon fiber and the high polymer material are prepared into a pressure sealing member (such as a pressure vessel) or a product, the expansion and connection of the microcracks are easy to form a leakage channel, so that the gas molecules or liquid leak, and the barrier property is poor.

[0047] Therefore, the present application provides a composite material, which comprises a two-dimensional polymer and a high polymer material matrix.

[0048] The high polymer material matrix is rubber or plastic.

[0049] Compared with the prior art, the two-dimensional polymer and the high polymer material matrix are compounded in the present application to prepare a composite material, and there is an interface interaction between the two-dimensional polymer and the high polymer material matrix. This interaction includes physical adsorption and chemical bonding, and the two can work better together to bear stress instead of separating from each other, so as to improve the overall performance of the material; at the same time, the two-dimensional polymer can limit the thermal motion of the molecular chains of the high polymer material matrix, so as to reduce the overall expansion degree of the composite material. When the composite material is prepared into a product or an article, the toughness of the product or the article can be improved, and at the same time, when the composite material is compounded with carbon fiber, the difference between the expansion coefficients of the two is small, no crack is generated, and the barrier property is high.

[0050] Specifically, the mass ratio of the two-dimensional polymer to the high polymer material matrix is 1:100-1:1.

[0051] Preferably, the mass ratio of the two-dimensional polymer to the high polymer material matrix is 1:100-1:10.

[0052] It should be noted that in the present application, the amount of the two-dimensional polymer and the polymer material matrix needs to be strictly controlled. When the mass ratio of the two-dimensional polymer and the polymer material matrix is less than 1:100, the content of the two-dimensional polymer is less, which cannot be uniformly dispersed in the polymer material matrix, the effect is reduced, the material performance is uneven, and the toughness cannot be effectively improved. When the mass ratio of the two-dimensional polymer and the polymer material matrix is higher than 1:1, the content of the two-dimensional polymer is higher, and the agglomeration of the two-dimensional polymer cannot improve the toughness of the composite material, and cannot effectively reduce the expansion coefficient of the composite material.

[0053] Therefore, the mass ratio of the two-dimensional polymer and the polymer material matrix in the present application can be 1:100, 1:90, 1:95, 1:80, 1:84, 1:70, 1:76, 1:60, 1:62, 1:50, 1:55, 1:40, 1:48, 1:30, 1:35, 1:20, 1:22, 1:10, 1:8, 1:6, 1:5, 1:3, 1:2 or 1:1.

[0054] Specifically, the two-dimensional polymer is a two-dimensional polyaramid.

[0055] It should be noted that the two-dimensional polyaramid has good mechanical properties and dimensional stability. When the two-dimensional polyaramid is compounded with the polymer material matrix, the two-dimensional polyaramid plays a role of physical filling in the matrix. At the same time, the two-dimensional polyaramid can be dispersed in the polymer material matrix to form a complex network structure, thereby improving the toughness of the composite material.

[0056] Because the molecular chain of the polymer material matrix will move when subjected to external force or temperature change. After the addition of the two-dimensional polyaramid, the two-dimensional polyaramid can limit the movement of the molecular chain of the polymer matrix, thereby improving the toughness of the composite material.

[0057] The polymer material generally has a high expansion coefficient, because the molecular chain of the polymer material will move when the temperature rises or falls, causing the material to expand in volume. When the two-dimensional polyaramid is added, it can limit the movement of the polymer matrix in the composite material, and the rigid structure of the two-dimensional polyaramid will limit the movement of the molecular chain of the polymer matrix, thereby reducing the overall expansion degree or expansion coefficient of the composite material.

[0058] When the polymer material is compounded with carbon fiber, the expansion coefficients of the two are quite different, and there is stress residual in the obtained product or article in high temperature or low temperature environment, thereby causing micro-cracks to occur in the product or article. After the two-dimensional polyaramid is added to the polymer material matrix, not only the toughness of the obtained composite material can be improved, but also the expansion coefficient of the obtained composite material can be reduced. When the obtained composite material is compounded with carbon fiber, there will be no cracks in the obtained product or article, thereby improving the barrier property.

[0059] The two-dimensional polyaramid used in the application is the two-dimensional polyaramid disclosed in CN 117832705A.

[0060] Specifically, the plastic includes thermosetting plastic and thermoplastic plastic.

[0061] Preferably, the thermosetting plastic includes epoxy resin, polyimide, unsaturated polyester resin or phenolic resin.

[0062] Preferably, the epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, glycidyl amine type epoxy resin or alicyclic epoxy resin.

[0063] Further preferably, the bisphenol A type epoxy resin is E-55 (616), E-51 (618), E-44 (6101), E-42 (634), E-35 (637), E-20 (601), E-12 (604), E-06 (607) or E-03 (609).

[0064] Further preferably, the bisphenol F type epoxy resin is HS-170, YLE-1300F or EPALLOY 8220.

[0065] It should be noted that bisphenol F epoxy resin, also known as bisphenol F diglycidyl ether, is referred to as BPF resin, which is prepared by reacting phenol with formaldehyde under acidic catalysis to form bisphenol F, and then performing polycondensation reaction with epichlorohydrin in the presence of sodium hydroxide. Common trade names are HS-170, YLE-1300F or EPALLOY 8220.

[0066] Further preferably, the glycidyl amine type epoxy resin is AG-80 (tetraglycidyl diaminodiphenylmethane), MY720, MF-4101 (tetrafunctional glycidyl amine), AFG-90 (modified glycidyl amine), ELM434 (tetraglycidyl amine), jER604 (glycidyl amine type), TGAP (triglycidyl p-aminophenol).

[0067] Further preferably, the alicyclic epoxy resin is ERL-4221, 2021P, CY179 or UVR-6105.

[0068] It should be noted that the two-dimensional sheet in the two-dimensional polyaramid has a high aspect ratio structure, which can force gas or liquid molecules to detour, significantly prolonging the penetration path in the alicyclic epoxy resin matrix; the alicyclic epoxy resin (such as UVR-6105) forms a high crosslinking density network under anhydride curing agent (such as methylhexahydrophthalic anhydride), improving the mechanical properties and increasing the barrier property.

[0069] Specifically, the polyimide is TP-8549, CP-0644, Ultem 1000, Ultem 2000, Ultem 4000, polyetherimide, polyesterimide or polyamideimide.

[0070] It should be noted that there is an interface interaction between the two-dimensional polyaramid and the polymer material matrix. This interaction includes physical filling and chemical bonding. For thermosetting plastics such as epoxy resin, polyimide and other polymer matrices, the polar groups (such as amide groups) on the surface of the two-dimensional polyaramid can interact with the polar functional groups (such as hydroxyl groups in epoxy resin, carbonyl groups in polyimide, etc.) in the matrix. This interaction enhances the adhesion between the two-dimensional polyaramid and the matrix, so that the two-dimensional polyaramid and the matrix can work together better to bear stress under external force, such as pressure environment, rather than separate from each other, thereby improving the toughness of the composite material.

[0071] Specifically, the rubber material is styrene butadiene rubber, chloroprene rubber, nitrile rubber, ethylene propylene diene rubber, isoprene rubber, butyl rubber, polysulfide rubber or polyurethane rubber.

[0072] It should be noted that the two-dimensional polyaramid is compounded with the rubber material, and when the two-dimensional polyaramid is added to the rubber material, there is a chemical bonding and physical adsorption effect. The two-dimensional polyaramid surface has polar groups such as amide groups, which can interact with the polar groups (such as nitrile groups in nitrile rubber) in the rubber matrix through chemical bonds (such as hydrogen bonds, covalent bonds), to enhance the interface bonding force; at the same time, the lamellar structure of the two-dimensional polyaramid can form good physical adsorption with the rubber matrix, increasing the mechanical interlocking action of the interface.

[0073] Specifically, the thermoplastic plastic is polyethylene terephthalate, high-density polyethylene, polyvinyl chloride, low-density polyethylene, polypropylene or polystyrene.

[0074] It should be noted that in the present application, two-dimensional polyaramid is added to the thermoplastic plastic, and the two-dimensional polyaramid is dispersed in the thermoplastic plastic matrix in the form of nanosheet, etc., which has high specific surface area and excellent mechanical properties, can effectively share the load, and improve the overall strength and stiffness of the composite material. The two-dimensional polyaramid nanosheet can support the matrix like a "skeleton" and hinder the propagation of cracks, thereby significantly improving the fracture toughness of the composite material.

[0075] At the same time, the two-dimensional polyaramid and the thermoplastic plastic matrix form a good interface bond through physical or chemical action. This interface bond can effectively transfer stress, so that the reinforcing phase and the matrix work together, thereby improving the interface strength of the composite material.

[0076] It should be noted that the physical adhesion is through intermolecular forces, the two-dimensional polymer is filled into the molecular net gap as an interlayer, and the deformation of the molecular chain or molecular net is hindered, and the chemical adhesion is to crosslink with the polymer matrix by using the amide bond or modified functional group of the two-dimensional polymer, so that the material strength is not reduced and the material toughness can be greatly improved.

[0077] The application provides a preparation method of a composite material, comprising the following steps:

[0078] S1: sheet layer peeling, the two-dimensional polymer is added to a high-polarity solvent, and then ultrasonic dispersion is performed;

[0079] S2: blending, a polymer material matrix is proportionally added to step S1, and then stirring and purification are performed to obtain the composite material.

[0080] It should be noted that in step S1 of the application, the sheet layer structure of the two-dimensional polyaramid is fully unfolded by sheet layer peeling and dispersion in a high-polarity solvent. In step S2, when the two-dimensional polyaramid is blended with the polymer material matrix, the well-dispersed two-dimensional polyaramid sheet layers can be uniformly distributed in the matrix. This uniform distribution is similar to forming a reinforcing phase in the matrix, which can effectively disperse stress and prevent crack propagation, thereby improving toughness.

[0081] Specifically, in the sheet layer peeling process, a high-polarity solvent is used for treatment, and the concentration is 5-10wt%.

[0082] It should be noted that the high-polarity solvent is N,N-dimethylformamide (DMF) or N-methyl pyrrolidone (NMP), which can avoid the restacking of the sheet layers after peeling.

[0083] Specifically, in the ultrasonic treatment process, the ultrasonic power is 200-500W, and the ultrasonic time is 1-2h.

[0084] It should be noted that ultrasonic treatment can uniformly disperse the two-dimensional polyaramid nanosheet layer structure molecules, so that the sheet layer thickness of the two-dimensional polyaramid is <100nm, and the in-plane minimum size is >50nm. The ultrasonic power can be 200W, 210W, 220W, 230W, 240W, 250W, 270W, 290W, 300W, 320W, 340W, 350W, 380W, 400W, 410W, 430W, 450W, 470W, 490W or 500W.

[0085] Specifically, the stirring speed is 50-2000rpm, and the shear rate is 1-1000s -1 .

[0086] It should be noted that the two-dimensional polymer is a material with a sheet structure, for example, two-dimensional polyaramid. When the stirring speed is 50-2000 rpm and the shear rate is 1-1000 s -1 , the two-dimensional polyaramid can be uniformly dispersed in the polymer material matrix. Under suitable stirring and shearing conditions, the two-dimensional polyaramid sheet can be better surrounded by the polymer material matrix or the two-dimensional polyaramid sheet can be filled in the gap of the polymer material matrix molecular chain, effectively avoiding the agglomeration of the two-dimensional polyaramid sheet.

[0087] The stirring speed of the present application can be 50 rpm, 60 rpm, 70 rpm, 80 rpm, 90 rpm, 100 rpm, 110 rpm, 120 rpm, 130 rpm, 140 rpm, 150 rpm, 160 rpm, 170 rpm, 180 rpm, 190 rpm, 200 rpm, 300 rpm, 400 rpm, 500 rpm, 600 rpm, 700 rpm, 800 rpm, 900 rpm, 1000 rpm, 1200 rpm, 1500 rpm, 1600 rpm, 1800 rpm or 2000 rpm.

[0088] The shear rate of the present application can be 1 s -1 , 10 s -1 , 50 s -1 , 60 s -1 , 80 s -1 , 100 s -1 , 120 s -1 , 200 s -1 , 250 s -1 , 300 s -1 , 320 s -1 , 400 s -1 , 470 s -1 , 520 s -1 , 600 s -1 , 630 s -1 , 680 s -1 , 700 s -1 , 750 s -1 , 800 s -1 , 860 s -1 , 900 s -1 , 950 s -1 or 1000 s -1 .

[0089] If the stirring speed is too low, the two-dimensional polyaramid sheet layers will gather together due to their own gravity and other factors to form larger clusters, which cannot effectively fill the gaps between the molecular chains of the polymer material matrix. If the shear rate is too high, the molecular chains of the polymer matrix may be broken. The molecular chain structure of the polymer material is crucial to its performance, and the breaking of the molecular chains will reduce the molecular weight of the material, thereby affecting its mechanical properties, processing properties, etc.

[0090] Specifically, the polymer material matrix is epoxy resin, unsaturated polyester resin or phenolic resin; before step S2, the viscosity of the epoxy resin, unsaturated polyester resin or phenolic resin is ensured to be 0.1-0.5 Pa·s.

[0091] It should be noted that in the present application, when the polymer material is epoxy resin and the like, it is relatively viscous, so it needs to be heated to ensure that the viscosity of the epoxy resin and the like is 0.1-0.5 Pa·s, so that the two-dimensional polymer can be uniformly dispersed in the epoxy resin and the like.

[0092] In the present application, during the pre-curing and debubbling process, the stirred material needs to be debubbled in a vacuum oven at 40-70℃ for more than 30 min to avoid the presence of holes in the cured composite material and reduce the toughness of the composite material.

[0093] Specifically, when the polymer material matrix is epoxy resin and the like, the preparation method further comprises step S3, curing.

[0094] Preferably, the curing agent is 4,4'-diaminodiphenyl sulfone (DDS), aromatic amine (DIABO) or acid anhydride curing agent.

[0095] Further preferably, step curing is adopted, 80℃ / 1h→120℃ / 2h→180℃ / 3h.

[0096] It should be noted that in the present application, two-dimensional polyaramid is added to the epoxy resin and the like, and step-by-step heating or step curing is adopted during the curing stage, first curing at a temperature of 80℃ for 1h, then curing at a temperature of 120℃ for 2h, and finally curing at a temperature of 180℃ for 3h, the purpose of which is to avoid the orientation disorder of the two-dimensional polyaramid sheet layers caused by high-temperature sudden rise, so as to effectively improve the toughness of the composite material and reduce the expansion coefficient of the composite material.

[0097] Preferably, one of an interfacial compatibilizer, a flame retardant and a nano-barrier synergist is added in step S2.

[0098] Preferably, the interfacial compatibilizer is selected from silane coupling agents and maleic anhydride grafts.

[0099] It should be noted that the amount of silane coupling agent is 0.5-2% of the mass of the two-dimensional polyaramid, and the amount of maleic anhydride grafting agent is 3-8% of the mass of the epoxy resin and other materials. There are problems such as weak interfacial bonding force, poor compatibility and poor dispersibility between the two-dimensional polyaramid and the epoxy resin and other materials. Therefore, the two-dimensional polyaramid is surface modified to improve the interfacial compatibility and dispersibility of the two-dimensional polyaramid and the epoxy resin and other materials.

[0100] The silane coupling agent contains a bifunctional structure (such as KH550, KH560), one end of which is an alkoxy group (which forms a silanol group after hydrolysis), and the other end of which is an organic active group (amino group, epoxy group, etc.). The alcohol group is dehydrated and condensed with the hydroxyl group / carboxyl group on the surface of the two-dimensional polyaramid to form a Si-O-C covalent bond; and the organic end reacts with the epoxy resin and other materials to enhance the interfacial bonding.

[0101] When the silane coupling agent is compounded with the maleic anhydride grafting agent, the polar groups of the silane and the anhydride groups form a hydrogen bond network, which further improves the composite material.

[0102] Preferably, the flame retardant is a phosphorus-nitrogen flame retardant.

[0103] It should be noted that although the two-dimensional polyaramid has intrinsic barrier properties, the epoxy resin material is flammable and needs to be synergistically flame-retardant, especially when it is in contact with strong oxidizing solutions such as liquid oxygen, which can avoid the risk of burning or explosion. The total amount of the flame retardant is controlled to be 10-20wt% of the matrix to avoid excessive damage to the mechanical properties.

[0104] Preferably, the nano-barrier synergist is montmorillonite and / or a nano material.

[0105] It should be noted that in the invention, the nano-barrier synergist is montmorillonite, and the amount of montmorillonite added is 3-5wt% of the mass of the epoxy resin and other materials, which significantly improves the barrier properties of the composite material, but excessive montmorillonite can easily lead to agglomeration.

[0106] Further preferably, the nano material is SiO2 nanoparticles, Ti3C2T x Nano lamella or graphene.

[0107] In the present invention, when the two-dimensional polymer and the epoxy resin and other materials are blended, the nano material is added, and the amount of the nano material added is 1-10wt% of the amount of the epoxy resin and other materials, which can improve the overall performance of the composite material, such as strength, toughness and other mechanical properties, and can also significantly improve the barrier properties, but the nano material exceeds 10wt% and can easily lead to agglomeration.

[0108] Specifically, when the polymer material matrix is polyimide, the interfacial compatibilizer is added in step S2.

[0109] It should be noted that when the two-dimensional polymer is compounded with the polyimide, an interfacial compatibilizer needs to be added to modify the surface of the two-dimensional polyaramid and improve the interfacial compatibility and dispersibility of the two-dimensional polymer and the epoxy resin matrix. The interfacial compatibilizer is selected from silane coupling agent KH-560 (γ-glycidoxypropyltrimethoxysilane), and the addition amount of the silane coupling agent is 0.5-1.5% of the mass of the polyimide.

[0110] Specifically, when the polymer material matrix is polyimide, the preparation method further comprises a step S3 of imidization forming, and a ladder temperature rising program is adopted: 80℃ / 1h→150℃ / 1h→250℃ / 2h→300℃ / 1h, and the temperature rising rate is ≤2℃ / min; the pressure is controlled to be 0.5-1MPa.

[0111] Specifically, N2 protection is adopted in the imidization forming process, and the flow rate is ≥20L / min.

[0112] It should be noted that in the imidization forming process of the present application, the temperature is raised in steps, and the temperature rising rate is controlled to be ≤2℃ / min, so as to ensure uniform imidization of the polyimide, and the temperature of the material inside and surface is uniform and consistent, and thermal stress and cracks caused by rapid temperature rising are reduced.

[0113] First, 80℃ is maintained for 1h, which can preliminarily remove the solvent and low molecular weight impurities, and at the same time, the slight dehydration reaction of the polyamic acid starts. The mild temperature rising can avoid bubbles and holes caused by rapid solvent evaporation, and ensure the density of the material.

[0114] At 150℃, the dehydration and preliminary imidization are further carried out, and the polyimide structure starts to form. At this temperature, the polyamic acid starts to significantly dehydrate to form a stable imide ring structure, and at the same time, the thermal stress caused by rapid temperature rising is avoided.

[0115] At 250℃, the imidization reaction is completed, and a completely cross-linked polyimide network is formed. Long-time high-temperature treatment ensures that the imidization reaction proceeds sufficiently, and a uniform polyimide structure is formed, and at the same time, the non-uniformity of the material performance caused by local overheating is avoided.

[0116] At 300℃, the polyimide structure is further stabilized, and the residual low molecular weight by-products are removed. High-temperature treatment can improve the thermal stability and mechanical properties of the material, and at the same time, the uniformity and consistency of the material are ensured.

[0117] It should be noted that the pressure needs to be controlled to be 0.5-1MPa during the imidization forming process, which can effectively inhibit the delamination of the two-dimensional polymer and the polyimide, and further ensure that the two-dimensional polymer is effectively compounded with the polyimide.

[0118] Specifically, when the polymer material matrix is rubber, an interfacial compatibilizer is added in step S2.

[0119] It should be noted that when the polymer material matrix is rubber, the rubber is blended with the two-dimensional polymer with the addition of an interfacial compatibilizer, which is a silane coupling agent. The amount of silane coupling agent added is 0.5-1.5% of the mass of the rubber.

[0120] Specifically, when the polymer material matrix is rubber, the preparation method further comprises a step S3 of banburying; and a step S4 of vulcanizing.

[0121] Preferably, the rotation speed during the banburying process is 50-80 rpm, the temperature is 80-100°C, and the total time length is 8-12 min.

[0122] Preferably, the vulcanization temperature during the vulcanization process is 150-160°C, and the vulcanization pressure is 5-15 MPa.

[0123] It should be noted that when the vulcanization temperature is 150-160°C and the vulcanization pressure is 5-15 MPa, on the one hand, the vulcanization reaction of the rubber can proceed relatively smoothly, and at this time, the crosslinking reaction speed of the rubber molecular chain is moderate, so that the rubber compound maintains good fluidity during the vulcanization process, and at the same time, the rubber compound is compacted, reducing internal voids and avoiding the occurrence of pores.

[0124] On the other hand, the rubber molecular chain has a certain activity, and the lamellar structure of the two-dimensional polyaramid can also better interact with the rubber molecules at this temperature, so that the two-dimensional polyaramid lamella can be subjected to a certain shear force and compression force in the rubber matrix. Under the action of external force, the lamella can be oriented, so that it is arranged along the pressure direction. At the same time, the pressure can make the interaction between the rubber molecular chain and the two-dimensional polyaramid lamella more closely, further promoting the orientation of the lamella.

[0125] Specifically, when the polymer material matrix is a thermoplastic plastic, an interfacial compatibilizer is added in step S2.

[0126] It should be noted that when the thermoplastic plastic is a non-polar plastic, the interfacial compatibilizer is a maleic anhydride graft (MAH-G-PP), and the amount of addition is 3-8 wt% of the mass of the plastic; when the thermoplastic plastic is a polar plastic, the interfacial compatibilizer is a silane coupling agent KH-550 (aminopropyl triethoxysilane), and the amount of addition is 0.5-1.5 wt% of the mass of the plastic.

[0127] Specifically, when the polymer material matrix is a thermoplastic plastic, the preparation method further comprises a step S3 of forming.

[0128] It should be noted that in the present application, when the two-dimensional polymer is blended with the thermoplastic plastic, it also needs to be formed, and the forming process is slightly different according to the type of the thermoplastic plastic. When the thermoplastic plastic is selected from polypropylene, polystyrene, high-density polyethylene or low-density polyethylene, the melting temperature in the forming process needs to be controlled to be 180-220℃, the injection pressure is ≥80MPa, the cooling rate is ≤20℃ / s, and the shrinkage rate is ≤1.2%.

[0129] When the thermoplastic plastic is polyethylene terephthalate, the melting temperature in the forming process needs to be controlled to be 270-280℃, the vacuum is ≤100Pa, the mold preheating temperature is 130-140℃, the pressure is 5-15MPa, the pressure holding time is 5-10min, and the crystallinity is 30-35%.

[0130] When the thermoplastic plastic is polyvinyl chloride, the plasticizing temperature needs to be controlled to be 160-170℃, the mold pressure is ≥5MPa, the holding time is 8-10min, and the thermal decomposition temperature is ≥200℃.

[0131] In the present application, the addition of the two-dimensional polymer such as two-dimensional polyaramid in the polymer material matrix can improve the toughness of the composite material and reduce the expansion coefficient of the composite material, and the composite material or the composite material and carbon fiber can be further compounded to prepare products or articles, so that the products or articles have good barrier properties.

[0132] The polymer material matrix in the present application includes rubber or plastic, which can be classified into different products or articles according to the categories.

[0133] The present application provides a plastic-based composite material product, and the raw material of the product includes a two-dimensional polymer and a polymer material matrix; the polymer material matrix is a thermosetting plastic.

[0134] Preferably, the thermosetting plastic is selected from epoxy resin, polyimide, unsaturated polyester resin and phenolic resin.

[0135] Preferably, the present application provides a plastic-based composite material product, and the raw material of the product includes a two-dimensional polymer and a polymer material matrix; the polymer material matrix is a thermosetting plastic, and further includes carbon fiber.

[0136] Specifically, the carbon fiber is T300, T700, T800, T1000 or T1200.

[0137] Specifically, the carbon fiber is high-strength fiber, including Kevlar fiber and nylon fiber.

[0138] The composite material obtained by the present application can be mixed with carbon fiber to prepare products or articles with excellent performance, and existing preparation methods such as dry winding and wet winding can be used, which will not be described here.

[0139] Preferably, the present invention provides a plastic-based composite material product, wherein the raw materials of the product include a two-dimensional polymer and a polymer material matrix; the polymer material matrix is ​​a thermosetting plastic, carbon fiber, and the preparation raw materials also include nanomaterials.

[0140] Preferably, the nanomaterials include SiO2 nanoparticles, Ti3C2T x Nanosheets or graphene.

[0141] It should be noted that the plastic-based composite products of the present invention have a wide range of applications and can be used in the aerospace field, such as components such as fuselages and wings; the automotive field, such as components such as body and chassis; the energy field, such as wind turbine blades, solar panel brackets, etc.; the sports equipment field, such as golf clubs and tennis rackets, etc.; pressure vessels and fishing gear.

[0142] Specifically, pressure vessels include gas cylinders and storage tanks.

[0143] The present invention provides a plastic-based composite material product. The raw materials of the product include a two-dimensional polymer and a thermoplastic plastic.

[0144] It should be noted that the plastic-based composite material product of the present invention can be used in the fields of food and medicine packaging, packaging films and containers, and electronic device packaging and protection.

[0145] The present invention provides a rubber product, characterized in that the raw materials of the product include a two-dimensional polymer and a rubber material.

[0146] The rubber products include rubber bags, rubber diaphragms, rubber storage bags, sealing rings, and rubber air bags.

[0147] The composite material provided by the present invention can be coated on a metal surface and used as a coating or adhesive. The two-dimensional polymer added to the composite material, such as two-dimensional polyaramid, can improve the interface strength between the composite material and the metal. At the same time, the composite material can protect metal materials such as aluminum alloys, titanium alloys, copper alloys or ferrous metals, and isolate them from corrosion by liquid hydrogen, liquid oxygen, liquid helium, etc.

[0148] In order to more clearly describe the present invention, it is further illustrated by the following examples and comparative examples.

[0149] Example 1

[0150] The preparation of two-dimensional polymer and high molecular material matrices includes the following steps:

[0151] S1: exfoliation, adding the two-dimensional polymer to a highly polar solvent N,N-dimethylformamide, and then dispersing it using ultrasound;

[0152] wherein the ultrasonic power is 200 W and the ultrasonic time is 2 h;

[0153] S2: blending, the polymer matrix is added in step S1 in proportion, and then stirring is carried out at a stirring speed of 50 rmp, and the shear rate is 10 s -1 ; purification and impurity removal, and after pre-curing and bubble removal (de-bubbling in a vacuum oven at 50℃ for more than 30 min), the composite material is prepared;

[0154] S3: curing, after adding the curing agent 4,4'-diamino diphenyl sulfone, step curing is adopted, 80℃ / 1h→120℃ / 2h→180℃ / 3h;

[0155] wherein the two-dimensional polymer is a two-dimensional polyaramid, the polymer matrix is an epoxy resin, the epoxy resin is bisphenol A type epoxy resin E-51; the viscosity range after heating is controlled to be 0.1-0.5 Pa·s; and the mass ratio of the two-dimensional polyaramid to the epoxy resin is 1:100.

[0156] Table 1: Comparison of raw materials in examples 1-7

[0157]

[0158]

[0159] Example 8

[0160] The preparation process of example 8 is basically the same as that of example 1, except that in step S2 of example 8, the interfacial compatibilizer is selected from silane coupling agent KH550, the amount of which is 1% of the mass of the two-dimensional polyaramid; the phosphorus-nitrogen flame retardant ammonium polyphosphate is added, the amount of which is 15% of the mass of the resin matrix; and the nano-barrier synergist is montmorillonite, the amount of which is 3% of the mass of the resin matrix.

[0161] Comparative example 1

[0162] The preparation process of comparative example 1 is basically the same as that of example 1, except that in comparative example 1, polyaramid is added instead of two-dimensional polyaramid.

[0163] Comparative example 2

[0164] The preparation process of comparative example 2 is basically the same as that of example 1, except that in comparative example 2, step S1 is not included, i.e., the two-dimensional polyaramid is directly mixed with the polymer matrix.

[0165] Performance detection

[0166] The obtained composite material is subjected to performance detection, including detection of toughness and expansion coefficient of the two-dimensional polyaramid before and after addition, wherein toughness detection of the plastic is performed according to ASTM D638 or ISO 527, toughness detection of the rubber is performed according to ASTM D412 or ISO 37, in-plane expansion coefficient detection is performed according to CTE ASTM E831 or ISO 11359, and specific detection results are shown in Table 2.

[0167] Table 2 Detection results of epoxy resin matrix composite material

[0168]

[0169]

[0170] Example 9

[0171] The two-dimensional polyaramid is compounded with the polyimide to prepare a composite material, including the following steps:

[0172] S1: Layer peeling, the two-dimensional polyaramid is added to a high-polarity solvent N, N-dimethylformamide, and then dispersed by ultrasonic;

[0173] wherein the ultrasonic power is 350 W, and the ultrasonic time is 1.5 h;

[0174] S2: Blending, a polymer material matrix polyimide is added to step S1 in proportion, and then an interfacial compatibilizer (silane coupling agent KH560, the addition amount is 1.5% of the mass of the polyimide) is added, followed by stirring at a stirring speed of 100 rmp and a shear rate of 200 s -1 The stirring is performed, purification and impurity removal are performed, and the composite material is prepared after pre-curing and bubble removal (de-bubbling in a 50℃ vacuum oven for more than 30 min);

[0175] wherein the polyimide is TP-8549; the mass ratio of the two-dimensional polyaramid to the polyimide is 1:80;

[0176] S3: Imidization forming, a stepwise temperature rising program is adopted: 80℃ / 1h→150℃ / 1h→250℃ / 2h→300℃ / 1h, the temperature rising rate is ≤2℃ / min; the pressure control is 1 MPa, N2 protection is adopted, and the flow rate is ≥20 L / min.

[0177] Example 10

[0178] Example 10 and Example 9 have substantially the same preparation process, except that the polyimide in Example 10 is Ultem 1000.

[0179] Example 11

[0180] Example 11 is prepared in substantially the same manner as Example 9, except that in Example 11 the polyimide is a polyetherimide.

[0181] Comparative Example 3

[0182] Comparative Example 3 is prepared in substantially the same manner as Example 9, except that in Comparative Example 3 a polyaramid is added instead of a two-dimensional polyaramid.

[0183] Performance testing

[0184] Table 3. Testing results of polyimide matrix composites

[0185]

[0186] Example 12

[0187] A two-dimensional polyaramid is compounded with a rubber to prepare a composite material, comprising the following steps:

[0188] S1: Layer peeling, the two-dimensional polyaramid is added to a high-polarity solvent N, N-dimethylformamide, and then dispersed by ultrasonic;

[0189] wherein the ultrasonic power is 450 W and the ultrasonic time is 1.5 h;

[0190] S2: Blending, a polymer material matrix rubber is added to step S1 in proportion, and an interfacial compatibilizer (silane coupling agent KH560, added amount is 1.5% of the mass of the rubber) is added, stirring at a stirring speed of 150 rpm and a shear rate of 500 s -1 After stirring, purifying and removing impurities, and pre-curing and removing bubbles (de-bubbling in a vacuum oven at 50°C for more than 30 min), the composite material is prepared;

[0191] wherein the rubber is styrene-butadiene rubber; and the mass ratio of the two-dimensional polyaramid to the styrene-butadiene rubber is 1:40;

[0192] Step S3: Banbury mixing, the rotation speed of the banbury mixing process is 50 rpm, the temperature is 100°C, and the total time is 8 min;

[0193] Step S4: vulcanization, the vulcanization temperature is 1500°C, and the vulcanization pressure is 10 MPa.

[0194] Example 13

[0195] Example 13 is prepared in substantially the same manner as Example 12, except that in Example 13 the rubber is chloroprene rubber.

[0196] Example 14

[0197] Example 14 was prepared in substantially the same manner as Example 12, except that in Example 14 the rubber was nitrile rubber.

[0198] Example 15

[0199] Example 15 was prepared in substantially the same manner as Example 12, except that in Example 15 the rubber was isoprene rubber.

[0200] Comparative Example 4

[0201] Comparative Example 4 was prepared in substantially the same manner as Example 12, except that in Comparative Example 4 a polyaramid was added instead of a two-dimensional polyaramid.

[0202] Performance testing

[0203] Table 4. Testing results of rubber matrix composites

[0204]

[0205] Example 16

[0206] A two-dimensional polyaramid was compounded with a thermoplastic to prepare a composite material, including the following steps:

[0207] S1: Layer peeling, the two-dimensional polyaramid was added to a high-polarity solvent N,N-dimethylformamide, and then dispersed by ultrasonic;

[0208] wherein the ultrasonic power was 500 W and the ultrasonic time was 1.5 h;

[0209] S2: Blending, a polymer material matrix thermoplastic was added to step S1 in proportion, and then an interfacial compatibilizer (silane coupling agent KH560, added amount was 1.5 wt% of the mass of the thermoplastic) was added, followed by stirring at a stirring speed of 200 rpm and a shear rate of 1000 s -1 After stirring, purification, impurity removal, and pre-curing bubble removal (de-bubbling in a vacuum oven at 50°C for more than 30 min), the composite material was prepared;

[0210] wherein the thermoplastic was polyethylene terephthalate; and the mass ratio of the two-dimensional polyaramid to the polyethylene terephthalate was 1:20;

[0211] S3: The melting temperature in the controlled forming process was 280°C, the vacuum was ≤100 Pa, the mold preheating temperature was 130-140°C, the pressure was 15 MPa, the pressure holding time was 5 min, and the crystallinity was 30-35%.

[0212] Example 17

[0213] Example 17 is prepared in substantially the same manner as Example 16, except that in Example 17 the thermoplastic is high density polyethylene, and the interfacial agent is a maleic anhydride graft (MAH-G-PP) added in an amount of 3 wt% of the thermoplastic.

[0214] S3: Control the melting temperature in the molding process to be 200°C, the injection pressure to be 80 MPa, the cooling rate to be 20°C / s, and the shrinkage to be 1.2%.

[0215] Example 18

[0216] Example 18 is prepared in substantially the same manner as Example 16, except that in Example 18 the thermoplastic is polyvinyl chloride.

[0217] S3: Control the plasticizing temperature to be 170°C, the molding pressure to be 5 MPa, the holding time to be 10 min, and the thermal decomposition temperature to be 200°C.

[0218] Example 19

[0219] Example 19 is prepared in substantially the same manner as Example 16, except that in Example 19 the thermoplastic is polypropylene, and the interfacial agent is a maleic anhydride graft (MAH-G-PP) added in an amount of 5 wt% of the thermoplastic.

[0220] S3: Control the melting temperature in the molding process to be 180°C, the injection pressure to be 90 MPa, the cooling rate to be 20°C / s, and the shrinkage to be 1.0%.

[0221] Comparative Example 5

[0222] Comparative Example 5 is prepared in substantially the same manner as Example 16, except that in Comparative Example 5 a polyaramid is added instead of a two-dimensional polyaramid.

[0223] Performance testing

[0224] Table 5: Testing results of thermoplastic matrix composite materials

[0225]

[0226] In combination with Examples 1-19 and Comparative Examples 1-5 and with reference to Tables 2-5, it can be seen that adding a two-dimensional polymer to a polymer material matrix, where the polymer material matrix is a plastic or rubber, such as an epoxy resin, a polyimide, etc., can improve the toughness of the composite and reduce the expansion coefficient of the composite material.

[0227] Application Example 1

[0228] This application example provides a storage tank, which includes an outer wall and an inner liner.

[0229] wherein the outer wall comprises the composite material obtained in Example 1 and carbon fiber T700;

[0230] wherein the inner liner is the composite material obtained in Example 16.

[0231] The helium mass spectrometry leak rate at room temperature and low temperature (liquid helium) is ≥ 1 x 10 -6 Pa·m 3 / s, which greatly improves the barrier property.

[0232] Application Example 2

[0233] The application example provides a rubber capsule comprising the composite material obtained in Example 12.

[0234] The helium mass spectrometry leak rate at room temperature and low temperature (liquid hydrogen) is ≥ 1 x 10 -6 Pa·m 3 / s, which greatly improves the barrier property.

[0235] Application Example 3

[0236] The application example provides a gas cylinder, the main body of the gas cylinder is prepared by a resin-based carbon fiber composite material (winding method), and the composite material obtained in Example 8 is uniformly coated as a coating layer on the inner wall of the gas cylinder.

[0237] The helium mass spectrometry leak rate at room temperature and low temperature (liquid hydrogen) is ≥ 1 x 10 -6 Pa·m 3 / s, which greatly improves the barrier property.

[0238] Application Example 4

[0239] The application example provides a storage tank, the storage tank comprises a three-layer structure, the first layer and the third layer are both prepared by winding a resin-based carbon fiber composite material, and the second layer is a metal layer, such as stainless steel; the composite material obtained in Example 8 is uniformly coated as a bonding layer or an adhesive between the first layer and the second layer and between the second layer and the third layer, so that the interfacial bonding strength and the barrier property are improved.

[0240] The helium mass spectrometry leak rate at room temperature and low temperature (liquid hydrogen) is ≥ 1 x 10 -6 Pa·m 3 / s, which greatly improves the barrier property.

[0241] The above merely provides the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this, any change or replacement that can be easily thought of by those skilled in the art within the technical range disclosed by the present application should be covered in the protection scope of the present application.

Claims

1. A composite material, characterized in that The composite material comprises a two-dimensional polymer and a high molecular material matrix; The polymer material matrix is ​​rubber or plastic.

2. A composite material according to claim 1, characterized in that: The mass ratio of the two-dimensional polymer to the polymer material matrix is ​​1:100 to 1:

1.

3. A composite material according to claim 1, characterized in that: The plastics include thermosetting plastics and thermoplastic plastics.

4. A composite material according to claim 3, characterized in that: The thermosetting plastic includes epoxy resin, polyimide, unsaturated polyester resin or phenolic resin; Preferably, the epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, glycidylamine epoxy resin or alicyclic epoxy resin.

5. A composite material according to claim 1, characterized in that: The rubber material is styrene-butadiene rubber, chloroprene rubber, nitrile rubber, EPDM rubber, isoprene rubber, butyl rubber, polysulfide rubber or polyurethane rubber.

6. A composite material according to claim 1, characterized in that: The thermoplastic plastic is polyethylene terephthalate, high-density polyethylene, polyvinyl chloride, low-density polyethylene, polypropylene or polystyrene.

7. A composite material according to claim 1, characterized in that: The composite material further comprises one or more of an interfacial compatibilizer, a flame retardant and a nano-barrier synergist; Preferably, the interfacial compatibilizer is a silane coupling agent and / or a maleic anhydride graft; Preferably, the flame retardant is a phosphorus-nitrogen flame retardant; Preferably, the nano-barrier synergist is montmorillonite and / or nanomaterials.

8. A composite material according to any one of claims 1 to 7, characterized in that: The two-dimensional polymer is two-dimensional polyaramid.

9. A method for preparing the composite material according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1: exfoliation, adding the two-dimensional polymer to a highly polar solvent and then dispersing it using ultrasound; S2: Blending, adding a polymer material matrix to step S1 in proportion, and then stirring, purifying, pre-curing and defoaming to obtain a composite material.

10. The method for preparing the composite material according to claim 9, characterized in that: The polymer material matrix is ​​epoxy resin, unsaturated polyester resin or phenolic resin; and the epoxy resin, unsaturated polyester resin or phenolic resin is processed before step S2 to ensure that the viscosity of the epoxy resin, unsaturated polyester resin or phenolic resin is 0.1-0.5 Pa·s.

11. The method for preparing the composite material according to claim 9, characterized in that: When the polymer material matrix is ​​polyimide, the preparation method further includes step S3 imidization molding, using a step heating program: 80℃ / 1h→150℃ / 1h→250℃ / 2h→300℃ / 1h, with a heating rate of ≤2℃ / min; and the pressure is controlled at 0.5~1MPa.

12. The method for preparing the composite material according to claim 9, characterized in that: When the polymer material matrix is ​​a rubber material, the preparation method further comprises step S3 of banburying; and step S4 of vulcanization.

13. The method for preparing the composite material according to claim 9, characterized in that: When the polymer material matrix is ​​thermoplastic plastic, the preparation method further includes step S3 of molding.

14. Use of the composite material according to any one of claims 1 to 8 or the composite material obtained by the preparation method according to any one of claims 9 to 13 in a product.

15. The use according to claim 14, characterized in that The products include plastic products and rubber products, and the composite material is one of the base materials of the products; or the composite material is the coating or adhesive layer of the products.

16. A plastic-based composite material product, characterized in that: The raw materials of the product include two-dimensional polymer and high molecular material matrix; The polymer material matrix is ​​thermosetting plastic.

17. The plastic-based composite material product according to claim 16, characterized in that: The raw materials of the product also include carbon fibers.

18. The plastic-based composite product according to claim 16, characterized in that: The raw materials of the product also include nanomaterials; Preferably, the nanomaterials include SiO2 nanoparticles, Ti3C2T x Nanosheets or graphene.

19. A plastic-based composite material product, characterized in that: The raw materials of the product include two-dimensional polymers and thermoplastics.

20. A rubber product, characterized in that: The raw materials of the product include two-dimensional polymer and rubber.

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