Wafer film detection device, semiconductor apparatus, and wafer film detection method

By setting up a multi-modal detector outside the wafer transfer cavity, multi-dimensional detection data evaluation is achieved, which solves the problems of low efficiency and poor accuracy of traditional detection devices, improves the accuracy of thin film crack prediction and production efficiency, and reduces the risk of process chamber contamination.

CN120870170BActive Publication Date: 2026-06-05青岛海存微电子有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
青岛海存微电子有限公司
Filing Date
2025-09-29
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Traditional wafer thin film inspection devices suffer from low inspection efficiency and poor accuracy, making it impossible to accurately predict thin film cracking. Furthermore, offline inspection interrupts the production process, affecting the overall efficiency of the equipment.

Method used

A multimodal detector is installed outside the wafer transport cavity, including at least three independent detection structures, to acquire multi-dimensional detection data. The data is then evaluated and executed by a processor, avoiding conflicts with the structures inside the transport cavity and enabling online detection.

Benefits of technology

It improves the accuracy and efficiency of film crack prediction and detection, reduces installation and maintenance difficulty, reduces process chamber contamination, and improves production efficiency and product yield.

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Abstract

The application provides a wafer film detection device, a semiconductor device and a wafer film detection method. The wafer film detection device is arranged outside a transmission cavity of a wafer. The wafer film detection device comprises a multi-modal detector arranged opposite to an observation window of the transmission cavity, the multi-modal detector comprising at least three detection structures independent of each other, the at least three detection structures being configured to detect a wafer film surface, each detection structure being configured to obtain at least one detection data of the wafer film surface; and a processor connected to each detection structure, the processor being configured to evaluate the detection data and perform corresponding operations according to an evaluation result. The wafer film detection device improves detection efficiency and the accuracy of wafer film cracking prediction.
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