Manufacturing process of ultra-narrow step board-to-board connector

Abstract

The invention provides an ultra-narrow step pitch board-to-board connector manufacturing process, which comprises the manufacturing processes of signal terminal material strip manufacturing, power supply terminal material preparation, first-time forming and second-time forming, and comprises the following steps of: firstly, manufacturing a first-time formed part from an outer-layer signal terminal group, an inner-layer signal terminal group and a power supply terminal through the first-time forming, and then manufacturing a second-time formed part from the first-time formed part through the second-time forming; the first plastic main body and the second plastic main body are arranged, the first vacant part and the second vacant part are reserved on the first plastic main body, then the two primary forming parts are formed for the second time to form a secondary forming part, and the first vacant part can be filled with the first filling part. The second filling part can fill the second vacancy part and realize the combination between the first plastic main body of one primary forming part and the second plastic main body of the other primary forming part, and the two primary forming parts form an integrated structure, so that good connection stability and structural strength are achieved, the manufacturing process can be simplified, the processing difficulty is reduced, and the production efficiency is improved. And the manufacturing cost and the manufacturing time are reduced.

Description

Technical Field

[0001] This invention relates to the field of connector technology, and more particularly to a manufacturing process and preparation process for an ultra-narrow pitch board-to-board connector. Background Technology

[0002] Board-to-board connectors, an indispensable part of electronic products, feature fast and stable transmission, low loss, and high fidelity, acting as a bridge for communication in electronic circuits. The development of 4G and 5G has accelerated the iteration speed of products in the consumer electronics industry. The rapid development of smart terminals such as smartphones and wearable devices has also promoted the development of board-to-board connectors. In smart terminal devices, there are high requirements for the miniaturization, stability, and reliability of board-to-board connectors.

[0003] Some board-to-board connectors have two rows of inner signal terminal groups, two rows of outer signal terminal groups, and two power terminals. The existing manufacturing process involves molding one row of inner signal terminal groups and one row of outer signal terminal groups onto a single strip of plastic, and molding another row of inner signal terminal groups and another row of outer signal terminal groups onto another strip of plastic. The two power terminals are then molded between the ends of the two strips of plastic. This process is complex, difficult to manufacture, and increases production costs and time. Summary of the Invention

[0004] The problem to be solved by this invention is to provide a manufacturing process for an ultra-narrow pitch board-to-board connector, which simplifies the process, reduces production costs, and improves production efficiency.

[0005] To solve the above technical problems, a manufacturing process for an ultra-narrow pitch board-to-board connector provided by this invention is adopted, which includes the following steps:

[0006] S1: The signal terminal strip is made by feeding a steel strip into a punch press to form a signal terminal strip. The signal terminal strip includes an outer signal terminal strip and an inner signal terminal strip. The outer signal terminal strip includes a first main strip and several outer signal terminal groups arranged in parallel on the first main strip. The inner signal terminal strip includes a second main strip and several inner signal terminal groups arranged in parallel on the second main strip. Both the outer and inner signal terminal groups include several signal terminals arranged in parallel. The signal terminals on the outer signal terminal group and the signal terminals on the inner signal terminal group are arranged in opposite directions and staggered.

[0007] S2: Preparation of power terminals. Prepare the power terminals. The power terminals include a C-shaped panel. The outer edge of the C-shaped panel is bent and has a surrounding edge. The surrounding edge is connected to the first pin, the second pin, and the third pin. The inner edge of the C-shaped panel is connected to an arc-shaped contact part.

[0008] S3: First molding: The signal terminal material strip and power terminal are input into the injection molding machine so that the outer signal terminal group, inner signal terminal group and power terminal are integrally injection molded in the cavity of the injection molding machine to form a one-time molded part. The one-time molded part includes a one-time molded plastic body. The one-time molded plastic body includes a first plastic body integrally molded on the power terminal and a second plastic body integrally molded on the signal terminal. The first plastic body includes a C-shaped plastic body and a base connected to the inner edge of the bottom of the C-shaped plastic body. One end of the second plastic body is connected to one end of the C-shaped plastic body. The first plastic body has a void portion, which includes a first void portion located on the base portion and a second void portion located on the other end of the C-shaped plastic body.

[0009] S4: Second molding: Prepare two primary molding parts, place the two primary molding parts at a 180° angle in the cavity of the injection molding machine for integral injection molding to form a secondary molding part. The secondary molding part includes two secondary molding plastic bodies, each of which includes a first filling part that fills the first void and a second filling part that fills the second void and is formed on the other end of the second plastic body.

[0010] Preferably, the first vacancy is set in an "L" shape.

[0011] Preferably, the roots of the first pin, the second pin, and the third pin are all bent to form an inner groove, and the first plastic body is formed on the inner groove and fills the inner groove.

[0012] Preferably, hollow grooves are provided on both sides of the root of the second pin on the perimeter, and the first plastic body is formed on the hollow grooves and fills the hollow grooves.

[0013] Preferably, the edge of the first gap is provided with an arc-shaped protrusion.

[0014] Preferably, the second plastic body includes a retaining wall portion adjacent to the side of the signal terminal.

[0015] The beneficial effects of this invention are as follows: This invention provides a manufacturing process for an ultra-narrow pitch board-to-board connector, including the production of signal terminal strips, preparation of power terminals, a first molding process, and a second molding process. First, a set of outer signal terminal groups, a set of inner signal terminal groups, and a power terminal are molded into a primary molded part through the first molding process. A first gap and a second gap are left on the first plastic body. Then, the two primary molded parts are molded a second time to form a secondary molded part. A first filling part can fill the first gap, and a second filling part can fill the second gap, realizing the connection between the first plastic body of one primary molded part and the second plastic body of another primary molded part. The two primary molded parts form an integrated structure with good connection stability and structural strength. This process can simplify the manufacturing process, reduce processing difficulty, and reduce manufacturing costs and time, making it worthy of promotion. Attached Figure Description

[0016] Figure 1 This illustration shows a schematic diagram of the outer signal terminal group, inner signal terminal group, and power terminal of the present invention before the first molding.

[0017] Figure 2 A schematic diagram illustrating the structure of the power supply terminal of the present invention is shown.

[0018] Figure 3 A schematic diagram illustrating the structure of the one-piece molded part of the present invention is shown.

[0019] Figure 4 The present invention is illustrated. Figure 3 A schematic diagram of the structure at point AA'.

[0020] Figure 5 The present invention is illustrated. Figure 3 A schematic diagram of the structure at BB' in the middle.

[0021] Figure 6 A schematic diagram illustrating the structure of the one-piece molded plastic body of the present invention is shown.

[0022] Figure 7 The diagram illustrates the structure of two primary molded parts of the present invention before the second molding.

[0023] Figure 8 A schematic diagram illustrating the structure of the secondary molded part of the present invention is shown.

[0024] Figure 9 A schematic diagram illustrating the structure of the secondary molded plastic body of the present invention is shown.

[0025] Figure 10 A top view of the secondary molded part of the present invention is shown.

[0026] Figure 11 A process flow diagram of the present invention is illustrated.

[0027] Reference numerals: Outer signal terminal group 1, signal terminal 10, inner signal terminal group 2, power terminal 3, C-shaped panel 30, perimeter 31, hollow groove 310, first pin 32, inner groove 320, second pin 33, third pin 34, arc-shaped contact part 35, one-piece molded part 4, one-piece molded plastic body 40, first plastic body 41, C-shaped plastic body 410, base 411, empty part 412, first empty part 412a, second empty part 412b, arc-shaped protrusion 412c, second plastic body 42, retaining wall part 420, secondary molded part 5, secondary molded plastic body 50, first filling part 500, second filling part 501. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure.

[0029] Based on the embodiments described in this disclosure, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this disclosure.

[0030] refer to Figure 1-11 .

[0031] This invention provides a manufacturing process for an ultra-narrow pitch board-to-board connector, comprising the following steps:

[0032] S1: The signal terminal strip is made by feeding a steel strip into a punch press to form a signal terminal strip. The signal terminal strip includes an outer signal terminal strip and an inner signal terminal strip. The outer signal terminal strip includes a first main strip and several outer signal terminal groups 1 arranged in parallel on the first main strip. The inner signal terminal strip includes a second main strip and several inner signal terminal groups 2 arranged in parallel on the second main strip. Both the outer signal terminal group 1 and the inner signal terminal group 2 include several signal terminals 10 arranged in parallel. The signal terminals 10 on the outer signal terminal group 1 and the signal terminals 10 on the inner signal terminal group 2 are arranged in opposite directions and offset.

[0033] S2: Preparation of power terminals. Prepare power terminals 3. Power terminals 3 include C-shaped panels 30. The outer edge of the C-shaped panels 30 is bent and has a surrounding edge 31. The surrounding edge 31 is connected to the first pin 32, the second pin 33, and the third pin 34. The inner edge of the C-shaped panels 30 is connected to an arc-shaped contact part 35.

[0034] S3: First molding: The signal terminal material strip and power terminal 3 are input into the injection molding machine so that the outer signal terminal group 1, the inner signal terminal group 2, and the power terminal 3 are integrally injection molded in the cavity of the injection molding machine to form a one-time molded part 4. The one-time molded part 4 includes a one-time molded plastic body 40. The one-time molded plastic body 40 includes a first plastic body 41 integrally molded on the power terminal 3 and a second plastic body 42 integrally molded on the signal terminal 10. The first plastic body 41 includes a C-shaped plastic body 410 and a base 411 connected to the inner edge of the bottom of the C-shaped plastic body 410. One end of the second plastic body 42 is connected to one end of the C-shaped plastic body 410. The first plastic body 41 has a void 412. The void 412 includes a first void 412a located on the base 411 and a second void 412b located on the other end of the C-shaped plastic body 410.

[0035] S4: Second molding, prepare two primary molding parts 4, place the two primary molding parts 4 at a 180° angle in the cavity of the injection molding machine for integral injection molding to form a secondary molding part 5. The secondary molding part 5 includes two secondary molding plastic bodies 50. The secondary molding plastic body 50 includes a first filling part 500 that fills the first empty part 412a and a second filling part 501 that fills the second empty part 412b and is formed on the other end of the second plastic body 42.

[0036] It includes the production of signal terminal strips, preparation of power terminals, first molding, and second molding processes. First, a set of outer signal terminal groups 1, a set of inner signal terminal groups 2, and a power terminal 3 are molded into a primary molded part 4 through the first molding process. A first blank 412a and a second blank 412b are left on the first plastic body 41. Then, the two primary molded parts 4 are molded in the second molding process to form a secondary molded part 5. The first filling part 500 can fill the first blank 412a, and the second filling part 501 can fill the second blank 412b, realizing the connection between the first plastic body 41 of one primary molded part 4 and the second plastic body 42 of the other primary molded part 4. The two primary molded parts 4 form an integrated structure with good connection stability and structural strength. It can simplify the process, reduce processing difficulty, and reduce manufacturing costs and time. The signal terminals 10 of the outer signal terminal group 1 and the signal terminals 10 of the inner signal terminal group 2 are staggered, which can achieve the design requirements of smaller step pitch and is worth promoting.

[0037] Based on the above embodiments, the first vacant portion 412a is set in an "L" shape, and the first filling portion 500 is also in an "L" shape after molding, which can strengthen the bonding strength between the secondary molded plastic body 50 and the first plastic body 41 and avoid cracking.

[0038] Based on the above embodiments, the roots of the first pin 32, the second pin 33, and the third pin 34 are all bent to form an inner groove 320. The first plastic body 41 is formed on the inner groove 320 and fills the inner groove 320, which serves as a barrier between the pin and the surrounding edge 31, preventing solder creep when soldering the pin and improving the stability of product quality.

[0039] Based on the above embodiments, hollow grooves 310 are provided on both sides of the root of the second pin 33 on the perimeter 31. The first plastic body 41 is formed on the hollow grooves 310 and fills the hollow grooves 310, which can improve the bonding strength between the first plastic body 41 and the power terminal 3 and prevent it from falling off.

[0040] Based on the above embodiments, the edge of the first empty part 412a is provided with an arc-shaped protrusion 412c. After the first filling part 500 is formed, its edge forms an arc-shaped groove that matches the arc-shaped protrusion 412c, which can improve the bonding strength between the secondary molded plastic body 50 and the first plastic body 41 and avoid cracking.

[0041] Based on the above embodiments, the second plastic body 42 includes a retaining wall portion 420 adjacent to the side of the signal terminal 10, which plays a lateral limiting role on the signal terminal 10 and prevents the signal terminal 10 from being deformed by force when the connector is plugged in or out.

[0042] The above embodiments are merely descriptions of preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A process for manufacturing an ultra-narrow-pitch board-to-board connector, characterized by, The method comprises the following steps: S1: manufacturing a signal terminal strip, inputting a steel strip into a punch to be punched to form a signal terminal strip, the signal terminal strip comprising an outer layer signal terminal strip and an inner layer signal terminal strip, the outer layer signal terminal strip comprising a first main strip and a plurality of outer layer signal terminal groups arranged side by side on the first main strip, the inner layer signal terminal strip comprising a second main strip and a plurality of inner layer signal terminal groups arranged side by side on the second main strip, each of the outer layer signal terminal groups and the inner layer signal terminal groups comprising a plurality of signal terminals arranged side by side, the signal terminals on the outer layer signal terminal groups being reversely staggered with the signal terminals on the inner layer signal terminal groups; S2: preparing a power terminal, the power terminal comprising a C-shaped panel, the outer edge of the C-shaped panel being provided with a surrounding edge, the surrounding edge being connected with a first pin, a second pin and a third pin, and the inner edge of the C-shaped panel being connected with an arc-shaped contact portion; S3: first forming, inputting the signal terminal strip and the power terminal into an injection molding machine to integrally injection mold the outer layer signal terminal groups, the inner layer signal terminal groups and the power terminal in a cavity of the injection molding machine to form a first formed piece, the first formed piece comprising a first formed plastic body, the first formed plastic body comprising a first plastic main body integrally formed on the power terminal and a second plastic main body integrally formed on the signal terminal, the first plastic main body comprising a C-shaped plastic body and a base portion connected to the bottom inner edge of the C-shaped plastic body, one end of the second plastic main body being connected to one end of the C-shaped plastic body, the first plastic main body having a hollow portion, the hollow portion comprising a first hollow portion on the base portion and a second hollow portion on the other end of the C-shaped plastic body; S4: second forming, placing two first formed pieces at an angle of 180° in the cavity of the injection molding machine to integrally injection mold the two first formed pieces to form a second formed piece, the second formed piece comprising two second formed plastic bodies, the second formed plastic bodies comprising a first filling portion filling the first hollow portion and a second filling portion filling the second hollow portion and formed on the other end of the second plastic main body.

2. The process for manufacturing an ultra-narrow-pitch board-to-board connector according to claim 1, wherein The first hollow portion is arranged in an "L" shape.

3. The process for making an ultra-narrow-pitch board-to-board connector according to claim 2, wherein, The roots of the first pin, the second pin and the third pin are all bent to form an inner recess, and the first plastic main body is formed on the inner recess and fills the inner recess.

4. The process for making an ultra-narrow-pitch board-to-board connector according to claim 3, wherein, The surrounding edge is provided with a hollow groove on both sides of the root of the second pin, and the first plastic main body is formed on the hollow groove and fills the hollow groove.

5. The process for making an ultra-narrow-pitch board-to-board connector according to claim 4, wherein The edge of the first hollow portion is provided with an arc-shaped protruding portion.

6. The process for making an ultra-narrow-pitch board-to-board connector according to claim 5, wherein, The second plastic main body comprises a barrier portion adjacent to the side surface of the signal terminal.

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