Solvent-resistant heat-resistant epoxy adhesive and preparation method thereof

Abstract

The invention relates to the technical field of epoxy resin adhesives, in particular to a solvent-resistant heat-resistant epoxy adhesive and a preparation method thereof. The solvent-resistant heat-resistant epoxy adhesive is prepared from a component A and a component B, the component A comprises the following raw material components in percentage by mass: 55-60% of epoxy resin, 1-2% of an anti-settling agent, 0.5-1% of a silane coupling agent, 0.5-1% of a defoaming agent and the balance of filler A; the component B comprises the following raw material components in percentage by mass: 20-25% of a curing agent composition, 1-2% of an anti-settling agent, 8-12% of benzyl alcohol and the balance of filler B; wherein the curing agent composition comprises tetraethylenepentamine, dodecenyl succinic anhydride and a modified fatty amine curing agent; aiming at the defects that an existing epoxy adhesive is insufficient in solvent resistance and heat resistance and cannot meet long-term stable use performance, the epoxy adhesive achieves excellent solvent resistance and heat resistance.

Description

Technical Field

[0001] This application relates to the field of epoxy resin adhesive technology, and more specifically, to a solvent-resistant and heat-resistant epoxy adhesive and its preparation method. Background Technology

[0002] Screen printing uses a photosensitive plate-making method to create a screen printing plate with a specific pattern. During its manufacturing process, the secure bonding of the screen to the aluminum frame and steel sheet to form a stable screen printing frame is crucial. However, this field currently faces many serious challenges. On the one hand, the inks and cleaning agents used in the printing process contain a large amount of solvent, which requires the adhesives used to fix the screen to have excellent solvent resistance. On the other hand, during the use of the screen frame, in order to ensure printing results, it is necessary to periodically expose the frame to high-temperature environments and solvents for cleaning, which undoubtedly places high demands on the heat resistance of the adhesives.

[0003] Currently, the most widely used screen printing adhesive, yellow glue, performs poorly in terms of solvent resistance and heat resistance. Epoxy resin adhesives are inherently brittle and have poor heat resistance. Furthermore, in practical applications, they usually need to be used in conjunction with solvent-resistant edge-sealing adhesives, which not only makes the process extremely cumbersome but also significantly increases production and time costs. In addition, yellow glue has an extremely high solvent content, releasing large amounts of volatile organic compounds (VOCs), which not only poses a serious threat to the health of operators but also causes significant damage to the environment. Therefore, the production and preparation of adhesives that possess both solvent resistance and good heat resistance is of paramount practical significance and an urgent need for the manufacture of screen printing frames. Summary of the Invention

[0004] To address the shortcomings of existing epoxy adhesives in terms of solvent resistance and heat resistance, which make them unsuitable for long-term stable use, this application provides a solvent- and heat-resistant epoxy adhesive and its preparation method.

[0005] In a first aspect, this application provides a solvent-resistant and heat-resistant epoxy adhesive, employing the following technical solution: a solvent-resistant and heat-resistant epoxy adhesive, comprising component A and component B; component A comprises the following raw material components by mass percentage: epoxy resin 55-60%, anti-settling agent 1-2%, silane coupling agent 0.5-1%, defoamer 0.5-1%, and the remainder being filler A; component B comprises the following raw material components by mass percentage: curing agent composition 20-25%, anti-settling agent 1-2%, benzyl alcohol 8-12%, and the remainder being filler B; wherein, the curing agent composition comprises tetraethylenepentamine, dodecenyl succinic anhydride, and modified aliphatic amine curing agent.

[0006] Preferably, the modified fatty amine curing agent is composed of 1,3-cyclohexanedimethylamine and a polymer with CAS number 60112-98-3.

[0007] By adopting the above technical solution, the epoxy adhesive achieves excellent solvent resistance and heat resistance after curing with the curing agent composition, enabling the adhesive to maintain a stable working state for a long time under complex working conditions. The epoxy resin in component A, as the main substrate, provides good adhesive strength. The addition of silane coupling agent and filler A serves two purposes: firstly, filler A reduces the curing shrinkage rate and coefficient of linear expansion of the adhesive material, thereby reducing stress, improving interfacial contact with the substrate, and better bonding the mesh frame, thus increasing the adhesive force and maintaining the mesh frame tension; secondly, the silane coupling agent enhances the bonding force between filler A and the substrate, strengthens the material's cohesion, effectively improves the brittleness of the epoxy resin itself, and maintains the overall mechanical properties of the material, such as hardness.

[0008] The curing agent composition in component B is selected from tetraethylenepentamine, dodecenyl succinic anhydride and modified fatty amine curing agent. The inventors have found that the adhesive formed by the combined use of tetraethylenepentamine, dodecenyl succinic anhydride and modified fatty amine curing agent has excellent solvent resistance and heat resistance. This may be because the primary amine active sites in the curing agent composition preferentially promote crosslinking. Due to the high reactivity of the primary amine groups in tetraethylenepentamine, they can react rapidly with the epoxy groups of epoxy resin in the early stage of curing, initiating the curing process. In the modified aliphatic amine curing agent, the cyclohexyl and other primary amine groups further participate in crosslinking, forming a primary crosslinking network. This allows the cyclohexyl groups to embed into the three-dimensional network structure formed by the aliphatic chains. The steric hindrance of the cyclohexyl groups regulates the curing speed, avoiding excessively rapid gelation that would result in more defects and pores in the crosslinking network. The formed primary crosslinking network has both a certain degree of toughness and rigidity. Furthermore, the cyclohexyl groups and the linearly interwoven network structure are beneficial for improving solvent resistance. In the primary crosslinking of tetraethylenepentamine, the diamine introduces a certain degree of toughness and crosslinking space, which is beneficial for the cyclohexane ring to embed as a rigid group into the crosslinking network, improving the density of the primary crosslinking network and restricting chain segment movement, thereby improving hardness and heat resistance. Amino groups can promote the formation of ester bonds between dodecenyl succinic anhydride and epoxy resin through proton transfer. These ester bonds enhance the flexibility of the system and further crosslink in the primary crosslinking network, forming a more complex and dense crosslinking network that improves heat resistance and solvent resistance. The generated ester bonds can also inhibit solvent swelling and prevent solvent molecules from randomly entering the material. The resulting carboxylic acid intermediate can also react with the hydroxyl groups formed after rapid initiation and curing of tetraethylenepentamine, further improving the crosslinking properties of the material. This allows the introduced hydrophobic and flexible long chains of dodecenyl groups to interweave in the system network, filling the gaps in the crosslinking network, enhancing flexibility, relieving internal stress, reducing the permeability of solvent molecules, and thus effectively blocking the penetration pathways of polar solvents such as ethanol and acetone.

[0009] The remaining rigid aromatic rings in modified aliphatic amine curing agents can be further embedded into the aforementioned cross-linked network through cross-linking. This not only constructs a more complex network structure but also enhances the density of the cross-linked network due to the shielding effect of the aromatic rings. This significantly improves resistance to penetration by non-polar solvents, further enhancing the solvent resistance and thermal stability of the cross-linked network. Consequently, epoxy adhesives exhibit swelling resistance, penetration resistance, and crack resistance in complex solvent environments. This also prevents epoxy resins from deforming and degrading under heat, allowing them to withstand higher temperatures without losing their properties, resulting in good heat resistance. Furthermore, due to the relatively low reactivity of phenolic hydroxyl groups, they play a crucial role in the later stages of curing, ensuring the curing reaction continues and leading to a tighter buildup of the cross-linked network. This significantly improves the mechanical properties, resulting in a better balance in the hardness, strength, solvent resistance, and toughness of the cured material. Therefore, by selecting the right curing agent, the heat and solvent resistance of the adhesive can be improved through multi-level gradient cross-linking and the construction of a denser molecular cross-linked network.

[0010] Fillers can further fill voids and increase hardness, enabling the adhesive to form a denser cross-linked network structure during curing. This results in superior stability against solvent attack, significantly improving the adhesive's heat and solvent resistance, thus meeting the stringent requirements for adhesives in screen printing frame manufacturing. Furthermore, the addition of benzyl alcohol optimizes the system's flowability, ensuring uniform curing and further enhancing overall heat resistance.

[0011] The mass ratio of tetraethylenepentamine, dodecenylsuccinic anhydride and modified fatty amine curing agent is 1:(0.3-0.5):(0.8-1.2).

[0012] The applicant discovered that the curing agent composition within the specified proportions of this application works synergistically to enable the epoxy resin curing process to proceed in stages, forming a hierarchical and dense cross-linked network. This optimizes the cross-linked skeleton and heat resistance, resulting in significant improvements in curing effect, heat resistance, and solvent resistance. The applicant also discovered that when the content of tetraethylenepentamine, which rapidly initiates curing in the initial stage, is too low, the initial cross-linking speed of the epoxy resin slows down, preventing the rapid formation of a structural basis. This leads to a slow increase in system viscosity, delayed epoxy resin setting, and a poorer cross-linked structure. Furthermore, a low content of dodecenyl succinic anhydride reduces curing uniformity, material toughness, solvent resistance, and resistance to penetration and cracking. Consequently, the cured epoxy resin struggles to achieve a good balance in hardness, strength, and toughness, making it more prone to deformation and degradation under heat. Excessive use of modified aliphatic amine curing agents disrupts the regularity of the cured structure and introduces unreacted functional groups or voids, making it easier for solvent molecules to overcome steric hindrance and chemical bond forces to diffuse into the resin, thus reducing solvent resistance.

[0013] Preferably, the epoxy resin is a fluorinated modified epoxy resin, and the preparation method of the fluorinated modified epoxy resin includes: under a nitrogen atmosphere, adding 0.1-0.2 mol of isophorone diisocyanate, 0.08-0.1 mol of octafluoropentanol, and 0.002-0.005 mol of stannous octoate sequentially to 200-240 g of butyl acetate, reacting under reflux at 35-40°C for 1-2 h, then slowly adding a mixture of bisphenol F epoxy resin and butyl acetate containing 0.15-0.22 mol of bisphenol F epoxy resin, and after the addition is complete, heating to 75-80°C and reacting for 2-3 h, and then rotary evaporating to obtain the fluorinated modified epoxy resin.

[0014] By employing the above technical solution, fluorine-modified epoxy resin is introduced with fluorinated groups. The CF bond has extremely high bond energy, making it difficult to break under heat or chemical attack. Furthermore, the fluorinated groups have extremely low surface energy and strong electronegativity, reducing the surface free energy of the adhesive. This results in fluorinated epoxy resin exhibiting excellent hydrophobicity and oleophobicity, reducing the wetting and penetration ability of solvent molecules and enhancing solvent resistance. Simultaneously, the small atomic radius of fluorine atoms and their relatively regular arrangement on the molecular chain lead to a tighter packing of the molecular chains, increasing chain regularity and reducing gaps between chains. This, in conjunction with the curing agent, restricts the movement of the molecular chains. Under heat, the movement of the molecular chains is hindered, making chain segment creep and deformation difficult, allowing the resin to maintain its structural stability at higher temperatures, thus improving heat resistance. This tight packing structure also restricts the entry of solvent molecules, significantly improving the resin's resistance to organic solvents. Fluorinated modified epoxy resins can also form a tighter interfacial structure with aliphatic modified calcium carbonate, which restricts the diffusion of solvent molecules in the system and thus improves solvent resistance.

[0015] In one specific implementation, the filler A includes calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate.

[0016] The mass ratio of calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate is (1-1.5):20:(16-20).

[0017] The filler B is fatty acid modified heavy calcium carbonate and fatty acid modified light calcium carbonate in a mass ratio of 1:(0.2-0.4).

[0018] By adopting the above technical solution, calcium oxide in filler A can promote the cross-linking and curing of epoxy resin, enhance the cohesive force of the adhesive, and the addition of heavy calcium carbonate further improves the hardness, rigidity, and wear resistance of the adhesive. Surface-treated calcium carbonate improves compatibility. The components of filler A work together to stabilize the adhesive's bonding performance and improve its mechanical properties, reduce the curing shrinkage and coefficient of linear expansion, and improve the overall performance of the adhesive. However, the reduced content of surface-treated calcium carbonate in fatty acid treatment results in insufficient dispersibility and poor compatibility of the filler in the epoxy resin, making it prone to agglomeration. This not only affects the coating properties of the material but also correspondingly reduces processing properties such as tensile strength.

[0019] In one specific implementation scheme, the anti-settling agent is nano-fumed silica; the defoamer is a vinyl ether defoamer; and the silane coupling agent is γ-(2,3-epoxypropoxy)propyltrimethoxysilane.

[0020] Secondly, this application provides a method for preparing a solvent-resistant and heat-resistant epoxy adhesive, using the following technical solution: A method for preparing a solvent-resistant and heat-resistant epoxy adhesive includes the following steps: S1: The preparation method of component A includes: mixing a portion of epoxy resin, filler A, and anti-settling agent, stirring at low speed for 10-15 minutes, and then switching to vacuum high-speed stirring for 30-40 minutes; then adding silane coupling agent, the remaining epoxy resin, and defoamer, stirring at low speed for 5-10 minutes, and then switching to vacuum high-speed stirring for 20-30 minutes to obtain component A; S2: The preparation method of component B includes: mixing the curing agent composition, filler B, and anti-settling agent, stirring at low speed for 10-15 minutes, then switching to vacuum high-speed stirring for 30-40 minutes; then adding benzyl alcohol, stirring at low speed for 5-10 minutes, then switching to vacuum high-speed stirring for 20-30 minutes to obtain component B; S3: Mix component A and component B uniformly at a weight ratio of (1.8-2.2):1 to obtain a solvent-resistant and heat-resistant epoxy adhesive.

[0021] The low-speed stirring speed is 400-500 r / min, and the high-speed stirring speed is 900-1000 r / min. In summary, this application has the following beneficial effects: 1. After curing with the curing agent composition, the epoxy adhesive achieves excellent solvent and heat resistance, enabling it to maintain long-term stable operation under complex conditions. The curing agent composition in component B ensures a more complete curing reaction and a higher degree of cross-linking, resulting in a denser cross-linked network structure during curing. This leads to superior stability against solvent attack, significantly improving the adhesive's heat and solvent resistance, thus meeting the stringent requirements for adhesives in the screen printing frame manufacturing process.

[0022] 2. Calcium oxide in filler A can promote the cross-linking and curing of epoxy resin and enhance the cohesiveness of the adhesive. The addition of heavy calcium carbonate further improves the hardness, rigidity and wear resistance of the adhesive. Surface-treated calcium carbonate improves compatibility, and fatty acid modification further improves the filler by fixing it in the cross-linking network, thereby further enhancing the solvent resistance and heat resistance of the adhesive. Detailed Implementation

[0023] The present application will be further described in detail below with reference to the embodiments.

[0024] raw material Some of the raw materials used in the preparation examples and embodiments: Modified fatty amine curing agent (model: DAITOCURAR) B-2413; the epoxy resin is bisphenol F type epoxy resin, brand name EPIKOTE862, purchased from Guangzhou Huali Trading Co., Ltd.; dodecenyl succinic anhydride was purchased from Shanghai Mairui Biochemical Technology Co., Ltd.; nano-fumed silica, model: HL-200; defoamer is polyoxyethylene polyoxypropylene monobutyl ether, model name: XD-400; silane coupling agent is γ-(2,3-epoxypropoxy)propyltrimethoxysilane; calcium oxide, product number 03698-01, purchased from Lingshou County Xuanguang Mineral Products Processing Plant; heavy calcium carbonate (325 mesh) was purchased from Lingshou County Qiangdong Mineral Products Processing Plant; light calcium carbonate was purchased from Foshan Bozhen Chemical Co., Ltd.; tetraethylenepentamine was purchased from Nanjing Beihua Chemical Co., Ltd.; benzyl alcohol was purchased from Wuhan Jiye Chemical Co., Ltd.; octafluoropentanol was purchased from Jiangsu Xinsu New Materials Co., Ltd.; stannous octoate was purchased from Wuhan Kanos Technology Co., Ltd.

[0025] Unless otherwise specified, all raw materials used in the examples and comparative examples are commercially available products.

[0026] Preparation Example 1 Fatty acid modified heavy calcium carbonate: Dissolve 9g of sodium hydroxide in 100g of water at 90℃, then add 1.2g of stearic acid, saponify for 30min to obtain saponified solution; Weigh 95g of heavy calcium carbonate and add it to 250g of water. Stir at 800r / min for 30min to obtain heavy calcium carbonate slurry. Add the saponification liquid obtained above, control the temperature at 80℃, activate for 20min to dehydrate, dry and pulverize at 60℃ to obtain fatty acid modified heavy calcium carbonate.

[0027] Preparation Example 2 Fatty acid modified light calcium carbonate: Dissolve 9g of sodium hydroxide in 100g of water at 90℃, then add 1.2g of stearic acid, saponify for 30min to obtain saponified solution; Weigh 95g of light calcium carbonate and add it to 250g of water. Stir at 800r / min for 30min to obtain light calcium carbonate slurry. Add the saponification liquid obtained above, control the temperature at 80℃, activate for 20min to dehydrate, dry and pulverize at 60℃ to obtain fatty acid modified light calcium carbonate.

[0028] Preparation Example 3 Fluorine-modified epoxy resin: Under a nitrogen atmosphere, 0.2 mol of isophorone diisocyanate, 0.1 mol of octafluoropentanol, and 0.002 mol of stannous octoate were sequentially added to 240 g of butyl acetate. The mixture was refluxed at 35 °C for 2 h. Subsequently, a mixture of bisphenol F epoxy resin and butyl acetate containing 0.22 mol of bisphenol F epoxy resin was slowly added dropwise. The mass of butyl acetate was 2.5 times that of bisphenol F epoxy resin. After the addition was complete, the temperature was raised to 80 °C and the mixture was reacted for 2 h. The butyl acetate was then rotary evaporated at 60 °C to obtain the fluorine-modified epoxy resin.

[0029] Preparation Example 4 Fluorine-modified epoxy resin: Under a nitrogen atmosphere, 0.1 mol of isophorone diisocyanate, 0.08 mol of octafluoropentanol, and 0.003 mol of stannous octoate were sequentially added to 200 g of butyl acetate. The mixture was refluxed at 40 °C for 1 h. Subsequently, a mixture of bisphenol F epoxy resin and butyl acetate containing 0.12 mol of bisphenol F epoxy resin was slowly added dropwise. The mass of butyl acetate was 2.5 times that of bisphenol F epoxy resin. After the addition was complete, the temperature was raised to 75 °C and the mixture was reacted for 3 h. The fluorine-modified epoxy resin was obtained by rotary evaporation of butyl acetate at 60 °C. Example 1

[0030] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to make up to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.4:0.8. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 in a mass ratio of 1.5:20:16. Filler B is fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive. Example 2

[0031] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to make up to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.3:1.2. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 in a mass ratio of 1.5:20:16. Filler B is fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive. Example 3

[0032] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to make up to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 0.7:0.4:1.1. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 in a mass ratio of 1.5:20:16. Filler B is fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive. Example 4

[0033] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to make up to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.7:0.5. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 in a mass ratio of 1.5:20:16. Filler B is fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive. Example 5

[0034] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to make up to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.4:0.8. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 in a mass ratio of 0.5:20:17. Filler B is fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive. Example 6

[0035] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to make up to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.4:0.8. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 in a mass ratio of 1.5:24:12. Filler B is fatty acid modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive. Example 7

[0036] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to bring the total to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to bring the total to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.4:0.8. Filler A is calcium oxide in a mass ratio of 1.5:36 and fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1. Filler B is fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid-modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.4. The preparation method of the solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 500 r / min for 15 min, then stirred at 900 r / min under vacuum for 40 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 500 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 500 r / min for 15 min, then stirring at 900 r / min under vacuum for 40 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive. Example 8

[0037] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to bring the total to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to bring the total to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.4:0.8. Filler A is calcium oxide and heavy calcium carbonate in a mass ratio of 1.5:36. Filler B is fatty acid modified heavy calcium carbonate obtained in Preparation Example 1 and fatty acid modified light calcium carbonate obtained in Preparation Example 2 in a mass ratio of 1:0.4. The preparation method of the solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 500 r / min for 15 min, then stirred at 900 r / min under vacuum for 40 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 500 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 500 r / min for 15 min, then stirring at 900 r / min under vacuum for 40 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive. Example 9

[0038] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to bring the total to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to bring the total to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.4:0.8. Filler A is heavy calcium carbonate in a mass ratio of 21.5:16 and fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1. Filler B is fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid-modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.4. The preparation method of the solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 500 r / min for 15 min, then stirred at 900 r / min under vacuum for 40 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 500 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 500 r / min for 15 min, then stirring at 900 r / min under vacuum for 40 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive. Example 10

[0039] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g of epoxy resin obtained in Preparation Example 3, 2g of anti-settling agent, 0.5g of silane coupling agent, 1g of defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g of curing agent composition, 2g of anti-settling agent, 8g of benzyl alcohol, and filler B to make up to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.4:0.8. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate obtained in Preparation Example 1 in a mass ratio of 1.5:20:16. Filler B is fatty acid modified heavy calcium carbonate obtained in Preparation Example 1 and fatty acid modified light calcium carbonate obtained in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin obtained in Preparation Example 3, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred under vacuum at 900 r / min for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred under vacuum at 900 r / min for 20 min to obtain component A; the preparation method of component B includes... The process includes: mixing tetraethylenepentamine, modified fatty amine curing agent, filler B, and anti-settling agent, stirring at 400 rpm for 10 min, then stirring at 900 rpm under vacuum for 30 min; adding benzyl alcohol, stirring at 400 rpm for 5 min, then stirring at 900 rpm under vacuum for 10 min, then adding dodecenyl succinic anhydride, and stirring at 85°C for 10 min to obtain component B; uniformly mixing component A and component B at a weight ratio of 2:1 to obtain a solvent-resistant and heat-resistant epoxy adhesive. Example 11

[0040] A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g of epoxy resin obtained in Preparation Example 4, 2g of anti-settling agent, 0.5g of silane coupling agent, 1g of defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g of curing agent composition, 2g of anti-settling agent, 8g of benzyl alcohol, and filler B to make up to 100g. The curing agent composition is tetraethylenepentamine, dodecenyl succinic anhydride, and modified fatty amine curing agent in a mass ratio of 1:0.4:0.8. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate obtained in Preparation Example 1 in a mass ratio of 1.5:20:16. Filler B is fatty acid modified heavy calcium carbonate obtained in Preparation Example 1 and fatty acid modified light calcium carbonate obtained in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin obtained in Preparation Example 4, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred under vacuum at 900 r / min for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred under vacuum at 900 r / min for 20 min to obtain component A; the preparation method of component B includes... The process includes: mixing tetraethylenepentamine, modified fatty amine curing agent, filler B, and anti-settling agent, stirring at 400 rpm for 10 min, then stirring at 900 rpm under vacuum for 30 min; adding benzyl alcohol, stirring at 400 rpm for 5 min, then stirring at 900 rpm under vacuum for 10 min, then adding dodecenyl succinic anhydride, and stirring at 85°C for 10 min to obtain component B; uniformly mixing component A and component B at a weight ratio of 2:1 to obtain a solvent-resistant and heat-resistant epoxy adhesive.

[0041] Comparative Example 1 A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to make up to 100g. The curing agent composition is tetraethylenepentamine and dodecenyl succinic anhydride in a mass ratio of 1.8:0.4. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 in a mass ratio of 1.5:20:16. Filler B is fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid-modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of the solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive.

[0042] Comparative Example 2 A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to make up to 100g. The curing agent composition is a curing agent consisting of tetraethylenepentamine and modified fatty amine in a mass ratio of 1.4:0.8. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 in a mass ratio of 1.5:20:16. Filler B is fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid-modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, modified aliphatic amine curing agent, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive.

[0043] Comparative Example 3 A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to make up to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to make up to 100g. The curing agent composition is a curing agent consisting of dodecenyl succinic anhydride and modified fatty amine in a mass ratio of 0.4:1.8. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 in a mass ratio of 1.5:20:16. Filler B is fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid-modified light calcium carbonate prepared in Preparation Example 2 in a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: Mixing modified fatty amine curing agent, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, then dodecenyl succinic anhydride is added, and stirred at 85℃ for 10 min to obtain component B; Component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive.

[0044] Comparative Example 4 A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to bring the total to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to bring the total to 100g. The curing agent is tetraethylenepentamine. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1, with a mass ratio of 1.5:20:16. Filler B is fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid-modified light calcium carbonate prepared in Preparation Example 2, with a mass ratio of 1:0.2. The preparation method of the solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing tetraethylenepentamine, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, and stirred at 85℃ for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive.

[0045] Comparative Example 5 A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to bring the total to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to bring the total to 100g. The curing agent is dodecenyl succinic anhydride. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1, with a mass ratio of 1.5:20:16. Filler B is fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid-modified light calcium carbonate prepared in Preparation Example 2, with a mass ratio of 1:0.2. The preparation method of the solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: mixing filler B and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol and dodecenyl succinic anhydride are added, stirred at 85℃ for 10 min, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min to obtain component B; component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive.

[0046] Comparative Example 6 A solvent- and heat-resistant epoxy adhesive comprises component A and component B. Component A includes the following raw material components: 55g epoxy resin, 2g anti-settling agent, 0.5g silane coupling agent, 1g defoamer, and filler A to bring the total to 100g. Component B includes the following raw material components by mass percentage: 20g curing agent composition, 2g anti-settling agent, 8g benzyl alcohol, and filler B to bring the total to 100g. The curing agent is a modified fatty amine curing agent. Filler A is calcium oxide, heavy calcium carbonate, and fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1, with a mass ratio of 1.5:20:16. Filler B is fatty acid-modified heavy calcium carbonate prepared in Preparation Example 1 and fatty acid-modified light calcium carbonate prepared in Preparation Example 2, with a mass ratio of 1:0.2. The preparation method of solvent-resistant and heat-resistant epoxy adhesive includes the following steps: The preparation method of component A is as follows: First, half of the epoxy resin, filler A, and anti-settling agent are mixed and stirred at 400 r / min for 10 min, then stirred at 900 r / min under vacuum for 30 min; then, silane coupling agent, the remaining half of the epoxy resin, and defoamer are added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 20 min to obtain component A; The preparation method of component B includes: Mixing modified fatty amine curing agent, filler B, and anti-settling agent, stirring at 400 r / min for 10 min, then stirring at 900 r / min under vacuum for 30 min; then, benzyl alcohol is added, stirred at 400 r / min for 5 min, then stirred at 900 r / min under vacuum for 10 min, and stirred at 85℃ for 10 min to obtain component B; Component A and component B are uniformly mixed at a weight ratio of 2:1 to obtain the solvent-resistant and heat-resistant epoxy adhesive.

[0047] The performance of the solvent-resistant and heat-resistant epoxy adhesives prepared in Examples 1-11 and Comparative Examples 1-6 was tested using the following method: a. Hardness test: Tested according to ISO 868 Shore hardness standard; Test piece size: approximately φ48 × approximately 5mm Shore D hardness; b. Tensile shear strength: Tested according to ISO4587 standard; 100×25×1.6mm bonded steel plate, sanded with #240 sandpaper, cleaned with acetone; Hardening conditions: 80℃ for 20min, immersed in acetone and toluene at room temperature (about 23℃) for 7 days, and the standard and immersion tensile shear strengths were recorded respectively. c. Heat and oil resistance test: The test piece was shaped as follows: φ48mm × φ3mm; curing conditions: 80℃ × 20min; after 7 days at room temperature (approximately 23℃), the test piece was completely immersed in automotive 5W-30 engine oil, sealed, and baked in an oven at 120℃ for 500 hours. The mass before and after was measured, and the difference between the mass before and after was divided by the mass before baking to obtain the mass change rate (%). The performance results are shown in Table 1. Table 1 Performance Test Results As shown in Table 1, compared with Examples 1-4 and Comparative Examples 1-6, the curing agent compositions within the proportion range of this application work together to enable epoxy resin to undergo gradient curing at different stages. Based on the characteristic groups of different curing agents and the gradient curing process, a more complex and dense cross-linked network is formed, which greatly improves the solvent resistance and heat resistance of the adhesive. Tetraethylenepentamine has high activity and rapidly initiates curing. The long-chain alkyl groups of dodecenyl succinic anhydride fill the gaps in the network, reducing the permeability of solvent molecules and relieving internal stress. At the same time, it modifies the rigid aromatic and alicyclic structures in the aliphatic amine curing agent, which can effectively resist the penetration of non-polar solvents, further enhancing the solvent resistance and thermal stability of the cross-linked network. As a result, the epoxy adhesive has the properties of swelling resistance, penetration resistance, and crack resistance in complex solvent environments. It makes the epoxy resin less prone to deformation and degradation when heated, allowing it to withstand high temperatures without losing its properties, and has good heat resistance. This results in a good balance in terms of hardness, strength, and toughness of the cured material.

[0048] Comparing Examples 1 and 5-9, it can be seen that calcium oxide can promote the cross-linking and curing of epoxy resin and enhance the cohesive force of the adhesive. The addition of heavy calcium carbonate further improves the hardness, rigidity and wear resistance of the adhesive. Surface-treated calcium carbonate improves the compatibility and stability of the adhesive's bonding performance and enhances its mechanical properties, thereby improving the overall performance of the adhesive.

[0049] Comparing Examples 1 and 10-11, it can be seen that the fluorinated modified epoxy resin improves all aspects of its performance. This is not only because it has good hydrophobicity and oleophobicity, which reduces the wetting and penetration ability of solvent molecules into the resin and improves the resin's resistance to organic solvents, but more importantly, the fluorinated groups participate in the construction of complex cross-linking networks based on curing, thereby further improving the heat resistance and solvent resistance.

[0050] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made to the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A solvent-resistant and heat-resistant epoxy adhesive, characterized in that: It is composed of component A and component B; component A includes the following raw material components by mass percentage: epoxy resin 55-60%, anti-settling agent 1-2%, silane coupling agent 0.5-1%, defoamer 0.5-1%, and the remainder is filler A; component B includes the following raw material components by mass percentage: curing agent composition 20-25%, anti-settling agent 1-2%, benzyl alcohol 8-12%, and the remainder is filler B; wherein, the curing agent composition includes tetraethylenepentamine, dodecenyl succinic anhydride, and modified aliphatic amine curing agent.

2. The solvent-resistant and heat-resistant epoxy adhesive according to claim 1, characterized in that: The mass ratio of tetraethylenepentamine, dodecenylsuccinic anhydride and modified fatty amine curing agent is 1:(0.3-0.5):(0.8-1.2).

3. The solvent-resistant and heat-resistant epoxy adhesive according to claim 1, characterized in that: The filler A includes calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate.

4. The solvent-resistant and heat-resistant epoxy adhesive according to claim 3, characterized in that: The mass ratio of calcium oxide, heavy calcium carbonate, and fatty acid modified heavy calcium carbonate is (1-1.5):20:(16-20).

5. The solvent-resistant and heat-resistant epoxy adhesive according to claim 1, characterized in that: The filler B is fatty acid modified heavy calcium carbonate and fatty acid modified light calcium carbonate in a mass ratio of 1:(0.2-0.4).

6. The solvent-resistant and heat-resistant epoxy adhesive according to claim 1, characterized in that: The anti-settling agents are all nano-vaporized silica; the defoamers are vinyl ether defoamers; and the silane coupling agents are γ-(2,3-epoxypropoxy)propyltrimethoxysilane.

7. A method for preparing the solvent-resistant and heat-resistant epoxy adhesive according to any one of claims 1-6, characterized in that, Includes the following steps: S1: The preparation method of component A includes: mixing a portion of epoxy resin, filler A, and anti-settling agent, stirring at low speed for 10-15 minutes, then switching to vacuum high-speed stirring for 30-40 minutes; then adding silane coupling agent, the remaining epoxy resin, and defoamer, stirring at low speed for 5-10 minutes, then switching to vacuum high-speed stirring for 20-30 minutes to obtain component A. S2: The preparation method of component B includes: mixing the curing agent composition, filler B, and anti-settling agent, stirring at low speed for 10-15 minutes, then switching to vacuum high-speed stirring for 30-40 minutes; then adding benzyl alcohol, stirring at low speed for 5-10 minutes, then switching to vacuum high-speed stirring for 20-30 minutes to obtain component B; S3: Mix component A and component B uniformly at a weight ratio of (1.8-2.2):1 to obtain a solvent-resistant and heat-resistant epoxy adhesive.

8. The method for preparing the solvent-resistant and heat-resistant epoxy adhesive according to claim 7, characterized in that: The low-speed stirring speed is 400-500 r / min, and the high-speed stirring speed is 900-1000 r / min.

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