Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel, the display panel comprises a first substrate, a second substrate, a driving layer and a light-emitting element, the first substrate is provided with a first surface and a second surface which are arranged back to back; the second substrate is arranged on one side of the first surface of the first substrate, the second substrate and the first substrate are arranged in a spaced mode, the second substrate is provided with a third surface facing the second substrate and a fourth surface deviating from the second substrate, and the second substrate can allow light to penetrate through; the driving layer is arranged on one side of the first surface of the first substrate; the light-emitting element is arranged on one side of the third surface of the second substrate and fixedly connected with the second substrate, and the light-emitting element is electrically connected with the driving layer and emits light towards the second substrate. In this way, the display effect of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] There is currently a demand for large-screen displays. When large-screen displays are required, multiple small display panels are usually spliced ​​together to form a large display screen. The applicant has found that there are gaps in the splicing of the display panels, which results in poor display effect and affects user experience and visual comfort. Summary of the Invention

[0003] The main technical problem addressed by this application is to provide a display panel, a display device, and a method for manufacturing the display panel, which can improve the display effect of the display panel.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a display panel, comprising: a first substrate having a first surface and a second surface disposed opposite to each other; a second substrate disposed on one side of the first surface of the first substrate and spaced apart from the first substrate, the second substrate having a third surface facing the second substrate and a fourth surface facing away from the second substrate, and the second substrate being able to allow light to pass through; a driving layer disposed on one side of the first surface of the first substrate; and a light-emitting element disposed on one side of the third surface of the second substrate and fixedly connected to the second substrate, wherein the light-emitting element is electrically connected to the driving layer and emits light towards the second substrate.

[0005] The driving layer has a first pad on its surface away from the first substrate, and the light-emitting element has an electrode that is electrically connected to the first pad. Preferably, the first pad is electrically connected to the electrode through a conductive material, which includes at least one of conductive ink, anisotropic conductive adhesive, and metal solder.

[0006] In this configuration, the electrode of the light-emitting element is directly electrically connected to the first pad; alternatively, a second pad is formed on one side of the third surface of the second substrate, the second pad being electrically connected to the first pad, and the electrode of the light-emitting element being electrically connected to the second pad, thereby achieving electrical connection between the second pad and the first pad. Preferably, the display panel further includes a planarization layer disposed on one side of the third surface of the second substrate, the planarization layer having grooves formed on the surface away from the second substrate, the light-emitting element being disposed in the grooves, wherein the second pad is disposed on the side of the planarization layer away from the second substrate. Preferably, the material of the planarization layer includes at least one of polyimide, polymethyl methacrylate, and silicon dioxide. Preferably, the number of light-emitting elements is multiple, the planarization layer having multiple grooves formed on the surface away from the second substrate, and different light-emitting elements being disposed in different grooves.

[0007] The display panel further includes a flexible circuit board, one end of which is disposed on one side of the second surface of the first substrate, and the other end is bent and extended to one side of the first surface of the first substrate and electrically connected to the driving layer; preferably, the display panel further includes a driving chip, which is disposed on one side of the second surface of the first substrate and electrically connected to the flexible circuit board.

[0008] Wherein, the material of the first substrate includes at least one of glass and plastic, and / or, the material of the second substrate includes at least one of glass and plastic.

[0009] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a display device, including a display panel as described in any of the above claims.

[0010] The number of display panels is multiple, and the second substrates of multiple display panels are spliced ​​together.

[0011] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a method for manufacturing a display panel, comprising: forming a driving layer on one side of a first surface of a first substrate; fixing a light-emitting element on one side of a third surface of a second substrate, wherein the second substrate allows light to pass through and the light-emitting element emits light toward the second substrate; arranging the first substrate and the second substrate opposite to each other, such that the driving layer and the light-emitting element are located between the first substrate and the second substrate; and electrically connecting the light-emitting element to the driving layer.

[0012] The driving layer has a first pad on its surface away from the first substrate, and the light-emitting element has an electrode. The step of electrically connecting the light-emitting element to the driving layer includes: aligning and bonding the electrode on the light-emitting element to the first pad, thereby electrically connecting the electrode and the first pad through a conductive material. Preferably, the step of aligning and bonding the electrode on the light-emitting element to the first pad includes: aligning and bonding the electrode on the light-emitting element to the first pad using at least one of mechanical alignment bonding and optical alignment bonding.

[0013] The step of fixing the light-emitting element on one side of the third surface of the second substrate includes: forming a planarization layer on one side of the third surface of the second substrate; forming a groove on the surface of the planarization layer opposite to the second substrate; and fixing the light-emitting element in the groove.

[0014] The beneficial effects of this application are as follows: Unlike the prior art, in the display panel of this application, the first substrate and the second substrate are spaced apart, the driving layer is disposed on one side of the first surface of the first substrate, and the light-emitting element is disposed on one side of the third surface of the second substrate. The driving layer drives the light-emitting layer to emit light. In this application, since a second substrate is disposed outside the first substrate, and since the second substrate is located on the light-emitting side of the light-emitting element, the second substrate does not need to have side traces, and therefore does not need to be encapsulated. This allows for seamless splicing between adjacent second substrates when multiple display panels are spliced ​​together, thereby reducing the abruptness of the splicing seam and improving the product display effect. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0016] Figure 1 This is a schematic diagram of the structure of one embodiment of the display panel of this application;

[0017] Figure 2 This is a schematic diagram of the structure of one embodiment of the display device of this application;

[0018] Figure 3 This is a flowchart illustrating one embodiment of the method for manufacturing the display panel of this application; Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0020] See Figure 1 The display panel 100 includes a first substrate 1, a second substrate 2, a driving layer 3, and a light-emitting element 4.

[0021] The first substrate 1 has a first surface 11 and a second surface 12 disposed opposite to each other. The second substrate 2 is disposed on one side of the first surface 11 of the first substrate 1 and spaced apart from the first substrate 1. The second substrate 2 has a third surface 21 facing the second substrate 2 and a fourth surface 22 away from the second substrate 2, and the second substrate 2 allows light to pass through.

[0022] Specifically, the first substrate 1 serves as a support in the display panel 100, and the second substrate 2 is disposed opposite to the first substrate 1, with the first surface 11 of the first substrate 1 and the third surface 21 of the second substrate 2 facing each other. The second substrate 2 allows light to pass through and can be a transparent substrate or a semi-transparent substrate.

[0023] The driving layer 3 is disposed on one side of the first surface 11 of the first substrate 1, and the light-emitting element 4 is disposed on one side of the third surface 21 of the second substrate 2 and is fixedly connected to the second substrate 2. The light-emitting element 4 is electrically connected to the driving layer 3 and emits light toward the second substrate 2.

[0024] Specifically, the driving layer 3 is used to drive the light-emitting element 4. The driving layer 3 is located on the first surface 11 of the first substrate 1, and the light-emitting element 4 is located on one side of the third surface 21 of the second substrate 2. The driving layer 3 is electrically connected to the light-emitting element 4, thereby driving the light-emitting element 4 to emit light. At the same time, the light-emitting element 4 is disposed inverted on the second substrate 2 and emits light towards the second substrate 2, that is, the light emitted by the light-emitting element 4 is directed toward the second substrate 2.

[0025] In related technologies, a second substrate 2 is not provided; only a first substrate 1 exists, and side traces are also present on the first substrate 1. In order to avoid damage to the side traces on the first substrate 1 during splicing, the side traces on the first substrate 1 are usually encapsulated to form a side encapsulation layer. Due to the presence of the side encapsulation layer on the first substrate 1, there is a large splicing gap between two adjacent first substrates 1 during splicing, which affects the display effect.

[0026] In the scheme of this application, combined with Figure 2When multiple display panels 100 are spliced ​​together, since there is no need for side traces and side encapsulation layers on the second substrate 2, adjacent second substrates 2 can be seamlessly spliced, thereby weakening the abruptness of the splicing seam and improving the product display effect.

[0027] Continue reading Figure 1 The driving layer 3 has a first pad 31 on its surface opposite to the first substrate 1. The light-emitting element 4 has an electrode 41, which is electrically connected to the first pad 31. The light-emitting element 4 has two electrodes 41, one of which is a positive electrode and the other is a negative electrode. Each of the two electrodes 41 on the light-emitting element 4 is electrically connected to a first pad 31.

[0028] In one embodiment, the first pad 31 is electrically connected to the electrode 41 via a conductive material, which includes at least one of conductive ink, anisotropic conductive adhesive, and metal solder. Specifically, the conductive material includes one or more of conductive ink, anisotropic conductive adhesive, and metal solder. For example, the conductive material can be conductive ink, or it can be either conductive ink or anisotropic conductive adhesive.

[0029] Continue reading Figure 1 In one embodiment, a second pad 32 is formed on one side of the third surface 21 of the second substrate 2. The second pad 32 is electrically connected to the first pad 31. The electrode 41 of the light-emitting element 4 is electrically connected to the second pad 32 so as to be electrically connected to the first pad 31 through the second pad 32.

[0030] Specifically, considering that the light-emitting element 4 cannot be aligned with the first pad 31 on the first substrate 1 due to certain factors, a second pad 32 is also provided on one side of the third surface 21 of the second substrate 2, and the electrode 41 of the light-emitting element 4 is electrically connected to the first pad 31 through the second pad 32.

[0031] When the light-emitting element 4 can be aligned with the first pad 31 on the first substrate 1, the electrode 41 of the light-emitting element 4 can also be directly electrically connected to the first pad 31.

[0032] Continue reading Figure 1 The display panel 100 further includes a planarization layer 5, which is disposed on one side of the third surface 21 of the second substrate 2. A groove 51 is formed on the surface of the planarization layer 5 away from the second substrate 2. The light-emitting element 4 is disposed in the groove 51. The second pad 32 is disposed on the side of the planarization layer 5 away from the second substrate 2.

[0033] Specifically, the planarization layer 5 and the light-emitting element 4 are both located on one side of the third surface 21 of the second substrate 2. The planarization layer 5 is provided with a groove 51, so that the light-emitting element 4 is embedded in the groove 51, which makes it easy for the light-emitting element 4 to be installed in a designated position.

[0034] In another embodiment, the planarization layer 5 may not have the groove 51 provided, and the light-emitting element 4 may be fixed to the planarization layer 5 by an adhesive. Alternatively, in other embodiments, the light-emitting element 4 may be directly fixed to the third surface 21 of the second substrate 2 by an adhesive.

[0035] Among them, the planarization layer 5 has a trace (not shown) that electrically connects the second pad 32 and the electrode 41 on the surface away from the second substrate 2. During the fabrication, after the planarization layer 5 is formed, a groove 51 is formed on the planarization layer 5, and the light-emitting element 4 is placed in the groove 51. Then, the second pad 32 and the trace that electrically connects the second pad 32 and the electrode 41 are formed on the side of the planarization layer 5 away from the second substrate 2.

[0036] Continue reading Figure 1 In one embodiment, there are multiple light-emitting elements 4, and the planarization layer 5 has multiple grooves 51 formed on its surface away from the second substrate 2. Different light-emitting elements 4 are disposed in different grooves 51. Specifically, the multiple light-emitting elements 4 are respectively embedded in their respective grooves 51.

[0037] When there are multiple light-emitting elements 4, the electrodes 41 of some light-emitting elements 4 are directly electrically connected to the corresponding first pad 31, while the electrodes 41 of some light-emitting elements 4 are electrically connected to the corresponding first pad 31 through the second pad 32, depending on whether the light-emitting element 4 can be aligned with the first pad 31.

[0038] In one embodiment, the material of the planarization layer 5 includes at least one of polyimide, polymethyl methacrylate, and silica. Specifically, the material of the planarization layer 5 includes one or more of polyimide, polymethyl methacrylate, and silica. For example, the planarization layer 5 can be polyimide, or it can be polyimide or polymethyl methacrylate. This application does not limit the material of the planarization layer 5.

[0039] Continue reading Figure 1 The display panel 100 also includes a flexible circuit board 6 and a driver chip 7. One end of the flexible circuit board 6 is disposed on one side of the second surface 12 of the first substrate 1, and the other end is bent and extends to one side of the first surface 11 of the first substrate 1 and is electrically connected to the driving layer 3. The driver chip 7 is disposed on one side of the second surface 12 of the first substrate 1 and is electrically connected to the flexible circuit board 6.

[0040] Specifically, one end of the flexible circuit board 6 is electrically connected to the driving layer 3, and the other end is bent and extended to the second surface 12 of the first substrate 1 and electrically connected to the driving chip 7. Thus, the driving signal of the driving chip 7 is transmitted to the driving layer 3 through the flexible circuit board 6, and finally drives the light-emitting element 4 to emit light.

[0041] In one embodiment, the material of the first substrate 1 includes at least one of glass and plastic, that is, the material of the first substrate 1 includes one or more of glass and plastic. In one embodiment, the material of the second substrate 2 includes at least one of glass and plastic, that is, the material of the second substrate 2 includes one or more of glass and plastic. For example, both the first substrate 1 and the second substrate 2 are glass plates, and this application does not limit the materials of the first substrate 1 and the second substrate 2.

[0042] See Figure 2 A display device 200 includes a display panel 100 as described in any of the above embodiments. The display device 200 can be used in electronic devices such as televisions, mobile phones, computers, and stage screens. The display device 200 may include only one display panel 100 or multiple display panels 100. When there are multiple display panels 100, the second substrates 2 of the multiple display panels 100 are spliced ​​together. Since the second substrates 2 have no wiring or side encapsulation layers on their sides, adjacent second substrates 2 can be directly spliced ​​by adhesive bonding to achieve seamless splicing.

[0043] Combination Figure 1 as well as Figure 3 The following describes the manufacturing method of the display panel 100, which includes:

[0044] S110: A driving layer 3 is formed on one side of the first surface 11 of the first substrate 1.

[0045] Specifically, the driving layer 3 typically includes structures such as thin-film transistors, capacitors, and various signal lines. The driving layer 3 can be formed on the first substrate 1 through steps such as coating and patterning.

[0046] S120: A light-emitting element 4 is fixed on one side of the third surface 21 of the second substrate 2, wherein the second substrate 2 allows light to pass through, and the light-emitting element 4 emits light toward the second substrate 2.

[0047] Specifically, the light-emitting element 4 can be fixed to one side of the third surface 21 of the second substrate 2 by bonding or embedding, and the light-emitting element 4 emits light towards the second substrate 2.

[0048] S130: The first substrate 1 and the second substrate 2 are arranged opposite to each other, so that the driving layer 3 and the light-emitting element 4 are located between the first substrate 1 and the second substrate 2.

[0049] Specifically, the first substrate 1 and the second substrate 2 are stacked and spaced apart, and the third surface 21 is placed facing the first substrate 1. At this time, the driving layer 3 and the light-emitting element 4 are located between the first surface 11 and the third surface 21.

[0050] S140: Electrically connect the light-emitting element 4 to the driving layer 3.

[0051] Specifically, the light-emitting element 4 is electrically connected to the driving layer 3, so that the driving signal in the driving layer 3 drives the light-emitting element 4 to emit light.

[0052] See Figure 1 The driving layer 3 has a first pad 31 disposed on the surface away from the first substrate 1, and the light-emitting element 4 has an electrode 41 disposed thereon. Step S140 includes: aligning and bonding the electrode 41 on the light-emitting element 4 with the first pad 31, thereby making the electrode 41 and the first pad 31 electrically connected through a conductive material.

[0053] Specifically, the position of electrode 41 on the light-emitting element 4 is aligned with the position of the first pad 31. A conductive material electrically connects electrode 41 and the first pad 31, allowing the electrical signal from the driving layer 3 to be transmitted to the light-emitting element 4 via the first pad 31, the conductive material, and the first pad 31, thus driving the light-emitting element 4 to emit light. The conductive material can be one or more of conductive ink, anisotropic conductive adhesive, and metal solder. It should be noted that this application does not limit the type of conductive material.

[0054] In one embodiment, the step of aligning and bonding the electrode 41 on the light-emitting element 4 with the first pad 31 includes: aligning and bonding the electrode 41 on the light-emitting element 4 with the first pad 31 using at least one of mechanical alignment bonding and optical alignment bonding. Specifically, the alignment and bonding of the electrode 41 with the first pad 31 can be mechanical alignment, where the electrode 41 is correctly aligned with the first pad 31 using a mechanical structure or fixture, and then aligned and bonded using a conductive material; or, the alignment and bonding of the electrode 41 with the first pad 31 can be optical alignment bonding, where the electrode 41 is correctly aligned with the first pad 31 using optical equipment, such as a microscope or a laser alignment system, and then aligned and bonded.

[0055] In one embodiment, step S120 includes: forming a planarization layer 5 on one side of the third surface 21 of the second substrate 2, forming a groove 51 on the surface of the planarization layer 5 away from the second substrate 2; and fixing the light-emitting element 4 in the groove 51.

[0056] Specifically, a planarization layer 5 is formed on the third surface 21 of the second substrate 2 by methods such as chemical mechanical polishing (CMP), thermal oxidation, sputtering deposition, and laser annealing. A groove 51 is formed on the surface of the planarization layer 5 away from the second substrate 2 by means of opening holes, etc. The light-emitting element 4 is fixed in the groove 51, thereby fixing the light-emitting element 4 on the second substrate 2.

[0057] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel, characterized in that, include: The first substrate has a first surface and a second surface disposed opposite to each other; The second substrate is disposed on one side of the first surface of the first substrate and spaced apart from the first substrate. The second substrate has a third surface facing the second substrate and a fourth surface facing away from the second substrate, and the second substrate allows light to pass through. A driving layer is disposed on one side of the first surface of the first substrate; A light-emitting element is disposed on one side of the third surface of the second substrate and fixedly connected to the second substrate, wherein the light-emitting element is electrically connected to the driving layer and emits light toward the second substrate.

2. The display panel according to claim 1, characterized in that, The driving layer has a first pad on its surface away from the first substrate, and the light-emitting element has an electrode that is electrically connected to the first pad. Preferably, the first pad is electrically connected to the electrode via a conductive material, wherein the conductive material includes at least one of conductive ink, anisotropic conductive adhesive, and metal solder.

3. The display panel according to claim 2, characterized in that, The electrode of the light-emitting element is directly electrically connected to the first pad, or a second pad is formed on one side of the third surface of the second substrate, the second pad is electrically connected to the first pad, and the electrode of the light-emitting element is electrically connected to the second pad, so as to be electrically connected to the first pad through the second pad; Preferably, the display panel further includes: a planarization layer disposed on one side of the third surface of the second substrate, wherein a groove is formed on the surface of the planarization layer opposite to the second substrate, and the light-emitting element is disposed in the groove, wherein the second pad is disposed on the side of the planarization layer opposite to the second substrate; Preferably, the material of the planarization layer includes at least one of polyimide, polymethyl methacrylate, and silica; Preferably, there are multiple light-emitting elements, and the planarization layer has multiple grooves formed on the surface away from the second substrate, with different light-emitting elements disposed in different grooves.

4. The display panel according to claim 1, characterized in that, The display panel also includes: A flexible circuit board, one end of which is disposed on one side of the second surface of the first substrate, and the other end is bent and extended to one side of the first surface of the first substrate and electrically connected to the driving layer. Preferably, the display panel further includes a driver chip, which is disposed on one side of the second surface of the first substrate and electrically connected to the flexible circuit board.

5. The display panel according to claim 1, characterized in that, The material of the first substrate includes at least one of glass and plastic, and / or the material of the second substrate includes at least one of glass and plastic.

6. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 5.

7. The display device according to claim 6, characterized in that, The number of display panels is multiple, and the second substrate of multiple display panels is spliced ​​together.

8. A method for manufacturing a display panel, characterized in that, include: A driving layer is formed on one side of the first surface of the first substrate; A light-emitting element is fixed on one side of the third surface of the second substrate, wherein the second substrate allows light to pass through, and the light-emitting element emits light toward the second substrate; The first substrate and the second substrate are arranged opposite to each other, such that the driving layer and the light-emitting element are located between the first substrate and the second substrate; The light-emitting element is electrically connected to the driving layer.

9. The method according to claim 8, characterized in that, The driving layer has a first pad on its surface opposite to the first substrate, and the light-emitting element has electrodes. The step of electrically connecting the light-emitting element to the driving layer includes: The electrode on the light-emitting element is aligned and bonded to the first pad, thereby making the electrode and the first pad electrically connected through a conductive material; Preferably, the step of aligning and bonding the electrode on the light-emitting element with the first pad includes: The electrodes on the light-emitting element are aligned and bonded to the first pad using at least one of optical alignment bonding or mechanical alignment bonding.

10. The method according to claim 8, characterized in that, The step of fixing the light-emitting element on one side of the third surface of the second substrate includes: A planarization layer is formed on one side of the third surface of the second substrate; A groove is formed on the surface of the planarization layer opposite to the second substrate; The light-emitting element is fixed in the groove.

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