A method for coupling force, heat and electric field based on an inclined crown spring connector

Abstract

The application provides a force-thermal-electric field coupling method based on an inclined crown spring connector, and belongs to the field of electric connector design and optimization analysis, and the method specifically comprises the following steps: S1: a single-terminal parameterized CAE model of the inclined crown spring high-current connector is established, material attribute setting, mesh division, contact pair definition, boundary condition and solver configuration are completed through an APDL language; S2: a transient mechanical field simulation is performed, and normal contact force, geometric deformation and contact area of each contact point at the moment when the pin is completely inserted are extracted; S3: based on the Hertz contact theory, the theoretical value of the contact resistance is calculated according to the normal contact force of each contact point, and the contact conductivity and the contact thermal conductivity are derived; S4: according to the deformation result of the mechanical field, the spring sheet geometric model is reconstructed, and the contact point shape is fitted into an ellipse or a circle according to the contact area. The application is used to solve the convergence difficulty problem of the coupling simulation caused by the complex structure and reduce the difficulty of the multi-physical field coupling calculation.

Description

Technical Field

[0001] This invention relates to the field of electrical connector design and optimization analysis, specifically to a force-thermal-electric field coupling method based on a slanted crown spring connector. Background Technology

[0002] Electrical connectors, as key electrical components, play a vital role in high-reliability fields such as new energy vehicles and aerospace. Among them, high-current connectors, with their high current-carrying capacity, stable electrical performance, and excellent mechanical durability, have become crucial components in high-power power transmission systems. As electronic devices rapidly evolve towards higher power density and miniaturization, the need for integrating high-current connectors within limited spaces is becoming increasingly urgent, placing higher demands on connector structural design and performance optimization.

[0003] While traditional crown spring structures can meet the basic requirements for conventional high-current transmission, in situations where the internal space of the connector socket is extremely limited, problems often arise such as the inability to properly install springs that meet structural requirements, or springs seizing up after forced assembly. These issues severely affect the reliability of the electrical connector contact system. Angled crown spring connectors, due to their unique angled contact multi-contact structure, can provide higher contact pressure distribution and more stable current transmission performance.

[0004] The performance of high-current connectors is the result of the interaction of force, heat, and electric fields. A single physical field analysis cannot fully assess their reliability. International standards (such as IEC60512 and UL1977) clearly require connectors to pass tests under combined force-heat-electric conditions. This is because the main function of high-current connectors is to carry large currents. When a large current (usually above 50A) passes through the contact surface, it generates significant Joule heat (Q=I²R). Since the contact resistance is closely related to the contact surface pressure, the theoretical value of the contact resistance needs to be calculated through mechanical field analysis. Therefore, the force-heat-electric field coupling analysis of high-current connectors is essential.

[0005] In existing technologies, some scholars use a simplified simulation analysis method by directly estimating the heat generated by contact resistance and applying an equivalent heat flux. While this method can reflect the temperature distribution and trend, it cannot accurately characterize the true electrical performance of electrical connectors. Traditional multiphysics coupling methods mainly include direct coupling and indirect coupling. Direct coupling is suitable for models with simple structures and strong convergence, but it is difficult to model the coupled field of complex structures. Indirect coupling usually uses the assumption of equal distribution of total pressure for simplified calculation. Although it is suitable for symmetrical structures, for asymmetrical models, the force is uneven in different parts. If the equal distribution method is used, it will lead to increased simulation error and make it difficult to accurately reflect the distribution of contact resistance and current density.

[0006] In summary, for complex models such as oblique crown springs that are difficult to converge through direct coupling methods, and for models with poor accuracy when simplified, there is a lack of methods that combine accuracy and feasibility for indirect coupling of their force-thermal-electric physical fields. Summary of the Invention

[0007] The purpose of this invention is to provide a force-thermal-electric field coupling method based on a slanted crown spring connector, so as to solve the problem of difficult convergence in coupling simulation caused by complex structures, reduce the difficulty of multi-physics coupling calculation, and more accurately simulate the force-thermal-electric coupling characteristics of electrical connectors under actual working conditions, thereby providing technical support for improving the design accuracy, development efficiency and reliability analysis of electrical connectors.

[0008] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0009] A force-thermal-electric field coupling method based on a slanted crown spring connector specifically includes the following steps:

[0010] S1: Establish a single-terminal parametric CAE model of the high-current connector with a slanted crown spring, and complete the material property settings, mesh generation, contact pair definition, boundary conditions and solver configuration using APDL language;

[0011] S2: Perform transient mechanical field simulation to extract the normal contact force, geometric deformation and contact area of ​​each contact point when the pin is fully inserted;

[0012] S3: Based on Hertz contact theory, calculate the theoretical value of contact resistance according to the normal contact force of each contact point, and calculate the contact conductivity and contact thermal conductivity.

[0013] S4: Reconstruct the geometric model of the reed based on the deformation results of the mechanical field, and fit the shape of the contact point to an ellipse or circle according to the contact area cloud map. Import the steady-state electrothermal field and set the contact conductivity, contact thermal conductivity, contact parameters and other boundary conditions.

[0014] S5: Solve for the electrothermal physical field and output the results of temperature rise, volume resistance and voltage drop distribution.

[0015] The specific steps in S3 are as follows:

[0016] The theoretical formula for calculating the contact resistance of a single contact point is as follows, which is used to calculate the contact resistance of each contact point:

[0017] ;

[0018] In the formula: R is the contact resistance; K is related to the contact material, such as the value of K for the silver-silver contact pair selected in this embodiment being 60; F is the contact normal force; common contact types include point contact, surface contact, and line contact; m depends on the deformation of the contact surface and takes values ​​of 0.5, 1, and 0.7 respectively. For crown spring connectors, it is usually a point contact, and m takes a value of 0.5. The final calculated contact resistance unit is... ;

[0019] The contact conductance of the contact surface was calculated, and the formula for contact conductance is as follows:

[0020] ;

[0021] In the formula: Ecc is the contact conductivity, R is the contact resistance, and A is the contact area;

[0022] The formula for contact thermal conductivity is as follows:

[0023] ;

[0024] In the formula: Ecc is the contact electrical conductivity, and K is the thermal conductivity of the contact material. The resistivity of the contact material.

[0025] The specific steps for extracting the contact area of ​​each contact point in S2 include: establishing a local spherical coordinate system based on the contact pressure cloud map after the pin is fully inserted, or selecting all units within the contact point range by box selection. At the same time, selecting units within the radius range of each contact point by using the ESEL command and calculating the precise contact area and contact normal pressure of each contact point in sequence.

[0026] In step S1, the parametric modeling is applied to the oblique crown spring structure, using a hexahedral mesh, and the boundary conditions include fixed constraints and pin axial displacement loads.

[0027] In step S4, the contact shape fitting is implemented based on SolidWorks software, and the contact area data comes from the accurate calculation results of step S2.

[0028] The preprocessing settings for the electrothermal field in step S4 include the following: defining the thermal conductivity and resistivity of the material properties, refining the mesh of the contact area, and setting the current input surface and zero voltage reference surface as boundary conditions.

[0029] The high-current connector structure with a slanted crown spring includes a plug assembly and a socket assembly.

[0030] The plug assembly includes an insulating shell, a top cover, positive and negative sockets with slots, and a slanted crown spring fitted in the slot. The axial length of the slot is greater than the length of the spring and is provided with a limiting step.

[0031] The socket assembly includes a base, positive and negative pins, and a PCB board. The pins fit into the base slots without gaps. The PCB board has positive and negative conductive layers and an insulating layer, and the two conductive layers are nested with different dimensions in the height direction.

[0032] The plug assembly's outer shell and socket mating part are provided with vent holes and cavity structures.

[0033] In this design, the positive and negative conductive layers of the PCB are nested through through holes, and the insulating layer is filled between the conductive layers along the thickness direction.

[0034] In S4, minor deformations outside the throat of the reed are ignored, and the geometric model is reconstructed only based on the throat deformation.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] This invention has stronger convergence. For complex models, there is no need to perform overall plug-in simulation. Only the plug-in simulation of the contact parts is needed to simulate the accurate contact condition.

[0037] This invention is more operable, more efficient, and less time-consuming. The model only needs to change the parameters of the mechanical field parameterized modeling program and adjust the parameters in the modeling software according to the simulation results to perform multiphysics simulation calculations on the same topological structure.

[0038] This invention offers higher accuracy. By precisely dividing the shape of each contact point and calculating the contact resistance of each contact point, it can accurately reflect the current density concentration and voltage drop of each contact point, thereby obtaining accurate electrothermal coupling field calculation results and accurately reflecting the electrothermal performance of the electrical connector.

[0039] This invention calls upon each sub-computation module to perform force-thermal-electric coupling calculations for electrical connectors. The division of labor is clear, the calculation accuracy is high, it can complete the entire coupling analysis process and improve the convergence of multiphysics fields, reduce the difficulty of use, and make it convenient to use. Attached Figure Description

[0040] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of the overall structure of the oblique crown spring high-current connector of the present invention.

[0042] Figure 2 For the present invention Figure 1 A schematic diagram of the overall structure after the top cover has been removed.

[0043] Figure 3 This is a schematic diagram of the overall structure of the socket assembly described in this invention.

[0044] Figure 4 This is a schematic diagram showing the relationship between the positive and negative electrode pins and the positive and negative electrode oblique crown springs of the present invention.

[0045] Figure 5 This is a cloud map of the contact area between the inner and outer surfaces of the reed and the effect of dividing the contact area according to an embodiment of the present invention.

[0046] Figure 6 This is a flowchart illustrating the coupling of mechanical, thermoelectric, and physical fields in an embodiment of the present invention.

[0047] Figure 7 This is a cross-sectional view of the temperature distribution cloud map in an embodiment of the present invention.

[0048] Figure 8 This is a flowchart illustrating the overall process of this invention.

[0049] Figure label:

[0050] 101 Plug assembly, 102 Socket assembly, 103 Top cover, 104 Housing, 105 Wire, 106 Positive and negative angled crown spring, 107 Base, 108 Positive and negative pins, 109 PCB board. Detailed Implementation

[0051] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the embodiments of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive. Embodiments of the invention will now be described in detail with reference to the accompanying drawings.

[0052] See Figure 8 This embodiment discloses a force-thermal-electric field coupling method based on a slanted crown spring connector, which specifically includes the following steps:

[0053] S1: Establish a single-terminal parametric CAE model of the high-current connector with a slanted crown spring, and complete the material property settings, mesh generation, contact pair definition, boundary conditions and solver configuration using APDL language;

[0054] S2: Perform transient mechanical field simulation to extract the normal contact force, geometric deformation and contact area of ​​each contact point when the pin is fully inserted;

[0055] S3: Based on Hertz contact theory, calculate the theoretical value of contact resistance according to the normal contact force of each contact point, and calculate the contact conductivity and contact thermal conductivity.

[0056] S4: Reconstruct the geometric model based on the spring deformation results obtained from transient mechanical field simulation, fit the contact shape to an ellipse or circle according to the contact area, import the steady-state electrothermal field and set contact information such as contact conductivity, contact thermal conductivity and other boundary conditions.

[0057] S5: Solve for the electrothermal physical field and output the results of temperature rise, volume resistance and voltage drop distribution.

[0058] The specific steps in S3 are as follows:

[0059] The theoretical formula for calculating contact resistance is as follows:

[0060] ;

[0061] In the formula: R is the contact resistance; K is related to the contact material, such as the value of K for the silver-silver contact pair selected in this embodiment being 60; F is the contact normal force; common contact types include point contact, surface contact, and line contact; m depends on the deformation of the contact surface and takes values ​​of 0.5, 1, and 0.7 respectively. For crown spring connectors, it is usually a point contact, and m takes a value of 0.5. The final calculated contact resistance unit is... ;

[0062] The contact conductance of the contact surface was calculated, and the formula for contact conductance is as follows:

[0063] ;

[0064] In the formula: Ecc is the contact conductivity, R is the contact resistance, and A is the contact area;

[0065] The formula for contact thermal conductivity is as follows:

[0066] ;

[0067] In the formula: Ecc is the contact electrical conductivity, and K is the thermal conductivity of the contact material. The resistivity of the contact material.

[0068] The specific steps for extracting the contact area of ​​each contact point in S2 include: establishing a local spherical coordinate system based on the contact pressure cloud map after the pin is fully inserted; and selecting the units within the radius of each contact point using the ESEL command (or selecting all units within the contact point range by box selection) and calculating the precise contact area and contact normal pressure of each contact point in sequence.

[0069] In step S1, the parametric modeling is applied to the oblique crown spring structure, using a hexahedral mesh, and the boundary conditions include fixed constraints and pin axial displacement loads.

[0070] In step S4, the contact shape fitting is implemented using SolidWorks software, and the contact area data comes from the precise calculation results of step S2. Based on the actual shape of the contact area in the cloud map and the actual contact area axis length measured according to the scale in the cloud map, the inner surface contact of the reed is fitted as an ellipse (axis ratio > 1.2), and the outer surface contact is fitted as a circle (axis ratio ≤ 1.2).

[0071] The preprocessing settings for the electrothermal field in step S4 include the following: defining the thermal conductivity and resistivity of the material properties, refining the mesh of the contact area, and setting the boundary conditions for the current input surface and the zero-voltage reference surface.

[0072] The high-current connector structure with a slanted crown spring includes a plug assembly and a socket assembly.

[0073] The plug assembly includes an insulating shell, a top cover, positive and negative sockets with slots, and a slanted crown spring fitted in the slot. The axial length of the slot is greater than the length of the spring and is provided with a limiting step.

[0074] The socket assembly includes a base, positive and negative pins, and a PCB board. The pins fit into the base slots without gaps. The PCB board has positive and negative conductive layers and an insulating layer, and the two conductive layers are nested with different dimensions in the height direction.

[0075] The plug assembly's outer shell and socket mating part are provided with vent holes and cavity structures.

[0076] In this design, the positive and negative conductive layers of the PCB are nested through through holes, and the insulating layer is filled between the conductive layers along the thickness direction.

[0077] In step S2, the transient mechanical simulation uses the *GET and element table commands to extract the curve of the contact normal pressure changing with time, and calculates the average value of the contact point based on the moment when the pin is fully inserted.

[0078] In S4, minor deformations outside the throat of the reed are ignored, and the geometric model is reconstructed only based on the throat deformation.

[0079] To facilitate further exploration of the invention by those skilled in the art, the invention will be described in more detail below.

[0080] See Figures 1-4 In this embodiment, the oblique crown spring high-current connector structure includes a plug assembly and a socket assembly, wherein the socket assembly and the plug assembly contain positive and negative electrodes, and the plug and socket assembly should be plugged in during operation.

[0081] The plug assembly consists of a top cover, outer shell, wires, positive and negative terminals, and positive and negative inclined crown springs. Both the outer shell and the top cover are made of insulating material. The terminals have a pre-reserved slot, and the springs are assembled into the pre-reserved slot. The axial length of the slot is relative to the axial length of the spring, which also serves to prevent the springs from falling off. There is a gap between the limiting groove and the positive and negative terminals, and the terminals and limiting grooves are in clearance fit. The limiting groove is equipped with a stop step according to the size of the terminals, which is used to prevent the vertical displacement of the positive and negative terminals. Ventilation holes and cavities are reserved around the mating part between the outer shell and the terminals to enhance heat dissipation.

[0082] The socket assembly includes a base, positive and negative pins, and a PCB board. The base is made of insulating material, while the positive and negative pins are made of conductive material. The base has a pin slot that limits the position of the pin and the pin engages with the slot. The lower end of the pin is soldered to the PCB board, which includes positive and negative conductive layers and an insulating layer. The two conductive layers have different dimensions in the height direction. Both positive and negative electrodes have through holes. When assembled, the through hole of the negative conductive layer is nested inside the through hole of the positive conductive layer, and the three insulating layers are nested between the positive and negative conductive layers along the thickness direction. The end of the board has a load made of the same material as the conductive layer.

[0083] In practical applications, the base of the socket assembly along with the pins is first installed on the PCB board, and the pin assembly is then matched with the socket assembly. This includes inserting the pins into the socket so that the upper part of the pins contacts the inclined crown spring; and the base and the housing having a pre-reserved mating groove to complete the fit.

[0084] In this embodiment, the force-electric-thermal indirect sequential coupling method based on the oblique crown spring high-current connector is described in the following process: Figure 6 As shown:

[0085] S1: Use 3D modeling software to create an initial single-terminal model of the high-current connector, and use APDL language to perform parametric CAE preprocessing modeling of the simulation model:

[0086] S1-1: For the given high-current connector model with oblique crown spring in this embodiment, the geometric model of the high-current connector with oblique crown spring is established using professional modeling software such as SolidWorks or UG, which are good at handling curved surfaces, and then assembled according to the actual model.

[0087] S1-2: Addressing the challenge of directly modeling the oblique crown spring structure using parametric languages, a parametric CAE preprocessing program for single-terminal high-current connectors was developed based on APDL. This program includes setting material properties, mesh generation, contact pair definition, boundary conditions, and solver settings. Material properties include density, elastic modulus, Poisson's ratio, and yield strength. Mesh generation uses a specified element size and geometric subdivision to create a hexahedral master mesh for the oblique crown spring high-current connector model. Boundary conditions are defined with fixed constraints and specified displacement directions for pin insertion.

[0088] S2: Post-process the transient mechanical physical field simulation results and output the mechanical field simulation results, including the normal contact force, geometric deformation, and contact area of ​​each contact point;

[0089] S2-1: A post-processing program based on APDL is written, mainly using the *GET and element table commands to obtain the curve of normal contact force (contact normal pressure) changing over time.

[0090] S2-2: Based on S2-1, write a program to extract the positive pressure and contact area of ​​each contact point: According to the contact area and positive pressure cloud map after the pin is fully inserted, select key points at each contact point to establish a local spherical coordinate system and select the unit within the radius of each contact point using the ESEL command (or use the box selection to select all units within the contact point range), and obtain the accurate contact area and contact positive pressure of each contact point of the spring at the moment when the pin is fully inserted in this way.

[0091] S3: Calculate the theoretical value of the contact resistance of each contact point based on the normal contact force of each contact point. The empirical formula for calculating the theoretical value of the contact resistance is as follows:

[0092] The theoretical value of contact resistance is calculated based on the normal contact force. The empirical formula for calculating the theoretical value of contact resistance is as follows:

[0093]

[0094] In the formula: R is the contact resistance, and its unit is K; K is related to the contact material and its value is obtained experimentally; F is the contact normal force, and its unit is N; m depends on the deformation of the contact surface.

[0095] The contact conductance of the contact surface was calculated, and the formula for contact conductance is as follows:

[0096]

[0097] In the formula: Ecc is the contact conductivity, R is the contact resistance, and A is the contact area;

[0098] The formula for contact thermal conductivity is as follows:

[0099]

[0100] In the formula: Ecc is the contact electrical conductivity, and K is the thermal conductivity of the contact material. The resistivity of the contact material;

[0101] S4: Draw the deformed reed geometry based on the transient mechanical calculation results, import the geometry into the steady-state electro-thermal physics field in ANSYS Workbench, and complete the preprocessing settings:

[0102] S4-1: Based on the transient mechanical calculation results, obtain the deformation of the reed in each direction. The main deformation of the reed is concentrated in the throat of the reed. Other smaller deformations that have no impact on the electrothermal analysis are ignored. Draw the deformed reed model.

[0103] S4-2: Extract the contact area of ​​each contact point obtained in S2-2, and approximate the contact point shape as an ellipse and a circle based on the contact area cloud map. Use Solidworks software to draw the contact point shape of the deformed reed model obtained in S4-1 according to the size of the contact area of ​​each contact point.

[0104] S4-3: Complete the solution setup and preprocessing, including material property settings such as thermal conductivity and resistivity; the mesh generation adopts tetrahedral meshing as the whole, and the contact surfaces are refined; the contact settings are for each contact point and pin / hole, mainly setting the contact conductivity and contact thermal conductivity of each contact point; the boundary conditions are set as current surface and zero voltage surface, where the current surface is the positive electrode wire end face and the voltage surface is the negative electrode wire end face;

[0105] S5: Post-processing of the solution results for the electrothermal module, including electrothermal results such as temperature rise, volume resistance, and voltage drop:

[0106] See Figure 5-7 In this embodiment, the overall model experiences a temperature rise of 55.317°C under ambient temperature of 25°C and a current flow of 200A. The specific temperature distribution is as follows: Figure 7 As shown.

[0107] It should be noted that the parts of this invention not described in detail are common knowledge to those skilled in the art. Several software programs are involved in the above steps, which users can use or replace with similar software.

[0108] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0109] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A force-thermal-electric field coupling method based on a slanted crown spring connector, characterized in that, Specifically, the steps include the following: S1: Establish a single-terminal parametric CAE model of the high-current connector with a slanted crown spring, and complete the material property settings, mesh generation, contact pair definition, boundary conditions and solver configuration using APDL language; S2: Perform transient mechanical field simulation to extract the normal contact force, geometric deformation and contact area of ​​each contact point when the pin is fully inserted; The specific steps for extracting the contact area of ​​each contact point include: establishing a local spherical coordinate system based on the contact pressure cloud map after the pin is fully inserted, or selecting all elements of the contact point by box selection. At the same time, the elements within the radius of each contact point are selected by ESEL command and the precise contact area and contact normal pressure of each contact point are calculated in sequence. S3: Based on Hertz contact theory, calculate the theoretical value of contact resistance according to the normal contact force of each contact point, and calculate the contact conductivity and contact thermal conductivity. The theoretical formula for calculating the contact resistance of a single contact point is as follows, which is used to calculate the contact resistance of each contact point; ； In the formula: R is the contact resistance; K is related to the contact material and its value is obtained experimentally; F is the contact normal force; m depends on the deformation of the contact surface. The contact conductance of the contact surface was calculated, and the formula for contact conductance is as follows: ； In the formula: Ecc is the contact conductivity, R is the contact resistance, and A is the contact area; The formula for contact thermal conductivity is as follows: ； In the formula: Ecc is the contact electrical conductivity, and K is the thermal conductivity of the contact material. The resistivity of the contact material; S4: Reconstruct the reed's geometric model based on the deformation results of the mechanical field, and fit the contact point shape to an ellipse or circle according to the contact area cloud map. Import the steady-state electrothermal field and set the contact conductivity and contact thermal conductivity boundary conditions. The contact point shape fitting is implemented based on SolidWorks software, and the contact area data comes from the accurate calculation results of step S2. Based on the actual shape of the contact area in the cloud map and the actual contact area axis length measured according to the scale in the cloud map, fit the inner surface contact of the reed to an ellipse with an axis ratio > 1.2, and fit the outer surface contact to a circle with an axis ratio ≤ 1.

2. S5: Solve for the electrothermal physical field and output the results of temperature rise, volume resistance and voltage drop distribution.

2. The force-thermal-electric field coupling method based on a slanted crown spring connector according to claim 1, characterized in that: The parametric modeling described in step S1 is for the oblique crown spring structure, using hexahedral mesh generation, and the boundary conditions include fixed constraints and pin axial displacement loads.

3. The force-thermal-electric field coupling method based on a slanted crown spring connector according to claim 1, characterized in that, Step S4, the preprocessing settings for the electrothermal field, include the following: defining the thermal conductivity and resistivity of the material properties, refining the mesh in the contact area, and setting the boundary conditions: current input surface and zero voltage reference surface.

4. A force-thermal-electric field coupling method based on a slanted crown spring connector according to any one of claims 1-3, characterized in that: The high-current connector structure with a slanted crown spring includes a plug assembly and a socket assembly. The plug assembly includes an insulating shell, a top cover, positive and negative sockets with slots, and a slanted crown spring fitted in the slot. The axial length of the slot is greater than the length of the spring and is provided with a limiting step. The socket assembly includes a base, positive and negative pins, and a PCB board. The pins fit into the base slots without gaps. The PCB board has positive and negative conductive layers and an insulating layer, and the two conductive layers are nested with different dimensions in the height direction.

5. The force-thermal-electric field coupling method based on a slanted crown spring connector according to claim 4, characterized in that: The plug assembly's housing and socket mating part are provided with vent holes and cavity structures.

6. The force-thermal-electric field coupling method based on a slanted crown spring connector according to claim 3, characterized in that: The positive and negative conductive layers of the PCB are nested through through holes, and the insulating layer is filled between the conductive layers along the thickness direction.

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