Transmitter, temperature adjusting method and device and storage medium

Abstract

The invention provides a transmitter, a temperature adjusting method and device and a storage medium, relates to the technical field of satellite communication, and solves the problem that the performance of a device is influenced by the change of the working temperature of a last-stage power amplifier of the transmitter in the related technology. The temperature of the last-stage power amplifier of the transmitter is adjusted by controlling the rotating speed of the fan, so that the quiescent current of the high-power amplifier in the transmitter is kept basically stable, and the communication quality of the transmitter is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of satellite communication, and in particular to a transmitter, a temperature regulation method and device, and a storage medium. BACKGROUND

[0002] In a satellite communication system, the operating temperature of a transmitter is generally between -10°C and 50°C. Changes in temperature will cause changes in the quiescent current of the final power amplifier of the transmitter, thereby affecting the power consumption, efficiency, linearity and distortion, noise performance, gain and bandwidth, thermal stability, reliability, etc. of the final power amplifier, and ultimately affecting the radio frequency performance and reliability of the transmitter, resulting in poor satellite communication quality. Specifically, low temperature will deteriorate the performance indicators of the power amplifier, such as linearity deterioration, efficiency decline, output power decline, gain fluctuation, and even reliability risks such as startup failure, material brittleness, and current collapse. High temperature will also deteriorate the performance indicators of the power amplifier, such as increased static power consumption, deteriorated linearity, decreased efficiency, fluctuating output power, deteriorated noise performance, and even reliability risks such as thermal runaway, accelerated material aging, and shortened life. SUMMARY

[0003] The present application provides a transmitter, a temperature regulation method and device, and a storage medium, which solve the problem of changes in the operating temperature of the final power amplifier of the transmitter affecting device performance in related technologies. The present application can control the fan speed to regulate the temperature of the high power amplifier of the transmitter, thereby maintaining the stability of the quiescent current of the high power amplifier inside the transmitter, and further ensuring the communication quality of the transmitter.

[0004] In a first aspect, the present application provides a transmitter, which includes a power amplification unit, a micro control unit, a temperature detection unit, and a fan.

[0005] The power amplification unit comprises an isolator, a first attenuator, a drive amplifier, an equalizer, a second attenuator, a band-pass filter and a high-power amplifier, the output end of the isolator is connected to the input end of the first attenuator, the output end of the first attenuator is connected to the input end of the drive amplifier, the output end of the drive amplifier is connected to the input end of the equalizer, the output end of the equalizer is connected to the input end of the second attenuator, the output end of the second attenuator is connected to the input end of the band-pass filter, the output end of the band-pass filter is connected to the input end of the high-power amplifier, the control end of the high-power amplifier is connected to the signal output end of the micro control unit, and the output end of the high-power amplifier is used to output a signal processed.

[0006] In a second aspect, the application further provides a temperature adjustment method applied to the micro control unit in the transmitter provided in the first aspect, and the method comprises: acquiring the internal temperature of the transmitter collected by the temperature detection unit; determining a target rotating speed value corresponding to the internal temperature in the mapping data according to the internal temperature, wherein the mapping data comprises a mapping relationship between the internal temperature and the rotating speed value; adjusting the fan according to the target rotating speed value.

[0007] In a third aspect, the application further provides a temperature adjustment device applied to the micro control unit in the transmitter provided in the first aspect, and the device comprises: a temperature acquisition module configured to acquire the internal temperature of the transmitter collected by the temperature detection unit; a rotating speed determination module configured to determine a target rotating speed value corresponding to the internal temperature in the mapping data according to the internal temperature, wherein the mapping data comprises a mapping relationship between the internal temperature and the rotating speed value; a rotating speed adjustment module configured to adjust the fan according to the target rotating speed value.

[0008] In a fourth aspect, the application further provides a storage medium storing computer executable instructions, wherein the computer executable instructions are used to execute the temperature adjustment method of the application when executed by a processor.

[0009] The application improves the structure of the transmitter to adjust the internal temperature of the transmitter by the fan, and further provides a corresponding temperature adjustment method to control the rotating speed of the fan to adjust the temperature of the high power amplifier as the final stage power amplifier by detecting the change of the internal temperature of the transmitter in real time, so that the static current of the high power amplifier in the transmitter is basically stable at the preset value under normal temperature, high temperature and low temperature, the radio frequency performance and reliability of the power amplifier are improved, and the communication quality of the satellite system is improved. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 The schematic diagram of the link connection structure of the transmitter provided by an embodiment of the application is shown.

[0011] Figure 2 The schematic diagram of the transmitter structure under one perspective provided by an embodiment of the application is shown.

[0012] Figure 3 The schematic diagram of the transmitter structure under another perspective provided by another embodiment of the application is shown.

[0013] Figure 4 The schematic diagram of the steps of the temperature adjustment method provided by an embodiment of the application is shown.

[0014] Figure 5 The schematic diagram of the mapping relationship provided by an embodiment of the application is shown.

[0015] Figure 6 The schematic diagram of the structure of the temperature adjustment device provided by an embodiment of the application is shown. DETAILED DESCRIPTION

[0016] The application will be further described in detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the embodiments of the application, but not to limit the embodiments of the application. In addition, it should be noted that, for the convenience of description, only the parts related to the embodiments of the application are shown in the drawings, and the skilled in the art should be able to think that any combination of technical features can constitute an optional embodiment as long as the technical features are not contradictory to each other after reading the description of the application.

[0017] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a particular order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances to facilitate the implementation of the embodiments of the present application in an order other than that illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of a kind and do not limit the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the objects before and after are in an "or" relationship. In the description of the present application, "a plurality of" means two or more, and "several" means one or more.

[0018] In a satellite communication system, the operating temperature of the transmitter is generally between -10°C and 50°C. The change in temperature will cause the static current of the final stage power amplifier of the transmitter to change, thereby affecting the power consumption, efficiency, linearity and distortion, noise performance, gain and bandwidth, thermal stability, reliability, etc. of the final stage power amplifier, ultimately affecting the radio frequency performance and reliability of the transmitter, resulting in poor satellite communication quality. Specifically, low temperature will worsen the performance indicators of the power amplifier, such as linearity deterioration, efficiency decline, output power decline, gain fluctuation, and even reliability risks such as startup failure, material brittleness, current collapse, etc. High temperature will also worsen the performance indicators of the power amplifier, such as static power consumption increase, linearity degradation, efficiency decline, output power fluctuation, noise performance deterioration, and even reliability risks such as thermal runaway, material accelerated aging, shortened life, etc.

[0019] In order to ensure that the communication quality of the satellite communication system under normal temperature, high temperature and low temperature environment temperature does not deteriorate significantly and to improve the reliability of the transmitter, it is necessary to ensure that the radio frequency performance of the transmitter remains basically unchanged at different temperatures. To this end, the present application provides a transmitter which can adjust the internal temperature to stabilize the static current, so that the static current can be maintained near the preset value (i.e. within the error range of the preset value), thereby ensuring the radio frequency performance of the transmitter.

[0020] Figure 1A schematic diagram of a link connection structure of a transmitter provided for an embodiment of the present application is shown in the figure. The transmitter comprises a power amplification unit 110, a micro control unit 120, a temperature detection unit 130 and a fan 140. The power amplification unit comprises an isolator Isolator, a first attenuator ATT1, a driving amplifier PA1, an equalizer EQ, a second attenuator ATT2, a band pass filter FL and a high power amplifier HPA. Specifically, the output of the isolator Isolator is connected to the input of the first attenuator ATT1, the output of the first attenuator ATT1 is connected to the input of the driving amplifier PA1, the output of the driving amplifier PA1 is connected to the input of the equalizer EQ, the output of the equalizer EQ is connected to the input of the second attenuator ATT2, the output of the second attenuator ATT2 is connected to the input of the band pass filter FL, the output of the band pass filter FL is connected to the input of the high power amplifier HPA, and the control terminal of the high power amplifier HPA is connected to the signal output terminal of the micro control unit 120. The high power amplifier HPA serves as the final stage amplifier of the transmitter, and the output of the high power amplifier HPA is used to output the signal after signal processing.

[0021] The micro control unit 120 is electrically connected to the temperature detection unit 130 and the fan 140. The temperature detection unit 130 is used to collect the internal temperature of the transmitter and deliver the sampling value corresponding to the internal temperature of the transmitter to the micro control unit 120. Optionally, the temperature detection unit 130 comprises a temperature sensor, and the temperature sensor is arranged inside the transmitter, for example, on one side of the high power amplifier to collect the internal temperature. The fan 140 is used to adjust the rotating speed according to the control signal output by the micro control unit 120 to adjust the internal temperature of the transmitter. It can be understood that the micro control unit 120 outputs the corresponding control signal according to the internal temperature to control the rotating speed of the fan 140, so as to adjust the internal temperature of the transmitter, so that the temperature of the high power amplifier HPA can meet the temperature requirement, so that the quiescent current is stabilized within the error range corresponding to the preset value. The preset value is the quiescent current value generated when the high power amplifier is in the best radio frequency performance, and when the detected quiescent current is within the error range corresponding to the preset value, it can be determined that the quiescent current is basically consistent.

[0022] From the above solution, it can be seen that the present application improves the structure of the transmitter to adjust the internal temperature of the transmitter by the fan, so that the quiescent current of the high power amplifier in the transmitter is basically consistent at normal temperature, high temperature and low temperature, improves the radio frequency performance and reliability of the final stage power amplifier, and improves the communication quality of the satellite system.

[0023] Optionally, in an embodiment, the power amplifier unit of the transmitter further comprises a pi attenuator, wherein an input end of the pi attenuator is connected to an output end of the isolator, and an output end of the pi attenuator is connected to an input end of the first attenuator. The pi attenuator is a symmetrical resistance network, which can be used as a fixed attenuator between equal impedances or as an impedance matching between unequal impedances, thereby playing a role in attenuating signal power, achieving impedance matching, etc.

[0024] Figure 2 A schematic diagram of the transmitter structure in one view is provided for an embodiment of the present application, Figure 3 A schematic diagram of the transmitter structure in another view is provided for another embodiment of the present application, as shown in Figure 2 and Figure 3 As shown in the figures, the transmitter further comprises a heat dissipation base plate 210 and a plurality of heat dissipation fins 220. Specifically, the power amplifier unit, the micro control unit 120 and the temperature detection unit 130 are all arranged on a first side of the heat dissipation base plate 210, and a high power amplifier 111 in the power amplifier unit is shown on the heat dissipation base plate 210 in the figures, while the plurality of heat dissipation fins 220 are arranged on a second side of the heat dissipation base plate 210, and the plurality of heat dissipation fins 220 are arranged at intervals so that a ventilation channel is formed between every two heat dissipation fins 220. In this regard, the plurality of heat dissipation fins 220 form a plurality of ventilation channels on the second side of the heat dissipation base plate 210, wherein the second side is the side opposite to the first side on the heat dissipation base plate 210, for example, if the first side is the upper side, then the second side is the lower side. And the fan 140 is located on one side of the heat dissipation fins 220 and perpendicular to the ventilation channel formed between the plurality of heat dissipation fins 220, so that the fan 140 can send air to the ventilation channel, thereby playing a role in adjusting the internal temperature of the transmitter. Optionally, there can be a plurality of high power amplifiers arranged on the heat dissipation base plate, and the plurality of high power amplifiers are arranged on the heat dissipation base plate to dissipate heat through the heat dissipation base plate and the heat dissipation fins.

[0025] The heat dissipation base plate and the heat dissipation fins can play a role in conducting heat dissipation. It can be understood that the heat generated by the high power amplifier arranged on the heat dissipation base plate in the working state can be conducted to each heat dissipation fin through the heat dissipation base plate, and then when the fan sends air to the ventilation channel formed between each heat dissipation fin, the heat can be taken away by the fan. Optionally, the number of fans can be set to multiple, and the multiple fans are located on the same side to form accelerated air supply. The scheme of the present application can form corresponding ventilation channels through the heat dissipation base plate and the heat dissipation fins, thereby improving the heat dissipation efficiency and helping to quickly adjust the internal temperature of the transmitter, so that the quiescent current of the power amplifier in the transmitter can be quickly stabilized within the error range corresponding to the preset value.

[0026] The embodiment of the present application further provides a temperature adjusting method, which is applied to the micro control unit in the transmitter provided by the above embodiment. The transmitter generates heat in the working state, so that the internal temperature of the transmitter is different from the ambient temperature, for example, 15°C higher than the ambient temperature. Figure 4 The schematic diagram of the steps of the temperature adjusting method provided by the embodiment of the present application is shown in the figure. The scheme of the present application controls the fan speed by detecting the temperature change in real time, so that the quiescent current of the transmitter power amplifier under high temperature, low temperature and normal temperature is basically unchanged, and finally the radio frequency performance of the transmitter is in the best state. The specific steps are as follows: In step S110, the internal temperature of the transmitter collected by the temperature detection unit is obtained.

[0027] The micro control unit can detect the internal temperature of the transmitter by using the temperature detection unit. Correspondingly, the detected temperature data can be stored on the memory connected with the micro control unit, so that the micro control unit can read the temperature data at any time. The temperature data includes the sampling value of the detected internal temperature of the transmitter. The micro control unit can obtain the internal temperature of the transmitter in real time, and adjust the temperature based on the internal temperature to stabilize the quiescent current.

[0028] In step S120, the target speed value corresponding to the internal temperature is determined in the mapping data according to the internal temperature. The mapping data includes the mapping relationship between the internal temperature and the speed value.

[0029] The mapping data is preset data representing the mapping relationship between the internal temperature and the speed value. After determining the current internal temperature of the transmitter, the micro control unit can find the target speed value corresponding to the internal temperature in the mapping data. In some embodiments, the mapping data can be obtained by detecting the transmitter provided in the above embodiments. For example, when the internal temperature of the transmitter is 40°C in a normal temperature environment (e.g., 25°C), the gate voltage VG of the power amplifier is set to -2.6V to adjust the static current Idq of the power amplifier to 3A, so that the radio frequency performance of the transmitter is optimal. After running for a preset time, the static current will stabilize at other values, and the gate voltage VG needs to be adjusted, for example, the gate voltage VG is adjusted to -2.8V to stabilize the static current at Idq=3A, and the speed of the fan can be recorded as the speed value corresponding to the temperature, for example, the speed of the fan is expressed as a percentage of the maximum speed of the fan, and when the internal temperature of the transmitter is 40°C and the current speed of the fan is 75%, the mapping relationship between the temperature and the speed can be recorded. It is conceivable that when the input power is fixed, the gain, output power, and third-order intermodulation distortion of the transmitter are stable when the static current is stable. The third-order intermodulation distortion IMD3 is the ratio of the third-order intermodulation product power to the main signal power (usually expressed in dBc), which is related to the third-order intercept point IP3. In a radio frequency or microwave multi-carrier communication system, the third-order intercept point IP3 and the third-order intermodulation distortion IMD3 are important indicators for measuring linearity or distortion.

[0030] When the internal temperature of the transmitter is 65°C in a high temperature environment (e.g., 50°C), if the fan speed is still maintained at the previous speed (e.g., 75% as described above), the static current will increase, for example, to 4.5A, and the radio frequency performance of the transmitter will change, for example, the gain and output power will decrease, and the third-order intermodulation distortion will increase. Therefore, the speed of the fan needs to be adjusted to reduce the internal temperature of the transmitter. For example, when the speed of the fan is adjusted to 100%, the static current Idq is 3.1A, and it is considered that the static current is stable within the preset error range, and the stability of the static current is maintained.

[0031] When the temperature of the transmitter is 5°C in a low temperature environment (e.g. -10°C), the static current Idqis reduced to 1.8A if the fan speed is maintained at 75% as described above. In this case, the RF performance of the transmitter is changed, such as the gain is reduced, the output power is reduced, and the third-order intermodulation distortion is increased. In this case, the fan speed needs to be adjusted to increase the temperature of the transmitter. For example, when the fan speed is adjusted to 40%, the static current Idq= 2.95A. In this case, the static current Idqis considered to be in the error range of the preset value, and the stability of the static current Idqis maintained. Based on this, the fan speed value is measured in the preset temperature range when the ambient temperature changes, so as to obtain the mapping relationship between the internal temperature and the fan speed value in the preset temperature range.

[0032] In step S130, the fan speed is adjusted according to the target speed value.

[0033] In the mapping data, the target speed value corresponding to the current internal temperature is determined based on the mapping relationship between the internal temperature and the speed value, and then the micro control unit adjusts the fan to make the fan speed reach the target speed value. It is conceivable that the micro control unit can convert the target speed value into a corresponding voltage value to control the fan, so that the fan rotates at the target speed value.

[0034] In an embodiment, a plurality of temperature intervals are provided in the mapping data, and different temperature intervals correspond to different mapping relationships. In this case, after the current internal temperature is determined, the target temperature interval in which the internal temperature is located is determined. Based on the target temperature interval, the mapping relationship corresponding to the target temperature interval is determined, that is, the mapping relationship corresponding to the target temperature interval is selected, and then the target speed value corresponding to the internal temperature in the target temperature interval is determined according to the mapping relationship and the internal temperature. That is, the target speed value corresponding to the current internal temperature is determined according to the mapping relationship. For example, in a temperature interval, the temperature values in this interval all correspond to the same speed value, such as in the temperature interval of 0-5°C, the temperature values all correspond to the speed value of 40%. Therefore, when the internal temperature of the transmitter is 5°C, the corresponding target speed value is 40%.

[0035] Optionally, the divided temperature intervals include a first interval, a second interval, a third interval and a fourth interval, wherein the temperature values in the second interval are all greater than the temperature values in the first interval, and the temperature values in the third interval are all greater than the temperature values in the second interval. Figure 5The mapping relationship provided by an embodiment of the present application is shown in the diagram. The first interval corresponds to a temperature range of (-∞, 5], i.e. a temperature value less than or equal to 5°C; the second interval corresponds to a temperature range of (5, 40), i.e. a temperature value greater than 5°C and less than 40°C; the third interval corresponds to a temperature range of [40, 65), i.e. a temperature value greater than or equal to 40°C and less than 65°C; and the fourth interval corresponds to a temperature range of [65, +∞), i.e. a temperature value greater than or equal to 65°C.

[0036] In the case that the internal temperature is in the first interval, the mapping relationship is determined as the first rotation speed value corresponding to the fixed value of the internal temperature, such as 40%. In the case that the internal temperature is in the second interval, the mapping relationship is determined as the one-to-one correspondence between the internal temperature and the rotation speed value according to the first linear relationship. The rotation speed value corresponding to each internal temperature in the second interval is greater than the first rotation speed value and less than or equal to the second rotation speed value. In this regard, the relationship between the temperature and the rotation speed value in the second interval satisfies the first linear relationship. For example, the first rotation speed value is 40% and the second rotation speed value is 75%, i.e. the fan rotation speed linearly changes between 40% and 75% with the temperature change at a first slope k1= (75-40) / (40-5)=1. In the case that the internal temperature is in the third interval, the mapping relationship is determined as the one-to-one correspondence between the internal temperature and the rotation speed value according to the second linear relationship. The temperature value in the third interval is greater than the temperature value in the second interval, and the rotation speed value corresponding to each internal temperature in the third interval is greater than the second rotation speed value and less than the third rotation speed value. The second linear relationship corresponds to a second slope. For example, the second rotation speed value is 75% and the third rotation speed value is 100%, i.e. the fan rotation speed linearly changes between 75% and 100% with the temperature change at a second slope k2= (100-75) / (65-40)=1. In the case that the internal temperature is in the fourth interval, the mapping relationship is determined as the third rotation speed value corresponding to the fixed value of the internal temperature, such as 100%. The third rotation speed value is greater than the rotation speed value corresponding to each internal temperature in the third interval.

[0037] As can be seen from the above scheme, the scheme adjusts the fan and controls the rotation speed of the fan by detecting the change of the temperature in real time, thereby adjusting the temperature of the high-power amplifier, so that the static current of the high-power amplifier of the transmitter at other temperatures and the static current at normal temperature remain basically unchanged, which helps to ensure that the radio frequency performance of the transmitter is in the best state and effectively improves the communication quality of the satellite system.

[0038] In some embodiments, after adjusting the fan speed, the fan speed is further adjusted according to the determined change value of the static current. That is, after the initial adjustment of the fan, the static current is detected again to obtain the value of the static current after the adjustment of the fan speed, and by comparing the static current before and after the adjustment, the change value of the static current is determined. That is, the difference between the static current before the adjustment of the fan speed and the static current after the adjustment of the fan speed is determined, and the micro control unit adjusts the fan again in response to the change of the static current.

[0039] Optionally, in the case that the static current is less than the preset current value and the difference between the static current and the preset current value is greater than the preset threshold, the fan speed is reduced by a preset step value based on the target speed value. In the case that the static current is greater than the preset current value and the difference between the static current and the preset current value is greater than the preset threshold, the fan speed is increased by a preset step value based on the target speed value. It can be understood that the preset threshold is related to the error range of the preset value, for example, the preset value is 3A, and the corresponding error range is [2.9, 3.1], that is, the error is ±0.1A, and the current value is greater than or equal to 2.9A and less than or equal to 3.1A, and for this, the preset threshold can be set to 0.1.

[0040] After the initial adjustment of the fan, the temperature change of the high power amplifier of the transmitter causes the static current to change, so that the difference between the static current and the preset current value is greater than the preset threshold, which can determine that the current internal temperature of the transmitter still causes the static current to be unable to stabilize in the error range of the preset value, and the fan speed is continuously adjusted until the static current is in the error range of the preset value. For example, after the initial adjustment of the fan, if the static current is 2.8A, it can be determined that the static current is less than the preset current value and the difference between the static current and the preset current value is greater than the preset threshold, and then the fan speed is reduced by a preset step value based on the target speed value until the static current is in the error range of the preset value. If the static current is 3.2A, it can be determined that the static current is greater than the preset current value and the difference between the static current and the preset current value is greater than the preset threshold, and then the fan speed is increased by a preset step value based on the target speed value until the static current is in the error range of the preset value.

[0041] Therefore, the present scheme stabilizes the static current by re-adjusting the fan speed, so that the high power amplifier inside the transmitter can maintain the stability of the static current at different temperatures, which helps to improve the reliability of the transmitter and improve the communication quality of the satellite system.

[0042] Figure 6A structural diagram of a temperature adjusting device provided by an embodiment of the present application is shown in the figure. The device is applied to a micro control unit in a transmitter, and is used to execute the temperature adjusting method provided by the above embodiment and has the corresponding function modules and beneficial effects of the execution method. As shown in the figure, the temperature adjusting device includes a temperature collection module 301, a rotating speed determination module 302, and a rotating speed adjusting module 303.

[0043] The temperature collection module 301 is configured to acquire the internal temperature of the transmitter collected by the temperature detection unit. The rotating speed determination module 302 is configured to determine the target rotating speed value corresponding to the internal temperature in the mapping data according to the internal temperature, and the mapping data includes the mapping relationship between the internal temperature and the rotating speed value. The rotating speed adjusting module 303 is configured to adjust the fan according to the target rotating speed value.

[0044] On the basis of the above embodiment, a plurality of temperature intervals are set in the mapping data, and different temperature intervals correspond to different mapping relationships. The rotating speed determination module 302 is specifically configured to: determine the target temperature interval in which the internal temperature is located; determine the mapping relationship between the temperature and the rotating speed value in the target temperature interval based on the target temperature interval; determine the target rotating speed value corresponding to the internal temperature in the target temperature interval according to the mapping relationship and the internal temperature.

[0045] On the basis of the above embodiment, the rotating speed determination module 302 is further configured to: in the case that the internal temperature is in the first interval, determine that the mapping relationship is the first rotating speed value corresponding to the fixed value of the internal temperature; in the case that the internal temperature is in the second interval, determine that the mapping relationship is that the internal temperature and the rotating speed value are one-to-one corresponding according to the first linear relationship, the temperature value in the second interval is greater than the temperature value in the first interval, and the rotating speed value corresponding to each internal temperature in the second interval is greater than the first rotating speed value and less than or equal to the second rotating speed value, and the first linear relationship is associated with the first slope; in the case that the internal temperature is in the third interval, determine that the mapping relationship is that the internal temperature and the rotating speed value are one-to-one corresponding according to the second linear relationship, the temperature value in the third interval is greater than the temperature value in the second interval, and the rotating speed value corresponding to each internal temperature in the third interval is greater than the second rotating speed value and less than the third rotating speed value, and the second linear relationship corresponds to the second slope; in the case that the internal temperature is in the fourth interval, determine that the mapping relationship is the third rotating speed value corresponding to the fixed value of the internal temperature, and the temperature value in the fourth interval is greater than the temperature value in the third interval.

[0046] On the basis of the above embodiment, the device further includes a rotating speed re-adjusting module, which is configured to: According to the determined change value of the static current, the rotating speed of the fan is readjusted.

[0047] Based on the above-mentioned embodiments, the rotating speed readjustment module is specifically configured as: In a case where the static current is less than the preset current value and a difference between the static current and the preset current value is greater than a preset threshold, the rotating speed of the fan is decreased by a preset step value based on the target rotating speed value; In a case where the static current is greater than the preset current value and a difference between the static current and the preset current value is greater than a preset threshold, the rotating speed of the fan is increased by a preset step value based on the target rotating speed value.

[0048] It is worth noting that, in the above-mentioned embodiments of the device, each module is only divided according to the functional logic, but is not limited to the above-mentioned division, as long as the corresponding functions can be realized; in addition, the specific names of the modules are only for the convenience of mutual differentiation, and do not limit the protection scope of the embodiments of the present application.

[0049] The embodiments of the present application also provide a storage medium storing computer executable instructions, which, when executed by a processor, are used for performing the related operations in the temperature adjustment method provided by any of the embodiments of the present application.

[0050] The computer readable storage medium includes permanent and non-permanent, removable and non-removable media, which can be realized by any method or technology to store information. The information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette, disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information accessible by a computing device.

[0051] It should also be noted that the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed or inherent to such processes, methods, articles or devices. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0052] Note that the above merely describes preferred embodiments of the application and the principles of the application. It will be understood by those skilled in the art that the application is not limited to the specific embodiments described herein, and that changes, modifications and substitutions can be made by those skilled in the art without departing from the scope of the application. Therefore, although the application has been described in detail by the above embodiments, the application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the application, and the scope of the application is determined by the appended claims.

Claims

1. A transmitter, characterized by The power amplification unit, the micro control unit, the temperature detection unit and the fan are included. The power amplification unit includes an isolator, a first attenuator, a drive amplifier, an equalizer, a second attenuator, a band pass filter and a high power amplifier, and the output of the isolator is connected to the input of the first attenuator, the output of the first attenuator is connected to the input of the drive amplifier, the output of the drive amplifier is connected to the input of the equalizer, the output of the equalizer is connected to the input of the second attenuator, the output of the second attenuator is connected to the input of the band pass filter, the output of the band pass filter is connected to the input of the high power amplifier, the control end of the high power amplifier is connected to the signal output end of the micro control unit, and the output end of the high power amplifier is used for outputting the signal processed. The micro control unit is electrically connected with the temperature detection unit and the fan, the temperature detection unit is used for collecting the internal temperature of the transmitter and transmitting the sampling value corresponding to the internal temperature of the transmitter to the micro control unit, and the fan is used for adjusting the rotating speed according to the control signal output by the micro control unit to adjust the temperature of the high power amplifier of the transmitter.

2. The transmitter of claim 1, characterized in that A heat dissipation substrate and a plurality of heat dissipation fins are further included, the power amplification unit, the micro control unit and the temperature detection unit are arranged on the first side of the heat dissipation substrate, a plurality of heat dissipation fins are arranged on the second side of the heat dissipation substrate respectively, the second side is the side opposite to the first side on the heat dissipation substrate, the plurality of heat dissipation fins are used for forming a plurality of ventilation channels on the second side of the heat dissipation substrate, and the fan is located on one side of the heat dissipation fin and used for sending air to the ventilation channels.

3. The transmitter of claim 1 or 2, characterized by The power amplification unit further includes a π attenuator, the input of the π attenuator is connected to the output of the isolator, and the output of the π attenuator is connected to the input of the first attenuator.

4. A temperature adjustment method characterized by, The micro control unit applied to the transmitter in any one of claims 1-3, the temperature adjusting method comprises: acquiring the internal temperature of the transmitter collected by the temperature detection unit; determining the target rotating speed value corresponding to the internal temperature in the mapping data according to the internal temperature, the mapping data including the mapping relationship between the internal temperature and the rotating speed value; adjusting the fan according to the target rotating speed value.

5. The temperature adjustment method of claim 4, wherein, A plurality of temperature intervals are set in the mapping data, and different temperature intervals correspond to different mapping relationships. The determining the target rotating speed value corresponding to the internal temperature in the mapping data according to the internal temperature comprises: determining the target temperature interval in which the internal temperature is located; determining the mapping relationship between the temperature and the rotating speed value in the target temperature interval based on the target temperature interval; determining the target rotating speed value corresponding to the internal temperature in the target temperature interval according to the mapping relationship and the internal temperature.

6. The temperature adjustment method of claim 5, wherein, The determining the mapping relationship corresponding to the target temperature interval based on the target temperature interval comprises: In a case where the internal temperature is in a first interval, the mapping relationship is determined as a first rotating speed value corresponding to a fixed value of the internal temperature; In a case where the internal temperature is in a second interval, the mapping relationship is determined as a one-to-one correspondence between the internal temperature and the rotating speed value according to a first linear relationship, the temperature values in the second interval are all greater than the temperature values in the first interval, and the rotating speed values corresponding to each internal temperature in the second interval are all greater than the first rotating speed value and less than or equal to a second rotating speed value, and the first linear relationship is associated with a first slope; In a case where the internal temperature is in a third interval, the mapping relationship is determined as a one-to-one correspondence between the internal temperature and the rotating speed value according to a second linear relationship, the temperature values in the third interval are all greater than the temperature values in the second interval, and the rotating speed values corresponding to each internal temperature in the third interval are all greater than the second rotating speed value and less than a third rotating speed value, and the second linear relationship corresponds to a second slope; In a case where the internal temperature is in a fourth interval, the mapping relationship is determined as a third rotating speed value corresponding to a fixed value of the internal temperature, and the temperature values in the fourth interval are all greater than the temperature values in the third interval.

7. The temperature adjustment method according to claim 4 or 5, characterized by, Further comprising: Re-adjusting the rotating speed of the fan according to the determined change value of the static current.

8. The temperature regulation method of claim 7, wherein, The re-adjusting the rotating speed of the fan according to the determined change value of the static current comprises: In a case where the static current is less than a preset current value and a difference between the static current and the preset current value is greater than a preset threshold, reducing the rotating speed of the fan by a preset step value on the basis of the target rotating speed value; In a case where the static current is greater than a preset current value and a difference between the static current and the preset current value is greater than a preset threshold, increasing the rotating speed of the fan by a preset step value on the basis of the target rotating speed value.

9. A temperature regulating device, characterized by, The micro control unit is applied to the transmitter in any one of claims 1-3, and the temperature adjusting device comprises: a temperature acquisition module configured to acquire the internal temperature of the transmitter collected by the temperature detection unit; a rotating speed determination module configured to determine a target rotating speed value corresponding to the internal temperature in mapping data according to the internal temperature, the mapping data comprising a mapping relationship between the internal temperature and the rotating speed value; a rotating speed adjustment module configured to adjust the fan according to the target rotating speed value.

10. A storage medium storing computer-executable instructions, wherein: The computer executable instructions, when executed by the processor, are used to perform the temperature adjusting method in any one of claims 4-8. The computer executable instructions, when executed by the processor, are used to perform the temperature adjusting method in any one of claims 4-8.

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