Display module and electronic equipment

Abstract

The invention provides a display module and electronic equipment, relates to the technical field of electronic equipment, and is used for solving the problem that an existing display module is not light and thin enough. The display module comprises a display panel and a circuit board. The display panel comprises a display area, a bending area and a binding area, the binding area is located on the backlight side of the display area, and the display area and the binding area are connected through the bending area. The driving chip is arranged on the surface, away from the display area, of the binding area, and the driving chip is electrically connected with the binding area. The circuit board is arranged between the binding area and the display area, the surface of one side of the circuit board is attached to the binding area, the surface of the other side of the circuit board is attached to the display area, and the circuit board is electrically connected with the binding area. Through the structure, the overall thickness of the display module can be reduced. And moreover, the circuit board can also play a role of a cushion block, so that the curvature of the bending area can be reduced, and the risk that the bending area is damaged due to an overlarge bending angle can be further reduced.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more particularly to a display module and an electronic device. Background Technology

[0002] With the development of electronic devices, there is an increasing pursuit of thinner, lighter, and smaller designs. Achieving this thinner and smaller design primarily relies on reducing the size of various components within the electronic device. For example, the thickness of the display module directly affects the overall thickness of the electronic device. Therefore, the thickness of existing display modules needs to be further reduced. Summary of the Invention

[0003] This application provides a display module and an electronic device to solve the problem that existing display modules are not thin and light enough.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of this application provide a display module, including a display panel and a circuit board. The display panel includes a display area, a bending area, and a bonding area. The bonding area is located on the backlight side of the display area, and the display area and the bonding area are connected through the bending area. A driver chip is disposed on the surface of the bonding area opposite to the display area, and the driver chip is electrically connected to the bonding area. The circuit board is disposed between the bonding area and the display area, with one surface of the circuit board attached to the bonding area and the other surface of the circuit board attached to the display area. The circuit board is electrically connected to the bonding area.

[0006] The display module provided in the first aspect of this application, by placing a circuit board between the display area and the bonding area of ​​the display panel, with both sides of the circuit board respectively attached to the display area and the bonding area, effectively utilizes the gap between the display area and the bonding area to accommodate the circuit board, thereby reducing the overall thickness of the display module. Furthermore, the attachment of both sides of the circuit board to the display area and the bonding area also acts as a spacer, reducing the curvature of the bending area, i.e., increasing the radius of curvature of the bending area, and thus reducing the risk of damage to the bending area due to excessive bending angles (e.g., breakage of ribbon cables in the bending area).

[0007] In conjunction with the first aspect, in one possible implementation, the circuit board includes a first portion and a second portion, the first portion being located in the gap between the bonding area and the display area, and the second portion extending out of the gap. In this way, the second portion of the circuit board extends out of the gap between the bonding area and the display area, facilitating electrical connection between the second portion of the circuit board and the motherboard of the electronic device.

[0008] In conjunction with the first aspect, in another possible implementation, the first portion of the circuit board covers the bonding area in the thickness direction of the display module. This arrangement ensures the flatness of the bonding area after it is bonded to the circuit board, as the first portion of the circuit board covers the bonding area of ​​the display panel.

[0009] In conjunction with the first aspect, in another possible implementation, the display area includes a first sub-region and a second sub-region. The first sub-region and the bonding area are connected by a bending area, and the vertical projection of the circuit board onto the display area is located within the first sub-region. Since the second sub-region of the display area is positioned relative to other components (such as batteries, motherboards, etc.) in the electronic device after the display module is installed, and the distance between these components and the display area is very small, by ensuring that the vertical projection of the circuit board onto the display area is entirely within the first sub-region—that is, the circuit board does not extend to one side of the second sub-region of the display area—it is possible to avoid the circuit board encroaching on the arrangement space of other components within the electronic device.

[0010] In conjunction with the first aspect, in another possible implementation, the vertical projection of the edge of the binding region away from the bending region onto the display area coincides with the boundary line between the first and second sub-regions. This maximizes the area of ​​the second sub-region of the display area, thereby increasing the space on one side of the second sub-region within the electronic device and facilitating the placement of other components.

[0011] In conjunction with the first aspect, in another possible implementation, the display module further includes conductive connectors. An opening is provided in the bonding area, and the conductive connector fills the opening. The circuit board is electrically connected to the bonding area through the conductive connector. Since display panels are generally multi-layered structures, consisting of multiple stacked functional layers, providing openings in the bonding area and filling them with conductive connectors facilitates the use of conductive connectors to achieve electrical connections between the circuit board and the corresponding functional layers of the display panel.

[0012] In conjunction with the first aspect, another possible implementation involves multiple openings spaced apart, and multiple conductive connectors corresponding one-to-one with each opening. This configuration allows, on the one hand, multiple conductive connectors to be connected to various pins of the circuit board, facilitating the transmission of different signals. On the other hand, multiple conductive connectors enhance the robustness and stability of the electrical connection between the circuit board and the bonding area of ​​the display panel.

[0013] In conjunction with the first aspect, another possible implementation involves using silver as the material for the conductive connector. Silver has strong electrical conductivity and generates very little heat when current flows through it, thus effectively reducing signal transmission loss and ensuring the stability and clarity of signal transmission.

[0014] In conjunction with the first aspect, in another possible implementation, the bonding area includes an insulating layer, a circuit layer, and a light-emitting layer stacked together. The insulating layer is located on the side of the bonding area facing the display area, the light-emitting layer is located on the side of the bonding area away from the display area, and the circuit layer is located between the insulating layer and the light-emitting layer. An opening is provided on the insulating layer and penetrates the insulating layer. One end of the conductive connector is electrically connected to the circuit layer, and the other end of the conductive connector is electrically connected to the circuit board.

[0015] In conjunction with the first aspect, in another possible implementation, the thickness of the circuit board is h in the thickness direction of the display module, where 0.1mm ≤ h ≤ 0.12mm.

[0016] In conjunction with the first aspect, in another possible implementation, the circuit board is a flexible circuit board.

[0017] In conjunction with the first aspect, another possible implementation includes a backplate located between the display area and the circuit board, with both the display area and the circuit board bonded to the side surfaces of the backplate. This ensures the flatness of the display area by bonding it to the backplate, preventing distortion or deformation of the displayed image. The backplate can be made of a high-strength metal, such as titanium alloy, stainless steel, or aluminum alloy, serving as the structural core of the entire display module and providing stable support for its other components.

[0018] In conjunction with the first aspect, another possible implementation includes a light-transmitting cover plate attached to the side of the display area opposite to the bonding area. When the display module is installed on the electronic device, the light-transmitting cover plate is on the outermost side of the display module, providing some protection to the display panel and preventing it from being directly scratched or impacted by external objects.

[0019] In conjunction with the first aspect, another possible implementation includes a polarizer attached to the side of the display area opposite to the bonding area. The polarizer enhances the contrast and color performance of the display module and can reduce the reflection and glare of external light to some extent, thereby improving the visibility of the display module.

[0020] Secondly, this application provides an electronic device including a housing assembly, a motherboard, and the display module described in the first aspect. The motherboard is disposed within the housing assembly, the display module is mounted on the housing assembly, and the circuit board of the display module is electrically connected to the motherboard.

[0021] Understandably, the beneficial effects that the electronic device described in the second aspect and any of its possible implementations can achieve can be referenced to the beneficial effects in the first aspect and any of its possible implementations, and will not be repeated here. Attached Figure Description

[0022] Figure 1 A structural diagram of an electronic device provided in an embodiment of this application;

[0023] Figure 2 for Figure 1 A front view of the electronic devices in their unfolded state;

[0024] Figure 3 for Figure 1 A front view of the electronic devices in a folded state;

[0025] Figure 4 for Figure 1 A cross-sectional schematic diagram of the display module at point AA;

[0026] Figure 5 for Figure 4 A schematic diagram showing the relative positions of the display module and the battery.

[0027] Figure 6 This is a cross-sectional schematic diagram of a display module provided in an embodiment of this application;

[0028] Figure 7 This is a cross-sectional schematic diagram of another display module provided in an embodiment of this application;

[0029] Figure 8 for Figure 7 A 3D structural diagram of the display module in the binding area;

[0030] Figure 9 for Figure 8 A magnified view of a section at point B in the middle;

[0031] Figure 10 This is a cross-sectional schematic diagram of another display module provided in an embodiment of this application;

[0032] Figure 11 for Figure 10 A bottom view showing the distribution of the first and second sub-regions of the central display panel;

[0033] Figure 12 A bottom view showing the distribution of a first sub-region and a second sub-region of a display panel, provided in an embodiment of this application;

[0034] Figure 13 This is a cross-sectional schematic diagram of a display panel provided in an embodiment of this application;

[0035] Figure 14 For having Figure 13 A cross-sectional schematic diagram of the display module in the central display panel;

[0036] Figure 15 for Figure 14 A magnified view of a section at point C;

[0037] Figure 16 A top view of the binding area of ​​a display module provided in an embodiment of this application;

[0038] Figure 17 This is a cross-sectional schematic diagram of another display module provided in an embodiment of this application;

[0039] Figure 18 for Figure 17 Schematic diagram of the manufacturing process of the display module Figure 1 ;

[0040] Figure 19 for Figure 17 Schematic diagram of the manufacturing process of the display module Figure 2 ;

[0041] Figure 20 for Figure 17 Schematic diagram of the manufacturing process of the display module Figure 3 ;

[0042] Figure 21 for Figure 17 Schematic diagram of the manufacturing process of the display module Figure 4 .

[0043] Figure label:

[0044] 01. Electronic device; 10. Display module; 10a. First area; 10b. Second area; 10c. Third area; 11. Light-transmitting cover; 12. Display panel; 121. Display area; 12a. Light-emitting layer; 12b. Circuit layer; 12c. Insulating layer; 1211. First sub-area; 1212. Second sub-area; 122. Bending area; 123. Bonding area; 13. Backplate; 14. Driver chip; 15. Circuit board; 151. First part; 152. Second part; 16. Pad; 17. Conductive connector; 18. Polarizing film; 20. Housing assembly; 21. Hinge mechanism; 22. Middle frame; 22a. First middle frame; 22b. Second middle frame; 210. First bonding surface; 220. Second bonding surface; 230. Third bonding surface; 30. Battery; 40. Main board; 100. Gap; 200. Opening. Detailed Implementation

[0045] To make the purpose, technical solution, and advantages of this application clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0046] In the description of this application, it should be clarified that the terms "vertical," "lateral," "longitudinal," "front," "rear," "left," "right," "up," "down," and "horizontal," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are merely for the convenience of describing this application, and do not mean that the device or element referred to must have a specific orientation or position, and therefore should not be construed as a limitation of this application. Similarly, the term "quantity" should not be construed as a limitation of this application.

[0047] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0048] This application provides an electronic device 01. Specifically, the electronic device 01 can be a portable electronic device or other types of electronic devices. For example, the electronic device can be a mobile phone, a tablet computer, a personal digital assistant (PDA), a wearable device, etc. The display screen of the electronic device can be a foldable screen or a flat screen. For ease of explanation, the following description uses a foldable screen mobile phone as an example. The foldable screen mobile phone can be a mobile phone with an outward folding display screen or a mobile phone with an inward folding display screen. In the following description, the electronic device 01 is used as an example of a mobile phone with an inward folding display screen.

[0049] Specifically, please see Figure 1 As shown, Figure 1 This is a structural diagram of an electronic device 01 provided in an embodiment of this application. The electronic device 01 may include a housing assembly 20, a battery 30, a motherboard 40, and a foldable display module 10. The display module 10 is supported and attached to the housing assembly 20. The housing assembly 20 can drive the display module 10 to rotate between an unfolded state and a folded state. The battery 30 and the motherboard 40 are both located in the housing assembly 20, and the battery 30 and the display module 10 are electrically connected to the motherboard 40.

[0050] Understandable, Figure 1 The diagram only schematically shows some of the components included in the foldable screen terminal 01. The actual shape, size, position, and structure of the components are not limited by the structure shown in the diagram.

[0051] For the sake of clarity in the following embodiments, an XYZ coordinate system is established. When the electronic device 01 is in its unfolded state, the width direction of the electronic device 01 is defined as the X-axis direction, the length direction of the electronic device 01 as the Y-axis direction, and the thickness direction of the electronic device 01 as the Z-axis direction. It should be noted that the coordinate system of the electronic device 01 can be flexibly set according to actual needs. This application only provides an example and should not be considered as a special limitation of this application.

[0052] The aforementioned housing assembly 20 is used to protect the internal components of the electronic device 01. The housing assembly 20 may include a hinge mechanism 21 and a middle frame 22. Two middle frames 22 are provided, namely a first middle frame 22a and a second middle frame 22b. The hinge mechanism 21 connects the first middle frame 22a and the second middle frame 22b, enabling relative rotation between the first middle frame 22a and the second middle frame 22b, thereby allowing the electronic device 01 to rotate and switch between an unfolded state and a folded state.

[0053] The aforementioned display module 10 is used to display images, videos, etc. The display module 10 can be divided into a first region 10a, a second region 10b, and a third region 10c, with the third region 10c positioned between the first region 10a and the second region 10b. The third region 10c can be bent and deformed. When the electronic device 01 is in a folded state, the third region 10c of the display module 10 is bent, and the first region 10a and the second region 10b are positioned opposite each other. When the electronic device 01 is in an unfolded state, the third region 10c of the display module 10 is flattened, at which point the first region 10a, the second region 10b, and the third region 10c are on the same plane.

[0054] Please see below. Figure 2 As shown, Figure 2 for Figure 1 The image shows a front view (along the positive Y-axis) of the electronic device 01 in its unfolded state. The first frame 22a has a first mating surface 210, on which the first region 10a of the display module 10 is supported and mated. The second frame 22b has a second mating surface 220, on which the second region 10b of the display module 10 is supported and mated. The hinge mechanism 21 has a third mating surface 230, on which the third region 10c of the display module 10 is supported and mated. The first frame 22a and the second frame 22b are rotatably connected via the hinge mechanism 21, allowing the electronic device 01 to rotate between the unfolded and folded states.

[0055] With the aforementioned electronic device 01 in the deployed state, please continue to refer to Figure 1 and Figure 2 As shown, Figure 1 and Figure 2 All electronic devices 01 are in an unfolded state. The first bonding surface 210, the second bonding surface 220, and the third bonding surface 230 are on the same plane, so that the display module 10 can be fully unfolded. That is, the first region 10a, the second region 10b, and the third region 10c of the display module 10 are on the same plane, and the flatness of the display module 10 can be guaranteed. In this state, a large-screen display of electronic devices 01 can be achieved, which can bring a better user experience.

[0056] When the aforementioned electronic device 01 is in a folded state, please refer to Figure 3 As shown, Figure 3 for Figure 1 The electronic device 01 is shown in a folded state (positive Y-axis view). The first region 10a and the second region 10b of the display module 10 are opposite each other, and the third region 10c is bent. The housing assembly 20 protects the display module 10, meaning the display module 10 is located between the first frame 22a and the second frame 22b of the housing assembly 20. In this state, the display module 10 is not visible to the user, preventing scratches or damage and thus providing effective protection. For example, when the phone is not in use, the electronic device 01 can be folded to avoid damage to the display module 10.

[0057] Please return to the previous page. Figure 1 As shown, the motherboard 40 is used to set up the electronic devices of the electronic device 01 and realize the electrical connection between the electronic devices. For example, the electronic devices may be control chips (e.g., system-on-chip, SOC), graphics processing unit (GPU), universal flash storage (UFS), earpiece, flash module, and the aforementioned display module 10, etc.

[0058] The motherboard 40 and battery 30 can be housed together in the first middle frame 22a, or together in the second middle frame 22b, or the motherboard 40 and battery 30 can be housed separately in the first middle frame 22a and the second middle frame 22b. This application does not impose any special limitations on this. The following description assumes that both the motherboard 40 and battery 30 are housed in the second middle frame 22b.

[0059] Based on the above, please refer to Figure 4 As shown, Figure 4 for Figure 1 The diagram shows a cross-section (parallel to the XZ plane) at point AA of the display module 10. The display module 10 may include a light-transmitting cover plate 11, a display panel 12, a back plate 13, a driver chip 14, a pad 16, and a circuit board 15. The display panel 12 can be divided into a display area 121, a bending area 122, and a bonding area 123. The bonding area 123 is located on the backlight side of the display area 121, and the display area 121 and the bonding area 123 are connected through the bending area 122. The driver chip 14 is disposed on the surface of the bonding area 123 facing away from the display area 121 and is electrically connected to the bonding area 123. The bending area 122 and the bonding area 123 of the display panel 12 are located within the second region 10b of the display module 10.

[0060] The light-transmitting cover 11 is attached to the side of the display area 121 away from the binding area 123. When the display module 10 is installed on the electronic device 01, the light-transmitting cover is located on the outermost side of the display module 10, which can play a certain protective role for the display panel 12 and prevent the display panel 12 from being directly scratched or impacted by external objects.

[0061] The back plate 13 is located between the display area 121 and the bonding area 123, and the back plate 13 is attached to the surface of the display area 121 away from the light-transmitting cover plate 11. The back plate 13 can be made of high-strength titanium alloy, stainless steel, aluminum alloy, etc., to serve as the main structural body of the entire display module 10 and provide stable support for other components of the display module 10.

[0062] A pad 16 is disposed between the bonding area 123 and the back plate 13. One side of the pad 16 is in contact with the back plate 13, and the other side of the pad 16 is in contact with the bonding area 123. By using the pad 16, the distance between the display area 121 and the component arrangement area is increased, which is equivalent to reducing the curvature of the bending area 122 and increasing the radius of curvature of the bending area 122, thereby preventing the bending area 122 from being damaged due to excessive bending angle.

[0063] The circuit board 15 is used to realize the electrical connection between the display module 10 and the motherboard 40 of the electronic device 01. Figure 4 In the middle, the circuit board 15 is attached to the surface of the bonding area 123 away from the display area 121, and after being electrically connected to the bonding area 123, it moves away from the bending area 122 (i.e., Figure 4 The X-axis (negative direction) extends to the backlight side of the display area 121.

[0064] It is understood that the light-transmitting cover 11 and the display panel 12, the back plate 13 and the display panel 12, and the pad 16 and the back plate 13 and the display panel 12 can be bonded and fixed with optical adhesive (OCA).

[0065] The aforementioned display panel 12 can be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display panel 12, a mini light-emitting diode (MLED) display, a micro light-emitting diode (LED) display panel 12, a micro organic light-emitting diode (MOLED) display panel 12, a quantum dot light-emitting diode (QLED) display panel 12, a liquid crystal display (LCD) panel 12, etc.

[0066] The aforementioned light-transmitting cover 11 can be a common cover. After the display module 10 is installed on the electronic device 01, the light-transmitting cover 11 is located on the outermost side of the display module 10, providing a certain degree of protection for the display panel 12 and preventing it from being directly scratched or impacted by external objects. Alternatively, the light-transmitting cover 11 can also be a cover with touch functionality, enabling the electronic device 01 to have touch control, thus making it more convenient for users. Therefore, this application does not impose any special limitations on the specific material of the light-transmitting cover 11.

[0067] The aforementioned circuit board 15 can be a rigid circuit board 15 or a flexible circuit board 15 (FPC), as long as it can realize the electrical connection between the display module 10 and the motherboard 40 of the electronic device 01. This application does not make any special limitations in this regard. For ease of understanding, the following examples all use a flexible circuit board 15 as an example.

[0068] Please see Figure 5 As shown, Figure 5 for Figure 4 A schematic diagram showing the relative positions of the display module 10 and the battery 30. When the above... Figure 4When the display module 10 is installed on the electronic device 01, Figure 5 In the indicated orientation, the second middle frame 22b ( Figure 5 The space located below the display area 121 (not shown) is mainly used to accommodate other components of the electronic device 01 (such as the battery 30). Since the circuit board 15 is electrically connected to the bonding area 123 of the display panel 12, it extends away from the bending area 122 (i.e.,...). Figure 5 The circuit board 15 extends to the backlight side of the display area 121 in the negative X-axis direction. At this time, the part of the circuit board 15 that extends to the display area 121 will occupy part of the space originally used to accommodate other components, thereby causing the thickness of the electronic device 01 to increase.

[0069] For the reasons mentioned above, please refer to Figure 6 As shown, Figure 6 This is a cross-sectional (parallel to the XZ plane) schematic diagram of a display module 10 provided in an embodiment of this application. The circuit board 15 is bonded and electrically connected to the bonding area 123 of the display panel 12, and then extends from the side of the driver chip 14 away from the bonding area 123 towards the bending area 122 (i.e.... Figure 6 Extending along the positive X-axis, this arrangement prevents the circuit board 15 from encroaching on the space for other components.

[0070] However, the above structure is equivalent to stacking a portion of the circuit board 15 with the driver chip 14, which increases the overall thickness of the display module 10 at the location where the driver chip 14 is placed, which is also detrimental to the thinning and lightening of the electronic device 01. At this time, the overall thickness of the display module 10 is equal to the sum of the thickness of the light-transmitting cover 11, the thickness of the display area 121 of the display panel 12, the thickness of the back plate 13, the thickness of the pad 16, the thickness of the bonding area 123 of the display panel 12, the thickness of the driver chip 14, and the thickness of the circuit board 15.

[0071] To address the aforementioned issues, this application provides another display module 10, please refer to [link to relevant documentation]. Figure 7 , Figure 8 and Figure 9 As shown, Figure 7 This is a cross-sectional schematic diagram (parallel to the XZ plane) of another display module 10 provided in an embodiment of this application. Figure 8 for Figure 7 A three-dimensional structural diagram of the display module 10 at the binding area 123. Figure 9 for Figure 8A partial enlarged view at point B. The display module 10 may include the aforementioned light-transmitting cover plate 11, display panel 12, back plate 13, driver chip 14, and circuit board 15. The display area 121 and bonding area 123 of the display panel 12 are arranged opposite each other and are located on both sides of the back plate 13, and are connected by a bending area 122. The driver chip 14 is disposed on the surface of the bonding area 123 opposite to the display area 121 and is electrically connected to the bonding area 123. The light-transmitting cover plate 11 is attached to the side of the display area 121 opposite to the bonding area 123. The back plate 13 is located between the display area 121 and the bonding area 123, and the back plate 13 is attached to the surface of the display area 121 opposite to the light-transmitting cover plate 11.

[0072] The circuit board 15 is disposed between the back plate 13 and the bonding area 123 of the display panel 12. One side surface of the circuit board 15 is attached to the back plate 13, and the other side surface of the circuit board 15 is attached to the bonding area 123. The circuit board 15 is electrically connected to the bonding area 123.

[0073] In this way, by placing the circuit board 15 between the back plate 13 and the bonding area 123 of the display panel 12, and with both sides of the circuit board 15 respectively attached to the back plate 13 and the bonding area 123, the gap 100 between the back plate 13 and the bonding area 123 of the display panel 12 is used to accommodate the circuit board 15. This reduces the overall thickness of the display module 10, and the circuit board 15 does not adversely affect the placement space of other components (such as the battery 30) below the display area 121. Simultaneously, the circuit board 15 can also serve the aforementioned purpose... Figure 6 The function of the middle pad 16 is to reduce the curvature of the bending area 122, that is, to increase the radius of curvature of the bending area 122 of the display panel 12, thereby reducing the risk of damage to the bending area 122 due to excessive bending angle (such as the breakage of the ribbon cable in the bending area 122).

[0074] It is understood that the circuit board 15 can also be fixed to the back plate 13 and the bonding area 123 of the display panel 12 by optical adhesive, and this application does not make any special limitation on this.

[0075] As for the thickness h of the circuit board 15 in the Z-axis direction, those skilled in the art can select it according to actual needs. For example, 0.1mm≤h≤0.12mm can avoid excessive bending angle in the bending area 122.

[0076] In some embodiments, see Figure 8 and Figure 9 As shown, Figure 8 for Figure 7 A three-dimensional structural diagram of the display module 10 at the binding area 123. Figure 9 for Figure 8 A partial enlarged view at point B. The circuit board 15 may include a first portion 151 and a second portion 152. The first portion 151 is located in the gap 100 between the back plate 13 and the bonding area 123 of the display panel 12, and the second portion 152 extends out of the gap 100. This extension of the second portion 152 of the circuit board 15 into the gap 100 between the bonding area 123 and the back plate 13 facilitates electrical connection between the second portion 152 of the circuit board 15 and the motherboard 40 of the electronic device 01 during subsequent assembly.

[0077] The first part 151 and the second part 152 of the circuit board 15 can be a regular shape such as a rectangle or trapezoid, or other irregular shapes. This application does not impose any special limitations on this.

[0078] For example, please continue to see Figure 9 As shown, circuit board 15 is a flexible circuit board. In a cross-section parallel to the XY plane, the first part 151 of circuit board 15 is rectangular, and the second part 152 is L-shaped. The first part 151 and the second part 152 are distributed along the Y-axis. The gold fingers of the flexible circuit board are located at the end of the first part 151 away from the second part 152. The gold fingers are electrically connected to the bonding area 123. The end of the second part 152 away from the first part 151 is provided with a male connector for a board-to-board connector (BTB). The male connector of the board-to-board connector is connected to the gold fingers through a ribbon cable inside the flexible circuit board. The main board 40 of electronic device 01 ( Figure 9 The male connector (not shown) is equipped with a female connector for a board-to-board connector. During assembly, the electrical connection between the display module 10 and the motherboard 40 can be achieved by mating the male and female connectors.

[0079] The above examples only provide some possible distributions of the first part 151 and the second part 152 of the circuit board 15 and do not constitute a specific limitation on this application. Those skilled in the art can make adjustments according to actual needs.

[0080] Further, please see Figure 10 As shown, Figure 10This is a cross-sectional (parallel to the XZ plane) schematic diagram of another display module 10 provided in this application embodiment. In the thickness direction (parallel to the Z-axis) of the display module 10, the first portion 151 of the circuit board 15 covers the bonding area 123 of the display panel 12. For example, in a cross-section parallel to the XY plane, both the bonding area 123 and the first portion 151 are rectangular in shape, and the length of the bonding area 123 in the Y-axis direction is equal to the length of the first portion 151 in the Y-axis direction, and the width of the bonding area 123 in the X-axis direction is equal to the width of the first portion 151 in the X-axis direction. This arrangement ensures the flatness of the bonding area 123 after it is bonded to the first portion 151 of the circuit board 15.

[0081] Based on the above, please continue to refer to Figure 10 and combined Figure 11 As shown, Figure 11 for Figure 10 A bottom view (along the positive Z-axis) showing the distribution of the first sub-region 1211 and the second sub-region 1212 of the display panel 12. The display area 121 of the display panel 12 can be divided into the first sub-region 1211 and the second sub-region 1212, which are distributed along the X-axis. The first sub-region 1211 and the bonding area 123 are connected by a bending area 122. The vertical projection of the circuit board 15 onto the display area 121 is located within the first sub-region 1211.

[0082] Since the display module 10 is installed on the electronic device 01, the second sub-region 1212 of the display area 121 is connected to other components in the electronic device 01 (such as the battery 30, Figure 11 (Not shown in the image) are arranged relative to each other, and the spacing between these components and the display area 121 is very small or even close to the display area 121. Therefore, by making the vertical projection of the circuit board 15 on the display area 121 of the display panel 12 completely located within the first sub-region 1211, that is, the second part 152 of the circuit board 15 does not extend below the second sub-region 1212 of the display area 121, it is possible to avoid the second part 152 of the circuit board 15 from crowding out the arrangement space of other components below the second sub-region 1212 in the electronic device 01.

[0083] Further, please see Figure 12 As shown, Figure 12 A bottom view (along the positive Z-axis) showing the distribution of a first sub-region 1211 and a second sub-region 1212 of a display panel 12 provided in an embodiment of this application. The vertical projection of the edge of the binding region 123 away from the bending region 122 onto the display region 121 is shown, along with the boundary line between the first sub-region 1211 and the second sub-region 1212. Figure 12The dotted lines in the text overlap. This allows the area of ​​the second sub-region 1212 of the display area 121 to be maximized, which helps to increase the space below the second sub-region 1212 within the electronic device 01, facilitating the arrangement of other components.

[0084] In some embodiments, see Figure 13 As shown, Figure 13 This is a cross-sectional schematic diagram (parallel to the XZ plane) of a display panel 12 provided in an embodiment of this application. The display panel 12 may be composed of a light-emitting layer 12a, a circuit layer 12b, and an insulating layer 12c stacked together, with the circuit layer 12b located between the insulating layer 12c and the light-emitting layer 12a.

[0085] Because the bending area 122 is bent, the display area 121 of the display panel 12 will be positioned opposite to the bonding area 123. At this time, in the Z-axis direction, the stacking order of the light-emitting layer 12a, the circuit layer 12b, and the insulating layer 12c in the bonding area 123 will be reversed compared to the stacking order in the display area 121. That is to say, in Figure 13 In the orientation shown, the display area 121 consists of a light-emitting layer 12a, a circuit layer 12b, and an insulating layer 12c from top to bottom, while the bonding area 123 consists of an insulating layer 12c, a circuit layer 12b, and a light-emitting layer 12a from top to bottom. That is, the side of the bonding area 123 facing the display area 121 is the insulating layer 12c, and the side of the bonding area 123 away from the display area 121 is the light-emitting layer 12a.

[0086] Please see Figure 14 and Figure 15 As shown, Figure 14 For having Figure 13 A cross-sectional view (parallel to the XZ plane) of the display module 10 of the central display panel 12. Figure 15 for Figure 14 A magnified view of section C. Since the circuit board 15 is disposed between the bonding area 123 and the back plate 13, in order to achieve electrical connection between the circuit board 15 and the circuit layer 12b of the bonding area 123, an opening 200 is provided on the insulating layer 12c of the bonding area 123, and the opening 200 penetrates the insulating layer 12c. The opening 200 is filled with a conductive connector 17. One end of the conductive connector 17 is electrically connected to the circuit layer 12b of the bonding area 123, and the other end of the conductive connector 17 is electrically connected to the circuit board 15.

[0087] It is understandable that the conductive connector 17 can be made of a metal with good conductivity, such as silver or copper, which can effectively reduce signal loss during transmission in the conductive connector 17 and ensure the stability and clarity of signal transmission.

[0088] The material of the insulating layer 12c can be organic polymer materials such as PI (Polyimide), EMC (Epoxy Molding Compound), and PTFE (Polytetrafluoroethylene).

[0089] Further, please see Figure 16 As shown, Figure 16 This is a top view (along the negative Z-axis) of a bonding area 123 of a display module 10 provided in an embodiment of this application. Multiple openings 200 are provided on the insulating layer 12c of the bonding area 123, spaced apart. Simultaneously, multiple conductive connectors 17 are also provided, each corresponding to one of the openings 200. This arrangement allows the multiple conductive connectors 17 to be connected to different pins of the circuit board 15, facilitating the transmission of different signals. Furthermore, the multiple conductive connectors 17 enhance the robustness and stability of the electrical connection between the circuit board 15 and the bonding area 123 of the display panel 12.

[0090] In some embodiments, see Figure 17 As shown, Figure 17 This is a cross-sectional (parallel to the XZ plane) schematic diagram of another display module 10 provided in an embodiment of this application. The display module 10 may further include a polarizer 18. The polarizer 18 is disposed between the display area 121 of the display panel 12 and the light-transmitting cover plate 11. The polarizer 18 is used to enhance the contrast and color performance of the display area 121, and can reduce the reflection and glare of external light to a certain extent, thereby improving the visibility of the display module 10.

[0091] It is understandable that the polarizer 18 can also be fixed to the display panel 12 and the light-transmitting cover 11 by optical adhesive.

[0092] The following is about the above. Figure 17 Manufacturing process description of display module 10:

[0093] First step, such as Figure 18 As shown, Figure 18 for Figure 17 Schematic diagram of the manufacturing process of the display module 10 Figure 1At this time, the bending area 122 of the display panel 12 is in a flattened state, and the display area 121, the bending area 122, and the bonding area 123 are on the same plane. The polarizer 18 is attached to the light-emitting side of the display area 121 of the display panel 12, the light-transmitting cover 11 is attached to the surface of the polarizer 18 away from the display panel 12, the back plate 13 is attached to the backlight side of the display area 121, and the driver chip 14 is electrically connected to the circuit layer 12b of the bonding area 123.

[0094] The second step, as Figure 19 As shown, Figure 19 for Figure 17 Schematic diagram of the manufacturing process of the display module 10 Figure 2 An opening 200 is formed in the insulating layer 12c of the bonding area 123 of the display panel 12, and the opening 200 penetrates the insulating layer 12c.

[0095] The third step, as Figure 20 As shown, Figure 20 for Figure 17 Schematic diagram of the manufacturing process of the display module 10 Figure 3 Conductive silver paste is printed and filled into the opening 200 using screen printing to form the conductive connector 17;

[0096] Step four, as Figure 21 As shown, Figure 21 for Figure 17 Schematic diagram of the manufacturing process of the display module 10 Figure 4 The pins of the first portion 151 of the circuit board 15 (flexible circuit board 15) are soldered together with the conductive connector 17, and one side surface of the first portion 151 of the circuit board 15 is bonded to the bonding area 123.

[0097] Step 5, please return to the previous page. Figure 17 As shown, the bending area 122 of the display panel 12 is bent so that the bonding area 123 is located on the backlight side of the display area 121. Then, the other side surface of the first part 151 of the circuit board 15 is attached and bonded to the back plate 13, and the display module 10 is completed.

[0098] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0099] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized by include: The display panel includes a display area, a bending area, and a bonding area. The bonding area is located on the backlight side of the display area, and the display area and the bonding area are connected through the bending area. A circuit board is disposed between the bonding area and the display area, with one side surface of the circuit board attached to the bonding area and the other side surface of the circuit board attached to the display area, and the circuit board is electrically connected to the bonding area.

2. The display module according to claim 1, characterized in that, The circuit board includes a first part and a second part, the first part being located in the gap between the bonding area and the display area, and the second part extending out of the gap.

3. The display module according to claim 2, characterized in that, In the thickness direction of the display module, the first portion of the circuit board covers the bonding area.

4. The display module according to claim 2 or 3, characterized in that, The display area includes a first sub-area and a second sub-area. The first sub-area and the bonding area are connected through the bending area. The vertical projection of the circuit board on the display area is located within the first sub-area.

5. The display module according to claim 4, characterized in that, The vertical projection of the edge of the binding area away from the bending area onto the display area coincides with the boundary line between the first sub-area and the second sub-area.

6. The display module according to any one of claims 1 to 5, characterized in that, The display module further includes a conductive connector. An opening is provided on the bonding area, and the conductive connector is filled in the opening. The circuit board is electrically connected to the bonding area through the conductive connector.

7. The display module according to claim 6, characterized in that, The openings are provided in multiple ways, and the multiple openings are spaced apart. The conductive connectors are provided in multiple ways, and the multiple conductive connectors correspond one-to-one with the multiple openings.

8. The display module according to claim 6 or 7, characterized in that, The conductive connector is made of silver.

9. The display module according to any one of claims 6 to 8, characterized in that, The bonding area includes an insulating layer, a circuit layer, and a light-emitting layer stacked together. The insulating layer is located on the side of the bonding area facing the display area, the light-emitting layer is located on the side of the bonding area away from the display area, and the circuit layer is located between the insulating layer and the light-emitting layer. The opening is disposed on the insulating layer and penetrates the insulating layer. One end of the conductive connector is electrically connected to the circuit layer, and the other end of the conductive connector is electrically connected to the circuit board.

10. The display module according to any one of claims 1 to 9, characterized in that, In the thickness direction of the display module, the thickness of the circuit board is h, where 0.1mm ≤ h ≤ 0.12mm.

11. The display module according to any one of claims 1 to 10, characterized in that, The circuit board is a flexible circuit board.

12. The display module according to any one of claims 1 to 11, characterized in that, The display module also includes a back plate, which is located between the display area and the circuit board, and the display area and the circuit board are respectively attached to the two side surfaces of the back plate.

13. The display module according to any one of claims 1 to 12, characterized in that, The display module also includes a light-transmitting cover plate, which is attached to the side of the display area opposite to the binding area.

14. The display module according to any one of claims 1 to 13, characterized in that, The display module also includes a polarizer, which is attached to the side of the display area opposite to the bonding area.

15. An electronic device, characterized in that, include: Housing assembly; The motherboard is housed within the housing assembly; The display module is the display module according to any one of claims 1 to 14, the display module is mounted on the housing assembly, and the circuit board is electrically connected to the motherboard.

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