Display device

Abstract

The invention discloses a display device which comprises a display panel and a backlight module, the display panel is arranged on the light emitting side of the backlight module, the backlight module comprises a plurality of light emitting units, at least one light emitting unit comprises a support, the support is provided with a first surface and a second surface which are oppositely arranged in the first direction, and a containing groove is formed in the first surface. The first chip, the second chip and the third chip are arranged in the containing groove, the positive electrode and the negative electrode of the first chip are connected with the first bonding pad and the second bonding pad respectively, the positive electrode and the negative electrode of the second chip are connected with the third bonding pad and the fourth bonding pad respectively, and the positive electrode and the negative electrode of the third chip are connected with the fifth bonding pad and the sixth bonding pad respectively. The second surface is provided with a blocking part, the blocking part is located between the first bonding pad and the third bonding pad, and the blocking part is configured to separate the first bonding pad from the third bonding pad. According to the display device, the path of electrochemical reaction between the bonding pads can be blocked, and the reliability of the performance of the display device is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display device. Background Technology

[0002] Display devices typically include a display panel and a backlight module. Light emitted from the backlight module is projected onto the display panel, and after passing through the display panel, image information is displayed on the display panel. The backlight module typically includes multiple light-emitting units, each of which includes a bracket, multiple chips, and multiple pads. The multiple chips are disposed in the bracket, and the positive and negative terminals of each chip are connected to corresponding pads.

[0003] However, as the number of pads in the light-emitting unit increases, spontaneous electrochemical reactions can easily occur between the pads under the influence of water and oxygen, leading to the failure of the light-emitting unit and thus affecting the lifespan of the display device. Summary of the Invention

[0004] This application discloses a display device that can block the path of electrochemical reaction between pads, thereby improving the reliability of the display device performance.

[0005] To achieve the above objectives, embodiments of this application disclose a display device, including:

[0006] Display panel;

[0007] A backlight module, wherein the display panel is disposed on the light-emitting side of the backlight module, and the backlight module includes:

[0008] Multiple light-emitting units, at least one of the light-emitting units comprising:

[0009] The bracket has a first surface and a second surface disposed opposite to each other along a first direction, and a receiving groove is provided on the first surface.

[0010] A first chip, a second chip, and a third chip are disposed in the receiving slot, and at least two of the first chip, the second chip, and the third chip emit light of different wavelengths;

[0011] A first pad, a second pad, a third pad, a fourth pad, a fifth pad, and a sixth pad are disposed on the second surface. The first pad and the second pad are respectively connected to the first chip, the third pad and the fourth pad are respectively connected to the second chip, and the fifth pad and the sixth pad are respectively connected to the third chip.

[0012] The first pad, the third pad, and the fifth pad are spaced apart along a second direction, and the first pad and the second pad, the third pad and the fourth pad, and the fifth pad and the sixth pad are respectively arranged opposite to each other along a third direction;

[0013] A barrier portion is provided on the second surface, the barrier portion being located between the first pad and the third pad, and the barrier portion being configured to space between the first pad and the third pad;

[0014] Wherein, the first direction is the thickness direction of the bracket, and the first direction, the second direction, and the third direction are perpendicular to each other.

[0015] The display device disclosed in this application has a first pad, a third pad, and a fifth pad spaced apart along a second direction. The first pad and the second pad, the third pad and the fourth pad, and the fifth pad and the sixth pad are respectively arranged opposite each other along a third direction. A barrier portion is provided on the second surface of the bracket and is placed between the first pad and the third pad. The barrier portion physically isolates the pads of two adjacent chips, thereby preventing the formation of ion migration channels between the pads of two adjacent chips in a water-oxygen environment, inhibiting or reducing the migration and deposition of silver ions. That is, it blocks the path of electrochemical reaction between two adjacent sets of first pads, prevents electrochemical reactions between multiple sets of first pads, and thus improves the reliability of the light-emitting unit performance, which is beneficial to extending the service life of the display device.

[0016] As an alternative implementation, the barrier is configured as a groove recessed relative to the second surface of the support.

[0017] Since the light-emitting unit is usually soldered on the substrate, by constructing the barrier portion as a groove formed on the second surface, the barrier portion will not protrude from the second surface and occupy the space between the light-emitting unit and the substrate while still being able to separate two adjacent pads. This will prevent the thickness of the light-emitting unit from increasing, thus facilitating the thinning of the backlight module.

[0018] As an optional implementation, at least one of the light-emitting units further includes:

[0019] A colloid, which fills the barrier portion and covers at least a portion of the first pad and / or the third pad.

[0020] By filling the barrier portion with an colloid and covering at least a portion of the first and / or third pads, the colloid can prevent water and oxygen from directly contacting the covered pads, achieving a double barrier against water and oxygen. Covering the pads also reduces the risk of oxidation and improves their stability under long-term conditions. Furthermore, by placing the colloid on the light-emitting unit based on a grooved barrier structure, the barrier portion guides the colloid to fill the gap between the pads and the support, increasing the contact area between the colloid and the pads and forming a continuous sealing layer to prevent water and oxygen intrusion. On the other hand, the groove also provides a mechanical positioning function to ensure consistent colloid filling. In addition, after curing, the colloid enhances the adhesion between the support and the substrate, reducing solder joint cracking caused by vibration or thermal stress.

[0021] As an optional implementation, the colloid filled in the barrier portion has a dimension of L1 in the third direction, and the barrier portion has a dimension of L2 in the third direction, wherein L1 ≥ 1 / 2L2.

[0022] By limiting the minimum filling ratio of the colloid in the barrier section, the colloid is ensured to fill at least half of the barrier section in the third direction, so that the colloid can cover the critical area of ​​the pad edge and prevent local water and oxygen penetration due to insufficient filling.

[0023] As an alternative implementation, the bracket further has a side surface connected to the first surface and the second surface, wherein the first pad, the second pad, the third pad, the fourth pad, the fifth pad, and the sixth pad are at least partially located on the side surface;

[0024] The barrier portion has a first end and a second end disposed opposite to each other along the third direction, at least one of the first end and the second end being located on the side surface, such that the colloid covers the first pad and / or the third pad located on the side surface.

[0025] By setting up a colloid-covered pad on the side surface, a full circumferential seal is achieved for the pad on the side surface, reducing the possibility of corrosion or oxidation of the weak point of the pad on the side of the bracket, while providing mechanical cushioning to resist lateral impacts.

[0026] As an optional implementation, the backlight module further includes a substrate, at least one of the light-emitting units is connected to the substrate, the substrate is provided with a groove, the groove is disposed corresponding to the blocking portion in the first direction, and the groove is filled with the colloid.

[0027] A groove corresponding to the barrier portion is provided on the substrate, forming a nested structure with the barrier portion of the bracket. After dispensing, the adhesive can form a more three-dimensional sealing structure under the guidance of the upper and lower grooves. It can also prevent water and oxygen from entering from the side of the substrate, enhance the sealing performance, effectively block the electrochemical path between two adjacent pads, and improve the performance of the light-emitting unit.

[0028] As an optional implementation, at least one of the light-emitting units further includes:

[0029] A seventh pad is at least partially disposed in the receiving groove, and the first chip, the second chip, and the third chip are disposed on the seventh pad;

[0030] The barrier portion has a first end and a second end disposed opposite to each other along the third direction, the first end being located at the edge of the bracket and the second end extending to the seventh pad.

[0031] By placing a seventh pad on the bracket, the heat generated by the chip can be dissipated outward through the seventh pad, improving the chip's stability and lifespan, thereby extending the lifespan of the light-emitting unit. Furthermore, the seventh pad extends the barrier portion to its connection, ensuring that the barrier portion, while effectively separating components, is not excessively long and thus avoids over-occupying bracket space. This results in a more rational layout of components and ensures that the seventh pad has sufficient heat dissipation area, working in conjunction with the barrier portion to conduct heat and improve heat dissipation efficiency.

[0032] As an alternative implementation, in the second direction, the barrier portion is located in the middle between the first pad and the third pad.

[0033] By placing the barrier portion at the midpoint between the first and third pads, i.e., ensuring that the distance from the barrier portion to the first and third pads in the second direction is approximately the same, the difference in electric field angle between adjacent pads is reduced, thereby decreasing the driving force for silver ion migration and making electrochemical reactions less likely to occur on the first and third pads. Furthermore, this arrangement also ensures symmetrical distances from the barrier portion to the first and third pads, resulting in a uniform electric field distribution and preventing localized electric field concentrations that could accelerate electrochemical reactions.

[0034] As an optional implementation, the dimension of the barrier portion in the first direction is H, where H satisfies: H ≥ 0.1 mm, and / or, H ≤ 0.3 mm; and / or,

[0035] The dimension of the barrier in the second direction is W, where W satisfies: W≥0.2mm, and / or W≤0.8mm.

[0036] On the one hand, if the dimension H of the barrier portion in the thickness direction of the support is less than 0.1 mm, the height of the barrier portion is too low when it is a protrusion on the second surface. Conversely, the depth of the barrier portion is too low when it is a recess on the second surface. That is, regardless of whether the barrier portion is a protrusion or a recess, it cannot provide effective isolation. Silver ions easily migrate under the influence of the electric field, forming metal deposits, thus affecting the performance of the light-emitting unit. Therefore, by setting the dimension H of the barrier portion in the thickness direction of the support to be no less than 0.1 mm, the size of the barrier portion can be made appropriate, thereby enabling it to provide effective physical isolation and preventing the formation of ion migration channels between adjacent pads.

[0037] On the other hand, if the dimension H of the barrier portion in the thickness direction of the bracket is greater than 0.3 mm, when the barrier portion is a protrusion on the second surface, its height is too high, which will excessively occupy the space between the light-emitting unit and the substrate, leading to an increase in the overall thickness of the light-emitting unit and hindering the welding of the bracket and the substrate. When the barrier portion is a recess on the second surface, its depth is too high, which will excessively occupy the space on the bracket and affect the mechanical strength of the bracket. Therefore, by setting the dimension H of the barrier portion in the thickness direction of the bracket to be no greater than 0.3 mm, the barrier portion can be prevented from being too high, avoiding affecting the welding of the bracket and the substrate, or it can be prevented from excessively occupying the space on the bracket, reducing the impact on the structural strength of the bracket itself.

[0038] When the size of the barrier in the thickness direction of the bracket is 0.1mm≤H≤0.3mm, H can be kept within a reasonable range. This can not only provide effective isolation, but also reduce the impact on the welding process, or ensure the structural strength of the bracket itself.

[0039] If the dimension W of the barrier in the second direction is less than 0.2 mm, then the barrier is too narrow in the second direction and cannot effectively isolate two adjacent pads.

[0040] If the dimension W of the barrier in the second direction is greater than 0.8mm, the barrier is too wide in the second direction. An overly wide barrier will make the distance between the barrier and the pads on both sides too close. During the pad soldering process, it is easily affected by the solder, thus failing to effectively play the isolation role of the barrier.

[0041] When the size of the barrier in the second direction is 0.2mm≤W≤0.8mm, W can be kept within a reasonable range. This not only provides effective isolation but also prevents the barrier from being too close to the pads on both sides, thus avoiding the impact of pad soldering.

[0042] In one optional implementation, the first chip, the second chip, and the third chip are arranged sequentially along the second direction, wherein the first chip, the second chip, and the third chip are respectively a red light chip, a green light chip, and a blue light chip, and are arranged sequentially along the second direction.

[0043] The positive and negative terminals of the first chip are connected to the first pad and the second pad, respectively; the positive and negative terminals of the second chip are connected to the third pad and the fourth pad, respectively; and the positive and negative terminals of the third chip are connected to the fifth pad and the sixth pad, respectively.

[0044] The barrier portion is provided between the second pad and the fourth pad, the third pad and the fifth pad, and the fourth pad and the sixth pad.

[0045] By using red, green, and blue light chips, the light-emitting unit can create various colors through the mixing of these three colors. The first, third, and fifth pads, connected to the positive terminals of these three color chips, are positioned on the same side of the support, while the second, fourth, and sixth pads, connected to the negative terminals of the three color chips, are positioned on the other side. This avoids crosstalk between different drive current signals, reduces the risk of color mixing, ensures the stability of color output, and simplifies circuit wiring design. Furthermore, a barrier is placed between any two adjacent pads, ensuring that the pads of any two adjacent chips are separated, blocking the path of electrochemical reactions between adjacent pads, preventing electrochemical reactions between pads, and thus effectively improving the reliability of the light-emitting unit.

[0046] Compared with the prior art, the beneficial effects of this application are:

[0047] The display device disclosed in this application has a first pad, a third pad, and a fifth pad spaced apart along a second direction. The first pad and the second pad, the third pad and the fourth pad, and the fifth pad and the sixth pad are respectively arranged opposite each other along a third direction. A barrier portion is provided on the second surface of the bracket and is placed between the first pad and the third pad. The barrier portion physically isolates the pads of two adjacent chips, thereby preventing the formation of ion migration channels between the pads of two adjacent chips in a water-oxygen environment, inhibiting or reducing the migration and deposition of silver ions. That is, it blocks the path of electrochemical reaction between two adjacent sets of first pads, prevents electrochemical reactions between multiple sets of first pads, and thus improves the reliability of the light-emitting unit performance, which is beneficial to extending the service life of the display device. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of the display device disclosed in this application;

[0050] Figure 2 This is an exploded view of the display device disclosed in this application;

[0051] Figure 3 This is one of the structural schematic diagrams of the light-emitting unit disclosed in this application;

[0052] Figure 4 This is a top view schematic diagram of the light-emitting unit disclosed in this application;

[0053] Figure 5 This is the second schematic diagram of the structure of the light-emitting unit disclosed in this application;

[0054] Figure 6 This is a side view of the light-emitting unit when the barrier portion is a groove, as disclosed in this application;

[0055] Figure 7 This is a side view of the light-emitting unit when the barrier portion disclosed in this application is a protrusion;

[0056] Figure 8 This is a bottom view of the light-emitting unit disclosed in this application;

[0057] Figure 9 This is a schematic diagram of the structure of the colloid covering the pads located on the side surface disclosed in this application;

[0058] Figure 10 This is a schematic diagram of the structure of the colloid filling the barrier portion disclosed in this application;

[0059] Figure 11 This is a schematic diagram of the structure of the light-emitting unit disclosed in this application disposed on the substrate.

[0060] Explanation of reference numerals in the attached figures:

[0061] 1000, Display device; 1, Display panel; 2, Backlight module; 2a, Light-emitting area; 100, Light-emitting unit; 10, Bracket; 101, Receiving groove; 10a, First surface; 10b, Second surface; 10c, Side surface; 11, Barrier portion; 11a, First end; 11b, Second end; 21, First chip; 22, Second chip; 23, Third chip; 301, First pad group; 302, Second pad group; 303, Third pad group; 31, First pad; 32, Second pad; 33 34, 35, 36, 37, 40, 40a, 40b, 40c, 50, colloid; 200, substrate; 201, 202, 203, groove; Z, first direction; Y, second direction; X, third direction; H, dimension of the barrier portion in the first direction; W, dimension of the barrier portion in the second direction; L1, dimension of the colloid filled in the barrier portion in the third direction; L2, dimension of the barrier portion in the third direction. Detailed Implementation

[0062] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0063] In this application, the terms "upper," "lower," "inner," "outer," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0064] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0065] Furthermore, the terms "set up," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0066] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0067] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0068] Please see Figure 1 and Figure 2 This application discloses a display device 1000, which includes a display panel 1 and a backlight module 2. The display panel 1 is disposed on the light-emitting side of the backlight module 2. The backlight module 2 is used to provide backlight, and the display panel 1 is used to display image information for user viewing.

[0069] The display device 1000 can be, but is not limited to, electronic display products such as televisions, computer monitors, and LCD panels, and can be widely used in places such as homes, offices, conference halls, exhibition halls, stations, hospitals, or shopping malls.

[0070] In some embodiments, the backlight module 2 may include a lamp plate, a reflector, a diffuser, and an optical film group (not shown) arranged sequentially from back to front. The display panel 1 is located in front of the optical film group. The light emitted by the lamp plate is reflected by the reflector and then passes through the diffuser and the optical film group in sequence before reaching the display panel 1. The liquid crystal molecules in the front panel are deflected by the electric field, reducing the transmittance of the light emitted by the optical film group into the liquid crystal panel. This causes the light to be projected onto filters of different colors to form an image, thereby displaying image information on the display panel 1.

[0071] The optical film assembly may include multiple films. These films may include brightness enhancement films and multiple prism sheets, or multiple films may include multiple prism sheets.

[0072] Continue reading Figure 2 In some embodiments, the backlight module 2 includes a plurality of light-emitting units 100, which can serve as light-emitting sources for the backlight module 2.

[0073] In some embodiments, the backlight module 2 includes a substrate 200, and a plurality of light-emitting units 100 are disposed on the substrate 200. It is understood that the substrate 200, as a carrier substrate for the light-emitting units 100, can be electrically connected to the light-emitting units 100 to provide light-emitting driving signals to the light-emitting units 100. The substrate 200 can be a rigid substrate, such as glass.

[0074] It should be noted that multiple light-emitting units 100 can form multiple light-emitting areas 2a on the substrate 200. For example, the multiple light-emitting areas 2a are spaced apart along the height direction (vertical direction) of the display panel 1, each light-emitting area 2a is rectangular, the length direction of each light-emitting area 2a extends along the width direction of the display panel 1, and the width direction of each light-emitting area 2a extends along the height direction of the display panel 1. Each light-emitting area 2a may have multiple light-emitting units 100. Of course, in other examples, the multiple light-emitting areas 2a can be spaced apart along the width direction (horizontal direction) of the display panel 1, each light-emitting area 2a is rectangular, the length direction of each light-emitting area 2a extends along the height direction of the display panel 1, and the width direction of each light-emitting area extends along the width direction of the display panel 1.

[0075] Please refer to the following: Figures 3 to 5 In some embodiments, at least one light-emitting unit 100 includes a support 10, the support 10 having a first surface 10a and a second surface 10b disposed opposite to each other along a first direction Z, and the first surface 10a having a receiving groove 101.

[0076] It should be noted that the receiving groove 101 has an opening, and the side wall of the receiving groove 101 is sloping and forms a reflective inner cavity. That is, the receiving groove 101 is roughly bowl-shaped, and the side wall of the receiving groove 101 can reflect light. The opening can be circular, square, or rectangular, but whether it is a circular or square opening, it makes the receiving groove 101 of the bracket 10 sloping. The specific shape is not limited in this embodiment.

[0077] Optionally, the support 10 can be a square block structure, such as a square or a rectangle. When the block structure support 10 is rectangular, it means that the support 10 can have two opposite long sides and two opposite short sides. For ease of understanding, the following explanation will use a rectangular support 10 as an example. Of course, as other examples, the support 10 can also be an irregular block structure, a plate structure, etc.

[0078] Combination Figure 3 and Figure 4 In some embodiments, at least one light-emitting unit 100 includes a first chip 21, a second chip 22, and a third chip 23, which are disposed in a receiving groove 101. At least two of the first chip 21, second chip 22, and third chip 23 emit light of different wavelengths. The light emitted from the first chip 21, second chip 22, and third chip 23 is reflected by the sidewall of the receiving groove 101 and exits from the opening.

[0079] It is understood that the second surface 10b of the support 10 mentioned above refers to the outer surface opposite to the surface of the receiving groove 101 used to set the chip along the thickness direction of the support 10. After being soldered to the substrate 200, the second surface 10b can refer to the side facing the substrate 200.

[0080] In some embodiments, at least one light-emitting unit 100 includes a first pad 31, a second pad 32, a third pad 33, a fourth pad 34, a fifth pad 35, and a sixth pad 36, all of which are disposed on a second surface 10b. Specifically, the first pad 31 and the second pad 32 are connected to the first chip 21, the third pad 33 and the fourth pad 34 are connected to the second chip 22, and the fifth pad 35 and the sixth pad 36 are connected to the third chip 23.

[0081] For example, the first pad 31 and the second pad 32 are connected to the positive and negative terminals of the first chip 21, respectively; that is, the first pad 31 and the second pad 32 are the positive and negative pads of the first chip 21, respectively. The third pad 33 and the fourth pad 34 are connected to the positive and negative terminals of the second chip 22, respectively; that is, the third pad 33 and the fourth pad 34 are the positive and negative pads of the second chip 22, respectively. The fifth pad 35 and the sixth pad 36 are connected to the positive and negative terminals of the third chip 23, respectively; that is, the fifth pad 35 and the sixth pad 36 are the positive and negative pads of the third chip 23, respectively. Of course, in other examples, the first pad 31 and the second pad 32 can be connected to the negative and positive terminals of the first chip 21, respectively; that is, the first pad 31 and the second pad 32 are the negative and positive pads of the first chip 21, respectively. The third pad 33 and the fourth pad 34 are connected to the negative and positive terminals of the second chip 22, respectively. That is, the third pad 33 and the fourth pad 34 are the negative and positive pads of the second chip 22, respectively. The fifth pad 35 and the sixth pad 36 are connected to the negative and positive terminals of the third chip 23, respectively. That is, the fifth pad 35 and the sixth pad 36 are the negative and positive pads of the third chip 23, respectively.

[0082] It should be noted that the first pad 31, the second pad 32, the third pad 33, the fourth pad 34, the fifth pad 35, and the sixth pad 36 can each include two parts: one part is located inside the receiving groove 101, which is used for the positive or negative electrical connection of the first chip 21, the second chip 22, and the third chip 23; the other part is located outside the receiving groove 101 and is at least partially located on the second surface 10b of the bracket 10. Any one of the first pad 31, the second pad 32, the third pad 33, the fourth pad 34, the fifth pad 35, and the sixth pad 36 can be integrally formed, extending from inside the receiving groove 101 of the bracket 10 to the outside of the bracket 10, thereby ensuring that the bracket 10 has pads both inside and outside.

[0083] The bracket 10 can be soldered to the substrate 200 via the first pad 31, the second pad 32, the third pad 33, the fourth pad 34, the fifth pad 35 and the sixth pad 36 located on the second surface 10b.

[0084] Optionally, the first chip 21 can be connected to the first pad 31 and the second pad 32 via wires, or the first chip 21 can be directly soldered to the first pad 31 and the second pad 32 without wires. Taking different chips on the market as examples, the PN junction of a standard chip is on the front side of the chip, and is connected to the pads by wire bonding; while the PN junction of a flip chip is on the bottom of the chip, and is connected by soldering, without wire bonding, thus enhancing the reliability of the connection. Correspondingly, the second chip 22 can also be connected to the third pad 33 and the fourth pad 34, and the third chip 23 can also be connected to the fifth pad 35 and the sixth pad 36 via wires or soldering.

[0085] Optionally, when the chip is connected to the pad via wires, the wires can be gold wires or copper wires. Since gold wires have stable performance, connecting via gold wires can extend the lifespan of the wires, thereby increasing the lifespan of the light-emitting unit 100.

[0086] In some embodiments, the receiving groove 101 is further filled with a transparent colloid (not shown), which is used to encapsulate the chip. The transparent colloid may be hemispherical in shape and possess high refractive index and high light transmittance, which facilitates a large light emission angle for the chip, thereby increasing the luminous flux. Furthermore, the transparent colloid also provides protection, preventing defects caused by moisture, dust corrosion, or poor contact and detachment due to vibration, thus improving the lifespan and reliability of the chip and the light-emitting unit 100.

[0087] Alternatively, the transparent colloid can be a plastic material such as epoxy resin or silicone resin.

[0088] In this embodiment, the chip can be fixed using the bracket 10, and then the positive and negative terminals of the chip can be connected to the pads using bonding wires, followed by potting and encapsulation to obtain a complete light-emitting unit 100.

[0089] Combination Figure 4 and Figure 5 In some embodiments, the first pad 31, the third pad 33, and the fifth pad 35 are spaced apart along the second direction Y, and the first pad 31 and the second pad 32, the third pad 33 and the fourth pad 34, the fifth pad 35 and the sixth pad 36 are respectively arranged opposite each other along the third direction X.

[0090] It can be understood that the first pad 31 and the second pad 32 constitute a first pad group 301 for connection with the first chip 21, the third pad 33 and the fourth pad 34 constitute a second pad group 302 for connection with the second chip 22, and the fifth pad 35 and the sixth pad 36 constitute a third pad group 303 for connection with the third chip 23. The first pad group 301, the second pad group 302, and the third pad group 303 are spaced apart along the second direction Y, while the two pads in each pad group are arranged opposite each other along the third direction X.

[0091] In this design, the first direction Z represents the thickness direction of the bracket 10, and the first direction Z, the second direction Y, and the third direction X are perpendicular to each other. Taking a rectangular bracket 10 as an example, the second direction X can be the length direction of the bracket 10, and the third direction Y can be the width direction of the bracket 10. That is, the pads for connecting to the positive and negative terminals of each chip are respectively set on the long side of the bracket 10. In this way, when multiple pads are set, the spacing between adjacent pads connected to different chips is not too small, reducing the risk of short circuits.

[0092] It is understandable that during the production process, process factors such as equipment precision and measurement errors may affect the actual molding effect of the bracket 10, making the width direction, length direction and thickness direction of the bracket 10 "approximately perpendicular", that is, the included angle of the first direction Z, the second direction Y and the third direction X can be approximately equal to 90°, such as 88°, 89°, 91° or 92°.

[0093] Currently, to achieve more flexible color control and richer light effect variations, the number of pads on the light-emitting unit 100 typically includes four, six, eight, or even more. However, with the increase in the number of pads, spontaneous electrochemical reactions easily occur between the pads under the influence of water and oxygen. Specifically, at the anode, silver dissociates into Ag+ (silver ions) under the influence of an electric field and OH- (hydroxyl ions), and forms AgOH (silver hydroxide) with OH-. The Ag-OH chemical bond in AgOH is weak and easily decomposes into gel-like Ag2O (silver oxide) and water. At the cathode, H+ (hydrogen ions) accept electrons to form H2 (hydrogen gas). The Ag+ dissociated at the anode migrates directly from the electrolyte to the cathode under the influence of an electric field, accepts electrons, and completes electrochemical deposition to form metallic silver. This can easily lead to the failure of the light-emitting unit 100 and affect the service life of the backlight module 2.

[0094] Based on the above, see Figure 5 In some embodiments, a barrier portion 11 is provided on the second surface 10b, the barrier portion 11 is located between the first pad 31 and the third pad 33, and the barrier portion 11 is configured to space between the first pad 31 and the third pad 33.

[0095] By providing a barrier portion 11 on the second surface 10b of the bracket 10 and placing the barrier portion 11 between the first pad 31 and the third pad 33, the barrier portion 11 physically isolates the pads of two adjacent chips, thereby preventing the formation of ion migration channels between the pads of two adjacent chips in a water-oxygen environment, inhibiting or reducing the migration and deposition of silver ions, that is, blocking the path of electrochemical reaction between two adjacent sets of first pads 31, preventing electrochemical reactions between multiple sets of first pads 31, thereby improving the reliability of the light-emitting unit 100 and helping to extend the service life of the display device 1000.

[0096] It should be noted that the first pad 31, the third pad 33, and the fifth pad 35 being spaced apart along the second direction Y can mean that the first pad 31, the third pad 33, and the fifth pad 35 are sequentially spaced apart along the second direction Y, that is, the third pad 33 is positioned between the first pad 31 and the fifth pad 35 in the second direction Y. Of course, in other embodiments, the third pad 33, the first pad 31, and the fifth pad 35 can be sequentially spaced apart along the second direction Y, or the first pad 31, the fifth pad 35, and the third pad 33 can be sequentially spaced apart. But regardless of which sequential arrangement method is used, the barrier portion 11 is always located between two adjacent pads positioned along the second direction.

[0097] In some embodiments, the portions of the first pad 31, second pad 32, third pad 33, fourth pad 34, fifth pad 35, and sixth pad 36 located outside the receiving groove 101 are disposed at the edge of the bracket 10, and the blocking portion 11 extends along a third direction X, with at least one end of the blocking portion 11 extending to the edge of the bracket 10 in the third direction X. That is, both pads of each pad group are disposed at the edge of the long side of the bracket 10.

[0098] Placing the pads on the edge of the bracket 10 facilitates alignment during the soldering process, thereby improving the assembly yield of the light-emitting unit 100. At the same time, extending the barrier portion 11 to the edge of the bracket 10 ensures that the placement of the barrier portion 11 and the pads are consistent, forming a continuous physical isolation.

[0099] Continue reading Figure 5 In some embodiments, the bracket 10 further has a side surface 10c, which is connected to the first surface 10a and the second surface 10b. The first pad 31, the second pad 32, the third pad 33, the fourth pad 34, the fifth pad 35, and the sixth pad 36 are at least partially located on the side surface 10c. Specifically, the first pad 31, the second pad 32, the third pad 33, the fourth pad 34, the fifth pad 35, and the sixth pad 36 located outside the receiving groove 101 each include two interconnected parts. The first part is located on the side surface 10c, and the second part is located on the second surface 10b, and the connection between the two parts is located at the corner of the bracket 10.

[0100] It is understood that the side surface 10c refers to the outer peripheral surface that is disposed opposite to the side wall surface of the receiving groove 101 along the second direction Y and the third direction X. Taking the square bracket 10 as an example, the side surface 10c consists of four side surfaces 10c.

[0101] See Figure 6 In some embodiments, in the second direction Y, the barrier portion 11 is located in the middle between the first pad 31 and the third pad 33. If the distance between the first pad 31 and the second pad 32 in the second direction Y is L, then the barrier portion 11 is located at 1 / 2L, that is, the distance from the barrier portion 11 to the first pad 31 and the third pad 33 is approximately the same.

[0102] By placing the barrier portion 11 at the middle of the first pad 31 and the third pad 33, that is, making the distance from the barrier portion 11 to the first pad 31 and the third pad 33 in the second direction Y approximately the same, the difference in electric field angle between adjacent pads is reduced, the driving force for silver ion migration is decreased, and the first pad 31 and the third pad 33 are less prone to electrochemical reactions. Furthermore, the above arrangement also makes the distance from the barrier portion 11 to the first pad 31 and the third pad 33 symmetrical, resulting in a uniform electric field distribution and avoiding the situation where local electric field concentration accelerates electrochemical reactions.

[0103] It is understandable that when a barrier portion 11 is provided between any two adjacent pads in the three pad groups, the barrier portion 11 is located in the middle between any two adjacent pads in the three pad groups in the second direction Y. For example, the first pad group 301, the second pad group 302, and the third pad group 303 are arranged alternately along the second direction Y, that is, the first pad 31, the third pad 33, and the fifth pad 35 are arranged alternately along the second direction Y. Since the second pad 32, the fourth pad 34, and the sixth pad 36 are respectively arranged opposite to the first pad 31, the third pad 33, and the fifth pad 35 in the third direction X, the second pad 32, the fourth pad 34, and the sixth pad 36 are also arranged alternately along the second direction Y. At this time, the first pad 31 and the third pad 33 are arranged adjacently, the third pad 33 and the fifth pad 35 are arranged adjacently, the second pad 32 and the fourth pad 34 are arranged adjacently, and the fourth pad 34 and the sixth pad 36 are arranged adjacently. Therefore, a barrier portion 11 is provided between the first pad 31 and the third pad 33, between the third pad 33 and the fifth pad 35, between the second pad 32 and the fourth pad 34, and between the fourth pad 34 and the sixth pad 36, and the barrier portion 11 is located in the middle of two adjacent pads.

[0104] Continue to combine Figures 3 to 5 In some embodiments, the first chip 21, the second chip 22, and the third chip 23 can be red light chips, green light chips, and blue light chips, respectively. When powered on, these three chips can emit light of different colors. Of course, as other examples, the first chip 21, the second chip 22, and the third chip 23 can also be, for example, red light chips, white light chips, or blue light chips, or alternatively, they can be set according to actual needs; this embodiment does not impose specific limitations on this.

[0105] In some embodiments, the first chip 21, the second chip 22, and the third chip 23 are arranged sequentially along the second direction Y. It can be understood that, in one example, the first chip 21, the second chip 22, and the third chip 23 can be arranged in a straight line along the second direction Y. In another example, the first chip 21, the second chip 22, and the third chip 23 can be distributed in a triangular shape, but the arrangement from one end of the support 10 along the second direction Y is still in the order of red light chip, green light chip, and blue light chip. The specific arrangement can be selected according to actual needs.

[0106] In some embodiments, the positive and negative terminals of the first chip 21 are connected to the first pad 31 and the second pad 32, respectively. That is, the first pad 31 is the positive pad of the first chip 21, and the second pad 32 is the negative pad of the first chip 21. When the first chip 21 is a red light chip, this enables power supply to the red light chip, causing it to emit red light.

[0107] In some embodiments, the positive and negative terminals of the second chip 22 are connected to the third pad 33 and the fourth pad 34, respectively. That is, the third pad 33 is the positive pad of the second chip 22, and the fourth pad 34 is the negative pad of the second chip 22. When the second chip 22 is a green light chip, this enables power supply to the green light chip, causing it to emit green light.

[0108] In some embodiments, the positive and negative terminals of the third chip 23 are connected to the fifth pad 35 and the sixth pad 36, respectively. That is, the fifth pad 35 is the positive pad of the third chip 23, and the sixth pad 36 is the negative pad of the third chip 23. When the third chip 23 is a blue light chip, this enables power supply to the blue light chip, causing it to emit blue light.

[0109] Since the first pad 31, the third pad 33, and the fifth pad 35 are respectively spaced apart along the second direction Y, and the first pad 31 and the second pad 32, the third pad 33 and the fourth pad 34, the fifth pad 35 and the sixth pad 36 are respectively arranged opposite each other along the third direction X, it can be seen that the first pad 31, the third pad 33, and the fifth pad 35 are located on one side of the bracket 10 in the third direction X, and the second pad 32, the fourth pad 34, and the sixth pad 36 are located on the other side of the bracket 10 in the third direction X. Since the first pad 31, the third pad 33, and the fifth pad 35 are the positive pads of each chip, and the second pad 32, the fourth pad 34, and the sixth pad 36 are the negative pads of each chip, the positive pads of each chip are located on the same side of the bracket 10, and the negative pads are located on the other side of the bracket 10.

[0110] In some embodiments, a barrier portion 11 is provided between the second pad 32 and the fourth pad 34, the third pad 33 and the fifth pad 35, and the fourth pad 34 and the sixth pad 36.

[0111] For example, barrier portions are provided between the positive pad (first pad 31) of the first chip 21, the positive pad (third pad 33) of the second chip 22, the negative pad (second pad 32) of the first chip 21, the negative pad (fourth pad 34) of the second chip 22, the positive pad (third pad 33) of the second chip 22, the positive pad (fifth pad 35) of the third chip 23, the negative pad (fourth pad 34) of the second chip 22, and the negative pad (sixth pad 36) of the third chip 23.

[0112] By setting the first chip 21, the second chip 22, and the third chip 23 as red, green, and blue light chips respectively, the light-emitting unit 100 can create various colors by mixing the three colors. Placing the first pad 31, the third pad 33, and the fifth pad 35, which are connected to the positive terminals of the three-color chips, on the same side of the bracket 10, and the second pad 32, the fourth pad 34, and the sixth pad 36, which are connected to the negative terminals of the three-color chips, on the other side, avoids crosstalk between different drive current signals, reduces the risk of color mixing, ensures the stability of color output, and simplifies circuit wiring design.

[0113] In addition, a barrier portion 11 is provided between any two adjacent pads, so that the pads of any two adjacent chips can be separated, blocking the path of electrochemical reaction between any two adjacent pads, preventing electrochemical reaction between pads, and thus effectively improving the reliability of the light-emitting unit 100.

[0114] Optionally, see Figure 6 and Figure 7 The barrier portion 11 can be a protrusion on the second surface 10b, such as a bump or a ridge. Alternatively, the barrier portion 11 can be a groove recessed on the second surface 10b, as long as it can play a blocking role to block the electrochemical reaction path between two adjacent pads.

[0115] In some embodiments, the dimension of the barrier portion 11 in the first direction Z (thickness direction of the bracket 10) is H, where H satisfies: H≥0.1mm.

[0116] If the dimension H of the barrier portion 11 in the thickness direction Z of the support 10 is less than 0.1 mm, then when the barrier portion 11 is a protrusion on the second surface 10b, the height of the barrier portion 11 is too low. And when the barrier portion 11 is a recess on the second surface 10b, the depth of the barrier portion 11 is too low. That is, regardless of whether the barrier portion 11 is a protrusion or a recess, it cannot provide effective isolation. Silver ions are easily migrated under the influence of the electric field, forming metal deposition, thus affecting the performance of the light-emitting unit 100. Therefore, by setting the dimension H of the barrier portion 11 in the thickness direction Z of the support 10 to be not less than 0.1 mm, the size of the barrier portion 11 can be made appropriate, thereby enabling the barrier portion 11 to provide effective physical isolation and prevent the formation of ion migration channels between adjacent pads.

[0117] In some embodiments, the dimension of the barrier portion 11 in the first direction Z (the thickness direction Z of the bracket 10) is H, where H satisfies: H≤0.3mm.

[0118] If the dimension H of the barrier portion 11 in the thickness direction Z of the bracket 10 is greater than 0.3 mm, when the barrier portion 11 is a protrusion on the second surface 10b, the height of the barrier portion 11 is too high, which will excessively occupy the space between the light-emitting unit 100 and the substrate 200, resulting in an increase in the overall thickness of the light-emitting unit 100 and hindering the welding of the bracket 10 and the substrate 200. When the barrier portion 11 is a groove recessed on the second surface 10b, the depth of the barrier portion 11 is too high, which will excessively occupy the space on the bracket 10 and affect the mechanical strength of the bracket 10. Therefore, by setting the dimension H of the barrier portion 11 in the thickness direction Z of the bracket 10 to be no greater than 0.3 mm, the barrier portion 11 can be prevented from being too high, avoiding affecting the welding of the bracket 10 and the substrate 200, or it can be prevented from excessively occupying the space on the bracket 10, reducing the impact on the structural strength of the bracket 10 itself.

[0119] In some embodiments, the dimension of the barrier portion 11 in the thickness direction Z of the support 10 is H, where H satisfies: 0.1mm ≤ H ≤ 0.3mm. Optionally, H may satisfy 0.1mm ≤ H ≤ 0.2mm, 0.2mm ≤ H ≤ 0.3mm, or 0.15mm ≤ H ≤ 0.25mm, etc. For example, H may be 0.1mm, 0.2mm, or 0.3mm, etc.

[0120] When the dimension of the barrier portion 11 in the thickness direction Z of the bracket 10 is 0.1mm≤H≤0.3mm, H can be kept within a reasonable range. This not only provides effective isolation but also reduces the impact on the welding process or protects the structure of the bracket 10 itself. When the barrier portion 11 is a protrusion, this size range is more likely to meet the requirements for thinner and lighter light-emitting units 100 while ensuring effective blocking of ion migration.

[0121] In some embodiments, the dimension of the barrier portion 11 in the second direction Y is W, where W ≥ 0.2 mm. If the dimension W of the barrier portion 11 in the second direction Y is less than 0.2 mm, then the barrier portion 11 is too narrow in the second direction Y and cannot effectively isolate two adjacent pads.

[0122] In some embodiments, the dimension of the barrier portion 11 in the second direction Y is W, where W ≤ 0.8 mm. If the dimension W of the barrier portion 11 in the second direction Y is greater than 0.8 mm, the barrier portion 11 is too wide in the second direction Y. An overly wide barrier portion 11 will make the distance between the barrier portion 11 and the pads on both sides too close. During the pad soldering process, it is easily affected by the solder, thus failing to effectively perform the isolation function of the barrier portion 11.

[0123] In some embodiments, the size of the barrier portion 11 in the second direction Y is W, where W satisfies: 0.2mm≤W≤0.8mm.

[0124] When the dimension of the barrier portion 11 in the second direction Y satisfies 0.2mm≤W≤0.8mm, W can be kept within a reasonable range. This ensures effective isolation while preventing the barrier portion 11 from being too close to the pads on both sides, thus avoiding the impact of pad soldering. When the barrier portion 11 is a groove, this suitable size range can balance the isolation effect and structural strength.

[0125] It can be understood that the dimension W of the blocking part 11 in the second direction Y is the width. When the blocking part 11 is a protrusion protruding from the second surface 10b, the dimension of the blocking part 11 in the thickness direction Z of the support 10 is the height; when the blocking part 11 is a groove recessed from the second surface 10b, the dimension of the blocking part 11 in the thickness direction Z of the support 10 is the depth.

[0126] Preferably, the barrier portion 11 is configured as a groove recessed relative to the second surface 10b of the support 10, that is, the groove design is used to isolate two adjacent pads (first pad 31 and third pad 33).

[0127] Since the light-emitting unit 100 is usually soldered on the substrate 200, by constructing the barrier portion 11 as a groove formed on the second surface 10b, the barrier portion 11 will not protrude on the second surface 10b and occupy the space between the light-emitting unit 100 and the substrate 200 while still being able to separate two adjacent pads. This will prevent the thickness of the light-emitting unit 100 from increasing, which will help to make the backlight module 2 thinner and lighter.

[0128] Combination Figures 4 to 5In some embodiments, at least one light-emitting unit 100 further includes a seventh pad 40, which is at least partially disposed in the receiving groove 101, and the first chip 21, the second chip 22 and the third chip 23 are disposed on the seventh pad 40.

[0129] Specifically, the seventh pad 40 may have a third surface 40a and a fourth surface 40b disposed opposite each other along the first direction Z. The third surface 40a is located in the receiving groove 101, and the first chip 21, the second chip 22, and the third chip 23 are disposed on the third surface 40a. The fourth surface 40b is exposed on the second surface 10b of the bracket 10. The heat generated by the first chip 21, the second chip 22, and the third chip 23 is transferred to the seventh pad 40, and then transferred to the external environment through the seventh pad 40.

[0130] By setting a seventh pad 40 on the bracket 10, the heat generated by the chip can be dissipated outward through the seventh pad 40, thereby improving the stability and lifespan of the chip and extending the lifespan of the light-emitting unit 100.

[0131] It should be noted that the aforementioned seventh pad 40 can not only serve as a heat dissipation pad, but also as a pad for electrical connection with the substrate. Furthermore, the portion of the seventh pad 40 located in the receiving groove 101 can also serve as a reflective element, which is more conducive to the emission of light.

[0132] See Figure 8 In some embodiments, the blocking portion 11 has a first end 11a and a second end 11b disposed opposite to each other along the third direction X. That is, the blocking portion 11 can be elongated, with its length direction aligned with the third direction X.

[0133] In some embodiments, the first end 11a is located at the edge of the bracket 10, and the second end 11b extends to the seventh pad 40. In other words, the first end 11a is located on the side surface 10c of the bracket 10, and the second end 11b extends to be connected to the seventh pad 40.

[0134] By setting the seventh pad 40, the barrier portion 11 extends to be connected to it, so that the barrier portion 11 can play an effective separation role while avoiding excessive length of the barrier portion 11, which would cause excessive occupation of the space of the bracket 10. This makes the layout between the components more reasonable and ensures that the seventh pad 40 has sufficient heat dissipation area to conduct heat in conjunction with the barrier portion 11, thereby improving heat dissipation efficiency.

[0135] It should be noted that the seventh pad 40 is extended along the second direction Y. Since the pads of each chip are spaced apart along the second direction Y, extending the seventh pad 40 along the arrangement direction of each pad group makes the area of ​​the seventh pad 40 large enough, thereby increasing the heat dissipation area and improving the heat dissipation effect of each chip.

[0136] Optionally, the first pad 31, the second pad 32, the third pad 33, the fourth pad 34, the fifth pad 35, the sixth pad 36, and the seventh pad 40 are set separately, so that the electrical area and the heat dissipation area are independent of each other, so that the chip has a larger heat dissipation area and extends the service life of the light-emitting unit 100.

[0137] In some embodiments, the two ends of the seventh pad 40 in the second direction Y generally correspond to the two pad groups located closest to the edge of the support 10. Figure 3 and Figure 4 Taking the first pad group 301, the second pad group 302, and the third pad group 303 as an example, they are arranged sequentially along the second direction Y. Figure 3 and Figure 4 (From left to right on the paper), the seventh pad 40 is disposed between the three pad groups, and one end of the seventh pad 40 in the second direction Y corresponds to the first pad group 301, and the other end of the seventh pad 40 in the second direction Y corresponds to the second pad group 302.

[0138] See Figure 9 and Figure 10 In some embodiments, at least one light-emitting unit 100 further includes an adhesive 50, which fills the barrier portion 11 and covers at least a portion of the first pad 31 and / or the third pad 33. Exemplarily, after the light-emitting unit 100 is soldered to the substrate 200, adhesive is applied at the connection point of the corresponding pad. Utilizing the fluidity of the adhesive 50 and guided by the barrier portion 11, the adhesive 50 gradually fills the second surface 10b of the support 10, covering the pad.

[0139] By filling the barrier portion 11 with colloid 50 and covering at least a portion of the first pad 31 and / or the third pad 33, the colloid can prevent water and oxygen from directly contacting the covered pads, achieving a double barrier against water and oxygen. Covering the pads also reduces the risk of oxidation and improves their stability under long-term conditions. Furthermore, by placing the colloid on the light-emitting unit 100 based on the grooved structure of the barrier portion 11, the colloid 50 can be guided by the barrier portion 11 to fill the gap between the pads and the support 10, increasing the contact area between the colloid and the pads and forming a continuous sealing layer to prevent water and oxygen intrusion. On the other hand, the groove also provides a mechanical positioning function to ensure the consistency of the colloid filling. In addition, after curing, the colloid 50 can enhance the bonding force between the support 10 and the substrate 200, reducing solder joint cracking caused by vibration or thermal stress.

[0140] It should be noted that the colloid 50 can cover the first pad 31 and / or the third pad 33 located outside the receiving tank 101. Specifically, a portion of the colloid 50 can cover the first pad 31 and / or the third pad 33 located on the side surface 10c, and another portion of the colloid 50 can cover the first pad 31 and / or the third pad 33 located on the second surface 10b, thereby making the overall water and oxygen isolation effect of the first pad 31 and / or the third pad 33 better.

[0141] Optionally, the aforementioned colloid 50 can be epoxy resin, polyurethane adhesive, etc., which can effectively isolate water and oxygen from the solder pads.

[0142] Understandably, in one example, combining Figure 10 A barrier portion 11 is provided between the first pad 31 and the third pad 33, the second pad 32 and the fourth pad 34, the third pad 33 and the fifth pad 35, and the fourth pad and the sixth pad 36, respectively. Since the seventh pad 40 is disposed between the aforementioned pads, and the first end 11a of the barrier portion 11 is located at the edge of the support 10, and the second end 11b is connected to the seventh pad 40, that is, barrier portions 11 can be provided on both sides of the seventh pad 40 in the third direction X. Correspondingly, each barrier portion 11 can be filled with adhesive 50. Thus, while setting barrier portions 11 between any two adjacent pads to achieve the function of separating the pads, the barrier portions 11 can also guide adhesive to fill the gaps between all pads and the support 10, achieving a complete or near-complete seal for the pads on the support 10. Furthermore... By using the colloid filled in the barrier portion 11, the heat distribution can be optimized, the impact of temperature rise on the colloid 50 can be reduced, and the colloid 50 can be filled in sections to avoid gaps caused by the barrier portion 11 being too long. This makes the filling effect of the colloid 50 better and effectively isolates water and oxygen.

[0143] It should be noted that during the filling of colloid 50, in order to ensure the heat dissipation effect of the seventh pad 40, the colloid 50 can be made not to cover the seventh pad 40, so that there are two independently set parts of colloid 50 on both sides of the seventh pad 40 along the third direction X.

[0144] Combination Figure 10 In some embodiments, the dimension of the colloid filled in the barrier portion 11 in the third direction X is L1, and the dimension of the barrier portion 11 in the third direction X is L2, wherein L1 ≥ 1 / 2L2. Optionally, L1 = 1 / 2L2, that is, the colloid 50 fills half of the barrier portion 11, or L1 = L2, that is, the colloid 50 completely fills the barrier portion 11.

[0145] By limiting the minimum filling ratio of the colloid in the barrier portion 11, the colloid 50 is ensured to fill at least half of the barrier portion 11 in the third direction X, thus ensuring that the colloid 50 covers the critical area of ​​the pad edge and preventing local water and oxygen penetration due to insufficient filling.

[0146] It is understandable that when barrier portions 11 are provided between the first pad 31 and the third pad 33, the second pad 32 and the fourth pad 34, the third pad 33 and the fifth pad 35, and the fourth pad and the sixth pad 36, the length of the adhesive 50 filled in the barrier portion 11 between the first pad 31 and the third pad 33 can be equal to or unequal to the length of the adhesive 50 filled in the barrier portion 11 between the second pad 32 and the fourth pad 34. Correspondingly, the length of the adhesive 50 filled in the barrier portion 11 between other adjacent pads can also satisfy the above relationship.

[0147] As described above, the blocking portion 11 has a first end 11a and a second end 11b along a third direction X, such as Figure 9 As shown, in some embodiments, at least one of the first end 11a and the second end 11b is located on the side surface 10c, so that the colloid 50 covers the first pad 31 and / or the third pad 33 located on the side surface 10c. It can be understood that the first pad 31 and the third pad 33 are only two of all the pads on the bracket 10. The side surface 10c is the surface surrounding the outer periphery of the bracket 10. When the bracket 10 is square, it also has a side surface 10c with a second pad 32, a fourth pad 34 and a sixth pad 36. The barrier portion 11 located between the first pad 31 and the third pad 33 is mainly used to separate the two pads. Therefore, the side surface 10c through which the barrier portion 11 penetrates is also the side surface 10c with the first pad 31 and the third pad 33.

[0148] Specifically, the first end 11a of the barrier portion 11 is located on the side surface 10c, that is, at the edge of the bracket 10.

[0149] It is understandable that in order to achieve the coverage of the first pad 31 and the third pad 33 on the side surface 10c by the colloid, since the colloid may be irregular in shape, the maximum height of the colloid 50 in the thickness direction Z of the support 10 is greater than the height of the first pad 31 and the third pad 33 on the side surface 10c.

[0150] By setting the pads on the side surface 10c to be covered with colloid, the pads on the side surface 10c are fully circumferentially sealed, reducing the possibility of corrosion or oxidation of the weak point of the side pads of the bracket 10, while providing mechanical cushioning to resist lateral impact.

[0151] It is understandable that when barrier portions 11 are provided between the first pad 31 and the third pad 33, the second pad 32 and the fourth pad 34, the third pad 33 and the fifth pad 35, and the fourth pad 34 and the sixth pad 36, the colloid also covers the second pad 32 and the fourth pad 34, the third pad 33 and the fifth pad 35, and the fourth pad 34 and the sixth pad 36 respectively, thereby covering all the pads outside the bracket 10 and achieving the effect of isolating water and oxygen.

[0152] As can be seen from the foregoing, see the following: Figure 11 The backlight module 2 also includes a substrate 200, and at least one light-emitting unit 100 is connected to the substrate 200. Specifically, the substrate 200 is provided with an eighth pad 201 corresponding to the pads on the bracket 10. The first pad 31, the second pad 32, the third pad 33, the fourth pad 34, the fifth pad 35 and the sixth pad 36 located on the second surface 10b are respectively soldered to the eighth pad 201 so that each chip can achieve electrical conduction.

[0153] In some embodiments, a groove 202 is provided on the substrate 200, the groove 202 is disposed corresponding to the barrier portion 11 in the first direction Z, and the groove 202 is filled with colloid 50.

[0154] A groove 202 corresponding to the barrier portion 11 is provided on the substrate 200, forming a nested structure with the barrier portion 11 of the support 10. After dispensing, the adhesive 50 can form a more three-dimensional sealing structure under the guidance of the upper and lower grooves, and can also prevent water and oxygen from entering from the side of the substrate 200, enhance the sealing performance, effectively block the path of electrochemical generation between two adjacent pads, and improve the performance of the light-emitting unit 100.

[0155] The display device disclosed in the embodiments of this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the display device and its core ideas. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display device, characterized in that, include: Display panel; A backlight module, wherein the display panel is disposed on the light-emitting side of the backlight module, and the backlight module includes: Multiple light-emitting units, at least one of the light-emitting units comprising: The bracket has a first surface and a second surface disposed opposite to each other along a first direction, and a receiving groove is provided on the first surface. A first chip, a second chip, and a third chip are disposed in the receiving slot, and at least two of the first chip, the second chip, and the third chip emit light of different wavelengths; A first pad, a second pad, a third pad, a fourth pad, a fifth pad, and a sixth pad are disposed on the second surface. The first pad and the second pad are respectively connected to the first chip, the third pad and the fourth pad are respectively connected to the second chip, and the fifth pad and the sixth pad are respectively connected to the third chip. The first pad, the third pad, and the fifth pad are spaced apart along a second direction, and the first pad and the second pad, the third pad and the fourth pad, and the fifth pad and the sixth pad are respectively arranged opposite to each other along a third direction; The second surface is provided with a barrier portion, the barrier portion is located between the first pad and the third pad, and the barrier portion is configured to space between the first pad and the third pad; Wherein, the first direction is the thickness direction of the bracket, and the first direction, the second direction, and the third direction are perpendicular to each other.

2. The display device according to claim 1, characterized in that, The barrier portion is configured as a groove recessed relative to the second surface of the support.

3. The display device according to claim 2, characterized in that, At least one of the light-emitting units further includes: A colloid, which fills the barrier portion and covers at least a portion of the first pad and / or the third pad.

4. The display device according to claim 3, characterized in that, The colloid filling the barrier portion has a dimension L1 in the third direction, and the barrier portion has a dimension L2 in the third direction, wherein L1 ≥ 1 / 2L2.

5. The display device according to claim 3, characterized in that, The bracket also has a side surface connected to the first surface and the second surface, and the first pad, the second pad, the third pad, the fourth pad, the fifth pad and the sixth pad are at least partially located on the side surface; The barrier portion has a first end and a second end disposed opposite to each other along the third direction, at least one of the first end and the second end being located on the side surface, such that the colloid covers the first pad and / or the third pad located on the side surface.

6. The display device according to claim 3, characterized in that, The backlight module further includes a substrate, at least one of the light-emitting units is connected to the substrate, the substrate is provided with a groove, the groove is disposed corresponding to the blocking part in the first direction, and the groove is filled with the colloid.

7. The display device according to claim 1, characterized in that, At least one of the light-emitting units further includes: A seventh pad is at least partially disposed in the receiving groove, and the first chip, the second chip, and the third chip are disposed on the seventh pad; The barrier portion has a first end and a second end disposed opposite to each other along the third direction, the first end being located at the edge of the bracket and the second end extending to the seventh pad.

8. The display device according to any one of claims 1-7, characterized in that, In the second direction, the barrier portion is located in the middle between the first pad and the third pad.

9. The display device according to any one of claims 1-7, characterized in that, The dimension of the blocking portion in the first direction is H, where H satisfies: H ≥ 0.1 mm, and / or, H ≤ 0.3 mm; and / or, The dimension of the barrier in the second direction is W, where W satisfies: W≥0.2mm, and / or W≤0.8mm.

10. The display device according to any one of claims 1-7, characterized in that, The first chip, the second chip, and the third chip are arranged sequentially along the second direction, and the first chip, the second chip, and the third chip are respectively a red light chip, a green light chip, and a blue light chip; The positive and negative terminals of the first chip are connected to the first pad and the second pad, respectively; the positive and negative terminals of the second chip are connected to the third pad and the fourth pad, respectively; and the positive and negative terminals of the third chip are connected to the fifth pad and the sixth pad, respectively. The barrier portion is provided between the second pad and the fourth pad, the third pad and the fifth pad, and the fourth pad and the sixth pad.

Images