Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel, a manufacturing method thereof and a display device, and relates to the technical field of display. The display panel comprises a driving backboard and a plurality of light emitting devices, the driving backboard comprises a substrate and a plurality of driving bonding pad units located on one side of the substrate, and each driving bonding pad unit at least comprises a driving bonding pad; the light-emitting device comprises a device body and device bonding pad units, each device bonding pad unit at least comprises a device bonding pad, and one device bonding pad is connected with one driving bonding pad; the display panel meets at least one of the following three conditions: the first condition is that the surfaces, far away from the substrate, of the at least two driving bonding pad units are distributed in the direction far away from the substrate; the second condition is that the surfaces, far away from the substrate, of the at least two device bonding pad units are distributed in the direction far away from the substrate; the third condition is that the surfaces, away from the substrate, of the at least two device bodies are distributed in the direction away from the substrate. The bonding defects can be reduced while the bonding pressure between the light-emitting device and the driving back plate is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0002] At present, the glass-based bonding technology can realize high-density and high-efficiency bonding of light-emitting devices and driving backplanes, but the existing bonding technology has a small bonding pressure between part of the light-emitting devices and the driving backplane when realizing the bonding of the light-emitting devices and the driving backplane, resulting in bonding defects.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0004] The present disclosure provides a display panel, a manufacturing method thereof and a display device, which can improve the bonding pressure between light-emitting devices and driving backplanes while reducing bonding defects.

[0005] According to one aspect of the present disclosure, a display panel is provided, comprising:

[0006] a driving backplane, the driving backplane comprising a substrate and a plurality of driving pad units located on one side of the substrate, each of the driving pad units comprising at least one driving pad;

[0007] a plurality of light-emitting devices, the light-emitting devices comprising device bodies and device pad units located on one side of the device bodies, each of the device pad units comprising at least one device pad, and one device pad being connected to one driving pad;

[0008] The display panel satisfies at least one of the following three conditions:

[0009] A first condition is that at least two of the driving pad units are distributed away from the surface of the substrate in a direction away from the substrate;

[0010] A second condition is that at least two of the device pad units are distributed away from the surface of the substrate in a direction away from the substrate;

[0011] A third condition is that at least two of the device bodies are distributed away from the surface of the substrate in a direction away from the substrate.

[0012] In an exemplary embodiment of the present disclosure, when the display panel satisfies the first condition, the surfaces of at least two of the driving pad units close to the substrate are flush, and the thicknesses of the pads of at least two of the driving pad units are different, and the thicknesses of the pads of the same driving pad unit are the same.

[0013] In an example embodiment of the present disclosure, when the display panel further satisfies the second condition, the thickness of the pads of the at least two device pad units is the same or different, and the thickness of the at least two device bodies is different.

[0014] In an example embodiment of the present disclosure, when the display panel further satisfies the third condition, the thickness of the pads of the at least two device pad units is different, and the thickness of the at least two device bodies is different.

[0015] In an example embodiment of the present disclosure, when the display panel satisfies the first condition, the driving pad units are distributed along the direction close to the surface of the substrate, and the thickness of the pads of the driving pad units is the same.

[0016] In an example embodiment of the present disclosure, when the display panel further satisfies the second condition, the thickness of the pads of the at least two device pad units is the same or different, and the thickness of the at least two device bodies is different.

[0017] In an example embodiment of the present disclosure, when the display panel further satisfies the third condition, the thickness of the pads of the at least two device pad units is different, and the thickness of the at least two device bodies is different.

[0018] In an example embodiment of the present disclosure, when the display panel satisfies the second condition, the thickness of the pads of the at least two device pad units is different, and the thickness of the pads of the same device pad unit is the same.

[0019] In an example embodiment of the present disclosure, when the display panel satisfies the third condition, the driving pad units are distributed along the direction close to the surface of the substrate, and the thickness of the pads of the driving pad units is different, and the thickness of the at least two device bodies is different.

[0020] In an example embodiment of the present disclosure, when the display panel satisfies the third condition, the driving pad units are flush along the surface close to the substrate, the thickness of the pads of the driving pad units is the same, and the thickness of the at least two device bodies is different.

[0021] In an example embodiment of the present disclosure, when the display panel satisfies the second condition and the third condition simultaneously, the plurality of driving pad units are flush with the surface of the substrate, and the thicknesses of the pads of the plurality of driving pad units are the same; the thicknesses of the pads of the at least two device pad units are different, and the thicknesses of the at least two device bodies are different.

[0022] In an example embodiment of the present disclosure, when the display panel satisfies the second condition and the third condition simultaneously, the plurality of driving pad units are flush with the surface of the substrate, and the thicknesses of the pads of the plurality of driving pad units are the same; the thicknesses of the pads of the at least two device pad units are different, and the thicknesses of the plurality of device bodies are the same.

[0023] In an example embodiment of the present disclosure, when the display panel satisfies the second condition and the third condition simultaneously, at least two driving pad units are distributed along the direction close to the substrate near the surface of the substrate, the thicknesses of the pads of the at least two driving pad units are different, and the thicknesses of the pads of the same driving pad unit are the same; the thicknesses of the pads of the at least two device pad units are different, and the thicknesses of the at least two device bodies are different.

[0024] In an example embodiment of the present disclosure, when the display panel satisfies the second condition and the third condition simultaneously, at least two driving pad units are distributed along the direction close to the substrate near the surface of the substrate, the thicknesses of the pads of the at least two driving pad units are different, and the thicknesses of the pads of the same driving pad unit are the same; the thicknesses of the pads of the at least two device pad units are different, and the thicknesses of the plurality of device bodies are the same.

[0025] In an example embodiment of the present disclosure, when the display panel satisfies the first condition, the second condition and the third condition simultaneously, the thicknesses of the pads of the plurality of driving pad units are the same, the thicknesses of the pads of the plurality of device pad units are the same, and the thicknesses of the plurality of device bodies are the same; and at least two pad units are distributed along the direction close to the substrate near the surface of the substrate.

[0026] In an example embodiment of the present disclosure, the display panel further comprises a device planar layer covering the plurality of light-emitting devices.

[0027] In an example embodiment of the present disclosure, each of the light-emitting devices comprises at least one light-emitting color.

[0028] When the light emitting device includes multiple light emitting colors, the thickness of the device body of the multiple light emitting devices of the same light emitting color is the same, the thickness of the device pad of the multiple light emitting devices of the same light emitting color is the same, and the thickness of the pad of the corresponding connected driving pad unit of the multiple light emitting devices of the same light emitting color is the same.

[0029] According to an aspect of the present disclosure, a manufacturing method of a display panel is provided, the method comprising:

[0030] forming a driving backplate, the driving backplate comprising a substrate and a plurality of first driving pad units and a plurality of second driving pad units located on one side of the substrate, each of the first driving pad units comprising at least one first driving pad, and each of the second driving pad units comprising at least one second driving pad;

[0031] forming a plurality of device recesses on a substrate, and forming a plurality of first light emitting devices in each of the device recesses, respectively, the first light emitting devices comprising a first device body and a first device pad unit located on one side of the first device body, each of the first device pad units comprising at least one first device pad;

[0032] bonding each of the first light emitting devices to the driving backplate by connecting one of the first device pads to one of the first driving pads;

[0033] removing the substrate;

[0034] forming a plurality of second light emitting devices on the surface of the substrate, the second light emitting devices comprising a second device body and a second device pad unit located on one side of the second device body, each of the second device pad units comprising at least one second device pad;

[0035] bonding each of the second light emitting devices to the driving backplate by connecting one of the second device pads to one of the second driving pads.

[0036] According to an aspect of the present disclosure, a display device is provided, comprising the display panel of any one of the above.

[0037] The display panel and the display device of the present disclosure can coordinate and adjust the relative positional relationship of the surface of each device body, the surface of each device pad, and the surface of each driving pad, and utilize the fact that at least part of the surface of the device body, the surface of the device pad, and the surface of the driving pad are not coplanar at the same time, to achieve the bonding of multiple device bodies and driving backplates in batches, reduce the bonding density of light emitting devices, improve the bonding pressure of each light emitting device, reduce bonding defects, and thus improve the overall bonding yield.

[0038] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0039] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and serve to explain the principles of the present disclosure. It is readily apparent to one skilled in the art that the following figures are merely illustrative of some embodiments of the present disclosure and that other figures can be obtained from these figures without incurring inventive effort.

[0040] Figure 1 Structure diagram of a display panel of a first embodiment of the present disclosure.

[0041] Figure 2 Structure diagram of a display panel of a second embodiment of the present disclosure.

[0042] Figure 3 Structure diagram of a display panel of a third embodiment of the present disclosure.

[0043] Figure 4 Structure diagram of a display panel of a fourth embodiment of the present disclosure.

[0044] Figure 5 Structure diagram of a display panel of a fifth embodiment of the present disclosure.

[0045] Figure 6 Structure diagram of a display panel of a sixth embodiment of the present disclosure.

[0046] Figure 7A Structure diagram of a display panel of a first case in a seventh embodiment of the present disclosure.

[0047] Figure 7B Structure diagram of a display panel of a second case in a seventh embodiment of the present disclosure.

[0048] Figure 8A Structure diagram of a display panel of a first case in an eighth embodiment of the present disclosure.

[0049] Figure 8B Structure diagram of a display panel of a second case in an eighth embodiment of the present disclosure.

[0050] Figure 9A Structure diagram of a display panel of a first case in a ninth embodiment of the present disclosure.

[0051] Figure 9B Structure diagram of a display panel of a second case in a ninth embodiment of the present disclosure.

[0052] Figure 10A A structural schematic diagram of a display panel in a first case of the tenth embodiment of the present disclosure.

[0053] Figure 10B A structural schematic diagram of a display panel in a second case of the tenth embodiment of the present disclosure.

[0054] Figure 11 A structural schematic diagram of a display panel in the eleventh embodiment of the present disclosure.

[0055] Figure 12 A structural schematic diagram of a display panel in the prior art of the present disclosure.

[0056] In the drawings, the following signs are explained as follows:

[0057] BP, driving back plate; 100, substrate; LD, light emitting device; LD1, first light emitting device; LD2, second light emitting device; 300, device body; 301, first device body; 302, second device body; 200, base; 201, first base; 202, second base; PADU1, driving pad unit; PAD11, first driving pad unit; PAD12, second driving pad unit; PADU2, device pad unit; PAD21, first device pad unit; PAD22, second device pad unit; 401, driving groove; 402, device groove; 501, first adhesive layer; 502, second adhesive layer. DETAILED DESCRIPTION

[0058] Example embodiments now will be described more fully hereinafter with reference to the accompanying drawings; however, these embodiments can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the example embodiments to those skilled in the art. Like reference numerals refer to like elements throughout the specification. Additionally, the drawings are not necessarily drawn to scale.

[0059] The terms "one", "a", "the", "said", and "at least one" are used to denote one or more elements / components / etc.; the terms "comprises", "comprising", "includes", "including" and "has" are used to mean including, but not limited to; the terms "first", "second", and "third", etc. are used only to distinguish one element / component / etc. from another, and do not limit the number of elements / components / etc.

[0060] The embodiments of the present disclosure provide a display panel, as shown in the drawing, which can include a driving back plate BP and a plurality of light emitting devices LD arranged on one side of the driving back plate BP. Figures 1 to 11 The embodiments of the present disclosure provide a display panel, as shown in the drawing, which can include a driving back plate BP and a plurality of light emitting devices LD arranged on one side of the driving back plate BP.

[0061] The display panel has a plurality of light emitting devices LD, which can be LEDs (Light Emitting Diodes) made of inorganic light emitting materials, for example, Micro LEDs (Micro Light Emitting Diodes, size not greater than 100 pm) and Mini LEDs (Mini Light Emitting Diodes, size of 100 pm to 200 pm). Of course, the light emitting devices LD can also be other light emitting devices LD suitable for the panel structure of the present disclosure, which are not particularly limited here.

[0062] Taking the light emitting device LD as an LED (Micro LED or Mini LED) for example, the light emitting device LD can include a substrate 200 and an epitaxial layer on the substrate 200. The substrate 200 can be made of sapphire, silicon carbide, etc. The epitaxial layer can include a first semiconductor layer, a light emitting functional layer, and a second semiconductor layer, etc. Each film layer in the epitaxial layer can be formed on the substrate 200 at one time through epitaxial process, wherein the first semiconductor layer can be made of gallium nitride, gallium phosphide, etc., and the specific material is determined according to the light emitting color of the light emitting device LD, and the light emitting functional layer can be a quantum well layer. In some embodiments of the present disclosure, the substrate 200 exists in the manufacturing process, and when the light emitting device LD is transferred to the driving backplane BP after the manufacturing is completed, the light emitting device LD does not have the substrate 200, i.e., the substrate 200 is peeled off from the epitaxial layer.

[0063] In order to facilitate the peeling between the substrate 200 and the epitaxial layer, a double bonding layer can be further included between the substrate 200 and the epitaxial layer to assist the peeling of the substrate 200 from the epitaxial layer. In addition, the double bonding layer can also improve the adhesion and thermal management effect between the device and the substrate 200 when the epitaxial layer is prepared on the substrate 200.

[0064] The light emitting device LD includes a device pad unit PADU2, and each device pad unit PADU2 includes at least one device pad, which can be made of a metal material, for example, copper, gold, etc. The number of device pads in each device pad unit PADU2 can be determined according to the assembly structure of the light emitting device LD.

[0065] A device pad is connected with a driving pad, and the two can be bonded by a bonding metal, for example, tin, indium, nickel, etc. The melting point of the bonding metal can be lower than that of the materials of the device pad and the driving pad. When the light emitting device LD and the driving backplane BP are bonded, the bonding can be performed in a temperature environment higher than the melting point of the bonding metal and lower than the melting point of each pad.

[0066] The display panel can further include a pixel definition layer, and each light emitting device LD is defined by the pixel definition layer. The pixel definition layer has a plurality of pixel openings, and the size of each pixel opening is the same as the size of the light emitting device LD. The shape of each pixel opening is the same as the shape of the light emitting device LD. The shape of each pixel opening can be a polygon such as a rectangle, a square, a rhombus, or a polygon with other shapes, or a circle, an ellipse, or other shapes.

[0067] In some embodiments of the present disclosure, the light emitting device LD includes at least one light emitting color, and each light emitting device LD can be divided into a plurality of light emitting units, and one light emitting unit includes a plurality of light emitting devices LD. In the present disclosure, the light emitting colors of the plurality of light emitting devices LD in the same light emitting unit can be the same or at least partially different, and the light emitting colors of the plurality of light emitting devices LD in different light emitting units can be the same or different.

[0068] For example, each light emitting device LD can include a first color light emitting device LD, a second color light emitting device LD, and a third color light emitting device LD with different light emitting colors. For example, the first color light emitting device LD is used to emit red light, the second color light emitting device LD is used to emit green light, and the third color light emitting device LD is used to emit blue light. The number of each color light emitting device LD is a plurality, but the number of light emitting devices LD of different colors can not be the same. For example, one light emitting unit includes one first color light emitting device LD, one second color light emitting device LD, and one third color light emitting device LD.

[0069] Due to different light emitting efficiencies, the thicknesses of the epitaxial layers of the light emitting devices LD of different colors are different, resulting in differences in the size and thickness of the light emitting devices LD of different colors. For example, the thickness of the epitaxial layer of the first color light emitting device LD (red light) can be 2 μm, the thickness of the epitaxial layer of the second color light emitting device LD (green light) can be 3 μm, and the thickness of the epitaxial layer of the third color light emitting device LD (blue light) can be 4 μm. Therefore, after forming the above three types of light emitting devices LD on the substrate 200, there is a thickness difference between them. In the present disclosure, the thickness difference of the light emitting device LD can be caused by the difference in the manufacturing process of the device itself, or it can be designed as a thickness difference of the device for subsequent bonding of the light emitting device LD and the driving back plate BP.

[0070] In some embodiments of the present disclosure, the display panel can further comprise a device planarization layer covering the plurality of light emitting devices LD. After the plurality of light emitting devices LD are bonded to the driving backplane BP, the device planarization layer can be filled between the plurality of light emitting devices LD to avoid the plurality of light emitting devices LD from being unevenly away from the surface of the substrate 100. The device planarization layer can be formed of an insulating material such as encapsulation glue.

[0071] In some embodiments of the present disclosure, the driving backplane BP comprises a substrate 100 and a plurality of driving pad units PADU1 on one side of the substrate 100, each pad unit comprising at least one driving pad. In some embodiments of the present disclosure, the driving backplane BP can comprise a circuit layer on the surface of the substrate 100, and the driving pads are disposed on the circuit layer. The substrate 100 can be a flat plate structure, and the material thereof can be a hard material such as glass or a flexible material such as polyimide. In addition, the substrate 100 can be a single-layer or multi-layer structure.

[0072] In some embodiments of the present disclosure, the circuit layer can comprise a driving circuit, by which the light emitting devices LD can be driven to emit light to display images. For example, the driving circuit can comprise a pixel circuit, which can be of a 7T1C, 8T1C or other structure as long as it can drive the light emitting devices LD to emit light, and the structure thereof is not specially limited herein, wherein nTmC represents that one pixel circuit comprises n thin film transistors (denoted by the letter "T") and m capacitors (denoted by the letter "C"). The number of pixel circuits can be the same as the number of light emitting devices LD, and each pixel circuit is connected to one light emitting device LD in a one-to-one correspondence. Of course, one pixel circuit can also be connected to a plurality of light emitting devices LD, which is not specially limited herein. In some embodiments of the present disclosure, the driving circuit can further comprise a peripheral circuit for inputting driving signals to the pixel circuit to control the light emitting devices LD to emit light. The peripheral circuit can comprise a gate driving circuit and a light emitting control circuit, and of course, can further comprise other circuits, and the specific structure of the peripheral circuit is not specially limited herein.

[0073] The driving backplane BP can further comprise a first planarization layer covering the circuit layer and exposing each driving pad. The first planarization layer can be formed of an insulating material such as encapsulation glue to insulate each driving pad from each other.

[0074] The pad driving unit is disposed on the circuit layer, and the light emitting devices LD can be connected to the circuit layer through the driving pads in the pad driving unit. Each driving pad unit PADU1 comprises at least one driving pad, which can be made of a metal material such as copper or gold. The number of driving pads in each driving pad unit PADU1 can be determined according to the assembly structure of the light emitting devices LD. For example, the light emitting devices LD can adopt one of a vertical structure and a flip-chip structure.

[0075] In some embodiments of the present disclosure, taking a vertical structure as an example, the first electrode of the light emitting device LD is stacked on the driving back plate BP, and the substrate 200, the epitaxial layer and the second electrode are sequentially distributed in a direction away from the driving back plate BP. The first electrode can be directly connected with the driving circuit, and the second electrode can be connected with the driving circuit through a lead wire. Only one device pad needs to be arranged on the first electrode on one light emitting device LD, that is, the number of device pads in each device pad unit PADU2 is one, and the device pad is connected with the driving pad on the driving back plate BP to achieve the electrical connection between the light emitting device LD and the driving back plate BP.

[0076] In some embodiments of the present disclosure, taking a flip structure as an example, the first electrode and the second electrode of the light emitting device LD can be provided on the driving back plate BP in the same layer, and the substrate 200 and the epitaxial layer can be sequentially distributed in a direction away from the driving back plate BP. At the same time, the first electrode and the second electrode can be directly connected with the driving circuit. The device pad needs to be arranged on both the first electrode and the second electrode on one light emitting device LD, that is, the number of device pads in each device pad unit PADU2 is two, and each device pad is connected with the corresponding driving pad on the driving back plate BP to achieve the electrical connection between the light emitting device LD and the driving back plate BP.

[0077] The first electrode and the second electrode described above can adopt a transparent conductive material such as ITO (indium zinc oxide) or IZO (indium tin oxide), so that the first electrode and the second electrode can be light-transmissive. Of course, the materials of the first electrode and the second electrode can also include titanium, aluminum, silver, gold and the like. The first electrode and the second electrode can adopt a single-layer or multi-layer structure, and the materials of different layers can be different.

[0078] The inventors found that, in order to improve the manufacturing efficiency of the device, high-density light emitting devices LD are usually formed on the substrate 200, and then the light emitting devices LD are bonded and connected with the driving back plate BP. However, since the bonding yield is affected by factors including bonding pressure, and the bonding equipment usually provides a constant pressure, the bonding pressure borne by each light emitting device LD is related to the area ratio of the single light emitting device LD, that is,

[0079]

[0080] According to the above relationship, as shown in FIG. 6, when the multiple light emitting devices LD are arranged in a low density on the substrate 200 (i.e., the area ratio of the light emitting device LD is small), the bonding pressure of the light emitting device LD is large, which can ensure that each light emitting device LD and the driving back plate BP form a good bonding form. As shown in FIG. 7, when the multiple light emitting devices LD are arranged in a high density on the substrate 200 (i.e., the area ratio of the light emitting device LD is large), the bonding pressure of the light emitting device LD is small, which can cause the light emitting device LD and the driving back plate BP to form a poor bonding form. Figure 12 Figure 12 ​As shown, when the plurality of light emitting devices LD are arranged in high density on the substrate 200 (i.e., the light emitting device LD area ratio is large), the light emitting device LD bonding pressure is small, which cannot guarantee that each light emitting device LD can form a good bond with the driving back plate BP, resulting in a bonding defect, which affects the structural performance of the display panel.

[0081] In order to improve the bonding pressure between each light emitting device LD and the driving back plate BP and avoid bonding defects, the one-time high-density light emitting device LD can be formed into multiple batches of low-density light emitting device LD to bond with the driving back plate BP, thereby improving the bonding pressure of each light emitting device LD and the driving back plate BP in each batch bonding process.

[0082] In the present disclosure, high density can refer to a pixel density greater than 300 PPI (Pixels Per Inch), and low density can refer to a pixel density less than or equal to 300 PPI. However, the boundary between high density and low density is not limited to the above-mentioned value, and can be adjusted according to the specific device structure and application.

[0083] In order to improve the single bonding pressure, the display panel needs to meet at least one of the following three conditions: the first condition is that at least two driving pad units PADU1 are distributed away from the surface of the substrate 100 in a direction away from the substrate 100; the second condition is that at least two device pad units PADU2 are distributed away from the surface of the substrate 100 in a direction away from the substrate 100; and the third condition is that at least two device bodies 300 are distributed away from the surface of the substrate 100 in a direction away from the substrate 100. By coordinating the position and position relationship of the surface of each device body 300, the surface of each device pad, and the surface of each driving pad, and by using the surface of at least part of the device body 300, the device pad, and the driving pad not being coplanar at the same time, the plurality of light emitting devices LD and the driving back plate BP are bonded in batches, the bonding density of the light emitting device LD is reduced, the bonding pressure of each light emitting device LD is improved, the bonding defects are reduced, and the overall bonding yield is improved.

[0084] The following will be described in detail:

[0085] The plurality of light emitting devices LD can include a plurality of first light emitting devices LD1 and a plurality of second light emitting devices LD2, and the first light emitting devices LD1 and the second light emitting devices LD2 are respectively bonded to the driving back plate BP through different batches. The plurality of driving pad units PADU1 includes a first driving pad unit PAD11 and a second driving pad unit PAD12. The first light emitting device LD1 includes a first device body 301 and a first device pad unit PAD21, and a first device pad unit PAD21 is connected to a first driving pad unit PAD11; the second light emitting device LD2 includes a second device body 302 and a second device pad unit PAD22, and a second device pad unit PAD22 is connected to a second driving pad unit PAD12.

[0086] Of course, in the embodiments provided in the present disclosure, a plurality of third light emitting devices LD can also be included, and the third light emitting devices LD are respectively bonded to the driving back plate BP through different batches from the first light emitting devices LD1 and the second light emitting devices LD2. The third light emitting devices LD and the bonding structure are the same as the first light emitting devices LD1, and will not be described in detail here. In addition, the first, second and third only refer to light emitting devices LD bonded through different batches, and the specific structure of the light emitting device LD is as described above.

[0087] The first light emitting devices LD1, the second light emitting devices LD2 and the third light emitting devices LD can be light emitting devices LD of the same color, or light emitting devices LD of different colors. For example, the first light emitting devices LD1, the second light emitting devices LD2 and the third light emitting devices LD are all one of red, green and blue; or two of them are of the same color; or the three light emitting devices LD are of different colors.

[0088] In the embodiments provided in the present disclosure, when the light emitting device LD includes two or three light emitting colors, the thickness of the device body 300 of the plurality of light emitting devices LD of the same light emitting color is the same, the thickness of the pad of the plurality of light emitting devices LD of the same light emitting color is the same, and the thickness of the pad of the driving pad unit PADU1 corresponding to the connection of the device body 300 of the plurality of light emitting devices LD of the same light emitting color is the same.

[0089] In this paper, the upper surface (the side away from the substrate) and the lower surface (the side close to the substrate) of each pad (including each device pad and each driving pad) can be a plane or a non-plane. Due to the limitation of the manufacturing process, the upper and lower surfaces of the pad can be inclined or uneven, and the thickness of the pad at different positions can be different. Therefore, in order to facilitate the comparison of the thickness relationship between the pads, the thickness of the pad in the following embodiments refers to the vertical distance between the point on the lower surface of the pad closest to the substrate and the point on the upper surface of the pad farthest from the substrate in the direction perpendicular to the substrate.

[0090] In addition, in the present disclosure, the upper surface and the lower surface of each pad can be strictly parallel or non-strictly parallel. Due to process limitations, the upper and lower surfaces of the pad can have a certain angle, which can be less than or equal to 5°. Within the above range, the upper and lower surfaces of the pad can be considered parallel.

[0091] In the embodiments provided in the present disclosure, the surfaces of the at least two driving pad units PADU1 close to the substrate 100 are not coplanar. A first adhesive layer 501 can be formed on the surface of the driving back plate BP, a plurality of driving grooves 401 (or a first boss structure) can be formed on the first adhesive layer 501. When the driving pads are subsequently formed, at least part of the driving pads are located in the driving grooves 401 of the adhesive layer (or on the surface of the first boss structure), and at least part of the driving pads are located on the surface of the first adhesive layer 501, so that the lower surfaces of at least part of the driving pads are not coplanar.

[0092] In the embodiments provided in the present disclosure, the surfaces of the at least two device bodies 300 close to the substrate 100 are not coplanar on the base 200. A second adhesive layer 502 can be formed on the surface of the base 200, a plurality of device grooves 402 (or a second boss structure) can be formed on the second adhesive layer 502. When the device bodies 300 are subsequently formed, at least part of the device bodies 300 are located in the device grooves 402 of the adhesive layer (or on the surface of the second boss structure), and at least part of the device bodies 300 are located on the surface of the second adhesive layer 502, so that the upper surfaces of at least part of the device bodies 300 are not coplanar on the base 200.

[0093] The following is an example of taking the first light emitting device LD1 and the second light emitting device LD2 as the same color, and the light emitting device LD as a vertical structure, that is, each driving pad unit PADU1 includes one driving pad, the thicknesses of the two driving pads in each driving unit are the same, each device pad unit PADU2 includes one device pad, and the thicknesses of the two device pads in each device pad are the same.

[0094] It should be noted that if the light emitting device LD adopts a flip structure, each driving pad unit PADU1 includes two driving pads, the thicknesses of the two driving pads in each driving unit are the same, each device pad unit PADU2 includes two device pads, the thicknesses of the two device pads in each device pad are the same, and one driving pad and one device pad are connected correspondingly. The following embodiments of the present disclosure include both the vertical structure and the flip structure of the light emitting device LD, and the bonding modes of the driving pads and the device pads in the two structures are the same.

[0095] In the first embodiment, as shown in FIG. 1, the first light emitting device LD1 and the second light emitting device LD2 are the same color, and the light emitting device LD adopts a vertical structure. Figure 1As shown, when the display panel satisfies the first condition, the at least two driving pad units PADU1 are flush with the surface of the substrate 100, and the thicknesses of the pads of the at least two driving pad units PADU1 are different.

[0096] In the display panel, when the lower surfaces (the surfaces close to the substrate 100, hereinafter referred to as such) of the first driving pad unit PAD11 and the second driving pad unit PAD12 are flush, if the upper surfaces (the surfaces away from the substrate 100, hereinafter referred to as such) of the first driving pad unit PAD11 and the second driving pad unit PAD12 are required to be distributed along the direction of the substrate 100, the thicknesses of the first driving pad unit PAD11 and the second driving pad unit PAD12 are required to be different, so that the upper surfaces of the driving pads in the first driving pad unit PAD11 and the second driving pad unit PAD12 have a height difference, i.e., the thickness of the pad of the first driving pad unit PAD11 is smaller than the thickness of the pad of the second driving pad unit PAD12.

[0097] In order to satisfy the requirement that the upper surfaces of the first device body 301 and the second device body 302 are flush, the upper surfaces of the first device pad unit PAD21 and the second device pad unit PAD22 are flush, i.e., the thickness of the pad of the first device pad unit PAD21 is greater than the thickness of the pad of the second device pad unit PAD22, and the thickness of the first device body 301 is the same as the thickness of the second device body 302.

[0098] Meanwhile, to satisfy the requirement that the bonding pressure of the first light emitting device LD1 and the driving back plate BP is smaller than the bonding pressure of the second light emitting device LD2 and the driving back plate BP, the following method can be adopted:

[0099] In the first case, a plurality of device grooves 402 corresponding to the first light emitting device LD1 are formed on the second substrate 202, and the second light emitting device LD2 is formed on the surface of the second substrate 202 and at a position different from the device grooves 402; after the first light emitting device LD1 is formed on the first substrate 201 and bonded to the first driving pad unit PAD11, the first substrate 201 is removed; after the device grooves 402 are corresponded to the first light emitting device LD1 one by one, the second light emitting device LD2 is bonded to the second driving unit, and then the second substrate 202 is removed. Due to the existence of the device grooves 402, when the second light emitting device LD2 is bonded to the driving back plate BP, the upper surface of the first light emitting device LD1 can be located in the groove, so that the bonding pressure of the second light emitting device LD2 is greater than the bonding pressure of the first light emitting device LD1, thereby improving the bonding yield.

[0100] In the second case, the first light emitting device LD1 and the second light emitting device LD2 are formed on the same substrate 200, wherein the first light emitting device LD1 is formed on the surface of the substrate 200, and a plurality of first convex structures can be formed on the substrate 200, and a second light emitting device LD2 is formed on the surface of each first convex structure. When the first light emitting device LD1 and the second light emitting device LD2 are bonded, due to the formation of the first convex structure, the bonding pressure of the second light emitting device LD2 is greater than that of the first light emitting device LD1 when the light emitting device LD is bonded to the driving backboard BP, thereby improving the bonding yield.

[0101] After the plurality of first light emitting devices LD1 are connected to the driving backboard BP by bonding the first driving pad unit PAD11 to the first device pad unit PAD21, the first substrate 201 (on which the plurality of first light emitting devices LD1 are located) is peeled off. Then, after the plurality of second light emitting devices LD2 are connected to the driving backboard BP by bonding the second driving pad unit PAD12 to the second device pad unit PAD22, the second substrate 202 (on which the plurality of second light emitting devices LD2 are located) is peeled off. In this way, the density of the light emitting device LD is reduced during each bonding process, and the bonding pressure of each light emitting device LD is improved. The density of the first light emitting device LD1 on the first substrate 201 can be less than or equal to 300 PPI, for example, 300 PPI, 250 PPI, 200 PPI, 150 PPI, 100 PPI, 50 PPI, or even less. In addition, the plurality of first light emitting devices LD1 can be uniformly distributed on the driving backboard BP, or can be arranged in different regions of the substrate 100 with different distribution densities, which can be selected according to specific needs. In addition, the density of the second light emitting device LD2 on the second substrate 202 and the arrangement form on the driving backboard BP are the same as or similar to those of the first light emitting device LD1.

[0102] The first substrate 201 and the second substrate 202 in this embodiment can be the same substrate 200 or different substrates 200. In order to recycle resources, the same substrate 200 can be repeatedly used to grow different batches of light emitting devices LD until the substrate 200 is no longer suitable for forming light emitting devices LD.

[0103] In the following embodiments, the bonding process and method of the driving pad and the device pad are the same as or similar to those of the first embodiment, and will not be described again.

[0104] In the second embodiment, as shown in FIG. 2B, the first light emitting device LD1 and the second light emitting device LD2 are formed on the same substrate 200, wherein the first light emitting device LD1 is formed on the surface of the substrate 200, and a plurality of first convex structures can be formed on the substrate 200, and a second light emitting device LD2 is formed on the surface of each first convex structure. Figure 2As shown in the display panel, when the first condition and the third condition are met, that is, the upper surfaces of the first driving pad unit PAD 11 and the second driving pad unit PAD 12 are distributed along the direction of the substrate 100, the upper surfaces of the first device pad unit PAD 21 and the second device pad unit PAD 22 are flush, and the upper surfaces of the first device body 301 and the second device body 302 are distributed along the direction of the substrate 100.

[0105] On the basis of the first embodiment, the pad thicknesses of the first device pad unit PAD 21 and the second device pad unit PAD 22 can be the same or different. When the pad thicknesses of the first device pad unit PAD 21 and the second device pad unit PAD 22 are different, if the upper surface of the first device pad unit PAD 21 is lower than the upper surface of the second device pad unit PAD 22, the pad thickness of the first device pad unit PAD 21 needs to be smaller than the pad thickness of the second device pad unit PAD 22.

[0106] The formation manner, structure, and bonding process of the first light-emitting device LD 1 and the second light-emitting device LD 2 on the substrate 200 in the second embodiment are the same as or similar to those in the first embodiment, and will not be described in detail here.

[0107] In the third embodiment, as shown in the display panel, Figure 3 As shown in the display panel, when the first condition and the third condition are met, that is, the upper surfaces of the first driving pad unit PAD 11 and the second driving pad unit PAD 12 are distributed along the direction of the substrate 100, the upper surfaces of the first device pad unit PAD 21 and the second device pad unit PAD 22 are flush, and the upper surfaces of the first device body 301 and the second device body 302 are distributed along the direction of the substrate 100.

[0108] On the basis of the first embodiment, the pad thicknesses of the first device pad unit PAD 21 and the second device pad unit PAD 22 are different. When the upper surface of the first device pad unit PAD 21 is flush with the upper surface of the second device pad unit PAD 22, the pad thickness of the first device pad unit PAD 21 needs to be smaller than the pad thickness of the second device pad unit PAD 22, that is, the sum of the thicknesses of the first driving pad and the first device pad is equal to the sum of the thicknesses of the second driving pad and the second device pad. At the same time, the thicknesses of the first device body 301 and the second device body 302 can be different, so as to ensure that the upper surfaces of the first device body 301 and the second device body 302 are not coplanar. Further, the thickness of the first device body 301 can be smaller than the thickness of the second device body 302.

[0109] In the fourth embodiment, as shown in the display panel, Figure 4As shown, when the display panel satisfies the first condition, the at least two driving pad units PADU1 are distributed along the direction close to the surface of the substrate 100, and the thicknesses of the pads of the plurality of driving pad units PADU1 are the same. In the display panel, when the lower surfaces of the first driving pad unit PAD 11 and the second driving pad unit PAD 12 are not coplanar, if the upper surfaces of the first driving pad unit PAD 11 and the second driving pad unit PAD 12 are required to be distributed along the direction of the substrate 100 (not coplanar), the thicknesses of the first driving pad unit PAD 11 and the second driving pad unit PAD 12 can be made the same, so that the upper surfaces of the driving pads in the first driving pad unit PAD 11 and the second driving pad unit PAD 12 have a height difference. At the same time, the upper surfaces of the first device body 301 and the second device body 302 are flush, and the upper surfaces of the first device pad unit PAD 21 and the second device pad unit PAD 22 are flush, that is, the thicknesses of the first device body 301 and the second device body 302 are the same, and the thicknesses of the pads in the first device pad unit PAD 21 and the second device pad unit PAD 22 are different.

[0110] Specifically, the upper surface of the first driving pad unit PAD 11 is lower than the upper surface of the second driving pad unit PAD 12, and thus the thickness of the pad of the first device pad unit PAD 21 needs to be greater than the thickness of the pad of the second device pad unit PAD 22. In addition, the relative positional relationship between the substrate 200 and the light-emitting device LD needs to be as shown in the first embodiment, so as to ensure that the bonding pressure between the second light-emitting device LD 2 and the driving backplate BP is greater than the bonding pressure between the first light-emitting device LD 1 and the driving backplate BP.

[0111] In the fifth embodiment, as shown, Figure 5 when the display panel satisfies both the first condition and the second condition, that is, the upper surfaces of the first device pad unit PAD 21 and the second device pad unit PAD 22 are distributed along the direction of the substrate 100, the upper surfaces of the first driving pad unit PAD 11 and the second driving pad unit PAD 12 are distributed along the direction of the substrate 100, and the upper surfaces of the first device body 301 and the second device body 302 are flush.

[0112] On the basis of the fourth embodiment, the thicknesses of the pads of the at least two device pad units PADU2 are the same or different. Specifically, the thicknesses of the pads of the first driving pad unit PAD 11 and the second driving pad unit PAD 12 are the same, and the thickness of the pad of the first device pad unit PAD 21 can be equal to the thickness of the pad of the second device driving pad unit PADU1, and the thickness of the first device body 301 is less than (or greater than) the thickness of the second device body 302.

[0113] In the sixth embodiment, as shown, Figure 6As shown, when the display panel simultaneously satisfies the first condition and the third condition, that is, the upper surfaces of the first driving pad unit PAD11 and the second driving pad unit PAD12 are distributed along the direction of the substrate 100, the upper surfaces of the first device pad unit PAD21 and the second device pad unit PAD22 are flush, and the upper surfaces of the first device body 301 and the second device body 302 are distributed along the direction of the substrate 100.

[0114] Based on the fourth embodiment, the pads of at least two device pad units PADU2 have different thicknesses; the thicknesses of at least two device bodies 300 are different. Specifically, the pad thickness of the first driving pad unit PAD11 is equal to the pad thickness of the second driving pad unit PAD12. The pad thickness of the first device pad unit PAD21 can be greater than the pad thickness of the second device pad unit PAD22, so that the upper surface of the first device pad unit PAD21 is lower than the upper surface of the second device pad unit PAD22. At this time, the thickness of the first device body 301 is less than the thickness of the second device body 302, so that the upper surface of the first device body 301 is lower than the upper surface of the second device body 302.

[0115] In the seventh embodiment, such as Figure 7A and Figure 7B As shown, when the display panel meets the second condition, that is, the upper surfaces of at least two device pad units PADU2 are not coplanar, at the same time, the upper surfaces of at least two drive pad units PADU1 are coplanar, the upper surfaces of at least two device bodies 300 are coplanar, and the pad thicknesses of at least two device pad units PADU2 are different.

[0116] Furthermore, the pad thickness of the first driving pad unit PAD11 can be greater than or equal to the pad thickness of the second driving pad unit PAD12, the pad thickness of the first device pad unit PAD21 is less than the pad thickness of the second device pad unit PAD22, and the thickness of the first device body 301 can be greater than the thickness of the second device body 302.

[0117] In the first case, such as Figure 7A As shown, if the lower surfaces of the first driving pad unit PAD11 and the second driving pad unit PAD12 are flush, the pad thickness of the first driving pad unit PAD11 is equal to the pad thickness of the second driving pad unit PAD12, the pad thickness of the first device pad unit PAD21 is less than the pad thickness of the second device pad unit PAD22, and the thickness of the first device body 301 is greater than the thickness of the second device body 302.

[0118] The second scenario, such as Figure 7BAs shown, if the lower surfaces of the first driving pad unit PAD 11 and the second driving pad unit PAD 12 are not coplanar, the pad thickness of the first driving pad unit PAD 11 can be greater than the pad thickness of the second driving pad unit PAD 12, the pad thickness of the first device pad unit PAD 21 is less than the pad thickness of the second device pad unit PAD 22, and the thickness of the first device body 301 is greater than the thickness of the second device body 302.

[0119] It is explained herein that when the pad thickness of the first driving pad unit PAD 11 is greater than the pad thickness of the second driving pad unit PAD 12 and the upper surfaces of the two are flush, the first driving pad unit PAD 11 can be disposed in the driving groove 401 formed on the driving back plate BP to ensure that the upper surface of the first driving pad is flush with the upper surface of the second driving pad.

[0120] In the eighth embodiment, as shown in Figure 8A and Figure 8B When the display panel satisfies the third condition, i.e., the surfaces of the at least two driving pad units PADU1 away from the substrate 100 are flush; the surfaces of the at least two device pad units PADU2 away from the substrate 100 are flush; and the surfaces of the at least two device bodies 300 away from the substrate 100 are distributed in the direction away from the substrate 100.

[0121] The first case, as shown in Figure 8A When the surfaces of the at least two driving pad units PADU1 close to the substrate 100 are distributed in the direction close to the substrate 100, the pad thicknesses of the at least two driving pad units PADU1 are different. Specifically, if the lower surface of the first driving pad unit PAD 11 is not coplanar with the lower surface of the second driving pad unit PAD 12, the pad thickness of the first driving pad unit PAD 11 is greater than the pad thickness of the second driving pad unit PAD 12, the pad thickness of the first device pad unit PAD 21 is equal to the pad thickness of the second device pad unit PAD 22, and the thickness of the first device body 301 can be greater than or less than the thickness of the second device body 302.

[0122] The second case, as shown in Figure 8B When the surfaces of the at least two driving pad units PADU1 close to the substrate 100 are flush, the pad thicknesses of the at least two driving pad units PADU1 are the same. Specifically, if the lower surface of the first driving pad unit PAD 11 is coplanar with the lower surface of the second driving pad unit PAD 12, the pad thickness of the first driving pad unit PAD 11 is equal to the pad thickness of the second driving pad unit PAD 12, the pad thickness of the first device pad unit PAD 21 is equal to the pad thickness of the second device pad unit PAD 22, and the thickness of the first device body 301 can be greater than or less than the thickness of the second device body 302.

[0123] In the ninth embodiment, as shown in Figure 9A and Figure 9B , when the display panel simultaneously satisfies the second condition and the third condition, that is, the lower surfaces of the plurality of driving pad units PADU1 are flush with the surface of the substrate 100; the plurality of device pad units PADU2 are distributed along the direction away from the substrate 100 away from the surface of the substrate 100; and the plurality of device bodies 300 are distributed along the direction away from the substrate 100 away from the surface of the substrate 100.

[0124] In the case that the lower surfaces of the plurality of driving pad units PADU1 are flush, comprising:

[0125] The first case, as shown in Figure 9A , the pad thickness of the first driving pad unit PAD11 is the same as that of the second driving pad unit PAD12, the pad thickness of the first device pad unit PAD21 is less than (or greater than) that of the second device pad unit PAD22, and the thickness of the first device body 301 is less than (or greater than) that of the second device body 302.

[0126] The second case, as shown in Figure 9B , the pad thickness of the first driving pad unit PAD11 is the same as that of the second driving pad unit PAD12, the pad thickness of the first device pad unit PAD21 is less than (or greater than) that of the second device pad unit PAD22, and the thickness of the first device body 301 is equal to that of the second device body 302.

[0127] In the tenth embodiment, as shown in Figure 10A and Figure 10B , when the display panel simultaneously satisfies the second condition and the third condition, that is, the lower surfaces of the plurality of driving pad units PADU1 are flush with the surface of the substrate 100; the plurality of device pad units PADU2 are distributed along the direction away from the substrate 100 away from the surface of the substrate 100; and the plurality of device bodies 300 are distributed along the direction away from the substrate 100 away from the surface of the substrate 100.

[0128] In the case that the lower surfaces of the plurality of driving pad units PADU1 are not flush, comprising:

[0129] The first case, as shown in Figure 10A , the pad thickness of the first driving pad unit PAD11 is greater than that of the second driving pad unit PAD12, the pad thickness of the first device pad unit PAD21 is less than (or greater than) that of the second device pad unit PAD22, and the thickness of the first device body 301 is less than (or greater than) that of the second device body 302.

[0130] The second case, as shown in Figure 10BAs shown, the pad thickness of the first driving pad unit PAD11 is greater than that of the second driving pad unit PAD12, the pad thickness of the first device pad unit PAD21 is less than (or greater than) that of the second device pad unit PAD22, and the thickness of the first device body 301 is equal to that of the second device body 302.

[0131] In the eleventh embodiment, as shown, the display surface simultaneously satisfies the first condition, the second condition and the third condition, i.e., the at least two driving pad units PADU1 are distributed in a direction away from the surface of the substrate 100, the at least two device pad units PADU2 are distributed in a direction away from the surface of the substrate 100, and the at least two device bodies 300 are distributed in a direction away from the surface of the substrate 100. Figure 11

[0132] Further, the pads of the plurality of driving pad units PADU1 have the same thickness, the pads of the plurality of device pad units PADU2 have the same thickness, the plurality of device bodies 300 have the same thickness, and the at least two driving pad units PADU1 are distributed in a direction close to the surface of the substrate 100. Specifically, the pad thickness of the first driving pad unit PAD11 is equal to that of the second driving pad unit PAD12, the pad thickness of the first device pad unit PAD21 is equal to that of the second device pad unit PAD22, the thickness of the first device body 301 is equal to that of the second device body 302, and the lower surface of the first driving pad unit PAD11 is not coplanar with the lower surface of the second driving pad unit PAD12.

[0133] In the above-mentioned various embodiments, only the case that the two light emitting devices LD have the same light emitting color is taken as an example. When the light emitting device LD includes two or more light emitting colors, the bonding process and structure arrangement can be analogous to the above-mentioned embodiments. Different colors of light emitting devices LD can be bonded with different batches of driving backplanes BP, so as to reduce the density of the light emitting devices LD in each bonding, improve the bonding pressure of each light emitting device LD, and thus improve the bonding yield.

[0134] ​In the embodiments provided in the present disclosure, the pad thickness difference of the driving pad unit PADU1, the pad thickness difference of the device pad unit PADU2, and the thickness difference of the light emitting device LD can be 0.5-3 μm, for example, can be 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, or 3 μm, etc. The size of each thickness difference should not be too small to ensure that the bonding pressure can be improved when bonding the light emitting devices LD and the driving back plate BP of different batches; the size of each thickness difference should not be too large to ensure that the assembly relationship between the components of the display panel is not affected and the assembly accuracy of the display panel is ensured. Of course, the above-mentioned thickness differences can be adaptively adjusted according to the specific structure and size of the light emitting device LD and the driving back plate BP to match the overall size requirement.

[0135] The display panel provided in the present disclosure can coordinate and adjust the relative position relationship between the surface of each device body 300, the surface of each device pad, and the surface of each driving pad, that is, the thickness of each device body 300, each device pad, and each driving pad is changed, so that the surface of at least part of the device body 300, the surface of the device pad, and the surface of the driving pad are not coplanar at the same time, the device body 300 or the driving back plate BP forms a height difference, the multiple light emitting devices LD and the driving back plate BP are bonded in batches, the bonding density of the light emitting device LD is reduced, the bonding pressure of each light emitting device LD is improved, the bonding defects are reduced, and thus the overall bonding yield is improved.

[0136] The present disclosure also provides a manufacturing method of a display panel, which comprises:

[0137] forming a driving back plate, the driving back plate comprising a substrate and a plurality of first driving pad units and a plurality of second driving pad units on one side of the substrate, each first driving pad unit comprising at least one first driving pad, and each second driving pad unit comprising at least one second driving pad;

[0138] forming a plurality of device recesses on a substrate, and forming a plurality of first light emitting devices in each device recess, the first light emitting device comprising a first device body and a first device pad unit on one side of the first device body, and each first device pad unit comprising at least one first device pad;

[0139] bonding each first light emitting device and the driving back plate through a first device pad and a first driving pad;

[0140] removing the substrate;

[0141] forming a plurality of second light emitting devices on the surface of the substrate, the second light emitting device comprising a second device body and a second device pad unit on one side of the second device body, and each second device pad unit comprising at least one second device pad;

[0142] Each second light emitting device is bonded to the driving backplane by connecting with a second device pad and a second driving pad.

[0143] The manufacturing method provided by the present disclosure can be applied to the manufacturing of the panel structure provided by each of the embodiments described above by adaptive deformation, which will not be described one by one here.

[0144] The present disclosure also provides a display device, which can include a display panel, the display panel being the display panel of any of the embodiments described above, the specific structure and beneficial effects of which can be referred to the embodiments of the display panel described above, which will not be described here again. The display device of the present disclosure can be a mobile phone, a tablet computer, a television or other electronic device with display function, which will not be listed one by one here.

[0145] Other embodiments of the present disclosure will be readily apparent to those skilled in the art upon considering the specification and the practice of the disclosed application. The present application is intended to cover any variations, uses or adaptive changes of the present disclosure following the general principles of the present disclosure and including common knowledge or conventional technical means in the art which are not disclosed by the present disclosure. The specification and examples are only considered as exemplary, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A display panel, characterized in that, include: A driving backplane, the driving backplane including a substrate and a plurality of driving pad units located on one side of the substrate, each driving pad unit including at least one driving pad; Multiple light-emitting devices, each light-emitting device including a device body and a device pad unit located on one side of the device body, each device pad unit including at least one device pad, and one device pad being connected to one driving pad; The display panel satisfies at least one of the following three conditions: The first condition is that at least two of the driving pad units are distributed on surfaces away from the substrate in a direction away from the substrate; The second condition is that at least two of the device pad units are distributed on the surface away from the substrate in a direction away from the substrate; The third condition is that at least two surfaces of the device body away from the substrate are distributed in a direction away from the substrate.

2. The display panel according to claim 1, characterized in that, When the display panel satisfies the first condition, at least two of the driving pad units are flush with the surface of the substrate, and the pads of at least two of the driving pad units have different thicknesses, while the pads of the same driving pad unit have the same thickness.

3. The display panel according to claim 2, characterized in that, When the display panel also satisfies the second condition, the thickness of the pads of at least two of the device pad units is the same or different, and the thickness of at least two of the device bodies is different.

4. The display panel according to claim 2, characterized in that, When the display panel also satisfies the third condition, the thickness of the pads of at least two of the device pad units is different; the thickness of at least two of the device bodies is different; and the thickness of at least two of the device bodies is different.

5. The display panel according to claim 1, characterized in that, When the display panel satisfies the first condition, at least two of the driving pad units are distributed on the surface of the substrate in a direction close to the substrate, and the pads of the plurality of driving pad units have the same thickness, and the pads of the same driving pad unit have the same thickness.

6. The display panel according to claim 5, characterized in that, When the display panel also satisfies the second condition, the thickness of the pads of at least two of the device pad units is the same or different, and the thickness of at least two of the device bodies is different.

7. The display panel according to claim 5, characterized in that, When the display panel also satisfies the third condition, the thickness of the pads of at least two of the device pad units is different; and the thickness of at least two of the device bodies is different.

8. The display panel according to claim 1, characterized in that, When the display panel satisfies the second condition, the pads of at least two of the device pad units have different thicknesses, and the pads of the same device pad unit have the same thickness.

9. The display panel according to claim 1, characterized in that, When the display panel satisfies the third condition, at least two of the driving pad units are distributed on the surface of the substrate in a direction close to the substrate, the pads of the at least two driving pad units have different thicknesses, and the thicknesses of the at least two device bodies are different.

10. The display panel according to claim 1, characterized in that, When the display panel satisfies the third condition, at least two of the driving pad units are flush with the surface of the substrate, at least two of the driving pad units have the same pad thickness, and at least two of the device bodies have different thicknesses.

11. The display panel according to claim 1, characterized in that, When the display panel simultaneously satisfies the second condition and the third condition, the surfaces of the plurality of driving pad units are flush with the substrate, and the pads of the plurality of driving pad units have the same thickness; the pads of at least two of the device pad units have different thicknesses, and the bodies of at least two of the devices have different thicknesses.

12. The display panel according to claim 1, characterized in that, When the display panel simultaneously satisfies the second condition and the third condition, the surfaces of the plurality of driving pad units are flush with the substrate, and the pads of the plurality of driving pad units have the same thickness; the pads of at least two of the device pad units have different thicknesses, and the thickness of the plurality of device bodies is the same.

13. The display panel according to claim 1, characterized in that, When the display panel simultaneously satisfies the second condition and the third condition, at least two of the driving pad units are distributed on the surface of the substrate in a direction close to the substrate, the pads of at least two of the driving pad units have different thicknesses, and the pads of the same driving pad unit have the same thickness; the pads of at least two of the device pad units have different thicknesses, and the bodies of at least two of the devices have different thicknesses.

14. The display panel according to claim 1, characterized in that, When the display panel simultaneously satisfies the second condition and the third condition, at least two of the driving pad units are distributed on the surface of the substrate in a direction close to the substrate, the pads of at least two of the driving pad units have different thicknesses, and the pads of the same driving pad unit have the same thickness; the pads of at least two of the device pad units have different thicknesses, and the multiple device bodies have the same thickness.

15. The display panel according to claim 1, characterized in that, When the display panel simultaneously satisfies the first condition, the second condition, and the third condition, the pads of the plurality of driving pad units have the same thickness, the pads of the plurality of device pad units have the same thickness, and the body of the plurality of devices has the same thickness; and at least two of the pad units are distributed along the direction close to the substrate on their surfaces.

16. The display panel according to any one of claims 1-15, characterized in that, The display panel also includes a device planarization layer that covers a plurality of the light-emitting devices.

17. The display panel according to any one of claims 1-15, characterized in that, Each of the light-emitting devices includes at least one light-emitting color; When the light-emitting device includes multiple light-emitting colors, the thickness of the device body of multiple light-emitting devices of the same light-emitting color is the same, the thickness of the device pads of multiple light-emitting devices of the same light-emitting color is the same, and the thickness of the pads of the driving pad units connected to the multiple light-emitting devices of the same light-emitting color is the same.

18. A method for manufacturing a display panel, characterized in that, include: A driving backplane is formed, the driving backplane including a substrate and a plurality of first driving pad units and a plurality of second driving pad units located on one side of the substrate, each first driving pad unit including at least one first driving pad, and each second driving pad unit including at least one second driving pad. Multiple device recesses are formed on a substrate, and multiple first light-emitting devices are formed in each of the device recesses. Each first light-emitting device includes a first device body and a first device pad unit located on one side of the first device body. Each first device pad unit includes at least one first device pad. Each of the first light-emitting devices is bonded to the driving backplane by connecting a first device pad to a first driving pad; Remove the substrate; A plurality of second light-emitting devices are formed on the surface of the substrate. Each second light-emitting device includes a second device body and a second device pad unit located on one side of the second device body. Each second device pad unit includes at least one second device pad. Each of the second light-emitting devices is bonded to the driving backplane by connecting a second device pad to a second driving pad.

19. A display device, characterized in that, Includes the display panel as described in any one of claims 1-18.

Images