Measurement device and measurement method for metal plate, and method

Abstract

The invention provides a metal plate measuring device, a metal plate measuring method and a metal plate manufacturing method. The measuring device is provided with: a conveying mechanism for conveying the metal plate in the longitudinal direction (D2); a sensor for measuring the surface shape of the first surface of the metal plate; a table in which a second surface of the metal plate on the opposite side to the first surface is in contact with the table when measurement is performed by the sensor; and a control unit that repeatedly executes a first step in which the metal plate is conveyed by the conveyance mechanism in a state in which the metal plate is not in contact with the table, a second step in which the conveyance of the metal plate is stopped and the second surface of the metal plate that has been stopped is brought into contact with the table, and a third step in which the second surface of the metal plate that has been stopped is brought into contact with the table. The surface shape of the first surface of the metal plate is measured by the sensor in a state where the second surface of the metal plate is brought into contact with the table, and the table has a hole or a groove in a surface in contact with the metal plate.

Description

Technical Field

[0001] The present invention relates to a measuring device and a measuring method for a metal plate and a method for manufacturing the metal plate. Background Art

[0002] In recent years, displays used in portable devices such as smartphones and tablet PCs have been required to have high resolution, for example, a pixel density of 500 ppi or higher. Furthermore, demand for ultra-high definition (UHD) displays is also increasing in portable devices, and in this case, a pixel density of 800 ppi or higher is preferred.

[0003] Among display devices, organic EL display devices have attracted attention due to their good responsiveness, low power consumption, and high contrast. As a method for forming pixels of an organic EL display device, there is a known method in which pixels are formed in a desired pattern using a metal mask having through holes arranged in a desired pattern. Specifically, first, the metal mask is brought into close contact with a substrate for the organic EL display device, and then the closely contacted metal mask and substrate are placed together in a vapor deposition device to perform a vapor deposition process in which an organic material is vapor deposited on the substrate. In this way, pixels containing an organic material can be formed on the substrate in a pattern corresponding to the pattern of the through holes of the metal mask.

[0004] As a method for manufacturing a metal mask, there is known a method for forming a through hole on a metal plate by etching using a photolithography technique. For example, first, a first resist pattern is formed on the first surface of the metal plate by an exposure / development process, and a second resist pattern is formed on the second surface of the metal plate by an exposure / development process. Next, the area of ​​the first surface of the metal plate that is not covered by the first resist pattern is etched to form a first recess on the first surface of the metal plate. Thereafter, the area of ​​the second surface of the metal plate that is not covered by the second resist pattern is etched to form a second recess on the second surface of the metal plate. At this time, by etching in a manner such that the first recess and the second recess are interconnected, a through hole that penetrates the metal plate can be formed.

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2014-148743

[0006] The metal plate used to make the metal mask is produced, for example, by rolling a base material composed of a nickel-containing iron alloy. The thinner the metal plate is rolled, the higher the dimensional and positional accuracy of the resulting metal mask's pixels. However, rolling also creates a significant amount of undulations on the metal plate. Such undulations can reduce the positional and dimensional accuracy of the through-holes formed in the metal plate.

[0007] Therefore, from the perspective of ensuring the quality of the metal sheet, the evaluation of the metal sheet's corrugated shape is important. The metal sheet obtained by rolling is very long. Therefore, from the perspective of ensuring the quality of the metal sheet as a whole, it is preferable to evaluate the metal sheet's corrugated shape over a larger area.

[0008] However, conventional measuring devices for the corrugated shape of metal plates measure a sample cut out of the metal plate in a single-piece manner, making it difficult to evaluate the corrugated shape of the metal plate over a wide range.

[0009] Furthermore, when performing an etching process using photolithography from a roll of metal sheet, cutting the measurement sample from the middle of the roll would cause the roll itself to break, significantly impacting the etching process. Therefore, in this case, the measurement sample is cut from the end of the roll. Consequently, conventional single-sheet measurement devices have made it difficult to evaluate the wide range of undulations, including the middle of the roll. Summary of the Invention

[0010] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a metal plate measuring device, a measuring method, and a metal plate manufacturing method capable of continuously measuring the surface shape of the metal plate over a wider range.

[0011] A metal plate measuring device according to one embodiment of the present disclosure includes:

[0012] a conveying mechanism for conveying the metal plate in a longitudinal direction (D2);

[0013] a sensor for measuring a surface shape of the first surface of the metal plate;

[0014] a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and

[0015] A control unit that repeatedly executes the first step, the second step, and the third step,

[0016] In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table.

[0017] In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance is stopped is brought into contact with the table.

[0018] In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table.

[0019] The workbench has holes or grooves on a surface that contacts the metal plate.

[0020] A metal plate measuring method according to one embodiment of the present disclosure uses a measuring device having:

[0021] a conveying mechanism for conveying the metal plate in a longitudinal direction (D2);

[0022] a sensor for measuring a surface shape of the first surface of the metal plate;

[0023] a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and

[0024] A control unit that repeatedly executes the first step, the second step, and the third step,

[0025] In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table.

[0026] In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table.

[0027] In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table.

[0028] The workbench has holes or grooves on a surface that contacts the metal plate.

[0029] A method for manufacturing a metal plate for manufacturing a metal mask according to an embodiment of the present disclosure includes:

[0030] a rolling step of rolling a base material to obtain the metal plate; and

[0031] Inspection process, inspecting the rolled metal plate,

[0032] In the inspection process, a measuring device is used.

[0033] The measuring device comprises:

[0034] a conveying mechanism for conveying the metal plate in a longitudinal direction (D2);

[0035] a sensor for measuring a surface shape of the first surface of the metal plate;

[0036] a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and

[0037] A control unit that repeatedly executes the first step, the second step, and the third step,

[0038] In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table.

[0039] In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table.

[0040] In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table.

[0041] The workbench has holes or grooves on a surface that contacts the metal plate.

[0042] A method for manufacturing a metal mask having a plurality of through-holes formed therein according to one embodiment of the present disclosure includes:

[0043] The process of preparing metal sheets;

[0044] a resist pattern forming step of forming a resist pattern on the metal plate; and

[0045] an etching step of etching the area of ​​the metal plate not covered by the resist pattern to form a recessed portion on the metal plate for dividing and forming a through hole;

[0046] A measuring device is used in the process of preparing the metal plate.

[0047] The measuring device comprises:

[0048] a conveying mechanism for conveying the metal plate in a longitudinal direction (D2);

[0049] a sensor for measuring a surface shape of the first surface of the metal plate;

[0050] a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and

[0051] A control unit that repeatedly executes the first step, the second step, and the third step,

[0052] In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table.

[0053] In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table.

[0054] In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table.

[0055] The workbench has holes or grooves on a surface that contacts the metal plate.

[0056] According to the present invention, it is possible to provide a metal plate measuring device, a measuring method, and a metal plate manufacturing method capable of continuously measuring the surface shape of the metal plate over a wider range. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 This is a perspective view showing an example of a metal plate measuring device according to the present disclosure.

[0058] Figure 2A This is a plan view showing how the sensor moves when looking down at the worktable.

[0059] Figure 2B This is a plan view showing how the sensor moves when looking down at the worktable.

[0060] Figure 2C This is a plan view showing how the sensor moves when looking down at the worktable.

[0061] Figure 2D This is a plan view showing a method of measuring the surface of a metal plate using a sensor while intermittently moving the metal plate.

[0062] Figure 3A This is a perspective view showing one embodiment of a workbench.

[0063] Figure 3B This is a perspective view showing one embodiment of a workbench.

[0064] Figure 3C This is a perspective view showing one embodiment of a workbench.

[0065] Figure 4A This is a schematic cross-sectional view showing one embodiment of the first to third steps.

[0066] Figure 4B This is a schematic cross-sectional view showing one embodiment of the second step using the tension adjustment mechanism.

[0067] Figure 4C This is a schematic cross-sectional view showing one embodiment of the second step using the tension adjustment mechanism.

[0068] Figure 4D This is a schematic cross-sectional view showing one embodiment of the second step using the tension adjustment mechanism.

[0069] Figure 4E This is a schematic cross-sectional view showing one embodiment of the second step using the lifting mechanism.

[0070] Figure 4F This is a schematic cross-sectional view showing one embodiment of the second step using the lifting mechanism.

[0071] Figure 5 A flowchart showing one embodiment of a method for measuring a metal plate is shown.

[0072] Figure 6A This is a schematic cross-sectional view showing one embodiment of the rolling process.

[0073] Figure 6B This is a schematic cross-sectional view showing one embodiment of the annealing step.

[0074] Figure 7A This is a schematic diagram for explaining an example of a method for manufacturing a metal mask.

[0075] Figure 7B This is a diagram showing an example of a process of forming a resist film on a metal plate.

[0076] Figure 7C This is a diagram showing an example of a process of patterning a resist film.

[0077] Figure 7D This is a diagram showing an example of the first surface etching step.

[0078] Figure 7E This is a diagram showing an example of the second surface etching step.

[0079] Figure 8 1 is a schematic diagram illustrating a metal mask device according to one embodiment of the present disclosure.

[0080] Figure 9 This is a cross-sectional view showing a vapor deposition device according to one embodiment of the present disclosure. DETAILED DESCRIPTION

[0081] Hereinafter, one embodiment of the present disclosure will be described with reference to the accompanying drawings. In the drawings attached to this specification, the scale and aspect ratios may be appropriately changed or exaggerated relative to the actual scale and aspect ratios for ease of illustration and understanding.

[0082] In this specification and / or the drawings, unless otherwise specified, the following interpretations shall apply.

[0083] The terms indicating the substance that forms the basis of a structure may not be distinguished simply by the difference in name. For example, the terms "substrate," "base material," "plate," "sheet," or "film" are consistent with the above description.

[0084] Terms and / or numerical values ​​indicating shape and / or geometric conditions need not be strictly defined and can be interpreted as encompassing a range of degrees within which the same function can be expected. For example, "parallel" and / or "orthogonal" fall within the meanings described above. Furthermore, "length values" and / or "angle values" fall within the meanings described above.

[0085] When a structure is expressed as being "above," "below," "upper side," "lower side," "above," or "below" another structure, this can also include: a structure being in direct contact with the other structure; and a structure having the other structure between them. In other words, a structure having the other structure between them can also be expressed as being indirectly in contact with the other structure. Furthermore, expressions such as "above," "upper side," or "above" can be replaced with expressions such as "lower," "lower side," or "below." In other words, the up-down direction can be reversed.

[0086] When identical parts and / or parts having the same function are marked with the same or similar reference numerals, duplicate descriptions may be omitted. In addition, the dimensional ratios in the drawings may differ from the actual ratios. In addition, a portion of the structure of the embodiment may be omitted from the drawings.

[0087] Within the scope that no contradiction occurs, one or more aspects of the embodiment and one or more aspects of the modified example may be combined. In addition, within the scope that no contradiction occurs, one or more aspects of the embodiment may be combined with each other. In addition, within the scope that no contradiction occurs, one or more aspects of the modified example may be combined with each other.

[0088] When a plurality of steps are disclosed in a method such as a manufacturing method, other undisclosed steps may be performed between the disclosed steps. Furthermore, the order of the steps is not limited to the extent that no contradiction occurs.

[0089] Numerical ranges expressed using symbols such as "to" and / or "-" include the values ​​placed before and after the symbols. For example, a numerical range expressed as "34% to 38% by mass" is the same as a numerical range expressed as "34% to 38% by mass."

[0090] For the numerical values ​​described in this disclosure, a numerical range can be defined by combining any one of a plurality of candidate upper limit values ​​with any one of a plurality of candidate lower limit values. In addition, even if not specifically mentioned, a numerical range can be defined by combining any two of a plurality of candidate upper limit values, or by combining any two of a plurality of candidate lower limit values.

[0091] An embodiment of the present disclosure is described in the following paragraphs. An embodiment of the present disclosure is an example of an embodiment of the present disclosure. The present disclosure is not limited to the embodiment of the present disclosure.

[0092] A first aspect of the present disclosure is a measuring device for measuring a metal plate, wherein:

[0093] The measuring device comprises:

[0094] a conveying mechanism for conveying the metal plate in a longitudinal direction (D2);

[0095] a sensor for measuring a surface shape of the first surface of the metal plate;

[0096] a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and

[0097] A control unit that repeatedly executes the first step, the second step, and the third step,

[0098] In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table.

[0099] In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table.

[0100] In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table.

[0101] The workbench has holes or grooves on a surface that contacts the metal plate.

[0102] Regarding the second aspect of the present disclosure, in the measuring device of the first aspect described above,

[0103] The measuring device has a tension adjustment mechanism for adjusting the tension of the metal plate in the longitudinal direction (D2),

[0104] The control unit performs the following control:

[0105] In the first step, the tension of the metal plate is adjusted by the tension adjustment mechanism so that the metal plate does not contact the work table, and the metal plate is conveyed by the conveying mechanism.

[0106] In the third step, the conveyance of the metal plate is stopped, the tension of the metal plate is adjusted by the tension adjustment mechanism so that the metal plate contacts the table, and the surface shape of the first surface of the metal plate is measured by the sensor.

[0107] Regarding a third aspect of the present disclosure, in the measuring device of the first aspect or the second aspect,

[0108] The measuring device includes a lifting mechanism for lifting the conveying mechanism relative to the workbench.

[0109] The control unit performs the following control:

[0110] In the first step, the distance between the metal plate and the workbench is adjusted by the lifting mechanism so that the metal plate and the workbench do not contact each other, and the metal plate is transported by the transport mechanism.

[0111] In the third step, the conveyance of the metal plate is stopped, the distance between the metal plate and the work table is adjusted by the lifting mechanism so that the metal plate contacts the work table, and the surface shape of the first surface of the metal plate is measured by the sensor.

[0112] Regarding a fourth aspect of the present disclosure, in the measuring device according to any one of the first to third aspects,

[0113] The measuring device includes at least one of a tension adjustment mechanism for adjusting the tension of the metal plate in the longitudinal direction (D2) and a lifting mechanism for raising and lowering the conveying mechanism relative to the workbench.

[0114] The control unit performs the following control:

[0115] In the first step, the tension of the metal plate and / or the distance between the metal plate and the table are adjusted by the tension adjustment mechanism and / or the lifting mechanism so that the metal plate does not contact the table, and the metal plate is conveyed by the conveying mechanism.

[0116] In the third step, the conveyance of the metal plate is stopped, the tension of the metal plate and / or the distance between the metal plate and the workbench are adjusted by the tension adjustment mechanism and / or the lifting mechanism so that the metal plate contacts the workbench, and the surface shape of the first surface of the metal plate is measured by the sensor.

[0117] According to a fifth aspect of the present disclosure, in the measuring device according to any one of the first to fourth aspects, the thickness of the metal plate is 5 μm to 100 μm.

[0118] Regarding a sixth aspect of the present disclosure, in the measuring device according to any one of the first to fifth aspects, the contactable area of ​​the stage is 80% to 99%.

[0119] Regarding a seventh aspect of the present disclosure, in the measuring device according to any one of the first to sixth aspects, the conveying mechanism includes a first roller that feeds out the metal plate and a second roller that winds up the metal plate.

[0120] An eighth aspect of the present disclosure is a measuring method for a metal plate, wherein:

[0121] The measuring method uses a measuring device having:

[0122] a conveying mechanism for conveying the metal plate in a longitudinal direction (D2);

[0123] a sensor for measuring a surface shape of the first surface of the metal plate;

[0124] a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and

[0125] A control unit that repeatedly executes the first step, the second step, and the third step,

[0126] In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table.

[0127] In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table.

[0128] In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table.

[0129] The workbench has holes or grooves on a surface that contacts the metal plate.

[0130] A ninth aspect of the present disclosure is a method for manufacturing a metal plate used for manufacturing a metal mask, wherein:

[0131] The method for manufacturing the metal plate comprises:

[0132] a rolling step of rolling a base material to obtain the metal plate; and

[0133] Inspection process, inspecting the rolled metal plate,

[0134] In the inspection process, a measuring device is used.

[0135] The measuring device comprises:

[0136] a conveying mechanism for conveying the metal plate in a longitudinal direction (D2);

[0137] a sensor for measuring a surface shape of the first surface of the metal plate;

[0138] a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and

[0139] A control unit that repeatedly executes the first step, the second step, and the third step,

[0140] In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table.

[0141] In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table.

[0142] In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table.

[0143] The workbench has holes or grooves on a surface that contacts the metal plate.

[0144] A tenth aspect of the present disclosure is a method for manufacturing a metal mask having a plurality of through holes formed therein, wherein:

[0145] The method for manufacturing the metal mask comprises:

[0146] The process of preparing metal sheets;

[0147] a resist pattern forming step of forming a resist pattern on the metal plate; and

[0148] an etching step of etching the area of ​​the metal plate not covered by the resist pattern to form a recessed portion on the metal plate for dividing and forming a through hole;

[0149] A measuring device is used in the process of preparing the metal plate.

[0150] The measuring device comprises:

[0151] a conveying mechanism for conveying the metal plate in a longitudinal direction (D2);

[0152] a sensor for measuring a surface shape of the first surface of the metal plate;

[0153] a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and

[0154] A control unit that repeatedly executes the first step, the second step, and the third step,

[0155] In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table.

[0156] In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table.

[0157] In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table.

[0158] The workbench has holes or grooves on a surface that contacts the metal plate.

[0159] Figure 1 A perspective view of an example of a metal plate measuring device according to the present disclosure is shown. The metal plate measuring device 100 according to the present disclosure includes: a conveying mechanism 110 for conveying a metal plate 200 in a longitudinal direction D2; a sensor 120 for measuring the surface shape of a first surface 210 of the metal plate 200; a worktable 130 for contacting a second surface 220 of the metal plate 200 located opposite the first surface 210 during measurement by the sensor 120; and a control unit 140.

[0160] The control unit 140 controls the conveying mechanism 110 , the sensor 120 , and the tension adjustment mechanism 150 and the lifting mechanism 160 described later, thereby repeatedly executing the first step S1 , the second step S2 , and the third step S3 .

[0161] The details of the process will be described later. However, in the first step S1, the metal plate 200 is conveyed by the conveying mechanism 110 while the metal plate 200 is not in contact with the work table 130. In the second step S2, the conveyance of the metal plate 200 is stopped, and the second surface 220 of the stopped metal plate 200 is brought into contact with the work table 130. In the third step S3, the surface shape of the first surface 210 of the metal plate 200 is measured by the sensor 120 while the second surface 220 of the metal plate 200 is in contact with the work table 130. This makes it possible to continuously measure the surface shape of the metal plate over a wider range.

[0162] The conveying mechanism 110 conveys the metal plate 200 in the longitudinal direction D2. The conveying mechanism 110 may include, for example, a first roller 111 for delivering the metal plate 200 and a second roller 112 for winding the metal plate 200. Based on instructions from the control unit 140, the metal plate 200 is delivered from the roller 112 and wound up from the second roller 112. Thus, the conveying mechanism 110 can convey the metal plate 200 in the longitudinal direction D2 or stop conveying the metal plate 200.

[0163] The conveying mechanism 110 may also include a first auxiliary roller 151 and a second auxiliary roller 152 between the first roller 111 and the second roller 112. The first auxiliary roller 151 and the second auxiliary roller 152 may support the metal plate 200 between the first roller 111 and the second roller 112, or may send out the metal plate 200 and assist in conveying. Figure 1 The rollers shown may also have other rollers that assist in conveying.

[0164] The sensor 120 measures the surface shape of the first surface 210 of the metal plate 200. The surface condition measured by the sensor 120 may include information related to the height of the surface of the first surface 210 of the metal plate 200. This height-related information is also referred to as a height distribution. This height distribution may be data that three-dimensionally represents the surface shape of the first surface 210 of the metal plate 200. For example, it may include information related to each position of the metal plate 200 on a plane in the width direction D1 and the length direction D2, and information related to the height of the surface of the metal plate 200 in the height direction D3 for each position.

[0165] Thus, the height distribution obtained by the sensor 120 can show the undulating shape on the surface of the first surface 210. Moreover, based on such a height distribution, the steepness or elongation difference in the width direction D1, the length direction D2, or other arbitrary directions can also be calculated.

[0166] The sensor 120 is not particularly limited as long as it can measure the surface shape of the first surface 210 of the metal plate 200. Examples thereof include optical displacement meters and pressure-type displacement meters. By measuring the distance between the sensor 120 and the first surface 210, the height distribution can be measured.

[0167] As a displacement meter of the optical system, a conventionally known displacement meter can be used, but as an example, a triangular distance method and a white coaxial confocal method can be listed. In the triangular distance method, light having a focusing position that differs for each wavelength is irradiated onto the object, and the height of the object is measured by the imaging position of the reflected light of the light irradiated onto the object. In addition, in the white coaxial confocal method, the height of the object is measured by detecting the wavelength position of the maximum light amount based on the received light spectrum.

[0168] At least one of the sensor 120 and the workbench 130 may also be configured to be movable relative to each other. Figure 1 In the device structure shown, the workbench 130 is stationary and the sensor 120 is movable relative to the workbench 130. Specifically, the sensor 120 can also be configured to be movable in the width direction D1 by the first moving mechanism 121. In addition, the first moving mechanism 121 can also be configured to be movable in the length direction D2 by the second moving mechanism 122. Thus, the sensor 120 can also move on the plane of the width direction D1 and the length direction D2. In this case, the first moving mechanism 121 and the second moving mechanism 122 can also have mechanisms for obtaining coordinates in the width direction D1 and the length direction D2, respectively. Thus, when the sensor 120 measures information related to the height, the height value can also be recorded in correspondence with the coordinates in the plane formed by the width direction D1 and the length direction D2. There is no particular limitation as a mechanism for obtaining coordinates, and for example, an encoder or a laser interferometer can be listed. In addition, in addition to this, the first moving mechanism 121 can also be configured to enable the sensor 120 to move in the height direction D3. Thus, the sensor 120 can move not only in the planar direction but also in the height direction D3. Alternatively, the sensor 120 may be fixed and the stage 130 may be movable.

[0169] Alternatively, by moving the worktable 130 in the width direction D1 and the length direction D2, the sensor 120 and the metal plate 200 can be moved relative to each other in the width direction D1 and the length direction D2 to measure information related to the surface height of the first surface 210 of the metal plate 200. In this case, the measuring device 100 can include a mechanism for controlling the drive of the worktable 130 while acquiring coordinates in the width direction D1 and the length direction D2. This allows the coordinates in the D1 and D2 directions of the position where the height is measured by the sensor 120 to be recorded. The mechanism for acquiring coordinates is not particularly limited; examples include encoders and laser interferometers.

[0170] Figures 2A to 2C An example of how the sensor 120 moves when looking down at the workbench 130 is shown. Figures 2A to 2C In FIG, arrows are used to indicate the direction in which the sensor 120 scans while measuring the surface shape of the first surface 210. Figures 2A to 2C The path that the sensor 120 moves when not performing measurement is not shown. Figure 2A and Figure 2BThe sensor 120 is shown as scanning in one direction while measuring the surface shape of the first surface 210 in the width direction D1 or the length direction D2. Figure 2C The sensor 120 is shown as moving by repeating scanning in two directions in the width direction D1. The movement method of the sensor 120 is not limited to the above-described method.

[0171] As described above, the plane coordinates in the width direction D1 and the length direction D2 and the information on the height of the metal plate 200 at each coordinate position can be measured while the sensor 120 and the work table 130 are relatively moved, and these can be recorded in correspondence. Figures 2A to 2C As shown in the example, the predetermined area of ​​the metal plate 200 on the workbench 130 is repeatedly measured at a certain interval, and as described later, Figure 5 By intermittently moving the metal plate 200 as shown and repeatedly performing measurement along the longitudinal direction of the metal plate 200 , a three-dimensional profile as the surface shape can be obtained over most of the coil of the metal plate 200 .

[0172] The schematic diagram is shown in Figure 2D .exist Figure 2D , the following method is shown: for each measurement area R, the sensor 120 is moved to measure the surface shape of the first surface 210, and the metal plate 200 is intermittently moved by a distance L each time so that the area R to be measured is moved sequentially, thereby measuring the three-dimensional profile of the surface shape over most of the roll of the metal plate 200. The arrows shown in the area R indicate Figure 2A As shown, the sensor 120 is scanned in the length direction D2 to measure the three-dimensional profile of each measurement region R.

[0173] The worktable 130 is the portion of the metal plate 200 that contacts the second surface 220 located opposite the first surface 210 when the sensor 120 performs measurement. The metal plate 200 is, for example, a metal plate having a thickness of approximately 20 μm. To accurately measure the surface shape of such a metal plate 200, in the present disclosure, the second surface 220 of the metal plate 200, whose conveyance has stopped, is brought into contact with the worktable 130 (second step S2). With the second surface 220 of the metal plate 200 in contact with the worktable 130, the surface shape of the first surface 210 of the metal plate 200 is measured by the sensor 120 (third step S3).

[0174] As an example, the metal plate 200 has a width of 500 mm and a thickness of about 20 μm, which is large, thin, and light. Therefore, when the second surface 220 of the metal plate 200 whose conveyance has stopped is brought into contact with the workbench 130, it is sometimes difficult to push away the air between the workbench 130 and the metal plate 200 by the weight of the metal plate 200. If there is air between the workbench 130 and the metal plate 200, the measurement of the surface shape of the first surface 210 becomes inaccurate. Therefore, before measuring the surface shape of the first surface 210, it is necessary to wait for the air to be discharged. However, from the perspective of increasing the measurement speed and measuring the metal plate 200 over a wider range, a shorter waiting time is preferred.

[0175] Therefore, the workbench 130 may also have holes or grooves on the surface in contact with the metal plate 200. These holes or grooves can function as air vents between the workbench 130 and the metal plate 200. This can further increase measurement speed. Furthermore, the presence of holes or grooves can easily suppress vibrations of the metal plate 200 when the workbench 130 and the metal plate 200 are in contact, potentially further improving measurement accuracy.

[0176] The shape of the holes is not particularly limited and can be, for example, circular or polygonal. Furthermore, the cross-sectional shape of the holes or grooves is not particularly limited and can be approximately uniform in width, or can be V-shaped, widening toward the surface in contact with the metal plate, or narrowing toward the surface in contact with the metal plate. The holes or grooves may or may not extend through the worktable.

[0177] The contactable area of ​​the worktable 130 is preferably 80% to 99%, 85% to 99%, or even 90% to 98%. By setting the contactable area within this range, vibration of the metal plate 200 when the worktable 130 and the metal plate 200 are in contact can be easily suppressed, thereby further improving measurement accuracy and tending to further increase measurement speed.

[0178] In addition, here, "contactable area" refers to the ratio of the area that can contact the metal plate 200 other than the holes or grooves to the entire surface of the workbench 130 when looking down at the workbench 130. Therefore, for example, when looking down at 2500cm 2 In the workbench 130, a total of 500cm 2 In the case of holes or grooves, the contactable area is 80% ((2500-500) / 2500×100).

[0179] From the perspective of measurement accuracy, the table 130 may be a table with high flatness, and examples thereof include glass, resin, and ceramic. However, from the perspective of minimal shape change over time and resistance to damage, a stone plate is preferred, and flatness of JIS B 7513 Grade 0 or Grade 00 is more preferably used. Here, Grade 0 means that the flatness tolerance value of the entire surface is 5 μm or less when the surface size is 630 mm × 630 mm, and Grade 00 means that the flatness tolerance value of the entire surface is 2.5 μm or less when the surface size is 630 mm × 630 mm.

[0180] Figures 3A to 3C A perspective view of the workbench 130 is shown. Figure 3A A perspective view of a workbench having grooves in the width direction D1 and the length direction D2 is shown. Figure 3B A perspective view of a workbench having a groove in the longitudinal direction D2 is shown. Alternatively, a workbench having a groove in the width direction D1 may be used. Figure 3C A perspective view of a table having holes arranged in the width direction D1 and the length direction D2 is shown. The configuration examples of the holes and the grooves are not limited to the above, and a combination of holes and grooves may also be used.

[0181] The width of the groove or the diameter of the hole can preferably be 0.1 mm or more, 0.2 mm or more, 0.3 mm or more, 0.4 mm or more, 0.5 mm or more, or 0.6 mm or more. In addition, the width of the groove or the diameter of the hole is preferably 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, 3 mm or less, or 2 mm or less. The width of the groove or the diameter of the hole can also be determined by combining any one of the multiple lower limit candidate values ​​and any one of the multiple upper limit candidate values. For example, the width of the groove or the diameter of the hole can preferably be 0.1 to 30 mm or less, 0.2 to 20 mm or less, 0.3 to 10 mm or less, 0.4 to 5 mm or less, or 0.5 to 3 mm or less.

[0182] The width of the groove or the diameter of the hole is preferably shorter than the measurement pitch described later. The ratio of the width of the groove or the diameter of the hole to the measurement pitch can preferably be greater than 0.1, greater than 0.2, greater than 0.3, or greater than 0.4. In addition, the ratio of the width of the groove or the diameter of the hole to the measurement pitch can preferably be less than 1.0, less than 0.9, less than 0.8, or less than 0.7. The ratio of the width of the groove or the diameter of the hole to the measurement pitch can be determined by combining any one of the multiple lower limit candidate values ​​described above and any one of the multiple upper limit candidate values ​​described above. For example, the ratio of the width of the groove or the diameter of the hole to the measurement pitch can be 0.1 to 0.9, 0.2 to 0.8, or 0.3 to 0.7.

[0183] The depth of the groove or hole can preferably be 0.1 mm or more, 0.2 mm or more, 0.3 mm or more, 0.4 mm or more, 0.5 mm or more, or 0.6 mm or more. In addition, the width of the groove or the diameter of the hole can preferably be 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, 3 mm or less, or 2 mm or less. The depth of the groove or hole can also be determined by a combination of any one of the multiple lower limit candidate values ​​and any one of the multiple upper limit candidate values. For example, the depth of the groove or hole can preferably be 0.1 to 30 mm or less, 0.2 to 20 mm or less, 0.3 to 10 mm or less, 0.4 to 5 mm or less, or 0.5 to 3 mm or less.

[0184] The spacing between the grooves or the distance between adjacent holes can preferably be 1 mm or more, 5 mm or more, 10 mm or more, 20 mm or more, 30 mm or more, or 40 mm or more. Furthermore, the spacing between the grooves or the distance between adjacent holes is preferably 200 mm or less, 175 mm or less, 150 mm or less, 125 mm or less, 100 mm or less, or 75 mm or less. The spacing between the grooves or the distance between adjacent holes can also be determined by combining any one of the multiple lower limit candidate values ​​and any one of the multiple upper limit candidate values. For example, the spacing between the grooves or the distance between adjacent holes can preferably be 1 to 200 mm or less, 5 to 150 mm or less, or 10 to 100 mm or less.

[0185] The control unit 140 repeatedly executes the first step S1 , the second step S2 , and the third step S3 . Figure 4A One embodiment of the flow of the first step S1 , the second step S2 , and the third step S3 is shown. Figure 4A It is a schematic cross-sectional view of a surface in the longitudinal direction D2 and the height direction D3.

[0186] like Figure 4A As shown, in the first step S1, the control unit 140 controls the conveying mechanism 110 so that the metal plate 200 is conveyed without contacting the table 130. Specifically, the control unit 140 rotates the first roller 111, which feeds the metal plate 200, and the second roller 112, which winds up the metal plate 200, in the conveying direction F1. As a result, the metal plate 200 is conveyed in the longitudinal direction D2.

[0187] In addition, if Figure 4A As shown in FIG. 1 , the control unit 140 may also rotate the first auxiliary roller 151 and the second auxiliary roller 152 for assisting the conveyance of the metal plate 200 in the conveyance direction F1. Figure 4A In the illustrated example, the first auxiliary roller 151 and the second auxiliary roller 152 are rollers constituting the transport mechanism 110 , and are also rollers constituting the tension adjustment mechanism 150 described later.

[0188] In the first step S1, the control unit 140 can also adjust the tension applied to the metal plate 200 between the first roller 111 and the second roller 112 by controlling the rotation speed of the first roller 111 and the second roller 112, and control it in a manner to avoid the metal plate 200 from bending and contacting the workbench 130.

[0189] In the second step S2, the control unit 140 stops the conveyance of the metal plate 200 by the conveyance mechanism 110, and brings the second surface 220 of the metal plate 200, whose conveyance has stopped, into contact with the work table 130. Specifically, after stopping the conveyance of the metal plate 200, the control unit 140 may reduce the tension of the metal plate 200 using the tension adjustment mechanism 150 (described later), thereby bending the metal plate 200 and bringing the bent metal plate 200 into contact with the work table 130.

[0190] Alternatively or in addition thereto, the metal plate 200 and the work table 130 may be moved up and down relative to each other in the height direction D3 by the lifting mechanism 160 so that the bent metal plate 200 contacts the work table 130 .

[0191] In the third step S3, the surface shape of the first surface 210 of the metal plate 200 is measured by the sensor 120 while the second surface 220 of the metal plate 200 is in contact with the worktable 130. Specifically, the control unit 140 may drive and control the first moving mechanism 121 and the second moving mechanism 122 to move the sensor 120 to any position within the surface in the longitudinal direction D2 and the width direction D1. While moving, the sensor 120 may also measure the height of the metal plate 200 at various locations along the surface in the longitudinal direction D2 and the width direction D1, thereby obtaining a height distribution.

[0192] Next, the hardware structure of control unit 140 will be described. Control unit 140 can be composed of a microcontroller (MCU) or a general-purpose computer that also includes input devices such as a keyboard and output devices such as a display. If control unit 140 is a microcontroller, information input and output devices can also be connected to the microcontroller's input and output interfaces.

[0193] In particular, the control unit 140 may be electrically connected to the conveying mechanism 110, the sensor 120, the first moving mechanism 121, the second moving mechanism 122, the tension adjustment mechanism 150, and the lifting mechanism 160. Figure 1In the figure, except for the connection between the control unit 140 and the rollers, the first moving mechanism 121, and the second moving mechanism 122 constituting the conveying mechanism 110, other parts are omitted. However, since the control unit 140 controls the measuring device 100, even if not specifically shown in the figure, all the components of the measuring device 100 that are electrically controlled can be connected to the control unit 140 by wire or wireless. For example, Figure 1 Although the connection between the sensor 120 and the control unit 140 is not shown in the example, it can be understood that the sensor 120 and the control unit 140 are connected via the first moving mechanism 121 and the second moving mechanism 122.

[0194] The measuring device 100 of the present disclosure may further include a tension adjustment mechanism 150. The tension adjustment mechanism 150 is not particularly limited as long as it adjusts the tension of the metal plate 200 in the longitudinal direction D2. In this case, the control unit 140 may adjust the tension of the metal plate 200 using the tension adjustment mechanism 150 in the first step S1 so that the metal plate 200 does not contact the worktable 130, and then convey the metal plate 200 via the conveying mechanism 110. Alternatively, the control unit 140 may stop conveying the metal plate 200 and adjust the tension of the metal plate 200 using the tension adjustment mechanism 150 so that the metal plate 200 contacts the worktable 130.

[0195] exist Figures 4A to 4D , an embodiment using a first auxiliary roller 151 and a second auxiliary roller 152 is shown as one embodiment of the tension adjustment mechanism 150. In the second step S2, the control unit 140 stops the conveyance of the metal plate 200 by the conveyance mechanism 110, and brings the second surface 220 of the stopped metal plate 200 into contact with the table 130.

[0196] At this time, Figure 4A In the illustrated embodiment, after stopping the conveying mechanism 110, the control unit 140 slightly rotates the first roller 111 and the first auxiliary roller 151 of the tension adjustment mechanism 150 in the conveying direction F1 and then stops them. At this time, the control unit 140 fixes the second auxiliary roller 152 so that it does not rotate. As a result, the metal sheet 200 between the first and second auxiliary rollers 151, 152 deflects by the length conveyed by the first auxiliary roller 151. The second surface 220 of the deflected metal sheet 200 contacts the table 130.

[0197] exist Figure 4BIn the illustrated embodiment, after stopping the conveying mechanism 110, the control unit 140 slightly rotates the first roller 111 and the first auxiliary roller 151 of the tension adjustment mechanism 150 in the conveying direction F1 and stops them. Furthermore, the control unit 140 slightly rotates the second roller 112 and the second auxiliary roller 152 of the tension adjustment mechanism 150 in the return direction F2 and stops them. This causes the metal sheet 200 between the first and second auxiliary rollers 151, 152 to bend by the length conveyed by the first and second auxiliary rollers 151, 152. The second surface 220 of the bent metal sheet 200 contacts the table 130.

[0198] exist Figure 4C In the illustrated embodiment, after stopping the conveying mechanism 110, the control unit 140 slightly rotates the second roller 112 and the second auxiliary roller 152 of the tension adjustment mechanism 150 in the return direction F2 and stops them. At this time, the control unit 140 fixes the first auxiliary roller 151 so that it does not rotate. As a result, the metal sheet 200 between the first and second auxiliary rollers 151, 152, deflects by the length conveyed by the second auxiliary roller 152. The second surface 220 of the deflected metal sheet 200 contacts the table 130.

[0199] exist Figure 4D In the illustrated embodiment, the distance between the first auxiliary roller 151 and the second auxiliary roller 152 is shortened, thereby bending the metal sheet 200 between the first and second auxiliary rollers 151, 152. At this time, the first and second auxiliary rollers 151, 152 may be brought closer to each other in the F3 direction, or one of the first and second auxiliary rollers 151, 152 may be brought closer to the other. Furthermore, when the distance between the first and second auxiliary rollers 151, 152 is shortened, the first and second rollers 151 separate. Furthermore, when the distance between the second and second auxiliary rollers 152 is shortened, the first and second rollers 151 separate. Therefore, the first and second rollers may be fed separately. As a result, the second surface 220 of the metal sheet 200, bent between the first and second auxiliary rollers 151, contacts the table 130.

[0200] exist Figures 4A to 4D In any of the methods, when the metal plate 200 is re-conveyed after the third step S3, the control unit 140 can also adjust the tension of the metal plate 200 again through the tension adjustment mechanism 150 so that the metal plate 200 does not contact the workbench 130, and convey the metal plate 200 through the conveying mechanism 110.

[0201] The metal plate measuring device 100 of the present disclosure may further include a lifting mechanism 160. The lifting mechanism 160 is not particularly limited as long as it lifts and lowers the conveying mechanism 110 relative to the worktable 130. Specifically, the lifting mechanism 160 may be a mechanism that lifts and lowers the worktable 130.

[0202] In this case, the control unit 140 may adjust the distance between the metal plate 200 and the conveying mechanism 110 in the height direction D3 via the lifting mechanism 160 in the first step S1 so that the metal plate 200 does not contact the work table 130, and then convey the metal plate 200 via the conveying mechanism 110. Alternatively, the control unit 140 may stop conveying the metal plate 200 and adjust the positions of the metal plate 200 and the conveying mechanism 110 in the height direction D3 via the lifting mechanism 160 so that the metal plate 200 contacts the work table 130.

[0203] exist Figure 4E In FIG. 1 , as one embodiment of the lifting mechanism 160 , a method of using a lift 161 of the workbench 130 is shown. Figure 4E In the illustrated method, in the first step S1, the control unit 140 controls the conveying mechanism 110 to convey the metal plate 200 in a bent state. Then, in the second step S2, the control unit 140 stops conveying the metal plate 200 by the conveying mechanism 110 and moves the metal plate 200 in an upward direction F4, in the height direction D3 of the metal plate 200 and the conveying mechanism 110, so that the metal plate 200 contacts the work table 130. As a result, the bent metal plate 200 contacts the work table 130.

[0204] In addition, Figure 4F In FIG. 1 , as one embodiment of the lifting mechanism 160 , a lifting roller 162 provided on the side of the workbench 130 is used. Figure 4F In the illustrated method, in the first step S1, the control unit 140 controls the conveying mechanism 110 to convey the metal plate 200, with the lifting rollers 162 positioned vertically upward. Then, in the second step S2, the control unit 140 stops the conveying mechanism 110 from conveying the metal plate 200 and lowers the lifting rollers 162 vertically downward (F4'). This causes the metal plate 200 to bend by the amount the lifting rollers 162 have been lowered, and to contact the table 130.

[0205] Furthermore, the tension adjustment mechanism 150 and the lifting mechanism 160 may be used in combination. For example, the measuring device 100 of the present disclosure may include at least one of the tension adjustment mechanism 150 and the lifting mechanism 160. In this case, the control unit 140 may also perform the following control: in the first step S1, the tension of the metal plate 200 and / or the distance between the metal plate 200 and the work table 130 are adjusted by the tension adjustment mechanism 150 and / or the lifting mechanism 160 so that the metal plate 200 does not contact the work table 130, and the metal plate 200 is conveyed by the conveying mechanism 110. In the third step S3, the conveyance of the metal plate 200 is stopped, the tension of the metal plate 200 and / or the distance between the metal plate 200 and the work table 130 are adjusted by the tension adjustment mechanism 150 and / or the lifting mechanism 160 so that the metal plate 200 contacts the work table 130, and the surface shape of the first surface 210 of the metal plate 200 is measured by the sensor 120.

[0206] Next, the metal plate measurement method will be described. In the disclosed metal plate measurement method, the first step S1, the second step S2, and the third step S3 are repeatedly performed using the aforementioned measuring device. This allows for continuous measurement of the surface shape of the metal plate over a wider range. Furthermore, since there is no need to measure a single piece of measurement sample cut from the metal plate as is conventionally done, the effects of strain on the metal plate caused by cutting can be eliminated.

[0207] In addition, hereinafter, the operation of repeatedly conveying and stopping the metal plate 200 is also referred to as intermittent operation.

[0208] Figure 5 FIG. 1 shows a flow chart showing one embodiment of a method for measuring a metal plate. Figure 5 As shown, in the metal plate measuring method of the present disclosure, in the first step S1 , the metal plate 200 is conveyed by the conveying mechanism 110 in a state where the metal plate 200 is not in contact with the work table 130 .

[0209] At this time, the conveying mechanism 110 may perform an intermittent operation in which the metal plate 200 is conveyed in the longitudinal direction D2 by a distance less than that of one work table 130. This allows the surface shape of a continuous range in the longitudinal direction D2 to be measured.

[0210] Alternatively, the conveying mechanism 110 can perform intermittent operation, conveying the metal plate 200 a distance greater than that of one worktable 130 in the longitudinal direction D2. This allows the surface shape of discontinuous areas in the longitudinal direction D2 to be measured. For example, by performing intermittent operation of repeatedly conveying and stopping the metal plate 200 every 5 meters, the surface shape of a long metal plate 200 can be measured at 5-meter intervals.

[0211] Furthermore, in the metal plate measuring method of the present disclosure, in the second step S2 , the conveyance of the metal plate 200 is stopped, and the second surface 220 of the metal plate 200 whose conveyance has been stopped is brought into contact with the stage 130 .

[0212] At this time, as described above, the tension adjustment mechanism 150 or the lifting mechanism 160 is used to bring the second surface 220 of the metal plate 200 into contact with the table 130 (see Figures 4A to 4E In the present disclosure, it is preferred to measure the surface shape without applying tension to the metal plate 200. This eliminates the influence of the tension of the conveying mechanism 110 on the surface shape measurement. Therefore, in the second step S2, it is preferred to bring the second surface 220 of the bent metal plate 200 into contact with the worktable 130.

[0213] In the third step S3, the surface shape of the first surface 210 of the metal plate 200 is measured by the sensor 120 while the second surface 220 of the metal plate 200 is in contact with the worktable 130. The measurement pitch in the longitudinal direction D2 and the width direction D1 is not particularly limited and can be appropriately determined according to the desired measurement accuracy, for example, 1 to 50 mm, 1 to 40 mm, 1 to 30 mm, or 1 to 20 mm.

[0214] Alternatively, in the fourth step S4 , the control unit 140 may check whether the preset range has been measured, and if so, terminate the measurement operation; otherwise, further repeat the first to third steps S1 to S3 .

[0215] Next, a method for manufacturing a metal plate used to manufacture a metal mask will be described. The disclosed method comprises a rolling step of rolling a base material to obtain a metal plate, and an inspection step of inspecting the rolled metal plate. In the inspection step, the first step S1, the second step S2, and the third step S3 are repeatedly performed using the aforementioned measuring device.

[0216] Furthermore, after the rolling step and before the inspection step, the metal plate manufacturing method of the present disclosure may further include a slitting step of cutting off the widthwise ends of the rolled metal plate or an annealing step of annealing the rolled metal plate.

[0217] Figure 6A 1 is a schematic cross-sectional view showing one embodiment of the rolling process. In the rolling process, a base material 55 is rolled to obtain a metal plate having a desired thickness. The base material 55 may be made of, for example, an Invar alloy.

[0218] In the rolling process, the base material 55 is conveyed toward a rolling device 56 including a pair of rollers 56a and 56b along the conveying direction indicated by the arrow F5. The base material 55 that has arrived between the pair of rollers 56a and 56b is rolled by the pair of rollers 56a and 56b. As a result, the thickness of the base material 55 is reduced and the base material 55 is stretched along the conveying direction. In this way, a long metal plate 200 of a predetermined thickness can be obtained. Figure 6A As shown, the wound body 62 may be formed by winding the metal plate 200 around the core 61 .

[0219] The thickness of the metal plate 200 is, for example, 5 μm or greater, 10 μm or greater, 15 μm or greater, 20 μm or greater, or 25 μm or greater. Alternatively, the thickness of the metal plate 200 is, for example, 100 μm or less, 80 μm or less, 60 μm or less, 50 μm or less, or 40 μm or less. Furthermore, the thickness of the metal plate 200 can be, for example, 5 μm to 100 μm, 10 μm to 80 μm, 15 μm to 60 μm, 20 μm to 50 μm, or 25 μm to 40 μm.

[0220] In addition, the weight of the metal plate 200 is preferably 0.005 g / cm 2 Above, 0.010g / cm 2 Above, 0.015g / cm 2 Above, 0.020g / cm 2 Above, 0.025g / cm 2 Above, it can also be 0.030g / cm 2 In addition, the weight of the metal plate 200 is preferably 0.070 g / cm 2 Below, 0.060g / cm 2 Below, it can also be 0.050g / cm 2 the following.

[0221] The thinner the metal plate 200, the lighter its weight per unit area. Therefore, when the workbench 130 and the metal plate 200 are in contact, air between them tends to be difficult to escape. Therefore, when the thickness of the metal plate 200 is within the above range, the workbench 130 preferably has holes or grooves on the surface that contacts the metal plate.

[0222] It should be noted that Figure 6A The diagram merely schematically illustrates the rolling process, and the specific structure and process steps for implementing the rolling process are not particularly limited. For example, the rolling process may include a hot rolling process in which the base material 55 of the Invar alloy is processed at a temperature above the recrystallization temperature, or a cold rolling process in which the base material is processed at a temperature below the recrystallization temperature.

[0223] The slitting process is a step for cutting off the widthwise ends of the rolled metal sheet. This slitting process removes both ends of the metal sheet 200 in the widthwise direction D1, thereby eliminating cracks that may develop at these ends. This further suppresses breakage of the metal sheet 200 caused by cracks. The range of the cutoff is not particularly limited; for example, it can be set to 3 to 5 mm.

[0224] Figure 6B 1 is a schematic cross-sectional view showing one embodiment of the annealing process. In the annealing process, the metal plate obtained by rolling is annealed by the annealing device 57. As a result, the residual stress accumulated in the metal plate 200 can be removed. Figure 6B As shown, in the annealing process, the metal sheet 200 can be continuously annealed while being conveyed in the direction F5. Alternatively, batch annealing can be performed. The annealing process conditions can be appropriately set according to the thickness of the metal sheet 200, the rolling ratio, etc. For example, the annealing process conditions can be 500°C and 60 seconds.

[0225] The rolling process, the slitting process, and the annealing process may be repeated multiple times. By repeating these processes, the metal plate 200 having a desired thickness can be obtained.

[0226] In the inspection process, the metal plate obtained by rolling is inspected. The metal plate 200 inspected in the inspection process may also be a metal plate obtained by performing the rolling process, slitting process, and annealing process once or repeatedly. The inspection method in the inspection process is substantially the same as the metal plate measurement method described above, so a detailed description is omitted.

[0227] The manufacturing method of the metal mask disclosed in the present invention includes: a process of preparing a metal plate; a resist pattern forming process of forming a resist pattern on the metal plate; and an etching process of etching the area of ​​the metal plate not covered by the resist pattern to form a recessed portion that divides the through holes in the metal plate, thereby manufacturing a metal mask with multiple through holes.

[0228] The metal mask disclosed in the present invention can be used for various purposes. Without particular limitation, for example, the metal mask of the present invention can be used as a metal mask for patterning an organic material on a substrate in a desired pattern in the manufacture of an organic EL display device. The metal mask disclosed in the present invention can achieve high pixel density composition. In the organic EL display devices that can be manufactured, in addition to displays of smartphones, televisions, etc., devices for displaying or projecting images or images for expressing virtual reality (VR) or augmented reality (AR) are also included.

[0229] In addition, in this specification and the drawings, unless otherwise specified, an example of a metal mask used in manufacturing an organic EL display device and a method for manufacturing the same are described as one embodiment of the present invention.

[0230] The method for manufacturing a metal mask according to an embodiment of the present disclosure includes a preparation step of preparing a metal plate 200 having a first surface 210 and a second surface 220 located opposite to the first surface 210 ; and an etching step of forming the metal mask 20 by etching the metal plate 200 .

[0231] In addition, a method of manufacturing the metal mask 20 by etching will be described below, but the metal mask 20 may be formed by etching or by laser processing.

[0232] Main reference Figures 7A to 7E A method for manufacturing the metal mask 20 according to one embodiment of the present disclosure will be described. Figure 7A 2 is a schematic diagram showing a manufacturing apparatus 70 for manufacturing a metal mask 20 using a metal plate 200 and its processing sequence. Figure 7A , an example of continuously feeding the metal plate 200 from the resist film forming apparatus 71 to the stripping apparatus 74 is shown. However, the method for manufacturing the metal mask 20 disclosed herein is not limited to this. For example, the metal plate 200 may be wound into a roll each time it passes through each apparatus. Furthermore, when feeding the metal plate 200 to each apparatus, the metal plate 200 may be unwound from a roll.

[0233] Hereinafter, each step of the method for manufacturing the metal mask 20 will be described in detail.

[0234] First, a metal plate 200 having a desired thickness is prepared (preparation step). The metal plate 200 may be in the form of a wound body 50. The method for producing the metal plate 200 having a desired thickness is not particularly limited, and examples thereof include the aforementioned rolling method and the plating film forming method.

[0235] In the method for manufacturing a metal mask of the present disclosure, the surface shape of the first surface of the metal plate is measured in the step of preparing the metal plate. This measuring method is substantially the same as the above-mentioned method for measuring the metal plate, so detailed description is omitted.

[0236] Next, using the resist film forming apparatus 71, resist films 53a and 53b are formed on the first surface 210 and the second surface 220 of the metal plate 200 ( Figure 7BSpecifically, the resist films 53a and 53b may be formed by attaching a dry film resist to the first surface 210 and the second surface 220. Alternatively, the resist films 53a and 53b may be formed by applying a coating liquid containing a photosensitive resist material to the first surface 210 and the second surface 220 and drying the coating liquid.

[0237] There is no particular limitation on the dry film resist or coating liquid, and conventionally known materials can be used. In addition, the resist films 53a and 53b thus formed can be either negative resists or positive resists. Among them, negative resists are preferably used.

[0238] The thickness of the resist films 53a and 53b can be 15 μm or less, 10 μm or less, 6 μm or less, or 4 μm or less. Furthermore, the thickness of the resist films 53a and 53b can be 1 μm or more, 3 μm or more, 5 μm or more, or 7 μm or more. The range of the thickness of the resist films 53a and 53b can also be determined by a combination of any one of the plurality of upper limit candidate values ​​and any one of the plurality of lower limit candidate values.

[0239] Next, the resist films 53a and 53b are exposed and developed using the exposure / development device 72. Figure 7C As shown, a first resist pattern 53c can be formed on the first surface 210, and a second resist pattern 53d can be formed on the second surface 220. For example, when a negative resist film is used, a photomask that prevents light from passing through the region to be removed in the resist film can be placed on the resist film, and the resist film can be exposed through the photomask, and then developed.

[0240] Next, the metal plate 200 is etched using the first resist pattern 53c and the second resist pattern 53d as masks using the etching device 73 (etching step). The etching step may include a first surface etching step and a second surface etching step.

[0241] Figure 7D A schematic diagram showing an example of a first surface etching step in the perforated region 22 is shown. In the first surface etching step, an etching liquid is used to etch the area of ​​the first surface 210 that is not covered by the first resist pattern 53c. At this time, the second surface 220 may also be covered with a resin or the like that is resistant to the etching liquid.

[0242] The first surface 210 not covered by the first resist pattern 53c is etched by the etching liquid ( Figure 7D). Thus, a plurality of first recesses 30 are formed on the first surface 210. Furthermore, the etching of the metal plate 200 can be performed isotropically from the holes in the resist pattern toward various directions. Therefore, the cross-sectional areas of the first recesses 30 and the second recesses 35 at various positions along the thickness direction of the metal mask 20 are gradually reduced as they progress from the surface toward the thickness direction.

[0243] exist Figure 7E is a schematic diagram showing an example of the second surface etching process in the porous region 22. In the second surface etching process, an etching liquid is used to etch the area of ​​the second surface 220 that is not covered by the second resist pattern 53d. At this time, the film or the like that covered the second surface 220 in the first surface etching process may be peeled off in advance. Alternatively, the first surface 210 may be covered with a resin 54 or the like that is resistant to the etching liquid.

[0244] The second surface 220 not covered by the second resist pattern 53d is etched by the etching liquid ( Figure 7E ). Thus, the second recess 35 is formed on the second surface 220. Furthermore, the first recess 30 and the second recess 35 communicate with each other, thereby forming the through hole 25.

[0245] The etching liquid is not particularly limited as long as it is a conventionally known etching liquid, and examples thereof include etching liquids containing a ferric chloride solution and hydrochloric acid.

[0246] In the second side etching process, Figure 7E As shown, etching may be continued until adjacent second recesses 35 are connected. At the location where adjacent second recesses 35 are connected, the adjacent second recesses 35 merge to form a ridgeline 36. Furthermore, the ridgeline 36 is spaced apart from the second resist pattern 53d, and etching also progresses in the thickness direction of the metal plate 200 at the top of the ridgeline 36. As a result, the second resist pattern 53d is peeled off from the metal plate 200. Furthermore, the second surface 220 may partially remain between adjacent second recesses 35.

[0247] Furthermore, the resist pattern or the resin 54 resistant to the etching solution is peeled off from the metal plate 200 using the peeling device 74. Next, a separation step is performed in which the long metal plate 200 is cut using the separating device 75, thereby separating the metal mask 20 composed of a single metal plate from the metal plate 200. In this manner, the metal mask 20 can be obtained.

[0248] The metal mask device 10 according to one embodiment of the present disclosure includes a frame 15 and the metal mask 20 provided on the frame 15. The metal mask 20 may be provided on the frame 15 in such a manner that the second surface 20b contacts the frame 15. Figure 82 shows a top view of the metal mask device 10 viewed from the first surface 20a side of the metal mask 20. Figure 9 A cross-sectional view of the vapor deposition device is shown in FIG.

[0249] Regarding the metal mask device 10 of the present disclosure, a plurality of metal masks 20 ( Figure 8 In this case, the plurality of metal masks 20 may be arranged in a width direction intersecting the length direction of the metal masks 20. In addition, each metal mask 20 may be fixed to the frame 15 at both ends 23a in the length direction of the metal mask 20 in the peripheral area 23 surrounding the effective area 22.

[0250] The fixing method to the frame 15 is not particularly limited, and examples thereof include welding.

[0251] The metal mask device 10 may also include a component that is fixed to the frame 15 and partially overlaps with the metal mask 20 in the thickness direction of the metal mask 20. Examples of such a component are not particularly limited, and include a component that extends in a direction intersecting the longitudinal direction of the metal mask 20 and supports the metal mask 20, and a component that overlaps with the gap between two adjacent metal masks.

[0252] Next, refer to Figure 9 A method for manufacturing an organic EL display device using the metal mask 20 of the present invention will be described. The organic EL display device may include a substrate 92 and a vapor deposition layer containing a vapor deposition material 98 provided in a pattern in a laminated state.

[0253] The method for manufacturing the organic EL display device according to one embodiment of the present disclosure is not particularly limited, and includes, for example, a vapor deposition step of vapor-depositing the vapor deposition material 98 onto a substrate such as the substrate 92 using the metal mask 20 .

[0254] In the vapor deposition process, first, the metal mask device 10 is arranged so that the metal mask 20 and the substrate 92 face each other. Figure 9 As shown in FIG, the first surface 20a of the metal mask 20 may be opposed to the substrate 92. Here, the substrate 92 is a vapor deposition object such as a glass substrate.

[0255] like Figure 9 As shown, when the metal mask device 10 is housed in the evaporation device 90, the surface of the metal mask 20 facing the substrate 92 is the first surface 20a, and the surface of the metal mask 20 located on the crucible 94 side holding the evaporation material 98 is the second surface 20b. In the evaporation device 90, the metal mask 20 is placed on the crucible 94 side of the substrate 92. Here, the metal mask 20 and the substrate 92 can also be tightly adhered by magnetic force.

[0256] In the evaporation device 90, a crucible 94 for accommodating the evaporation material 98 and a heater 96 for heating the crucible 94 may be arranged below the metal mask device 10. Here, as an example, the evaporation material 98 may also be an organic light-emitting material. The evaporation material 98 in the crucible 94 is vaporized or sublimated by the heat from the heater 96. The vaporized or sublimated evaporation material 98 adheres to the substrate 92 through the through-holes 25 of the metal mask 20. As a result, the evaporation material 98 is formed on the surface of the substrate 92 in a desired pattern corresponding to the positions of the through-holes 25 of the metal mask 20. In addition, during the evaporation process, the interior of the evaporation device 90 may be a vacuum atmosphere.

[0257] When different types of deposition materials are to be deposited corresponding to pixels such as RGB, different metal masks 20 may be used corresponding to the colors of the deposition materials 98, and the deposition materials 98 may be formed into films on the surface of the substrate 92. For example, the deposition material 98 for red, the deposition material 98 for green, and the deposition material 98 for blue may be sequentially deposited on the substrate 92. Alternatively, the metal mask 20 (metal mask device 10) and the substrate 92 may be relatively moved little by little along the arrangement direction of the through holes 25 (the aforementioned one direction), and the deposition material 98 for red, the deposition material 98 for green, and the deposition material 98 for blue may be sequentially deposited.

[0258] Furthermore, the method for manufacturing an organic EL display device may include various steps in addition to the vapor deposition step of vapor-depositing the vapor deposition material 98 on a substrate such as the substrate 92 using the metal mask 20. For example, the method for manufacturing an organic EL display device may include a step of forming a first electrode on the substrate. The vapor-deposited layer is formed on the first electrode. The method for manufacturing an organic EL display device may also include a step of forming a second electrode on the vapor-deposited layer. The method for manufacturing an organic EL display device may also include a sealing step of sealing the first electrode, the vapor-deposited layer, and the second electrode provided on the substrate 92.

[0259] The vapor-deposited layer formed on a substrate such as substrate 92 using the metal mask 20 is not limited to the light-emitting layer formed by vapor-depositing the organic light-emitting material described above, but may also include other layers. For example, the vapor-deposited layer may include, in order from the first electrode side, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and the like. In this case, the vapor deposition process using the metal mask 20 corresponding to each layer may be performed separately.

[0260] While the above description describes a method for continuously measuring the surface shape of a long metal plate over a wide area, as a variation, the metal plate measuring device of one embodiment of the present disclosure can also be used to measure a single metal plate. In this case, the metal plate measuring device can be configured similarly to the above description, except that it lacks a conveying mechanism.

[0261] Specifically, a single-piece metal plate measuring device includes: a sensor that measures the surface shape of the first surface of the metal plate; a workbench that contacts the second surface of the metal plate located opposite to the first surface when measurement is performed using the sensor; and a control unit that executes a measuring process equivalent to the third process, wherein the measuring process is a process of measuring the surface shape of the first surface of the metal plate using the sensor while the second surface of the metal plate is in contact with the workbench, and the workbench has a hole or groove on the surface that contacts the metal plate.

[0262] In a single-piece metal plate, similarly to the above, by providing the table 130 with holes or grooves, vibration of the metal plate 200 when the table 130 and the metal plate 200 are in contact can be easily suppressed, and measurement accuracy tends to be further improved.

[0263] The present invention has industrial applicability as an apparatus for use in inspecting a metal plate or the like for manufacturing a metal mask.

[0264] Label Description

[0265] 10···Metal mask device; 15···Frame; 20···Metal mask; 20a···First surface; 20b···Second surface; 22···Perforated area; 23···Surrounding area; 23a···Both end portions; 25···Through hole; 30···First recess; 31···First wall surface; 35···Second recess; 36···Ridge line; 50···Winding body; 53a···resist film; 53b···resist film; 53c···first resist pattern; 53d···second resist pattern; 54···resin; 55···parent material; 56···rolling device; 56a···roller; 56b···roller; 61···core; 62···wound body; 70···manufacturing device; 71···resist film forming device device; 72···exposure / developing device; 73···etching device; 74···peeling device; 75···separating device; 90···evaporation device; 92···substrate; 96···heater; 98···evaporation material; 100···measuring device; 110···conveyance mechanism; 111···1st roller; 112···2nd roller; 120···sensor; 121···1st moving mechanism; 122···2nd moving mechanism; 130···workbench; 140···control unit; 150···tension adjustment mechanism; 151···1st auxiliary roller; 152···2nd auxiliary roller; 160···lifting mechanism; 161···elevator; 200···metal plate; 210···1st surface; 220···2nd surface.

Claims

1. A measuring device, which is a measuring device for a metal plate, wherein: The measuring device comprises: a conveying mechanism for conveying the metal plate in a longitudinal direction (D2); a sensor for measuring a surface shape of the first surface of the metal plate; a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and A control unit that repeatedly executes the first step, the second step, and the third step, In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table. In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table. In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table. The workbench has holes or grooves on a surface that contacts the metal plate.

2. The measuring device according to claim 1, wherein The measuring device has a tension adjustment mechanism for adjusting the tension of the metal plate in the longitudinal direction (D2), The control unit performs the following control: In the first step, the tension of the metal plate is adjusted by the tension adjustment mechanism so that the metal plate does not contact the work table, and the metal plate is conveyed by the conveying mechanism. In the third step, the conveyance of the metal plate is stopped, the tension of the metal plate is adjusted by the tension adjustment mechanism so that the metal plate contacts the table, and the surface shape of the first surface of the metal plate is measured by the sensor.

3. The measuring device according to claim 1, wherein The measuring device includes a lifting mechanism for lifting the conveying mechanism relative to the workbench. The control unit performs the following control: In the first step, the distance between the metal plate and the workbench is adjusted by the lifting mechanism so that the metal plate and the workbench do not contact each other, and the metal plate is conveyed by the conveying mechanism. In the third step, the conveyance of the metal plate is stopped, the distance between the metal plate and the work table is adjusted by the lifting mechanism so that the metal plate contacts the work table, and the surface shape of the first surface of the metal plate is measured by the sensor.

4. The measuring device according to claim 1, wherein The measuring device includes at least one of a tension adjustment mechanism for adjusting the tension of the metal plate in the longitudinal direction (D2) and a lifting mechanism for raising and lowering the conveying mechanism relative to the workbench. The control unit performs the following control: In the first step, the tension of the metal plate and / or the distance between the metal plate and the workbench are adjusted by the tension adjustment mechanism and / or the lifting mechanism so that the metal plate does not contact the workbench, and the metal plate is conveyed by the conveying mechanism. In the third step, the conveyance of the metal plate is stopped, the tension of the metal plate and / or the distance between the metal plate and the workbench are adjusted by the tension adjustment mechanism and / or the lifting mechanism so that the metal plate contacts the workbench, and the surface shape of the first surface of the metal plate is measured by the sensor.

5. The measuring device according to claim 1, wherein The thickness of the metal plate is 5 μm to 100 μm. The measuring device according to claim 1 , wherein: The contactable area of ​​the workbench is 80% to 99%.

7. The measuring device according to claim 1, wherein The conveying mechanism includes a first roller for feeding out the metal plate and a second roller for winding up the metal plate.

8. A measurement method for a metal plate, wherein: The measuring method uses a measuring device having: a conveying mechanism for conveying the metal plate in a longitudinal direction (D2); a sensor for measuring a surface shape of the first surface of the metal plate; a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and A control unit that repeatedly executes the first step, the second step, and the third step, In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table. In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table. In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table. The workbench has holes or grooves on a surface that contacts the metal plate.

9. A method for manufacturing a metal plate for manufacturing a metal mask, wherein: The method for manufacturing the metal plate comprises: a rolling step of rolling a base material to obtain the metal plate; and Inspection process, inspecting the rolled metal plate, In the inspection process, a measuring device is used. The measuring device comprises: a conveying mechanism for conveying the metal plate in a longitudinal direction (D2); a sensor for measuring a surface shape of the first surface of the metal plate; a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and A control unit that repeatedly executes the first step, the second step, and the third step, In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table. In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table. In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table. The workbench has holes or grooves on a surface that contacts the metal plate.

10. A method for manufacturing a metal mask, wherein the metal mask is formed with a plurality of through holes, wherein: The method for manufacturing the metal mask comprises: The process of preparing metal sheets; a resist pattern forming step of forming a resist pattern on the metal plate; as well as an etching step of etching the area of ​​the metal plate not covered by the resist pattern to form a recessed portion on the metal plate for defining and forming the through-hole; A measuring device is used in the process of preparing the metal plate. The measuring device comprises: a conveying mechanism for conveying the metal plate in a longitudinal direction (D2); a sensor for measuring a surface shape of the first surface of the metal plate; a workbench, with which a second surface of the metal plate, located on the opposite side of the first surface, contacts when measurement is performed by the sensor; and A control unit that repeatedly executes the first step, the second step, and the third step, In the first step, the metal plate is conveyed by the conveying mechanism in a state where the metal plate is not in contact with the work table. In the second step, the conveyance of the metal plate is stopped, and the second surface of the metal plate whose conveyance has been stopped is brought into contact with the table. In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the table. The workbench has holes or grooves on a surface that contacts the metal plate.

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