A high-power liquid-cooled load testing device for data centers

Abstract

This invention relates to the field of load testing technology, specifically a high-power liquid-cooled load testing device for data centers. The device includes a data processing enclosure and an operating interface located on one side of the enclosure. The data processing enclosure houses a liquid cooling assembly for centralized cooling of data processing components. This liquid cooling assembly includes a heat conduction module, and the heat conduction and cooling module includes a mounting cover for the heat concentration area during data processing component operation. Multiple sets of heat collection plates are arrayed within the mounting cover, and these heat collection plates are connected in series with the data processing component circuitry. Structural optimization significantly improves cooling efficiency and load adaptability. The mounting cover and array of heat collection plates are designed specifically for the heat concentration area, combining a circular cover with a concentric polygonal arrangement to eliminate heat collection blind spots. Multiple arrays of heat collection plates increase the thermal contact area. The combination of a heat-conducting shaft and a copper heat-conducting frame shortens the heat transfer path, improving heat transfer efficiency compared to designs without a heat-conducting shaft.

Description

Technical Field

[0001] This invention relates to the field of load testing technology, specifically to a high-power liquid-cooled load testing device for data centers. Background Technology

[0002] Current liquid-cooled load testing devices for high-power data center equipment suffer from several technical shortcomings that make them unsuitable for testing requirements. First, cooling is not targeted enough; traditional devices often employ full-area cooling, failing to focus on areas of concentrated heat in components, leading to wasted cooling resources. Furthermore, multi-core chips and other heat sources are prone to localized overheating, resulting in poor test stability. Second, the heat collection and conduction structures are inefficient; heat collectors are often randomly arranged or made of a single material, resulting in limited heat contact area, long heat conduction paths, and significant losses. Third, the liquid cooling circulation system has low reliability; the "bottom-in, top-out" liquid flow design violates the principle of heat convection, leading to insufficient heat exchange. Fourth, there is a lack of safety monitoring and redundancy; the absence of real-time hydraulic monitoring makes the pipeline susceptible to damage due to abnormal pressure, and main line failures require system shutdown for repairs, resulting in low equipment availability. These problems lead to high energy consumption and insufficient testing accuracy in existing devices, making them unsuitable for the precise testing scenarios of high-power loads in data centers. Summary of the Invention

[0003] To address the problems in the prior art, this invention provides a high-power liquid-cooled load testing device for data centers.

[0004] The technical solution adopted by the present invention to solve its technical problem is: a high-power liquid-cooled load testing device for data centers, including a data processing cabinet;

[0005] Liquid cooling assembly: The data processing box is equipped with a liquid cooling assembly for centralized cooling of the data processing components.

[0006] The liquid cooling assembly includes a conductive module;

[0007] The conductive module includes a mounting cover for the heat concentration area during the operation of the data processing element;

[0008] The array inside the mounting cover is equipped with multiple sets of heat collection plates, which are connected in series with the data processing element circuit.

[0009] The heat collection plates are arranged at equal intervals or staggered along the mounting cover, and the heat collection plates dissipate heat through the flow of water.

[0010] The beneficial effects of this invention are as follows: This invention significantly improves cooling efficiency and load adaptability through structural optimization. A heat-concentrating shroud and array of heat-collecting plates are designed for the heat concentration area. The combination of a circular shroud and a concentric polygonal arrangement eliminates heat collection blind spots, and multiple arrays of heat-collecting plates increase the thermal contact area. The combination of a heat-conducting shaft and a copper heat-conducting frame shortens the heat transfer path, improving heat conduction efficiency compared to designs without a heat-conducting shaft, and also improving heat exchange efficiency compared to a single conduit structure. The "top-in, bottom-out" liquid flow and the U-shaped heat-conducting rod array adapt to the principle of thermal convection, stably supporting high-power load testing. Simultaneously, the lightweight design of the copper heat-conducting frame and U-shaped rods ensures thermal conductivity while reducing the load on the heat exchange box, adapting to the compact layout requirements of data centers. Attached Figure Description

[0011] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0012] Figure 1 This is a schematic diagram of the overall structure of a high-power liquid-cooled load testing device for a data center according to the present invention.

[0013] Figure 2 This is a schematic diagram of the internal structure of a high-power liquid-cooled load testing device for a data center according to the present invention.

[0014] Figure 3 This is a schematic diagram of the heat exchange box structure of a high-power liquid-cooled load testing device for data centers according to the present invention.

[0015] Figure 4 This is a three-dimensional structural diagram of the mounting cover of a high-power liquid-cooled load testing device for a data center according to the present invention;

[0016] Figure 5 This invention relates to a high-power liquid-cooled load testing device for data centers. Figure 4 Schematic diagram of the structure at point A in the middle;

[0017] Figure 6 This is a first embodiment of the heat-conducting component of a high-power liquid-cooled load testing device for data centers according to the present invention;

[0018] Figure 7 This is a second embodiment of the heat-conducting component of a high-power liquid-cooled load testing device for data centers according to the present invention.

[0019] In the diagram: 100, Data processing box; 110, Operation interface; 200, Liquid cooling assembly; 210, Liquid inlet pipe; 211, Hydraulic display; 220, Heat exchange box; 221, First bypass pipe; 222, Second bypass pipe; 223, Flange; 224, Heat conduction frame; 225, Rotating shaft; 226, Baffle blades; 227, Support plate; 228, Heat conduction rod; 230, Liquid outlet pipe; 260, Conduction module; 261, Mounting cover; 263, Heat conduction shaft; 264, Heat collection plate. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0021] Example 1:

[0022] like Figure 1 - Figure 7 As shown, a high-power liquid-cooled load testing device for data centers according to the present invention includes a data processing box 100 and an operation interface 110 placed on one side of the data processing box 100.

[0023] The data processing enclosure 100 houses data processing components, such as high-power chips like CPUs and GPUs; it provides installation and protection space, while the operation interface 110 is used to input test parameters and view test data in real time, such as component temperature and liquid cooling flow rate.

[0024] The data processing enclosure 100 is equipped with a liquid cooling assembly 200 for centralized cooling of the data processing components;

[0025] The liquid cooling assembly 200 includes a conductive module 260.

[0026] The conductive module 260 includes a mounting cover 261 for the heat concentration area during the operation of the data processing element; multiple sets of heat collection plates 264 are arranged in an array inside the mounting cover 261, and the heat collection plates 264 are connected in series with the circuit of the data processing element.

[0027] The conductive module 260 of the liquid cooling component 200 is specifically designed to target the heat concentration area of ​​the data processing element. The mounting cover 261 covers the heat concentration area, and the heat collection plates 264 arranged in an array inside the cover are connected in series with the circuit of the data processing element. The heat collection plates 264 are arranged at equal intervals or staggered along the mounting cover 261. The heat collection plates 264 dissipate heat through the flow of water. Physically, they are arranged along the heat-generating path of the element and directly contact the surface of the heat-generating element. The high thermal conductivity of the heat collection plates 264 quickly collects the heat generated by the element during operation, laying the foundation for subsequent heat exchange.

[0028] Among them, the mounting cover 261 focuses on the heat concentration area, avoids the waste of cooling resources, and solves the problem of "full-area cooling and local overheating" in traditional liquid cooling; the shape of the cross section of the mounting cover 261 can be selected from regular polygons, racetrack shapes, circles, or ellipses; the array-type heat collection plate 264 greatly increases the heat contact area, improves heat collection efficiency, and provides a guarantee for stable cooling of high-power loads; the heat collection plate 264 is arranged in series with the circuit, without occupying too much extra space, and is suitable for the compact equipment layout of data centers.

[0029] As a preferred technical solution: the mounting cover 261 is circular, and the heat collection plates 264 are arranged at equal intervals along the circumference of the mounting cover 261, and are arranged in multiple rows;

[0030] The center lines of the heat collector 264 form multiple polygons, and all of these polygons are concentric.

[0031] The center lines of the heat collection plates 264 form multiple concentric polygons. This arrangement makes fuller use of the space on one side of the mounting cover 261. The heat collection plates 264 are spaced appropriately to reduce thermal interference between them.

[0032] The arrangement of multiple rows or concentric polygons around the circumference allows for the installation of more heat collection fins 264, enabling heat transfer and dissipation for more data processing components.

[0033] As a preferred technical solution: the heat collection plate 264 is fixed to the mounting cover 261 by a heat-conducting shaft 263, and the heat-conducting shaft 263 passes through the bottom of the mounting cover 261.

[0034] The heat collection plate 264 is fixed to the mounting cover 261 by the heat-conducting shaft 263, which passes through the bottom of the mounting cover 261. The heat-conducting shaft 263 provides stable support for the heat collection plate 264 and prevents it from shifting under equipment vibration or liquid flow impact. The heat collected by the heat collection plate 264 is quickly conducted to the outside of the mounting cover 261 through the heat-conducting shaft 263, which facilitates subsequent heat dissipation and avoids heat accumulation inside the mounting cover 261.

[0035] Example 2:

[0036] Basically the same as in Example 1, such as Figure 1 and Figure 6 As shown, the difference is that the liquid cooling assembly 200 also includes a heat exchange box 220.

[0037] The heat exchange box 220 and the mounting cover 261 are fixed and sealed together by flange 223, and the heat-conducting shaft 263 extends into the heat exchange box 220;

[0038] The heat exchange box 220 is equipped with a heat-conducting component connected to the heat-conducting shaft 263;

[0039] A liquid inlet pipe 210 is provided on the upper end of the side of the heat exchange box 220 near the mounting cover 261;

[0040] The liquid outlet pipe 230 is connected to the heat exchange box 220 and is located at the lower end of the opposite side of the liquid inlet pipe 210.

[0041] The heat exchange box 220 is fixed and sealed to the mounting cover 261 by flange 223. A gasket is provided between flanges 223, and the gasket is a graphite composite gasket. The flange 223 is connected with the graphite gasket, which can withstand a pressure of 1.6MPa without leakage, and is suitable for high-pressure liquid cooling scenarios.

[0042] The heat-conducting shaft 263 extends into the heat exchange box 220 to transfer the heat from the heat collector 264 to the heat-conducting components inside the heat exchange box 220.

[0043] Coolant flows into the heat exchanger 220 through the inlet pipe 210 at the top, making full contact with the heat-conducting components and absorbing heat. After the temperature rises, the coolant flows out through the outlet pipe 230 at the bottom and enters the external cooling system, such as a cooling tower, for cooling and recycling, forming a complete liquid cooling circuit. The "top in, bottom out" flow direction conforms to the principle of thermal convection, with hot water, which has a lower density, flowing upwards and cold water, which has a higher density, flowing downwards, ensuring that the coolant and heat-conducting components exchange heat fully.

[0044] As a preferred technical solution, the heat-conducting component includes a heat-conducting frame 224, which is made of metal.

[0045] Its side near the mounting cover 261 is connected to the heat-conducting shaft 263 extending into the heat exchange box 220.

[0046] The heat-conducting component is a metal heat-conducting frame 224. The side of the frame closest to the mounting cover 261 is connected to the heat-conducting shaft 263 extending into the heat exchange box 220. The heat-conducting shaft transfers heat to the heat-conducting frame 224. With its high thermal conductivity and large surface area, the metal heat-conducting frame 224 makes full contact with the coolant flowing into the heat exchange box 220, quickly transferring heat to the coolant and realizing a complete heat collection, heat conduction and heat exchange chain.

[0047] As a preferred technical solution, the heat conduction frame 224 is preferably made of copper with good thermal conductivity; a hole adapted to the heat conduction shaft 263 is provided on one side of the heat conduction frame 224, and the heat conduction shaft 263 is inserted into the hole provided on one side of the heat conduction frame 224.

[0048] Thermal conductivity of copper (especially red copper) Much higher than aluminum ,steel This design minimizes heat loss within the heat-conducting frame 224. The raised spherical shape in the center of the heat-conducting frame 224 increases the contact area with water, thereby enhancing heat dissipation. A hole for the heat-conducting shaft 263 is provided on one side of the heat-conducting frame 224, allowing the heat-conducting shaft 263 to be directly inserted into the hole, ensuring tight contact and simplifying the assembly process. The precision machining of the fitting hole ensures that there are no gaps between the heat-conducting shaft 263 and the heat-conducting frame 224, preventing a decrease in heat transfer efficiency caused by air insulation.

[0049] As a preferred technical solution, the diameter of the inlet pipe 210 is larger than the diameter of the outlet pipe 230; the heat conduction frame 224 has a raised spherical shape in the middle, and the tail of the heat conduction frame 224 is connected to a baffle 226 through a rotating shaft 225, and the baffle 226 is made of plastic material, and the baffle 226 is adapted to the inner diameter of the heat exchange box 220.

[0050] The large diameter of the inlet pipe ensures that the coolant quickly fills the heat exchange box 220, shortening the system start-up time; the small diameter of the outlet pipe 230 keeps a certain liquid pressure in the heat exchange box 220, prolonging the contact time between the coolant and the heat conduction frame 224, and improving the heat exchange efficiency.

[0051] The turbulence blades 226 rotate under the push of the water flow, and they can also play a role in heat conduction. They disrupt the direction of liquid flow to avoid laminar flow, so that the coolant can fully contact the surface of the heat conduction frame 224 and eliminate heat exchange dead zones.

[0052] In other words, the "large inlet, small outlet" pipe diameter design balances flow and pressure, ensuring that the coolant in the heat exchange box 220 is full and the flow rate is stable; the diameter of the inlet pipe 210 is also larger than the overall diameter of the baffle blades 226. The accelerated flow of the coolant drives the baffle blades 226 to rotate, and the baffle blades 226 break the laminar flow, so that the coolant temperature distribution is uniform with a temperature difference of ≤2℃, avoiding the decrease in heat exchange efficiency caused by local excessively high coolant temperature.

[0053] Example 3:

[0054] Basically the same as in Example 1, such as Figure 1 and Figure 7 As shown, the difference is that the heat-conducting component includes a heat-conducting rod 228, which is connected to a heat-conducting shaft 263 extending into the heat exchange box 220;

[0055] The heat-conducting rods 228 are arranged in a "U" shape and are arrayed inside the heat exchange box 220.

[0056] The heat-conducting component is a heat-conducting rod 228. The heat-conducting shaft 263 is connected to the heat-conducting rod 228 extending into the heat exchange box 220. Heat is transferred to the heat-conducting rod 228 through the heat-conducting shaft 263. The heat-conducting rod 228 directly contacts the coolant for heat exchange.

[0057] The heat-conducting rods 228 are U-shaped with a radius of 30mm and a straight section length of 100mm. They are arranged in an array within the heat exchange box 220. The U-shaped structure extends the path length of the heat-conducting rods 228 within the heat exchange box 220 by 100% compared to straight rods. The array arrangement ensures that there are no heat exchange blind spots within the heat exchange box 220, and that the coolant makes full contact with each heat-conducting rod 228 as it flows through. The U-shaped heat-conducting rods 228 are hollow rods, and the heat is concentrated on the surface. Compared to solid heat-conducting rods 228, they are 40% lighter, reducing the load on the heat exchange box 220.

[0058] As a preferred technical solution, the heat exchange box 220 is provided with multiple sets of support plates 227, and the heat-conducting rod 228 passes through the support plates 227.

[0059] Multiple sets of support plates 227 are fixed inside the heat exchange box 220. The heat-conducting rods 228 pass through the adapter holes on the support plates 227. The support plates 227 provide radial support for the heat-conducting rods 228 to prevent the heat-conducting rods 228 from shaking or shifting when the coolant flows or the equipment vibrates, and to ensure that the heat-conducting rods 228 always remain in the preset array position and maintain the optimal contact state with the coolant.

[0060] As a preferred technical solution, a hydraulic display 211 for real-time monitoring of water pressure is provided through the side wall of the liquid inlet pipe 210, and a first bypass pipe 221 and a second bypass pipe 222 are provided through the side wall of the heat exchange box 220, and both the first bypass pipe 221 and the second bypass pipe 222 are controlled by valves.

[0061] The hydraulic display 211 pointer pressure gauge on the side wall of the inlet pipe 210 monitors the inlet pressure in real time. When the pressure exceeds the safety threshold of 1.6MPa or is lower than the minimum working pressure of 0.2MPa, the operator can adjust the pump speed through the operation interface 110 to ensure the pressure of the liquid cooling system is stable.

[0062] The inlet side of the first bypass pipe 221 and the outlet side of the second bypass pipe 222 on the side wall of the heat exchanger 220 are both controlled by valves. When the main inlet pipe 210 / outlet pipe 230 is blocked or leaks, the valve of the corresponding bypass pipe is opened to realize the backup circulation of coolant. At the same time, the bypass pipe can be used to vent the system to remove air or replenish coolant.

[0063] Both the first bypass pipe 221 and the second bypass pipe 222 are stainless steel pipes with a diameter of 25mm. The valves are manual ball valves DN25 with a pressure rating of 1.6MPa.

[0064] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-power liquid-cooled load testing device for data centers, comprising: Data processing enclosure (100); Liquid cooling assembly (200), wherein the data processing housing (100) is provided with a liquid cooling assembly (200) for centralized cooling of data processing components, characterized in that: The liquid cooling assembly (200) includes a conduction module (260), and the conduction module (260) includes a mounting cover (261); The conductive module (260) is specifically designed to target the heat concentration area of ​​the data processing element, and the mounting cover (261) covers the heat concentration area; Multiple sets of heat collection plates (264) are arranged in an array inside the mounting cover (261). The heat collection plates (264) are connected in series with the data processing element circuit. The heat collection plates (264) are arranged at equal intervals or staggered along the mounting cover (261). The heat collection plates (264) dissipate heat through the flow of water. The heat collection plates (264) are arranged at equal intervals along the circumference of the mounting cover (261) and are arranged in multiple rows; and / or the center line of the heat collection plates (264) forms multiple polygons, and the multiple polygons are all concentric polygons. The heat collection plate (264) is fixed to the mounting cover (261) by a heat-conducting shaft (263), and the heat-conducting shaft (263) passes through the bottom of the mounting cover (261); The liquid cooling assembly (200) also includes a heat exchange box (220). The heat exchange box (220) and the mounting cover (261) are fixed and sealed together by a flange (223), and the heat-conducting shaft (263) extends into the heat exchange box (220); The heat exchange box (220) is equipped with a heat-conducting component connected to the heat-conducting shaft (263); A liquid inlet pipe (210) is provided on the upper end of the side of the heat exchange box (220) near the mounting cover (261). The liquid outlet pipe (230) is connected to the heat exchange box (220) and is located at the lower end of the opposite side of the liquid inlet pipe (210); The diameter of the inlet pipe (210) is larger than the diameter of the outlet pipe (230); The heat-conducting component is a heat-conducting frame (224), which is made of heat-conducting material; Its side near the mounting cover (261) is connected to the heat-conducting shaft (263) extending into the heat exchange box (220); The heat-conducting frame (224) has a raised spherical shape in the middle, and the tail of the heat-conducting frame (224) is connected to a baffle (226) via a rotating shaft (225). The baffle (226) is adapted to the inner diameter of the heat exchange box (220); and the baffle is made of plastic. Alternatively, the heat-conducting element may be a heat-conducting rod (228), which is connected to a heat-conducting shaft (263) extending into the heat exchange box (220); and / or The heat-conducting rods (228) are arranged in a "U" shape and are arrayed inside the heat exchange box (220); The shape of the cross section of the mounting cover (261) is selected from regular polygons, racetracks, circles or ellipses.

2. The data center high-power liquid-cooled load testing device according to claim 1, characterized in that: The heat-conducting bracket (224) is made of copper; and / or The heat-conducting frame (224) has a hole on one side that is compatible with the heat-conducting shaft (263), and the heat-conducting shaft (263) is inserted into the hole on one side of the heat-conducting frame (224).

3. The data center high-power liquid-cooled load testing device according to claim 1, characterized in that: Multiple sets of support plates (227) are fixedly installed inside the heat exchange box (220), and the heat-conducting rod (228) passes through the support plates (227).

4. The data center high-power liquid-cooled load testing device according to claim 1, characterized in that: The side wall of the liquid inlet pipe (210) is provided with a hydraulic display (211) for real-time monitoring of water pressure. The side wall of the heat exchange box (220) is provided with a first bypass pipe (221) and a second bypass pipe (222), and both the first bypass pipe (221) and the second bypass pipe (222) are controlled by valves.

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