Display panel and display device

Abstract

The invention provides a display panel and a display device. The display panel includes: a substrate; the pixel defining layer is located on one side of the substrate, and a plurality of pixel openings are defined by the pixel defining layer; at least part of the light-emitting devices are located in the pixel openings, each light-emitting device comprises a light-emitting functional layer and a first electrode layer, the first electrode layer is located on the side, away from the substrate, of the light-emitting functional layer, and the light transmittance of the first electrode layer is larger than or equal to 90%. The light transmittance of the first electrode layer is greater than or equal to 90%, so that the microcavity effect in the light-emitting device can be weakened, light with a wide wavelength range can be emitted from the display panel, for example, light with a large visual angle can be emitted from the display panel, the problem of color cast of the display panel is relieved, and the display effect of the display panel is improved. The brightness of the display panel in a wide visual angle range is good, and the display effect is excellent.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically to display panels and display devices. Background Technology

[0002] OLED (Organic Light-Emitting Diode) displays have attracted widespread attention due to their advantages such as high contrast, rich and accurate colors, fast response time, and wide viewing angles. With the rapid development of OLED display technology, top-emitting OLED panels have become the main choice for high-end display products due to their wide color gamut, self-emissive nature, and large aperture ratio, especially flexible OLED panels, which have seen widespread application. However, limited by current technology, current OLED display panels still cannot meet the demands. Summary of the Invention

[0003] In view of this, embodiments of this application provide a display panel and a display device.

[0004] The first aspect of this application provides a display panel, including:

[0005] substrate;

[0006] A pixel defining layer is located on one side of the substrate, and the pixel defining layer encloses multiple pixel openings;

[0007] Multiple light-emitting devices, at least some of which are located in pixel openings, each light-emitting device includes a light-emitting functional layer and a first electrode layer, the first electrode layer being located on the side of the light-emitting functional layer away from the substrate, and the light transmittance of the first electrode layer being greater than or equal to 90%.

[0008] In one embodiment, the first electrode layer includes at least one first sub-electrode layer, and the light transmittance of each first sub-electrode layer is greater than or equal to 90%.

[0009] Preferably, the transmittance of the first sub-electrode layer is greater than or equal to 95%;

[0010] Preferably, the first electrode layer further includes at least one second sub-electrode layer, the second sub-electrode layer being located on the side of the first sub-electrode layer close to and / or away from the substrate, the material of the second sub-electrode layer including metal, and the thickness of the second sub-electrode layer being less than or equal to 10 nm;

[0011] Preferably, the light transmittance of the second sub-electrode layer is greater than or equal to 90%;

[0012] Preferably, the first sub-electrode layer has at least two layers, and the second sub-electrode layer is located between adjacent first sub-electrode layers.

[0013] In one embodiment, the material of the first sub-electrode layer includes at least one of indium tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, fluorine-doped zinc oxide, indium zinc oxide, and indium gallium zinc oxide.

[0014] Preferably, the material of the second sub-electrode layer includes at least one of magnesium, silver, aluminum, tin, gallium, and zinc;

[0015] Preferably, the light-emitting device further includes a light extraction layer located on the side of the first electrode layer away from the substrate, wherein the refractive index of the light extraction layer at a light wavelength of 620 nm is greater than or equal to 1.4 and less than or equal to 1.8.

[0016] Preferably, the material of the light extraction layer includes at least one of polymethyl methacrylate, polyfluorene, and polystyrene.

[0017] Preferably, the first electrode layer is a monolithic structure.

[0018] In one embodiment, it further includes: an auxiliary conductive structure located on the side of the first electrode layer away from the substrate, the orthographic projection of the auxiliary conductive structure on the substrate being located around the orthographic projection of at least a portion of the pixel openings on the substrate, and the auxiliary conductive structure being electrically connected to the first electrode layer.

[0019] Preferably, the pixel defining layer includes a first surface and a second surface, the first surface is located on the side of the second surface away from the substrate, and the orthographic projection of the first surface on the substrate is within the orthographic projection range of the second surface on the substrate.

[0020] The orthogonal projection of the auxiliary conductive structure onto the substrate is located within the orthogonal projection range of the first surface onto the substrate;

[0021] Preferably, the auxiliary conductive structure includes at least one of a transparent conductive material and a metal;

[0022] Preferably, the transparent conductive material includes at least one of indium tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, fluorine-doped zinc oxide, indium zinc oxide, and indium gallium zinc oxide.

[0023] Preferably, the metal includes at least one selected from magnesium, silver, aluminum, titanium, molybdenum, tin, gallium, and zinc.

[0024] In one embodiment, the auxiliary conductive structure includes a first sub-auxiliary conductive structure and a second sub-auxiliary conductive structure, wherein the first sub-auxiliary conductive structure extends along a first direction and the second sub-auxiliary conductive structure extends along a second direction, and the first direction intersects the second direction.

[0025] Preferably, there is at least one pixel opening between adjacent first sub-auxiliary conductive structures, and / or, there is at least one pixel opening between adjacent second sub-auxiliary conductive structures.

[0026] In one embodiment, it further includes: an encapsulation layer located on the side of the light-emitting device away from the substrate, the encapsulation layer including a first encapsulation structure, the first encapsulation structure including at least one first functional layer and / or at least one first atomic deposition layer;

[0027] Preferably, the first functional layer and the first atomic deposition layer are alternately stacked in a direction perpendicular to the plane of the substrate;

[0028] Preferably, the first packaging structure includes at least one first functional layer and at least two first atomic deposition layers, with the first functional layer located between two adjacent first atomic deposition layers along a direction perpendicular to the plane of the substrate.

[0029] In one embodiment, the material of the first functional layer includes at least one of organic-inorganic hybrid materials and metals;

[0030] Preferably, the organic-inorganic hybrid material includes at least one of Alucone and SH nanocomposites;

[0031] Preferably, the metal includes at least one of magnesium and silver;

[0032] Preferably, the material of the first atomic deposition layer includes at least one of aluminum oxide, silicon nitride, and silicon oxide;

[0033] Preferably, the thickness of the first atomic deposition layer is greater than or equal to 20 nm and less than or equal to 80 nm, and the thickness of the first functional layer is greater than or equal to 8 nm and less than or equal to 120 nm.

[0034] In one embodiment, at least one first atomic deposition layer includes a first sub-atomic deposition layer and a second sub-atomic deposition layer, wherein the second sub-atomic deposition layer is located on the side of the first sub-atomic deposition layer away from the substrate;

[0035] At least one first functional layer includes a first sub-functional layer; the first sub-functional layer is located between a first sub-atom deposition layer and a second sub-atom deposition layer; the material of the first sub-functional layer includes an organic-inorganic hybrid material.

[0036] Preferably, the organic-inorganic hybrid material includes Alucone;

[0037] Preferably, the material of the first sub-atom deposition layer includes aluminum oxide, and / or the material of the second sub-atom deposition layer includes aluminum oxide.

[0038] In one embodiment, at least one first atomic deposition layer includes a stacked first sub-atomic deposition layer, a second sub-atomic deposition layer, and a third sub-atomic deposition layer, wherein the third sub-atomic deposition layer is located on the side of the second sub-atomic deposition layer away from the substrate.

[0039] At least one first functional layer includes a first sub-functional layer and a second sub-functional layer, the first sub-functional layer is located between the first sub-atom deposition layer and the second sub-atom deposition layer, and the second sub-functional layer is located between the second sub-atom deposition layer and the third sub-atom deposition layer;

[0040] Preferably, the material of the first sub-functional layer includes an organic-inorganic hybrid material, and the material of the second sub-functional layer includes a metal.

[0041] Preferably, the organic-inorganic hybrid material includes SH nanocomposite materials;

[0042] Preferably, the metal includes at least one of magnesium and silver.

[0043] In one embodiment, the encapsulation layer further includes a second encapsulation structure located on the side of the first encapsulation structure away from the substrate, and the material of the second encapsulation structure includes organic materials;

[0044] Preferably, the organic material includes optical adhesive;

[0045] Preferably, the thickness of the second packaging structure is greater than or equal to 1800 nm and less than or equal to 2200 nm.

[0046] In one embodiment, the encapsulation layer further includes a third encapsulation structure located on the side of the first encapsulation structure away from the substrate, the third encapsulation structure including at least one second functional layer and / or at least one second atomic deposition layer;

[0047] Preferably, the second functional layer and the second atomic deposition layer are alternately stacked in a direction perpendicular to the plane of the substrate;

[0048] Preferably, the third packaging structure includes at least one second functional layer and at least two second atomic deposition layers, with the second functional layer located between two adjacent second atomic deposition layers along a direction perpendicular to the plane of the substrate.

[0049] Preferably, the material of the second functional layer includes at least one of organic-inorganic hybrid materials and metals;

[0050] Preferably, the organic-inorganic hybrid material includes at least one of Alucone and SH nanocomposites;

[0051] Preferably, the metal includes at least one of magnesium and silver;

[0052] Preferably, the material of the second atomic deposition layer includes at least one of alumina, silicon nitride, and silicon oxide;

[0053] Preferably, the thickness of the second atomic deposition layer is greater than or equal to 20 nm and less than or equal to 50 nm, and the thickness of the second functional layer is greater than or equal to 8 nm and less than or equal to 120 nm.

[0054] In one embodiment, at least one second atomic deposition layer includes a fourth sub-atomic deposition layer and a fifth sub-atomic deposition layer, the fifth sub-atomic deposition layer being located on the side of the fourth sub-atomic deposition layer facing away from the substrate; at least one second functional layer includes a third sub-functional layer; the third sub-functional layer is located between the fourth sub-atomic deposition layer and the fifth sub-atomic deposition layer; the material of the third sub-functional layer includes an organic-inorganic hybrid material;

[0055] Preferably, the organic-inorganic hybrid material includes Alucone;

[0056] Preferably, the material of the fourth sub-atom deposition layer includes aluminum oxide, and / or the material of the fifth sub-atom deposition layer includes aluminum oxide.

[0057] In one embodiment, at least one second atomic deposition layer includes a stacked fourth sub-atomic deposition layer, a fifth sub-atomic deposition layer, and a sixth sub-atomic deposition layer, wherein the sixth sub-atomic deposition layer is located on the side of the fifth sub-atomic deposition layer away from the substrate.

[0058] At least one second functional layer includes a third sub-functional layer and a fourth sub-functional layer, with the third sub-functional layer located between the fourth sub-atom deposition layer and the fifth sub-atom deposition layer, and the fourth sub-functional layer located between the fifth sub-atom deposition layer and the sixth sub-atom deposition layer;

[0059] Preferably, the material of the third sub-functional layer includes an organic-inorganic hybrid material, and the material of the fourth sub-functional layer includes a metal;

[0060] Preferably, the organic-inorganic hybrid material includes SH nanocomposite materials;

[0061] Preferably, the metal includes at least one of magnesium and silver.

[0062] In one embodiment, the first encapsulation structure is a monolayer film structure;

[0063] Preferably, the display panel further includes: an isolation structure located on the side of the pixel defining layer near the encapsulation layer, the isolation structure enclosing a plurality of isolation openings, the orthographic projection of the pixel openings on the substrate being located within the orthographic projection range of the isolation openings on the substrate, and at least some of the light-emitting devices being located within the connected isolation openings and pixel openings;

[0064] The first packaging structure includes multiple packaging parts, the orthographic projection of the packaging parts on the substrate covers the orthographic projection of the isolation opening on the substrate, and a portion of the packaging parts fills the isolation opening.

[0065] Preferably, the display panel further includes: an auxiliary conductive structure located on the side of the isolation structure away from the substrate, the orthographic projection of the auxiliary conductive structure on the substrate being located around the orthographic projection of at least a portion of the isolation opening on the substrate, the isolation structure being electrically connected to the auxiliary conductive structure, and the first electrode layer overlapping the isolation structure.

[0066] Preferably, the substrate includes a flexible substrate.

[0067] In one embodiment, the device further includes an encapsulation layer located on the side of the light-emitting device away from the substrate, wherein the maximum distance between the surface of the encapsulation layer away from the substrate and the surface of the encapsulation layer close to the substrate is less than or equal to 1 μm.

[0068] A second aspect of this application provides a display device, comprising:

[0069] The aforementioned display panel;

[0070] The light-shielding part is located on the light-emitting side of the display panel, and the light-shielding part is provided with multiple first openings;

[0071] The orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the first opening on the substrate, and the distance between the edge of the orthographic projection of the pixel opening on the substrate and the edge of the orthographic projection of the first opening on the substrate is greater than or equal to 0.5 μm and less than or equal to 4 μm.

[0072] In one embodiment, the distance between the edge of the orthographic projection of the pixel opening on the substrate and the edge of the orthographic projection of the first opening on the substrate is greater than or equal to 0.5 μm and less than or equal to 3 μm.

[0073] Preferably, the distance between the edge of the orthographic projection of the pixel opening on the substrate and the edge of the orthographic projection of the first opening on the substrate is greater than or equal to 1 μm and less than or equal to 2.5 μm.

[0074] In one embodiment, the pixel defining layer has a light-absorbing material;

[0075] Preferably, the color of the pixel delimiting layer includes black.

[0076] According to the display panel provided in the embodiments of this application, the transparency of the first electrode layer can reduce the microcavity effect in the light-emitting device, so that light with a wide wavelength range can be emitted from the display panel. For example, light with a wide viewing angle can be emitted from the display panel, which alleviates the color shift problem of the display panel and makes the brightness of the display panel better in a wide viewing angle range, resulting in excellent display effect. Attached Figure Description

[0077] Figure 1 This is a schematic cross-sectional view of the display panel in one embodiment of this application.

[0078] Figure 2 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0079] Figure 3 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0080] Figure 4 This is a top view of the display panel in one embodiment of this application.

[0081] Figure 5 This is a top view of the display panel in another embodiment of this application.

[0082] Figure 6 This is a top view of the display panel in another embodiment of this application.

[0083] Figure 7 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0084] Figure 8 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0085] Figure 9 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0086] Figure 10 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0087] Figure 11 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0088] Figure 12 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0089] Figure 13 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0090] Figure 14 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0091] Figure 15 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0092] Figure 16 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0093] Figure 17 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0094] Figure 18 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0095] Figure 19 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0096] Figure 20 This is a schematic diagram of the process for manufacturing a display panel in one embodiment of this application.

[0097] Figure 21 This is a cross-sectional structural diagram of a display device in one embodiment of this application.

[0098] Figure 22 This is a cross-sectional structural diagram of the display device in another embodiment of this application. Detailed Implementation

[0099] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0100] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0101] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0102] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0103] In existing technologies, top-emitting OLED display panels typically employ a transparent conductive anode (such as indium tin oxide, ITO), a light-emitting functional layer, and a metal cathode. The metal cathode has low transparency and high reflectivity. After light is generated from the light-emitting functional layer, it is reflected between the anode and cathode interfaces, creating a microcavity effect. The microcavity structure allows light of specific wavelengths to resonate within the cavity, enhancing light intensity and improving luminous efficiency. The microcavity effect also narrows the spectral bandwidth of the emitted light, improving color purity. However, the microcavity effect leads to a strong viewing angle dependence in the optical properties of the display panel. At different viewing angles, the propagation path and resonance conditions of light within the microcavity structure change, resulting in differences in brightness and color. This leads to drawbacks in existing display panels, such as significant viewing angle distortion and severe brightness decay.

[0104] In view of this, the first aspect of this application provides a display panel, referring to Figure 1 The schematic diagram of the cross-sectional structure of the display panel shown includes: a substrate 100, a pixel defining layer 200, and multiple light-emitting devices 300.

[0105] Optionally, the pixel defining layer 200 is located on one side of the substrate 100, and the pixel defining layer 200 surrounds a plurality of pixel openings 210.

[0106] Optionally, at least a portion of the light-emitting device 300 is located in the pixel opening 210. The light-emitting device 300 includes a light-emitting functional layer 310 and a first electrode layer 320. The first electrode layer 320 is located on the side of the light-emitting functional layer 310 facing away from the substrate 100. The light transmittance of the first electrode layer 320 is greater than or equal to 90%. For example, the light transmittance of the first electrode layer 320 can be 90%, 92%, 94%, 95%, 96%, 98%, or 100%, etc.

[0107] It is understandable that the light transmittance of the first electrode layer 320 is greater than or equal to 90%, so that almost all the light emitted by the light-emitting functional layer 310 can pass through the first electrode layer 320, and the first electrode layer 320 will hardly reflect light, thereby reducing the microcavity effect in the light-emitting device 300.

[0108] According to the display panel provided in the embodiments of this application, the transparency of the first electrode layer 320 can reduce the microcavity effect in the light-emitting device 300, so that light with a relatively wide wavelength range can be emitted from the display panel. For example, light with a wide viewing angle can be emitted from the display panel, which alleviates the color shift problem of the display panel and makes the brightness of the display panel better in a wider viewing angle range, resulting in excellent display effect.

[0109] For example, in the display panel of this application embodiment, the color deviation is less than 1, and the display brightness can still be maintained at more than 90% when the viewing angle is 30 degrees. The viewing angle refers to the angle between the observer's line of sight and the direction perpendicular to the plane on which the display panel is located.

[0110] Exemplarily, the light-emitting device 300 further includes a second electrode layer 330, which is located between the pixel defining layer 200 and the substrate 100. The second electrode layer 330 may be an anode, and the first electrode layer 320 may be a cathode. The light-emitting functional layer 310 includes an emitting layer (EML), and may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL) located between the cathode and the emitting layer (EML). The number of layers in the light-emitting functional layer 310 is at least one.

[0111] In one embodiment, refer to Figure 1 The first electrode layer 320 includes at least one first sub-electrode layer 321, each of which is transparent. For example, adjacent first sub-electrode layers 321 may be made of the same or different materials. Stacking at least one first sub-electrode layer 321 helps to reduce the resistance of the first electrode layer 320 and reduce the power consumption of the display panel.

[0112] For example, the light transmittance of the first sub-electrode layer is greater than or equal to 95%.

[0113] In one embodiment, the material of the first sub-electrode layer includes at least one selected from indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), gallium-doped zinc oxide (GZO), fluorine-doped zinc oxide (FZO), indium zinc oxide (IZO), and indium gallium zinc oxide. Therefore, the first electrode layer 320 has high transparency and excellent conductivity.

[0114] For example, ITO has advantages such as high light transmittance, low resistance and high maturity; AZO has the characteristics of low cost, environmental protection and good blue light transmittance; GZO has the characteristics of good stability and high transparency; FZO has the characteristics of low scattering and high corrosion resistance; IZO has the characteristics of flexibility and smooth surface.

[0115] Optionally, the first electrode layer 320 further includes at least one second sub-electrode layer, which is located on the side of the first sub-electrode layer close to and / or away from the substrate 100. The material of the second sub-electrode layer includes metal, and the thickness of the second sub-electrode layer is less than or equal to 10 nm (e.g., it can be 1 nm, 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, 8 nm, 9 nm, or 10 nm, etc.), which is beneficial to enhance the conductivity of the first electrode layer 320. In addition, the thickness of the second sub-electrode layer is relatively thin, and the light transmittance is relatively high, for example, the light transmittance of the second sub-electrode layer is greater than or equal to 90%.

[0116] Optionally, the first sub-electrode layer has at least two layers, and the second sub-electrode layer is located between adjacent first sub-electrode layers. Optionally, the material of the second sub-electrode layer includes at least one of magnesium, silver, aluminum, tin, gallium, and zinc. For example, the material of the first sub-electrode layer includes AZO, and the material of the second sub-electrode layer includes a magnesium-silver alloy.

[0117] Optionally, refer to Figure 2 The schematic diagram of the cross-sectional structure of the display panel shown indicates that the light-emitting device 300 also includes a light extraction layer 340, located on the side of the first electrode layer 320 facing away from the substrate 100. The refractive index of the light extraction layer 340 at a light wavelength of 620 nm is greater than or equal to 1.4 and less than or equal to 1.8, for example, it can be 1.4, 1.5, 1.6, 1.7, or 1.8. Therefore, light emitted from the first electrode layer 320 into the light extraction layer 340 almost never undergoes total internal reflection, further reducing light reflection in the light-emitting device 300, thereby reducing the microcavity effect in the light-emitting device 300.

[0118] Optionally, the material of the light extraction layer 340 includes at least one of polymethyl methacrylate, polyfluorene, and polystyrene.

[0119] Optionally, the first electrode layer 320 is a single-layer structure. This allows for the creation of a full-surface cathode structure.

[0120] In one embodiment, refer to Figure 3 The schematic diagram of the cross-sectional structure of the display panel shown indicates that the display panel also includes an auxiliary conductive structure 400 located on the side of the first electrode layer 320 facing away from the substrate 100. The orthographic projection of the auxiliary conductive structure 400 on the substrate 100 is located around the orthographic projection of at least a portion of the pixel openings 210 on the substrate 100. The auxiliary conductive structure 400 is electrically connected to the first electrode layer 320. This improves the conductivity of the first electrode layer 320, reduces the power consumption of the display panel, and avoids uneven display. Moreover, the placement of the auxiliary conductive structure 400 has almost no impact on the light-emitting effect of the light-emitting devices.

[0121] Optionally, refer to Figure 3The pixel defining layer 200 includes a first surface 201 and a second surface 202. The first surface 201 is located on the side of the second surface 202 away from the substrate 100. The orthographic projection of the first surface 201 on the substrate 100 is within the orthographic projection range of the second surface 202 on the substrate 100. For example, the cross-sectional structure of the pixel defining layer 200 is a trapezoidal structure.

[0122] Optionally, the orthographic projection of the auxiliary conductive structure 400 on the substrate 100 is located within the orthographic projection range of the first surface 201 on the substrate 100. Therefore, the auxiliary conductive structure 400 has almost no impact on the light-emitting effect of the light-emitting device, and while improving angular offset at large viewing angles, it helps to avoid display unevenness.

[0123] For example, the orthographic projection of the auxiliary conductive structure 400 on the substrate 100 coincides with the orthographic projection of the first surface 201 on the substrate 100. The auxiliary conductive structure 400 has a large area, which can effectively improve the conductivity of the first electrode layer 320.

[0124] Optionally, the auxiliary conductive structure 400 includes at least one of a transparent conductive material and a metal. Therefore, the auxiliary conductive structure 400 exhibits better conductivity.

[0125] For example, transparent conductive materials include at least one of indium tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, fluorine-doped zinc oxide, indium zinc oxide, and indium gallium zinc oxide. For example, metals include at least one of magnesium, silver, aluminum, titanium, molybdenum, tin, gallium, and zinc.

[0126] In one embodiment, refer to Figure 4 , Figure 5 and Figure 6 The schematic diagram of the top view of the display panel shown includes an auxiliary conductive structure 400 comprising a first sub-auxiliary conductive structure 410 and a second sub-auxiliary conductive structure 420. The first sub-auxiliary conductive structure 410 extends along a first direction x, and the second sub-auxiliary conductive structure 420 extends along a second direction y. The first direction x and the second direction y intersect. For example, the first direction x and the second direction y are perpendicular to each other.

[0127] Optionally, at least one pixel opening 210 is provided between adjacent first sub-auxiliary conductive structures 410, and / or at least one pixel opening 210 is provided between adjacent second sub-auxiliary conductive structures 420. For example, each pixel opening 210 has an auxiliary conductive structure 400 around its periphery. Alternatively, a portion of the periphery of the pixel opening 210 has an auxiliary conductive structure 400. It is understood that the larger the area of ​​the auxiliary conductive structure 400, the better the effect of enhancing the conductivity of the first electrode layer 320.

[0128] For example, the auxiliary conductive structure 400 has a mesh-like structure.

[0129] In one embodiment, refer to Figure 7 The schematic diagram of the cross-sectional structure of the display panel shown includes: an encapsulation layer 500 located on the side of the light-emitting device 300 away from the substrate 100. The encapsulation layer 500 includes a first encapsulation structure 510, which includes at least one first functional layer 512 and / or at least one first atomic deposition layer 511.

[0130] For example, the first packaging structure 510 includes at least one first functional layer 512. As another example, the first packaging structure 510 includes at least one first atomic deposition layer 511.

[0131] For example, when the first packaging structure 510 includes multiple first functional layers 512, the multiple first functional layers 512 are stacked in direct contact, or other film layers are disposed between adjacent first functional layers 512.

[0132] For example, when the first packaging structure 510 includes multiple first atomic deposition layers 511, the multiple first atomic deposition layers 511 are stacked in direct contact, or other film layers are disposed between adjacent first atomic deposition layers 511.

[0133] For example, the first packaging structure 510 includes a first functional layer 512 and a first atomic deposition layer 511.

[0134] In this case, the first functional layer 512 can be located close to the first atomic deposition layer 511 (see details). Figure 8 ) or deviation (see details) Figure 9 ) One side of substrate 100.

[0135] For example, the first packaging structure 510 includes at least one first functional layer 512 and at least one first atomic deposition layer 511, and the first functional layer 512 and the first atomic deposition layer 511 are alternately stacked in a direction perpendicular to the plane of the substrate 100.

[0136] For example, refer to Figure 10 The schematic diagram of the cross-sectional structure of the display panel shown shows that the first packaging structure 510 includes at least one first functional layer 512 and at least two first atomic deposition layers 511. In a direction perpendicular to the plane of the substrate 100, the first functional layer 512 is located between two adjacent first atomic deposition layers 511.

[0137] It should be noted that the thickness of any two first atomic deposition layers 511 can be the same or different; the material of any two first atomic deposition layers 511 can be the same or different.

[0138] It should be noted that the atomic deposition layer, taking the first atomic deposition layer 511 as an example, refers to the film layer prepared by atomic layer deposition (ALD), which is relatively thin and dense.

[0139] It is understood that the number of layers in the first atomic deposition layer 511 can be 1, 2, 3, 4, 5, 6, 7, 8 or more. For example, a first functional layer 512 is located between any two adjacent first atomic deposition layers 311. The number of layers in the first functional layer 512 can be 1, 2, 3, 4, 5, 6, 7, 8 or more.

[0140] It is understood that the first encapsulation structure 510 includes a first functional layer 512 and / or at least one first atomic deposition layer 511. The first atomic deposition layer 511 has a small thickness, which is beneficial to obtaining an encapsulation layer 500 with a relatively thin thickness, thereby helping to improve the large viewing angle color shift problem of the display panel. The first atomic deposition layer 511 has good density, excellent water and oxygen isolation effect, and excellent reliability. The setting of the first functional layer 512 is beneficial to obtaining a first encapsulation structure 510 with certain functions, such as obtaining a first encapsulation structure 510 with good flexibility or good heat dissipation performance, thereby improving the encapsulation performance of the encapsulation layer.

[0141] For example, the encapsulation layer 500 is part of the microcavity structure, and a thinner encapsulation layer 500 reduces the optical path difference. As the thickness of the encapsulation layer 500 decreases, the optical path difference may no longer satisfy the conditions for constructive interference, resulting in a reduction in the intensity of light at these wavelengths, thereby mitigating the microcavity effect to some extent. With the microcavity effect weakened, light from a wide viewing angle can escape from the display panel, thus improving angular distortion at wide viewing angles.

[0142] In one embodiment, the material of the first functional layer 512 includes at least one of an organic-inorganic hybrid material and a metal. The first functional layer 512 has a certain ability to block water and oxygen; the organic-inorganic hybrid material makes the functional layer more flexible, making the encapsulation layer more flexible and suitable for flexible display panels; the metal has good heat dissipation performance, making the heat dissipation effect of the encapsulation layer better, improving the encapsulation reliability, and allowing the heat generated by the light-emitting device to be dissipated in time, reducing the thermal decay of the display panel.

[0143] For example, the organic-inorganic hybrid material includes at least one of Alucone and SH nanocomposites.

[0144] For example, methods for preparing alucone include, but are not limited to, molecular layer deposition. For instance, it may include the following steps: first, an organic precursor (such as ethylene glycol, hydroquinone, or other chain-like organic materials) is introduced into a reaction chamber, where the organic molecules are adsorbed onto the substrate surface; then, an aluminum-containing precursor (such as trimethylaluminum) is introduced, reacting with the adsorbed organic molecules to form a monolayer containing aluminum and organic components. By repeating this alternating pulse process, alucone materials with specific thicknesses and compositions can be prepared.

[0145] For example, Alucone is mainly formed by the alternating reaction of trimethylaluminum (TMA) and ethylene glycol (EG), which can extend the permeation path and enhance flexibility.

[0146] For example, SH nanocomposite materials refer to nanoscale composite materials containing sulfur (S) and hydrogen (H) elements. For instance, SH nanocomposite materials are formed by dispersing silica (SiO2) nanoparticles in a system containing thiol (-SH) groups, such as thiol-modified polymers or resins, combining the characteristics of inorganic nanoparticles (SiO2) with the properties of organic thiol groups to form a unique nanocomposite material structure. Exemplarily, silica (SiO2) nanoparticles can be dispersed in a UV-curable resin to obtain SH nanocomposite materials. The first functional layer 512 containing SH nanocomposite materials, combined with the first atomic deposition layer 511, helps optimize stress, alleviate cracks in the encapsulation layer 300 caused by bending, and improve flexibility. Furthermore, the relatively rough surface of the first functional layer 512 containing SH nanocomposite materials helps increase the bonding strength between the first functional layer 512 and the first atomic deposition layer 511, further improving encapsulation reliability.

[0147] For example, the metal includes at least one of magnesium and silver. Exemplarily, the metal includes magnesium, silver, or a magnesium-silver alloy.

[0148] For example, the material of the first atomic deposition layer 511 includes at least one of aluminum oxide, silicon nitride, and silicon oxide. Therefore, the first atomic deposition layer 511 has a strong ability to block water and oxygen.

[0149] For example, the thickness of the first atomic deposition layer 511 is greater than or equal to 20 nm and less than or equal to 80 nm (e.g., it can be 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, or 80 nm, etc.). As a result, the encapsulation layer 500 is relatively thin, which helps to reduce the microcavity effect and thus helps to improve the problems of large viewing angle piezoresistion and large viewing angle brightness attenuation.

[0150] For example, the thickness of the first functional layer 512 is greater than or equal to 8 nm and less than or equal to 120 nm (e.g., it can be 8 nm, 20 nm, 40 nm, 60 nm, 80 nm, 100 nm, or 120 nm, etc.). As a result, the thinner thickness of the encapsulation layer 500 is beneficial to reducing the microcavity effect, which in turn helps to improve the problems of large viewing angle piezoresistion and large viewing angle brightness attenuation.

[0151] For example, the material of the first functional layer 512 includes alucone, and the thickness of the first functional layer 512 is greater than or equal to 8 nm and less than or equal to 12 nm (e.g., it can be 8 nm, 9 nm, 10 nm, 11 nm, or 12 nm, etc.). For example, the material of the first functional layer 512 includes metal, and the thickness of the first functional layer 512 is greater than or equal to 10 nm and less than or equal to 15 nm (e.g., it can be 10 nm, 11 nm, 12 nm, 13 nm, or 15 nm, etc.). For example, the material of the first functional layer 512 includes SH nanocomposite material, and the thickness of the first functional layer 512 is greater than or equal to 80 nm and less than or equal to 120 nm (e.g., it can be 80 nm, 90 nm, 100 nm, 110 nm, or 120 nm, etc.).

[0152] In one embodiment, refer to Figure 10 The schematic cross-sectional structure of the display panel shown includes at least one first atomic deposition layer 511, comprising a first sub-atomic deposition layer 5111 and a second sub-atomic deposition layer 5112, with the second sub-atomic deposition layer 5112 located on the side of the first sub-atomic deposition layer 5111 facing away from the substrate 100; at least one first functional layer 512 includes a first sub-functional layer 5121, located between the first sub-atomic deposition layer 5111 and the second sub-atomic deposition layer 5112; the material of the first sub-functional layer 5121 includes an organic-inorganic hybrid material. Thus, the first encapsulation structure 510 possesses both excellent water and oxygen barrier properties and mechanical flexibility, making it suitable for top-emitting OLED (TOLED) display panels.

[0153] For example, the organic-inorganic hybrid material includes Alucone. The first subfunctional layer 5121 can extend the permeation path of water and oxygen and also enhance the flexibility of the first encapsulation structure 510, making it suitable for flexible display panels.

[0154] For example, the first sub-atomic deposition layer 5111 is made of aluminum oxide, and / or the second sub-atomic deposition layer 5112 is made of aluminum oxide. Thus, the first sub-atomic deposition layer 5111 and / or the second sub-atomic deposition layer 5112 can be prepared using aluminum oxide as a raw material via atomic layer deposition (ALD). This results in high density of the first and second sub-atomic deposition layers 5111 and 5112, excellent water and oxygen barrier properties, and superior encapsulation performance of the first encapsulation structure 510. Furthermore, the first and second sub-atomic deposition layers 5111 and 5112 prepared by atomic deposition are relatively thin, which helps alleviate the color shift problem of the display panel at large viewing angles. The first and second sub-atomic deposition layers 5111 and 5112 are almost free of defects such as pinholes, resulting in strong long-term stability of the display panel.

[0155] In one embodiment, refer to Figure 11 The schematic cross-sectional structure of the display panel shown includes at least one first atomic deposition layer 511 comprising a first sub-atomic deposition layer 5111, a second sub-atomic deposition layer 5112, and a third sub-atomic deposition layer 5113 stacked together, with the third sub-atomic deposition layer 5113 located on the side of the second sub-atomic deposition layer 5112 facing away from the substrate 100; and at least one first functional layer 512 comprising a first sub-functional layer 5121 and a second sub-functional layer 5122, with the first sub-functional layer 5121 located between the first sub-atomic deposition layer 5111 and the second sub-atomic deposition layer 5112, and the second sub-functional layer 5122 located between the second sub-atomic deposition layer 5112 and the third sub-atomic deposition layer 5113. Therefore, the first encapsulation structure 510 has a stronger ability to isolate water and oxygen.

[0156] For example, the first sub-functional layer 5121 is made of an organic-inorganic hybrid material, and the second sub-functional layer 5122 is made of a metal. Thus, the first encapsulation structure 510 possesses both excellent flexibility and heat dissipation performance, making it suitable for flexible display panels.

[0157] For example, the organic-inorganic hybrid material includes SH nanocomposites; the metal includes at least one of magnesium and silver.

[0158] In one embodiment, refer to Figure 12 The schematic diagram of the cross-sectional structure of the display panel shown indicates that the encapsulation layer 500 also includes a second encapsulation structure 520, located on the side of the first encapsulation structure 510 facing away from the substrate 100. The material of the second encapsulation structure 520 includes organic materials. Therefore, the second encapsulation structure 520 can be fabricated by inkjet printing (IJP). The surface of the second encapsulation structure 520 facing away from the substrate 100 is relatively flat, which is beneficial for the subsequent fabrication of film layers.

[0159] For example, organic materials include optical adhesives, which have high transparency, facilitating the emission of light from the light-emitting device 300.

[0160] For example, the thickness of the second packaging structure 520 is greater than or equal to 1800 nm and less than or equal to 2200 nm, such as 1800 nm, 1900 nm, 2000 nm, 2100 nm, or 2200 nm. Therefore, the second packaging structure 520 is relatively thin, which helps to alleviate the problem of color shift at large viewing angles in the display panel.

[0161] In one embodiment, refer to Figure 13 The schematic diagram of the cross-sectional structure of the display panel shown indicates that the encapsulation layer 500 also includes a third encapsulation structure 530, located on the side of the first encapsulation structure 510 facing away from the substrate 100. This further improves the encapsulation effect of the display panel.

[0162] For example, the third packaging structure 530 is located on the side of the second packaging structure 520 away from the substrate 100.

[0163] Optionally, refer to Figure 13 The third encapsulation structure 530 includes at least one second functional layer 532 and / or at least one second atomic deposition layer 531.

[0164] For example, the third packaging structure 530 includes at least one second functional layer 532. As another example, the third packaging structure 530 includes at least one second atomic deposition layer 531.

[0165] For example, when the third packaging structure 530 includes at least one second functional layer 532, the multiple second functional layers 532 are stacked in direct contact, or other film layers are disposed between adjacent second functional layers 532.

[0166] For example, when the third encapsulation structure 530 includes at least one second atomic deposition layer 531, multiple second atomic deposition layers 531 are stacked in direct contact, or other film layers are disposed between adjacent second atomic deposition layers 531.

[0167] For example, the third packaging structure 530 includes a second functional layer 532 and a second atomic deposition layer 531. In this case, the second functional layer 532 may be located close to the second atomic deposition layer 531 (see details). Figure 14 ) or deviation (see details) Figure 15 ) One side of substrate 100.

[0168] For example, the third packaging structure 530 includes at least one second functional layer 532 and at least one second atomic deposition layer 531, with the second functional layer 532 and the second atomic deposition layer 531 alternately stacked in a direction perpendicular to the plane of the substrate 100.

[0169] For example, refer to Figure 16 The third packaging structure 530 includes at least one second functional layer 532 and at least two second atomic deposition layers 531. The second functional layer 532 is located between two adjacent second atomic deposition layers 531 in a direction perpendicular to the plane of the substrate 100.

[0170] Optionally, the material of the second functional layer 532 includes at least one of organic-inorganic hybrid materials and metals.

[0171] For example, organic-inorganic hybrid materials include at least one of Alucone and SH nanocomposites.

[0172] For example, the metal includes at least one of magnesium and silver, and by way of example, the metal includes magnesium, silver, or a magnesium-silver alloy.

[0173] For example, the material of the second atomic deposition layer 531 includes at least one of aluminum oxide, silicon nitride, and silicon oxide.

[0174] Optionally, the thickness of the second atomic deposition layer 531 is greater than or equal to 20 nm and less than or equal to 50 nm, for example, it can be 20 nm, 22 nm, 24 nm, 26 nm, 28 nm, 30 nm, 40 nm, 45 nm or 50 nm, etc.

[0175] For example, the encapsulation layer 500 includes a first atomic deposition layer 511, a second encapsulation structure 520, and a second atomic deposition layer 531 stacked sequentially. The thickness of the second atomic deposition layer 531 can be 50 nm, and the thickness of the first atomic deposition layer 511 can be 80 nm.

[0176] Optionally, the thickness of the second functional layer 532 is greater than or equal to 8 nm and less than or equal to 120 nm (e.g., it can be 8 nm, 20 nm, 40 nm, 60 nm, 80 nm, 100 nm, or 120 nm, etc.). For example, the material of the second functional layer 532 includes alucone, and the thickness of the second functional layer 532 is greater than or equal to 8 nm and less than or equal to 12 nm (e.g., it can be 8 nm, 9 nm, 10 nm, 11 nm, or 12 nm, etc.). For example, the material of the second functional layer 532 includes metal, and the thickness of the second functional layer 532 is greater than or equal to 10 nm and less than or equal to 15 nm (e.g., it can be 10 nm, 11 nm, 12 nm, 13 nm, or 15 nm, etc.). For example, the material of the second functional layer 532 includes SH nanocomposite material, and the thickness of the second functional layer 532 is greater than or equal to 80 nm and less than or equal to 120 nm (e.g., it can be 80 nm, 90 nm, 100 nm, 110 nm, or 120 nm, etc.).

[0177] In one embodiment, refer to Figure 16 At least one second atomic deposition layer 531 includes a fourth sub-atomic deposition layer 5311 and a fifth sub-atomic deposition layer 5312, with the fifth sub-atomic deposition layer 5312 located on the side of the fourth sub-atomic deposition layer 5311 facing away from the substrate 100; at least one second functional layer 532 includes a third sub-functional layer 5321; the third sub-functional layer 5321 is located between the fourth sub-atomic deposition layer 5311 and the fifth sub-atomic deposition layer 5312; the material of the third sub-functional layer 5321 includes an organic-inorganic hybrid material. Therefore, the third encapsulation structure 530 possesses both excellent water and oxygen barrier properties and mechanical flexibility, making it suitable for top-emitting OLED (TOLED) display panels.

[0178] For example, organic-inorganic hybrid materials include Alucone. The third sub-functional layer 5321 can extend the permeation path of water and oxygen and also enhance the flexibility of the third encapsulation structure 530, making it suitable for flexible display panels.

[0179] For example, the material of the fourth sub-atom deposition layer 5311 includes aluminum oxide, and / or the material of the fifth sub-atom deposition layer 5312 includes aluminum oxide. Thus, the fourth sub-atom deposition layer 5311 and / or the fifth sub-atom deposition layer 5312 can be prepared using aluminum oxide as a raw material via atomic layer deposition (ALD). This results in high density of the fourth sub-atom deposition layer 5311 and the fifth sub-atom deposition layer 5312, excellent water and oxygen barrier capabilities, and superior encapsulation performance of the third encapsulation structure 530. Furthermore, the fourth sub-atom deposition layer 5311 and the fifth sub-atom deposition layer 5312 prepared by atomic deposition are relatively thin, which helps alleviate the problem of color shift at large viewing angles in the display panel.

[0180] In one embodiment, refer to Figure 17 The schematic cross-sectional structure of the display panel shown indicates that at least one second atomic deposition layer 531 includes a stacked fourth sub-atomic deposition layer 5311, a fifth sub-atomic deposition layer 5312, and a sixth sub-atomic deposition layer 5313, with the sixth sub-atomic deposition layer 5313 located on the side of the fifth sub-atomic deposition layer 5312 facing away from the substrate 100; at least one second functional layer 532 includes a third sub-functional layer 5321 and a fourth sub-functional layer 5322, with the third sub-functional layer 5321 located between the fourth sub-atomic deposition layer 5311 and the fifth sub-atomic deposition layer 5312, and the fourth sub-functional layer 5322 located between the fifth sub-atomic deposition layer 5312 and the sixth sub-atomic deposition layer 5313. Therefore, the third encapsulation structure 530 has a stronger ability to isolate water and oxygen.

[0181] For example, the third sub-functional layer 5321 is made of an organic-inorganic hybrid material, and the fourth sub-functional layer 5322 is made of a metal. Thus, the third packaging structure 530 combines excellent flexibility and heat dissipation performance, making it suitable for flexible display panels.

[0182] For example, the organic-inorganic hybrid material includes SH nanocomposites; the metal includes at least one of magnesium and silver.

[0183] For example, the first encapsulation structure 510 is a whole film layer structure.

[0184] For example, refer to Figure 18 The schematic diagram of the cross-sectional structure of the display panel shown includes: an isolation structure 600 located on the side of the pixel defining layer 200 near the encapsulation layer 500; the isolation structure 600 encloses a plurality of isolation openings 610; the orthographic projection of the pixel openings 210 on the substrate 100 is located within the orthographic projection range of the isolation openings 610 on the substrate 100; and at least some of the light-emitting devices 300 are located within the connected isolation openings 610 and pixel openings 210.

[0185] For example, the second electrode layer 330 is located between the pixel defining layer 200 and the substrate 100, and at least a portion of the second electrode layer 330 is exposed in the pixel opening 210, while the light-emitting functional layer 310 and the first electrode layer 320 are located in the connected isolation opening 610 and the pixel opening 210.

[0186] Optionally, the first packaging structure 510 includes a plurality of packaging portions 501, the orthographic projection of the packaging portions 501 on the substrate 100 covering the orthographic projection of the isolation opening 610 on the substrate 100, and a portion of the packaging portions 501 filling the isolation opening 610.

[0187] It is understood that each package 501 includes at least one first subatomic deposition layer and / or at least one first functional layer.

[0188] It is understandable that patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe the relevant content of the isolation structure 600 for reference.

[0189] Optionally, refer to Figure 19The schematic diagram of the cross-sectional structure of the display panel shown shows that the auxiliary conductive structure 400 is located on the side of the isolation structure 600 away from the substrate 100. The orthographic projection of the auxiliary conductive structure 400 on the substrate 100 is located around the orthographic projection of at least part of the isolation opening 610 on the substrate 100. The isolation structure 600 is electrically connected to the auxiliary conductive structure 400, and the first electrode layer 320 overlaps with the isolation structure 600.

[0190] In one embodiment, refer to Figure 17 The maximum distance H between the surface of the encapsulation layer 500 facing away from the substrate 100 and the surface of the encapsulation layer 500 close to the substrate 100 is less than or equal to 1 μm, for example, it can be 1 μm, 0.8 μm, 0.6 μm, 0.4 μm, etc. Therefore, the encapsulation layer 500 is relatively thin, which helps to reduce the microcavity effect and improve the large viewing angle piezoresistive effect.

[0191] Optionally, substrate 100 includes a flexible substrate. Exemplarily, substrate 100 may be a substrate substrate. The substrate substrate may include organic resin materials such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or it may be a flexible PCB that is easily deformable. In some embodiments, the substrate substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or it may include metals or metal compounds. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL). The display panel can be folded or bent to suit different scenarios.

[0192] The second aspect of this application provides a method for manufacturing a display panel, referring to... Figure 20 The diagram shows a process flow chart for manufacturing a display panel, which includes the following steps.

[0193] S100: A second electrode layer is prepared on one side of the substrate.

[0194] S200: A pixel defining layer is prepared on the side of the second electrode layer away from the substrate, and the pixel defining layer surrounds a plurality of pixel openings.

[0195] S300: A light-emitting functional layer and a first electrode layer are fabricated in the pixel aperture to obtain multiple light-emitting devices.

[0196] It should be noted that the light-emitting device, pixel defining layer and substrate are the same as described above, and will not be repeated here.

[0197] S400: At least one first functional layer and / or at least one first atomic deposition layer are prepared on the side of the light-emitting device away from the substrate to obtain a first packaging structure.

[0198] It should be noted that the first packaging structure is consistent with the previous description, and will not be elaborated further here.

[0199] In one embodiment, at least one first atomic deposition layer is prepared on the side of the light-emitting device away from the substrate at a temperature of 50°C to 80°C (e.g., 50°C, 60°C, 70°C, or 80°C). Therefore, the preparation temperature of the first atomic deposition layer is relatively mild, causing almost no damage to the light-emitting device and the substrate, thus improving the yield of the display panel.

[0200] For example, the method for preparing the first atomic deposition layer includes plasma-enhanced atomic layer deposition (PEALD).

[0201] For example, the method for preparing the first functional layer includes at least one of molecular layer deposition, vapor deposition, and spin coating.

[0202] For example, when the material of the first functional layer includes alucone, the first functional layer can be prepared by molecular layer deposition (MLD). The temperature during molecular layer deposition of the first functional layer can be 50℃ to 80℃ (e.g., 50℃, 60℃, 70℃ or 80℃, etc.).

[0203] For example, when the material of the first functional layer includes metal, the first functional layer can be prepared by vapor deposition.

[0204] For example, when the material of the first functional layer includes SH nanocomposite material, SiO2 nanoparticles can be dispersed in UV-curable resin and the first functional layer can be prepared by spin coating.

[0205] A third aspect of this application provides a display device, with reference to... Figure 21 The diagram shows a cross-sectional structure of the display device, which includes: the aforementioned display panel; and a light-shielding part 700.

[0206] Optionally, the light-shielding portion 700 is located on the light-emitting side of the display panel, and the light-shielding portion 700 surrounds a plurality of first openings 710. The orthographic projection of the pixel opening 210 on the substrate 100 is located within the orthographic projection range of the first opening 710 on the substrate 100. The distance L between the edge of the orthographic projection of the first opening 710 on the substrate 100 and the edge of the orthographic projection of the pixel opening 210 on the substrate 100 is greater than or equal to 0.5 μm and less than or equal to 4 μm, for example, it can be 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, or 4 μm, etc. This helps to reduce the reflectivity of the display device, further weakens the microcavity effect in the display device, and improves the problem of color shift at large viewing angles.

[0207] In one embodiment, the distance L between the edge of the orthographic projection of the first opening 710 on the substrate 100 and the edge of the orthographic projection of the pixel opening 210 on the substrate 100 is greater than or equal to 0.5 μm and less than or equal to 3 μm. This further reduces the reflectivity of the display device, further weakens the microcavity effect in the display device, and improves the problem of large viewing angle color shift.

[0208] Optionally, the distance L between the edge of the orthographic projection of the first opening 710 on the substrate 100 and the edge of the orthographic projection of the pixel opening 210 on the substrate 100 is greater than or equal to 1 μm and less than or equal to 2.5 μm. This results in excellent reduction of the reflectivity of the display device.

[0209] In one embodiment, the pixel defining layer 200 contains a light-absorbing material. This effectively prevents light emission crosstalk between adjacent light-emitting devices, resulting in clearer and more accurate image display.

[0210] For example, the pixel boundary layer 200 may be black. A black pixel boundary layer typically has the property of absorbing light. When displaying a black image or when the light-emitting devices are not lit, it effectively absorbs ambient light and any light leakage that may occur from adjacent light-emitting devices. This helps improve the contrast of the display device, making blacks deeper and whites brighter, thereby enhancing the overall visual effect.

[0211] For example, the light-absorbing material includes at least one of carbon-based materials (e.g., carbon nanotubes), black organic materials (e.g., black organic dyes based on anthraquinone structures), and metal oxide composites (e.g., manganese oxides).

[0212] Optionally, the display device may also include a color resist layer 800, which includes a plurality of color resist units 810 located in the opening 710.

[0213] For example, refer to Figure 21The light path diagram S of the light-emitting device 300 shown shows that, due to the thinness of the encapsulation layer 500, light rays with a larger viewing angle can be emitted smoothly, mitigating the problem of large viewing angle angular deviation.

[0214] For example, refer to Figure 22 The display device may also include a touch panel 900 located between the display panel and the light-shielding portion 700, which facilitates the implementation of the touch function of the display device. For example, the touch panel 900 is located between the encapsulation layer 500 and the light-shielding portion 700.

[0215] It should be noted that the display device may also include the structures that conventional display devices should have, such as touch panels and driver chips, which will not be elaborated on further here.

[0216] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0217] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, include: substrate; A pixel defining layer is located on one side of the substrate, and the pixel defining layer encloses a plurality of pixel openings; A plurality of light-emitting devices, at least some of which are located in the pixel opening, each light-emitting device comprising a light-emitting functional layer and a first electrode layer, the first electrode layer being located on the side of the light-emitting functional layer opposite to the substrate, and the light transmittance of the first electrode layer being greater than or equal to 90%.

2. The display panel according to claim 1, characterized in that, The first electrode layer includes at least one first sub-electrode layer, and the light transmittance of each first sub-electrode layer is greater than or equal to 90%. Preferably, the transmittance of the first sub-electrode layer is greater than or equal to 95%; Preferably, the first electrode layer further includes at least one second sub-electrode layer, the second sub-electrode layer being located on the side of the first sub-electrode layer close to and / or away from the substrate, the material of the second sub-electrode layer including metal, and the thickness of the second sub-electrode layer being less than or equal to 10 nm; Preferably, the light transmittance of the second sub-electrode layer is greater than or equal to 90%; Preferably, the first sub-electrode layer has at least two layers, and the second sub-electrode layer is located between adjacent first sub-electrode layers.

3. The display panel according to claim 2, characterized in that, The material of the first sub-electrode layer includes at least one of indium tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, fluorine-doped zinc oxide, indium zinc oxide, and indium gallium zinc oxide. Preferably, the material of the second sub-electrode layer includes at least one of magnesium, silver, aluminum, tin, gallium, and zinc; Preferably, the light-emitting device further includes a light extraction layer located on the side of the first electrode layer away from the substrate, wherein the refractive index of the light extraction layer at a light wavelength of 620 nm is greater than or equal to 1.4 and less than or equal to 1.

8. Preferably, the material of the light extraction layer includes at least one of polymethyl methacrylate, polyfluorene, and polystyrene. Preferably, the first electrode layer is a monolithic structure.

4. The display panel according to claim 1, characterized in that, Also includes: An auxiliary conductive structure is located on the side of the first electrode layer away from the substrate. The orthographic projection of the auxiliary conductive structure on the substrate is located around the orthographic projection of at least a portion of the pixel openings on the substrate. The auxiliary conductive structure is electrically connected to the first electrode layer. Preferably, the pixel defining layer includes a first surface and a second surface, the first surface is located on the side of the second surface opposite to the substrate, and the orthographic projection of the first surface on the substrate is within the orthographic projection range of the second surface on the substrate; The orthogonal projection of the auxiliary conductive structure onto the substrate is located within the orthogonal projection range of the first surface onto the substrate; Preferably, the auxiliary conductive structure comprises at least one of a transparent conductive material and a metal; Preferably, the transparent conductive material includes at least one of indium tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, fluorine-doped zinc oxide, indium zinc oxide, and indium gallium zinc oxide. Preferably, the metal includes at least one selected from magnesium, silver, aluminum, titanium, molybdenum, tin, gallium, and zinc.

5. The display panel according to claim 4, characterized in that, The auxiliary conductive structure includes a first sub-auxiliary conductive structure and a second sub-auxiliary conductive structure. The first sub-auxiliary conductive structure extends along a first direction, and the second sub-auxiliary conductive structure extends along a second direction. The first direction and the second direction intersect. Preferably, there is at least one pixel opening between adjacent first sub-auxiliary conductive structures, and / or, there is at least one pixel opening between adjacent second sub-auxiliary conductive structures.

6. The display panel according to claim 1, characterized in that, Also includes: An encapsulation layer is located on the side of the light-emitting device away from the substrate. The encapsulation layer includes a first encapsulation structure, which includes at least one first functional layer and / or at least one first atomic deposition layer. Preferably, the first functional layer and the first atomic deposition layer are alternately stacked in a direction perpendicular to the plane of the substrate; Preferably, the first packaging structure includes at least one first functional layer and at least two first atomic deposition layers, wherein the first functional layer is located between two adjacent first atomic deposition layers in a direction perpendicular to the plane of the substrate.

7. The display panel according to claim 6, characterized in that, The material of the first functional layer includes at least one of organic-inorganic hybrid materials and metals; Preferably, the organic-inorganic hybrid material includes at least one of Alucone and SH nanocomposite materials; Preferably, the metal includes at least one of magnesium and silver; Preferably, the material of the first atomic deposition layer includes at least one of aluminum oxide, silicon nitride, and silicon oxide; Preferably, the thickness of the first atomic deposition layer is greater than or equal to 20 nm and less than or equal to 80 nm, and the thickness of the first functional layer is greater than or equal to 8 nm and less than or equal to 120 nm.

8. The display panel according to claim 6 or 7, characterized in that, At least one first atomic deposition layer includes a first sub-atomic deposition layer and a second sub-atomic deposition layer, wherein the second sub-atomic deposition layer is located on the side of the first sub-atomic deposition layer opposite to the substrate; At least one first functional layer includes a first sub-functional layer; the first sub-functional layer is located between the first sub-atom deposition layer and the second sub-atom deposition layer; the material of the first sub-functional layer includes an organic-inorganic hybrid material. Preferably, the organic-inorganic hybrid material includes Alucone; Preferably, the material of the first sub-atom deposition layer includes aluminum oxide, and / or the material of the second sub-atom deposition layer includes aluminum oxide.

9. The display panel according to claim 6 or 7, characterized in that, At least one first atomic deposition layer includes a first sub-atomic deposition layer, a second sub-atomic deposition layer and a third sub-atomic deposition layer stacked together, wherein the third sub-atomic deposition layer is located on the side of the second sub-atomic deposition layer opposite to the substrate; At least one first functional layer includes a first sub-functional layer and a second sub-functional layer, wherein the first sub-functional layer is located between the first sub-atom deposition layer and the second sub-atom deposition layer, and the second sub-functional layer is located between the second sub-atom deposition layer and the third sub-atom deposition layer; Preferably, the material of the first sub-functional layer includes an organic-inorganic hybrid material, and the material of the second sub-functional layer includes a metal; Preferably, the organic-inorganic hybrid material includes SH nanocomposite materials; Preferably, the metal includes at least one of magnesium and silver.

10. The display panel according to claim 6, characterized in that, The encapsulation layer further includes a second encapsulation structure located on the side of the first encapsulation structure away from the substrate, and the material of the second encapsulation structure includes organic materials; Preferably, the organic material includes optical adhesive; Preferably, the thickness of the second packaging structure is greater than or equal to 1800 nm and less than or equal to 2200 nm.

11. The display panel according to claim 6, characterized in that, The encapsulation layer further includes a third encapsulation structure located on the side of the first encapsulation structure away from the substrate, and the third encapsulation structure includes at least one second functional layer and / or at least one second atomic deposition layer; Preferably, the second functional layer and the second atomic deposition layer are alternately stacked in a direction perpendicular to the plane of the substrate; Preferably, the third packaging structure includes at least one second functional layer and at least two second atomic deposition layers, wherein the second functional layer is located between two adjacent second atomic deposition layers along a direction perpendicular to the plane of the substrate; Preferably, the material of the second functional layer includes at least one of organic-inorganic hybrid materials and metals; Preferably, the organic-inorganic hybrid material includes at least one of Alucone and SH nanocomposite materials; Preferably, the metal includes at least one of magnesium and silver; Preferably, the material of the second atomic deposition layer includes at least one of aluminum oxide, silicon nitride, and silicon oxide; Preferably, the thickness of the second atomic deposition layer is greater than or equal to 20 nm and less than or equal to 50 nm, and the thickness of the second functional layer is greater than or equal to 8 nm and less than or equal to 120 nm.

12. The display panel according to claim 11, characterized in that, At least one second atomic deposition layer includes a fourth sub-atomic deposition layer and a fifth sub-atomic deposition layer, wherein the fifth sub-atomic deposition layer is located on the side of the fourth sub-atomic deposition layer opposite to the substrate; at least one second functional layer includes a third sub-functional layer; the third sub-functional layer is located between the fourth sub-atomic deposition layer and the fifth sub-atomic deposition layer; the material of the third sub-functional layer includes an organic-inorganic hybrid material; Preferably, the organic-inorganic hybrid material includes Alucone; Preferably, the material of the fourth sub-atom deposition layer includes aluminum oxide, and / or the material of the fifth sub-atom deposition layer includes aluminum oxide.

13. The display panel according to claim 11, characterized in that, At least one second atomic deposition layer includes a stacked fourth sub-atomic deposition layer, a fifth sub-atomic deposition layer, and a sixth sub-atomic deposition layer, wherein the sixth sub-atomic deposition layer is located on the side of the fifth sub-atomic deposition layer opposite to the substrate; At least one second functional layer includes a third sub-functional layer and a fourth sub-functional layer, wherein the third sub-functional layer is located between the fourth sub-atom deposition layer and the fifth sub-atom deposition layer, and the fourth sub-functional layer is located between the fifth sub-atom deposition layer and the sixth sub-atom deposition layer; Preferably, the material of the third sub-functional layer includes an organic-inorganic hybrid material, and the material of the fourth sub-functional layer includes a metal; Preferably, the organic-inorganic hybrid material includes SH nanocomposite materials; Preferably, the metal includes at least one of magnesium and silver.

14. The display panel according to claim 6, characterized in that, The first encapsulation structure is a single-layer film structure; Preferably, the display panel further includes: an isolation structure located on the side of the pixel defining layer near the encapsulation layer, the isolation structure enclosing a plurality of isolation openings, the orthographic projection of the pixel openings on the substrate being within the orthographic projection range of the isolation openings on the substrate, and at least a portion of the light-emitting devices being located within the communicating isolation openings and the pixel openings; The first packaging structure includes a plurality of packaging portions, wherein the orthographic projection of the packaging portion on the substrate covers the orthographic projection of the isolation opening on the substrate, and a portion of the packaging portion fills the isolation opening; Preferably, the display panel further includes: an auxiliary conductive structure located on the side of the isolation structure away from the substrate, wherein the orthographic projection of the auxiliary conductive structure on the substrate is located around the orthographic projection of at least a portion of the isolation opening on the substrate, the isolation structure is electrically connected to the auxiliary conductive structure, and the first electrode layer overlaps with the isolation structure; Preferably, the substrate comprises a flexible substrate.

15. The display panel according to claim 1, characterized in that, Also includes: An encapsulation layer is located on the side of the light-emitting device facing away from the substrate, and the maximum distance between the surface of the encapsulation layer facing away from the substrate and the surface of the encapsulation layer close to the substrate is less than or equal to 1 μm.

16. A display device, characterized in that, include: The display panel according to any one of claims 1 to 15; A light-shielding part is located on the light-emitting side of the display panel, and the light-shielding part is provided with a plurality of first openings; The orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the first opening on the substrate, and the distance between the edge of the orthographic projection of the pixel opening on the substrate and the edge of the orthographic projection of the first opening on the substrate is greater than or equal to 0.5 μm and less than or equal to 4 μm.

17. The display device according to claim 16, characterized in that, The distance between the edge of the orthographic projection of the pixel opening on the substrate and the edge of the orthographic projection of the first opening on the substrate is greater than or equal to 0.5 μm and less than or equal to 3 μm; Preferably, the distance between the edge of the orthographic projection of the pixel opening on the substrate and the edge of the orthographic projection of the first opening on the substrate is greater than or equal to 1 μm and less than or equal to 2.5 μm; Preferably, the pixel defining layer contains a light-absorbing material; Preferably, the color of the pixel delimiting layer includes black.

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