Laser layering and thinning device for glass substrate

Abstract

The invention relates to the technical field of numerical control machining, and discloses a glass substrate laser layering thinning device which comprises a shell and a bottom box on one side of the shell, a mounting part is fixedly connected to the side, close to the shell, of the bottom box, and a condensation plate is mounted on the side, close to the shell, of the mounting part. An operation plate is fixedly connected to the side, away from the installation part, of the condensation plate, a limiting plate is fixedly connected to the side, close to the operation plate, of the rack rod, an air cylinder is installed on the side, perpendicular to the bottom box, of the installation part, and a water seepage net part is installed on the side, perpendicular to the installation part, of the bottom box. According to the invention, the bottom of the operation plate is provided with the condensation plate which is cooperatively used, and water pouring cooling is carried out in the operation space, so that the motion platform is always at the equipment temperature suitable for continuous operation, stable operation of the operation assembly in the equipment is ensured, and the heat effect brought by the laser assembly to the operation space can be reduced; and the overall temperature sensing of other equipment in the space is relieved.

Description

Technical Field

[0001] This invention relates to the field of CNC machining technology, specifically to a laser-based thinning device for glass substrates. Background Technology

[0002] Laser-based thinning devices are precision equipment that uses the high energy density of a laser beam to peel off or precisely reduce the thickness of materials layer by layer. They are widely used in semiconductor manufacturing, optical component processing, electronic packaging and other fields. Using ultraviolet femtosecond lasers and high-precision Z-axis control (nanometer level), they achieve wafer backside thinning (from 500μm to below 50μm) through layer-by-layer peeling, avoiding cracks caused by mechanical grinding.

[0003] The core advantage of laser-based thinning devices lies in achieving precise control of material thickness through non-contact, high-precision energy control. The key technology lies in the coordinated matching of laser parameters (wavelength, pulse width, energy) and motion control (precision, speed). Different materials (brittle, flexible, metallic, non-metallic) and processing precision requirements (from millimeters to nanometers) will lead to differences in light source selection, optical path design, and monitoring methods, but "precise energy control - real-time feedback control" remains its core technology. With the development of ultrashort pulse laser technology and artificial intelligence algorithms, future devices will evolve towards higher precision (atomic-level thinning), faster speeds (batch processing), and greater intelligence (adaptive process adjustment).

[0004] However, in actual use, the above-mentioned glass substrate laser delamination and thinning device has several drawbacks. First, the heat generated by the substrate after laser thinning is not dissipated in time or water cooling is used alone, which is not conducive to the stability of the substrate. Second, the limiting components mostly use vacuum suction cups for fixation to pursue high-end features, but this is not convenient for fixing the substrate and is prone to displacement. Therefore, we propose a glass substrate laser delamination and thinning device. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides a laser-based thinning device for glass substrates, which solves the problems of slow heat dissipation after operation and instability of the substrate due to the pursuit of high-end positioning in existing devices.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution: a glass substrate laser delamination and thinning device, comprising a housing and a base box on one side of the housing. The base box is fixedly connected to the housing on the side near the housing and is located inside the housing. A mounting component is fixedly connected to the base box on the side near the housing. A condensing plate is mounted on the mounting component on the side near the housing, and the side of the condensing plate near the mounting component is inserted into and connected to the mounting component. An operating plate is fixedly connected to the side of the condensing plate away from the mounting component. A rotating rod is inserted into and mounted on the side of the base box near the mounting component, and the side of the rotating rod away from the base box is located inside the mounting component. The rotating rod is fixedly connected to a rotating shaft on the side near the mounting component. A rack is movably connected to the side of the rotating shaft perpendicular to the bottom box. A limit plate is fixedly connected to the side of the rack near the operating panel, and the limit plate passes through the condenser plate and is movably connected to the operating panel. A cylinder is installed on the side of the mounting component perpendicular to the bottom box, and the cylinder is placed on the side of the mounting component and fixedly connected to the limit plate. A seepage mesh is installed on the side of the bottom box perpendicular to the mounting component, and the seepage mesh is inserted into and connected to the bottom box on the side near the bottom box. A recycling box is installed on the side of the bottom box away from the seepage mesh, and the recycling box is placed inside the bottom box and fixedly connected to the bottom box.

[0009] Preferably, the limiting plate is provided with a limiting frame on the side near the cylinder, and the side of the cylinder near the limiting frame is inserted and connected to the limiting frame. The rack is provided with a limiting rod parallel to the side near the bottom box, and the side of the limiting rod near the limiting frame is fixedly connected to the limiting frame.

[0010] Preferably, the rotating rod is fixedly connected to a motor on one side of the base box, and the side of the motor near the base box is fixedly connected to the base box. The motor is installed inside the base box at the center of the recycling bin. A control box is provided on the side of the mounting component perpendicular to the outer shell, and the control box is placed inside the outer shell and fixedly connected to the outer shell. An electric slide rail is fixedly connected to the side of the control box near the operation panel, and a clamping pipe is movably connected to the side of the electric slide rail near the operation panel.

[0011] Preferably, the side of the clamping component near the operating panel is provided with a water spray pipe, and the side of the water spray pipe near the clamping component is placed inside the clamping component, while the side of the water spray pipe away from the clamping component is inserted and connected to the inside of the bottom box.

[0012] Preferably, a water storage tank is installed on the side of the bottom box away from the recycling box, and the water storage tank is placed inside the bottom box and fixedly connected to the bottom box. A support frame is fixedly connected to the side of the water storage tank near the recycling box, and the support frame is fixedly connected to the recycling box on the side near the recycling box.

[0013] Preferably, a water pump is provided on the side of the water storage tank near the bottom tank, and the water pump is placed inside the bottom tank and fixedly connected to the bottom tank. A water outlet pipe is fixedly connected to the side of the water pump near the water storage tank, and the side of the water outlet pipe near the water storage tank is fixedly connected to the water storage tank. The side of the water pump near the bottom tank is fixedly connected to a spray pipe.

[0014] Preferably, an exhaust box is installed on one side of the vertical water pump in the base box, and the side of the exhaust box near the outer shell passes through the base box and is fixedly connected to the outer shell. The operation panel is provided with a sliding groove for use with the limiting plate. The side of the operation panel away from the base box is provided with a control center, and the control center is located inside the outer shell and fixedly connected to the outer shell.

[0015] Preferably, a robotic arm is provided on one side of the control box vertically to the control center, and the side of the robotic arm near the control box is fixedly connected to the control box. A laser head is installed on the side of the robotic arm near the operation panel, and the side of the laser head near the robotic arm is fixedly connected to the robotic arm.

[0016] Preferably, a monitoring box is fixedly installed on one side of the vertical control box of the base box. A sensing mechanism is installed on the side of the monitoring box near the base box, and the sensing mechanism is placed inside the monitoring box and fixedly connected to the monitoring box. A monitoring mechanism is provided on the side of the sensing mechanism away from the base box, and the monitoring mechanism is placed inside the monitoring box and fixedly connected to the monitoring box. A protective cover for use with the monitoring mechanism is provided on the side of the monitoring box near the operation panel.

[0017] In summary, the technical effects and advantages of this invention are as follows:

[0018] 1. In this invention, by setting a condensing plate at the bottom of the operating plate and simultaneously cooling it with water in the operating space, the motion platform is kept at a suitable equipment temperature for continuous operation, ensuring stable operation of the operating components inside the equipment. It can also reduce the heat effect of the laser components on the operating space, alleviate the overall temperature of other equipment in the space, thereby improving the overall service life of the device and the usage form of the operating substrate.

[0019] 2. In this invention, by installing a limiting plate on the operating panel and having a rack rod inside the mounting component that moves in opposite and parallel motion to the limiting plate, and by using a cylinder assembly on one side of the mounting component for auxiliary limiting, the device can effectively prevent vibration during laser processing while clamping and fixing, reduce substrate displacement, and thus improve the overall stability of the device.

[0020] 3. In this invention, a water-permeable mesh is provided on the side of the bottom box near the mounting component, and a recycling box is installed inside the bottom box. Water after cooling and pouring is recycled into the recycling box through the water-permeable mesh. The long strip-shaped water-permeable mesh facilitates the concentrated leakage of cooling water. Placing the recycling box inside the bottom box can also cool down the bottom space of the device, reducing the aging of the components inside the device. The centralized recycling of cooling water also improves the overall convenience and practicality of the device. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a laser delamination and thinning device for a glass substrate according to the present invention;

[0022] Figure 2 This is a schematic diagram of the overall structure of the outer shell, control center, and base box of the present invention;

[0023] Figure 3 This is a schematic diagram of the overall structure of the operating panel and the limiting plate of the present invention;

[0024] Figure 4 This is a top view of the operating panel and limiting plate of the present invention;

[0025] Figure 5 This is a schematic diagram of the overall structure of the limiting plate of the present invention;

[0026] Figure 6 This is a schematic diagram of the overall structure of the bottom box and recycling box of the present invention.

[0027] In the diagram: 1. Outer shell; 2. Control center; 3. Base box; 301. Drainage mesh; 302. Exhaust box; 303. Water pump; 4. Control panel; 401. Condensation plate; 402. Mounting component; 403. Slide opening; 5. Motor; 501. Rotating rod; 502. Rotating shaft; 6. Robotic arm; 601. Laser head; 602. Control box; 7. Monitoring box; 701. Monitoring mechanism; 702. Sensing mechanism; 703. Protective cover; 8. Pipe clamp; 801. Electrical slide rail; 802. Water spray pipe; 9. Limit plate; 901. Cylinder; 902. Limit frame; 903. Rack and pinion; 904. Limit rod; 10. Recycling box; 1001. Water storage tank; 1002. Support frame; 1003. Water outlet pipe. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] refer to Figures 1-6 The illustrated glass substrate laser delamination and thinning device includes a housing 1 and a base box 3 on one side of the housing 1. The base box 3 is fixedly connected to the housing 1 on the side closest to the housing 1, and the base box 3 is placed inside the housing 1. A mounting member 402 is fixedly connected to the side of the base box 3 closest to the housing 1. A condensation plate 401 is mounted on the side of the mounting member 402 closest to the housing 1, and the side of the condensation plate 401 closest to the mounting member 402 is inserted into and connected to the mounting member 402. An operation plate 4 is fixedly connected to the side of the condensation plate 401 furthest from the mounting member 402. A rotating... A rod 501 is mounted on the side of the rod 501 away from the base box 3, which is placed inside the mounting component 402. A rotating shaft 502 is fixedly connected to the side of the rotating rod 501 near the mounting component 402. A rack rod 903 is movably connected to the side of the rotating shaft 502 perpendicular to the base box 3. A limit plate 9 is fixedly connected to the side of the rack rod 903 near the operating plate 4. The operating plate 4 has a sliding groove 403 that cooperates with the limit plate 9. The limit plate 9 passes through the condenser plate 401 and is movably connected to the operating plate 4. A cylinder 901 is mounted on the side of the mounting component 402 perpendicular to the base box 3, and the cylinder 901 is located on one side of the mounting component 402. A limiting frame 902 is fixedly connected to the limiting plate 9. A limiting frame 902 is provided on the side of the limiting plate 9 near the cylinder 901, and the side of the cylinder 901 near the limiting frame 902 is inserted into and connected to the limiting frame 902. A limiting rod 904 is provided parallel to the side of the rack 903 near the bottom box 3, and the side of the limiting rod 904 near the limiting frame 902 is fixedly connected to the limiting frame 902. A seepage mesh 301 is installed on one side of the vertical mounting part 402 of the bottom box 3, and the side of the seepage mesh 301 near the bottom box 3 is inserted into and connected to the bottom box 3. A recycling bin is installed on the side of the bottom box 3 away from the seepage mesh 301. 10, and the recycling bin 10 is placed inside the bottom box 3 and fixedly connected to the bottom box 3. The rotating rod 501 is fixedly connected to the motor 5 on one side of the bottom box 3, and the motor 5 is fixedly connected to the bottom box 3 on the side near the bottom box 3. The motor 5 is placed in the center of the recycling bin 10 and installed inside the bottom box 3. The bottom box 3 has a vertical water pump 303 installed on one side of the bottom box 3 with an exhaust box 302. The exhaust box 302 is fixedly connected to the outer shell 1 through the bottom box 3 on the side near the outer shell 1. The control center 2 is provided on the side of the operation panel 4 away from the bottom box 3, and the control center 2 is placed inside the outer shell 1 and fixedly connected to the outer shell 1.

[0030] Among them, the mounting component 402 is provided with a control box 602 on one side of the vertical housing 1, and the control box 602 is placed inside the housing 1 and fixedly connected to the housing 1. The side of the control box 602 near the operation panel 4 is fixedly connected to an electric slide rail 801. The side of the electric slide rail 801 near the operation panel 4 is movably connected to a clamping component 8. The side of the clamping component 8 near the operation panel 4 is provided with a water spray pipe 802, and the side of the water spray pipe 802 near the clamping component 8 is placed inside the clamping component 8. The side of the water spray pipe 802 away from the clamping component 8 is inserted and connected to the inside of the base box 3.

[0031] A water storage tank 1001 is installed on the side of the bottom tank 3 away from the recycling tank 10, and the water storage tank 1001 is placed inside the bottom tank 3 and fixedly connected to the bottom tank 3. A support frame 1002 is fixedly connected to the side of the water storage tank 1001 near the recycling tank 10, and the support frame 1002 is fixedly connected to the recycling tank 10 on the side near the recycling tank 10. A water pump 303 is provided on the side of the water storage tank 1001 near the bottom tank 3, and the water pump 303 is placed inside the bottom tank 3 and fixedly connected to the bottom tank 3. A water outlet pipe 1003 is fixedly connected to the side of the water pump 303 near the water storage tank 1001, and the water outlet pipe 1003 is fixedly connected to the side of the water storage tank 1001 near the water storage tank 1001. The side of the water pump 303 near the bottom tank 3 is fixedly connected to the water spray pipe 802.

[0032] Among them, a robotic arm 6 is provided on one side of the control box 602 perpendicular to the control center 2, and the side of the robotic arm 6 near the control box 602 is fixedly connected to the control box 602. A laser head 601 is installed on the side of the robotic arm 6 near the operation panel 4, and the side of the laser head 601 near the robotic arm 6 is fixedly connected to the robotic arm 6. A monitoring box 7 is fixedly installed on one side of the base box 3 perpendicular to the control box 602. A sensing mechanism 702 is installed on the side of the monitoring box 7 near the base box 3, and the sensing mechanism 702 is placed inside the monitoring box 7 and fixedly connected to the monitoring box 7. A monitoring mechanism 701 is provided on the side of the sensing mechanism 702 away from the base box 3, and the monitoring mechanism 701 is placed inside the monitoring box 7 and fixedly connected to the monitoring box 7. A protective cover 703 for use with the monitoring mechanism 701 is provided on the side of the monitoring box 7 near the operation panel 4.

[0033] Working principle of this invention:

[0034] First, the glass substrate is placed on the operating plate 4 and held in place by the limiting plates 9 on both sides. The mounting part 402 is equipped with a rack rod 903 that moves in opposite and parallel motion to the limiting plate 9. The cylinder 901 assembly on one side of the mounting part 402 provides auxiliary limiting. The robotic arm 6 at the top of the operating plate 4 drives the laser head 601 to perform layer thinning operation. The limiting plate 9 can effectively prevent vibration caused by laser processing while clamping and fixing, thus reducing substrate displacement.

[0035] Secondly, by setting a condenser plate 401 at the bottom of the operating panel 4 and simultaneously cooling it with water in the operating space, the motion platform is kept at a suitable equipment temperature for continuous operation, ensuring stable operation of the operating components inside the equipment. This also reduces the heat effect of the laser components on the operating space, alleviates the overall temperature of other equipment in the space, and thus improves the overall service life of the device.

[0036] Finally, by providing a cooperating seepage mesh 301 on the side of the bottom box 3 near the mounting part 402, and installing a recycling box 10 inside the bottom box 3, the water after cooling and pouring is recycled into the recycling box 10 through the seepage mesh 301. The long strip-shaped seepage mesh 301 facilitates the concentrated leakage of cooling water. Placing the recycling box 10 inside the bottom box 3 can also cool down the bottom space of the device, reducing the aging of the components inside the device.

[0037] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A glass substrate laser delamination and thinning device, comprising a housing (1) and a base box (3) on one side of the housing (1), characterized in that: The bottom box (3) is fixedly connected to the outer shell (1) on the side near the outer shell (1), and the bottom box (3) is placed inside the outer shell (1). A mounting part (402) is fixedly connected to the side of the bottom box (3) near the outer shell (1). A condenser plate (401) is installed on the side of the mounting part (402) near the outer shell (1), and the side of the condenser plate (401) near the mounting part (402) is inserted and connected to the mounting part (402). An operating plate (4) is fixedly connected to the side of the condenser plate (401) away from the mounting part (402). A rotating rod (501) is inserted and installed on the side of the bottom box (3) near the mounting part (402), and the side of the rotating rod (501) away from the bottom box (3) is placed inside the mounting part (402). A rotating shaft (502) is fixedly connected to the side of the rotating rod (501) near the mounting part (402). (502) A rack rod (903) is movably connected to one side of the vertical base box (3). A limit plate (9) is fixedly connected to the side of the rack rod (903) near the operation plate (4). The limit plate (9) passes through the condenser plate (401) and is movably connected to the operation plate (4). A cylinder (901) is installed on the side of the mounting part (402) perpendicular to the base box (3). The cylinder (901) is fixedly connected to the limit plate (9) on the side of the mounting part (402). A water seepage net (301) is installed on the side of the base box (3) perpendicular to the mounting part (402). The water seepage net (301) is inserted into the base box (3) on the side near the base box (3). A recycling box (10) is installed on the side of the base box (3) away from the water seepage net (301). The recycling box (10) is placed inside the base box (3) and is fixedly connected to the base box (3).

2. The glass substrate laser delamination and thinning device according to claim 1, characterized in that: The limiting plate (9) is provided with a limiting frame (902) on the side near the cylinder (901), and the side of the cylinder (901) near the limiting frame (902) is inserted and connected to the limiting frame (902). The rack (903) is provided with a limiting rod (904) on the side near the bottom box (3), and the side of the limiting rod (904) near the limiting frame (902) is fixedly connected to the limiting frame (902).

3. The glass substrate laser delamination and thinning device according to claim 1, characterized in that: The rotating rod (501) is fixedly connected to a motor (5) on one side of the bottom box (3), and the motor (5) is fixedly connected to the bottom box (3) on the side closest to the bottom box (3). The motor (5) is installed inside the bottom box (3) at the center of the recycling box (10).

4. The glass substrate laser delamination and thinning device according to claim 1, characterized in that: The mounting component (402) has a control box (602) on one side of the outer shell (1) perpendicular to the outer shell (1), and the control box (602) is placed inside the outer shell (1) and fixedly connected to the outer shell (1). An electric slide rail (801) is fixedly connected to the side of the control box (602) near the operation panel (4), and a clamping pipe component (8) is movably connected to the side of the electric slide rail (801) near the operation panel (4).

5. The glass substrate laser delamination and thinning device according to claim 4, characterized in that: The clamping fitting (8) has a water spray pipe (802) on the side near the operating plate (4), and the side of the water spray pipe (802) near the clamping fitting (8) is placed inside the clamping fitting (8), while the side of the water spray pipe (802) away from the clamping fitting (8) is inserted and connected to the inside of the bottom box (3).

6. The glass substrate laser delamination and thinning device according to claim 1, characterized in that: A water storage tank (1001) is installed on the side of the bottom box (3) away from the recycling box (10), and the water storage tank (1001) is placed inside the bottom box (3) and fixedly connected to the bottom box (3). A support frame (1002) is fixedly connected on the side of the water storage tank (1001) close to the recycling box (10), and the support frame (1002) is fixedly connected to the recycling box (10) on the side close to the recycling box (10).

7. The glass substrate laser delamination and thinning device according to claim 6, characterized in that: A water pump (303) is provided on the side of the water storage tank (1001) near the bottom tank (3), and the water pump (303) is placed inside the bottom tank (3) and fixedly connected to the bottom tank (3). A water outlet pipe (1003) is fixedly connected on the side of the water pump (303) near the water storage tank (1001), and the side of the water outlet pipe (1003) near the water storage tank (1001) is fixedly connected to the water storage tank (1001). The side of the water pump (303) near the bottom tank (3) is fixedly connected to the spray pipe (802).

8. The glass substrate laser delamination and thinning device according to claim 1, characterized in that: The bottom box (3) has a vertical water pump (303) with an exhaust box (302) installed on one side. The exhaust box (302) is fixedly connected to the outer shell (1) through the bottom box (3) on the side closer to the outer shell (1). The operation plate (4) is provided with a sliding groove (403) for use with the limiting plate (9). The operation plate (4) is provided with a control center (2) on the side away from the bottom box (3). The control center (2) is located inside the outer shell (1) and is fixedly connected to the outer shell (1).

9. The glass substrate laser delamination and thinning device according to claim 4, characterized in that: The control box (602) is equipped with a robotic arm (6) on one side of the vertical control center (2), and the side of the robotic arm (6) near the control box (602) is fixedly connected to the control box (602). A laser head (601) is installed on the side of the robotic arm (6) near the operation panel (4), and the side of the laser head (601) near the robotic arm (6) is fixedly connected to the robotic arm (6).

10. The glass substrate laser delamination and thinning device according to claim 1, characterized in that: A monitoring box (7) is fixedly installed on one side of the vertical control box (602) of the base box (3). A sensing mechanism (702) is installed on the side of the monitoring box (7) close to the base box (3), and the sensing mechanism (702) is placed inside the monitoring box (7) and fixedly connected to the monitoring box (7). A monitoring mechanism (701) is provided on the side of the sensing mechanism (702) away from the base box (3), and the monitoring mechanism (701) is placed inside the monitoring box (7) and fixedly connected to the monitoring box (7). A protective cover (703) is provided on the side of the monitoring box (7) close to the operation panel (4) to cooperate with the monitoring mechanism (701).

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