server

Abstract

The application discloses a kind of servers, it is related to server heat dissipation technical field, including case, mainboard, fixed structure, storage device and cable module, mainboard is installed to the case inside;Fixed structure is installed to the case inside, and is located the side of mainboard, fixed structure includes baffle, baffle is opened with multiple wire ports;Storage device is installed to fixed structure, and storage device is electrically connected with mainboard;Storage device is electrically connected with mainboard by the partial cable of cable module, and cable module is correspondingly passed through multiple wire ports.Therefore, the fixed structure is additionally provided in the position distinguishing from the installation area of mainboard in the case in the application, so that the storage device installed on the fixed structure is no longer directly installed in the reserved position of mainboard, but is fixed in the inside of case in the form of independent structure, so that the heat dissipation of heat dissipation component on mainboard is significantly weakened.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, specifically to a server. Background Technology

[0002] As servers increasingly demand higher storage speeds and densities, M.2 solid-state drives (SSDs) are widely adopted due to their small size and high transfer rates. Currently, most branded servers typically install storage devices in pre-existing motherboard slots, making them susceptible to motherboard heat dissipation. This can lead to significant temperature increases under high loads, triggering frequency throttling and impacting overall performance. Summary of the Invention

[0003] This application provides a server to at least address the problem in the related art where storage devices are easily affected by motherboard heat dissipation.

[0004] This application provides a server, including:

[0005] Chassis;

[0006] Motherboard, which is installed inside the chassis;

[0007] A fixing structure is installed inside the chassis and located on one side of the motherboard. The fixing structure includes a baffle with multiple cable routing ports.

[0008] A storage device, wherein the storage device is mounted to the fixed structure and is electrically connected to the motherboard;

[0009] The storage device is electrically connected to the motherboard via a portion of the cables in the cable module, and the cable module passes through a plurality of the cable ports.

[0010] Therefore, by placing the fixing structure beside the motherboard, the present invention allows storage devices mounted on the fixing structure to be detached from the motherboard, thereby reducing the impact of heat dissipation from heat-generating components on the motherboard. Simultaneously, since the storage device no longer occupies a reserved space on the motherboard, operators are not limited by the motherboard layout when choosing an installation location and can install the fixing structure in any suitable location within the chassis other than the motherboard area.

[0011] Furthermore, the cables in the cable module are used to establish electrical connections between the motherboard and other modules requiring electrical connection (such as power supplies). In this invention, operators can connect some of the cables in the cable module between the motherboard and the storage device to achieve data transmission and power supply between the two, thereby enabling the storage device to establish an electrical connection with the motherboard.

[0012] Based on the above structural design, the present invention adds a fixing structure in a position inside the chassis that is different from the motherboard mounting area, so that the storage device installed on the fixing structure is no longer directly installed in the reserved position on the motherboard, but is fixed inside the chassis as an independent structure.

[0013] Understandably, the above arrangement can effectively keep the storage device away from high-heat components on the motherboard, such as the CPU, GPU, or high-speed chips, thereby significantly reducing the thermal impact of the motherboard's heat dissipation on the storage device. This effectively reduces the risk of the storage device operating in a high-temperature environment, extends the lifespan of the storage device, and further ensures the security and reliability of its data storage.

[0014] Furthermore, since the installation location of storage devices is no longer limited by the motherboard layout and pre-defined mounting positions, operators can freely choose the installation location of the fixed structure based on the internal structure and heat dissipation conditions of the chassis. This flexibility allows for installation, for example, near the cooling fans or airflow channels within the chassis, to achieve better heat dissipation. This flexibility not only improves the adaptability of servers to different chassis structures and application scenarios but also provides operators with greater maintainability and scalability.

[0015] Therefore, by setting an independent fixing structure inside the chassis, the present invention enables the storage device to be physically isolated from the motherboard and flexibly arranged. This not only improves the heat dissipation environment of the storage device, but also enhances the convenience of device installation, thereby improving the overall operational stability and applicability of the server. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the server structure according to an embodiment of the present invention;

[0017] Figure 2 for Figure 1 A side view of the structural diagram of the server shown;

[0018] Figure 3 This is a front view of the fixed structure according to an embodiment of the present invention;

[0019] Figure 4 This is a schematic diagram of the rear structure of the fixing structure according to an embodiment of the present invention;

[0020] Figure 5 This is a schematic diagram of the front structure of the baffle according to an embodiment of the present invention;

[0021] Figure 6 This is a schematic diagram of the back structure of the baffle according to an embodiment of the present invention;

[0022] Figure 7This is a schematic diagram of the front structure of the back plate according to an embodiment of the present invention;

[0023] Figure 8 This is a schematic diagram of the front structure of the tray according to an embodiment of the present invention;

[0024] Figure 9 This is a schematic diagram of the back structure of the tray according to an embodiment of the present invention;

[0025] Figure 10 This is a schematic diagram of the front structure of the cable management rack according to an embodiment of the present invention;

[0026] Figure 11 This is a schematic diagram of the cable management rack in an embodiment of the present invention when it is open;

[0027] Figure 12 This is a schematic diagram of the clamping component according to an embodiment of the present invention;

[0028] Figure 13 This is a schematic diagram of the connection structure between the clamping member and the back plate in an embodiment of the present invention.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Chassis; 2. Motherboard; 3. Storage device; 4. Cable module; 5. Baffle; 501. First protrusion; 502. Fixing foot; 503. Cable guide port; 504. Second protrusion; 505. Threaded hole; 6. Backplate module; 601. Backplate; 602. Support plate; 603. Support column; 604. Fastener; 605. Positioning protrusion; 606. Positioning hole; 607. Elastic washer; 608. Slide groove; 609. Elastic pad; 610. Clamping plate; 611. Fixing component; 612. First fixing hole; 613. Signal connector; 6 14. Power connector; 615. Plug interface; 616. Transition plate; 617. First connection hole; 618. Second connection hole; 7. Cable management rack; 701. Cable tray; 702. Opening; 703. Second fixing hole; 7031. Entry section; 7032. Fixing section; 7033. Transition section; 704. Locking structure; 705. Cover plate; 706. Buckle plate; 707. Fixing protrusion; 708. Rotating groove; 8. Clamping component; 801. Clamping base; 802. Clamp cover; 803. Snap-fit ​​knob; 9. Heat dissipation assembly; 901. Cooling fan. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0032] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] In existing server architectures, M.2 solid-state drives (SSDs) are typically fixed to pre-installed mounting locations on the motherboard 2 using screws. These locations are generally situated on the surface of the motherboard 2 and are electrically connected to it via a standardized M.2 interface (such as an M-key) for data transmission and power supply. During installation, the storage device 3 is secured to the mounting holes at the pre-installed location on the motherboard 2 using screws, resulting in a mounting method where one end is connected to the interface 615 and the other end is fixed with screws. While this installation layout is simple and space-saving, it also exposes the storage device 3 to the direct thermal environment of the motherboard 2 for extended periods.

[0035] Specifically, storage device 3 is typically installed close to heat-generating components mounted on motherboard 2, such as high-power devices like the CPU, GPU, memory, or northbridge / southbridge chips. These devices continuously generate significant heat during operation, which affects storage device 3 through various means:

[0036] Firstly, high-power devices have high surface temperatures, and heat is transferred to adjacent M.2 modules in the form of radiation, causing the entire module to be in a heated state.

[0037] Secondly, the cooling airflow inside the server preferentially flows through areas such as the CPU heatsink and memory. By the time the airflow reaches the area around the M.2 module, it has already carried a lot of heat, causing the ambient temperature of the M.2 module to rise further.

[0038] Third, the motherboard 2 itself acts as a heat-conducting medium, which will form local hot areas after the high-power devices are heated. The storage device 3 is in direct contact with the motherboard 2, and its interface also becomes a path for heat conduction, further aggravating the temperature rise.

[0039] Because M.2 solid-state drives are small, have densely packed components, and typically lack independent heat dissipation structures, when external heat sources are combined with their own operating heat, the heat is difficult to dissipate in time, easily causing the temperature to rise rapidly under high load. Once a set threshold is exceeded, the device's internal firmware will trigger a temperature-controlled frequency reduction mechanism, actively reducing read and write speeds to avoid damage, but this will directly affect the overall storage performance of the server.

[0040] To address the aforementioned problems, this application provides a server. (Reference) Figure 1 and Figure 2 The server includes a chassis 1, a motherboard 2, a fixed structure, a storage device 3, and a cable module 4.

[0041] The motherboard 2 is installed inside the chassis 1. A mounting structure is also located inside the chassis 1 to provide installation space for the storage device 3. Furthermore, the mounting structure is situated beside the motherboard 2 so that the storage device 3, mounted on the mounting structure, can be detached from the motherboard 2, thereby reducing the impact of heat dissipation from the heat-generating components on the motherboard 2. Simultaneously, since the storage device 3 no longer occupies the reserved space on the motherboard 2, the operator is not restricted by the layout of the motherboard 2 when choosing an installation location; the mounting structure can be installed in any suitable location within the chassis 1, excluding the motherboard 2 area. For example, as... Figure 2 As shown in the layout, the fixed structure can be located in the space area of ​​the motherboard 2 along the width direction of the chassis 1.

[0042] Furthermore, the cables in cable module 4 are used to establish electrical connections between the motherboard 2 and other modules requiring electrical connection (such as power supplies). In this embodiment, the operator can connect some of the cables in cable module 4 between the motherboard 2 and the storage device 3 to achieve data transmission and power supply between the two, thereby enabling the storage device 3 to complete the electrical connection with the motherboard 2.

[0043] Based on the above structural design, this embodiment adds a fixing structure inside the chassis 1 at a position different from the motherboard 2 mounting area, so that the storage device 3 installed on the fixing structure is no longer directly installed in the reserved position of the motherboard 2, but is fixed inside the chassis 1 in the form of an independent structure.

[0044] Understandably, the above arrangement can effectively keep the storage device 3 away from the high-heat components on the motherboard 2, such as the CPU, GPU or high-speed chip, thereby significantly reducing the thermal impact of the motherboard 2's heat dissipation on the storage device 3, thus effectively reducing the risk of the storage device 3 operating in a high-temperature environment, extending the service life of the storage device 3, and further ensuring the security and reliability of its data storage.

[0045] Furthermore, since the installation location of storage device 3 is no longer limited by the layout and reserved installation positions of motherboard 2, operators can freely choose the installation location of the fixed structure according to the internal structure and heat dissipation conditions of chassis 1. This flexibility allows for installation, for example, near the cooling fan 901 or the heat dissipation duct within chassis 1, to achieve better heat dissipation. This flexibility not only improves the server's adaptability to different chassis 1 structures and application scenarios but also provides operators with greater maintainability and scalability.

[0046] Therefore, by setting an independent fixing structure inside the chassis 1, this embodiment enables the storage device 3 to be physically isolated from the motherboard 2 and flexibly arranged. This not only improves the heat dissipation environment of the storage device 3, but also enhances the ease of installation, thereby improving the overall operational stability and applicability of the server.

[0047] In this embodiment, the connection between the motherboard 2 and the storage device 3 differs from the traditional method of direct plug-in connection via a pre-reserved interface on the motherboard 2. While this embodiment increases the number of cables, the additional cables can be routed efficiently using a fixed structure, thus avoiding adverse effects. Specifically, the fixed structure may include a baffle 5, on which the storage device 3 is mounted, and the baffle 5 has multiple cable routing ports 503. (See reference...) Figure 1 and Figure 2The cables in the cable module 4 can pass through these cable guide ports 503 in sequence, thereby achieving cable organization. Through these cable guide ports 503, the cables in this embodiment can not only avoid stacking or messy distribution, but also effectively avoid the heat dissipation area directly above the CPU and other high-heat components on the motherboard 2, thus avoiding obstruction of heat dissipation airflow.

[0048] Therefore, this embodiment, through the cooperation of the baffle 5 and the cable management port 503, ensures the electrical connection between the motherboard 2 and the storage device 3 while further optimizing the internal wiring of the chassis 1. On the one hand, the baffle 5 improves the heat dissipation environment of the chassis 1, preventing cables from crossing high-heat areas and interfering with the heat dissipation airflow, thereby improving overall heat dissipation efficiency. On the other hand, with the cable paths streamlined, the internal layout of the chassis 1 is clearer and more orderly, not only reducing the risk of electromagnetic interference caused by cable crossings and stacking, but also facilitating operators to quickly identify relevant cables during subsequent maintenance, expansion, or replacement of the storage device 3, thus improving operational efficiency.

[0049] Therefore, this embodiment solves the problems of messy wiring and obstructed heat dissipation caused by the increase in the number of cables during actual installation through the above structural design, thereby significantly improving the overall performance of the server in terms of stability, reliability and maintainability.

[0050] In one embodiment, reference Figure 3 The fixed structure includes a backplate module 6 on which the storage device 3 can be installed. The backplate module 6 is located on the side of the baffle 5 facing away from the motherboard 2, which allows the storage device 3 to avoid the high-heat area above the motherboard 2. At the same time, it can also effectively prevent the hot air carrying heat from directly hitting the storage device 3 during the process of hot air being drawn out of the area by the cooling fan 901, thereby further reducing the adverse thermal impact of the heat-generating components of the motherboard 2 on the storage device 3.

[0051] Although the baffle 5, positioned beside the motherboard 2, can avoid some of the aforementioned hot air, its side closest to the motherboard 2 will still inevitably be subjected to some hot airflow. Simultaneously, heat-generating components on the motherboard 2 will transfer heat to the baffle 5 via radiation, causing the overall temperature of the baffle 5 to rise. Therefore, in this embodiment, the storage device 3 and the baffle 5 are arranged with a gap, thus forming a heat-insulating space between them to reduce the heat transfer effect from the baffle 5 to the storage device 3. Therefore, this embodiment can further ensure that the storage device 3 is not subjected to a significant temperature rise due to external heat coupling during operation, thereby preventing overheating and triggering frequency throttling, ensuring its operational stability and performance reliability, and extending its service life.

[0052] In this embodiment, the spacing between the baffle 5 and the storage device 3 can take various appropriate forms. For example, the following two arrangements can be adopted: one is that the backplate 601 is fixed in contact with the baffle 5, while the storage device 3 and the backplate 601 are kept apart; the other is that the backplate 601 is fixed in contact with the storage device 3, while the baffle 5 and the backplate 601 are kept apart. It should be noted that if the first method is adopted, after the heat is conducted from the baffle 5 to the backplate 601, it will be further transferred through the interface connected to the storage device 3, which may affect its temperature control. Therefore, this embodiment prefers the second arrangement, that is, keeping the backplate 601 and the baffle 5 apart, so as to effectively reduce the heat transfer from the baffle 5 to the storage device 3, thereby better ensuring the performance and stability of the device.

[0053] Therefore, in one embodiment, the backplane module 6 may include a connecting portion, and the backplane 601 is spaced apart from the baffle 5 through the connecting portion, so as to realize that the storage device 3 mounted on the backplane 601 is spaced apart from the baffle 5, wherein the storage device 3 may be mounted on the side of the backplane 601 facing away from the baffle 5. It can be understood that, compared with the storage device 3 being mounted on the side of the backplane 601 facing the baffle 5, this embodiment can effectively avoid the storage device 3 being directly exposed to the high-heat area near the baffle 5, forming effective thermal isolation, fundamentally eliminating heat interference from the baffle 5, thereby ensuring the stability and reliability of the operation of the storage device 3.

[0054] It should be noted that the spacing design between the backplate 601 and the baffle 5 in this embodiment effectively prevents most heat transfer and fully meets the normal operation requirements of the storage device 3. Of course, based on this embodiment, operators can selectively add spacing between the backplate 601 and the storage device 3 according to the number of heat-generating components on the motherboard 2 inside the server and their total heat generation. This spacing can be achieved by increasing the thickness of the interface module on the backplate 601, making the distance between the connector 615 and the backplate 601 greater than the thickness of the storage device 3. Simultaneously, the clamping member 8 used to fix the rear of the hard drive can have a structure that partially supports the backplate 601 and the hard drive, ensuring that the storage device 3 is set parallel to the backplate 601. This further reduces the risk of heat being transferred to the storage device 3 via conduction, ensuring that the hard drive does not trigger frequency reduction due to overheating during continuous high-load operation, thereby guaranteeing its long-term high-performance output.

[0055] In this embodiment, the connecting portion can have any suitable structure. (See reference...) Figure 3In the illustrated embodiment, the connecting portion includes a tray 602 and a connecting structure. The tray 602 is connected to a baffle 5, while the connecting structure is disposed on the surface of the tray 602 facing away from the baffle 5 and protrudes outward, with its end maintaining a distance from the baffle 5. A back plate 601 can be connected to the end of the connecting structure away from the tray 602, thereby forming an air-filled physical isolation area between the back plate 601 and the tray 602.

[0056] Understandably, due to the low thermal conductivity of air, this physical isolation significantly limits the heat transferred to the backplate 601 via conduction or radiation. Therefore, this application effectively isolates the baffle 5 from direct contact with the backplate 601 through this physical isolation, thus laying the foundation for subsequent thermal management. Even if a small amount of heat passes through the backplate 601 and is ultimately transferred to the storage device 3, its magnitude is very limited and insufficient to cause any adverse effects on the operation of the storage device 3. Therefore, this embodiment ensures that the storage device 3 maintains stable and reliable operating performance even when near a high heat source.

[0057] In one embodiment, the connection structure described above may include a connector and a spacer.

[0058] The connector is disposed on the tray 602, and the back plate 601 is detachably connected to the connector to facilitate the assembly of the back plate module 6 by the operator. The spacer is disposed on the tray 602, and the back plate 601 abuts against the spacer to form the aforementioned physical isolation area between the back plate 601 and the tray 602.

[0059] In this embodiment, the connector can have any suitable structure. (See reference...) Figure 8 In the illustrated embodiment, the connector may include a support column 603, one end of which is connected to the tray 602 via a plug-in, snap-fit ​​or other suitable fixing method, thereby providing a stable base for the subsequent installation of the back plate 601, thus ensuring the stability and accuracy of the entire structure.

[0060] The support column 603 has a first connecting hole 617 at the end away from the support plate 602, which is combined with Figure 7 The back plate 601 is provided with a second connection hole 618. The first and second connection holes 618 can be connected by fasteners 604 to realize a detachable connection between the back plate 601 and the support plate 602.

[0061] The fastener 604 may include screws, which can be threaded through the second connecting hole 618 and connected to the first connecting hole 617. Alternatively, in some embodiments, the support plate 602 and the back plate 601 may be connected via other suitable quick-release mechanisms. Regardless of the connection method, the aim is to facilitate quick installation or replacement of the back plate 601 by the operator without affecting other components.

[0062] In one embodiment, review Figure 8 The connector may further include a positioning protrusion 605, one end of which is connected to the surface of the tray 602 facing the back plate 601 via a plug-in, snap-fit, or other suitable fixing method, and the positioning protrusion 605 protrudes outward relative to the surface of the tray 602, in conjunction with... Figure 7 The back plate 601 has a corresponding positioning hole 606, and the positioning protrusion 605 is inserted into the positioning hole 606. That is, when installing the back plate 601 and the support plate 602, the end of the positioning protrusion 605 away from the support plate 602 is first inserted into the positioning hole 606. At this time, the first connecting hole 617 and the second connecting hole 618 will be aligned, and the operator can then fix the connection using the screws.

[0063] It should be noted that the aforementioned support column 603 and positioning protrusion 605 can have any appropriate number. Specifically, two support columns 603 and two positioning protrusions 605 can be provided, and the two support columns 603 and two positioning protrusions 605 can be arranged opposite each other along the diagonal of the back plate 601, distributed at the four corners of the back plate 601, thereby improving the connection strength between the support plate 602 and the back plate 601.

[0064] Furthermore, in this embodiment, reference Figure 8 The positioning protrusion 605 may include a positioning post, which comprises a first segment and a second segment extending from the support plate 602 toward the back plate 601. The diameter decreases sequentially along the extension direction. Simultaneously, the height of the first segment is lower than that of the support post 603, while the end of the second segment is higher than that of the support post 603, so that the end of the positioning post can be inserted into the positioning hole 606. Therefore, in this embodiment, the back plate 601 can directly abut against the end of the support post 603.

[0065] Generally, during actual server operation, chassis 1 experiences vibration. This is because the continuous high-frequency vibration generated by the cooling fans 901 installed on chassis 1—whether CPU cooling fan 901, GPU cooling fan 901, or chassis 1 cooling fan 901—is transmitted to chassis 1. If the backplate 601 abuts against the aforementioned support column 603, the vibration from that part will be transmitted to the backplate 601 through the baffle 5, the support plate 602, and the support column 603.

[0066] Continuous mechanical vibration poses a serious threat to the connection stability of the storage device 3 and its mating interface 615. Repeated minor vibrations can cause mechanical stress at the contact points between the storage device 3 and the interface 615, leading to fretting wear, oxidation or wear of the metal contact surfaces, and affecting the integrity of electrical signals. Furthermore, long-term accumulated vibration stress may cause the interface to loosen, and in severe cases, even cause the storage device 3 to physically detach from the backplane 601, ultimately directly affecting the reliability of data reading and writing, and even causing system interruption.

[0067] Therefore, in this embodiment, it is preferable that the back plate 601 abuts against the spacer, so that the back plate 601 is only connected to the connector without abutting, thereby effectively reducing the vibration transmitted from the connector to the back plate 601.

[0068] The spacer can have any suitable structure, as shown in the reference. Figure 8 As shown in the illustrated embodiment, the spacer may include an elastic washer 607, which is connected to the surface of the support plate 602 facing the back plate 601. Furthermore, the natural height of the elastic washer 607 is not lower than the height of the positioning protrusion 605, allowing the back plate 601 to directly abut against the elastic washer 607, absorbing and cushioning vibrations through its elasticity. It is important to note that after the back plate 601 abuts against the elastic washer 607, the screw and the end of the positioning protrusion 605 must have sufficient depth to screw into the first connecting hole 617 and the positioning hole 606 to ensure the stability of the connection and the proper use of the positioning protrusion.

[0069] In one embodiment, the spacer may further include an elastic pad 609, one end of which is also connected to the surface of the support plate 602 facing the back plate 601, and its natural height is greater than that of the support post 603. Similarly, after the back plate 601 abuts against the elastic pad 609, it needs to allow sufficient depth for the screws and the ends of the positioning protrusions 605 to screw into the first connecting hole 617 and the positioning hole 606 to ensure the stability of the connection and the proper use of the positioning protrusions.

[0070] In this embodiment, it is preferable to abut the back plate 601 against the spacer, so that the back plate 601 is fixed only by the connector and does not directly abut against other components, thereby effectively reducing the vibration transmitted from the connector to the back plate 601.

[0071] The spacer can adopt any suitable structure. Figure 8 In the illustrated embodiment, the spacer may include an elastic washer 607, which is connected to the side surface of the support plate 602 facing the back plate 601. The natural height of the elastic washer 607 is higher than the height of the support post 603, allowing the back plate 601 to directly abut against the elastic washer 607, thereby absorbing and buffering vibrations through elasticity. It should be noted that after the back plate 601 abuts against the elastic washer 607, it is still necessary to ensure that the screw and the end of the positioning protrusion 605 can be fully screwed into the first connecting hole 617 and the positioning hole 606 to ensure a stable connection and maintain the normal use of the positioning protrusion.

[0072] In another embodiment, the spacer may include an elastic pad 609, one end of which is also connected to the surface of the support plate 602 facing the back plate 601, and its natural height is greater than that of the support post 603. After the back plate 601 abuts against the elastic pad 609, it is also necessary to ensure that the screw and the end of the positioning protrusion 605 have sufficient screw-in depth to ensure a stable connection and normal use of the positioning protrusion.

[0073] The number of elastic washers 607 and elastic pads 609 can be adjusted according to the actual installation situation. In this embodiment, three elastic washers 607 and one elastic pad 609 can be provided, and the three elastic washers 607 and one elastic pad 609 are arranged at intervals along the length of the support plate 602. In addition, the weight of the support plate 602 can be reduced by opening through holes in the empty areas.

[0074] In one embodiment, reference Figure 9 A transition plate 616 and a clamping plate 610 can be sequentially connected to the top of the support plate 602. The clamping plate 610 and the support plate 602 are spaced apart, and the three together form a sliding groove 608 for insertion and engagement with the top of the baffle 5. This design simplifies the cumbersome bolt fixing to a one-step sliding insertion, fundamentally solving the problem of long installation time.

[0075] Specifically, the transition plate 616 connects to the same side of the clamping plate 610 and the support plate 602, so that the groove 608 formed by the enclosure has a strip-shaped opening on the side away from the transition plate 616. The top of the baffle 5 can be inserted into the groove 608 through this strip-shaped opening, achieving a quick, tool-free connection. This plug-in design not only significantly speeds up the installation of the server, but also ensures the stability and repeatability of the baffle 5 connection through precise mechanical fit, thereby greatly improving the server's production efficiency and assembly reliability.

[0076] Regarding the fixing of the baffle 5 and the slide 608, this embodiment provides several suitable fixing methods. One fixing method is to use a fixing member 611, which can be set on the side of the clamping plate 610 away from the baffle 5, and can pass through the clamping plate 610 to achieve a detachable connection with the baffle 5. Another method is to design the clamping plate 610 to be inclined towards the support plate 602, so that the width of the slide 608 gradually decreases along the transition plate 616 to the strip opening, and the spacing of the strip opening is less than the thickness of the baffle 5. At the same time, the transition plate 616 can have a certain degree of elasticity. When the baffle 5 is inserted, the clamping plate 610 will generate a clamping force on the baffle 5 due to elastic deformation, thereby achieving clamping and fixing. At the same time, the friction between the clamping plate 610, the baffle 5, and the support plate 602 will also prevent slippage.

[0077] Of course, to enhance connection stability, the two fixing methods described above can also be combined. In this preferred embodiment, the clamping plate 610 first clamps and fixes the baffle 5 using its inclined design, and then the fixing member 611 further locks the baffle 5. This dual fixing mechanism can significantly enhance the stability and shock resistance of the connection between the baffle 5 and the slide 608, effectively resisting the continuous vibration generated during server operation, fundamentally eliminating contact problems caused by physical loosening, thereby greatly ensuring the long-term operational reliability of the server.

[0078] In this embodiment, the aforementioned fastener 611 is a hand-tightening screw. The hand-tightening screw can be inserted into the slide groove 608 after the baffle 5 is inserted, and can be detachably connected to the baffle 5 via the clamping plate 610. The end of the screw can abut against the surface of the baffle 5 to fix the baffle 5, or it can be fixed by opening a threaded hole 505 on the baffle 5 for threaded connection at its end.

[0079] To facilitate precise installation of the tray 602 into the designated position of the baffle 5, in one embodiment, reference is made to... Figure 5 and Figure 9 The baffle 5 has a first protruding part 501 protruding outward on its surface facing away from the main board 2, while the support plate 602 has a first fixing hole 612. The first fixing hole 612 includes a wider opening section and a narrower positioning section, which are connected sequentially along the extension direction of the slide groove 608. This structural design allows the operator to align the first protruding part 501 on the baffle 5 with the opening section and slide it in during installation. Subsequently, as the baffle 5 is further inserted into the slide groove 608, the first protruding part 501 automatically enters the positioning section, thereby achieving initial positioning and greatly simplifying the installation operation.

[0080] It should be noted that the width of the clamp 610 does indeed affect the sequence of installation operations. This is because the width of the clamp 610 directly determines the effective length of the slide 608 and the relative position of the protrusions on the installation path. If the clamp 610 is narrower, the contact point between the support plate 602 and the baffle 5 is further forward. The first protrusion 501 may reach and enter the opening section before the baffle 5 is fully inserted into the slide 608, thus requiring the operator to align the protrusion first. Conversely, if the clamp 610 is wider, the contact point between the support plate 602 and the baffle 5 is further back. The top of the baffle 5 may be fully inserted into the slide 608 and in place before the first protrusion 501 reaches the opening section. In this case, the operator can first slide the baffle 5 into the slide 608 and then align and lock the protrusion. This design flexibility allows the fixing structure to adapt to components of different sizes while ensuring a precise and efficient installation process.

[0081] The first fixing hole 612 can adopt a gourd-shaped hole configuration, the aforementioned positioning hole 606 can be formed in the small hole section of the gourd-shaped hole, and the opening section can be formed by the large hole section of the gourd-shaped hole. Correspondingly, the first protrusion 501 can adopt an I-beam structure, that is, the tightening section of the insertion part of the I-beam slides from the opening of the large hole section to the small hole section. It should be noted that the head of the I-beam is usually composed of the tightening section and the flanges at both ends. The flanges can be understood as a ring-shaped structure extending radially outward from both ends of the tightening section. The flanges have a larger diameter than the tightening section, so that after being inserted into the small hole section, they can prevent the I-beam from disengaging from the small hole section along its axial direction.

[0082] In one embodiment, the edge of the baffle 5 is provided with a fixing foot 502, which is detachably connected to the bottom surface of the chassis 1 to detachably fix the baffle 5 inside the chassis 1.

[0083] Further, refer to Figure 5 and Figure 6 The fixing foot 502 may include multiple strip plates, which are respectively located on both sides of the baffle 5. One edge of each strip plate is connected to the edge of the baffle 5 and is perpendicular to the surface of the baffle 5, thereby improving the stability of the baffle 5. Simultaneously, the surface of the strip plate is attached to the bottom surface of the chassis 1 and fixedly connected by bolts.

[0084] In one embodiment, the backplane 601 is provided with a plug-in module with a plug interface 615 for installing the storage device 3. Correspondingly, the backplane 601 is also provided with a signal connector 613 and a power connector 614, both of which are electrically connected to the plug-in module through electrical paths on the backplane 601. These connectors are connected to the motherboard 2 via cables, thereby realizing data and power transmission between the motherboard 2 and the storage device 3, making the backplane 601 an efficient interconnection bridge within the server.

[0085] In one embodiment, the back panel 601 is provided with a plurality of adjustment slots, which are arranged sequentially at intervals along the length of the back panel 601, such that each adjustment slot has a different distance from the insertion interface 615. This design aims to ensure that storage devices 3 of different specifications can find a corresponding adjustment slot at their rear after being inserted into the insertion interface 615. (See reference...) Figure 12 and Figure 13 This embodiment also includes a clamping member 8, which can be selectively connected to one of the adjustment ports and can be detachably connected to the tail of the storage device 3.

[0086] Therefore, when replacing storage devices 3 of different specifications, the operator only needs to insert the clamp 8 into the corresponding adjustment socket to achieve a detachable connection with the tail of the storage device 3, thereby providing a unified and stable fixing method for storage devices 3 of different lengths, greatly improving the versatility of the design and the flexibility of the system.

[0087] In one embodiment, reference Figure 2 The aforementioned clamping component 8 may include a clamping base 801 and a clamping cover 802. The clamping cover 802 has a connecting post extending upwards perpendicular to the back plate 601, while the clamping base 801 has a corresponding insertion hole for engaging with the connecting post. After connecting the clamping base 801 to the corresponding adjustment port, the operator inserts the insertion hole of the clamping cover 802 into the connecting post, thereby allowing the end of the clamping cover 802 near the storage device 3 to abut against its tail, thus achieving clamping and fixing of the storage device 3. Of course, other suitable connection methods can also be used between the clamping base 801 and the clamping cover 802.

[0088] In this embodiment, the clamping base 801 can have any suitable structural form. (See reference...) Figure 3 In the illustrated embodiment, the clamping base 801 may include a U-shaped clamping frame with a snap-fit ​​post on its outer bottom surface. The end of the snap-fit ​​post has a snap-fit ​​knob 803, which is adapted to the outer contour of the adjustment slot on the back plate 601. Specifically, the operator can pass the snap-fit ​​post through the adjustment slot, and then rotate the clamping frame to make the snap-fit ​​knob 803 abut against the peripheral end face of the corresponding adjustment slot on the back plate 601, thereby achieving quick snap-fit ​​fixation between the clamping base 801 and the back plate 601. Through this design, this embodiment simplifies traditional screw fixing to a tool-free "insert-rotate" operation, greatly improving installation efficiency and convenience, and providing a robust and reliable connection to effectively resist the impact of vibration on the storage device 3.

[0089] Based on the fixed structure that allows the storage device 3 to be freed from the physical constraints of the motherboard 2, this embodiment optimizes the positions of the components inside the chassis 1 to fully utilize the server's heat dissipation capabilities. In one embodiment, refer to Figure 1 and Figure 2 The baffle 5 and the motherboard 2 are spaced apart along the first direction. This layout divides the interior of the chassis 1 into two independent areas along this direction: a motherboard 2 heat dissipation area for heat dissipation of the motherboard 2 and a storage device 3 heat dissipation area for heat dissipation of the storage device 3, laying the foundation for achieving partitioned heat dissipation.

[0090] Corresponding to this layout, the server's heat dissipation assembly 9 includes multiple cooling fans 901 spaced apart along a first direction. These fans 901 are also spaced apart from the baffle 5 and the motherboard 2 along a second direction perpendicular to each other. This arrangement allows the heat dissipation assembly 9 to concentrate most of its cooling capacity on the motherboard 2 for efficient cooling, while a portion of its cooling capacity is used to cool the storage device 3. This precise partitioning and on-demand allocation cooling strategy ensures that high-heat components (such as the CPU and GPU) receive sufficient airflow, while preventing excess heat from affecting the storage device 3, thereby improving the overall cooling efficiency and performance stability of the server.

[0091] In practical applications, the cables on the motherboard 2 can also be classified according to their connection to other external modules. Therefore, the cables include at least two types of cables. For example, cables used to connect the motherboard 2 to the power supply can be classified as power connection cables, which are mainly used to supply power to the motherboard 2 and related modules; cables used to connect the motherboard 2 to the storage device 3 (such as hard drives, solid-state drives, etc.) can be classified as storage connection cables, such as SATA cables.

[0092] However, in existing technologies, the lack of categorized management of cables connecting the motherboard 2 to external modules often leads to cable tangling or interference with other components, thus affecting airflow organization and heat dissipation within the chassis 1. Furthermore, tangled cables of different categories may interfere with each other; for example, if power connection cables and storage connection cables are tangled or crossed, it may adversely affect the signal transmission stability of the storage connection cables.

[0093] Therefore, in one embodiment, reference Figure 1 and Figure 2 Cables of the same type are configured to pass through the same cable guide 503 to achieve physical classification and isolation of the cables. For example, power cables are all passed through the same cable guide 503. Figure 4The larger cable routing port 503 is shown, while other types of cables can pass through other cable routing ports 503 and exit from the heat dissipation area of ​​the storage device 3. This arrangement allows cables to bypass the high-heat heat dissipation area above the motherboard 2 and instead connect to the corresponding module inside or outside the chassis 1 from the relatively low-heat heat dissipation area of ​​the storage device 3. This fundamentally solves the problem of cables affecting heat dissipation efficiency due to airflow obstruction in traditional cabling methods, as well as the problem of some cables experiencing transmission errors due to heat.

[0094] In one embodiment, combined Figure 4 A cable management rack 7 is provided on the side of the baffle 5 facing away from the motherboard 2. This cable management rack 7 has cable routing channels, providing dedicated pathways for certain cables to avoid the heat dissipation area above the motherboard 2, thereby optimizing the wiring within the chassis 1. Figure 1 and Figure 2 As shown, this structural design primarily addresses the issue of significant distances between the starting and passing points of certain similar cables. Specifically, when these cables connect to the motherboard 2, there is a certain distance difference between their connection ports and the pre-designed cable routing ports 503 on the baffle 5. Without dedicated cable management, these cables would need to extend directly from their ports to the cable routing ports 503. Since the relative positions of these two points often cross the heat dissipation area above the motherboard 2, the cables inevitably pass through this area during installation, thus obstructing airflow to some extent and potentially causing localized air stagnation, reducing the overall heat dissipation efficiency inside the chassis 1.

[0095] To address the aforementioned issues, this embodiment adds a cable management rack 7 to the side of the baffle 5 facing away from the motherboard 2, allowing cables to be redirected along the cable routing channels. This way, when the starting point of some cables is far from the preset cable routing ports 503 on the baffle 5, these cables can first be organized and guided through the cable routing channels on the cable management rack 7, and then, depending on actual needs, can either continue through to the corresponding cable routing port 503, or be directly led out through the cable routing channels and connected to the target module. This effectively prevents cables from crossing the heat dissipation area above the motherboard 2, thus ensuring unobstructed heat dissipation channels and making the cable routing path more reasonable and orderly.

[0096] In one embodiment, reference Figure 10 and Figure 11 The cable management frame 7 specifically includes a cable tray 701. The cable passage is formed inside the cable tray 701, and the cable tray 701 has openings 702 on both sides along the cable passage direction. During installation, cables can pass through the openings 702 sequentially and be guided to the desired position along the cable passage. This design of the cable tray 701 not only standardizes the cable routing but also serves to separate and secure the cables, further improving the stability and safety of cable installation.

[0097] Furthermore, the design of the cable management rack 7 described above can also bring the following technical benefits:

[0098] Firstly, regarding heat dissipation, the cable management bracket 7 guides the cables effectively, keeping the heat dissipation area above the motherboard 2 as clean and unobstructed as possible, preventing cables from obstructing airflow. The chassis 1 typically relies on fans to create airflow channels, effectively removing heat generated by the motherboard 2 and its mounted processor, memory, and other heat-generating components. If cables cross the heat dissipation area directly above the motherboard 2, they will inevitably create localized obstructions, reducing airflow speed or even causing turbulence, thus affecting cooling performance. However, the proper placement of the cable management bracket 7 optimizes the airflow path of the chassis 1 simply by improving the cable management without adding additional heat dissipation components, effectively improving heat dissipation efficiency.

[0099] Secondly, in terms of cabling management, the cable management rack 7 makes the cable routing more organized. In existing technologies, if cables are arranged haphazardly, they are not only prone to tangling but may also interfere with other structural components, causing maintenance difficulties. By setting up cable passages and cable boxes 701, cables can be centrally managed, allowing cables with different functions to be distributed along designated paths within the chassis 1, avoiding tangling. This not only improves the aesthetics and visibility of the cabling but also greatly reduces the difficulty of subsequent maintenance, replacement, or expansion of cables.

[0100] Furthermore, in terms of safety, the cable management rack 7 restrains the cables through the cable box 701, which can prevent the insulation layer from being worn due to shaking and friction during long-term use, reduce the risk of short circuits or poor contact, and thus enhance the overall safety and reliability of operation.

[0101] Furthermore, from a system adaptability perspective, the cable management rack 7 offers significant flexibility. Different servers or chassis 1 may have variations in the layout of the motherboard 2 and the location of the cable management ports 503. Using a fixed cabling method often makes it difficult to accommodate various layouts. However, through the guiding function of the cable management rack 7, cables can be flexibly adjusted according to their specific starting and ending points. They can either enter the cable management channel first and then pass through the cable management port 503, or they can be directly led out through the cable management channel, forming diverse cabling schemes. This flexibility allows the design of this embodiment to adapt to a wider range of system environments, giving it strong versatility and promotional value.

[0102] Furthermore, the cable tray 701 in the cable management rack 7 can achieve layered cable routing through the opening 702. For example, when multiple types of cables need to be routed inside the chassis 1, some cables can enter the cable routing channel through the upper opening 702 of the cable tray 701, while other cables can be guided from the lower opening 702. This allows cables with different functions to be physically isolated in the same space, avoiding electromagnetic interference problems that may be caused by excessive proximity between signal lines and power lines. This layered cable routing design further improves the electromagnetic compatibility inside the chassis 1, ensuring signal stability during equipment operation. During subsequent equipment maintenance or upgrades, target cables can be quickly identified and easily disassembled or replaced through the guidance of the cable tray, significantly reducing maintenance difficulty and labor costs.

[0103] Therefore, this embodiment effectively prevents cables from crossing the heat dissipation area above the motherboard 2 by setting a cable management frame 7 on the side of the baffle 5 facing away from the motherboard 2 and forming a cable passage within the cable management frame 7. With the guiding function of the cable box 701 and the opening 702, the cable layout is more reasonable and orderly, not only improving the heat dissipation efficiency inside the chassis 1 but also enhancing the standardization, safety, and electromagnetic compatibility of cabling management. At the same time, this structural design has strong flexibility and versatility, adapting to the cabling needs of different system environments and significantly improving efficiency during assembly and maintenance, thus demonstrating outstanding technological advancement and application value.

[0104] To facilitate the installation of the cable tray 701 onto the baffle 5, in one embodiment, the baffle 5 has a second protrusion 504 on its surface facing the main board 2, and the cable tray 701 has a second fixing hole 703 that mates with it. The second fixing hole 703 includes an entry section 7031, a transition section 7033, and a fixing section 7032 connected in sequence. The second protrusion 504 can first be inserted into the entry section 7031, then slide through the transition section 7033, and finally stop in the fixing section 7032. The cable tray 701 also includes a locking structure 704, which is detachably connected to the second protrusion 504 stopping in the fixing section 7032. With this structure, the cable tray 701 and the baffle 5 can be quickly assembled and reliably fixed without additional tools; at the same time, the cable tray 701 can be easily disassembled when maintenance or adjustment of the wiring is required, improving the flexibility and efficiency of cable management.

[0105] In this embodiment, the second fixing hole 703 can also be in the form of a gourd-shaped hole. Correspondingly, the large hole section constitutes the entry section 7031, the small hole section constitutes the fixing section 7032, and the transition section 7033 is composed of the transition portion between the large hole section and the small hole section. Furthermore, the second protrusion 504 can also adopt an I-beam structure, that is, the insertion part of the I-beam is inserted into the baffle 5, and the head opposite to the insertion part is connected to the second fixing hole 703.

[0106] Among them, combined Figure 11 In this embodiment, the locking structure 704 includes clamping plates disposed on both sides of the small hole section. The clamping plates are symmetrically arranged and gradually bend towards the small hole section along the extension direction of the small hole section away from the large hole section. An arc-shaped groove matching the bending shape of the clamping plate is formed on the opposing surface of the clamping plates. The arc-shaped groove is used to limit and clamp the flange of the I-beam head, thereby achieving reliable fixation of the I-beam head. With this structural design, when the flange of the I-beam head is inserted and embedded in the arc-shaped groove, a stable connection between the cable box 701 and the baffle 5 can be achieved without the need for additional fasteners 604. Simultaneously, because the clamping plates have a certain degree of elasticity, users can easily separate the I-beam head from the arc-shaped groove by external force when maintenance or replacement is required, thus achieving a detachable connection. This ensures the reliability of the connection and improves the convenience of installation and maintenance.

[0107] It should be noted that the head of an H-beam nail typically consists of a tightening section and flanges at both ends. These flanges can be understood as ring-shaped structures extending radially outward from both ends of the tightening section. The flanges have a larger diameter than the tightening section, thus, after insertion into the small hole, they can engage with the arc-shaped groove to provide positioning and fixation. Furthermore, combined with... Figure 10 and Figure 11 The aforementioned locking structure 704 is provided on both the inner and outer surfaces of the wire box 701. Therefore, this embodiment can fix the two flanges at both ends of the head of the I-shaped nail.

[0108] In one embodiment, reference Figure 1 The junction box 701 includes a box body, a cover plate 705, and a latching plate 706 connected sequentially along its circumference. The box body and the cover plate 705 are rotatably connected, allowing the cover plate 705 to switch between an open and closed position. This rotatable connection can take various suitable forms, such as providing a pivot at the connection between the box body and the cover plate 705, allowing the cover plate 705 to be rotatably mounted on the pivot; or as... Figure 11 As shown, when the junction box 701 is entirely made of plastic, a rotating groove 708 is formed at the connection between the box body and the cover plate 705. This rotating groove 708 reduces the material thickness at the connection point between the box body and the cover plate 705, allowing this area to elastically deform when the cover plate 705 is subjected to force, thus providing a flexible structure similar to a hinge. Simultaneously, the groove also provides necessary clearance for the cover plate 705 to move during opening and closing, preventing interference between the cover plate 705 and the box body. Therefore, the cover plate 705 can rotate smoothly between the open and closed positions without the need for an additional independent rotating shaft component.

[0109] To ensure stable fixation after closure, a fixing protrusion 707 is provided at the end of the box body opposite to the rotatable connection of the cover plate 705, and an insertion hole adapted to the fixing protrusion 707 is formed on the buckle plate 706. In use, when the cover plate 705 is closed around the rotatable connection, the fixing protrusion 707 is inserted into the insertion hole on the buckle plate 706, and the cover plate 705 and the buckle plate 706 are reliably locked together by a snap-fit ​​engagement, thereby keeping the cover plate 705 in a stable closed state.

[0110] Therefore, this embodiment ensures smooth cable installation while allowing operators to easily open the cover 705 for cable laying, organization, or maintenance when needed. The snap-fit ​​locking method not only simplifies the operation steps and avoids the use of additional fasteners 604 such as screws, but also ensures the closing stability of the cover 705, preventing accidental loosening due to airflow impact or vibration inside the chassis 1.

[0111] It should be noted that the storage device 3 mentioned in this embodiment is mainly an M.2 solid-state drive.

[0112] The server provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server, characterized in that, include: Chassis (1); Motherboard (2), the motherboard (2) is installed inside the chassis (1); A fixed structure is installed inside the chassis (1) and located on one side of the motherboard (2). The fixed structure includes a baffle (5) and the baffle (5) has multiple cable routing ports (503). Storage device (3), the storage device (3) is installed on the fixed structure, and the storage device (3) is electrically connected to the motherboard (2); The fixing structure further includes: a backplate module (6), the backplate module (6) is installed on the side of the baffle (5) facing away from the motherboard (2), the backplate module (6) includes a backplate (601), and the storage device (3) is installed on the backplate (601); the storage device (3) and the baffle (5) are spaced apart; The storage device (3) is electrically connected to the motherboard (2) through the cable module (4), and the cable module (4) passes through multiple cable ports (503).

2. The server according to claim 1, characterized in that, The back panel module (6) also includes a connecting part. The back panel (601) is spaced apart from the baffle (5) through the connecting part. The storage device (3) is installed on the side of the back panel (601) facing away from the baffle (5).

3. The server according to claim 2, characterized in that, The connecting part includes: A tray (602) is connected to the baffle (5); A connecting structure is provided on the surface of the tray (602) facing away from the baffle (5), the connecting structure is configured to protrude outward, and the back plate (601) is connected to the end of the connecting structure away from the tray (602).

4. The server according to claim 3, characterized in that, The connection structure includes: A connector is disposed on the tray (602), and the back plate (601) is detachably connected to the connector; A spacer is disposed on the tray (602), and the back plate (601) abuts against the spacer.

5. The server according to claim 4, characterized in that, The connector includes a support column (603), the end of the support column (603) away from the tray (602) is provided with a first connection hole (617), the back plate (601) is provided with a second connection hole (618), and the second connection hole (618) and the first connection hole (617) are connected by a fastener (604).

6. The server according to claim 5, characterized in that, The connector also includes a positioning protrusion (605), and a positioning hole (606) is provided on the back plate (601). The positioning protrusion (605) and the positioning hole (606) are inserted into each other.

7. The server according to claim 6, characterized in that, The spacer includes an elastic washer (607) whose natural height is higher than that of the support post (603).

8. The server according to claim 7, characterized in that, The spacer also includes an elastic pad (609) which is naturally higher than the support post (603).

9. The server according to claim 3, characterized in that, The top of the tray (602) is connected in sequence to a transition plate (616) and a clamping plate (610). The clamping plate (610) is spaced apart from the tray (602). The clamping plate (610), the transition plate (616) and the tray (602) form a sliding groove (608). The top of the baffle (5) is inserted into the sliding groove (608).

10. The server according to claim 9, characterized in that, A fastener (611) is provided on the clamp (610), the fastener (611) passes through the clamp (610) and is detachably connected to the baffle (5).

11. The server according to claim 10, characterized in that, The baffle (5) has a first protrusion (501) protruding outward on the surface away from the main board (2). The tray (602) has a first fixing hole (612). The first fixing hole (612) includes a positioning section and an opening section. The positioning section and the opening section are connected sequentially along the extension direction of the slide (608). The opening section is located on the edge of the tray (602) away from the transition plate (616).

12. The server according to claim 1, characterized in that, The edge of the baffle (5) is provided with a fixing foot (502), and the fixing foot (502) is detachably connected to the bottom surface of the chassis (1).

13. The server according to claim 1, characterized in that, The back plate (601) is provided with a plug-in interface (615), and the storage device (3) is plugged into the plug-in interface (615). The back plate (601) is provided with multiple adjustment ports, and the multiple adjustment ports and the plug-in interface (615) are arranged sequentially at intervals along the length direction of the back plate (601). The fixing structure also includes a clamping member (8), which is selectively connected to one of the adjustment ports. The clamping member (8) is detachably connected to the tail of the storage device (3).

14. The server according to claim 1, characterized in that, The server also includes a heat dissipation component (9), which includes a plurality of heat dissipation fans (901) spaced apart along a first direction. The baffle (5) and the motherboard (2) are spaced apart along the first direction. The heat dissipation fans (901) and the baffle (5) and the motherboard (2) are spaced apart along a second direction. The first direction and the second direction are perpendicular to each other.

15. The server according to claim 1, characterized in that, The cable module (4) includes at least two types of cables, and the cables of the same type are threaded through the same cable outlet (503).

16. The server according to claim 15, characterized in that, The baffle (5) is provided with a cable management rack (7) on the side facing away from the main board (2). The cable management rack (7) has a cable passage, through which some of the cables pass.

17. The server according to claim 16, characterized in that, The cable management rack (7) includes a cable pass box (701), the cable pass channel is formed inside the cable pass box (701), and the cable pass box (701) has openings (702) on both sides along the cable pass direction of the cable pass channel. The cables pass through the openings (702) in sequence along the cable pass direction.

18. The server according to claim 17, characterized in that, The baffle (5) has a second protrusion (504) on its surface facing the main board (2). The cable box (701) has a second fixing hole (703). The second fixing hole (703) includes an entry section (7031), a transition section (7033), and a fixing section (7032) connected in sequence. The second protrusion (504) is inserted into the entry section (7031), passes through the transition section (7033), and stops in the fixing section (7032). The cable box (701) also includes a locking structure (704). The locking structure (704) is detachably connected to the second protrusion (504) that stops in the fixing section (7032).

19. The server according to claim 17, characterized in that, The junction box (701) includes a box body, a cover plate (705) and a buckle plate (706) connected in sequence around the circumference. The box body and the cover plate (705) are rotatably connected. A fixing protrusion (707) is provided on the end of the box body that is connected to the cover plate (705). A plug hole is formed on the buckle plate (706), and the plug hole is engaged with the fixing protrusion (707).

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