Surface treatment apparatus for producing cmp polishing pad

By employing a sliding design and dynamic speed adjustment of the polishing roller in the CMP polishing pad production equipment, combined with a swingable clamping fixture, the problems of uneven substrate surface treatment and fixture obstruction are solved, achieving full coverage and efficient polishing effect.

CN120901830BActive Publication Date: 2026-06-02GUANG DONG JUN DA JING MI KE JI YOU XIAN GONG SI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GUANG DONG JUN DA JING MI KE JI YOU XIAN GONG SI
Filing Date
2025-07-29
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing CMP polishing pad production equipment suffers from problems such as a single treatment method, unevenness, and fixture obstruction affecting the effective treatment area when treating substrate surfaces, thus impacting polishing effect and efficiency.

Method used

The polishing roller is slidably mounted on the vertically intersecting drive shafts. Combined with the same-direction and opposite-direction rotation modes, the rotation speed is dynamically adjusted. With the help of the swingable clamping fixture, the entire area can be processed without dead angles.

Benefits of technology

It achieves full coverage and improved uniformity of the polishing pad substrate, thereby improving processing efficiency and quality and adapting to the needs of workpieces in different initial states.

✦ Generated by Eureka AI based on patent content.

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    Figure CN120901830B_ABST
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Abstract

The application belongs to the technical field of chemical mechanical polishing, and discloses a surface treatment equipment for CMP polishing pad production, which comprises a polishing roller; the polishing roller is provided with a driving shaft, the axis of the driving shaft intersects and is perpendicular to the rotating shaft of a rotating platform, and the polishing roller is slidingly arranged on the driving shaft; through the position change of the polishing roller on the driving shaft, the overall treatment of the workpiece surface on the rotating platform is realized; through the sliding arrangement of the polishing roller on the driving shaft which intersects and is perpendicular to the polishing roller, the polishing roller can freely move in the axial direction. The design breaks through the limitation of the traditional fixed or one-way motion polishing head, enables the polishing roller to continuously slide from the center to the outer edge of the rotating platform, covers the entire workpiece surface, enables the equipment to perform surface finishing on the polishing pad base material in the whole area and without dead angle, significantly improves the processing coverage and uniformity, and effectively solves the local defect problem caused by uneven treatment in the existing equipment.
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