Image generation unit and head-up display device

Abstract

The invention relates to an image generation unit and a head-up display device. In one aspect, an image generation unit is provided, the image generation unit including a display panel, a light-emitting surface of the display panel including a display area for emitting image light; the heat dissipation base body is thermally coupled to the light emitting surface, the heat dissipation base body transmits the image light, a first heat dissipation structure is formed on the outer surface of the heat dissipation base body, the surface of the first heat dissipation structure is in a non-planar shape, and the first heat dissipation structure is located in the area, not covered by the image light, of the outer surface. Therefore, the possibility that the display panel is damaged in a sunlight backward flowing state can be reduced.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a picture generation unit and a head-up display device. BACKGROUND

[0002] Head-up display (HUD) devices are widely used in vehicles and other transportation tools, which are used to project information such as vehicle conditions and road conditions on the windshield or synthetic mirror of the transportation tool, so as to form an image displaying the information in front of the driver.

[0003] Due to the light transmittance of the windshield, external sunlight can pass through the windshield into the HUD device, and reach and enter the display panel of the picture generation unit (PGU) along the reverse path of the display light of the HUD device, which is usually referred to as sunlight backflow. The energy of the sunlight backflow on the display panel is absorbed by the display panel, and thus the temperature of the display panel can be rapidly increased, which can cause damage to the display panel. SUMMARY

[0004] This section provides a general summary of the present disclosure, rather than a comprehensive disclosure of the full scope or all the features of the present disclosure.

[0005] The present disclosure provides a picture generation unit and a head-up display device comprising the same, the temperature of the display panel of the picture generation unit can be relatively low in the sunlight backflow state, thereby reducing the possibility of damage to the display panel in the sunlight backflow state.

[0006] According to an aspect of the present disclosure, a picture generation unit is provided. The picture generation unit comprises a display panel and a heat dissipation base. An out-coupling surface of the display panel comprises a display region from which image light exits. The heat dissipation base is thermally coupled to the out-coupling surface of the display panel. The heat dissipation base transmits the image light, and an outer surface of the heat dissipation base is formed with a first heat dissipation structure. A surface of the first heat dissipation structure is in a non-planar shape, and the first heat dissipation structure is located at a region of the outer surface of the heat dissipation base which is not covered by the image light.

[0007] According to another aspect of the present disclosure, a head-up display device is also provided. The head-up display device comprises a picture generation unit. The picture generation unit comprises a display panel and a heat dissipation base. An out-coupling surface of the display panel comprises a display region from which image light exits. The heat dissipation base is thermally coupled to the out-coupling surface of the display panel. The heat dissipation base transmits the image light, and an outer surface of the heat dissipation base is formed with a first heat dissipation structure, a surface of the first heat dissipation structure is in a non-planar shape, and the first heat dissipation structure is located at a region of the outer surface of the heat dissipation base which is not covered by the image light.

[0008] According to the technical solution, the heat dissipation base body that transmits image light is thermally coupled to the light exit surface of the display panel, and the outer surface of the heat dissipation base body is formed with the first heat dissipation structure in the area that is not covered by the image light, so that the heat dissipation efficiency can be improved without interfering with the image light, so as to quickly and effectively reduce the temperature of the display panel, and thus reduce the possibility of damage to the display panel in the sunlight backflow state. BRIEF DESCRIPTION OF DRAWINGS

[0009] The features and advantages of embodiments of the present disclosure will become more apparent from the following detailed description, taken in conjunction with the accompanying drawings. The drawings are not drawn to scale, and some features can be exaggerated or minimised to show details. In the drawings: Figure 1 is a schematic view of a related art HUD device.

[0010] Figure 2 is a schematic view of an image generation unit according to a first embodiment of the present disclosure.

[0011] Figure 3 is a schematic view of a heat dissipation base body of the image generation unit shown in Figure 2

[0012] Figure 4 is a schematic view of an image generation unit according to a second embodiment of the present disclosure.

[0013] Figure 5 is a schematic view of an image generation unit according to a third embodiment of the present disclosure.

[0014] Figure 6 is a schematic view of an image generation unit according to a fourth embodiment of the present disclosure.

[0015] Figure 7 is a schematic view of a heat dissipation base body of the image generation unit shown in Figure 6 is an enlarged view of the circular portion in

[0016] Figure 8 is a schematic view of an image generation unit according to a fifth embodiment of the present disclosure.

[0017] Figure 9 is a schematic view of a HUD device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0018] The present disclosure is described in detail below with reference to the accompanying drawings and by way of exemplary embodiments. It is to be noted that the following detailed description of the present disclosure is merely for illustrative purposes and by no means limiting the present disclosure.

[0019] ​It should be noted that, for the sake of clarity, not all the features of the specific embodiments are described and illustrated in the description and drawings, and in order to avoid obscuring the technical solutions concerned by the present disclosure with unnecessary details, only the device structures and parts closely related to the technical solutions of the present disclosure are described and illustrated in the description and drawings, while other details which are not closely related to the technical content of the present disclosure and are known to those skilled in the art are omitted.

[0020] First, refer to Figure 1 A brief description of the related art HUD device 10' is given.

[0021] The HUD device (schematically shown in a dashed box) 10' generally comprises a PGU (schematically shown in another dashed box) 100' and a reflection unit 200'.

[0022] The PGU 100' comprises a display panel 120' and a backlight device 130'. The backlight device 130' is disposed at the light-incident side of the display panel 120' to provide backlight to the display panel 120'. Thus, image light rays S1' carrying image information are emitted from the light-emitting side 124' of the display panel 120'.

[0023] The reflection unit 200' is disposed on the propagation path of the image light rays S1' to reflect the image light rays S1' to the windshield glass 20'.

[0024] During the image display process of the HUD device 10', the PGU 100' emits the image light rays S1' towards the reflection unit 200'. The image light rays S1' are reflected by the reflection unit 200' to be incident to the windshield glass 20', and then reflected by the windshield glass 20' to enter the eyebox 40' (i.e. the range within which the eyes of the driver can move while keeping the viewed image clear and complete). Thus, a virtual image 60' (i.e. a display image) is formed on the outside of the windshield glass 20' (i.e. the left side of the windshield glass 20') and on the backward extension line of the reflected image light rays S1', for the driver to view. Figure 1

[0025] Due to the light-transmitting property of the windshield glass 20', light rays S2' from external sunlight 80' can pass through the windshield glass 20' to enter the HUD device 10', and propagate (also referred to as backflow) to the display panel 120' of the PGU 100' along the reverse path (shown in a dashed line) of the emission path (shown in a solid line) of the image light rays S1'. Figure 1 Figure 1 The display panel 120' absorbs the energy of the backflowing sunlight, and thus the temperature of the display panel 120' can rapidly increase. If the display panel 120' is irradiated by the sunlight for a long time, the display panel 120' can be thermally damaged. ​​

[0026] In view of this, according to an embodiment of the present disclosure, a PGU100 is provided. Hereinafter, referring to... Figures 2 to 8 The PGU100 will be described in detail.

[0027] First, refer to Figure 2 The PGU100 includes a display panel 120 and a heat dissipation base 140.

[0028] Based on the emission direction of the image light S1 carrying image information, the display panel 120 includes a light-inlet surface 122 and a light-outlet surface 124. The light-outlet surface 124 is divided into a display area ( Figure 2 The area between dashed lines L1 and L2 (center-emitting surface 124) 1242 and non-display area ( Figure 2 The light-emitting surface 124 is located in the area to the left of dashed line L1 and to the right of dashed line L2. The display area 1242 is the area where image rays S1 are emitted; in other words, the display area 1242 is the area covered by the pixel array participating in image display. The non-display area 1244 is the area where image rays S1 cannot be emitted, that is, the area that cannot participate in image display, such as the encapsulation boundary area.

[0029] For example, the display panel 120 may be a liquid crystal display (LCD), a light-emitting diode display (LED), a diffuser, etc., and there is no limitation herein.

[0030] The heat dissipation substrate 140 is thermally coupled to the light-emitting surface 124 of the display panel 120. The heat dissipation substrate 140 transmits image light S1, and a first heat dissipation structure 144 is formed on the outer surface 142 of the heat dissipation substrate 140. The surface of the first heat dissipation structure 144 is non-planar, and the first heat dissipation structure 144 is located in the area of ​​the outer surface 142 not covered by the image light S1. Figure 2 (The area 142 on the outer surface of the middle and outer surfaces is located to the left of the dashed line L1 and to the right of the dashed line L2) 1422.

[0031] The thermal coupling method establishes a heat transfer path between the display panel 120 and the heat dissipation substrate 140, enabling the heat from the display panel 120 to be transferred to the heat dissipation substrate 140.

[0032] Since the image light S1 is transmitted, the heat dissipation substrate 140, which is thermally coupled to the light-emitting surface 124, will not affect the emission of the image light S1 from the PGU100, and thus will not affect the display image formed by the image light S1.

[0033] The first heat dissipation structure 144 is formed on the outer surface 142 of the heat dissipation base 140 by a specific process. For example, the specific process includes chemical etching, laser processing, mechanical processing, etc. The non-planar surface includes a non-planar curved surface, a multi-planar combined surface, etc. The multi-planar combined surface is, for example, a convex surface, a zigzag surface, etc. The first heat dissipation structure 144 in the form of a non-planar surface increases the contact area between the outer surface 142 of the heat dissipation base 140 and air, thereby improving the heat dissipation efficiency of the heat dissipation base 140. Moreover, the first heat dissipation structure 144 does not interfere with the image light S1 and thus does not affect the display image formed by the image light S1.

[0034] Specifically, in the sunlight backflow state, the light S2 from the sunlight backflowing to the PGU 100 (shown by a dashed line in FIG. 1) passes through the heat dissipation base 140 to reach the display panel 120 and is absorbed by the display panel 120, causing the temperature of the display panel 120 to rise. Under the action of the temperature difference, heat is transferred from the display panel 120 to the heat dissipation base 140, which absorbs the heat and transfers the heat to the outer surface 142. The outer surface 142 transfers and dissipates the heat to the air through contact with the surrounding air, thereby achieving cooling of the display panel 120. Figure 2

[0035] Moreover, since the outer surface 142 is formed with the first heat dissipation structure 144 in the form of a non-planar surface at the region 1422, a larger heat dissipation area can be obtained without affecting the display image, thereby improving the heat dissipation efficiency and enabling the heat in the heat dissipation base 140 to be quickly dissipated to the air through the first heat dissipation structure 144, so as to quickly and effectively reduce the temperature of the display panel 120.

[0036] In this way, the possibility of damage to the display panel 120 in the sunlight backflow state is reduced.

[0037] It can be understood that, since the heat dissipation base 140 transmits the image light S1, the heat dissipation base 140 can be made of a visible light band light-transmitting material.

[0038] The visible light band light-transmitting material refers to a material that allows light in the visible light band (i.e., the wavelength range of electromagnetic waves that can be perceived by the human eye, typically 380-780 nm) to pass through. For example, the visible light band light-transmitting material includes inorganic light-transmitting materials (such as glass, quartz), organic light-transmitting materials (such as resin), composite light-transmitting materials (such as laminated glass), etc.

[0039] ​For the resin, it is conceivable to add a high-thermal-conductivity material, such as a ceramic material, a metallic material, or the like, to the resin to increase the thermal conductivity thereof. Illustratively, the thermal conductivity of a common resin is approximately 0.2 W / mK, and the thermal conductivity of the resin after the addition of the high-thermal-conductivity material can be increased to 1 W / mK or more.

[0040] It is conceivable that the light transmittance of the visible light band light-transmitting material can be greater than or equal to 80%.

[0041] In this way, not only can the light loss of the image light S1 that transmits through the heat dissipation base 140 be reduced to improve the imaging effect, but also the heat accumulation in the heat dissipation base 140 can be reduced to reduce the temperature of the display panel 120.

[0042] For example, the heat dissipation base 140 can be heat dissipation glass. The heat dissipation glass has a high light transmittance, and thus, similar to the above effects, the light loss can be reduced and the heat accumulation in the heat dissipation base 140 can be reduced.

[0043] It is conceivable that the heat dissipation glass can be made of aluminum-silicon glass. The aluminum-silicon glass has a high light transmittance and a low coefficient of thermal expansion, and not only can the light loss and the heat accumulation in the heat dissipation base 140 be reduced, but also the structure is relatively stable and is not prone to cracking due to thermal stress at high temperatures.

[0044] It is conceivable that the heat dissipation glass can also be made of other types of glass, such as microcrystalline glass, and the like, without limitation.

[0045] It is conceivable that the thickness of the heat dissipation base 140 is 1-5 mm. If the thickness is less than 1 mm, the heat transfer in the heat dissipation base 140 from the center to the edge of the heat dissipation base 140 can be affected; and if the thickness is greater than 5 mm, the mass of the heat dissipation base 140 can be large, affecting the reliability of the PGU 100.

[0046] With reference to Figure 3 The outer surface 142 of the heat dissipation base 140 can be divided into a region 1422 that is not covered by the image light S1 and a region 1424 that is covered by the image light S1. Figure 3 The region 1422 can include a first portion 1422a facing the light-out surface 124 (i.e., at the lower surface of the heat dissipation base 140 in FIG. 1), a second portion 1422b facing away from the light-out surface 124 (i.e., at the upper surface of the heat dissipation base 140 in FIG. 1), and a third portion 1422c between the first portion 1422a and the second portion 1422b (i.e., at the side surface of the heat dissipation base 140 in FIG. 1). Figure 3 Figure 3

[0047] ​​It can be understood that, in a case where any one of the first portion 1422a, the second portion 1422b, and the third portion 1422c is exposed to ambient air, the first heat dissipation structure 144 can be located on the any one to dissipate heat into the air. Exemplarily, as shown in Figure 3 the first heat dissipation structure 144 can be located at the second portion 1422b. Since the area of the second portion 1422b is relatively large, the area of the first heat dissipation structure 144 can be made larger, so that more effective heat dissipation can be achieved.

[0048] It can be conceived that, as shown in Figure 3 the first heat dissipation structure 144 can include a plurality of microstructures 1442, and the height of the microstructure 1442 is 1.2-120 μm.

[0049] The plurality of microstructures 1442 can further increase the contact area of the first heat dissipation structure 144 with air, so as to further improve the heat dissipation efficiency, thereby more quickly and effectively reducing the temperature of the display panel 120.

[0050] The height of the microstructure 1442 is the distance between the lowest point and the highest point of the microstructure 1442 in a direction perpendicular to the second portion 1422b. If the height of the microstructure 1442 is greater than 120 μm, the contact area of the first heat dissipation structure 144 with air will be reduced, thereby reducing the heat dissipation efficiency. If the height of the microstructure 1442 is less than 1.2 μm, the surface of the microstructure 1442 is close to a plane, which also reduces the heat dissipation efficiency.

[0051] It can be conceived that the shape of the microstructure 1442 can include at least one of a spherical shape, a boss shape, and a wave shape.

[0052] Compared with a plane, the spherical shape, the boss shape, or the wave shape has a larger contact area with air, which is conducive to improving the heat dissipation efficiency.

[0053] It can be conceived that, as shown in Figure 4 the PGU 100 can further include a second heat dissipation structure 160, the second heat dissipation structure 160 transmits the image light S1, and the second heat dissipation structure 160 is disposed at a region 1424 of the outer surface 142 of the heat dissipation substrate 140 covered by the image light S1, the region 1424 being covered by the image light S1 and facing away from the light exit face 124.

[0054] In this way, the effect of dissipating heat via the region 1424 as a display region can be improved without affecting the image light S1 and thus without affecting the displayed image. As a result, the heat transferred from the display panel 120 to the heat dissipation base 140 can be effectively dissipated by the first heat dissipation structure 144 and the second heat dissipation structure 160, thereby further improving the heat dissipation efficiency to more effectively reduce the temperature of the display panel 120 and thus reduce the possibility of damage to the display panel 120 in the sunlight backflow state.

[0055] It is envisaged that, as shown in Figure 4 , the second heat dissipation structure 160 can include a thermally conductive film 162.

[0056] The thermally conductive film 162 has a high thermal conductivity, for example, generally has a higher thermal conductivity than glass material, can quickly transfer heat in the heat dissipation base 140 to the surrounding air, thereby quickly and effectively reducing the temperature of the display panel 120.

[0057] It is envisaged that the thermally conductive film 162 can include at least one of a metal conductive film, a nanomesh wire film, and a graphene film.

[0058] The metal conductive film, the nanomesh wire film, and the graphene film have a high thermal conductivity, for example, the thermal conductivity of a silver nanomesh wire film is 100-300 W / mK, and the thermal conductivity of a graphene film is 2000-5000 W / mK, which is much greater than the thermal conductivity of conventional glass material (0.8-1.4 W / mK). As a result, the heat dissipation efficiency can be improved to quickly and effectively reduce the temperature of the display panel 120.

[0059] It is envisaged that, as shown in Figure 5 , the PGU 100 further includes a thermoelectric cooler (TEC) 180, and the thermally conductive film 162 is connected to the TEC 180 (shown in dashed lines).

[0060] The TEC is a solid-state active heat dissipation device based on the Peltier effect. The TEC 180 includes a cold end and a hot end, the cold end absorbs heat from the thermally conductive film 162 connected thereto, the absorbed heat is transferred to the hot end by the Peltier effect, and is dissipated to the air via the hot end (for example, via an external heat dissipation system such as a fan connected to the hot end).

[0061] As a result, heat transfer and dissipation can be more rapid and effective, and thus the cooling effect on the display panel 120 can be improved.

[0062] It is also envisaged that, as shown in Figure 6 , the second heat dissipation structure 160 can include a metal wire grid 164.

[0063] The metal wire grid 164 is a polarized optical element that can transmit polarized light of a specific direction and reflect polarized light of a direction orthogonal to the specific direction. In the embodiment shown, the metal wire grid 164 can transmit the image light S1 from the display panel 120, while also polarizing and filtering the light S2 from the sunlight that is incident on the metal wire grid 164. Figure 6 In the embodiment shown, the metal wire grid 164 reflects vertically polarized light (i.e., S-polarized light) and transmits horizontally polarized light (i.e., P-polarized light). In this way, not only does the image light S1 and thus the display image not be affected, but the energy of the sunlight that enters the display panel 120 is also reduced, thereby reducing the temperature of the display panel 120. Figure 6 In the embodiment shown, the metal wire grid 164 reflects vertically polarized light (i.e., S-polarized light) and transmits horizontally polarized light (i.e., P-polarized light). In this way, not only does the image light S1 and thus the display image not be affected, but the energy of the sunlight that enters the display panel 120 is also reduced, thereby reducing the temperature of the display panel 120.

[0064] In addition, the metal wire grid 164 is made of a metal material such as aluminum, silver, etc., and thus has a high thermal conductivity. In this way, the heat dissipation substrate 140 can also be effectively cooled by the heat conduction of the metal, further improving the heat dissipation efficiency.

[0065] Furthermore, the metal wire grid 164 is arranged at the region 1424 such that the area of the metal wire grid 164 can be small, and a polarized filtering element does not need to be additionally arranged at the dust shield of the HUD device. In this way, the manufacturing cost can be reduced.

[0066] It is envisaged that the metal wire grid 164 can be arranged at the region 1424 of the heat dissipation substrate 140, and the metal wire grid 164 can be arranged at the region 1424 of the heat dissipation substrate 140 in combination with the heat dissipation film 162. Figure 7 In particular, the period of the metal wire grid 164 is 20-200 nm, the ratio of the width a of the air gap 1642 to the width b of the wire grid 1644 is 40-60%, and the height h of the wire grid 1644 is 0.5-2 times the width b of the wire grid 1644.

[0067] In this way, more horizontally polarized light can be transmitted through the metal wire grid 164, and less vertically polarized light can be transmitted through the metal wire grid 164, i.e., high transmittance of the image light S1 and low transmittance of the light S2 from the sunlight are achieved. In this way, the filtering effect of the metal wire grid 164 is improved, further reducing the temperature of the display panel 120.

[0068] It is to be understood that the second heat dissipation structure 160 can also include both the heat dissipation film 162 and the metal wire grid 164. Details are not repeated here.

[0069] It is envisaged that the metal wire grid 164 can be arranged at the region 1424 of the heat dissipation substrate 140, and the metal wire grid 164 can be arranged at the region 1424 of the heat dissipation substrate 140 in combination with the heat dissipation film 162. Figure 8 In particular, the period of the metal wire grid 164 is 20-200 nm, the ratio of the width a of the air gap 1642 to the width b of the wire grid 1644 is 40-60%, and the height h of the wire grid 1644 is 0.5-2 times the width b of the wire grid 1644.

[0070] By setting the adhesive layer 110, the heat dissipation base 140 can be firmly fixed to the light emitting surface 124, so that the heat dissipation base 140 can stably and continuously dissipate heat from the display panel 120, and at the same time, the adhesive layer 110 transmits the image light S1 emitted from the display panel 120, so as not to affect the normal display of the HUD device.

[0071] The adhesive layer 110 can be made of materials such as silicone, epoxy resin, etc. with good thermal conductivity. In this way, the heat of the display panel 120 can be quickly transferred to the heat dissipation base 140 through the adhesive layer 110, so that the temperature of the display panel 120 can always be kept low.

[0072] It is envisaged that, as shown in Figure 8 , the adhesive layer 110 can cover the display area 1242 of the display panel 120.

[0073] In this way, on the one hand, the image light S1 emitted from the display panel 120 can all be transmitted through the adhesive layer 110 to improve the clarity and brightness of the display image. On the other hand, the contact area of the adhesive layer 110 and the light emitting surface 124 of the display panel 120 can be increased, thereby improving the transfer efficiency of heat from the display panel 120 to the heat dissipation base 140, so that the display panel 120 can always be kept at a low temperature.

[0074] It is envisaged that, as shown in Figure 8 , the area of the adhesive layer 110 can be smaller than the area of the part of the outer surface 142 of the heat dissipation base 140 facing the light emitting surface 124 of the display panel 120 (i.e. the area of the lower surface of the heat dissipation base 140 in Figure 8 ) and the area of the light emitting surface 124 of the display panel 120.

[0075] In this way, there is a gap between the edge area of the part of the outer surface 142 facing the light emitting surface 124 and the light emitting surface 124. The gap can form a turbulent flow or vortex, thereby enhancing the transfer efficiency of heat from the display panel 120 to the air through the heat dissipation base 140, i.e. enhancing the heat dissipation efficiency, to effectively reduce the temperature of the display panel 120.

[0076] According to another aspect of the present disclosure, as shown in Figure 9 , a HUD device (schematically shown in a dashed box) 10 is also provided. The HUD device 10 comprises a PGU (schematically shown in another dashed box) 100.

[0077] The HUD device 10 comprises a PGU 100 and a reflection unit 200. The PGU 100 comprises a display panel 120 and a heat dissipation base 140. The display panel 120 emits image light S1 carrying information of vehicle conditions, road conditions, etc. The image light S1 passes through the heat dissipation base 140, is reflected by the reflection unit 200, and is incident on the windshield 20, and then is reflected by the windshield 20 and enters the eyebox 40. Thus, a virtual image 60, i.e., a display image, is formed on the outside of the windshield 20 for the driver to observe.

[0078] When the sunlight backflow occurs, the light path of the light S2 from the external sunlight 80 is as shown by the dashed line in FIG. 2, and sequentially passes through the windshield 20 and the reflection unit 200 and enters the PGU 100. The light S2 passes through the heat dissipation base 140 and is absorbed by the display panel 120, causing the display panel 120 to heat up. Under the action of the temperature difference, the heat is transferred from the display panel 120 to the heat dissipation base 140, and then is transferred and dissipated to the air through the outer surface 142 of the heat dissipation base 140, in particular through the first heat dissipation structure 144. Figure 9

[0079] In the present disclosure, the use of the terms "first", "second", "upper", "lower", etc. is merely for the purpose of facilitating description and should not be considered as limiting. In addition, although the present disclosure has been described with reference to the exemplary embodiments, it should be understood that the present disclosure is not limited to the specific embodiments described and shown in detail. Those skilled in the art can make various changes to the exemplary embodiments without departing from the scope defined by the claims of the present disclosure.

[0080] The features mentioned and / or shown in the above description of exemplary embodiments of the present disclosure can be combined in one or more other embodiments in the same or similar manner as the features in other embodiments are combined or replace corresponding features in other embodiments. The technical solutions obtained by combining or replacing should also be considered to be included in the protection scope of the present disclosure.​

Claims

1. An image generation unit characterized by comprising: The image generation unit comprises: a display panel, an outlight surface of the display panel comprising a display area of emergent image light rays; and a heat dissipation base thermally coupled to the outlight surface, the heat dissipation base transmitting the image light rays, and an outer surface of the heat dissipation base being formed with a first heat dissipation structure, a surface of the first heat dissipation structure being in a non-planar shape, and the first heat dissipation structure being located at a region of the outer surface not covered by the image light rays.

2. The image generation unit of claim 1, wherein, The heat dissipation base is heat dissipation glass.

3. The image generation unit of claim 1, wherein, The first heat dissipation structure comprises a plurality of microstructures, a height of the microstructures being 1.2-120 μm.

4. The image generation unit of claim 3, wherein, A shape of the microstructures comprises at least one of a spherical shape, a boss shape and a wave shape.

5. The image generation unit of claim 1, wherein, The image generation unit further comprises a second heat dissipation structure, the second heat dissipation structure transmitting the image light rays, and the second heat dissipation structure being disposed at a first region of the outer surface, the first region being covered by the image light rays and facing away from the outlight surface.

6. The image generation unit of claim 5, wherein, The second heat dissipation structure comprises at least one of a heat conductive film and a metal wire grid.

7. The image generation unit of claim 6, wherein, The heat conductive film comprises at least one of a metal conductive film, a nanomesh wire film and a graphene film.

8. The image generation unit of claim 6, wherein, The image generation unit further comprises a thermoelectric cooling module, the heat conductive film being connected to the thermoelectric cooling module.

9. The image generation unit of claim 6, wherein, A period of the metal wire grid is 20-200 nm, a ratio of an air gap to a width of the wire grid is 40-60%, and a height of the wire grid is 0.5-2 times of the width of the wire grid.

10. The image generation unit of claim 1, wherein, Further comprising a cementing layer, the cementing layer transmitting the image light rays, and the cementing layer being located between the heat dissipation base and the outlight surface to fix the heat dissipation base to the outlight surface.

11. The image generation unit of claim 10, wherein, The cementing layer covers the display area, and an area of the cementing layer is smaller than an area of a portion of the outer surface facing the outlight surface and an area of the outlight surface.

12. A head-up display device, characterized by comprising: The image generation unit comprises any one of claims 1-11.

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