Sensor and quality detection device

Abstract

The embodiment of the invention provides a sensor and a quality detection device. In one specific embodiment, the sensor comprises a protective shell, a first circuit board, a second circuit board and a temperature sensing element, a first cavity is formed in the protective shell, and the first circuit board and the second circuit board are located in the first cavity; the first circuit board is provided with a first resonator, and the second circuit board is provided with a second resonator; the temperature sensing element is located between the first resonator and the second resonator; the protective shell comprises a first output end, a second output end and a third output end, the first output end is electrically connected with the output end of the first resonator, the second output end is electrically connected with the output end of the second resonator, and the third output end is electrically connected with the output end of the temperature sensing element; the first resonator is provided with a first opening for exposing the first vibrator; the protective shell is provided with a second opening for exposing the first resonator, and the first oscillator is exposed out of the protective shell through the first opening and the second opening. According to the embodiment, pollution on the surface of the spacecraft can be detected.

Description

Technical Field

[0001] This disclosure relates to the field of testing. More specifically, it relates to a sensor and a quality testing device. Background Technology

[0002] Currently, with the development of China's aerospace and national defense sectors, an increasing number of aerospace reconnaissance and monitoring satellites have been successfully launched into space. After entering space, spacecraft and satellites operate in a high-vacuum environment. The release of gas from their own materials and the re-release of carried particles creates a large amount of volatiles, dust particles, and gas molecules, causing contamination on the spacecraft surface. The plumes generated by attitude control engines also release waste, further contaminating the spacecraft surface. The accumulation of contaminants on sensitive surfaces has a cumulative effect over time, causing varying degrees of damage to both long-life low-Earth orbit satellites and deep-space exploration satellites. This contamination of the optical lenses of onboard optical sensors leads to signal attenuation; reduced solar energy absorption efficiency and output power; wear and tear on connectors; and changes in the surface absorptivity and emissivity of the temperature control layer, causing material aging and severely impacting the effective performance of onboard payloads and remote sensors. Although micro-mass sensors have long been developed abroad for dust monitoring, current technology lacks equipment capable of effectively monitoring contamination on spacecraft surfaces. Summary of the Invention

[0003] The purpose of this disclosure is to provide a sensor and quality inspection device for effectively monitoring contamination on the surface of spacecraft, thereby addressing at least one of the problems existing in the prior art.

[0004] To achieve the above objectives, the present disclosure adopts the following technical solution: The first aspect of this disclosure provides a sensor for detecting contamination on the surface of a spacecraft, comprising a protective shell, a first circuit board, a second circuit board, and a temperature sensing element; A first chamber is formed inside the protective shell, and the first circuit board and the second circuit board are respectively located inside the first chamber. A first resonator is provided on the side of the first circuit board away from the second circuit board, and a second resonator is provided on the second circuit board; The temperature sensing element is located between the first resonator and the second resonator; The protective shell includes a first output terminal, a second output terminal, and a third output terminal. The first output terminal is electrically connected to the output terminal of the first resonator, the second output terminal is electrically connected to the output terminal of the second resonator, and the third output terminal is electrically connected to the output terminal of the temperature sensing element. The first resonator has a first opening on the side away from the second circuit board that exposes the first oscillator; The protective shell has a second opening that exposes the first resonator, and the first oscillator is exposed to the protective shell through the first opening and the second opening.

[0005] Preferably, the sensor includes a third circuit board located within the first chamber, the third circuit board being located on the side of the second circuit board away from the first circuit board; The output terminal of the first resonator is electrically connected to the first output terminal in sequence via the first circuit board, the second circuit board, and the third circuit board; The output terminal of the second resonator is electrically connected to the second output terminal in sequence via the second circuit board and the third circuit board; The output terminal of the temperature sensing element is electrically connected to the third output terminal in sequence via the first circuit board, the second circuit board, and the third circuit board.

[0006] Preferably, the temperature sensing element is a diode.

[0007] Preferably, the protective shell includes a base; A first outer shell is fixedly installed on the base; A first chamber is formed between the first outer shell and the base, and a first bracket for fixing the first circuit board, the second circuit board and the third circuit board are fixedly installed in the first chamber. The first output terminal, the second output terminal, and the third output terminal are disposed on the base; The sensor also includes a protective cover, which is detachably mounted on the side of the first housing away from the base; the protective cover and the first housing cooperate to form a fourth chamber, and the second opening is disposed in the fourth chamber; The first housing has a second opening that exposes the first resonator.

[0008] Preferably, a sealing gasket is provided between the protective cover and the first outer shell; The outer surface of the base is sealed to the first outer shell.

[0009] Preferably, the first resonator includes a second housing and a second support; A second chamber is formed inside the second outer shell, the second bracket is fixed inside the second chamber, and a first vibrator is fixedly installed on the second bracket; The second housing has a first opening that exposes the first oscillator of the first resonator; The second resonator includes a third housing and a third support; A third chamber is formed inside the third outer shell, the third bracket is fixed inside the third chamber, and a second vibrator is fixedly installed on the third bracket.

[0010] Preferably, the first resonator further includes a plurality of first spring pieces fixed to the second bracket, and the first oscillator is fixedly installed to the second bracket through the plurality of first spring pieces; The second resonator also includes a plurality of second springs fixed to the third bracket, and the second oscillator is fixedly installed to the third bracket through the plurality of second springs.

[0011] Preferably, the first resonator and the second resonator are both quartz resonators.

[0012] A second aspect of the present invention provides a quality inspection device, comprising: A processor and at least one sensor as described in any of the first aspects; The sensor is used to acquire the monitoring frequency output by the first oscillator affected by the surface deposits of the first resonator; acquire the reference frequency output by the second resonator; and acquire the ambient temperature between the first and second resonators by the temperature sensing element. The processor is used to calculate the mass change of the deposits on the surface of the first oscillator based on the monitoring frequency, the reference frequency, and the ambient temperature, and to obtain the contamination detection results on the spacecraft surface.

[0013] Preferably, the processor is used to obtain the chip's base frequency based on the ambient temperature. and frequency constant K; According to the formula:

[0014] Calculate the mass change of the deposits on the surface of the first oscillator. ; The monitoring frequency of the deposits on the surface of the first oscillator; The reference frequency provided for the second resonator; The density of the deposits on the surface of the first oscillator; The area of ​​the deposits on the surface of the first oscillator.

[0015] The beneficial effects of this disclosure are as follows: In this invention, the opening exposing the first resonator's first oscillator allows it to be directly exposed to the spacecraft surface environment, where contaminants such as volatiles, dust, and plume residues can be directly deposited on the oscillator's surface. This contaminant deposition alters the oscillator's effective mass, causing a shift in its resonant frequency. This enables accurate detection of changes in contaminant mass, meeting the high-sensitivity detection requirements for contaminants on the spacecraft surface and providing a foundation for payload contamination protection.

[0016] In this embodiment, the first resonator is exposed, directly contacting contaminants, and its frequency is affected by both contaminant deposition and temperature changes. The second resonator is enclosed, protected by a shell to isolate it from contaminants, and its frequency is affected only by temperature changes. In this application, ambient temperature data is provided independently by a temperature sensing element. By comparing the frequency shifts of the two resonators and combining them with the temperature data, the effect of temperature drift can be eliminated, purifying the signal into frequency changes caused by contaminant deposition, significantly improving the signal-to-noise ratio and measurement accuracy. Attached Figure Description

[0017] The specific embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0018] Figure 1 A schematic diagram of the structure of a sensor according to an embodiment of the present disclosure is shown.

[0019] Figure 2 A schematic diagram of the structure of a first resonator according to an embodiment of the present disclosure is shown.

[0020] Figure 3 A schematic diagram of the structure of a second resonator according to an embodiment of the present disclosure is shown. Detailed Implementation

[0021] To more clearly illustrate this disclosure, the following description, in conjunction with embodiments and accompanying drawings, further clarifies the subject matter. Similar components in the drawings are indicated by the same reference numerals. Those skilled in the art should understand that the specific description below is illustrative rather than restrictive and should not be construed as limiting the scope of protection of this disclosure.

[0022] The first embodiment of the present invention provides a sensor, such as... Figure 1 As shown, the sensor is used for contamination detection on the surface of a spacecraft and includes a protective shell 10, a first circuit board 20, a second circuit board 30, and a temperature sensing element 70. A first chamber is formed inside the protective shell 10, and the first circuit board 20 and the second circuit board 30 are respectively located inside the first chamber; A first resonator 50 is provided on the side of the first circuit board 20 away from the second circuit board 30, and a second resonator 60 is provided on the second circuit board 30. The temperature sensing element 70 is located between the first resonator 50 and the second resonator 60; The protective shell 10 includes a first output terminal, a second output terminal and a third output terminal. The first output terminal is electrically connected to the output terminal of the first resonator 50, the second output terminal is electrically connected to the output terminal of the second resonator 60, and the third output terminal is electrically connected to the output terminal of the temperature sensing element 70. The first resonator 50 has a first opening 504 on the side away from the second circuit board 30, which exposes the first oscillator 506; The protective shell 10 has a second opening 106 for exposing the first resonator 50. The first oscillator 506 is exposed to the protective shell 10 through the first opening 504 and the second opening 106.

[0023] In this invention, the opening exposing the first oscillator 506 of the first resonator 50 allows the oscillator of the first resonator 50 to be directly exposed to the spacecraft surface environment. Contaminants such as volatiles, dust, and plume residues can be directly deposited on the oscillator surface. This contaminant deposition alters the effective mass of the oscillator, causing a shift in its resonant frequency. This enables accurate detection of changes in the mass of contaminants, meeting the high-sensitivity detection requirements for contaminants on the spacecraft surface and providing a foundation for contamination protection of the payload.

[0024] In this embodiment, the first resonator 50 is exposed, directly contacting contaminants, and its frequency is affected by both contaminant deposition and temperature changes. The second resonator 60 is enclosed, isolated from contaminants by the protective casing 10, and its frequency is affected only by temperature changes. In this application, ambient temperature data is independently provided by the temperature sensing element 70. By comparing the frequency shifts of the two resonators and combining them with the temperature data, the effect of temperature drift can be eliminated, purifying the signal into frequency changes caused by contaminant deposition, significantly improving the signal-to-noise ratio and measurement accuracy.

[0025] In one specific example, spacecraft include devices such as artificial Earth satellites, manned spacecraft, and space probes, which are not limited in this embodiment.

[0026] In one specific example, the protective housing 10 includes a first output terminal, a second output terminal, and a third output terminal on the side near the second circuit board 30.

[0027] In one specific example, the temperature sensing element 70 can be disposed on the side of the first circuit board 20 close to the second circuit board 30, in which case the second resonator 60 is disposed on the side of the second circuit board 30 close to the first circuit board 20. Alternatively, the temperature sensing element 70 can be disposed on the side of the second circuit board 30 close to the first circuit board 20, in which case the second resonator 60 is disposed on the side of the second circuit board 30 away from the first circuit board 20.

[0028] In a specific example, the first resonator 50 is to be decapped before assembly, that is, to open a first opening 504 and remove at least 1.5 mm of the upper part of the shell of the first resonator 50, so as to ensure that the internal quartz crystal of the first resonator 50 is exposed to the protective shell 10 after installation.

[0029] In one possible implementation, the sensor includes a third circuit board 40 located within the first chamber, the third circuit board 40 being located on the side of the second circuit board 30 away from the first circuit board 20. The output terminal of the first resonator 50 is electrically connected to the first output terminal via the first circuit board 20, the second circuit board 30 and the third circuit board 40 in sequence; The output terminal of the second resonator 60 is electrically connected to the second output terminal via the second circuit board 30 and the third circuit board 40 in sequence; The output terminal of the temperature sensing element 70 is electrically connected to the third output terminal via the first circuit board 20, the second circuit board 30, and the third circuit board 40 in sequence. In this embodiment, the third circuit board 40 serves as a signal bus and relay layer, integrating the output signals of the first resonator 50, the second resonator 60, and the temperature sensing element 70 before outputting them to the interface of the protective shell 10. On the one hand, the third circuit board 40 can protect the devices installed between the first circuit board 20 and the third circuit board 40, such as the temperature sensing element 70 and the second resonator 60; on the other hand, high-frequency vibrations during spacecraft launch can easily damage the sensor. Using the third circuit board 40 as a relay avoids excessively long wiring between the second board and the corresponding output terminal, which has high inertia and can cause connection point breakage under high-frequency vibrations. Moreover, in this embodiment, the third circuit board 40 serves as the bottom support, forming a multi-level support structure to improve the strength of the sensor.

[0030] In a specific example, the first output terminal, the second output terminal, and the third output terminal on the protective shell 10 are each connected to two wires, for a total of six wires. The six wires are respectively connected to the corresponding interfaces of the second circuit board 30 so that the output terminal of the first resonator 50 is electrically connected to the first output terminal in sequence via the first circuit board 20, the second circuit board 30, and the third circuit board 40; the output terminal of the second resonator 60 is electrically connected to the second output terminal in sequence via the second circuit board 30 and the third circuit board 40; and the output terminal of the temperature sensing element 70 is electrically connected to the third output terminal in sequence via the first circuit board 20, the second circuit board 30, and the third circuit board 40.

[0031] In one possible implementation, the temperature sensing element 70 is a diode. In this embodiment, the diode achieves highly stable temperature measurement using semiconductor characteristics, enabling contamination detection sensitivity at the nanogram level (0.1 ng / Hz), while simultaneously meeting the long-life reliability requirements of spacecraft in radiation, vacuum, and atomic oxygen environments.

[0032] In one possible implementation, the protective shell 10 includes a base 101; The first outer shell 102 is fixedly installed on the base 101; A first chamber is formed between the first outer shell 102 and the base 101, and a first bracket for fixing the first circuit board 20, the second circuit board 30 and the third circuit board 40 are fixedly installed in the first chamber. The first output terminal, the second output terminal, and the third output terminal are mounted on the base 101; The sensor also includes a protective cover 103, which is detachably mounted on the side of the first housing 102 away from the base 101. The protective cover 103 and the first housing 102 cooperate to form a fourth chamber, and a second opening 106 is disposed in the fourth chamber. Specifically, the protective cover 103 can be detachably and fixedly connected to the first housing 102 by screws or by threaded connection. This embodiment does not impose any restrictions on this.

[0033] The first housing 102 has a second opening 106 that exposes the first resonator 50.

[0034] In a specific example, the second housing 501 and the third housing 601 are each a sealed container that protects the internal precision oscillator, or wafer, and support from environmental factors such as dust, moisture, and physical impact. Such housings typically consist of two parts: a base, which is the bottom of the housing; it is usually made of metal, ceramic, or glass and has embedded metal pins or pads. The ends of the support are welded or connected to these pins or connection points inside the base; the base provides the electrical interface, i.e., pins or pads, for connection to external circuitry; the mounting base for the support; and the bottom of the sealed cavity. The top cover, typically a metal cap or cover plate, is sealed and welded to the base to form the sealed cavity.

[0035] In this embodiment, the cooperation between the first outer shell 102 and the base 101 protects the internal structure of the first resonator 50, the second resonator 60, the temperature sensing element 70, and the three circuit boards. Before using the sensor, the protective cover 103 protects the quartz oscillator from damage. Furthermore, the first opening 504 and the second opening 106 only expose the first oscillator 506 portion of the first resonator 50; the remaining circuit boards and temperature sensing element 70 are still protected by the protective shell 10. This achieves the goal of maintaining high detection sensitivity while preventing damage to the core circuitry from space radiation and atomic oxygen erosion, thus ensuring the sensor's lifespan.

[0036] In a specific example, the first bracket may be a sleeve located between the base 101 and the third circuit board 40; the third circuit board 40 and the second circuit board 30, and the second circuit board 30 and the first circuit board 20, respectively, to facilitate installation and fixation.

[0037] In a specific example, before installing the sensor onto the spacecraft, the protective cover 103 needs to be removed. After the sensor is installed onto the spacecraft, the outer surface of the spacecraft should be aligned as much as possible with the outer surface of the first outer shell 102 on the side where the first opening 504 is provided. At the same time, in this embodiment, the side of the first resonator 50 away from the second circuit board 30 is aligned with the outer surface of the first outer shell 102 on the side where the first opening 504 is provided, so that the first resonator 50 is aligned with the spacecraft surface. The first oscillator 506 on the first resonator 50 can more accurately measure the micro-dust on the spacecraft surface while avoiding the first resonator 50 being exposed on the spacecraft surface, thus increasing the risk of damage.

[0038] In one specific example, the first housing 102 and the protective cover 103 are fixedly connected by bolts.

[0039] It should be noted that in this embodiment, the first circuit board 20, the second circuit board 30 and the third circuit board 40 can be fixed to the first housing 102 by screws, and this embodiment does not impose any restrictions on this.

[0040] In a specific example, the base 101 and the first outer shell 102 are both made of titanium alloy. Although stainless steel, aluminum, titanium alloy, and other metal materials can all be used in satellites, stainless steel has too high a density, titanium alloy is next, and aluminum has the lowest density. Aluminum has a large amount of gas release in a vacuum, so it is not suitable for sensor applications. Therefore, titanium alloy is selected as the structural material for both the base 101 and the first outer shell 102.

[0041] In one possible implementation, a sealing gasket 105 is provided between the protective cover 103 and the first housing 102; The outer surface of the base 101 is sealed to the first housing 102. In this embodiment, the protective cover 103 is sealed to the housing by a sealing gasket 105 to prevent dust from entering the first oscillator 506 before the sensor is used.

[0042] In a specific example, the outer surface of the first resonator 50 is sealed to the second opening 106 of the first housing 102; it should be noted that sealing can be achieved by means of sealant or by adding a sealing gasket 105, etc., and this embodiment does not limit this.

[0043] In one possible implementation, such as Figure 2 As shown, the first resonator 50 includes a second housing 501 and a second bracket 502; A second chamber 505 is formed inside the second outer shell 501, a second bracket 502 is fixed inside the second chamber 505, and a first vibrator 506 is fixedly installed on the second bracket 502. The second housing 501 has a first opening 504 that exposes the first oscillator 506 of the first resonator 50; like Figure 3 As shown, the second resonator 60 includes a third housing 601 and a third support 602; A third chamber 604 is formed inside the third outer shell 601, and a third bracket 602 is fixed inside the third chamber 604. A second vibrator 605 is fixedly installed on the third bracket 602.

[0044] In one specific example, the second bracket 502 and the third bracket 602 are respectively HC-37 / U cold-pressed brackets; the second housing 501 and the third housing 601 are respectively HC-37 / U cold-pressed housing covers for vacuum cold-pressing sealing.

[0045] It should be noted that, Figure 2 The second opening 106 of the first resonator 50 is disposed on the top of the second housing 501; In one possible implementation, the first resonator 50 further includes a plurality of first spring pieces 503 fixed to the second bracket 502, and the first oscillator 506 is fixedly mounted to the second bracket 502 by the plurality of first spring pieces 503. The second resonator 60 also includes a plurality of second spring pieces 603 fixed to the third bracket 602, and the second oscillator 605 is fixedly installed to the third bracket 602 through the plurality of second spring pieces 603.

[0046] In one specific example, conductive adhesive is used to bond the oscillator to the four springs of the corresponding bracket, which effectively improves the sensor's vibration resistance and impact resistance.

[0047] In one possible implementation, the first resonator 50 and the second resonator 60 are quartz resonators, respectively.

[0048] In a specific example, the second resonator 60 is a quartz resonator, whose output is an electrical signal with a nominal frequency of 10000±0.5kHz; the first resonator 50 is a quartz resonator, whose output has a nominal frequency of 9998±0.5kHz, and the output frequency will change after being contaminated with dust particles.

[0049] In a specific example, in this embodiment, the first circuit board 20, the second circuit board 30, and the third circuit board 40 are all printed circuit boards.

[0050] A second embodiment of the present invention provides a quality inspection device, comprising: A processor and at least one sensor as described in the first embodiment; The sensor is used to acquire the monitoring frequency output by the first oscillator 506 affected by the surface deposits through the first resonator 50; acquire the reference frequency output by the second resonator 60; and acquire the ambient temperature between the first resonator 50 and the second resonator 60 monitored by the temperature sensing element 70. The processor is used to calculate the mass change of the deposits on the surface of the first oscillator 506 based on the monitoring frequency, reference frequency and ambient temperature, and obtain the contamination detection results on the spacecraft surface.

[0051] The processor is used to obtain the chip's base frequency based on the ambient temperature. and frequency constant K; According to the formula:

[0052] Calculate the mass change of the deposits on the surface of the first oscillator 506. ; The monitoring frequency for the deposits on the surface of the first oscillator 506; The reference frequency provided for the second resonator 60; The density of the deposits on the surface of the first oscillator 506; The area of ​​the deposits on the surface of the first oscillator 506.

[0053] In this embodiment, the temperature sensing element 70 reduces the impact of temperature on the difference frequency signal. The influence of this makes the frequency-temperature curves of the second resonator 60 and the first resonator 50 consistent. The frequency change of the quartz wafer is proportional to the change in mass per unit area. By measuring the frequency change by the processor, the mass contamination on the surface of the sensitive wafer can be calculated.

[0054] This invention is the first to apply the sensor of this invention to the surface of equipment such as satellites and spacecraft to detect surface contamination, providing a foundation for contamination protection of onboard payloads.

[0055] In the description of this disclosure, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. For those skilled in the art, the specific meaning of the above terms in this disclosure can be understood according to the specific circumstances.

[0056] It should also be noted that, in the description of this disclosure, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0057] Obviously, the above embodiments of this disclosure are merely examples for clearly illustrating this disclosure, and are not intended to limit the implementation of this disclosure. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all implementation methods here. Any obvious variations or modifications derived from the technical solutions of this disclosure are still within the protection scope of this disclosure.

Claims

1. A sensor, characterized in that, The sensor is used for contamination detection on the surface of spacecraft and includes a protective shell, a first circuit board, a second circuit board, and a temperature sensing element. A first chamber is formed inside the protective shell, and the first circuit board and the second circuit board are respectively located inside the first chamber. A first resonator is provided on the side of the first circuit board away from the second circuit board, and a second resonator is provided on the second circuit board; The temperature sensing element is located between the first resonator and the second resonator; The protective shell includes a first output terminal, a second output terminal, and a third output terminal. The first output terminal is electrically connected to the output terminal of the first resonator, the second output terminal is electrically connected to the output terminal of the second resonator, and the third output terminal is electrically connected to the output terminal of the temperature sensing element. The first resonator has a first opening on the side away from the second circuit board that exposes the first oscillator; The protective shell has a second opening that exposes the first resonator, and the first oscillator is exposed to the protective shell through the first opening and the second opening.

2. The sensor according to claim 1, characterized in that, The sensor includes a third circuit board located within the first chamber, the third circuit board being located on the side of the second circuit board away from the first circuit board; The output terminal of the first resonator is electrically connected to the first output terminal in sequence via the first circuit board, the second circuit board, and the third circuit board; The output terminal of the second resonator is electrically connected to the second output terminal in sequence via the second circuit board and the third circuit board; The output terminal of the temperature sensing element is electrically connected to the third output terminal in sequence via the first circuit board, the second circuit board, and the third circuit board.

3. The sensor according to claim 1, characterized in that, The temperature sensing element is a diode.

4. The sensor according to claim 2, characterized in that, The protective shell includes a base; A first outer shell is fixedly installed on the base; A first chamber is formed between the first outer shell and the base, and a first bracket for fixing the first circuit board, the second circuit board and the third circuit board are fixedly installed in the first chamber. The first output terminal, the second output terminal, and the third output terminal are disposed on the base; The first housing has a second opening that exposes the first resonator; The sensor also includes a protective cover, which is detachably mounted on the side of the first housing away from the base; the protective cover and the first housing cooperate to form a fourth chamber, and the second opening is disposed in the fourth chamber.

5. The sensor according to claim 4, characterized in that, A sealing gasket is provided between the protective cover and the first outer shell; The outer surface of the base is sealed to the first outer shell.

6. The sensor according to claim 1, characterized in that, The first resonator includes a second housing and a second support; A second chamber is formed inside the second outer shell, the second bracket is fixed inside the second chamber, and a first vibrator is fixedly installed on the second bracket; The second housing has a first opening that exposes the first oscillator of the first resonator; The second resonator includes a third housing and a third support; A third chamber is formed inside the third outer shell, the third bracket is fixed inside the third chamber, and a second vibrator is fixedly installed on the third bracket.

7. The sensor according to claim 6, characterized in that, The first resonator also includes a plurality of first spring pieces fixed to the second bracket, and the first oscillator is fixedly installed to the second bracket through the plurality of first spring pieces; The second resonator also includes a plurality of second springs fixed to the third bracket, and the second oscillator is fixedly installed to the third bracket through the plurality of second springs.

8. The sensor according to any one of claims 1-7, characterized in that, The first resonator and the second resonator are both quartz resonators.

9. A quality inspection device, characterized in that, include: The processor and at least one sensor as claimed in any one of claims 1-8; The sensor is used to acquire the monitoring frequency output by the first oscillator due to the influence of its surface deposits via the first resonator; and to acquire the reference frequency output by the second resonator. The ambient temperature between the first resonator and the second resonator is monitored using a temperature sensing element. The processor is used to calculate the mass change of the deposits on the surface of the first oscillator based on the monitoring frequency, the reference frequency, and the ambient temperature, and to obtain the contamination detection results on the spacecraft surface.

10. The quality inspection device according to claim 9, characterized in that, The processor is used to obtain the chip's base frequency based on the ambient temperature. and frequency constant K; According to the formula: Calculate the mass change of the deposits on the surface of the first oscillator. ; The monitoring frequency of the deposits on the surface of the first oscillator; The reference frequency provided for the second resonator; The density of the deposits on the surface of the first oscillator; The area of ​​the deposits on the surface of the first oscillator.

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