Connector module

Abstract

The invention discloses a connector module, and relates to the technical field of electronic accessories, and the connector module comprises a module substrate, a connector assembly, a plastic package body and a signal shielding layer. The connector assembly is mounted on the module substrate; the plastic package body wraps at least part of the structure of the connector assembly; and the signal shielding layer covers the outer surface of the plastic package body, is arranged around the connector assembly and is used for shielding an electromagnetic signal of the connector assembly. According to the technical scheme provided by the invention, the risk of electromagnetic energy leakage in the operation process of the board-to-board connector is avoided, and the application reliability of the connector module is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic accessories, in particular to a connector module. BACKGROUND

[0002] With the increasing requirements of the market on the functionality, performance and appearance of consumer electronic devices (such as smart phones, smart wearable devices, etc.), such products continue to evolve towards miniaturization, thinness and multi-functional integration. To meet this trend, the internal structure design of the products tends to be compact, and the layout density of each component is continuously improved to achieve higher space utilization efficiency.

[0003] Under this background, as a key component for realizing electrical connection and signal transmission between circuit boards, the performance of the board-to-board connector directly affects the reliability and integration of the whole machine. However, in the prior art, with the continuous reduction of the size of the connector and the gradual increase of the signal transmission frequency, there are certain limitations in the structural design of the board-to-board connector, especially in high-frequency application environment, which is prone to electromagnetic energy leakage. This problem not only may cause a decline in signal integrity, affecting the performance of the device, but also may cause electromagnetic interference, thereby adversely affecting the electromagnetic compatibility of the surrounding electronic components and the whole system. SUMMARY

[0004] The main purpose of the present application is to provide a connector module, which aims to avoid the risk of electromagnetic energy leakage of the board-to-board connector during operation and improve the application reliability of the connector module.

[0005] To achieve the above-mentioned purpose, the present application provides a connector module, which comprises: a module substrate; a connector component installed on the module substrate; a plastic package body wrapping at least part of the structure of the connector component; and a signal shielding layer covering the outer surface of the plastic package body and surrounding the connector component for shielding the electromagnetic signals of the connector component.

[0006] In an embodiment, the connector component comprises a board-to-board connector, a peripheral element and an adapter plate installed on the module substrate, the board-to-board connector is electrically connected with the peripheral element, and the adapter plate is electrically connected with the board-to-board connector.

[0007] In an embodiment, the board-to-board connector is located on the front surface of the module substrate, and the peripheral element and the adapter plate are located on the bottom surface of the module substrate.

[0008] In one embodiment, the molding compound includes a bottom molding compound and a top molding compound. The bottom molding compound is formed on the bottom surface of the module substrate and encapsulates the peripheral components and the adapter plate. The top molding compound is formed on the top surface of the module substrate and encapsulates the connection between the board-to-board connector and the module substrate.

[0009] In one embodiment, the signal shielding layer covers the top surface and side surface of the top molding compound and the side surface of the bottom molding compound; a grounding metal layer is provided on the side surface of the module substrate, and the signal shielding layer is electrically connected to the grounding metal layer.

[0010] In one embodiment, the signal shielding layer includes an outer metal layer and an inner metal layer stacked sequentially. The inner metal layer is electrically connected to the grounding metal layer and is connected to the top surface and side surface of the top molding compound and the side surface of the bottom molding compound.

[0011] In one embodiment, the signal shielding layer further includes a plurality of intermediate metal layers stacked together, wherein the plurality of intermediate metal layers are disposed between the outer metal layer and the inner metal layer.

[0012] In one embodiment, the thickness of the outer metal layer is greater than the thickness of the inner metal layer.

[0013] In one embodiment, the outer metal layer is a corrosion-resistant metal layer.

[0014] In one embodiment, the signal shielding layer is formed on the outer surface of the encapsulation by a vacuum sputtering process.

[0015] The technical solution of this invention provides physical protection for internal components and forms a regular package by mounting the connector assembly onto the module substrate and then encapsulating at least part of its structure with a plastic encapsulation. Furthermore, it innovatively covers the outer surface of the plastic encapsulation with a signal shielding layer surrounding the connector assembly. This design confines the electromagnetic waves generated by the connector assembly during operation within the shielding layer, effectively blocking the outward radiation and leakage of electromagnetic energy. This fundamentally reduces the risk of electromagnetic interference between board-to-board connectors, ensures the stability of signal transmission, and ultimately significantly improves the reliability of the connector module in complex electromagnetic environments. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of one side surface of the connector module provided by the present invention; Figure 2 This is a schematic diagram of the structure of the other side surface of the connector module provided by the present invention before injection molding; Figure 3 This is a schematic diagram of the structure of the other side surface of the connector module provided by the present invention after injection molding; Figure 4 A longitudinal sectional view of the connector module provided by the present invention from one perspective; Figure 5 A longitudinal sectional view of the connector module provided by the present invention from another perspective.

[0018] Explanation of icon numbers: 10. Module substrate; 20. Connector assembly; 21. Board-to-board connector; 22. Peripheral components; 23. Adapter board; 30. Molded enclosure; 31. Bottom molded enclosure; 32. Top molded enclosure; 40. Signal shielding layer.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0023] In current technologies, consumer electronic devices continue to evolve towards miniaturization and multifunctional integration, significantly increasing the density of internal component layouts. Board-to-board connectors, as core components for signal transmission between circuit boards, are increasingly exhibiting electromagnetic energy leakage issues in applications requiring smaller sizes and higher frequencies. Electromagnetic interference generated during high-frequency signal transmission not only affects signal integrity but may also reduce the electromagnetic compatibility of the entire system; these problems are particularly prominent in compact products such as smart wearable devices.

[0024] To resolve the above issues, please refer to Figure 1 and Figure 4 This application proposes a connector module, which includes a module substrate 10, a connector assembly 20, a molding compound 30, and a signal shielding layer 40. The connector assembly 20 is mounted on the module substrate 10, the molding compound 30 encapsulates part of the structure of the connector assembly 20, and the signal shielding layer 40 covers the outer surface of the molding compound 30 and surrounds the connector assembly 20.

[0025] In this embodiment, the module substrate 10 refers to a rigid or flexible circuit board that supports electronic components and provides mechanical support and circuit interconnection functions. The connector assembly 20 refers to a collection of components that realize electrical connections between circuit boards, specifically including board-to-board connectors 21 and their supporting components, which are fixed to the substrate surface by soldering or surface mounting. The molding compound 30 refers to an insulating encapsulation material formed by injection molding, specifically epoxy resin or silicone material, used to protect internal components from environmental corrosion. The signal shielding layer 40 refers to a conductive metal cover layer, specifically formed by vacuum sputtering of metal, and its arrangement around the connector assembly 20 can effectively block electromagnetic radiation paths.

[0026] Specifically, the module substrate 10 serves as a structural carrier supporting the connector assembly 20, which is fixed to a designated area of ​​the substrate via soldering or surface mounting. The molding compound 30 encapsulates the non-contact portions of the connector assembly 20 using injection molding, forming a physical protective layer. After the molding compound 30 cures, a signal shielding layer 40 is deposited on its outer surface using vacuum sputtering, forming a continuously covering conductive film. This shielding layer extends along the surface of the molding compound 30 to the edge of the substrate, forming an electrical connection with the grounding metal layer on the side of the substrate, thus constructing a complete electromagnetic shielding loop. When high-frequency signals are transmitted through the connector assembly 20, the shielding layer suppresses electromagnetic wave radiation through absorption and reflection.

[0027] Compared to existing technologies, traditional solutions often incorporate partial shielding structures within the connector but fail to construct a complete shielding layer on the outer surface of the molding compound 30. This solution, however, covers the entire surface of the molding compound 30 with an external continuous conductive layer, forming a 360-degree shielding structure surrounding the connector assembly 20, significantly expanding the electromagnetic protection range. In existing technologies, the grounding structure typically only connects to the bottom surface of the substrate; this solution achieves multi-point grounding of the shielding layer through a grounding metal layer on the side of the substrate, effectively reducing grounding impedance.

[0028] Through the above technical solution, this application can effectively suppress electromagnetic leakage during high-frequency signal transmission and improve the signal transmission quality of the connector module. In compact electronic devices, this solution can reduce electromagnetic interference between adjacent components and enhance system electromagnetic compatibility. The combination design of the shielding layer and the molding compound 30 ensures shielding effectiveness while maintaining the thin and light characteristics of the module structure, meeting the high-density integration requirements of modern consumer electronics products.

[0029] Please see Figures 1 to 3 This application further proposes a connector module including a board-to-board connector 21, peripheral components 22 and an adapter board 23 mounted on a module substrate 10. The board-to-board connector 21 is electrically connected to the peripheral components 22, and the adapter board 23 is electrically connected to the board-to-board connector 21.

[0030] In this embodiment, the board-to-board connector 21 refers to the component used to realize the electrical connection between two circuit boards, and its contact layout and spacing must match the design requirements of the target circuit board. Peripheral components 22 refer to auxiliary electronic components that work in conjunction with the board-to-board connector 21, specifically surface-mount resistors, capacitors, or inductors, used to optimize signal transmission quality or provide power management functions. The adapter board 23 refers to the intermediate carrier used to adjust the electrical connection position of the board-to-board connector 21, specifically implemented using a multilayer printed circuit board, and its internal wiring must meet the impedance control requirements for high-frequency signal transmission. Electrical connection refers to the method of establishing an electrical path through conductive materials, specifically achieved using solder, conductive adhesive, or metal spring contacts, ensuring that the connection has stable contact resistance and mechanical strength.

[0031] Specifically, the board-to-board connector 21 is fixed to the front side of the module substrate 10, while the peripheral components 22 and the adapter board 23 are distributed on the bottom surface of the module substrate 10. The board-to-board connector 21 forms an electrical connection with the peripheral components 22 through internal wiring to realize signal processing or power distribution functions. The adapter board 23 is connected to the board-to-board connector 21 through a vertical conduction structure to extend the connector interface from the front side to the bottom surface of the module substrate 10, thereby adapting to multi-board stacking layouts in compact spaces. The module substrate 10 serves as a support carrier, and its material can be glass fiber reinforced epoxy resin to balance mechanical strength and dielectric properties. After the molding compound 30 encapsulates the connector assembly 20, the signal shielding layer 40 covers the outer surface of the molding compound 30, forming an electromagnetic shielding structure.

[0032] Compared with existing technologies, in traditional solutions, the board-to-board connector 21 is usually independently mounted on the circuit board surface, and the peripheral components 22 are scattered, resulting in low overall space utilization and long signal paths. This solution integrates the peripheral components 22 and the adapter board 23 on both sides of the module substrate 10, making the vertical spatial distribution of the connector assembly 20 more compact, while shortening the electrical path between the board-to-board connector 21 and the peripheral components 22, and reducing parasitic inductance and electromagnetic radiation during high-frequency signal transmission.

[0033] Through the above technical solution, this application can achieve high-density integration of connector assembly 20 in a limited space, reducing energy loss and electromagnetic interference risks during signal transmission. The coordinated layout of peripheral components 22 and adapter board 23 optimizes the electrical connection structure between circuit boards, improving signal integrity while enhancing the mechanical stability of the overall module, making it more suitable for high-frequency, highly integrated electronic device applications.

[0034] Please see Figures 1 to 4 This application further proposes a connector module including a module substrate 10, a board-to-board connector 21 located on the front side of the module substrate 10, and peripheral components 22 and an adapter plate 23 located on the bottom side of the module substrate 10.

[0035] In this embodiment, the board-to-board connector 21 is arranged on the front side of the module substrate 10, allowing its terminal array to be directly exposed to the external interface area, facilitating vertical insertion with other circuit boards. The peripheral components 22 and adapter board 23 are centrally located on the bottom surface of the module substrate 10, forming an electrical connection with the board-to-board connector 21 via internal traces. This layout confines the high-frequency signal transmission path to the front area of ​​the substrate, while sinking auxiliary components and adapter modules to the bottom surface, effectively avoiding spatial interference between different functional modules. The board-to-board connector 21 on the front side of the module substrate 10 can be fixed using surface mount technology, while the peripheral components 22 and adapter board 23 on the bottom surface can be integrated using embedded packaging technology.

[0036] Compared to existing technologies, current connector modules typically concentrate all components on a single side of the substrate, leading to signal path crossing and increased electromagnetic interference. This solution, through a spatially layered layout, physically isolates high-frequency signal interfaces from low-frequency control components, significantly reducing the risk of signal crosstalk. Simultaneously, the recessed design of the bottom components frees up more wiring space on the front of the substrate, which helps shorten critical signal transmission paths.

[0037] Through the above technical solutions, this application achieves efficient utilization of the internal space of the connector module and optimizes the electromagnetic environment of the high-frequency signal transmission path. The bottom layout of the peripheral components 22 and the adapter board 23 reduces space competition with the board-to-board connector 21, thereby improving the overall structural compactness. The regional arrangement scheme also reduces the signal loop area, which helps to suppress high-frequency electromagnetic radiation leakage.

[0038] Please see Figure 4 This application further proposes that the molding compound 30 includes a bottom molding compound 31 and a top molding compound 32. The bottom molding compound 31 is formed on the bottom surface of the module substrate 10 and wraps the peripheral components 22 and the adapter plate 23. The top molding compound 32 is formed on the top surface of the module substrate 10 and wraps the connection between the board-to-board connector 21 and the module substrate 10.

[0039] In this embodiment, the bottom encapsulation 31 refers to the insulating encapsulation structure that covers the bottom area of ​​the module substrate 10 and wraps the peripheral components 22 and the adapter plate 23. Specifically, it can be formed by injection molding using epoxy resin material. It is used to fix the relative position of the peripheral components 22 and the adapter plate 23 and to isolate them from physical damage caused by the external environment. The top encapsulation 32 refers to the insulating encapsulation structure that covers the top area of ​​the module substrate 10 and wraps the connection between the board-to-board connector 21 and the substrate. Specifically, it can be formed by molding using polyimide material. It is used to enhance the mechanical connection strength between the board-to-board connector 21 and the substrate and to prevent the leakage of electromagnetic energy generated during high-frequency signal transmission. The bottom and top surfaces of the module substrate 10 refer to the lower and upper surfaces of the substrate in the vertical direction, respectively. Specifically, the double-sided circuit layout of the substrate can be used to achieve partitioned installation of different devices, thereby optimizing space utilization.

[0040] Specifically, the bottom molding compound 31 encapsulates the peripheral components 22 and the adapter plate 23, forming a stable integrated structure with the bottom surface of the module substrate 10, thus preventing component displacement or poor contact due to equipment vibration or temperature changes. The top molding compound 32 covers the connection area between the board-to-board connector 21 and the substrate, effectively reducing the intensity of electromagnetic radiation generated in this area during high-frequency signal transmission. The bottom molding compound 31 and the top molding compound 32 adopt a separate design, allowing for the selection of appropriate packaging materials and process parameters based on the characteristics of devices in different areas. For example, the bottom can use a high thermal conductivity material to assist in heat dissipation, while the top can use a low dielectric loss material to optimize signal transmission.

[0041] Compared to existing technologies, traditional connector modules typically use a single plastic package to encapsulate all components, making it impossible to meet the packaging requirements of different areas simultaneously. This solution uses a split plastic package structure, allowing the bottom and top to be packaged differently for the characteristics of the peripheral components 22 and the board-to-board connector 21, respectively. This avoids the structural stress concentration problem caused by the overall packaging and provides a flat base surface for the uniform coverage of the subsequent signal shielding layer 40.

[0042] Through the above technical solution, this application achieves key protection against high-frequency signal radiation sources through a split plastic encapsulation design, while improving the structural stability of the connector module under complex working conditions.

[0043] Please see Figure 1 , Figure 4 and Figure 5 This application further proposes that the signal shielding layer 40 covers the top surface and side surface of the top molding compound 32 and the side surface of the bottom molding compound 31; a grounding metal layer is provided on the side surface of the module substrate 10, and the signal shielding layer 40 is electrically connected to the grounding metal layer.

[0044] In this embodiment, the signal shielding layer 40 refers to a conductive layer covering the outer surface of the molding compound 30. Specifically, it can be achieved by forming a continuous coating layer on the surface of the molding compound 30 using a metal sputtering process, and is used to block the electromagnetic signals generated by the connector assembly 20 from radiating outward. The grounding metal layer refers to a conductive structure disposed on the side of the module substrate 10. Specifically, it can be achieved by forming a metal plating layer on the side of the substrate using an electroplating or deposition process, and is used to provide a grounding path for the signal shielding layer 40, forming an electromagnetic shielding loop. The top molding compound 32 refers to the insulating encapsulation material that wraps the connection between the connector and the substrate on the top surface of the module substrate 10, and the bottom molding compound 31 refers to the insulating encapsulation material that wraps the peripheral components 22 and the adapter plate 23 on the bottom surface of the module substrate 10. Both are formed separately through a molding process, and together they protect the internal electronic components.

[0045] Specifically, the signal shielding layer 40 is configured to cover the top and side surfaces of the top molding compound 32 and the side surfaces of the bottom molding compound 31, creating a continuous conductive path on both sides and sides of the module substrate 10. The grounding metal layer on the side surface of the module substrate 10 is in direct contact with the signal shielding layer 40, and the induced current generated by the shielding layer is guided into the grounding loop through conductive connection, thereby eliminating the accumulation of electromagnetic energy. This design extends the electromagnetic shielding range from the top molding compound 32 to the side surface of the bottom molding compound 31, while forming a closed electromagnetic shielding structure through the grounding metal layer on the side surface of the substrate, effectively reducing electromagnetic leakage during high-frequency signal transmission.

[0046] Compared to existing technologies, the signal shielding layer 40 of traditional connector modules typically only covers a single direction or a localized area and lacks a direct connection to the substrate grounding layer, resulting in gaps or impedance mismatches between the shielding layer and the grounding path. This solution extends the shielding layer coverage to multiple surfaces of the top and bottom molding compounds 31 and directly connects it to the grounding metal layer on the side of the substrate. This reduces the contact resistance between the shielding layer and the grounding layer, forming a low-impedance electromagnetic shielding loop, thereby significantly improving the suppression capability against high-frequency electromagnetic interference.

[0047] Please see Figure 1 , Figure 4 and Figure 5 This application further proposes that the signal shielding layer 40 includes an outer metal layer and an inner metal layer stacked sequentially, the inner metal layer being electrically connected to the ground metal layer and connected to the top surface and side surface of the top molding compound 32 and the side surface of the bottom molding compound 31.

[0048] In this embodiment, the outer metal layer refers to the metal structure layer covering the outermost part of the signal shielding layer 40, used to resist corrosion from corrosive substances in the external environment. The inner metal layer refers to the metal structure layer that is closely attached to the outer metal layer and close to the surface of the encapsulation 30, used to establish a conductive path with the grounding metal layer to achieve electromagnetic shielding.

[0049] Specifically, the inner metal layer forms a continuous conductive path by covering the top surface and sides of the top molding compound 32 and the sides of the bottom molding compound 31, and directly contacts the grounding metal layer on the side of the module substrate 10, thereby guiding electromagnetic interference signals into the grounding loop. The outer metal layer forms a protective cover layer outside the inner metal layer to prevent the conductivity of the inner metal layer from decreasing due to oxidation or corrosion. Through the stacked structure of the inner and outer metal layers, both electromagnetic shielding effectiveness is ensured and the environmental tolerance of the signal shielding layer 40 is improved.

[0050] Compared to existing technologies, traditional signal shielding layers 40 typically employ a single metal layer structure, which is prone to increased grounding resistance due to surface oxidation during long-term use, thereby weakening the shielding effect. This solution, however, utilizes a double-layer metal structure. The inner metal layer maintains stable grounding conductivity, while the outer metal layer extends the shielding layer's lifespan through its corrosion resistance, thus maintaining stable electromagnetic shielding performance under complex operating conditions.

[0051] Through the above technical solution, this application can effectively suppress electromagnetic energy leakage generated by the connector assembly 20 during high-frequency signal transmission, reduce the risk of interference to surrounding electronic components, and at the same time improve the durability of the signal shielding layer 40 through the synergistic effect of the double-layer metal structure, ensuring the long-term reliable operation of the connector module in a compact space layout.

[0052] Please see Figure 1 , Figure 4 and Figure 5 This application further proposes that the signal shielding layer 40 also includes a plurality of intermediate metal layers stacked together, wherein the plurality of intermediate metal layers are disposed between the outer metal layer and the inner metal layer.

[0053] In this embodiment, the middle metal layer refers to the conductive layer located between the outer and inner metal layers. Specifically, it can be formed using copper, aluminum, or alloy materials through electroplating or vacuum deposition processes to enhance the continuity of the electromagnetic wave reflection path. The stacked arrangement refers to multiple metal layers being sequentially superimposed in a parallel arrangement, which can be achieved by alternately depositing different metal materials, thus forming a multi-level electromagnetic wave reflection interface.

[0054] Specifically, multiple intermediate metal layers are disposed between the outer and inner metal layers, forming a multi-layer conductive structure. The inner metal layer directly covers the surface of the molding compound 30 and is connected to the grounded metal layer. The intermediate metal layers are stacked sequentially on top of the inner metal layers, and the outer metal layer covers the outermost intermediate metal layer. When high-frequency electromagnetic waves penetrate the outer metal layer, the intermediate metal layers attenuate the electromagnetic energy through multiple reflections and absorptions, reducing electromagnetic leakage.

[0055] Compared to existing technologies, traditional shielding layers typically employ a single-layer metal structure, allowing electromagnetic waves to easily leak directly after penetrating the outer layer. This solution, however, increases the number of middle metal layers to form a stepped impedance matching structure, causing electromagnetic waves to be reflected and lose energy at each metal interface, thus significantly improving shielding effectiveness.

[0056] Through the above technical solutions, this application can effectively suppress electromagnetic energy leakage generated during high-frequency signal transmission, reduce interference noise on the signal transmission path, and ensure the signal integrity of the connector assembly 20 in a high-density layout environment. Simultaneously, the multi-layer metal structure enhances the mechanical strength of the shielding layer through synergistic effects, preventing cracking or detachment of the shielding layer due to external stress.

[0057] Please see Figure 4 and Figure 5 This application further proposes that the thickness of the outer metal layer is greater than the thickness of the inner metal layer.

[0058] The outer metal layer refers to the outermost metal layer covering the outermost surface of the molding compound 30, while the inner metal layer refers to the metal layer that is in direct contact with the surface of the molding compound 30. The design that the outer metal layer is thicker than the inner metal layer allows the outer layer to provide stronger mechanical protection and corrosion resistance, while the inner layer maintains sufficient conductivity to achieve effective grounding.

[0059] Specifically, the outer and inner metal layers form a composite shielding structure through combinations of different materials and thicknesses. Increasing the thickness of the outer metal layer enhances its coverage of uneven areas on the surface of the molding compound 30, reducing the risk of metal layer damage due to environmental corrosion; decreasing the thickness of the inner metal layer reduces material costs while ensuring a low-impedance connection with the grounded metal layer. In the vacuum sputtering process, the outer and inner metal layers are deposited sequentially, and their thickness ratio can be controlled by adjusting the sputtering time or the target supply rate.

[0060] Compared with existing technologies, this solution optimizes overall performance by using a differentiated thickness design, prioritizing the outer layer for protection while the inner layer focuses on conductivity and signal shielding. Through this technical solution, the application can extend the service life of the signal shielding layer 40, avoid localized corrosion or peeling caused by an excessively thin outer metal layer, and maintain a stable electrical connection between the inner metal layer and the grounding metal layer, ensuring the continuity of electromagnetic shielding effectiveness during high-frequency signal transmission.

[0061] Please see Figure 1 , Figure 4 and Figure 5 Furthermore, this application proposes that the outer metal layer be a corrosion-resistant metal layer.

[0062] In this embodiment, the outer metal layer refers to the metal structure layer covering the outermost part of the signal shielding layer 40. Specifically, it can be achieved by surface passivation treatment of chemically stable metal material layer or by alloying with anti-corrosion elements, so as to directly contact the external environment and resist oxidation, moisture or chemical corrosion.

[0063] Specifically, the outer metal layer, as the outermost structure of the signal shielding layer 40, is directly exposed to the external environment. By using corrosion-resistant metal materials, this layer can maintain its structural integrity in humid, high-temperature, or corrosive gas environments, avoiding a decrease in shielding performance due to metal oxidation or chemical corrosion. In implementation, the outer metal layer is combined with the inner metal layer through a vacuum sputtering process to form a continuously covering composite shielding structure, which maintains electromagnetic shielding effectiveness and extends the service life of the shielding layer through its corrosion resistance.

[0064] In some specific implementations, the corrosion-resistant metal layer can be achieved through a multi-layer composite structure, such as superimposing a chromium layer on the surface of a nickel layer to enhance corrosion resistance; or by using a gradient material design, so that the elemental distribution of the outer metal layer gradually increases the proportion of corrosion-resistant components from the inside to the outside.

[0065] Compared to existing technologies, traditional signal shielding layers 40 typically use a single metallic material, such as copper or aluminum. These materials are prone to oxidation or electrochemical corrosion in complex environments, leading to holes or cracks on the shielding surface and consequently causing electromagnetic leakage. This solution, however, by incorporating a corrosion-resistant metal layer as the outer layer, can significantly reduce the corrosion rate under the same operating conditions, maintaining the continuity and electromagnetic shielding of the shielding layer.

[0066] Through the above technical solution, this application solves the problem of electromagnetic shielding effectiveness decay caused by corrosion of existing shielding layers, ensuring that the connector module maintains stable signal transmission quality during long-term use, and is especially suitable for electronic devices in high humidity, salt spray or industrial pollution environments.

[0067] Please see Figure 1 , Figure 4 and Figure 5 This application further proposes that the signal shielding layer 40 is formed on the outer surface of the encapsulated body 30 by a vacuum sputtering process.

[0068] In this embodiment, vacuum sputtering refers to a process in which metal atoms or ions are deposited on the surface of the molding compound 30 to form a continuous metal film by bombarding a metal target with high-energy particles in a vacuum environment. Specifically, it can be implemented using magnetron sputtering, ion beam sputtering, or radio frequency sputtering equipment. This process ensures that the metal layer uniformly covers the surface of the molding compound 30, avoiding local shielding failure caused by complex structure.

[0069] Specifically, after the molding compound 30 is formed, it is placed in a vacuum chamber, and metal material is deposited layer by layer on the surface of the molding compound 30 through a sputtering process. Metal atoms uniformly adhere to the surface of the molding compound 30 in a linear motion within the vacuum environment, including edges, corners, and uneven structural areas, forming a gapless conductive shielding layer. This process allows for adjustment of the shielding layer's thickness and density by controlling the sputtering time, target power, and substrate temperature, ensuring that the electromagnetic shielding effectiveness meets the requirements of high-frequency signal transmission.

[0070] Compared to existing technologies, traditional shielding layer fabrication often employs electroplating or conductive coating processes, which suffer from poor adhesion, uneven thickness, and inability to cover complex three-dimensional structures. Vacuum sputtering, on the other hand, forms a metal layer through physical deposition, allowing for precise control of film quality and avoiding the corrosion risks associated with chemical electroplating of the molding compound 30. It also adapts to the minute gaps and irregular structures on the surface of the molding compound 30 in high-density integration scenarios.

[0071] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A connector module, characterized in that, The connector module includes: Module substrate; A connector assembly, which is mounted on the module substrate; A molding compound that encapsulates at least a portion of the structure of the connector assembly; and A signal shielding layer is provided, which covers the outer surface of the molding compound and surrounds the connector assembly, for shielding the electromagnetic signals of the connector assembly.

2. The connector module as described in claim 1, characterized in that, The connector assembly includes a board-to-board connector, peripheral components, and an adapter board mounted on the module substrate. The board-to-board connector is electrically connected to the peripheral components, and the adapter board is electrically connected to the board-to-board connector.

3. The connector module as described in claim 2, characterized in that, The board-to-board connector is located on the front side of the module substrate, and the peripheral components and the adapter plate are located on the bottom side of the module substrate.

4. The connector module as described in claim 3, characterized in that, The molding compound includes a bottom molding compound and a top molding compound. The bottom molding compound is formed on the bottom surface of the module substrate and wraps around the peripheral components and the adapter board. The top molding compound is formed on the top surface of the module substrate and wraps around the connection between the board-to-board connector and the module substrate.

5. The connector module as described in claim 4, characterized in that, The signal shielding layer covers the top surface and side surface of the top molding compound and the side surface of the bottom molding compound; a grounding metal layer is provided on the side surface of the module substrate, and the signal shielding layer is electrically connected to the grounding metal layer.

6. The connector module as described in claim 5, characterized in that, The signal shielding layer includes an outer metal layer and an inner metal layer stacked sequentially. The inner metal layer is electrically connected to the grounding metal layer and is connected to the top surface and side surface of the top molding compound and the side surface of the bottom molding compound.

7. The connector module as described in claim 6, characterized in that, The signal shielding layer also includes a plurality of intermediate metal layers stacked together, wherein the plurality of intermediate metal layers are disposed between the outer metal layer and the inner metal layer.

8. The connector module as described in claim 7, characterized in that, The thickness of the outer metal layer is greater than the thickness of the inner metal layer.

9. The connector module as described in claim 6, characterized in that, The outer metal layer is a corrosion-resistant metal layer.

10. The connector module as described in claim 1, characterized in that, The signal shielding layer is formed on the outer surface of the encapsulated body by a vacuum sputtering process.

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