Display panel, display device and packaging method of display panel

Abstract

The invention discloses a display panel, a display device and a packaging method of the display panel, and relates to the technical field of display, the display panel comprises a circuit substrate, a plurality of LED chips located on one side of the circuit substrate, a first adhesive layer covering the plurality of LED chips, and a second adhesive layer located on one side, away from the plurality of LED chips, of the first adhesive layer, the first glue layer covering the plurality of LED chips is not formed by using a printing process any more, but is formed by adopting a mold glue filling mode, so that the surface, deviating from the plurality of LED chips, of the first glue layer, namely the first surface, is a flat surface parallel to the plane where the circuit substrate is located through the design of a mold, or the first surface is a flat surface parallel to the plane where the circuit substrate is located, or the second surface is a flat surface parallel to the plane where the circuit substrate is located. The first surface comprises a flat part and a plurality of first microstructures, the flat part is parallel to the plane where the circuit substrate is located, and the height of the first microstructures is not greater than 20% of the thickness of the second adhesive layer, that is, the height is within the permissible range of the segment difference of the second adhesive layer, so that bubbles are prevented from being generated on the first surface of the first adhesive layer, and the impression experience of a user is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a display device, and a method for packaging the display panel. Background Technology

[0002] Light-emitting diode (LED) display panels, such as Micro LED display panels and Mini-LED display panels, have many advantages such as self-illumination, low driving voltage, high luminous efficiency, short response time, and high clarity and contrast, and have gradually become a research hotspot in the field of display technology.

[0003] However, when encapsulating LED display panels, a transparent adhesive layer is usually printed on top of the LEDs to cover them. Utilizing the fluidity of the adhesive, the transparent adhesive flows to the edges of the display panel. This naturally creates a slope at the edges, making the transparent adhesive layer thinner than in the center of the display panel. When the anti-glare layer is subsequently applied, air bubbles will form at the edges of the display panel. These air bubbles have higher reflectivity than other areas and are visible macroscopically, resulting in a poor user experience. Summary of the Invention

[0004] To address the aforementioned technical issues, this application provides a display panel, a display device, and a packaging method for the display panel. Instead of using a printing process to form an adhesive layer above the light-emitting diode (LED), a mold-pouring method is used to form the adhesive layer above the LED. This ensures that the surface of the adhesive layer is smooth, or that the height of the microstructure on the surface of the adhesive layer is within the allowable range of subsequent adhesive layer steps, thereby preventing air bubbles from forming on the surface of the adhesive layer and improving the user's viewing experience.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] In a first aspect, this application provides a display panel, the display panel comprising:

[0007] Circuit board;

[0008] Multiple LED chips are located on one side of the circuit board;

[0009] The first adhesive layer covers multiple LED chips, and the surface of the first adhesive layer facing away from the multiple LED chips is the first surface.

[0010] The second adhesive layer is located on the side of the first adhesive layer that is away from the multiple LED chips;

[0011] The first surface is a flat surface parallel to the plane of the circuit board.

[0012] Alternatively, the first surface includes a flattened portion and a plurality of first microstructures, the flattened portion being parallel to the plane of the circuit board, and the height of the first microstructures being no more than 20% of the thickness of the second adhesive layer in a direction perpendicular to the plane of the circuit board.

[0013] Secondly, this application provides a display device including the aforementioned display panel.

[0014] Thirdly, this application provides a method for packaging a display panel, the method comprising:

[0015] The display panel is placed on a platform. The display panel includes a circuit board and multiple LED chips located on the side of the circuit board facing away from the platform.

[0016] A first mold is placed on the platform such that the first mold at least partially surrounds the display panel, and the surface of the first mold facing away from the platform is higher than the multiple LED chips;

[0017] A second mold is placed on the surface of the first mold facing away from the platform, such that at least the second mold, the first mold, and the display panel form a receiving cavity;

[0018] At least one of the first mold and the second mold is provided with a glue injection port, and glue is injected into the receiving cavity from the glue injection port to form a first glue layer covering multiple LED chips.

[0019] Remove the first mold and the second mold, and form a second adhesive layer on the side of the first adhesive layer opposite to the multiple LED chips;

[0020] Wherein, the surface of the second mold facing the display panel is the first model surface, and the first model surface is a flat surface parallel to the plane of the circuit board; or, the first model surface includes a model flattening part and a plurality of first model microstructures, the model flattening part is parallel to the plane of the circuit board, and in the direction perpendicular to the plane of the circuit board, the height of the first model microstructure is not greater than 20% of the thickness of the second adhesive layer.

[0021] Compared with existing technologies, the above technical solution has the following advantages:

[0022] The display panel provided in this application includes a circuit board, multiple LED chips located on one side of the circuit board, a first adhesive layer covering the multiple LED chips, and a second adhesive layer located on the side of the first adhesive layer facing away from the multiple LED chips. The first adhesive layer covering the multiple LED chips is no longer formed using a printing process, but rather using a mold-casting method. This allows the mold design to ensure that the surface of the first adhesive layer facing away from the multiple LED chips (i.e., the first surface) is a flat surface parallel to the plane of the circuit board, thus preventing air bubbles from forming on the first surface of the first adhesive layer and improving the user's viewing experience. Alternatively, the mold design can be used to ensure that the surface of the first adhesive layer facing away from the multiple LED chips (i.e., the first surface) includes a flat portion and multiple first microstructures. The flat portion is parallel to the plane of the circuit board, and the height of the first microstructures is controllable according to the mold design. In the direction perpendicular to the plane of the circuit board, the height of the first microstructures can be controlled to not exceed 20% of the thickness of the second adhesive layer. Therefore, the height of the first microstructures is within the allowable range of the step difference of the second adhesive layer. Thus, after the second adhesive layer is formed on the side of the first adhesive layer facing away from the multiple LED chips, air bubbles on the first surface of the first adhesive layer can also be avoided, improving the user's viewing experience. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic cross-sectional view of an existing light-emitting diode display panel;

[0025] Figure 2 A cross-sectional structural diagram of a display panel provided in an embodiment of this application;

[0026] Figures 3a-3d In a method for packaging a display panel provided in an embodiment of this application, the packaging forms... Figure 2 The diagram shows the various manufacturing processes of the display panel.

[0027] Figure 4 This is a top view of a display panel covered with a first adhesive layer and a first mold in an embodiment of this application;

[0028] Figure 5 This is another top view of the display panel covered with the first adhesive layer and the first mold in an embodiment of this application;

[0029] Figure 6A cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0030] Figure 7 In a method for packaging a display panel provided in an embodiment of this application, the packaging forms... Figure 6 The diagram shows the manufacturing process of the display panel.

[0031] Figure 8 A cross-sectional structural schematic diagram of another display panel provided in an embodiment of this application;

[0032] Figure 9 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0033] Figure 10a and Figure 10b A schematic diagram of the various processes for forming the second adhesive layer in a display panel encapsulation method provided in an embodiment of this application;

[0034] Figure 11 A cross-sectional structural schematic diagram of another display panel provided in an embodiment of this application;

[0035] Figures 12a-12d In a method for packaging a display panel provided in an embodiment of this application, the packaging forms... Figure 11 The diagram shows the various manufacturing processes of the display panel.

[0036] Figure 13 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0037] Figure 14 In a method for packaging a display panel provided in an embodiment of this application, the packaging forms... Figure 13 The diagram shows the manufacturing process of the display panel.

[0038] Figure 15 A cross-sectional structural schematic diagram of another display panel provided in an embodiment of this application;

[0039] Figure 16 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0040] Figure 17 In a method for packaging a display panel provided in an embodiment of this application, the packaging forms... Figure 16 The diagram shows the manufacturing process of the display panel.

[0041] Figure 18 A cross-sectional structural schematic diagram of another display panel provided in an embodiment of this application;

[0042] Figure 19 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0043] Figure 20 This is a schematic diagram of another display device provided in an embodiment of this application. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0045] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements, but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0046] Secondly, this application provides a detailed description in conjunction with schematic diagrams. When detailing the embodiments of this application, for ease of explanation, the accompanying drawings illustrating the device structure may be partially enlarged, not to scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this application. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0047] Figure 1 A cross-sectional structural schematic diagram of a conventional light-emitting diode display panel 100 is shown, as follows: Figure 1 As shown, the existing light-emitting diode display panel 100 includes a circuit board 10 and a plurality of LED chips 11 located on one side of the circuit board 10. In order to realize a large-size screen display, the light-emitting diode display panel needs to use small-size screens for splicing. In order to reduce the bezel of the screen and achieve seamless splicing, side traces 12 are usually provided on the side of the light-emitting diode display panel. The two ends of the side traces 12 extend to the upper and lower surfaces of the circuit board 10 respectively, and are electrically connected to the first conductor 131 and the second conductor 132 respectively provided on the upper and lower surfaces of the circuit board 10. A side encapsulation layer 14 is provided on the side of the side traces 12 away from the circuit board 10, and the side encapsulation layer 14 covers and protects the side traces 12.

[0048] refer to Figure 1 As shown, the encapsulation process of a conventional LED display panel is as follows: First, a transparent adhesive layer 15 is printed on the side of the LED chip 11 away from the circuit board 10 to cover the LED chip 11. Since the transparent adhesive layer 15 is formed by printing, it can only be printed near the edge of the display panel (e.g., near the side trace 12 of the display panel). The fluidity of the adhesive is used to make the transparent adhesive flow to the edge of the display panel. Otherwise, if the transparent adhesive is printed at the edge of the display panel, it will flow to the side of the display panel due to the fluidity of the adhesive, which is not easy to control. Then, an anti-glare layer 17 is attached to the side of the transparent adhesive layer 15 away from the LED chip 11 through an adhesive layer 16. Next, a transparent filler adhesive 18 is formed on the side of the side encapsulation layer 14 and the side of the transparent adhesive layer 15. Finally, a low-resistivity ink 19 is formed by pad printing.

[0049] It is understandable that, since a transparent adhesive layer 15 is printed on the side of the LED chip 11 away from the circuit board 10, and the adhesive flows to the edge of the display panel, the transparent adhesive layer 15 will naturally form a slope P1 at the edge of the display panel. This makes the transparent adhesive layer 15 thinner at the edge of the display panel than in the middle. After the anti-glare layer 17 is subsequently attached, air bubbles will be generated at the edge of the display panel. The air bubbles have a higher reflectivity than other locations, making them visible macroscopically and resulting in a poor user experience, especially at the splicing seams of the display panel, which may mislead users into thinking that the splicing seams are visible.

[0050] In view of this, embodiments of this application provide a display panel 200. Figure 2 This illustration shows a cross-sectional structural diagram of a display panel 200 provided in an embodiment of this application, as shown below. Figure 2 As shown, the display panel 200 includes a circuit board 20, a plurality of LED chips 21 located on one side of the circuit board 20, a first adhesive layer 22 covering the plurality of LED chips 21, and a second adhesive layer 23 located on the side of the first adhesive layer 22 facing away from the plurality of LED chips 21. The surface of the first adhesive layer 22 facing away from the plurality of LED chips 21 is a first surface C10. The first surface C10 can be a flat surface parallel to the plane of the circuit board 10. In this way, the first surface C10 of the first adhesive layer 22 and the second adhesive layer 23 are bonded together, which can prevent air bubbles from forming on the first surface C10 of the first adhesive layer 22 and improve the user's viewing experience.

[0051] It is understood that the circuit board 10 includes a substrate and a driving circuit layer on the substrate. The multiple LED chips 21 may include red LED chips, green LED chips and blue LED chips. The driving circuit layer is used to drive the multiple LED chips 21 to emit light and display.

[0052] To ensure that the first surface C10 of the first adhesive layer 22 is a flat surface parallel to the plane of the circuit board 10, this application embodiment also provides a display panel encapsulation method, which includes:

[0053] S10: As Figure 3a As shown, the display panel 200 is placed on a platform 30. The display panel 200 includes a circuit board 20 and a plurality of LED chips 21 located on the side of the circuit board 20 away from the platform 30.

[0054] Specifically, platform 30 can fix display panel 200.

[0055] S11: As Figure 3b As shown, a first mold 31 is placed on the platform 30 such that the first mold 31 at least partially surrounds the display panel 200, and the surface of the first mold 31 facing away from the platform 30 is higher than the plurality of LED chips 21.

[0056] S13: As Figure 3c As shown, a second mold 32 is placed on the surface of the first mold 31 away from the platform 30, such that at least the second mold 32, the first mold 31 and the display panel 200 form a receiving cavity K1.

[0057] S14: As Figure 3d As shown, at least one of the first mold 31 and the second mold 32 has a glue injection port (not shown in the figure), and glue is injected into the receiving cavity K1 from the glue injection port to form a first glue layer 22 covering multiple LED chips 21.

[0058] Specifically, after injecting sufficient fluid adhesive into the receiving cavity K1, the injected fluid adhesive can be cured, and the second mold 32 can be pressed down in a vacuum environment to form the first adhesive layer 22.

[0059] S15: As Figure 2 As shown, the first mold 31 and the second mold 32 are removed, and a second adhesive layer 23 is formed on the side of the first adhesive layer 22 opposite to the plurality of LED chips 21.

[0060] Among them, Figure 3c and Figure 3d As shown, the surface of the second mold 32 facing the display panel 100 is the first model surface C11. The first model surface C11 can be a flat surface parallel to the plane where the circuit board 20 is located. Thus, when fluid adhesive is injected into the receiving cavity K1 formed by the second mold 32, the first mold 31 and the display panel 200, after the injected fluid adhesive completely fills all corners of the receiving cavity K1 and cures, the first adhesive layer 22 can be separated from the surface of the multiple LED chips 21, that is, the first surface C10 is a flat surface parallel to the plane where the circuit board 20 is located.

[0061] In this embodiment, the first mold 31 at least partially surrounds the display panel 200; that is, the first mold 31 may partially surround the display panel 200 or completely surround the display panel 200. Optionally, Figure 4 A top view schematic diagram of a display panel 200 covered with a first adhesive layer 22 and a first mold 31 is shown, as follows. Figure 4 As shown, the first mold 31 can be located on the opposite sides 201 and 202 of the display panel 200. At this time, the other opposite sides 203 and 204 of the display panel 200 do not have the first mold 31. Then, the receiving cavity K1 formed by the second mold 32, the first mold 31 and the display panel 200 is defined on the opposite sides 201 and 202 of the display panel 200 where the first mold 31 is provided, while the opposite sides 203 and 204 of the display panel 200 have openings. The first adhesive layer 22 will cover the opposite sides 203 and 204 of the display panel 200 where the first mold 31 is not provided. The opposite sides 203 and 204 of the display panel 200 where the first mold 31 is not provided are auxiliary (dummy) sides.

[0062] In actual manufacturing processes, display panels are typically designed with auxiliary edges to facilitate handling. When encapsulating the display panel, the first adhesive layer 22 covering multiple LED chips 21 usually also covers the auxiliary edges of the display panel, and any excess adhesive covering the auxiliary edges is removed in subsequent processes.

[0063] Of course, another option, such as Figure 5 As shown, Figure 5 Another top view of the display panel 200 covered with the first adhesive layer 22 and the first mold 31 is shown. It can be seen that the first mold 31 can also completely surround the display panel 200. In this case, the auxiliary edge of the display panel 200 can be omitted. The receiving cavity K1 formed by the second mold 32, the first mold 31 and the display panel 200 is defined around the display panel 200, and the first adhesive layer 22 only covers the display panel 200.

[0064] In this embodiment of the application, the injection port for injecting glue into the receiving cavity K1 can be located on the first mold 31 or on the second mold 32. Alternatively, injection ports can be provided on both the first mold 31 and the second mold 32 to improve the injection rate, depending on the specific circumstances.

[0065] It is understood that in the display panel and its packaging method provided in this application embodiment, the first adhesive layer 22 covering multiple LED chips 21 is no longer formed by printing process, but by mold potting method. Specifically, fluid adhesive is injected into the receiving cavity K1 formed by at least the second mold 32, the first mold 31 and the display panel 200. After the fluid adhesive fills all corners of the receiving cavity K1 and cures, the first adhesive layer 22 is formed. In this way, through the design of the mold, the surface of the second mold 32 facing the display panel 100, i.e. the first model surface C11, can be set to be a flat surface parallel to the plane of the circuit board 20, so that the surface of the first adhesive layer 22 away from the multiple LED chips 21, i.e. the first surface C10, is a flat surface parallel to the plane of the circuit board, thereby avoiding the generation of air bubbles on the first surface C10 of the first adhesive layer 22 and improving the user's viewing experience.

[0066] Specifically, the second mold 32 can be made of ultra-high flatness reinforced glass material, so that the surface of the second mold 32 facing the display panel 100, i.e. the first model surface C11, is an ultra-high flatness surface. This makes the surface of the first adhesive layer 22 away from the surface of the multiple LED chips 21, i.e. the first surface C10, a surface with a flat and orderly overall cross section, preventing problems such as bubbles and bright lines caused by uneven edges of the first adhesive layer 22 when other film layers are subsequently pasted.

[0067] It is also understandable that, precisely because the first adhesive layer 22 covering multiple LED chips 21 in the display panel and its packaging method provided in this application embodiment is no longer formed by printing process, but by mold potting method, the first adhesive layer 22 can be made to be away from the surface of multiple LED chips 21, i.e., the first surface C10 includes a flat part and multiple first microstructures. The flat part is parallel to the plane of the circuit board 20, and the height of the first microstructure is controllable according to the mold design.

[0068] Figure 6 This illustration shows a cross-sectional structural diagram of another display panel provided in an embodiment of this application, as shown below. Figure 6 As shown, with Figure 2 Unlike the display panel shown, the first adhesive layer 22, which is away from the surface of the multiple LED chips 21, i.e., the first surface C10, may not be a completely flat surface. Instead, it includes a flat part C101 and multiple first microstructures C102. The flat part C101 is parallel to the plane of the circuit board 20. In the direction perpendicular to the plane of the circuit board 20, the height of the first microstructure C102 is no more than 20% of the thickness of the second adhesive layer 23.

[0069] It is understandable that the first adhesive layer 22 has multiple first microstructures C102 disposed on the first surface C10, which is opposite to the surface of the multiple LED chips 21. Firstly, it can improve the roughness of the first surface C10, so that the anti-glare layer can be adhered more firmly in the subsequent process. Secondly, it can improve the haze of the first surface C10, reducing the reflection of external light. Since the function of the subsequently adhered anti-glare layer is also to improve the surface haze of the light-emitting surface of the display panel and reduce the reflection of external light, if the haze of the first surface C10 of the first adhesive layer 23 is sufficient, it may not even be necessary to adhere the anti-glare layer, which is beneficial to reducing the thickness of the display panel. Thirdly, it is equivalent to roughening the light-emitting surface of the multiple LED chips 21, thereby improving the light emission efficiency of the multiple LED chips 21.

[0070] It is also understandable that, such as Figure 7 As shown, when forming the first adhesive layer 22 on the side of multiple LED chips 21 away from the circuit board 20 by mold potting, the surface of the second mold 32 facing the display panel 200, i.e., the first model surface C11, can be configured to include a model flattening part C111 and multiple first model microstructures C112. The model flattening part C111 is parallel to the plane of the circuit board 20, and in the direction perpendicular to the plane of the circuit board 20, the height of the first model microstructures C112 is not greater than 20% of the thickness of the second adhesive layer 23. Thus, fluid adhesive is injected into the receiving cavity K1 formed by the second mold 32, the first mold 31, and the display panel 200, and the fluid adhesive fills the cavity. After the cavity K1 is cured, the first adhesive layer 23 is separated from the surface of the multiple LED chips 21, i.e., the first surface C10 includes a flattening part C101 and multiple first microstructures C102. The flattening part C101 is parallel to the plane of the circuit substrate 20. In the direction perpendicular to the plane of the circuit substrate 20, the height of the first microstructure C102 is not greater than 20% of the thickness of the second adhesive layer 23. The model flattening part C111 of the first model surface C11 and the flattening part C101 of the first surface C10 are correspondingly arranged. The first model microstructure C112 of the first model surface C11 and the first microstructure C102 of the first surface C10 are correspondingly arranged.

[0071] It should be noted that, optionally, the second adhesive layer 23 can be an adhesive layer formed separately on the side of the first adhesive layer 22 opposite to the plurality of LED chips 21.

[0072] Another option, such as Figure 8 and Figure 9 As shown, Figure 8 and Figure 9The diagram shows cross-sectional structural schematics of two other display panels provided in the embodiments of this application. It can be seen that the second adhesive layer 23 can also be an adhesive layer used to adhere the anti-glare layer 24. That is, the display panel 200 can also include the anti-glare layer 24. The anti-glare layer 24 is located on the side of the second adhesive layer 23 away from the first adhesive layer 22. The function of the anti-glare layer 24 is to reduce the reflection of external light and improve the haze of the light-emitting surface of the display panel.

[0073] Accordingly, in the encapsulation process of the display panel 200, step 15, which forms a second adhesive layer 23 on the side of the first adhesive layer 22 opposite to the plurality of LED chips 21, may specifically include:

[0074] S151: As Figure 10a As shown, a second adhesive layer 23 is formed on the surface of an anti-glare layer 24.

[0075] S152: As Figure 10b As shown, from one side of the second adhesive layer 23, the second adhesive layer 23 and the anti-glare layer 24 are attached to the side of the first adhesive layer 22 away from the plurality of LED chips 21, thereby forming the second adhesive layer 23 on the side of the first adhesive layer 22 away from the plurality of LED chips 21.

[0076] Typically, the area of ​​the anti-glare layer 24 with the second adhesive layer 23 is larger than the area of ​​the display panel 200. Furthermore, as previously known, if the display panel 200 has auxiliary edges, the first adhesive layer 22 will cover the auxiliary edges of the display panel, meaning the first adhesive layer 22 also has excess material. Therefore, the encapsulation method for the display panel can further include:

[0077] S16: As Figure 10b As shown, excess portions of the anti-glare layer 24, the second adhesive layer 23 (and the first adhesive layer 22) are removed.

[0078] It is understandable that if there is excess material in the first adhesive layer 22, the excess material in the first adhesive layer 22 can be removed at the same time as the excess material in the anti-glare layer 24 and the second adhesive layer 23.

[0079] It is understandable that, regardless of whether the second adhesive layer 23 is a separately set adhesive layer or an adhesive layer used to adhere the anti-glare layer 24, the second adhesive layer 23 has a certain thickness, allowing the first surface C10 of the first adhesive layer 22 to have a certain roughness. Furthermore, as previously known, by setting the height of the first model microstructure C112 in the first model surface C11 of the second mold 32, the height of the first microstructure C102 in the first surface C10 of the first adhesive layer 22 can be controlled. Therefore, in this embodiment, by designing the mold, the height of the first microstructure C102 on the first surface C10 of the first adhesive layer 22 in the direction perpendicular to the plane of the circuit board 20 can be controlled to be no greater than 20% of the thickness of the second adhesive layer 23. Thus, the height of the first microstructure C102 on the first surface C10 of the first adhesive layer 22 can be within the allowable range of the step difference of the second adhesive layer 23. After the second adhesive layer 23 is formed on the side of the first adhesive layer 22 away from the multiple LED chips 21, it is also possible to avoid the generation of bubbles on the first surface C10 of the first adhesive layer 22, thereby improving the user's visual experience.

[0080] Optional, such as Figure 6 and Figure 9 As shown, the first microstructure C102 in the first surface C10 of the first adhesive layer 22 can be a groove structure, but this application does not limit the specific structure of the first microstructure 102. Alternatively, the first microstructure C102 in the first surface C10 of the first adhesive layer 22 can also be a protrusion structure.

[0081] Based on the first surface C10 of the first adhesive layer 22 including a flattened portion C101 and a plurality of first microstructures C102, optionally, in some embodiments of this application, such as Figure 6 As shown, the first surface C10 of the first adhesive layer 22 includes a first region C1 and a second region C2. The orthographic projection of the LED chip 21 on the first surface C10 is located in the first region C1, that is, the first region C1 corresponds to the LED chip 21. The plurality of first microstructures C102 include a plurality of first type microstructures C102-1 and a plurality of second type microstructures C102-2. In the direction perpendicular to the plane where the circuit substrate 20 is located, the height of the first type microstructure C102-1 is less than the height of the second type microstructure C102-2. The first type microstructure C102-1 is located in the first region C1, and the second type microstructure C102-2 is located in the second region C2.

[0082] In other words, a first type of microstructure C102-1 with a relatively small height is provided in the first region C1 of the first surface C10 of the first adhesive layer 22 corresponding to the LED chip 21, and a second type of microstructure C102-2 with a relatively large height is provided in the second region C2 of the first surface C10 of the first adhesive layer 22 that does not correspond to the LED chip 21. This is because, due to the thinner thickness of the portion of the first adhesive layer 22 corresponding to the LED chip 21 compared to the portion not corresponding to the LED chip 21, only the first region C1 of the first surface C10 of the first adhesive layer 22 corresponding to the LED chip 21 can have a relatively small first type of microstructure C102-1. Furthermore, having a relatively small first type of microstructure C102-1 in the first region C10 of the first surface C10 of the first adhesive layer 22 corresponding to the LED chip 21, and a relatively large second type of microstructure C102-2 in the second region C2 of the first surface C10 of the first adhesive layer 22, can further improve the roughness of the first surface C10 of the first adhesive layer 22.

[0083] Accordingly, during the encapsulation process of the display panel 200, such as Figure 7 As shown, the surface of the second mold 32 facing the display panel 200, i.e., the first model surface C11, includes a model flattening part C111 and multiple first model microstructures C112. The first model surface C11 includes a first model region C1' and a second model region C2'. The orthographic projection of the LED chip 21 on the first model surface C11 is located in the first model region C1'. The multiple first model microstructures C112 include multiple first-type model microstructures C112-1 and multiple second-type model microstructures C112-2. In the direction perpendicular to the plane where the circuit board 20 is located, the height of the first-type model microstructure C112-1 is less than the height of the second-type model microstructure C112-2. The first-type model microstructure C112-1 is located in the first model region C1', and the second-type model microstructure C112-2 is located in the second model region C2'.

[0084] It is understood that the first model surface C10 corresponds to the first surface C10, the model flattening part C111 of the first model surface C10 corresponds to the flattening part C101 of the first surface C10, the first model microstructure C112 of the first model surface C10 corresponds to the first microstructure C102 of the first surface C10, the first region C1' of the first model surface C10 corresponds to the first region C1 of the first surface C10, the first type of model microstructure C112-1 of the first model surface C10 corresponds to the first type of microstructure C102-1 of the first surface C10, the second region C2' of the first model surface C10 corresponds to the second region C2 of the first surface C10, and the second type of model microstructure C112-2 of the first model surface C10 corresponds to the second type of microstructure C102-2 of the first surface C10.

[0085] Optionally, in some embodiments of this application, such as Figure 2 , Figure 6 , Figure 8 and Figure 9 As shown, the circuit board 20 includes a second surface C20 facing the plurality of LED chips 21 and a third surface C30 facing away from the plurality of LED chips 21. A first conductor B1 is disposed on the second surface C20, and a second conductor B2 is disposed on the third surface C30. The circuit board 20 also includes a first side surface D10 connecting the second surface C20 and the third surface C30. A side trace 25 protrudes from the first side surface D10, and both ends of the side trace 25 extend to the second surface C20 and the third surface C30 respectively to electrically connect the first conductor B1 and the second conductor B2. A side encapsulation layer 26 is disposed on the side of the side trace 25 facing away from the circuit board 20, and the side encapsulation layer 26 covers the side trace 25. Thus, the edge of the side encapsulation layer 26 is the edge of the display panel 200. When forming the first adhesive layer 22 on the side of the plurality of LED chips 21 facing away from the circuit board 20 using the mold potting method of this application, the first mold 31 can be placed close to the side encapsulation layer 26 (e.g., Figure 3d and Figure 7 This ensures that, in a direction perpendicular to the plane of the circuit board 20, the edge of the first adhesive layer 22 is aligned with the edge of the side encapsulation layer 26.

[0086] It is understandable that by placing the second conductor B2 on the third surface C30 of the display panel 200 and providing a side trace 25 on the first side surface D10 of the display panel 200, the side trace 25 can electrically connect the first conductor B1 located on the second surface C20 of the display panel 200 and the second conductor B2 located on the third surface C30 of the display panel 200. This helps to reduce the bezel of the display panel and achieve seamless splicing of the display panel.

[0087] It can be noted that, such as Figures 3a-3d As shown and Figure 7 As shown, since a second conductor B2 is provided on the third surface C30 of the circuit board 20 of the display panel 200, and one end of the side trace 25 on the first side surface D10 of the circuit board 20 extends to the third surface C30 of the circuit board 20 and is electrically connected to the second conductor B2, and the side encapsulation layer 26 covers the side trace 25, the platform 30 that carries the display panel 200 for encapsulating the display panel 200 can have a protrusion 301 and a flat portion 302. The protrusion 301 protrudes relative to the flat portion 302. When the display panel 200 is placed on the platform 30, the display panel 200 is specifically placed on the protrusion 301, and the display panel extends beyond the protrusion 301 to accommodate the second conductor B2, the side trace 25 and the side encapsulation layer 26 on the third surface C30 of the circuit board 20.

[0088] It can also be noted that, such as Figures 3a-3d As shown and Figure 7 As shown, when the first mold 31 is placed on the platform 30, the first mold 31 is specifically placed on the flat portion 302 of the platform 30, and the first mold 31 is at least located on the side where the side trace 25 of the display panel 200 is located. As is known from the foregoing, the first mold 31 can also be placed around the display panel 200.

[0089] It is understandable that, such as Figures 3a-3d As shown and Figure 7 As shown, when the first mold 31 is placed on the platform 30, the surface of the first mold 31 facing the display panel 200 is perpendicular to the plane where the circuit board 20 is located, and the surface of the first mold 31 facing the display panel 200 is in contact with the side encapsulation layer 26; thereby, after the first adhesive layer 22 is formed, the edge of the first adhesive layer 22 can be aligned with the edge of the side encapsulation layer 26 in the direction perpendicular to the plane where the circuit board 20 is located.

[0090] It can also be understood that, based on the alignment of the edge of the first adhesive layer 22 and the edge of the side encapsulation layer 26 in a direction perpendicular to the plane of the circuit board 20, such as Figure 8 and Figure 9 As shown, the encapsulation method for the display panel may also include:

[0091] S17: Form a transparent filler 28, which is located on the side of the first adhesive layer 22 and the side encapsulation layer 26.

[0092] S18: Form a side light-shielding layer 27, which at least covers the sides of the first adhesive layer 22, the second adhesive layer 23, and the anti-glare layer 24.

[0093] Since the edge of the first adhesive layer 22 is aligned with the edge of the side encapsulation layer 26 in a direction perpendicular to the plane of the circuit board 20, and the transparent filler 28 is located on the side of the first adhesive layer 22 and the side encapsulation layer 26, the side light-shielding layer 27 at least covers the anti-glare layer 24, the second adhesive layer 23 and at least part of the transparent filler 28. Specifically, the side light-shielding layer 27 can extend from the side of the anti-glare layer 24, across the side of the second adhesive layer 23 and the transparent filler 28, all the way to the back of the display panel 200.

[0094] The transparent filler 28 is used to protect the sides of the display panel 200; the side light-shielding layer 27 can be an ink layer, used to reduce the reflection of external light by the sides of the display panel 200, and also to provide 360° full protection for the sides of the display panel 200.

[0095] Optionally, in other embodiments of this application, such as Figure 11 As shown, the circuit board 20 includes a second surface C20 facing the plurality of LED chips 21 and a third surface C30 facing away from the plurality of LED chips 21. A first conductor B1 is disposed on the second surface C20, and a second conductor B2 is disposed on the third surface C30. The circuit board 20 also includes a first side surface D10 connecting the second surface C20 and the third surface C30. A side trace 25 is protruding on the first side surface D10. The two ends of the side trace 25 extend to the second surface C20 and the third surface C30, respectively, to electrically connect the first conductor B1 and the second conductor B2. A side seal is disposed on the side of the side trace 25 facing away from the circuit board 20. The side encapsulation layer 26 covers the side traces 25. The side encapsulation layer 26 includes a first encapsulation portion 261 and a second encapsulation portion 262 connected to each other. The first encapsulation portion 261 is parallel to the second surface C20, and the second encapsulation portion 262 is parallel to the first side surface D10. The first adhesive layer 22 includes a first portion 221 and a second portion 222 connected to each other. The first portion 221 covers multiple LED chips 21 and the first encapsulation portion 261. The second portion 222 extends from the side of the first portion 221, across the side of the first encapsulation portion 261, to the side of the second encapsulation portion 262, covering at least a portion of the second encapsulation portion 262. In other words, the first adhesive layer 22 is not only located on the side of the multiple LED chips 21 facing away from the circuit board 10, covering the multiple LED chips 21, but also extends to the side of the display panel 200, covering at least a portion of the side surface of the display panel 200.

[0096] It should be noted that, for ease of description, the side encapsulation layer 26 is divided into a first encapsulation portion 261 and a second encapsulation portion 262 connected together, while the first encapsulation portion 261 and the second encapsulation portion 262 in the side encapsulation layer 26 are actually integrally formed. Similarly, for ease of description, the first adhesive layer 22 is divided into a first portion 221 and a second portion 222 connected together, while the first portion 221 and the second portion 222 in the first adhesive layer 22 are also actually integrally formed.

[0097] Accordingly, during the encapsulation process of the display panel 200, in order to simultaneously form a first adhesive layer 22 on the side of the plurality of LED chips 21 facing away from the circuit board 20 and on at least a portion of the side surfaces of the display panel 200, such as Figure 12a and Figure 12b As shown, when the first mold 31 is placed on the platform 30, there is a gap between the surface of the first mold 31 facing the display panel 200 and at least a portion of the second encapsulation portion 262 of the side encapsulation layer 26; subsequently, after the first adhesive layer 22 is formed, as... Figure 12c As shown, the first adhesive layer 22 includes a first portion 221 and a second portion 222 connected to each other. The first portion 221 covers a plurality of LED chips 21 and a first package portion 261. The second portion 222 extends from the side of the first portion 221, across the side of the first package portion 261, to the side of the second package portion 262, covering at least a portion of the second package portion 262.

[0098] Then, as Figure 12d As shown, a second adhesive layer 23 and an anti-glare layer 24 are formed on the side of the first adhesive layer 22 away from the plurality of LED chips 21. Specifically, the second adhesive layer 23 is first formed on the surface of the anti-glare layer 24, and then the second adhesive layer 23 and the anti-glare layer 24 are attached to the side of the first adhesive layer 22 away from the plurality of LED chips 21 from the side of the second adhesive layer 23.

[0099] As previously known, the area of ​​the anti-glare layer 24 on which the second adhesive layer 23 is formed is generally larger than the area of ​​the display panel 200, and thus, as Figure 12d As shown, excess portions of the anti-glare layer 24, the second adhesive layer 23, and the first adhesive layer 22 are removed. Finally, as... Figure 11 As shown, in the encapsulated display panel 200, the first adhesive layer 22 not only covers the first encapsulation portion 261 of the multiple LED chips 21 and the side encapsulation layer 26, but also covers at least a portion of the second encapsulation portion 262 of the side encapsulation layer 26. Thus, the first adhesive layer 22 can not only protect the multiple LED chips 21, but also protect at least a portion of the side of the display panel 200.

[0100] Furthermore, a first adhesive layer 22 is simultaneously formed on the side of the plurality of LED chips 21 facing away from the circuit board 20 and on at least a portion of the sidewalls of the display panel 200. Therefore, the second portion 222 of the first adhesive layer 22 covering at least a portion of the sidewalls of the display panel 200 can serve as a transparent filler adhesive (see reference). Figure 1 The transparent filler 18) eliminates the need to separately form a transparent filler on the side of the display panel 200, simplifying the encapsulation process.

[0101] Further optional, in some embodiments of this application, such as Figure 11 As shown, the second portion 222 of the first adhesive layer 22, which faces away from the second encapsulation portion 262 of the side encapsulation layer 26, includes a fourth surface C40 and a fifth surface C50. The fifth surface C50 is further away from the first surface C10 relative to the fourth surface C40. The fourth surface C40 is parallel to the first side surface D10 of the circuit board 20. The fifth surface C50 is inclined at an obtuse angle relative to the fourth surface C40 toward the second encapsulation portion 262 of the side encapsulation layer 26.

[0102] Accordingly, during the encapsulation process of the display panel 200, such as Figure 12a As shown, when the first mold 31 is placed on the platform 30, the surface of the first mold 31 facing the display panel 200 includes a second model surface C41 and a third model surface C51 connected together. The third model surface C51 is located on the side of the second model surface C41 away from the platform 30. The second model surface C41 is parallel to the first side surface of the circuit board 20, and the third model surface C51 is inclined at an obtuse angle relative to the second model surface C41 in a direction away from the display panel 200. Then, as... Figure 12c As shown, the surface of the second portion 222 of the first adhesive layer 22 facing away from the second encapsulation portion 262 of the side encapsulation layer 26 is an inclined surface. Finally, as... Figure 12d and Figure 11 As shown, after removing the excess first adhesive layer 22, the surface of the second portion 222 of the first adhesive layer 22 away from the second encapsulation portion 262 of the side encapsulation layer 26 includes a fourth surface C40 and a fifth surface C50, and the fifth surface C50 is further away from the first surface C10 relative to the fourth surface C40. The fourth surface C40 is parallel to the first side surface D10 of the circuit board 20, and the fifth surface C50 is inclined at an obtuse angle relative to the fourth surface C40 toward the second encapsulation portion 262 of the side encapsulation layer 26.

[0103] It is understood that the surface of the first mold 31 facing the display panel 200 includes a second model surface C41 and a third model surface C51 connected to each other. The second model surface C41 is parallel to the first side surface D10 of the circuit board 20, and the third model surface C51 is inclined at an obtuse angle relative to the second model surface C41 in a direction away from the display panel 200. In this way, the part of the surface of the first mold 31 facing the display panel 200 is an inclined surface, which facilitates the extraction of the first mold 31.

[0104] It is also understandable that, in order to ensure that the first adhesive layer 22 covers not only the multiple LED chips 21 and the first encapsulation portion 261 of the side encapsulation layer 26, but also at least a portion of the second encapsulation portion 262 of the side encapsulation layer 26, the surface of the first mold 31 facing the display panel 200 can be configured as described above, including a second mold surface C41 and a third mold surface C51 connected to each other. The second mold surface C41 is parallel to the first side surface of the circuit board 20, and the third mold surface C51 is inclined at an obtuse angle relative to the second mold surface C41 in a direction away from the display panel 200. Then, the excess first adhesive layer 22 is removed. This ensures that the side surfaces of the first adhesive layer 22, the second adhesive layer 23, and the anti-glare layer 24 are aligned in a direction perpendicular to the plane of the circuit board 20. Alternatively, the surface of the first mold 31 facing the display panel 200 can be directly configured to include a surface corresponding to the fourth surface C40 of the first adhesive layer 22 and a surface corresponding to the fifth surface C50 of the first adhesive layer 22, depending on the specific circumstances.

[0105] Furthermore, optionally, in some embodiments of this application, such as Figure 13 As shown, the fifth surface C50 of the second portion 222 of the first adhesive layer 22 can have multiple second microstructures C501. Correspondingly, during the encapsulation process of the display panel 200, as... Figure 14 As shown, it is only necessary to set the second model surface C51 of the first mold 31 to have multiple second model microstructures C502 in the region at least close to its first model surface C41, and the second model microstructures C502 and the second microstructures C501 are complementary structures.

[0106] Optionally, the second microstructure C501 can be a groove structure, but this application does not limit the specific shape of the second microstructure C501. Alternatively, the second microstructure C501 can also be a protrusion structure.

[0107] As is known from the foregoing, the second portion 222 of the first adhesive layer 22 covering at least a portion of the side surfaces of the display panel 200 can serve as a transparent filler adhesive (see reference). Figure 1 The transparent filler 18) eliminates the need for a separate transparent filler forming process on the side of the display panel 200, simplifying the encapsulation process. Based on this, such as... Figure 15 As shown, a side light-shielding layer 27 can be directly formed, meaning that the encapsulation method for the display panel provided in this application embodiment can further include:

[0108] S18: Form a side light-shielding layer 27, which at least covers the sides of the first adhesive layer 22, the second adhesive layer 23, and the anti-glare layer 24.

[0109] It is understood that the fifth surface C50 of the second portion 222 of the first adhesive layer 22 has multiple second microstructures C501, thereby making the side light-shielding layer 27 more robust during subsequent formation. Optionally, the second microstructures C501 can be groove structures, which can further enhance the robustness of the subsequently formed side light-shielding layer 27.

[0110] It is also understandable that, such as Figure 15 As shown, the side light-shielding layer 27 can extend from the side of the anti-glare layer 24, across the fourth surface C40 and the fifth surface C50 of the second part 222 of the first adhesive layer 22, to the back of the display panel 200, covering at least part of the side encapsulation layer 26, specifically covering at least part of the third encapsulation portion 263 of the side encapsulation layer 26 (the third encapsulation portion 263 is connected to the second encapsulation portion 262, and the third encapsulation portion 263 is parallel to the third surface C30 of the circuit board 20), thereby achieving 360° full protection of the side of the display panel 200.

[0111] Optionally, in some embodiments of this application, such as Figure 16As shown, the side encapsulation layer 26 includes a first encapsulation portion 261 and a second encapsulation portion 262 connected to each other, and also includes a third encapsulation portion 263. The first encapsulation layer 261 is parallel to the second surface C20 of the circuit board 20, the second encapsulation portion 262 is parallel to the first side surface D10 of the circuit board 20, the third encapsulation portion 263 is connected to the second encapsulation portion 262, and the third encapsulation portion 263 is parallel to the third surface C30 of the circuit board 20. At this time, the first adhesive layer 22 includes a first portion 221 and a second portion 222 connected to each other, and also includes a third portion 223 connected to the second portion 222. The first portion 221 covers a plurality of LED chips 21 and the first encapsulation portion 261. The second portion 222 extends from the side surface of the first portion 221, across the side surface of the first encapsulation portion 261, to the side surface of the second encapsulation portion 262, covering the second encapsulation portion 262. The third portion 223 covers at least part of the third encapsulation portion 263. In other words, the first adhesive layer 22 is not only located on the side of the multiple LED chips 21 away from the circuit board 20, but also extends to the side of the display panel 200, covering the first encapsulation portion 261 and the second encapsulation portion 262 of the side encapsulation layer 26, and further extends to the back of the display panel 200, covering at least part of the third encapsulation portion 263 of the side encapsulation layer 26, thereby achieving 360° full protection of the side of the display panel 200.

[0112] Optional, such as Figure 16 As shown, the second portion 222 of the first adhesive layer 22 covers a portion of the second encapsulation portion 262, and the third portion 223 of the first adhesive layer 22 extends along the second encapsulation portion 262 to the third encapsulation portion 263, covering another portion of the second encapsulation portion 262 and at least a portion of the third encapsulation portion 263. Alternatively, the second portion 222 of the first adhesive layer 22 may completely cover the second encapsulation portion 262, and the third portion 223 of the first adhesive layer 22 may cover at least a portion of the third encapsulation portion 263, depending on the specific circumstances.

[0113] Accordingly, during the encapsulation process of the display panel 200, such as Figure 17As shown, when the first mold 31 is placed on the platform 30, there is a gap between the surface of the first mold 31 facing the display panel 200 and the overall second encapsulation part 262. Thus, after the second mold 32 is placed, the second mold 31, the first mold 32, the display panel 200 and the platform 30 constitute a receiving cavity K1. Subsequently, after the first adhesive layer 22 is formed, the first adhesive layer 22 includes a first part 221, a second part 222 and a third part 223 connected in sequence. The first part 221 covers multiple LED chips 21 and the first encapsulation part 261. The second part 222 extends from the side of the first part 221, across the side of the first encapsulation part 261, to the side of the second encapsulation part 262, covering the second encapsulation part 262. The third part 223 covers at least part of the third encapsulation part 263.

[0114] Furthermore, such as Figure 18 As shown, a side light-shielding layer 27 is formed on the side of the display panel 200. Specifically, the side light-shielding layer 27 can extend from the side of the anti-glare layer 24, across the fourth surface C40 and the fifth surface C50 of the second part 222 of the first adhesive layer 22, to the back of the display panel 200, covering at least a portion of the third encapsulation portion 263 of the side encapsulation layer 26, thereby achieving 360° full protection of the side of the display panel 200.

[0115] Based on any of the above embodiments, optionally, in some embodiments of this application, the refractive index of the first adhesive layer 22 and the refractive index of the second adhesive layer 23 are different, so as to further improve the haze of the light-emitting surface of the display panel 200 and reduce the reflection of external light.

[0116] Accordingly, embodiments of this application also provide a display device 300, such as... Figure 19 and Figure 20 As shown, the display device 300 includes the display panel 200 provided in any of the above embodiments. Since the display panel 200 has been described in detail in the foregoing embodiments, it will not be described again here.

[0117] The display device 300 can be any electronic device with display capabilities, such as a touch screen, mobile phone, tablet computer, laptop computer, e-reader, or television.

[0118] It should be noted that, since the side wiring 25 is provided on the side of the display panel 200 in the aforementioned embodiment to electrically connect the conductors B1 and B2 on the upper and lower surfaces of the display panel, the bezel of the display panel 200 can be reduced. Therefore, the display device provided in this application embodiment can be a splicing display device, including multiple narrow-bezel display units (i.e., display panels 200).

[0119] The various parts of this manual are described in a combination of parallel and progressive methods. Each part focuses on the differences between the other parts, and the same or similar parts can be referred to each other.

[0120] The features described above regarding the disclosed embodiments can be substituted or combined with each other to enable those skilled in the art to implement or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that, include: Circuit board; Multiple LED chips are located on one side of the circuit board; A first adhesive layer covers the plurality of LED chips, and the surface of the first adhesive layer facing away from the plurality of LED chips is a first surface; The second adhesive layer is located on the side of the first adhesive layer that is opposite to the plurality of LED chips; Wherein, the first surface is a flat surface parallel to the plane where the circuit board is located; Alternatively, the first surface may include a flattened portion and a plurality of first microstructures, wherein the flattened portion is parallel to the plane of the circuit substrate, and in a direction perpendicular to the plane of the circuit substrate, the height of the first microstructure is not greater than 20% of the thickness of the second adhesive layer.

2. The display panel according to claim 1, characterized in that, The circuit board includes a second surface facing the plurality of LED chips and a third surface facing away from the plurality of LED chips. A first conductor is disposed on the second surface, and a second conductor is disposed on the third surface. The circuit board further includes a first side surface connecting the second surface and the third surface. A side trace is protruding on the first side surface, and the two ends of the side trace extend to the second surface and the third surface respectively to electrically connect the first conductor and the second conductor. A side encapsulation layer is provided on the side of the side trace away from the circuit board, and the side encapsulation layer covers the side trace; In a direction perpendicular to the plane of the circuit board, the edge of the first adhesive layer is aligned with the edge of the side encapsulation layer.

3. The display panel according to claim 1, characterized in that, The circuit board includes a second surface facing the plurality of LED chips and a third surface facing away from the plurality of LED chips. A first conductor is disposed on the second surface, and a second conductor is disposed on the third surface. The circuit board further includes a first side surface connecting the second surface and the third surface. A side trace is protruding on the first side surface, and the two ends of the side trace extend to the second surface and the third surface respectively to electrically connect the first conductor and the second conductor. A side encapsulation layer is provided on the side of the side trace away from the circuit board, and the side encapsulation layer covers the side trace; The side encapsulation layer includes a first encapsulation portion and a second encapsulation portion connected to each other, the first encapsulation portion being parallel to the second surface, and the second encapsulation portion being parallel to the first side surface; The first adhesive layer includes a first portion and a second portion connected together. The first portion covers the plurality of LED chips and the first package portion. The second portion extends from the side of the first portion, across the side of the first package portion, to the side of the second package portion, and covers at least a portion of the second package portion.

4. The display panel according to claim 3, characterized in that, The second portion of the surface away from the second package includes a fourth surface and a fifth surface. The fifth surface is further away from the first surface relative to the fourth surface. The fourth surface is parallel to the first side surface. The fifth surface is inclined at an obtuse angle relative to the fourth surface toward the second package.

5. The display panel according to claim 4, characterized in that, The fifth surface has multiple second microstructures.

6. The display panel according to claim 5, characterized in that, The second microstructure is a groove structure.

7. The display panel according to claim 3 or 4, characterized in that, The side encapsulation layer further includes a third encapsulation portion, which is connected to the second encapsulation portion and is parallel to the third surface; The first adhesive layer further includes a third portion, which is connected to the second portion and at least covers a portion of the third encapsulation portion.

8. The display panel according to claim 7, characterized in that, The second portion covers a portion of the second package portion, and the third portion extends along the second package portion to the third package portion, the third portion covering another portion of the second package portion and at least a portion of the third package portion.

9. The display panel according to claim 1, characterized in that, The first surface includes the flattened portion and the plurality of first microstructures; The first surface includes a first region and a second region, and the orthographic projection of the LED chip on the first surface is located in the first region; The plurality of first microstructures include a plurality of first type microstructures and a plurality of second type microstructures. In the direction perpendicular to the plane of the circuit substrate, the height of the first type microstructure is less than the height of the second type microstructure. The first type of microstructure is located in the first region, and the second type of microstructure is located in the second region.

10. The display panel according to claim 1, characterized in that, The first microstructure is a groove structure.

11. The display panel according to claim 1, characterized in that, The refractive index of the first adhesive layer is different from that of the second adhesive layer.

12. The display panel according to claim 1, characterized in that, The display panel further includes an anti-glare layer located on the side of the second adhesive layer opposite to the first adhesive layer.

13. The display panel according to claim 12, characterized in that, The display panel further includes a side light-shielding layer, which at least covers the sides of the first adhesive layer, the second adhesive layer, and the anti-glare layer.

14. A display device, characterized in that, Includes the display panel as described in any one of claims 1-13.

15. A method for packaging a display panel, characterized in that, include: A display panel is placed on a platform, the display panel including a circuit board and a plurality of LED chips located on the side of the circuit board facing away from the platform; A first mold is placed on the platform such that the first mold at least partially surrounds the display panel, and the surface of the first mold facing away from the platform is higher than the plurality of LED chips; A second mold is placed on the surface of the first mold facing away from the platform, such that at least the second mold, the first mold, and the display panel form a receiving cavity; At least one of the first mold and the second mold is provided with a glue injection port, and glue is injected into the receiving cavity from the glue injection port to form a first glue layer covering the plurality of LED chips; Remove the first mold and the second mold, and form a second adhesive layer on the side of the first adhesive layer opposite to the plurality of LED chips; Wherein, the surface of the second mold facing the display panel is the first model surface, and the first model surface is a flat surface parallel to the plane where the circuit board is located; or, the first model surface includes a model flattening part and a plurality of first model microstructures, the model flattening part is parallel to the plane where the circuit board is located, and in the direction perpendicular to the plane where the circuit board is located, the height of the first model microstructure is not greater than 20% of the thickness of the second adhesive layer.

16. The method for packaging a display panel according to claim 15, characterized in that, The circuit board includes a second surface facing the plurality of LED chips and a third surface facing away from the plurality of LED chips. A first conductor is disposed on the second surface, and a second conductor is disposed on the third surface. The circuit board further includes a first side surface connecting the second surface and the third surface. A side trace is protruding on the first side surface, and the two ends of the side trace extend to the second surface and the third surface respectively to electrically connect the first conductor and the second conductor. A side encapsulation layer is provided on the side of the side trace away from the circuit board, and the side encapsulation layer covers the side trace; The platform has a protrusion and a flat portion. The protrusion protrudes relative to the flat portion. When the display panel is placed on the platform, the display panel is specifically placed on the protrusion and the display panel extends beyond the protrusion to accommodate the second conductor, the side trace, and the side encapsulation layer on the third surface.

17. The method for packaging a display panel according to claim 16, characterized in that, When placing the first mold on the platform, the first mold is specifically placed on the flat part of the platform, and the first mold is at least located on the side where the side wiring of the display panel is located.

18. The method for packaging a display panel according to claim 17, characterized in that, When the first mold is placed on the platform, the surface of the first mold facing the display panel is perpendicular to the plane of the circuit board, and the surface of the first mold facing the display panel is in contact with the side encapsulation layer; Subsequently, after the first adhesive layer is formed, the edge of the first adhesive layer is aligned with the edge of the side encapsulation layer in a direction perpendicular to the plane of the circuit board.

19. The method for packaging a display panel according to claim 17, characterized in that, The side encapsulation layer includes a first encapsulation portion and a second encapsulation portion connected to each other, the first encapsulation portion being parallel to the second surface, and the second encapsulation portion being parallel to the first side surface; When the first mold is placed on the platform, there is a gap between the surface of the first mold facing the display panel and at least a portion of the second encapsulation portion; Subsequently, after the first adhesive layer is formed, the first adhesive layer includes a first part and a second part connected to each other. The first part covers the plurality of LED chips and the first package portion, and the second part extends from the side of the first part, across the side of the first package portion, to the side of the second package portion, covering at least a portion of the second package portion.

20. The method for packaging a display panel according to claim 19, characterized in that, The side encapsulation layer further includes a third encapsulation portion, which is connected to the second encapsulation portion and is parallel to the third surface; When the first mold is placed on the platform, there is a gap between the surface of the first mold facing the display panel and the integral second encapsulation part; After the second mold is placed, the second mold, the first mold, the display panel, and the platform constitute the receiving cavity; Subsequently, after the first adhesive layer is formed, the first adhesive layer further includes a third portion, which is connected to the second portion and at least covers a portion of the third encapsulation portion.

21. The method for packaging a display panel according to claim 19 or 20, characterized in that, When the first mold is placed on the platform, the surface of the first mold facing the display panel includes a second model surface and a third model surface that are connected. The third model surface is located on the side of the second model surface away from the platform. The second model surface is parallel to the first side surface. The third model surface is inclined at an obtuse angle relative to the second model surface in the direction away from the display panel.

22. The method for packaging a display panel according to claim 21, characterized in that, The second model surface has at least a plurality of second model microstructures in the region close to the first model surface.

23. The method for packaging a display panel according to claim 15, 19, or 20, characterized in that, A second adhesive layer is formed on the side of the first adhesive layer opposite to the plurality of LED chips, comprising: A second adhesive layer is formed on the surface of an anti-glare layer; From one side of the second adhesive layer, the second adhesive layer and the anti-glare layer are adhered to the side of the first adhesive layer opposite to the plurality of LED chips, thereby forming the second adhesive layer on the side of the first adhesive layer opposite to the plurality of LED chips; The packaging method for the display panel further includes: Remove excess portions of the anti-glare layer, the second adhesive layer, and the first adhesive layer.

24. The method for packaging a display panel according to claim 23, characterized in that, The packaging method for the display panel further includes: A side light-shielding layer is formed, which at least covers the sides of the first adhesive layer, the second adhesive layer, and the anti-glare layer.

25. The method for packaging a display panel according to claim 15, characterized in that, The first model surface includes a model flattened portion and multiple first model microstructures; The first model surface includes a first model region and a second model region, and the orthographic projection of the LED chip on the first model surface is located in the first model region; The plurality of first model microstructures include a plurality of first type model microstructures and a plurality of second type model microstructures. In the direction perpendicular to the plane where the circuit board is located, the height of the first type model microstructure is less than the height of the second type model microstructure. The first type of model microstructure is located in the first model region, and the second type of model microstructure is located in the second model region.

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