Electronic device
By using a flexible circuit board to connect the fingerprint module and the main circuit board in electronic devices, fingerprint information is directly transmitted and grounded, solving the problem of low fingerprint recognition accuracy and achieving higher recognition accuracy and thinner and lighter devices.
Patent Information
- Application Number
- CN202511038445.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-28
- Publication Date
- 2025-11-07
AI Technical Summary
In existing technologies, the fingerprint information transmission path in fingerprint recognition schemes is relatively long, which makes it easy to interfere with other electronic signals and affect the recognition accuracy.
Flexible circuit boards are used as the main and auxiliary board connectors, and the fingerprint module is directly connected to the main circuit board, which shortens the transmission path of fingerprint information. The module is also grounded through the module bracket to avoid electrostatic interference.
It effectively reduces interference between fingerprint information and other electronic signals, improves the accuracy of fingerprint recognition, and contributes to the thinner and lighter design of devices.
Smart Images

Figure CN120913256A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. BACKGROUND
[0002] With the continuous development of electronic equipment, the current mainstream fingerprint identification scheme includes capacitive fingerprint identification, photoelectric fingerprint identification, ultrasonic fingerprint identification, etc. The fingerprint information collected by the fingerprint module needs to be transmitted to the main circuit board of the electronic equipment for processing, so as to realize fingerprint identification. However, in the related art, the fingerprint module is connected to the auxiliary circuit board through its own fingerprint flexible circuit board, the auxiliary circuit board is connected to the main circuit board through an intermediate circuit board, and the fingerprint information collected by the fingerprint module reaches the main circuit board through the dedicated fingerprint flexible circuit board, the auxiliary circuit board, and the intermediate circuit board in sequence, so as to compare the fingerprint information with the fingerprint database through the control module on the main circuit board. If the data is consistent, the unlocking is successful; if the data is inconsistent, the unlocking fails. Since the transmission path of the fingerprint information is relatively long, it is easy to interfere with other electronic signals, thereby affecting the accuracy of fingerprint identification. SUMMARY
[0003] The present application discloses an electronic equipment to solve the problem of low accuracy of fingerprint identification in the related art.
[0004] To solve the above technical problems, the present application is implemented as follows: The present application discloses an electronic equipment, which comprises a device shell, a main circuit board, an auxiliary circuit board, a main-auxiliary board connecting piece, and a fingerprint module arranged in the device shell. The main-auxiliary board connecting piece is a flexible circuit board and is connected between the main circuit board and the auxiliary circuit board. The fingerprint module is connected to the main-auxiliary board connecting piece, so that the fingerprint information collected by the fingerprint module is directly transmitted to the main circuit board through the main-auxiliary board connecting piece.
[0005] The technical solution adopted by the present application can achieve the following technical effects: The electronic equipment disclosed by the present application connects the fingerprint module to the main-auxiliary board connecting piece, so that the fingerprint information collected by the fingerprint module is directly transmitted to the main circuit board through the main-auxiliary board connecting piece, thereby eliminating the need for the fingerprint information to pass through the auxiliary circuit board, effectively shortening the transmission path of the fingerprint information, alleviating the interference between the fingerprint information and other electronic signals, and improving the accuracy of fingerprint identification. BRIEF DESCRIPTION OF DRAWINGS
[0006] Figure 1 FIG. 1 is a partial cross-sectional view of a first electronic equipment according to an embodiment of the present application; Figure 2The exploded view of the fingerprint module disclosed in the embodiment of the present application; Figure 3 The connection diagram of the first intermediate circuit board and the fingerprint module disclosed in the embodiment of the present application; Figure 4 The connection diagram of the second intermediate circuit board and the fingerprint module disclosed in the embodiment of the present application; Figure 5 The partial cross-sectional view of the second electronic device disclosed in the embodiment of the present application; Figure 6 The partial enlarged view at A; Figure 5 The partial enlarged view at A; Figures 7 to 10 The grounding connectors of different structures disclosed in the embodiment of the present application.
[0007] Explanation of reference signs: 100 - device housing, 101 - avoiding groove, 200 - sub-circuit board, 300 - main sub-board connector, 400 - fingerprint module, 410 - module body, 411 - fingerprint recognition chip, 412 - fingerprint circuit board, 413 - connector, 420 - module support, 421 - support body, 422 - buckle, 430 - lens, 500 - screen. DETAILED DESCRIPTION
[0008] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the present application will be described clearly and completely below in combination with the specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0009] The technical scheme disclosed in each embodiment of the present application will be described in detail below in combination with the drawings.
[0010] Please refer to Figures 1 to 10 The electronic device disclosed in the embodiment of the present application comprises a device housing 100 and a main circuit board, a sub-circuit board 200, a main sub-board connector 300 and a fingerprint module 400 arranged in the device housing 100.
[0011] The device housing 100 is the main structure of the electronic device, which is used to provide a mounting basis for at least other parts of the electronic device.
[0012] The main circuit board is a core part of the electronic device, and the main circuit board has a processing module, which can include a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and the like. Of course, the main circuit board can also be integrated with components such as a memory, a storage, a power management chip, and a communication module.
[0013] The auxiliary circuit board 200 is usually integrated with some auxiliary functional modules, such as an audio processing module, a USB interface and related circuits, and the like, which are mainly used to enhance the functions of the electronic device or improve the user experience. The processing module on the main circuit board can control the functional modules on the auxiliary circuit board 200, and can process the related information generated by the functional modules on the auxiliary circuit board 200. The main circuit board and the auxiliary circuit board 200 can be rigid circuit boards.
[0014] The main-sub board connector 300 is a flexible circuit board and is connected between the main circuit board and the auxiliary circuit board 200, so as to realize electrical connection between the main circuit board and the auxiliary circuit board 200, and to realize signal transmission between the main circuit board and the auxiliary circuit board 200.
[0015] The fingerprint module 400 is mainly used for biometric identification, and verifies the identity of a user by identifying the fingerprint of the user. The fingerprint module 400 is connected to the main-sub board connector 300, so that the fingerprint information collected by the fingerprint module 400 is directly transmitted to the main circuit board through the main-sub board connector 300. The main circuit board can compare the fingerprint information with a fingerprint database. If the data is consistent, the unlocking is successful. If the data is inconsistent, the unlocking fails. It should be noted that the fingerprint unlocking process and principle are known technologies, and will not be described here.
[0016] The electronic device disclosed in the embodiments of the present application connects the fingerprint module 400 to the main-sub board connector 300, so that the fingerprint information collected by the fingerprint module 400 is directly transmitted to the main circuit board through the main-sub board connector 300, so that the fingerprint information collected by the fingerprint module 400 does not need to pass through the auxiliary circuit board 200, thereby effectively shortening the transmission path of the fingerprint information. Since the transmission path of the fingerprint information is shortened, the interference between the fingerprint information and other electronic signals can be alleviated, and the accuracy of fingerprint identification can be improved.
[0017] Specifically, the fingerprint module 400 can be an optical-electric fingerprint module, a capacitive fingerprint module, an ultrasonic fingerprint module, and the like. The type of the fingerprint module 400 is not specifically limited in the embodiments of the present application.
[0018] To avoid the risk of electrostatic interference of the fingerprint module 400, optionally, the fingerprint module 400 can include a module body 410 and a module support 420. The module body 410 is the core part of the fingerprint module 400, used to obtain and process fingerprint information, and transmit the fingerprint information to the main circuit board through the main and auxiliary board connector 300. The module body 410 can be installed on the device shell 100 through the module support 420, and the module support 420 can have a grounding connection part. The fingerprint module 400 can be grounded to the device shell 100 through the grounding connection part.
[0019] The electronic device disclosed in the embodiments of the present application sets the module support 420 to have a grounding connection part, so that the module support 420 not only has the function of installing the module body 410, but also has the function of grounding the fingerprint module 400, thereby avoiding the risk of electrostatic interference of the fingerprint module 400 due to not being grounded.
[0020] Specifically, the module support 420 as a whole can be a conductive metal piece, so that the module support 420 as a whole can serve as a grounding connection part. Of course, the module support 420 can also be provided with a grounding metal wire on the surface or embedded with a grounding metal wire inside, and the module support 420 can be grounded to the device shell 100 through the grounding metal wire, thereby achieving the grounding of the fingerprint module 400.
[0021] In another embodiment, the module support 420 can include a support body 421 and a buckle 422. The module body 410 can be arranged on the support body 421. The support body 421 can be clamped to the device shell 100 through the buckle 422 to connect the module support 420 to the device shell 100. The buckle 422 is a grounding connection part.
[0022] The electronic device disclosed in the embodiments of the present application sets the module support 420 to include a support body 421 and a buckle 422, and the buckle 422 is a grounding connection part. The buckle 422 not only serves as a structure for connecting the module support 420 to the device shell 100, but also serves as a component for grounding the fingerprint module 400, so that the buckle 422 has two functions, thereby facilitating the reduction of the number of components of the electronic device.
[0023] To adapt to the thin design of the electronic device, optionally, the device shell 100 can be provided with a recess 101. The device shell 100 can be provided with a buckle matching part extending into the recess 101 at the slot opening of the recess 101. At least part of the buckle 422 can extend into the recess 101 and be clamped to the buckle matching part. It should be noted that the slot opening of the recess 101 can be parallel to the thickness direction of the electronic device.
[0024] The electronic device disclosed by the embodiments of the present application can make at least part of the buckle 422 extend into the avoiding groove 101 to be clamped with the buckle matching part, so that the avoiding groove 101 can provide accommodation space for at least part of the buckle 422, thereby facilitating the thinning of the electronic device.
[0025] The buckle 422 can be attached to the surface of the support body 421 or connected with the support body 421 through a bolt, of course, the buckle 422 can also be connected with the support body 421 through other ways, and the embodiments of the present application do not make specific limitation on the connection mode of the buckle 422 and the support body 421.
[0026] In another embodiment, the buckle 422 can be embedded in the support body 421, and the first end and the second end of the buckle 422 distributed in opposite directions can respectively extend out of the support body 421, the first end of the buckle 422 can be clamped with the device shell 100, and the second end of the buckle 422 can be connected with the module body 410. It should be noted that the support body 421 can be a non-conductive material such as plastic or composite material, and the plastic or composite material is relatively light, thereby facilitating the lightweight design of the electronic device.
[0027] Since the buckle 422 is a component for grounding the fingerprint module 400 and is a conductive structure, the electronic device disclosed by the embodiments of the present application embeds the buckle 422 in the support body 421, which not only makes the setting of the buckle 422 more stable, but also protects the buckle 422, thereby ensuring the stability of the grounding of the fingerprint module 400.
[0028] Specifically, referring to Figure 5 and Figure 6 , the first end of the buckle 422 can be an arc-shaped structure, the arc-shaped structure can be an elastic body, the device shell 100 can have a buckle matching part, the buckle matching part can be adapted to the shape surrounded by the inner surface of the arc-shaped structure, and the buckle 422 can be buckled outside the buckle matching part through the arc-shaped structure.
[0029] The electronic device disclosed by the embodiments of the present application sets the first end of the buckle 422 as an elastic arc-shaped structure, sets the buckle matching part of the device shell 100 as a structure adapted to the shape surrounded by the inner surface of the arc-shaped structure, so that the buckle 422 is buckled outside the buckle matching part through the arc-shaped structure, thereby increasing the contact area of the buckle 422 and the buckle matching part, and further improving the stability of the buckle 422 buckled with the buckle matching part, and the first end of the buckle 422 is an elastic arc-shaped structure, so that the buckle 422 is easier to buckle outside the buckle matching part.
[0030] Of course, the buckle 422 can also be other structures, for example, referring toFigure 7 、 Figure 8 and Figure 9 The buckle 422 can include a buckle body and a protruding portion, the protruding portion can be arranged at one end of the buckle body, and the protruding portion can be buckled with the buckle matching portion of the device shell 100. Of course, the buckle 422 can also be a structure as shown in Figure 10 The application embodiment does not make specific limitations on the structure of the buckle 422.
[0031] Please refer to Figure 6 The second end of the buckle 422 can be a bending structure, the extension plane of the second end of the buckle 422 can be attached to the module body 410 and electrically connected. The second end of the buckle 422 can be connected to the module body 410 through welding, bolt connection, clamping and the like, so that the module body 410 can be installed on the bracket body 421 through the buckle 422.
[0032] The electronic device disclosed in the application embodiment can increase the electrical connection area of the buckle 422 and the module body 410 by setting the extension plane of the second end of the buckle 422 to be attached to the module body 410, which is conducive to improving the stability of the ground connection of the fingerprint module 400. Moreover, the module body 410 can be installed on the bracket body 421 through the buckle 422, so that the module body 410 and the module bracket 420 form an integral structure, which is conducive to the modular design of the fingerprint module 400.
[0033] Of course, the second end of the buckle 422 can also be in point contact with the module body 410 (point contact refers to a small contact area, for example, when the buckle 422 is a wire, the end surface of the wire is connected to the module body 410 to form a point contact).
[0034] In order to improve the overall strength of the module bracket 420, optionally, the buckle 422 and the bracket body 421 can be an integral injection molding structure, thereby improving the overall strength of the module bracket 420.
[0035] Of course, the buckle 422 can also be embedded in the bracket body 421 by interference fit or adhesion, and the application embodiment does not make specific limitations on the embedding method of the buckle 422 and the bracket body 421.
[0036] Optionally, the first end of the buckle 422 and the second end of the buckle 422 can be subjected to a gold plating process, thereby forming a gold plating layer on the first end of the buckle 422 and the second end of the buckle 422, which is conducive to the stability of the electrical connection between the buckle 422 and the module body 410 and the electrical connection between the buckle 422 and the buckle matching portion.
[0037] The embodiment of the present application discloses a specific fingerprint module 400, the module body 410 can include a fingerprint identification chip 411 and a fingerprint circuit board 412, the fingerprint identification chip 411 can be arranged on the fingerprint circuit board 412, the fingerprint identification chip 411 can be a photoelectric fingerprint identification chip, the fingerprint module 400 can further include a lens 430, the lens 430 can be arranged on the module support 420 and can be opposite to the fingerprint identification chip 411, and the grounding connection part can be electrically connected with the fingerprint circuit board 412.
[0038] The electronic device can further include a screen 500, the screen 500 can be arranged on the device shell 100, the screen 500 can have a fingerprint identification area, the lens 430 can be opposite to the fingerprint identification area, and the fingerprint identification chip 411 can be located on the side of the lens 430 away from the fingerprint identification area. In the case that the user's finger is placed on the fingerprint identification area, the fingerprint identification area is lighted, the light emitted by the fingerprint identification area is reflected after reaching the finger, and at least part of the reflected light can reach the fingerprint identification chip 411 in turn through the fingerprint identification area and the lens 430, thereby realizing the collection of the fingerprint information.
[0039] Optionally, the module body 410 can further include a connector 413, the fingerprint identification chip 411 and the connector 413 can be arranged on both sides of the fingerprint circuit board 412 in the thickness direction, and the connector 413 can be connected to the main and auxiliary plate connecting piece 300.
[0040] The electronic device disclosed by the embodiment of the present application arranges the fingerprint identification chip 411 and the connector 413 on both sides of the fingerprint circuit board 412 in the thickness direction, which not only facilitates the reduction of the length of the module body 410 in the length direction, but also forms a modular structure of the fingerprint identification chip 411, the connector 413 and the fingerprint circuit board 412, thereby facilitating the assembly of the fingerprint module 400. By arranging the connector 413, the special fingerprint flexible circuit board of the electronic device in the related art can be saved, and the special fingerprint flexible circuit board is complex to arrange and has a relatively high cost compared with the connector 413, thereby facilitating the reduction of the cost of the electronic device.
[0041] Of course, the fingerprint identification chip 411 and the connector 413 can also be arranged on the same side of the fingerprint circuit board 412 in the thickness direction, and the embodiment of the present application does not make specific limitation thereto.
[0042] Specifically, the connector 413 and the main-vice board connecting piece 300 can be connected by welding. In order to facilitate the connection between the fingerprint module 400 and the main-vice board connecting piece 300, the main-vice board connecting piece 300 can optionally include a plug-in fitting part, and the connector 413 can be plugged into the main-vice board connecting piece 300 through the plug-in fitting part. Since the connector 413 is plugged into the main-vice board connecting piece 300 through the plug-in fitting part, the connection between the fingerprint module 400 and the main-vice board connecting piece 300 is easier.
[0043] In order to adapt to the thin design of the electronic device, the fingerprint module 400 and the vice-circuit board 200 can be distributed side by side in a direction perpendicular to the thickness direction of the electronic device, so as to avoid the fingerprint module 400 and the vice-circuit board 200 overlapping in the direction perpendicular to the thickness direction of the electronic device, thereby facilitating the thin design of the electronic device.
[0044] It should be noted that the electronic device disclosed in the embodiments of the present application can be a mobile phone, a tablet computer, a game console, a learning machine, a communication terminal, etc., and the type of the electronic device is not specifically limited in the embodiments of the present application.
[0045] The above embodiments of the present application mainly describe the differences between the embodiments, and the different optimization features between the embodiments can be combined to form a better embodiment without contradiction. In view of the brevity of the text, the combination will not be described here.
[0046] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative and not restrictive. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope of protection of the claims, and all of them belong to the protection of the present application.
Claims
1. An electronic device, comprising: The device shell (100) and the main circuit board, the auxiliary circuit board (200), the main auxiliary board connecting piece (300) and the fingerprint module (400) arranged in the device shell (100), the main auxiliary board connecting piece (300) is a flexible circuit board and is connected between the main circuit board and the auxiliary circuit board (200), and the fingerprint module (400) is connected to the main auxiliary board connecting piece (300), so that the fingerprint information collected by the fingerprint module (400) is directly transmitted to the main circuit board through the main auxiliary board connecting piece (300).
2. The electronic device of claim 1, wherein, The fingerprint module (400) includes a module body (410) and a module support (420), the module body (410) is installed on the device shell (100) through the module support (420), the module support (420) has a grounding connection part, and the fingerprint module (400) is grounded to the device shell (100) through the grounding connection part.
3. The electronic device of claim 2, wherein, The module support (420) includes a support body (421) and a buckle (422), the module body (410) is arranged in the support body (421), the support body (421) is clamped with the device shell (100) through the buckle (422), and the buckle (422) is the grounding connection part.
4. The electronic device of claim 3, wherein, The device shell (100) is provided with a avoiding recess (101), the device shell (100) is provided with a buckle matching part extending to the inside of the avoiding recess (101) at the position of the slot opening of the avoiding recess (101), and at least part of the buckle (422) is inserted into the avoiding recess (101) and clamped with the buckle matching part.
5. The electronic device of claim 3, wherein, The buckle (422) is embedded in the support body (421), and the first end and the second end of the buckle (422) distributed in opposite directions respectively extend out of the support body (421), the first end of the buckle (422) is clamped with the device shell (100), and the second end of the buckle (422) is connected with the module body (410).
6. The electronic device of claim 5, wherein, The first end of the buckle (422) is an arc structure, the arc structure is an elastic body, the device shell (100) has a buckle matching part, the shape surrounded by the inner surface of the arc structure is matched with the buckle matching part, and the buckle (422) is buckled outside the buckle matching part through the arc structure.
7. The electronic device of claim 5, wherein, The second end of the buckle (422) is a bending structure, the extension plane of the second end of the buckle (422) is attached to the module body (410) and is electrically connected.
8. The electronic device of claim 5, wherein, The buckle (422) and the support body (421) are an integral injection molding structure.
9. The electronic device of claim 2, wherein, The module body (410) comprises a fingerprint identification chip (411) and a fingerprint circuit board (412), the fingerprint identification chip (411) is arranged on the fingerprint circuit board (412), the fingerprint identification chip (411) is a photoelectric fingerprint identification chip, the fingerprint module (400) further comprises a lens (430), the lens (430) is arranged on the module support (420) and opposite to the fingerprint identification chip (411), and the ground connection part is electrically connected with the fingerprint circuit board (412).
10. The electronic device of claim 9, wherein, The module body (410) further comprises a connector (413), the fingerprint identification chip (411) and the connector (413) are arranged on both sides of the fingerprint circuit board (412) in the thickness direction, and the connector (413) is connected to the main-sub board connecting piece (300).
11. The electronic device of claim 10, wherein, The main-sub board connecting piece (300) comprises a plug-in matching part, and the connector (413) is plug-in matched with the main-sub board connecting piece (300) through the plug-in matching part.
12. The electronic device of claim 1, wherein, In the thickness direction perpendicular to the electronic device, the fingerprint module (400) and the sub-circuit board (200) are distributed side by side.