A method for splicing and sizing balsa wood

By using laser marking and image processing technology, precise control of the wood splicing and cutting process has been achieved, solving the problems of loose splicing and inconsistent cutting dimensions in traditional methods, thus improving product quality and production efficiency.

CN120962807BActive Publication Date: 2026-05-15JIANGXI AWESOMEN NEW ENERGY TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JIANGXI AWESOMEN NEW ENERGY TECHNOLOGY CO LTD
Filing Date
2025-07-29
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Traditional wood splicing methods rely on workers' experience, resulting in loose splices, large gaps, and inconsistent cutting dimensions, which affect product quality and efficiency.

Method used

Laser marking and image processing technology are used to achieve precise control over the splicing and cutting process. The position and angle of the boards are marked by laser, and the splicing seams and cutting dimensions are checked by the image processing system to ensure consistency and accuracy.

Benefits of technology

It improves the tightness of splicing and the accuracy of cutting, enhances product quality and production efficiency, and solves problems such as loose splicing and inconsistent cutting dimensions that exist in traditional methods.

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Abstract

The application discloses a kind of barashamu splicing fixed-width cutting methods, it is related to timber processing technical field, including using laser line marker to mark the splicing end of board;According to laser marking line, the position and angle of splicing board are adjusted;Board is spliced together;Again using laser line marker marks the outer contour line of splicing qualified board;Spliced board is placed in outer contour line;Image acquisition device is used to photograph board after splicing, and the image obtained is input into image processing and analysis system;With the help of image processing and analysis system, the uniformity of board splicing joint and the shielding condition of outer contour line are checked and analyzed;Take the board that passes inspection and analysis, and place it on the clamp of cutting mechanism.The method introduces advanced technologies such as laser marking, image processing and analysis, realizes accurate control and automatic inspection of the splicing and cutting process, greatly improves the quality and production efficiency of product.
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Description

Technical Field

[0001] This invention relates to the field of wood processing technology, specifically a method for splicing and cutting balsa wood to a fixed width. Background Technology

[0002] In the wood processing industry, splicing and cutting are two crucial processes. Traditional splicing methods often rely on workers' experience and manual operation, which not only leads to low splicing accuracy but also easily results in loose joints and large gaps, seriously affecting the overall quality and aesthetics of the product. Similarly, the cutting process also faces challenges; ensuring that the cut boards have consistent width and dimensions has always been a problem that the wood processing industry urgently needs to solve.

[0003] Traditional cutting methods mostly employ mechanical cutting, relying on the precision of the cutting tools and the operator's skill. However, this method often struggles to guarantee the accuracy and consistency of the cut dimensions, especially in mass production, where dimensional deviations and uneven cut surfaces frequently occur. This not only affects product quality and performance but also increases the difficulty and cost of subsequent processing.

[0004] Furthermore, traditional splicing and cutting methods are significantly inefficient in terms of production. Relying on manual operation and experience-based judgment, they result in long production cycles and low efficiency, failing to meet the demands of the modern wood processing industry for efficient and precise production. Summary of the Invention

[0005] To address the aforementioned problems, this invention proposes a novel method for splicing and cutting balsa wood to a fixed width. This method, by introducing advanced technologies such as laser marking, image processing, and analysis, achieves precise control and automated inspection of the splicing and cutting processes, significantly improving product quality and production efficiency. This innovation not only solves problems such as loose splicing and inconsistent cutting dimensions found in traditional methods, but also provides the wood processing industry with an efficient and precise production method, possessing significant technological advantages and application value.

[0006] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a method for splicing and cutting balsa wood to a fixed width, comprising the following steps:

[0007] S1. Use a laser marker to mark the joints of the boards;

[0008] S2. Adjust the position and angle of the splicing panels according to the laser-marked lines;

[0009] S3. Join the boards together;

[0010] S4. Use a laser marker again to mark the outer contour line of the spliced ​​qualified panels;

[0011] S5. Place the assembled panels within the outer contour line;

[0012] S6. Use an image acquisition device to photograph the spliced ​​panels and input the acquired images into an image processing and analysis system;

[0013] S7. Use an image processing and analysis system to check and analyze the uniformity of the joints between the panels and the occlusion of the outer contour lines;

[0014] S8. Take the qualified board material and place it on the clamp of the cutting mechanism. The clamp can slide along the X or Y axis to control the cutting direction of the board material.

[0015] S9. Before cutting the board, use a laser marker to mark cutting lines of equal width on the board;

[0016] S10. Cut the board multiple times along the cutting line to obtain balsa wood boards of equal width.

[0017] In some embodiments, the specific steps for splicing the panels in step S3 include:

[0018] S3.1 Prepare the balsa wood boards to be spliced ​​and confirm the quantity, size and splicing sequence of the boards;

[0019] S3.2 Place the first board on the splicing workbench and ensure its position is stable;

[0020] S3.3 Pick up the subsequent boards one by one, and align the splicing ends of the boards with the already placed boards according to the predetermined splicing order and laser marking lines;

[0021] S3.4 Use clamps or clamping devices to temporarily fix the joints;

[0022] S3.5 After all the panels are assembled, a comprehensive inspection of the entire assembled panel is carried out.

[0023] In some embodiments, the specific steps for marking the outer contour line with the laser marker in step S4 include:

[0024] S4.1 Restart the laser marker and adjust its output parameters;

[0025] S4.2 Align the laser marker with one end of the spliced ​​board and move the laser marker along the outer edge of the board;

[0026] S4.3 Maintain the appropriate distance and angle between the laser marker and the surface of the material;

[0027] S4.4 After completing one round of marking, check the integrity and accuracy of the outer contour marking lines.

[0028] In some embodiments, the image acquisition device in step S6 specifically includes:

[0029] High-resolution cameras are used to capture clear images of the spliced ​​panels;

[0030] Lens assembly, connected to the camera, used to adjust focus and field of view;

[0031] Light source components are used to provide stable and uniform lighting conditions;

[0032] An image acquisition card, connected to a camera, is used to convert images captured by the camera into digital signals.

[0033] In some embodiments, the image processing and analysis system in steps S6 and S7 specifically includes:

[0034] The image receiving module is used to receive digital image signals transmitted by the image acquisition device;

[0035] Image processing module, including preprocessing functions;

[0036] The feature extraction module uses edge detection technology to identify the location of seams and outer contours in the image;

[0037] The uniformity analysis module evaluates the tightness and consistency of the stitching by calculating the degree of difference between pixels on both sides of the stitching seam.

[0038] The obstruction inspection module compares the outer contour of the actual spliced ​​panels with the outer contour of the qualified spliced ​​panels.

[0039] The quality control report generation module generates an evaluation report on the splicing quality based on the analysis results of uniformity and occlusion.

[0040] In some embodiments, the image processing and analysis step in step S7 specifically includes:

[0041] S7.1 Image Preprocessing: The image processing module performs preprocessing operations on the received image;

[0042] S7.2 Feature Extraction: The preprocessed image is analyzed using edge detection technology through the feature extraction module;

[0043] S7.3 Uniformity Analysis: The uniformity analysis module calculates the degree of difference between pixels on both sides of the splicing seam based on the feature extraction results;

[0044] S7.4 Obstruction Check: The obstruction check module compares the outer contour of the actual spliced ​​panels with the outer contour of the qualified spliced ​​panels.

[0045] S7.5 Quality Control Report Generation: The quality control report generation module generates an evaluation report on the splicing quality based on the analysis results of uniformity and occlusion.

[0046] In some embodiments, the cutting process in step S10 specifically includes:

[0047] S10.1 Adjust the cutting blade of the cutting mechanism to the predetermined position according to the equal-width cutting line marked by the laser line marker;

[0048] S10.2 Start the cutting mechanism and perform a smooth and continuous cutting operation on the board along the cutting line;

[0049] S10.3 After completing one cut, check the flatness and dimensional accuracy of the cut surface;

[0050] S10.4 Repeat steps S10.1 to S10.3 to cut the board multiple times.

[0051] Compared with the prior art, the beneficial effects of the present invention are:

[0052] This invention, by introducing laser marking technology, achieves precise control and positioning of splicing gaps, greatly improving the tightness and accuracy of splicing. This not only effectively solves the problems of large gaps and loose splicing common in traditional splicing methods, but also significantly improves the overall quality and aesthetics of the product.

[0053] This invention utilizes image processing and analysis technology to monitor and adjust the cutting process in real time, ensuring that the cut boards have consistent width and dimensions. This innovation not only improves the accuracy and consistency of cutting but also effectively avoids common problems in traditional cutting methods, such as dimensional deviations and uneven cut surfaces, further enhancing product quality and performance. Detailed Implementation

[0054] The embodiments of the present invention are described in detail below:

[0055] This embodiment provides a method for splicing and cutting balsa wood to a fixed width, including the following steps:

[0056] S1. Using a laser marker to mark the splicing ends of the boards ensures the accuracy of the splicing. The laser marker emits a fine and bright light to accurately mark the splicing ends of the boards, providing a precise reference for subsequent splicing and cutting.

[0057] S2. Adjust the position and angle of the splicing panels according to the laser marking line to ensure tight and uniform splicing. By adjusting the position and angle of the panels, the splicing seam can be made tighter, avoiding quality problems caused by loose splicing.

[0058] S3. The boards are joined together to form a single board. This step is the core of the joining process. Through the precise marking and adjustments made earlier, the accuracy of the joined boards in terms of position and angle is ensured.

[0059] S4. Use a laser marker again to mark the outer contour line of the spliced ​​qualified boards, which provides a clear reference for subsequent cutting and ensures that the cut boards have a consistent shape and size;

[0060] S5. Place the assembled panels within the outer contour line to compare the outer contour of the actual assembled panels with the outer contour of the qualified assembled panels.

[0061] S6. Use an image acquisition device to photograph the spliced ​​panels and input the acquired images into an image processing and analysis system;

[0062] S7. By using an image processing and analysis system, the uniformity of the splicing seams and the occlusion of the outer contour lines are inspected and analyzed, realizing automated inspection of splicing quality. Through the image processing and analysis system, the uniformity of the splicing seams and the occlusion of the outer contour lines can be inspected quickly and accurately, improving production efficiency and product quality;

[0063] S8. Take the qualified board material and place it on the clamp of the cutting mechanism. The clamp can slide along the X or Y axis to control the cutting direction of the board material.

[0064] S9. Before cutting the board, use a laser marker to mark cutting lines of equal width on the board, providing a precise reference line for cutting and ensuring that the cut boards have a consistent width;

[0065] S10. Cut the board multiple times along the cutting line to obtain balsa wood boards of equal width.

[0066] In some embodiments, the specific steps for splicing the panels in step S3 include:

[0067] S3.1 Ensure the work area is clean and free of clutter, prepare the balsa wood boards to be spliced, and confirm the quantity, size, and splicing sequence of the boards;

[0068] S3.2 According to the laser-marked line, place the first board on the splicing workbench and ensure that its position is stable and without shaking;

[0069] S3.3 Pick up the subsequent boards one by one, and align the splicing ends of the boards with the placed boards according to the predetermined splicing order and laser marking lines to ensure that the splicing seams are tight and there are no obvious gaps.

[0070] S3.4 During the splicing process, clamps or pressing devices are used to temporarily fix the splicing seams to prevent the panels from moving or misaligning during the splicing process;

[0071] S3.5 After all the panels are spliced, a comprehensive inspection is carried out on the entire spliced ​​panel to ensure the tightness and consistency of the splice seams, as well as the flatness and alignment between the panels.

[0072] By following the specific operational steps for panel splicing in S3 above, the splicing process of balsa wood panels can be ensured to be precise and efficient. This step is the core of the splicing process. Through precise marking and adjustment beforehand, and meticulous splicing and fixing afterwards, the accuracy of the spliced ​​panels in terms of position and angle is ensured. At the same time, a comprehensive inspection process can promptly identify and correct any potential splicing problems, such as gaps, misalignments, or unevenness, thereby further guaranteeing the quality of splicing and the accuracy of subsequent cutting. The implementation of this step lays a solid foundation for subsequent cutting and product quality.

[0073] In some embodiments, the specific steps for marking the outer contour line with the laser marker in step S4 include:

[0074] S4.1 Restart the laser marker and adjust its output parameters according to the size and shape of the spliced ​​board material to ensure that the outer contour of the mark is clearly visible and accurate;

[0075] S4.2 Align the laser marker with one end of the spliced ​​board and move the laser marker along the outer edge of the board so that the light emitted by it forms a continuous outer contour marking line on the board.

[0076] S4.3 During movement, maintain an appropriate distance and angle between the laser marker and the surface of the board to ensure the accuracy and consistency of the marked lines;

[0077] S4.4 After completing one round of marking, check the completeness and accuracy of the outer contour marking lines to ensure that there are no omissions or deviations. If necessary, make corrections and supplementary markings.

[0078] By following the specific steps in S4 above for marking the outer contour lines with a laser marker, it is ensured that the outer contour of the spliced ​​panels is accurately marked before cutting. This step provides a clear reference line for subsequent cutting, resulting in panels with consistent shape and size. Adjusting the output parameters of the laser marker ensures the clarity and accuracy of the marked lines, while maintaining an appropriate distance and angle ensures consistency and accuracy. Finally, by checking the integrity and accuracy of the outer contour marking lines, any potential marking errors can be identified and corrected in a timely manner, further guaranteeing the quality and precision of the cutting.

[0079] In some embodiments, the image acquisition device in step S6 specifically includes:

[0080] A high-resolution camera is used to capture clear images of the spliced ​​panels, ensuring rich image details for easy subsequent analysis and processing;

[0081] The lens assembly, connected to the camera, is used to adjust the focus and field of view to ensure that a complete picture of the spliced ​​panels can be captured while maintaining image clarity.

[0082] The light source assembly is used to provide stable and uniform lighting conditions, avoid the impact of shadows and reflections on image quality, and ensure that the captured images can truly reflect the actual situation of the spliced ​​panels.

[0083] An image acquisition card, connected to a camera, is used to convert images captured by the camera into digital signals and transmit them to an image processing and analysis system for subsequent inspection and analysis.

[0084] In some embodiments, the image processing and analysis system in steps S6 and S7 specifically includes:

[0085] An image receiving module is used to receive digital image signals transmitted by an image acquisition device and convert them into image data that can be analyzed.

[0086] The image processing module includes preprocessing functions such as filtering and enhancement to improve image quality and increase the accuracy of subsequent analysis.

[0087] The feature extraction module uses edge detection technology to identify the location of splicing seams and outer contour lines in the image, providing a basis for subsequent uniformity and occlusion analysis;

[0088] The uniformity analysis module evaluates the tightness and consistency of the stitching by calculating the degree of difference between pixels on both sides of the stitching seam.

[0089] The obstruction inspection module detects whether there is any obstruction or missing parts by comparing the outer contour of the actual spliced ​​board with the outer contour of the qualified spliced ​​board.

[0090] The quality control report generation module generates an evaluation report on the splicing quality based on the analysis results of uniformity and occlusion, providing a basis for decision-making in subsequent cutting and quality control.

[0091] In some embodiments, the image processing and analysis step in step S7 specifically includes:

[0092] S7.1 Image Preprocessing: The image processing module performs preprocessing operations such as filtering and enhancement on the received image to remove noise, enhance the features of the splicing seams and outer contour lines, and improve the accuracy and reliability of subsequent analysis.

[0093] S7.2 Feature Extraction: The feature extraction module uses edge detection technology to analyze the preprocessed image, accurately identifying the position of the splicing seam and outer contour line in the image, providing accurate basic data for subsequent uniformity and occlusion analysis;

[0094] S7.3 Uniformity Analysis: Based on the feature extraction results, the uniformity analysis module calculates the degree of difference between pixels on both sides of the splicing seam to evaluate the tightness and consistency of the splicing. If the degree of difference exceeds a preset threshold, the splicing quality is deemed unqualified.

[0095] S7.4 Obstruction Check: The obstruction check module compares the outer contour of the actual spliced ​​panels with the outer contour of the qualified spliced ​​panels to detect whether there is any obstruction or missing parts. If obstruction or missing parts are found, the splicing quality is deemed unqualified.

[0096] S7.5 Quality Control Report Generation: Based on the analysis results of uniformity and occlusion, the quality control report generation module generates an assessment report on the splicing quality. The report includes an assessment of the tightness and consistency of the splice seams, an inspection of the occlusion of the outer contour lines, and an overall evaluation of the splicing quality, providing a clear basis for decision-making in subsequent cutting and quality control.

[0097] In some embodiments, the cutting process in step S10 specifically includes:

[0098] S10.1 Adjust the cutting blade of the cutting mechanism to the predetermined position according to the equal width cutting line marked by the laser line marker, ensuring that the cutting blade is completely aligned with the cutting line;

[0099] S10.2 Start the cutting mechanism and perform a smooth and continuous cutting operation on the board along the cutting line to ensure that the board remains stable during the cutting process and avoids deviation or vibration;

[0100] S10.3 After completing one cut, check the flatness and dimensional accuracy of the cut surface to ensure that the cut boards have a consistent width and no obvious deviation;

[0101] S10.4 Repeat steps S10.1 to S10.3 to cut the board multiple times until the required number of equal-width balsa wood boards are obtained.

[0102] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A method for splicing and cutting balsa wood to a fixed width, characterized in that, Includes the following steps: S1. Use a laser marker to mark the joints of the boards; S2. Adjust the position and angle of the splicing panels according to the laser-marked lines; S3. Join the boards together; S4. Use a laser marker again to mark the outer contour line of the spliced ​​qualified panels; S5. Place the assembled panels within the outer contour line; S6. Use an image acquisition device to photograph the spliced ​​panels and input the acquired images into an image processing and analysis system; S7. Use an image processing and analysis system to check and analyze the uniformity of the joints between the panels and the occlusion of the outer contour lines; S8. Take the qualified board material and place it on the clamp of the cutting mechanism. The clamp can slide along the X or Y axis to control the cutting direction of the board material. S9. Before cutting the board, use a laser marker to mark cutting lines of equal width on the board; S10. Cut the board multiple times along the cutting line to obtain balsa wood boards of equal width.

2. The method for splicing and cutting balsa wood to a fixed width according to claim 1, characterized in that: The specific steps for splicing the boards in step S3 include: S3.1 Prepare the balsa wood boards to be spliced ​​and confirm the quantity, size and splicing sequence of the boards; S3.2 Place the first board on the splicing workbench and ensure its position is stable; S3.3 Pick up the subsequent boards one by one, and align the splicing ends of the boards with the already placed boards according to the predetermined splicing order and laser marking lines; S3.4 Use clamps or clamping devices to temporarily fix the joints; S3.5 After all the panels are assembled, a comprehensive inspection of the entire assembled panel is carried out.

3. The method for splicing and cutting balsa wood to a fixed width according to claim 1, characterized in that: The specific steps for marking the outer contour line with the laser marker in step S4 include: S4.1 Restart the laser marker and adjust its output parameters; S4.2 Align the laser marker with one end of the spliced ​​board and move the laser marker along the outer edge of the board; S4.3 Maintain the appropriate distance and angle between the laser marker and the surface of the material; S4.4 After completing one round of marking, check the integrity and accuracy of the outer contour marking lines.

4. The method for splicing and cutting balsa wood to a fixed width according to claim 1, characterized in that: The image acquisition device in step S6 specifically includes: High-resolution cameras are used to capture clear images of the spliced ​​panels; Lens assembly, connected to the camera, used to adjust focus and field of view; Light source components are used to provide stable and uniform lighting conditions; An image acquisition card, connected to a camera, is used to convert images captured by the camera into digital signals.

5. The method for splicing and cutting balsa wood to a fixed width according to claim 1, characterized in that: The image processing and analysis system in steps S6 and S7 specifically includes: The image receiving module is used to receive digital image signals transmitted by the image acquisition device; Image processing module, including preprocessing functions; The feature extraction module uses edge detection technology to identify the location of seams and outer contours in the image; The uniformity analysis module evaluates the tightness and consistency of the stitching by calculating the degree of difference between pixels on both sides of the stitching seam. The obstruction inspection module detects whether there is any obstruction or missing parts by comparing the outer contour of the actual spliced ​​board with the outer contour of the qualified spliced ​​board. The quality control report generation module generates an evaluation report on the splicing quality based on the analysis results of uniformity and occlusion.

6. The method for splicing and cutting balsa wood to a fixed width according to claim 5, characterized in that: The image processing and analysis steps in step S7 specifically include: S7.1 Image Preprocessing: The image processing module is used to preprocess the received image; S7.2 Feature Extraction: The feature extraction module analyzes the preprocessed image using edge detection technology; S7.3 Uniformity Analysis: The uniformity analysis module calculates the degree of difference between pixels on both sides of the splicing seam based on the feature extraction results; S7.4 Obstruction Check: The obstruction check module compares the outer contour of the actual spliced ​​board with the outer contour of the qualified spliced ​​board to detect whether there is any obstruction or missing parts. S7.5 Quality Control Report Generation: The quality control report generation module generates an evaluation report on the splicing quality based on the analysis results of uniformity and occlusion.

7. The method for splicing and cutting balsa wood to a fixed width according to claim 1, characterized in that: The cutting process in step S10 specifically includes: S10.1 Adjust the cutting blade of the cutting mechanism to the predetermined position according to the equal-width cutting line marked by the laser line marker; S10.2 Start the cutting mechanism and perform a smooth and continuous cutting operation on the board along the cutting line; S10.3 After completing one cut, check the flatness and dimensional accuracy of the cut surface; S10.4 Repeat steps S10.1 to S10.3 to cut the board multiple times.