Viscosity-reducing adhesive tape
By using polyacrylate resin and crosslinking agent in the anti-adhesion tape to form a crosslinked cured product, the adhesion between the adhesive layer and the substrate layer is enhanced, solving the problem of adhesive layer softening caused by plasticizer migration, and improving cutting accuracy and reliability.
Patent Information
- Application Number
- CN202510975235.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-15
- Publication Date
- 2025-11-25
AI Technical Summary
In existing anti-adhesion tapes, plasticizers in the substrate layer can easily migrate into the adhesive layer, causing the adhesive layer to soften, reducing cohesive energy, increasing the risk of delamination, and affecting cutting accuracy and reliability.
A combination of polyacrylate resin and crosslinking agent is used. The crosslinking agent reacts with the polar groups on the functional monomers to form a crosslinked cured product with residual polar groups. The degree of crosslinking is not less than 60%, and the content of phthalic plasticizer in the substrate layer is controlled to be less than 90% to enhance the adhesion between the adhesive layer and the substrate layer.
It effectively inhibits plasticizer migration, improves the adhesion between the adhesive layer and the substrate layer, reduces the risk of residual adhesive, and ensures cutting accuracy and reliability.
Smart Images
Figure CN121006162A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of adhesive materials technology, and more particularly to an anti-adhesive tape. Background Technology
[0002] Currently, non-adhesive tapes (such as UV non-adhesive tapes) can protect the wafer surface during wafer dicing, fixing the wafer to prevent movement during dicing, and facilitating peeling after dicing without damaging the wafer. UV non-adhesive tapes generally consist of a substrate layer, an adhesive layer, and a release layer. The adhesive layer is sandwiched between the substrate layer and the release layer; the substrate layer provides physical support, and the substrate layer and adhesive layer together determine the application scenario of the tape, while the release layer protects the adhesive layer. The adhesive layer needs to provide sufficient adhesion strength during the dicing process to prevent chip displacement or scattering, ensuring dicing accuracy and reliability, and also needs to be easily peeled off during the pick-up process to avoid wafer contamination and damage during pick-up.
[0003] In related technologies, plasticizers in the substrate layer can easily migrate into the adhesive layer, causing the adhesive layer to soften and its cohesive energy to decrease. This can lead to a decrease in the adhesion between the pressure-sensitive adhesive layer and the substrate layer, increasing the risk of delamination and, consequently, the risk of residual adhesive during wafer peeling. Therefore, the plasticizer migration resistance of the adhesive layer is crucial. Thus, it is necessary to develop a non-stick tape with good plasticizer migration resistance and adhesion. Summary of the Invention
[0004] In view of this, this application provides a method to improve the problems of unsatisfactory resistance to plasticizer migration or adhesion of existing anti-tack tapes.
[0005] In a first aspect, embodiments of this application provide a non-adhesive tape, comprising a substrate layer and an adhesive layer disposed on the substrate layer; the adhesive layer comprises, by mass, polyacrylate resin and a crosslinking agent; wherein the weight-average molecular weight of the polyacrylate resin is 250KD-1200KD, and the synthetic monomers of the polyacrylate resin include soft monomers, hard monomers, and functional monomers, wherein the functional monomers contain polar groups, and the functional monomers account for 2%-12% of the mass of the synthetic monomers; the crosslinking agent is used to react with the polar groups on the functional monomers to obtain a crosslinked cured product; the crosslinked cured product has unreacted polar groups remaining and the degree of crosslinking is greater than or equal to 60%; the mass content of phthalic plasticizer in the substrate layer is less than 90% of the total plasticizer content in the substrate layer.
[0006] In some embodiments of this application, the degree of crosslinking of the crosslinked cured product is 60%-95%; preferably, the degree of crosslinking of the crosslinked cured product is 85%-95%.
[0007] In some embodiments of this application, the mass ratio of the crosslinking agent to the polyacrylate resin is 0.5%-10%.
[0008] In some embodiments of this application, the crosslinking agent includes an isocyanate crosslinking agent; preferably, the isocyanate crosslinking agent has an isocyanate value of 5%-25%;
[0009] And / or, the crosslinking agent includes an epoxy crosslinking agent, preferably, the epoxy equivalent in the epoxy crosslinking agent is 50 g / mol to 200 g / mol.
[0010] In some embodiments of this application, the glass transition temperature of the cross-linked cured product is -32°C to -12°C.
[0011] In some embodiments of this application, the soft monomer is selected from at least one of butyl acrylate, isooctyl acrylate, n-octyl methacrylate, ethyl acrylate, laurate acrylate, isodecanyl acrylate, and isononyl acrylate.
[0012] And / or, the hard monomer is selected from at least one of methyl acrylate, methyl methacrylate, ethyl methacrylate, vinyl acetate, acrylonitrile, isobornyl acrylate, isobornyl methacrylate, and cyclohexyl methacrylate;
[0013] And / or, the functional monomer is selected from at least one of acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, and hydroxyethyl methacrylate.
[0014] In some embodiments of this application, the ratio of the soft monomer to the hard monomer to the functional monomer is (60-75): (20-35): (3-12) by mass.
[0015] In some embodiments of this application, the raw materials for preparing the polyacrylate resin further include a solvent, wherein, by mass, the solvent to the synthetic monomer is (40-70): (30-60);
[0016] And / or, the raw materials for preparing the polyacrylate resin further include an initiator, wherein the initiator comprises 0.05% to 0.5% of the synthetic monomer by mass.
[0017] In some embodiments of this application, the soft monomer is butyl acrylate, the hard monomer is ethyl methacrylate, isobornyl acrylate, and acrylonitrile, and the functional monomer is acrylic acid and hydroxyethyl acrylate; calculated by mass parts, butyl acrylate: ethyl methacrylate: isobornyl acrylate: acrylonitrile: acrylic acid: hydroxyethyl acrylate is (71-73): (9-11): (9-11): (2-4): (2-4): (1-3);
[0018] Alternatively, the soft monomer is isooctyl acrylate and laurate acrylate, the hard monomer is vinyl acetate and methyl acrylate, and the functional monomer is hydroxyethyl acrylate. The mass fractions of isooctyl acrylate: laurate acrylate: vinyl acetate: methyl acrylate: hydroxyethyl acrylate are (49-51): (17-19): (13-15): (11-13): (5-7).
[0019] Alternatively, the soft monomer is isooctyl acrylate and butyl acrylate, the hard monomer is methyl methacrylate and cyclohexyl methacrylate, and the functional monomer is methacrylic acid and hydroxyethyl acrylate. The mass fractions of isooctyl acrylate: butyl acrylate: methyl methacrylate: cyclohexyl methacrylate: methacrylic acid: hydroxyethyl acrylate are (51-53): (9-11): (19-21): (9-11): (3-5): (3-5).
[0020] In some embodiments of this application, the substrate layer includes a PVC substrate layer;
[0021] And / or, the substrate layer includes a plasticizer, the plasticizer comprising 17% to 35% of the mass of the substrate layer;
[0022] And / or, the tensile strength of the substrate layer in the MD direction is 25 MPa to 45 MPa;
[0023] And / or, the elongation at break in the MD direction of the substrate layer is 220% to 350%;
[0024] And / or, the tensile strength of the substrate layer in the TD direction is 25 MPa to 35 MPa;
[0025] And / or, the elongation at break in the TD direction of the substrate layer is 240% to 400%;
[0026] And / or, the puncture resistance of the substrate layer is 4.5N to 7N;
[0027] And / or, the puncture elongation of the substrate layer is 6 mm to 14 mm;
[0028] And / or, the substrate layer is a corona-treated substrate layer.
[0029] Beneficial effects:
[0030] The anti-tack tape of this application improves adhesion between the adhesive layer and the substrate layer by leaving some polar groups in the cross-linked cured product. Simultaneously, the polyacrylate resin in the adhesive layer has a weight-average molecular weight of 250KD-1200KD, the degree of cross-linking of the cross-linked cured product is not less than 60%, and the phthalate plasticizer content in the substrate layer is less than 90% of the total plasticizer content in the substrate layer. This allows the adhesive layer to effectively inhibit the migration of plasticizers from the substrate layer, improving or avoiding the problem of residual adhesive in existing anti-tack tapes. Attached Figure Description
[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0032] Figure 1 These are the infrared spectra of the anti-adhesion tapes prepared in Example 1 and Comparative Example 1 of this application;
[0033] Figure 2 These are the infrared spectra of the anti-adhesion tapes prepared in Example 2 and Comparative Example 2 of this application. Detailed Implementation
[0034] The experimental examples described in this application are merely some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit this application.
[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0036] In the description of this application, the term "comprising" means "including but not limited to". The terms first, second, third, etc. are used merely as illustrative purposes and do not impose numerical requirements or establish an order.
[0037] In this application, "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. A and B can be singular or plural.
[0038] In this application, "at least one" means one or more, and "more than one" means two or more. "One or more", "at least one of the following", or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, "at least one of a, b, or c", or "at least one of a, b, and c", can both mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.
[0039] Various embodiments of this application may exist in the form of a range; it should be understood that the description in the form of a range is merely for convenience and brevity and should not be construed as a hard limitation on the scope of this application; therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single numerical values within that range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and single numbers within the range, such as 1, 2, 3, 4, 5, and 6, regardless of the range. Furthermore, whenever a numerical range is referred to herein, it means including any referenced number (fraction or integer) within the referred range.
[0040] Currently, non-adhesive tapes (such as UV non-adhesive tapes) can protect the wafer surface during wafer dicing, fixing the wafer to prevent movement during dicing, and facilitating peeling after dicing without damaging the wafer. UV non-adhesive tapes generally consist of a substrate layer, an adhesive layer, and a release layer. The adhesive layer is sandwiched between the substrate layer and the release layer; the substrate layer provides physical support, and the substrate layer and adhesive layer together determine the application scenario of the tape, while the release layer protects the adhesive layer. The adhesive layer needs to provide sufficient adhesion strength during the dicing process to prevent chip displacement or scattering, ensuring dicing accuracy and reliability, and also needs to be easily peeled off during the pick-up process to avoid wafer contamination and damage during pick-up.
[0041] In related technologies, plasticizers in the substrate layer can easily migrate into the adhesive layer, causing the adhesive layer to soften and its cohesive energy to decrease. This can potentially reduce the adhesion between the pressure-sensitive adhesive layer and the substrate layer, increasing the risk of debonding and, consequently, the risk of residual adhesive during wafer peeling. Therefore, the plasticizer migration resistance of the adhesive layer is crucial. Thus, it is necessary to develop a resin composition that is resistant to plasticizer migration and possesses excellent mechanical properties.
[0042] In view of this, embodiments of this application provide a non-adhesive tape, comprising a substrate layer and an adhesive layer disposed on the substrate layer; the adhesive layer comprises polyacrylate resin and a crosslinking agent by mass; wherein the weight-average molecular weight of the polyacrylate resin is 250KD-1200KD, the synthetic monomers of the polyacrylate resin include soft monomers, hard monomers and functional monomers, the functional monomers contain polar groups, and the functional monomers account for 2%-12% of the mass of the synthetic monomers; the crosslinking agent is used to react with the polar groups on the functional monomers to obtain a crosslinked cured product; the crosslinked cured product has unreacted polar groups remaining and the degree of crosslinking is greater than or equal to 60%.
[0043] The anti-tack tape of this application improves adhesion between the adhesive layer and the substrate layer by leaving some polar groups in the cross-linked cured product. Furthermore, the polyacrylate resin in the adhesive layer has a weight-average molecular weight of 250KD-1200KD, the degree of cross-linking of the cured product is not less than 60%, and the phthalate plasticizer content in the substrate layer is less than 90% of the total plasticizer content. This allows the adhesive layer to effectively inhibit the migration of plasticizers from the substrate layer, improving or avoiding the problem of residual adhesive in existing anti-tack tapes.
[0044] For example, in this application, the weight-average molecular weight of the polyacrylate resin is 250 kDa, 300 kDa, 350 kDa, 400 kDa, 450 kDa, 500 kDa, 550 kDa, 600 kDa, 650 kDa, 700 kDa, 750 kDa, 800 kDa, 850 kDa, 900 kDa, 950 kDa, 1000 kDa, 1050 kDa, 1000 kDa, 1150 kDa, 1200 kDa, and any two of the above values. Further, the weight-average molecular weight of the polyacrylate resin is between 450 kDa and 1200 kDa. For example, the weight-average molecular weight of the polyacrylate resin can be obtained by gel permeation chromatography.
[0045] For example, the degree of crosslinking of the crosslinked cured product is 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, or any value between any two of the above. Further, the degree of crosslinking of the crosslinked cured product is 85% to 95%. It should be noted that the degree of crosslinking of the crosslinked cured product can be adjusted by modifying the relative ratio of the amount of functional monomer added to the amount of crosslinking agent in the adhesive layer, the curing process of the adhesive layer, etc.
[0046] For example, the amount of functional monomer used is 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, 8.5%, 9%, 9.5%, 10%, 10.5%, 11%, 11.5%, 12% of the mass of the synthetic monomer, or any value between any two of the above. It should be noted that the synthetic monomers used to prepare the polyacrylate resin in this application include soft monomers, hard monomers, and functional monomers. The mass of the synthetic monomer is the sum of the mass of the soft monomer, the mass of the hard monomer, and the mass of the functional monomer. One function of the functional monomer is to provide crosslinking sites; for example, the polar groups on the functional monomer react with the active functional groups on the crosslinking agent. Another function of the functional monomer in this application is to increase the adhesion between the adhesive layer and the substrate layer. If the content of functional monomers is too low, for example, less than 2%, it is easy to result in a low degree of cross-linking of the cross-linked cured product or no residue after the polar groups on the functional monomers react with the cross-linking agent, which can easily lead to insufficient adhesion of the cross-linked cured product or easy residue. If the content of functional monomers is too high, for example, more than 12%, it is easy to gel during the preparation of polyacrylate resin.
[0047] In some embodiments of this application, the amount of crosslinking agent in the adhesive layer, calculated by weight, is 0.5%-10% of the mass of the polyacrylate resin. It should be noted that if the crosslinking agent content is too low, for example, below 0.5%, it can easily lead to insufficient crosslinking of the cured product, resulting in insufficient cohesion of the cured adhesive layer and problems such as adhesive failure. The maximum content of the curing agent is set based on the maximum content of the functional monomers. If the crosslinking agent content is too high, for example, above 10%, it can easily lead to excessive crosslinking agent, resulting in excessively high crosslinking of the cured product or leaving no residue after the polar groups in the functional monomers react. For example, if the degree of crosslinking of the cured product exceeds 95%, the cured adhesive layer will lose its pressure-sensitive adhesive properties or have excessively low peel strength.
[0048] For example, the amount of crosslinking agent used is 0.5%, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10% of the mass of the polyacrylate resin, or any value between any two of the above. For example, the amount of crosslinking agent used is 3%-5% of the mass of the polyacrylate resin.
[0049] In some embodiments of this application, the crosslinking agent includes, but is not limited to, a thermal crosslinking agent. Further, the thermal crosslinking agent includes at least one of an isocyanate crosslinking agent or an epoxy crosslinking agent.
[0050] For example, the isocyanate crosslinking agent has ≥2 active functional groups. The isocyanate crosslinking agent includes, but is not limited to, isophorone diisocyanate (IPDI) polymers, and the isocyanate value is 5%-25%. It should be noted that if the isocyanate value in the isocyanate crosslinking agent is too high, for example, greater than 25%, it can easily lead to a higher proportion of small molecule monomers in the isocyanate crosslinking agent, which can easily result in unsatisfactory performance of the crosslinked cured product. If the isocyanate value in the isocyanate crosslinking agent is too low, for example, less than 5%, it can easily lead to insufficient crosslinking sites, a lower degree of crosslinking in the crosslinked cured product, and also easily result in unsatisfactory performance of the crosslinked cured product.
[0051] For example, the epoxy crosslinking agent has ≥2 active functional groups, and the epoxy crosslinking agent includes, but is not limited to, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane. Further, the epoxy equivalent in the epoxy crosslinking agent is 50 g / mol to 200 g / mol.
[0052] In some embodiments of this application, the glass transition temperature (Tg) of the crosslinked cured product is between -32°C and -12°C. The glass transition temperature (Tg) of the crosslinked cured product is -32°C, -30°C, -28°C, -26°C, -24°C, -22°C, -20°C, -18°C, -16°C, -14°C, -12°C, and any two of the above values. Exemplarily, the glass transition temperature of the crosslinked cured product can be obtained using a differential calorimeter. It should be noted that the glass transition temperature of the crosslinked cured product can be adjusted by controlling the composition and ratio of the synthetic monomers, the degree of crosslinking of the crosslinked cured product, etc.
[0053] In some embodiments of this application, the soft monomer is selected from at least one of butyl acrylate, isooctyl acrylate, n-octyl methacrylate, ethyl acrylate, laurate acrylate, isodecanyl acrylate, and isononyl acrylate.
[0054] In some embodiments of this application, the hard monomer is selected from at least one of methyl acrylate, methyl methacrylate, ethyl methacrylate, vinyl acetate, acrylonitrile, isobornyl acrylate, isobornyl methacrylate, and cyclohexyl methacrylate.
[0055] In some embodiments of this application, the functional monomer is selected from at least one of acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, and hydroxyethyl methacrylate.
[0056] In some embodiments of this application, the ratio of soft monomer to hard monomer to functional monomer by mass is (60-75):(20-35):(3-12). Thus, by controlling the proportions of soft monomer, hard monomer, and functional monomer, the adhesive layer, after crosslinking and curing, can have a suitable glass transition temperature and degree of crosslinking, and exhibit good adhesion to the substrate layer.
[0057] In some embodiments of this application, the soft monomer is butyl acrylate, the hard monomer is ethyl methacrylate, isobornyl acrylate, and acrylonitrile, and the functional monomer is acrylic acid and hydroxyethyl acrylate; the mass fractions of butyl acrylate: ethyl methacrylate: isobornyl acrylate: acrylonitrile: acrylic acid: hydroxyethyl acrylate are (71-73): (9-11): (9-11): (2-4): (2-4): (1-3). Thus, by controlling the composition and ratio of the soft monomer, hard monomer, and functional monomer, the adhesive layer can be cross-linked and cured to have a suitable glass transition temperature and degree of cross-linking, resulting in good adhesion to the substrate layer.
[0058] In some embodiments of this application, the soft monomers are isooctyl acrylate and laurate acrylate, the hard monomers are vinyl acetate and methyl acrylate, and the functional monomer is hydroxyethyl acrylate. The mass fractions of isooctyl acrylate: laurate acrylate: vinyl acetate: methyl acrylate: hydroxyethyl acrylate are (49-51): (17-19): (13-15): (11-13): (5-7). Thus, by controlling the composition and ratio of the soft monomers, hard monomers, and functional monomers, the adhesive layer can be cross-linked and cured to have a suitable glass transition temperature and degree of cross-linking, and exhibit good adhesion to the substrate layer.
[0059] In some embodiments of this application, the soft monomers are isooctyl acrylate and butyl acrylate, the hard monomers are methyl methacrylate and cyclohexyl methacrylate, and the functional monomers are methacrylic acid and hydroxyethyl acrylate. The mass fractions of isooctyl acrylate: butyl acrylate: methyl methacrylate: cyclohexyl methacrylate: methacrylic acid: hydroxyethyl acrylate are (51-53): (9-11): (19-21): (9-11): (3-5): (3-5). Thus, by controlling the composition and ratio of the soft monomers, hard monomers, and functional monomers, the adhesive layer, after crosslinking and curing, can have a suitable glass transition temperature and degree of crosslinking, and exhibit good adhesion to the substrate layer.
[0060] In some embodiments of this application, the raw materials for preparing the polyacrylate resin also include a solvent. Further, by mass, the solvent to monomer ratio is (40-70):(30-60). This allows for a suitable reaction rate of the monomer during the preparation of the polyacrylate resin, resulting in a narrow molecular weight distribution and a suitable molecular weight of the prepared polyacrylate resin. It should be noted that if the solvent content is too high, it can easily lead to a lower reaction rate of the monomer and may increase the molecular weight distribution width of the polyacrylate resin, thus reducing its molecular weight; if the solvent content is too low, it is detrimental to heat transfer and can easily cause reaction gelation.
[0061] For example, the solvent is at least one of ethyl acetate and toluene; the initiator is at least one of azobisisobutyronitrile and benzoyl peroxide.
[0062] In some embodiments of this application, the raw materials for preparing the polyacrylate resin also include an initiator. Further, the initiator-to-monomer ratio, calculated by mass, is 0.05% to 0.5%. This is beneficial for the reaction stability of the synthetic monomer, resulting in a polyacrylate resin with a suitable molecular weight. Exemplarily, the initiator-to-monomer ratio is 0.05%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, or any value between any two of the above.
[0063] For example, the initiator is at least one of azobisisobutyronitrile and benzoyl peroxide.
[0064] This application also provides a method for preparing polyacrylate resin, which includes the following steps:
[0065] Under S110 nitrogen protection, add 5-40% of the synthetic monomer and 1.5-2.5 times its mass of solvent to the reaction flask, heat to 70-75℃, start stirring, and dropwise add 25-50% of the synthetic monomer, 0.5-1.5 times its mass of solvent and 40-70% of the initiator mixture to the reaction flask over a period of 1.5-3 hours. After the addition is complete, keep the reaction at the temperature for 0.5-1.5 hours.
[0066] Heat S120 to 76-80℃, add the remaining synthetic monomer, along with 0.5-1.5 times its mass of solvent and the remaining initiator mixture dropwise to the reaction flask over 2-4 hours. After the addition is complete, maintain the temperature for 0.5-1.5 hours, then heat to 76-90℃ and react for 1.5-2.5 hours. Cool to room temperature, add the remaining solvent, stir until homogeneous, and then discharge the product.
[0067] It should be noted that the weight-average molecular weight of polyacrylate resin can be obtained by controlling the composition of the synthetic monomers, the reaction temperature of the synthetic monomers, the reaction time, etc.
[0068] This application also provides an anti-adhesion tape, which includes an adhesive layer and a substrate layer; wherein the adhesive layer includes the aforementioned resin composition, and the substrate layer includes a plasticizer.
[0069] Exemplarily, the adhesive layer is prepared from the aforementioned resin composition. Exemplarily, the resin composition is formed on a substrate layer to form the adhesive layer by a coating process.
[0070] In some embodiments of this application, the thickness of the adhesive layer is 6 μm to 20 μm. Further, the thickness of the adhesive layer is 8 μm to 15 μm.
[0071] In some embodiments of this application, the mass of the plasticizer in the substrate layer is 17% to 35% of the mass of the substrate layer. Exemplarily, the mass of the plasticizer in the substrate layer is 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, 31%, 32%, 33%, 34%, 35% of the mass of the substrate layer, and any value between any two of the above.
[0072] In some embodiments of this application, the plasticizer includes, but is not limited to, at least one of di(2-ethylhexyl) phthalate, diisononyl phthalate, dibutyl phthalate, diisobutyl phthalate, di(2-ethylhexyl) terephthalate, tri(2-ethylhexyl) trimellitate, n-octyl adipate, n-decyl adipate, diisononyl adipate, and di(2-ethylhexyl) adipate.
[0073] In some embodiments of this application, the plasticizer in the substrate layer includes phthalic plasticizers, and the mass ratio of phthalic plasticizers to the total amount of plasticizers in the substrate layer is less than or equal to 90%. It is important to emphasize that phthalic plasticizers have poor migration resistance. If the content of phthalic plasticizers in the substrate layer is too high, they are prone to migrating into the adhesive layer, causing the adhesive layer to soften and its cohesive energy to decrease. This may lead to a decrease in the adhesion between the pressure-sensitive adhesive layer and the substrate layer, increasing the risk of debonding and consequently increasing the risk of residual adhesive during wafer peeling. The plasticizer migration resistance of the adhesive layer is crucial. Therefore, it is necessary to develop a resin composition with excellent plasticizer migration resistance and mechanical properties.
[0074] In some embodiments of this application, the tensile strength of the substrate layer in the MD direction is 25 MPa to 45 MPa, and the elongation at break in the MD direction is 220%-350%; the tensile strength of the substrate layer in the TD direction is 25 MPa to 35 MPa, and the elongation at break in the TD direction is 240%-400%. Thus, the substrate layer in this application possesses high mechanical properties, which is beneficial for improving the mechanical properties of the anti-adhesion tape in this application.
[0075] It should be noted that in this application, MD (Machine Direction) refers to the direction of mechanical motion, and TD (Transverse Direction) refers to the direction perpendicular to the direction of mechanical motion.
[0076] In some embodiments of this application, the puncture resistance of the substrate layer is 4.5N-7N, and the puncture elongation is 6mm-14mm. This allows the substrate layer in this application to have high puncture resistance, which is beneficial for improving the puncture resistance of the anti-adhesive tape in this application.
[0077] In some embodiments of this application, the substrate layer includes, but is not limited to, a PVC substrate layer.
[0078] In some embodiments of this application, the substrate layer is a substrate layer that has undergone corona treatment. Exemplarily, the corona treatment is performed before coating the substrate layer, and the power of the corona treatment is from 1kW to 4.5kW.
[0079] In some embodiments of this application, the anti-adhesion tape further includes a release film disposed on the side of the adhesive layer opposite to the substrate layer. Further, the release force of the release film is from 1 g / 25 mm to 6 g / 25 mm.
[0080] This application also provides a method for preparing anti-adhesive tape, which includes the following steps:
[0081] S210 provides resin adhesive and substrate film.
[0082] Specifically, the resin solution includes the polyacrylate resin and crosslinking agent described above. The substrate film is used to form the substrate layer described above, and will not be elaborated upon here. For example, the viscosity of the resin solution is between 300 cps and 3000 cps. Further, the viscosity of the resin solution is between 600 cps and 1800 cps. It should be noted that the resin solution may contain an appropriate amount of solvent to adjust its viscosity. For example, the solvent used in the preparation of the polyacrylate resin may be used to adjust the viscosity of the resin solution.
[0083] S220 involves coating a release film with a resin solution, removing the solvent from the resin solution, and then transferring it onto a substrate film to obtain an adhesive tape.
[0084] In some embodiments of this application, the above-mentioned adhesive liquid is uniformly coated onto the release film using a coating machine; the solvent is dried in an oven at a temperature of 60-110°C for 1-3 minutes, and then transferred onto the substrate film to obtain the tape.
[0085] S230 involves curing the prepared tape to obtain a non-stick tape.
[0086] In some embodiments of this application, the tape is placed in an oven for curing at a temperature of 40-70°C for 36-80 hours. Once curing is complete, the anti-adhesion tape is obtained.
[0087] Example 1
[0088] The raw materials for preparing polyacrylate resin are as follows:
[0089] Synthetic monomers: by mass, 72 parts butyl acrylate, 10 parts ethyl methacrylate, 10 parts isobornyl acrylate, 3 parts acrylonitrile, 3 parts acrylic acid, and 2 parts hydroxyethyl acrylate.
[0090] Solvent: 150 parts ethyl acetate.
[0091] Initiator: 0.2 parts azobisisobutyronitrile.
[0092] (1) The preparation of polyacrylate resin includes the following steps:
[0093] a. Under nitrogen protection, add 30% of the synthetic monomer (all synthetic monomers and solvents are mixed beforehand) and twice the amount of solvent by mass to the reaction flask, heat to 75°C, start stirring, and dropwise add 35% of the synthetic monomer, once the amount of solvent by mass and 50% of the initiator mixture to the reaction flask over a period of 2 hours. After the addition is complete, keep the reaction at this temperature for 1.5 hours.
[0094] b. Heat to 78°C, add the remaining synthetic monomer, its solvent and remaining initiator mixture (1 times its mass) dropwise to the reaction flask over 3 hours. After the addition is complete, keep the temperature at 78°C for 1 hour, then heat to 80°C for 2 hours. Cool to room temperature, add the remaining solvent, stir well, and then discharge the product.
[0095] (2) The preparation of the anti-adhesion tape includes the following steps:
[0096] c. Add 50 parts of polyacrylate resin and 2 parts of thermal crosslinking agent (1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, epoxy equivalent 150 g / mol) to a container, stir evenly, let stand to defoam, and obtain the adhesive solution.
[0097] d. Use a coating machine to evenly coat the above adhesive solution onto the release film; place it in an oven to dry the solvent at 100°C for 1 minute, and then transfer it onto the substrate film (i.e., the substrate layer, in which the plasticizers are diisononyl adipate and di(2-ethylhexyl) phthalate, and the mass ratio of diisononyl adipate to di(2-ethylhexyl) phthalate is 70:30) to obtain the tape;
[0098] e. Place the tape in an oven to cure at 45°C for 76 hours. Once curing is complete, the tape for wafer dicing is obtained.
[0099] Example 2
[0100] The raw materials for preparing polyacrylate resin are as follows:
[0101] Synthetic monomers: 50 parts isooctyl acrylate, 18 parts laurate acrylate, 14 parts vinyl acetate, 12 parts methyl acrylate, and 6 parts hydroxyethyl acrylate.
[0102] Solvent: 135 parts ethyl acetate.
[0103] Initiator: 0.25 parts benzoyl peroxide.
[0104] (1) The preparation of polyacrylate resin includes the following steps:
[0105] a. Under nitrogen protection, add 10% of the synthetic monomer and 1.5 times its mass of solvent to the reaction flask, heat to 72°C, start stirring, and dropwise add 50% of the synthetic monomer, 0.8 times its mass of solvent and 60% of the initiator mixture to the reaction flask over 3 hours. After the addition is complete, keep the reaction at the temperature for 1 hour.
[0106] b. Heat to 80℃, add the remaining synthetic monomer, 1.2 times its mass of solvent and the remaining initiator mixture dropwise to the reaction flask, the dropwise addition time is 4h, after the dropwise addition is complete, keep the temperature for 0.5h, then heat to 82℃ and react for 1.5h, cool to room temperature, add the remaining solvent, stir evenly and then discharge the material.
[0107] (2) The preparation of the tape includes the following steps:
[0108] c. Add 50 parts of polyacrylate resin and 2.5 parts of thermal crosslinking agent (IPDI polymer, -NCO value 15%) to a container, stir evenly, let stand to defoam, and obtain the adhesive solution.
[0109] d. Use a coating machine to evenly coat the above adhesive solution onto the release film; place it in an oven to dry the solvent at 80°C for 2 minutes, and then transfer it onto the substrate film (the plasticizers include di(2-ethylhexyl) phthalate and diisooctyl adipate, with a mass ratio of di(2-ethylhexyl) phthalate to diisooctyl adipate of 80:20) to obtain the anti-tack tape;
[0110] e. Place the tape in an oven to cure at 55°C for 68 hours. Once curing is complete, the tape for wafer dicing is obtained.
[0111] Example 3
[0112] The raw materials for preparing polyacrylate resin are as follows:
[0113] Synthetic monomers: 52 parts isooctyl acrylate, 10 parts butyl acrylate, 20 parts methyl methacrylate, 10 parts cyclohexyl methacrylate, 4 parts methacrylic acid, and 4 parts hydroxyethyl acrylate.
[0114] Solvent: 185 parts toluene.
[0115] Initiator: 0.15 parts azobisisobutyronitrile.
[0116] (1) The preparation of polyacrylate resin includes the following steps:
[0117] a. Under nitrogen protection, add 35% of the synthetic monomer and 2.2 times its mass of solvent to the reaction flask, heat to 75°C, start stirring, and add dropwise 40% of the synthetic monomer, 1 times its mass of solvent and 45% of the initiator mixture to the reaction flask over a period of 1.8 hours. After the addition is complete, keep the reaction at the temperature for 0.8 hours.
[0118] b. Heat to 80°C, add the remaining synthetic monomer, 0.6 times its mass of solvent and the remaining initiator mixture dropwise to the reaction flask, over a period of 2.5 hours. After the addition is complete, keep the temperature at 80°C for 1.5 hours, then maintain the temperature at 80°C for another 2.5 hours. Cool to room temperature, add the remaining solvent, stir well, and then discharge the product.
[0119] (2) The preparation of the tape includes the following steps:
[0120] c. Add 50 parts of polyacrylate resin, 3.5 parts of thermal crosslinking agent (1.75 parts of 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, epoxy equivalent 150 g / mol; and 1.75 parts of IPDI polymer, -NCO value 15%) to a container, stir evenly, let stand to defoam, and obtain the adhesive solution.
[0121] d. Use a coating machine to evenly coat the above adhesive solution onto the release film; place it in an oven to dry the solvent at a temperature of 110°C for 2 minutes, and then transfer it onto the substrate film (the plasticizers are di(2-ethylhexyl) terephthalate, diisononyl adipate, and diisooctyl adipate, calculated by mass ratio of di(2-ethylhexyl) terephthalate: diisononyl adipate: diisooctyl adipate = 50:30:20) to obtain the tape.
[0122] e. Place the tape in an oven to cure at 60°C for 48 hours. Once curing is complete, you will obtain a non-stick tape for wafer dicing.
[0123] Example 4
[0124] The difference between this example and Example 1 lies in the following raw materials used to prepare the polyacrylate resin:
[0125] Synthetic monomers: by mass, 65 parts butyl acrylate, 10 parts ethyl methacrylate, 10 parts isobornyl acrylate, 3 parts acrylonitrile, 6 parts acrylic acid, and 6 parts hydroxyethyl acrylate.
[0126] Example 5
[0127] Compared with Example 1, the difference lies in the different synthetic monomers, as detailed below:
[0128] Synthetic monomers: by mass, 75 parts butyl acrylate, 10 parts ethyl methacrylate, 10 parts isobornyl acrylate, 3 parts acrylonitrile, 0.5 parts acrylic acid, and 1.5 parts hydroxyethyl acrylate.
[0129] Example 6
[0130] The difference between this and Example 2 is that the plasticizer in the substrate film is different:
[0131] The plasticizers include di(2-ethylhexyl) phthalate and diisooctyl adipate, with a mass ratio of di(2-ethylhexyl) phthalate to diisooctyl adipate of 89.5:10.5.
[0132] Example 7
[0133] The difference between this and Example 2 is that the plasticizer in the substrate film is different:
[0134] The plasticizers include diisononyl phthalate and diisooctyl adipate, with a mass ratio of diisononyl phthalate to diisooctyl adipate of 80:20.
[0135] Example 8
[0136] The difference between it and Example 3 lies in the different adhesive components:
[0137] Add 50 parts of polyacrylate resin, 2.5 parts of thermal crosslinking agent (1.25 parts of 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, epoxy equivalent 150 g / mol; and 1.25 parts of IPDI polymer, -NCO value 15%) to a container, stir evenly, let stand to defoam, and obtain the adhesive solution.
[0138] Example 9
[0139] The difference between it and Example 1 is that:
[0140] The prepared acrylic resins have different weight-average molecular weights; in this example, the weight-average molecular weight of the acrylic resin is 250 kDa.
[0141] Example 10
[0142] The difference between it and Example 1 is that:
[0143] The prepared acrylic resins have different weight-average molecular weights; in this example, the weight-average molecular weight of the acrylic resin is 1200 kDa.
[0144] Comparative Example 1
[0145] Compared with Example 1, the difference lies in the different synthetic monomers, as detailed below:
[0146] Synthetic monomers: 75.4 parts butyl acrylate, 10 parts ethyl methacrylate, 10 parts isobornyl acrylate, 3 parts acrylonitrile, 1.2 parts acrylic acid, and 0.4 parts hydroxyethyl acrylate.
[0147] Comparative Example 2
[0148] Compared with Example 2, the difference lies in the plasticizer in the substrate film. The plasticizer in Comparative Example 2 includes di(2-ethylhexyl) phthalate and diisooctyl adipate. The mass ratio of di(2-ethylhexyl) phthalate to diisooctyl adipate is 92:8.
[0149] Comparative Example 3
[0150] The difference between this and Example 1 is that the weight-average molecular weight of the prepared polyacrylate resin is 200 kDa.
[0151] Comparative Example 4
[0152] The difference between this and Example 3 is that in the tape preparation step, 2 parts of thermal crosslinking agent are replaced with 2.2 parts (1.1 parts of 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, epoxy equivalent 150 g / mol; and 1.1 parts of IPDI polymer, -NCO value 15%).
[0153] Comparative Example 5
[0154] Compared with Example 1, the difference lies in the different synthetic monomers, as detailed below:
[0155] Synthetic monomers: 64.5 parts butyl acrylate, 10 parts ethyl methacrylate, 10 parts isobornyl acrylate, 3 parts acrylonitrile, 6.5 parts acrylic acid, and 12.5 parts hydroxyethyl acrylate.
[0156] Performance testing
[0157] The polyacrylate resins or anti-adhesion tapes prepared in the above embodiments and comparative examples were subjected to the following performance tests, and the test results are shown in Table 1.
[0158] Tg (glass transition temperature) test: Differential calorimetry was used for detection, with a heating rate of 10℃ / min.
[0159] Weight-average molecular weight determination: Gel permeation chromatography was used for detection, with polystyrene as the standard and tetrahydrofuran as the mobile phase.
[0160] Crosslinking degree test: Take M0 (about 0.5g) of crosslinked cured material, soak it in ethyl acetate for 24h, take the undissolved part, dry it and weigh it to obtain the mass M1, and calculate the quotient (M1 / M0)*100% to obtain the crosslinking degree.
[0161] Peel strength test: The 180° peel strength test was conducted according to GB / T 2792-2014, with a sample size of 25mm × 300mm.
[0162] Plasticizer migration resistance test: Infrared detection of the tape surface was used to observe whether there was an enhancement of the infrared characteristic peak of plasticizer on the tape surface.
[0163] Residual adhesive test: Use a microscope to observe whether there is any residual adhesive on the picked-up chip.
[0164] Cutting test: Cut three wafers and observe under a microscope that the surface damage size of all chips is <30×5μm and the vertical damage size is <15μm, then it is qualified.
[0165] Pickup capability test: If all chips can be successfully picked up without damage or flying material when cutting three wafers, it is considered qualified; otherwise, it is considered unqualified.
[0166] Table 1
[0167]
[0168] Continued from Table 1
[0169]
[0170] As shown in Table 1, the weight-average molecular weight of the polyacrylate resins prepared in Examples 1 to 10 is 250KD-1200KD, the mass ratio of functional monomers to synthetic monomers is 2%-12%, the crosslinking agent can react with the polar groups on the functional monomers to obtain crosslinked cured products; the crosslinked cured products have unreacted polar groups remaining, the degree of crosslinking of the crosslinked cured products is not less than 60%, the glass transition temperature of the crosslinked cured products is -32℃ to -12℃, the mass ratio of phthalic plasticizer to the total amount of plasticizer in the substrate layer is less than or equal to 90%, the crosslinked cured products prepared have good resistance to plasticizer migration, there is no residue after peeling off the anti-adhesion tape, and the cutability or pick-upability is qualified.
[0171] The difference between Examples 1, 5, and 6 and Comparative Examples 1 and 5 lies in the content of the functional monomer as a percentage of the total synthesized monomer. In Examples 1, 5, and 6, the ratio of the functional monomer to the total synthesized monomer is 2%, 5%, and 12%, respectively; in Comparative Example 1, the functional monomer accounts for 1.6% of the total synthesized monomer, and in Comparative Example 5, the functional monomer accounts for 12.5%. The amount of functional monomer added in Comparative Example 1 is significantly reduced compared to Example 1. Figure 1 , Figure 1Example 1 – Initial test after tape curing, test 60 days after tape curing, Comparative Example 1 – Test 60 days after tape curing. It can be seen that the infrared spectrum of the adhesive surface of Example 1 does not show the characteristic infrared absorption peaks of diisononyl adipate near 1600 and 700. The infrared spectrum of the adhesive surface of Comparative Example 1 shows two peaks near 1600 and two peaks near 700, which are the characteristic infrared absorption peaks of diisononyl adipate. This indicates that the cross-linked cured product prepared in Comparative Example 1 has poor resistance to plasticizer migration. The migration of diisononyl adipate in the substrate layer to the adhesive layer leads to a decrease in its cohesive energy, resulting in residual adhesive after peeling. The cutability or pick-up performance of the anti-adhesive tape is unqualified.
[0172] The difference between Examples 2, 6, 7, and Comparative Example 2 lies in the mass content of phthalic plasticizers in the substrate layer. In Examples 2 and 7, the mass content of phthalic plasticizers in the substrate layer is approximately 80%, in Example 6 it is approximately 89.5%, and in Comparative Example 2 the proportion of phthalic plasticizers to the total plasticizer is higher than 90%. This proportion of phthalic plasticizers is too high; please refer to... Figure 2 Example 2 - Initial test was conducted after the tape had fully cured; Example 2 - Test was conducted 60 days after the tape had fully cured; Comparative Example 2 - Test was conducted 60 days after the tape had fully cured. Figure 2 It can be seen that the infrared spectrum of the adhesive surface of Comparative Example 2 shows a characteristic infrared absorption peak of di(2-ethylhexyl) phthalate around 750 nm, while the infrared spectrum of the adhesive surface of Example 2 does not show an obvious characteristic infrared absorption peak of di(2-ethylhexyl) phthalate. This indicates that the cross-linked cured product prepared in Comparative Example 2 has poor resistance to plasticizer migration. The migration of di(2-ethylhexyl) phthalate in the substrate layer to the adhesive layer leads to a decrease in its cohesive energy, resulting in residual adhesive after peeling. The poor cutability or pick-up performance of the anti-adhesive tape leads to poor resistance to plasticizer migration of the cross-linked cured product and residual adhesive after peeling.
[0173] Compared with Comparative Example 3, the polyacrylate resins prepared in Examples 1, 9, and 10 have different weight-average molecular weights. The weight-average molecular weights of the polyacrylate resins prepared in Examples 1, 9, and 10 are approximately 650 KD, 250 KD, and 1200 KD, respectively, while the weight-average molecular weight of the polyacrylate resin prepared in Comparative Example 3 is 200 KD. Because the weight-average molecular weight of the polyacrylate resin is too low, the plasticizer migration resistance of the prepared crosslinked cured product is extremely poor, and there is residual glue after peeling. The cutting or picking properties of the anti-adhesion tape are unqualified. The possible reason is that the weight-average molecular weight of the polyacrylate resin is too small, resulting in poor plasticizer migration resistance.
[0174] Compared with Comparative Example 4, Examples 1 and 9 have different contents of thermal crosslinking agent. In Example 1, the mass fraction of thermal crosslinking agent is 3.5 parts, and the viscosity of the cured product is about 85%. In Example 9, the viscosity of the cured product is about 60%. In Comparative Example 4, the mass fraction of thermal crosslinking agent is 2.2 parts, and the degree of crosslinking is about 55%. Due to the low degree of crosslinking, the crosslinked cured product has extremely poor resistance to plasticizer migration, and there is residual adhesive after peeling. The cutting or picking properties of the anti-adhesion tape are unqualified.
[0175] The technical solutions provided by the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A non-adhesive tape, characterized in that, The device includes a substrate layer and an adhesive layer disposed on the substrate layer. The adhesive layer comprises, by mass, polyacrylate resin and a crosslinking agent. The polyacrylate resin has a weight-average molecular weight of 250 kDa-1200 kDa, and its monomers include soft monomers, hard monomers, and functional monomers. The functional monomers contain polar groups, and their mass percentage is 2%-12% of the total monomers. The crosslinking agent reacts with the polar groups on the functional monomers to obtain a crosslinked cured product. The crosslinked cured product contains unreacted polar groups and has a crosslinking degree greater than or equal to 60%. The mass content of phthalic plasticizers in the substrate layer is less than 90% of the total plasticizer content in the substrate layer.
2. The anti-adhesion tape as described in claim 1, characterized in that, The degree of crosslinking of the crosslinked cured product is 60%-95%; preferably, the degree of crosslinking of the crosslinked cured product is 85%-95%.
3. The anti-adhesion tape as described in claim 1 or 2, characterized in that, The mass ratio of the crosslinking agent to the polyacrylate resin is 0.5%-10%.
4. The anti-adhesion tape as described in claim 1, characterized in that, The crosslinking agent includes isocyanate crosslinking agents; preferably, the isocyanate crosslinking agent has an isocyanate value of 5%-25%; And / or, the crosslinking agent includes an epoxy crosslinking agent, preferably, the epoxy equivalent in the epoxy crosslinking agent is 50 g / mol to 200 g / mol.
5. The anti-adhesion tape as described in claim 1, characterized in that, The glass transition temperature of the cross-linked cured product is -32°C to -12°C.
6. The anti-adhesion tape as described in claim 1, characterized in that, The soft monomer is selected from at least one of butyl acrylate, isooctyl acrylate, n-octyl methacrylate, ethyl acrylate, laurate acrylate, isodecanyl acrylate, and isononyl acrylate. And / or, the hard monomer is selected from at least one of methyl acrylate, methyl methacrylate, ethyl methacrylate, vinyl acetate, acrylonitrile, isobornyl acrylate, isobornyl methacrylate, and cyclohexyl methacrylate; And / or, the functional monomer is selected from at least one of acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, and hydroxyethyl methacrylate.
7. The anti-adhesion tape as described in claim 1, characterized in that, The ratio of the soft monomer to the hard monomer to the functional monomer, calculated by mass ratio, is (60-75):(20-35):(3-12).
8. The anti-adhesion tape as described in claim 1, characterized in that, The raw materials for preparing the polyacrylate resin also include a solvent, wherein, by mass, the solvent to the synthetic monomer is (40-70): (30-60); And / or, the raw materials for preparing the polyacrylate resin further include an initiator, wherein the initiator comprises 0.05% to 0.5% of the synthetic monomer by mass.
9. The anti-adhesion tape as described in claim 1, characterized in that, The soft monomer is butyl acrylate, the hard monomer is ethyl methacrylate, isobornyl acrylate and acrylonitrile, and the functional monomer is acrylic acid and hydroxyethyl acrylate; the mass fraction of butyl acrylate: ethyl methacrylate: isobornyl acrylate: acrylonitrile: acrylic acid: hydroxyethyl acrylate is (71-73): (9-11): (9-11): (2-4): (2-4): (1-3); Alternatively, the soft monomer is isooctyl acrylate and laurate acrylate, the hard monomer is vinyl acetate and methyl acrylate, and the functional monomer is hydroxyethyl acrylate. The mass fractions of isooctyl acrylate: laurate acrylate: vinyl acetate: methyl acrylate: hydroxyethyl acrylate are (49-51): (17-19): (13-15): (11-13): (5-7). Alternatively, the soft monomer is isooctyl acrylate and butyl acrylate, the hard monomer is methyl methacrylate and cyclohexyl methacrylate, and the functional monomer is methacrylic acid and hydroxyethyl acrylate. The mass fractions of isooctyl acrylate: butyl acrylate: methyl methacrylate: cyclohexyl methacrylate: methacrylic acid: hydroxyethyl acrylate are (51-53): (9-11): (19-21): (9-11): (3-5): (3-5).
10. The anti-adhesion tape as described in claim 1, characterized in that, The substrate layer includes a PVC substrate layer; And / or, the substrate layer includes a plasticizer, the plasticizer comprising 17% to 35% of the mass of the substrate layer; And / or, the tensile strength of the substrate layer in the MD direction is 25 MPa to 45 MPa; And / or, the elongation at break in the MD direction of the substrate layer is 220% to 350%; And / or, the tensile strength of the substrate layer in the TD direction is 25 MPa to 35 MPa; And / or, the elongation at break in the TD direction of the substrate layer is 240% to 400%; And / or, the puncture resistance of the substrate layer is 4.5N to 7N; And / or, the puncture elongation of the substrate layer is 6 mm to 14 mm; And / or, the substrate layer is a corona-treated substrate layer.