Stress sensor calibration method, device, equipment and medium
By performing finite element analysis on tensile data and multi-source calibration of strain gauge data, drawing stress cloud diagrams and establishing linear regression models, the high-precision calibration problem of stress sensors for irregularly shaped pipes was solved, improving detection accuracy and reliability.
Patent Information
- Application Number
- CN202511199433.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-26
- Publication Date
- 2025-11-14
AI Technical Summary
Due to stress concentration and boundary constraint interference effects caused by the geometric irregularities of non-standard specimens, existing stress sensor calibration methods cannot meet high-precision requirements and cannot accurately characterize the multi-dimensional stress distribution of irregularly shaped pipes.
By acquiring tensile data and performing finite element analysis, combined with stress and strain data from strain gauges, first and second stress cloud diagrams are plotted. Multi-source data calibration and comprehensive analysis are then performed to establish a linear regression model for calibrating the stress sensor.
This significantly improves the calibration accuracy and reliability of stress sensors, and enhances the ability to detect pipeline stress.
Smart Images
Figure CN120947899A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of sensor technology, and in particular to a method, apparatus, device and medium for calibrating a stress sensor. Background Technology
[0002] As a critical component in oil and gas transportation, chemical production, and other fields, the stress state of pipelines directly affects their structural safety and lifespan. Therefore, it is necessary to periodically monitor the stress state of pipelines using stress sensors. Accurate calibration of the stress sensors is essential for obtaining precise stress state data.
[0003] In practice, since the pipes being tested are mostly irregularly shaped, stress sensors need to be calibrated using non-standard specimens. However, due to stress concentration and boundary constraint interference effects caused by the geometric irregularities of non-standard specimens, the internal stress distribution of non-standard specimens exhibits significant non-uniformity, resulting in a large difference between the stress sensor calibration results and the actual stress, which fails to meet the high-precision requirements of stress sensor calibration. Summary of the Invention
[0004] This disclosure provides a method, apparatus, device, and medium for calibrating a stress sensor, aiming to solve the problem of how to accurately calibrate a stress sensor.
[0005] To achieve the above objectives, this application adopts the following technical solution:
[0006] In a first aspect, a stress sensor calibration method is provided, comprising: acquiring tensile force data applied to a test object, and performing finite element analysis on the test object based on the tensile force data to determine a first stress contour map; the first stress contour map is used to characterize the stress data corresponding to each point on the upper surface of the test object; acquiring stress data of strain gauges disposed on the surface of the test object and strain data of each point on the upper surface of the test object after applying tensile force data, and determining a second stress contour map based on the stress data of the strain gauges and the strain data of each point on the upper surface of the test object; the second stress contour map is used to characterize the stress data corresponding to each point on the upper surface of the test object; determining calibration data corresponding to the tensile force data based on the tensile force data, the first stress contour map, the stress data of the strain gauges, and the second stress contour map; and calibrating the stress sensor based on the calibration data corresponding to multiple tensile force data.
[0007] In some embodiments, determining the calibration data corresponding to the tensile data based on the tensile data, the first stress contour map, the strain gauge stress data, and the second stress contour map includes: acquiring the cross-sectional area of the test object and determining the ratio of the tensile data to the cross-sectional area of the test object as the stress data corresponding to the tensile data; performing a weighted summation on the stress data corresponding to the tensile data, the first stress contour map, the strain gauge stress data, and the second stress contour map to determine the comprehensive stress data at the corresponding position of the strain gauge; and determining the average value of the comprehensive stress data at the corresponding positions of multiple strain gauges as the calibration data corresponding to the tensile data.
[0008] In some embodiments, obtaining stress data of strain gauges disposed on the surface of the test object includes: obtaining strain data of the strain gauges and determining the stress data of the strain gauges by multiplying the Young's modulus of the test object and the strain data of the strain gauges.
[0009] In some embodiments, obtaining strain data at each point on the upper surface of the test object after applying tensile force data to the test object includes: obtaining displacement data of the spots sprayed on the surface of the test object after applying tensile force data to the test object, and determining the ratio of the displacement data to the length of the test object as the strain data at each point on the upper surface of the test object.
[0010] In some embodiments, determining a second stress contour map based on the stress data of the strain gauge and the strain data of each point on the upper surface of the test object includes: determining the stress data of each point on the upper surface of the test object as the product of the Young's modulus of the test object and the strain data of each point on the upper surface of the test object; using the stress data of the strain gauge as a standard value to correct the stress data of each point on the upper surface of the test object, and drawing a second stress contour map based on the corrected stress data of each point.
[0011] In some embodiments, the stress sensor is calibrated based on calibration data corresponding to multiple tensile data, including: acquiring electrical signal data corresponding to the tensile data of the stress sensor after applying tensile data to the test object; using the electrical signal data corresponding to the tensile data as the independent variable and the calibration data corresponding to the tensile data as the dependent variable, establishing a linear regression model of the electrical signal data corresponding to the tensile data and the calibration data corresponding to the tensile data, so as to calibrate the stress sensor.
[0012] In some embodiments, a plurality of strain gauges are disposed around the stress sensor on the upper surface of the test object, or a plurality of strain gauges are disposed on the upper and / or lower surface of the test object.
[0013] Secondly, a stress sensor calibration device is provided, which includes: a finite element analysis module, a multi-source data acquisition module, and a data processing module;
[0014] The finite element analysis module is used to acquire the tensile force data applied to the test object, and to perform finite element analysis on the test object based on the tensile force data to determine the first stress cloud map; the first stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the test object.
[0015] The multi-source data acquisition module is used to acquire stress data from strain gauges set on the surface of the test object and strain data at each point on the upper surface of the test object after applying tensile force to the test object. Based on the stress data from the strain gauges and the strain data at each point on the upper surface of the test object, a second stress cloud map is determined. The second stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the test object.
[0016] The data processing module is used to determine the calibration data corresponding to the tensile data based on the tensile data, the first stress contour map, the stress data of the strain gauge, and the second stress contour map.
[0017] The data processing module is also used to calibrate the stress sensor based on calibration data corresponding to multiple tensile force data.
[0018] Thirdly, a stress sensor calibration device is provided, including a memory and a processor; the memory is used to store computer-executed instructions, and the processor is connected to the memory via a bus; when the stress sensor calibration device is running, the processor executes the computer-executed instructions stored in the memory, so that the stress sensor calibration device performs the stress sensor calibration method of the first aspect.
[0019] The stress sensor calibration device can be an electronic device or a component of an electronic device, such as a chip system within the electronic device. The chip system supports the electronic device in implementing the functions involved in the first aspect and any possible implementation thereof, such as acquiring and determining the data and / or information involved in the aforementioned stress sensor calibration method. The chip system includes a chip, but may also include other discrete devices or circuit structures.
[0020] Fourthly, a computer-readable storage medium is provided, comprising computer-executable instructions that, when executed on a computer, cause the computer to perform the stress sensor calibration method described in the first aspect.
[0021] Fifthly, a computer program product is also provided, which includes a computer program or instructions that, when executed on a stress sensor calibration device, cause the stress sensor calibration device to perform the stress sensor calibration method as described in the first aspect above.
[0022] It should be noted that the aforementioned computer instructions may be stored, in whole or in part, on a computer-readable storage medium. This computer-readable storage medium may be packaged together with the processor of the stress sensor calibration device, or it may be packaged separately from the processor of the stress sensor calibration device; this application does not limit this.
[0023] The descriptions of the second, third, fourth, and fifth aspects of this application can be referenced to the detailed description of the first aspect.
[0024] In the embodiments of this application, the name of the stress sensor calibration device described above does not limit the device or functional module itself. In actual implementation, these devices or functional modules may appear under other names. For example, the receiving unit may also be called a receiving module, receiver, etc. As long as the function of each device or functional module is similar to that of this application, it falls within the scope of the claims of this application and its equivalents.
[0025] This application provides a stress sensor calibration method. It acquires tensile force data applied to a test object and performs finite element analysis on the test object based on the tensile force data to determine a first stress contour map. The first stress contour map characterizes the stress data corresponding to each point on the upper surface of the test object. Next, it acquires stress data from strain gauges placed on the surface of the test object and strain data at each point on the upper surface of the test object after applying tensile force. Based on the stress data from the strain gauges and the strain data at each point on the upper surface of the test object, it determines a second stress contour map. The second stress contour map characterizes the stress data corresponding to each point on the upper surface of the test object. Subsequently, it determines calibration data corresponding to the tensile force data based on the tensile force data, the first stress contour map, the strain gauge stress data, and the second stress contour map. Finally, it calibrates the stress sensor based on the calibration data corresponding to multiple tensile force data points.
[0026] As shown above, this scheme can clearly and accurately represent the stress data of each point on the upper surface of the tested object through the first stress cloud map and the second stress cloud map. This scheme also determines the stress data corresponding to the tensile force data, the first stress cloud map, the stress data of the strain gauge, and the second stress cloud map by determining four types of multi-source data. Based on the stress data obtained from these multi-source data, mutual calibration and comprehensive analysis are performed to jointly determine the stress data corresponding to the sensor's electrical signal. This accurately calibrates the stress sensor, significantly improves the calibration accuracy and reliability of the stress sensor, thereby improving the pipeline stress detection capability and solving the problem of how to accurately calibrate the stress sensor. Attached Figure Description
[0027] Figure 1A This is a schematic diagram of the structure of a stress sensor calibration system provided in an embodiment of this application;
[0028] Figure 1B This is a schematic diagram of another stress sensor calibration system provided in the embodiments of this application;
[0029] Figure 2 A schematic diagram of the hardware structure of a stress sensor calibration device provided in this application embodiment;
[0030] Figure 3 A schematic flowchart illustrating a stress sensor calibration method provided in this application embodiment;
[0031] Figure 4 This is a schematic diagram of a multivariate regression algorithm provided in an embodiment of this application;
[0032] Figure 5 A schematic flowchart illustrating another stress sensor calibration method provided in this application embodiment;
[0033] Figure 6 This is a schematic diagram of a stress sensor calibration device provided in an embodiment of this application. Detailed Implementation
[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0035] It should be noted that in the embodiments of this application, the words "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.
[0036] To facilitate a clear description of the technical solutions of the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish the same or similar items with essentially the same function and effect. Those skilled in the art can understand that the terms "first" and "second" are not intended to limit the quantity or execution order.
[0037] As described in the background section, pipelines are key components in fields such as oil and gas transportation and chemical production. The stress state of pipelines directly affects their structural safety and lifespan. Therefore, it is necessary to periodically detect the stress state of pipelines using stress sensors. To obtain accurate stress state data for pipelines, the stress sensors need to be accurately calibrated.
[0038] In practice, since the pipes being tested are mostly irregularly shaped, stress sensors need to be calibrated using non-standard specimens. However, due to the stress concentration and boundary constraint interference effects caused by the geometric irregularities of non-standard specimens, the internal stress distribution exhibits significant non-uniformity, and the actual stress at each point may vary greatly.
[0039] Currently, commonly used stress detection methods include strain gauge methods, X-ray methods, ultrasonic methods, and electromagnetic methods. These methods can only obtain stress data at local points, making it difficult to comprehensively characterize complex stress fields and fully depict the multi-dimensional stress distribution under different stress states. Therefore, if stress sensors are calibrated solely based on local point stress data, a significant systematic error will be introduced, leading to a substantial difference between the stress sensor calibration results and the actual stress, thus failing to meet the high-precision requirements of stress sensor calibration.
[0040] To address the aforementioned problems, this application provides a stress sensor calibration method. This method acquires tensile force data applied to a test object and performs finite element analysis on the test object based on the tensile force data to determine a first stress contour map. The first stress contour map characterizes the stress data corresponding to each point on the upper surface of the test object. Next, it acquires stress data from strain gauges placed on the surface of the test object and strain data at each point on the upper surface of the test object after applying tensile force. Based on the stress data from the strain gauges and the strain data at each point on the upper surface of the test object, a second stress contour map is determined. The second stress contour map characterizes the stress data corresponding to each point on the upper surface of the test object. Subsequently, calibration data corresponding to the tensile force data can be determined based on the tensile force data, the first stress contour map, the strain gauge stress data, and the second stress contour map. Finally, the stress sensor can be calibrated based on the calibration data corresponding to multiple tensile force data points.
[0041] As shown above, this scheme can clearly and accurately represent the stress data of each point on the upper surface of the tested object through the first stress cloud map and the second stress cloud map. This scheme also determines the stress data corresponding to the tensile force data, the first stress cloud map, the stress data of the strain gauge, and the second stress cloud map by determining four types of multi-source data. Based on the stress data obtained from these multi-source data, mutual calibration and comprehensive analysis are performed to jointly determine the stress data corresponding to the sensor's electrical signal. This accurately calibrates the stress sensor, significantly improves the calibration accuracy and reliability of the stress sensor, thereby improving the pipeline stress detection capability and solving the problem of how to accurately calibrate the stress sensor.
[0042] The implementation environment for the above-described stress sensor calibration method can be the stress sensor calibration system provided in the embodiments of this application.
[0043] Figure 1A This is a schematic diagram of a stress sensor calibration system provided in an embodiment of this application. Figure 1A As shown, the stress sensor calibration system includes a stress sensor calibration device 101 and a data storage device 102.
[0044] The stress sensor calibration device 101 and the data storage device 102 are connected in communication.
[0045] In practical applications, the stress sensor calibration device 101 can be connected to any number of data storage devices 102. For ease of understanding, Figure 1 illustrates an example of a stress sensor calibration device 101 connected to a data storage device 102.
[0046] In this embodiment of the application, the data storage device 102 is used to provide the stress sensor calibration device 101 with data for stress sensor calibration (e.g., tensile force data applied to the test object, stress data of strain gauges set on the surface of the test object, and strain data of each point on the upper surface of the test object after tensile force data is applied to the test object, etc.), so that the stress sensor calibration device 101 can perform stress sensor calibration based on the data sent by the data storage device 102.
[0047] Optionally, the physical devices of the stress sensor calibration device 101 and the data storage device 102 can be servers, terminals, or other types of electronic devices, and this application embodiment does not limit them.
[0048] Optionally, the aforementioned terminal may be a device that provides voice and / or data connectivity to a user, a handheld device with wireless connectivity, or other processing device connected to a wireless modem. The wireless terminal may communicate with one or more core networks via a radio access network (RAN). The wireless terminal may be a mobile terminal, such as a mobile phone (or "cellular" phone) and a computer with a mobile terminal, or a portable, pocket-sized, handheld, computer-embedded, or vehicle-mounted mobile device that exchanges voice and / or data with the radio access network, such as a mobile phone, tablet computer, laptop computer, netbook, or personal digital assistant (PDA).
[0049] Optionally, the server mentioned above can be one of the servers in a server cluster (composed of multiple servers), a chip in the server, a system-on-a-chip in the server, or a virtual machine (VM) deployed on a physical machine. This application embodiment does not limit this.
[0050] Optionally, the stress sensor calibration device 101 and the data storage device 102 can be two independent devices or integrated into the same device. When the stress sensor calibration device 101 and the data storage device 102 are integrated into the same device, the data storage device 102 can be a storage module (e.g., a database) of the stress sensor calibration device 101.
[0051] It is easy to understand that when the stress sensor calibration device 101 and the data storage device 102 are integrated into the same device, the communication method between the stress sensor calibration device 101 and the data storage device 102 is the same as the communication method between internal modules of the device. In this case, the communication process between the two is the same as when the stress sensor calibration device 101 and the data storage device 102 are independent of each other.
[0052] For ease of understanding, this application will use the example of stress sensor calibration device 101 and data storage device 102 being independent of each other.
[0053] Figure 1B This is a schematic diagram of another stress sensor calibration system provided in an embodiment of this application. Figure 1B As shown, the stress sensor calibration device includes: a test object 103, a stress sensor 104, a strain gauge 105, a high-precision image acquisition device 106, and a tensioning device 107.
[0054] The test object 103 is fixed on the tensile device 107, the stress sensor 104 is disposed on the upper surface of the test object 103, the strain gauge 105 is disposed around the stress sensor 104, and the lens of the high-precision image acquisition device 106 is facing the upper surface of the test object 103.
[0055] For example, the stress sensor 104 is surrounded by eight strain gauges 105 and two high-precision image acquisition devices 106 that acquire images from different angles. However, in practical applications, it is not limited to eight strain gauges 105 and two high-precision image acquisition devices 106. It can be adjusted according to the actual situation to meet the requirements of the application scenario.
[0056] Optionally, multiple stress sensors 104 to be calibrated can be set to achieve simultaneous calibration of multiple stress sensors 104.
[0057] The test object 103 provides measurable strain data. The stress sensor 104 is a calibrated sensor that provides electrical signal data. Strain gauges 105 provide precise strain data at multiple points. A high-precision image acquisition device 106 provides strain data at each point on the upper surface of the test object 103. A tensioning device 107 fixes the test object 103 and applies tension to it. Using the strain data provided by the strain gauges 105, the high-precision image acquisition device 106, and the tensioning device 107, corresponding stress data and stress data determined by finite element analysis are identified. These are then cross-calibrated and comprehensively analyzed. By assigning different weights to different source stress data, a more accurate comprehensive stress data at multiple strain gauges 105 is determined.
[0058] Optionally, the test object 103 can be a non-standard part, calibration part or standard test piece with toughness, or a pipe component can be used directly for testing.
[0059] Optionally, the high-precision image acquisition device 106 can be a high-precision camera with high resolution, high frame rate, low noise, and high stability. It can also be a high-precision camera specifically designed for DIC (Digital Integrated Circuits). Examples include industrial complementary metal-oxide-semiconductor (CMOS) cameras and scientific-grade CMOS cameras.
[0060] Optionally, the tensile device 107 can be a device that provides stable tensile force, such as an electronic universal tensile testing machine, a hydraulic universal tensile testing machine, a conventional digital display tensile testing machine, a fully automatic tensile testing machine, and a special-function tensile testing machine. The appropriate tensile testing machine for metal materials, non-metal materials, or composite materials can be selected based on the material of the object being tested 103.
[0061] The stress sensor calibration equipment in the stress sensor calibration system includes, for example: Figure 2 The included components. The following are examples... Figure 2 Taking the stress sensor calibration device shown as an example, the hardware structure of the stress sensor calibration device is introduced.
[0062] Figure 2 This is a schematic diagram of the hardware structure of a stress sensor calibration device provided in an embodiment of this application. Figure 2 As shown, the stress sensor calibration device includes: a processor 201, a memory 202, a communication interface 203, and a bus 204. The processor 201, the memory 202, and the communication interface 203 can be connected via the bus 204.
[0063] Processor 201 is the control center of the stress sensor calibration device. It can be a single processor or a collective term for multiple processing elements. For example, processor 201 can be a general-purpose central processing unit (CPU) or other general-purpose processors. The general-purpose processor can be a microprocessor or any conventional processor.
[0064] As one embodiment, processor 201 may include one or more CPUs, for example Figure 2 CPU0 and CPU1 are shown in the diagram.
[0065] The memory 202 may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, or electrically erasable programmable read-only memory (EEPROM), disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but is not limited thereto.
[0066] In one possible implementation, the memory 202 can exist independently of the processor 201. The memory 202 can be connected to the processor 201 via a bus 204 and is used to store instructions or program code. When the processor 201 calls and executes the instructions or program code stored in the memory 202, it can implement the stress sensor calibration method provided in the following embodiments of this application.
[0067] In this embodiment, the software programs stored in memory 202 differ for the stress sensor calibration device, resulting in different functions implemented by the stress sensor calibration device. The functions performed by each device will be described in conjunction with the following flowchart.
[0068] In another possible implementation, the memory 202 can also be integrated with the processor 201.
[0069] The communication interface 203 is used for connecting the stress sensor calibration device with other devices via a communication network, such as Ethernet, wireless access network, or wireless local area network (WLAN). The communication interface 203 may include a receiving unit for receiving data and a transmitting unit for transmitting data.
[0070] Bus 204 can be an industry standard architecture (ISA) bus, a peripheral component interconnect (PCI) bus, or an extended industry standard architecture (EISA) bus. This bus can be divided into address bus, data bus, control bus, etc. For ease of representation, Figure 2 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.
[0071] It should be pointed out that, Figure 2 The structure shown does not constitute a limitation on the stress sensor calibration device, except Figure 2 In addition to the components shown, the stress sensor calibration device may include more or fewer components than shown, or combine certain components, or have different component arrangements.
[0072] The stress sensor calibration method provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0073] The stress sensor calibration method provided in this application embodiment is applied to the stress sensor calibration device 101 in the stress sensor calibration system shown in FIG1, such as... Figure 3 As shown in the embodiment of this application, a stress sensor calibration method includes:
[0074] S301. The stress sensor calibration device acquires the tensile force data applied to the test object, and performs finite element analysis on the test object based on the tensile force data to determine the first stress cloud map.
[0075] The first stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the tested object.
[0076] Specifically, in order to obtain stress data at each point on the surface of the tested object, the tensile force data needs to be input into the finite element analysis program. Theoretical calculations are then performed based on the tensile force data to infer the stress data at each point, thereby drawing the first stress contour map.
[0077] Specifically, finite element analysis involves setting boundary conditions (such as tensile force data) consistent with actual experiments to simulate the stress change trend of the tested object during the tensile process.
[0078] Optionally, the test object can be a non-standard part.
[0079] Optionally, the applied tension can be along different axes of the tested object.
[0080] For example, the tensile force is provided by the tensile test module in the stress sensor calibration device. Before calibration, the tensile test scheme is determined, including: the tensile load range (i.e. the value of the tensile force) and the tensile load step size (i.e. the value of the tensile force change).
[0081] S302. The stress sensor calibration device acquires the stress data of the strain gauges set on the surface of the test object and the strain data of each point on the upper surface of the test object after applying tensile force to the test object. Based on the stress data of the strain gauges and the strain data of each point on the upper surface of the test object, the second stress cloud map is determined.
[0082] The second stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the tested object.
[0083] Specifically, in order to obtain stress data at each point on the upper surface of the test object through another method and to cross-calibrate and comprehensively analyze the stress data obtained by multiple methods, it is necessary to obtain strain data at each point on the upper surface of the test object in order to calculate and determine the second stress contour map.
[0084] Specifically, the stress data of the strain gauges set on the surface of the test object and the strain data of each point on the upper surface of the test object after applying tensile force to the test object are obtained, as detailed in some embodiments below, and will not be repeated here.
[0085] For example, in some embodiments, multiple strain gauges are disposed around the stress sensor on the upper surface of the test object, or multiple strain gauges are disposed on the upper and / or lower surfaces of the test object.
[0086] S303, the stress sensor calibration device determines the calibration data corresponding to the tensile data based on the tensile data, the first stress cloud diagram, the stress data of the strain gauge, and the second stress cloud diagram.
[0087] Specifically, in order to determine the accurate calibration data corresponding to the tensile data, it is necessary to cross-calibrate and comprehensively analyze the stress data obtained by multiple methods.
[0088] Specifically, based on multi-source data, the calibration data corresponding to the tensile data is determined, as detailed in some embodiments below, and will not be repeated here.
[0089] S304. The stress sensor calibration equipment calibrates the stress sensor based on calibration data corresponding to multiple tensile force data.
[0090] Specifically, after applying different tensile forces to the test object according to the above method and determining the calibration data corresponding to the different tensile force data (i.e., the stress corresponding to the position of the stress sensor), the stress sensor is calibrated according to the calibration data.
[0091] Specifically, the calibration method is described in detail in some of the embodiments below, and will not be repeated here.
[0092] In some embodiments, in S303 above, determining the calibration data corresponding to the tensile data based on the tensile data, the first stress contour map, the stress data of the strain gauge, and the second stress contour map specifically includes:
[0093] The stress sensor calibration device acquires the cross-sectional area of the test object and determines the stress data corresponding to the tensile force data by the ratio of the tensile force data to the cross-sectional area of the test object.
[0094] Specifically, in order to cross-calibrate and comprehensively analyze the stress data obtained from multiple methods, it is necessary to first determine the stress data corresponding to the tensile force data.
[0095] For example, the stress data corresponding to the tensile force data satisfies the following formula:
[0096]
[0097] Where σ1 is the stress data corresponding to the tensile force data; F is the tensile force data; and A is the cross-sectional area of the tested object.
[0098] For example, if the tensile force is 100N and the cross-sectional area is 0.01 square meters, then the stress data corresponding to the tensile force is 10kPa.
[0099] The stress sensor calibration equipment performs a weighted summation of the stress data corresponding to the tensile data, the first stress cloud map, the stress data of the strain gauge, and the second stress cloud map to determine the comprehensive stress data at the corresponding position of the strain gauge.
[0100] Specifically, in order to cross-calibrate and comprehensively analyze the stress data obtained from multiple methods, it is necessary to determine the comprehensive stress data at the corresponding positions of the strain gauges by weighted summation.
[0101] For example, the combined stress data at the corresponding location of the strain gauge satisfies the following formula:
[0102] σ real =β1·σ1+β2·σ2+β3·σ3+β4·σ4;
[0103] Where, σ rEal σ1 represents the comprehensive stress data at the corresponding location of the strain gauge; β1 is the first weight; σ1 is the stress data corresponding to the tensile force data; β2 is the second weight; σ2 is the stress data at the corresponding location of the strain gauge in the first stress cloud diagram; β3 is the third weight; σ3 is the stress data of the strain gauge; β4 is the fourth weight; σ4 is the stress data at the corresponding location of the strain gauge in the second stress cloud diagram.
[0104] Optionally, the first, second, third, and fourth weights can be approximated by training the model to obtain infinite approximations, or they can be determined by the multiple linear regression equation.
[0105] For example, Figure 4 This is a schematic diagram of a multiple regression algorithm provided in an embodiment of this application. Figure 4 As shown, the comprehensive stress data at the corresponding locations of the strain gauges are determined through a multiple linear regression equation, including:
[0106] S401. Obtain the stress dataset of the tensile force data from the tensioning machine.
[0107] Specifically, the stress sensor calibration device acquires the stress dataset of the tensile data of the tension machine, which is the stress data corresponding to the tensile data in this application.
[0108] S402. Obtain the stress dataset of the strain gauge.
[0109] Specifically, the stress sensor calibration device acquires the stress data set of the strain gauge, that is, the stress data corresponding to the strain gauge in this application.
[0110] S403. Obtain the DIC stress dataset.
[0111] Specifically, the stress sensor calibration device acquires the DIC stress dataset, which is the second stress cloud map in this application.
[0112] S404. Obtain the finite element simulation stress dataset.
[0113] Specifically, the stress sensor calibration device acquires the finite element simulation stress dataset, namely the first stress cloud map in this application.
[0114] S405. Determine the multiple regression model.
[0115] Specifically, the stress sensor calibration equipment determines the comprehensive stress data at the corresponding position of the strain gauge based on the stress dataset of the tensile force data from the tensile machine, the stress dataset of the strain gauge, the DIC stress dataset, and the finite element simulation stress dataset.
[0116] S406. Use the least squares method to determine the regression coefficients.
[0117] Specifically, the stress sensor calibration device uses a multiple regression model to determine four regression coefficients, namely the first weight, second weight, third weight, and fourth weight in this application.
[0118] Optionally, a multivariate regression algorithm process may also include: obtaining multi-source stress information and performing error analysis.
[0119] Specifically, after determining the regression coefficients using the least squares method, the stress sensor calibration equipment obtains multi-source stress information and determines the comprehensive stress data of the corresponding positions of multiple strain gauges through multiple measurements.
[0120] Specifically, after obtaining multi-source stress information, the stress sensor calibration equipment performs error analysis on the comprehensive stress data at the corresponding position of the strain gauge to determine more accurate comprehensive stress data at the corresponding position of the strain gauge.
[0121] The stress sensor calibration equipment determines the average value of the combined stress data at corresponding positions of multiple strain gauges as the calibration data corresponding to the tensile force data.
[0122] Specifically, in order to determine the accurate stress data at the corresponding location of the stress sensor, it is necessary to determine the average value of the combined stress data at the corresponding locations of multiple strain gauges as the calibration data corresponding to the tensile force data.
[0123] Optionally, if the overall stress data at different locations of different strain gauges differs significantly, the test value is deemed inaccurate and the test needs to be repeated.
[0124] Optionally, there can be eight or ten stress sensors; no limitation is made here.
[0125] As can be seen from the above embodiments, by cross-calibrating and comprehensively analyzing the stress data obtained from multiple testing methods, the calibration data corresponding to the tensile force data can be determined.
[0126] In some embodiments, in S302 above, acquiring stress data from strain gauges disposed on the surface of the test object specifically includes:
[0127] The stress sensor calibration equipment acquires the strain data of the strain gauge and determines the stress data of the strain gauge by multiplying the Young's modulus of the tested object and the strain data of the strain gauge.
[0128] Specifically, in order to calibrate data measured by other methods using strain gauge stress data and to calculate the comprehensive stress data at the corresponding location of the strain gauge, it is necessary to determine the stress data of the strain gauge.
[0129] For example, the stress data of the strain gauge satisfies the following formula:
[0130] σ3=E·ε3;
[0131] Where σ3 represents the stress data of the strain gauge; E represents the Young's modulus of the tested object; ε ε This refers to the strain data of the strain gauge.
[0132] In some embodiments, in S302 above, acquiring strain data at each point on the upper surface of the test object after applying tensile force to the test object specifically includes:
[0133] The stress sensor calibration device acquires the displacement data of the spots sprayed on the surface of the test object after applying tensile force to the test object, and determines the ratio of the displacement data to the length of the test object as the strain data of each point on the upper surface of the test object.
[0134] Specifically, in order to determine the stress data at each point on the upper surface of the test object in order to determine the second stress contour map, it is necessary to determine the strain data at each point on the upper surface of the test object.
[0135] Specifically, when acquiring displacement data of the spots sprayed on the surface of the test object, at least two high-precision cameras symmetrically arranged on both sides of the test object are required.
[0136] Optionally, strain data at each point on the surface of the test object can be obtained using digital image correlation (DIC) techniques.
[0137] Optionally, strain data for unavailable points can be supplemented using interpolation algorithms.
[0138] For example, a speckle pattern is sprayed onto the surface of the test object, and a high-precision camera acquires images before and after the application of tensile force. The images are then compared using a DIC (Digital Index) to obtain strain data corresponding to each point.
[0139] As can be seen from the above embodiments, by using DIC analysis to capture the minute deformation corresponding to each point using a high-precision camera, the strain data corresponding to each point can be analyzed more accurately, and the stress data corresponding to each point can be obtained precisely.
[0140] In some embodiments, a second stress contour map is determined based on the stress data from the strain gauges and the strain data at each point on the upper surface of the tested object, specifically including:
[0141] The stress sensor calibration equipment determines the stress data at each point on the upper surface of the test object by multiplying the Young's modulus of the test object by the strain data at each point on the upper surface of the test object.
[0142] Specifically, in order to comprehensively analyze and determine the combined stress data at the corresponding positions of multiple strain gauges, it is necessary to determine the stress data at each point on the upper surface of the tested object.
[0143] For example, the stress data at each point on the upper surface of the tested object satisfies the following formula:
[0144] σ4=E·ε4;
[0145] Where σ4 represents the stress data at each point on the upper surface of the tested object; and ε4 represents the strain data at each point on the upper surface of the tested object.
[0146] The stress sensor calibration equipment uses the stress data of the strain gauge as the standard value to correct the stress data of each point on the upper surface of the tested object, and draws a second stress cloud map based on the corrected stress data of each point.
[0147] Specifically, in order to draw an accurate second stress cloud map, it is necessary to use the stress data of the strain gauge as the standard value and correct the stress data of each point based on the stress data of the strain gauge.
[0148] For example, if the stress data of the strain gauge is 10 kPa and the stress data at the corresponding location is 10.01 kPa, the difference is 0.01 kPa. Then, the stress data corresponding to each point is corrected accordingly to obtain the second stress contour map.
[0149] In some embodiments, the stress sensor is calibrated based on calibration data corresponding to multiple tensile force data, specifically including:
[0150] The stress sensor calibration equipment acquires the electrical signal data corresponding to the tensile force data applied to the test object.
[0151] Specifically, in order to calibrate the stress sensor, it is necessary to first acquire the electrical signal data of the stress sensor after applying tensile force to the test object.
[0152] For example, when the tensile force is 100N, the electrical signal is 12mA.
[0153] The stress sensor calibration equipment uses the electrical signal data corresponding to the tensile force data as the independent variable and the calibration data corresponding to the tensile force data as the dependent variable to establish a linear regression model of the electrical signal data corresponding to the tensile force data and the calibration data corresponding to the tensile force data, in order to calibrate the stress sensor.
[0154] Specifically, in order to determine the range of stress data corresponding to the range of electrical signal data by acquiring multiple sets of electrical signal data and calibration data, it is necessary to determine the functional relationship between electrical signal data and stress data through a linear regression model, thereby completing the calibration.
[0155] As can be seen from the above embodiments, by using a linear regression model, the functional relationship between electrical signal data and stress data is accurately determined through multiple sets of data, so as to accurately calibrate the stress sensor.
[0156] Figure 5 This is a schematic flowchart illustrating another stress sensor calibration method provided in an embodiment of this application. Figure 5 As shown, the stress sensor calibration method includes:
[0157] S501. Determine the tensile test plan, set the tensile load step size, and record the tensile force data in real time.
[0158] Specifically, the stress sensor calibration equipment determines the tensile test scheme, sets the tensile load step size, and records the tensile force data in real time.
[0159] S502, Real-time recording of electrical signal data from stress sensors.
[0160] Specifically, a grid coordinate system is divided on the surface of the object under test to determine the position of the stress sensor, and the stress sensor calibration equipment records the electrical signal data of the stress sensor in real time.
[0161] S503, Real-time recording of strain data from strain gauges.
[0162] Specifically, the number and location of strain gauges are determined, and the stress sensor calibration equipment records the strain data of the strain gauges in real time.
[0163] S504. Record the stress data at each point on the upper surface of the tested object.
[0164] Specifically, a speckle pattern is sprayed onto the surface of the test object, the number and position of the DIC high-precision cameras are determined, and the stress sensor calibration equipment records the stress data of each point on the upper surface of the test object.
[0165] S505. Through finite element analysis, simulate the stress data at each point on the upper surface of the tested object.
[0166] Specifically, the stress sensor calibration equipment uses finite element analysis to simulate the stress data at each point on the surface of the tested object in order to determine the first stress cloud map.
[0167] S506. By comprehensively analyzing the stress data corresponding to the tensile data, the stress data of the strain gauge, the DIC strain cloud map, and the finite element simulation results, the accurate stress value at the corresponding position of the stress sensor is calculated.
[0168] Specifically, the stress sensor calibration equipment comprehensively analyzes the stress data corresponding to the tensile data, the stress data of the strain gauges, the DIC strain cloud map, and the finite element simulation results to determine the comprehensive stress data of the corresponding positions of multiple strain gauges, so as to calculate the accurate stress value of the corresponding position of the stress sensor (i.e., the calibration data of the corresponding position of the stress sensor).
[0169] S507. Calibrate the stress sensor.
[0170] Specifically, the stress sensor calibration equipment calibrates the stress sensor based on the accurate stress value at the corresponding location of the stress sensor.
[0171] The foregoing mainly describes the solutions provided by the embodiments of this application from a methodological perspective. To achieve the above functions, it includes corresponding hardware structures and / or software modules for executing each function. Those skilled in the art should readily recognize that, based on the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein, this application can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed in hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0172] This application embodiment can divide the stress sensor calibration device into functional modules according to the above method example. For example, each function can be divided into its own functional module, or two or more functions can be integrated into one processing module. The integrated module can be implemented in hardware or as a software functional module. Optionally, the module division in this application embodiment is illustrative and only represents one logical functional division; other division methods may be used in actual implementation.
[0173] Figure 6 A schematic diagram of a stress sensor calibration device provided in an embodiment of this application is shown. Figure 6As shown, the stress sensor calibration device includes: a finite element analysis module 601, a multi-source data acquisition module 602, a data processing module 603, and a tensile loading module 604;
[0174] The finite element analysis module 601 is used to acquire the tensile force data applied to the test object, and to perform finite element analysis on the test object based on the tensile force data to determine the first stress cloud map; the first stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the test object.
[0175] The multi-source data acquisition module 602 is used to acquire stress data of strain gauges set on the surface of the test object and strain data of each point on the upper surface of the test object after applying tensile force to the test object. Based on the stress data of the strain gauges and the strain data of each point on the upper surface of the test object, a second stress cloud map is determined. The second stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the test object.
[0176] The data processing module 603 is used to determine the calibration data corresponding to the tensile data based on the tensile data, the first stress cloud diagram, the stress data of the strain gauge, and the second stress cloud diagram.
[0177] The data processing module 603 is also used to calibrate the stress sensor based on the calibration data corresponding to multiple tensile data.
[0178] In some embodiments, the data processing module 603 is specifically used for:
[0179] Obtain the cross-sectional area of the test object, and determine the stress data corresponding to the tensile force data by the ratio of the tensile force data to the cross-sectional area of the test object.
[0180] The stress data corresponding to the tensile data, the first stress contour map, the stress data of the strain gauge, and the second stress contour map are weighted and summed to determine the comprehensive stress data at the corresponding position of the strain gauge.
[0181] The average value of the combined stress data at corresponding locations of multiple strain gauges is used as the calibration data corresponding to the tensile force data.
[0182] In some embodiments, the multi-source data acquisition module 602 is specifically used to: acquire strain data of strain gauges, and determine the stress data of strain gauges by multiplying the Young's modulus of the tested object and the strain data of strain gauges.
[0183] In some embodiments, the multi-source data acquisition module 602 is specifically used to: acquire displacement data of spots sprayed on the surface of the test object after applying tensile force data to the test object, and determine the ratio of displacement data to the length of the test object as the strain data of each point on the upper surface of the test object.
[0184] In some embodiments, the multi-source data acquisition module 602 is specifically used for:
[0185] The stress data at each point on the upper surface of the test object is determined by multiplying the Young's modulus of the test object by the strain data at each point on the upper surface of the test object.
[0186] The stress data of the strain gauge is used as the standard value to correct the stress data of each point on the upper surface of the tested object, and a second stress contour map is drawn based on the corrected stress data of each point.
[0187] In some embodiments, the data processing module 603 is specifically used for:
[0188] After acquiring the tensile force data applied to the test object, the electrical signal data corresponding to the tensile force data of the stress sensor is obtained.
[0189] Using the electrical signal data corresponding to the tensile force data as the independent variable and the calibration data corresponding to the tensile force data as the dependent variable, a linear regression model is established for the electrical signal data corresponding to the tensile force data and the calibration data corresponding to the tensile force data to calibrate the stress sensor.
[0190] In some embodiments, a plurality of strain gauges are disposed around the stress sensor on the upper surface of the test object, or a plurality of strain gauges are disposed on the upper and / or lower surface of the test object.
[0191] In some embodiments, the tension loading module 604 is specifically used to fix the test object and to provide axial tension to the test object.
[0192] This application also provides a computer-readable storage medium, which includes computer-executable instructions that, when executed on a computer, cause the computer to perform the stress sensor calibration method provided in the above embodiments.
[0193] This application also provides a computer program that can be directly loaded into a memory and contains software code. After being loaded and executed by a computer, the computer program can implement the stress sensor calibration method provided in the above embodiments.
[0194] Those skilled in the art will recognize that, in one or more of the examples above, the functions described in this application can be implemented using hardware, software, firmware, or any combination thereof. When implemented in software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or code on a computer-readable medium. Computer-readable media include computer-readable storage media and communication media, wherein communication media include any medium that facilitates the transmission of a computer program from one place to another. Storage media can be any available medium accessible to a general-purpose or special-purpose computer.
[0195] Through the above description of the embodiments, those skilled in the art can clearly understand that, for the sake of convenience and brevity, only the division of the above functional modules is used as an example. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.
[0196] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules or units is only a logical functional division, and other division methods may exist in actual implementation. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the shown or discussed mutual couplings, direct couplings, or communication connections may be through some interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms. Units described as separate components may or may not be physically separate; components shown as units may be one physical unit or multiple physical units, i.e., they may be located in one place or distributed in multiple different places. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0197] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiments of this application, in essence, or the part that contributes to general technology, or all or part of the technical solution, can be embodied in the form of a software product. This software product is stored in a storage medium and includes several instructions to cause a device (which may be a microcontroller, chip, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, mobile hard drives, ROM, RAM, magnetic disks, or optical disks.
[0198] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A method for calibrating a stress sensor, characterized in that, include: Acquire the tensile force data applied to the test object, and perform finite element analysis on the test object based on the tensile force data to determine the first stress contour map; The first stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the tested object; The stress data of the strain gauges set on the surface of the test object and the strain data of each point on the upper surface of the test object after the tensile force is applied to the test object are obtained, and a second stress contour map is determined based on the stress data of the strain gauges and the strain data of each point on the upper surface of the test object. The second stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the tested object; Based on the tensile force data, the first stress cloud diagram, the stress data of the strain gauge, and the second stress cloud diagram, determine the calibration data corresponding to the tensile force data; The stress sensor is calibrated based on calibration data corresponding to multiple tensile force data.
2. The method according to claim 1, characterized in that, The step of determining the calibration data corresponding to the tensile data based on the tensile data, the first stress contour map, the stress data of the strain gauge, and the second stress contour map includes: Obtain the cross-sectional area of the test object, and determine the stress data corresponding to the tensile force data as the ratio of the tensile force data to the cross-sectional area of the test object; The stress data corresponding to the tensile data, the first stress cloud map, the stress data of the strain gauge, and the second stress cloud map are weighted and summed to determine the comprehensive stress data at the corresponding position of the strain gauge. The average value of the combined stress data at the corresponding positions of multiple strain gauges is determined as the calibration data corresponding to the tensile force data.
3. The method according to claim 1, characterized in that, The process of acquiring stress data from strain gauges disposed on the surface of the test object includes: The strain data of the strain gauge is obtained, and the product of the Young's modulus of the tested object and the strain data of the strain gauge is determined as the stress data of the strain gauge.
4. The method according to claim 1, characterized in that, After the tensile force is applied to the test object, strain data at each point on the upper surface of the test object is obtained, including: The displacement data of the spots sprayed on the surface of the test object after the tensile force data is applied to the test object is obtained, and the ratio of the displacement data to the length of the test object is determined as the strain data of each point on the upper surface of the test object.
5. The method according to claim 4, characterized in that, The step of determining the second stress contour map based on the stress data of the strain gauge and the strain data of each point on the upper surface of the tested object includes: The product of the Young's modulus of the test object and the strain data at each point on the upper surface of the test object is determined as the stress data at each point on the upper surface of the test object. Using the stress data of the strain gauge as a standard value, the stress data of each point on the upper surface of the test object is corrected, and the second stress cloud map is drawn based on the corrected stress data of each point.
6. The method according to claim 1, characterized in that, The calibration of the stress sensor based on calibration data corresponding to multiple tensile force data includes: After the tensile force data is applied to the test object, the electrical signal data corresponding to the tensile force data of the stress sensor is obtained; Using the electrical signal data corresponding to the tensile force data as the independent variable and the calibration data corresponding to the tensile force data as the dependent variable, a linear regression model is established for the electrical signal data corresponding to the tensile force data and the calibration data corresponding to the tensile force data to calibrate the stress sensor.
7. The method according to claim 1, characterized in that, Multiple strain gauges are disposed around the stress sensor on the upper surface of the test object, or multiple strain gauges are disposed on the upper and / or lower surface of the test object.
8. A stress sensor calibration device, characterized in that, include: Finite element analysis module, multi-source data acquisition module, and data processing module; The finite element analysis module is used to acquire the tensile force data applied to the test object, and to perform finite element analysis on the test object based on the tensile force data to determine the first stress cloud diagram. The first stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the tested object; The multi-source data acquisition module is used to acquire stress data of strain gauges set on the surface of the test object and strain data of each point on the upper surface of the test object after the tensile force is applied to the test object, and to determine a second stress cloud map based on the stress data of the strain gauges and the strain data of each point on the upper surface of the test object. The second stress cloud map is used to characterize the stress data corresponding to each point on the upper surface of the tested object; The data processing module is used to determine the calibration data corresponding to the tensile data based on the tensile data, the first stress cloud diagram, the stress data of the strain gauge, and the second stress cloud diagram. The data processing module is also used to calibrate the stress sensor based on calibration data corresponding to multiple tensile data.
9. A stress sensor calibration device, characterized in that, include: Processor and memory; The memory is used to store one or more programs, the one or more programs including computer-executable instructions. When the stress sensor calibration device is running, the processor executes the computer-executable instructions stored in the memory to cause the stress sensor calibration device to perform the method of any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that, When the computer-executable instructions stored in the computer-readable storage medium are executed by the processor of the stress sensor calibration device, the stress sensor calibration device is capable of performing the method as described in any one of claims 1 to 7.