Lens module
By using flip-chip technology and mold forming technology to set sensor chips on ceramic substrates and integrating the lens barrel with the holder, the problem of making the lens module thinner was solved, and the size of the camera device was reduced while the components were protected.
Patent Information
- Application Number
- CN202410609462.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2025-11-25
Smart Images
Figure CN121012980A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a camera device, in particular to a miniaturized lens module. BACKGROUND
[0002] With the development of camera technology, lens modules are widely used in various camera devices. The combination of lens modules and various portable electronic devices such as mobile phones and computers is favored by many consumers.
[0003] A lens module generally includes a lens barrel and optical elements accommodated in the lens barrel. In a configuration in which a sensor base, an image sensor, and electronic elements occupy the same area of a surface of the sensor base, the size of the X-axis and Y-axis of the overall lens module is limited in reduction, which is not conducive to the development trend of thin and light electronic devices. SUMMARY
[0004] The present application aims to provide a lens module that is integrated by different processes to change the structure and achieve size reduction.
[0005] To achieve the above-mentioned purpose, the present application provides a lens module, which includes a sensor assembly, a package, a filter, and a lens assembly. The sensor assembly includes a sensor chip and a substrate, and the sensor chip is disposed on the substrate. The package includes a package bottom and a light-transmitting portion, and the package bottom extends to the light-transmitting portion and overlaps the substrate. The filter corresponds to the light-transmitting portion, and the filter is disposed on the substrate and faces the sensor chip. The lens assembly is disposed on the package.
[0006] Optionally, the light-transmitting portion penetrates two opposite sides of the package, the package includes a flange, the flange is adjacent to the light-transmitting portion and extends towards the light-transmitting portion. The filter is disposed between the flange and the substrate, and the flange covers the edge of the filter.
[0007] Optionally, the substrate includes a first side and a second side disposed opposite to each other, and a hollow portion, the hollow portion is disposed corresponding to the filter and penetrates the first side and the second side, and the sensor chip is disposed adjacent to the hollow portion, and the edge of the sensor chip is connected to the first side of the substrate.
[0008] Optionally, the package and the filter are respectively disposed on the second side of the substrate, and the hollow portion is between the filter and the sensor chip.
[0009] Optionally, the substrate includes a stepped portion, the stepped portion is concave from the direction of the first side to the second side, and adjacent to the hollow portion, and the edge of the sensor chip is disposed in the stepped portion.
[0010] Optionally, the sensor assembly includes an electronic element, the electronic element is disposed on the substrate, and the package covers the electronic element.
[0011] Optionally, the lens assembly is disposed on the package and includes a lens barrel and a driving element, and the lens barrel is movably connected to the driving element.
[0012] The application further provides a lens module, which includes a sensor assembly, a package, a filter, and a lens assembly. The sensor assembly includes a sensor chip and a substrate, and the sensor chip is disposed on the substrate. The package is disposed on the substrate, the filter is disposed on the substrate and faces the sensor chip, and the lens assembly is disposed on the package. The lens assembly includes a lens barrel and a driving element, the lens barrel includes a holding member disposed on a side wall of the lens barrel, the driving element includes an actuator, the holding member is held by the actuator, and the actuator is driven by the driving element and drives the lens barrel to move.
[0013] Optionally, the holding member protrudes from the side wall of the lens barrel and extends toward the actuator of the driving element.
[0014] Optionally, a part of the holding member is engaged with the actuator of the driving element.
[0015] In the lens module of the application, the sensor chip is disposed on the substrate of ceramic material by flip chip technology, so that a signal transmission path directly through the sensor chip and the substrate is formed, and the area space required for connecting the traditional horizontal gold wire and the connection point of the substrate is reduced. Secondly, the package is stacked on the substrate by a mold forming process to directly cover the elements on the substrate, which reduces the assembly avoidance space required by the traditional sensor base and electronic elements, achieves the purpose of reducing the size of the X axis and Y axis of the substrate, and provides better protection for the covered elements. Furthermore, the lens barrel and the holding member are integrated, which avoids the use of a traditional additional carrier, reduces the thickness space of the driving element, further reduces the size of the X axis and Y axis of the entire lens module, and thus achieves the purpose of reducing the size of the lens module. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is a perspective assembly diagram of the lens module of the application.
[0017] Figure 2 It is a perspective assembly diagram of the lens module of the application. Figure 1
[0018] Figure 3 A schematic diagram of an assembly process of the lens module of the embodiment of the present application.
[0019] Figure 4 A top view schematic diagram of the lens module of the embodiment of the present application. Figure 1
[0020] Figure 5 A partial sectional view schematic diagram of the A-A line section of the lens module of the embodiment of the present application. Figure 4
[0021] Figure 6 Another partial sectional view schematic diagram of the A-A line section of the lens module of the embodiment of the present application. Figure 4
[0022] Figure 7 A partial perspective view schematic diagram of the lens module of the embodiment of the present application. Figure 1
[0023] Figure 8 A perspective view schematic diagram of the lens module of the embodiment of the present application.
[0024] Figure 9 A perspective sectional view schematic diagram of the A-A line section of the lens module of the embodiment of the present application. Figure 4
[0025] Figure 10 A partial sectional view schematic diagram of the lens module of another embodiment of the present application. DETAILED DESCRIPTION
[0026] In order to facilitate the understanding of the technical features, contents and advantages of the present application and the effects that can be achieved, the present application is described in detail below in the form of embodiments with reference to the accompanying drawings, whose purpose is only to illustrate and assist in the description, and not necessarily the true proportions and accurate configurations after the implementation of the present application, so the proportions and configuration relationships of the drawings should not be interpreted to limit the scope of the rights of the present application in actual implementation.
[0027] The following description of the embodiments is made with reference to the drawings, which are used to illustrate specific embodiments that can be used to implement the present application. The directional terms mentioned in the present application, such as "up", "down", "front", "back", "left", "right", "top", "bottom", "horizontal", "vertical", etc. are only with reference to the direction of the drawings. Therefore, the directional terms used are used to illustrate and understand the present application, and not to limit the present application. In the entire specification and claims, unless the content clearly specifies, the meaning of "one" and "said" includes such a statement that includes "one or at least one" of the elements or components. In addition, as used in the present application, unless it is clear from the specific context that a plurality of exclusions are excluded, the singular pronoun also includes the statement of a plurality of elements or components.
[0028] The following will refer to the relevant drawings, the embodiments of the present application will be described, for ease of understanding, the same elements in the following embodiments are described with the same symbol. It should be noted that the combination of various elements in the present application preferably forms the above-mentioned embodiments, but this should not be interpreted as a limitation of the present application, i.e. various elements in the present application can also have more combination ways, not limited to the above-mentioned embodiments.
[0029] The present application provides a lens module which can be applied to a camera module built in an electronic device such as a smart phone, a tablet computer or a notebook computer. Referring to Figure 1 and Figure 2 , Figure 1 is a perspective combination diagram of the lens module of the embodiments of the present application, Figure 2 is Figure 1 a perspective exploded diagram of the lens module. As shown in Figure 1 and Figure 2 , the lens module 1 provided by the embodiments of the present application includes a sensor assembly 10, a package 20, a filter 30 and a lens assembly 40. The sensor assembly 10 includes a sensor chip 11 and a substrate 12, and the sensor chip 11 is arranged on the substrate 12 for collecting incident light and generating image signals. In some embodiments, the substrate 12 is a circuit board formed of ceramic material. Exemplarily, the substrate 12 is a multilayer ceramic substrate, and the substrate 12 includes oppositely arranged first and second sides 121 and 122, and a hollow part 120, and a plurality of electronic elements 124 (for example, capacitors or resistors) are arranged on the second side 122 of the substrate 12. Specifically, the first side 121 is below the second side 122, the hollow part 120 is arranged corresponding to the filter 30 and penetrates the first and second sides 121 and 122, thereby forming a substrate 12 with an open structure.
[0030] It is worth mentioning that the ceramic substrate has good processability and strength characteristics, and it is easy to form an open-shaped hollow part 120 in the middle, and the size of the hollow part 120 only needs to be in the size range that allows the visible area of the sensor chip 11 to sense the image and not to block the light path. In this embodiment, as shown in Figure 2 , the sensor chip 11 is arranged on the first side 121 of the substrate 12, adjacent to the hollow part 120, and the edge part 111 of the sensor chip 11 is connected to the first side 121 of the substrate 12, so that the sensor chip 11 senses the light from the lens through the hollow part 120. Such a design configuration allows the placement position of the passive components (such as electronic elements) on the substrate 12 to be concentrated close to the middle of the substrate 12, thereby reducing the size of the X and Y axes of the substrate 12.
[0031] Continuing to refer to Figure 1 and Figure 2The package 20 includes a package bottom 21, a light-transmitting portion 22, and a flange 23. Specifically, the light-transmitting portion 22 penetrates through opposite sides of the package 20, the flange 23 is adjacent to and extends toward the light-transmitting portion 22, and the package bottom 21 extends to the light-transmitting portion 22. The optical filter 30 is disposed on the substrate 12 corresponding to the light-transmitting portion 22 and faces the sensor chip 11. The lens assembly 40 is disposed on the package 20.
[0032] Referring to Figure 3 , Figure 3 FIG. 1 is a schematic diagram of an assembled lens module 1 according to an embodiment of the present disclosure. As shown in FIG. 1, the lens module 1 includes a substrate 12, a sensor chip 11, an optical filter 30, a package 20, and a lens assembly 40. The substrate 12 has a first side 121 and a second side 122 opposite to the first side 121. The sensor chip 11 is disposed on the first side 121 of the substrate 12. The optical filter 30 is disposed on the substrate 12 and faces the sensor chip 11. The package 20 is disposed on the substrate 12 and covers the sensor chip 11. The lens assembly 40 is disposed on the package 20 and faces the sensor chip 11. Figure 3 The assembly process of the lens module 1 according to an embodiment of the present disclosure is shown in FIG. 2. As shown in FIG. 2, the assembly from the top left corner in the arrow direction mainly includes six steps, which are step S11, forming a hollow portion 120 on the substrate 12; step S12, disposing the optical filter 30 on the substrate 12 and corresponding to the hollow portion 120; step S13, fixing the sensor chip 11 on the substrate 12 by flip chip process; step S14, packaging the package 20 on the substrate 12 and one side of the optical filter 30 by low pressure molding process (LPM) and exposing the optical filter 30; step S15, assembling the connector assembly 50; and step S16, mounting the lens assembly 40. It should be noted that the order of the steps is not limited to this, and the order can be changed according to actual needs.
[0033] It is particularly pointed out that in the embodiment of the present disclosure, the coupling and electrical connection between the substrate 12 and the sensor chip 11 can be realized by flip chip process, for example. Flip chip process is a process of using conductive solder or conductive adhesive and other conductive components to realize electrical connection when the sensor chip 11 is installed on the first side 121 of the substrate 12. In some embodiments, the conductive adhesive can be anisotropic conductive film (ACF), for example. Flip chip process refers to a process of forming conductive bumps on the chip without using wiring bonding, and then making the conductive bumps contact the substrate to connect the chip to the circuit of the substrate. Flip chip process has a simpler structure and a thinner coupling area compared to surface mount technology (SMT) process. Since flip chip connection process is a known technology, additional description thereof is omitted. In detail, the sensor chip 11 of the embodiment of the present disclosure is packaged by flip chip process, and its contact points are linked with signals on the substrate 11, which makes the signals straight through up and down, and reduces the area space required for horizontal wire bonding and connection of the connection points with the substrate when the conventional chip on board (COB) process is used.
[0034] Referring to Figure 4 to Figure 7 and cooperating Figure 2 , Figure 4 FIG. 3 is a top view of the lens module 1 of Figure 1 FIG. 4 is a partial perspective sectional view of the A-A line segment of Figure 5 FIG. 5 is a partial perspective sectional view of the B-B line segment of Figure 4 the lens module 1 of FIG. 1.Figure 6 for Figure 4 Another partial cross-sectional diagram of line segment AA and Figure 7 for Figure 1 A partial three-dimensional schematic diagram of lens module 1. (See attached diagram.) Figure 5 As shown, the sensor chip 11 and the filter 30 are respectively disposed on a first side 121 and a second side 122 opposite to each other on the substrate 12, and a cutout 120 is provided between them. Specifically, the filter 30 can filter light within a specific wavelength range that passes directly through the lens barrel, and light that has passed through the filter 30 can be incident on the sensor chip 11 disposed below the cutout 120. In some embodiments, the filter 30 can be an infrared filter to prevent infrared light from incident on the sensor chip 11. In other embodiments, the filter 30 can be a blue light filter.
[0035] like Figure 5 As shown, the connector assembly 50 includes a ribbon cable element 51, a reinforcing plate 52, and a connector 53. Exemplarily, the reinforcing plate 52 may be attached to the lower portion of the ribbon cable element 51 and located on a first side 121 of the substrate 12 to improve the strength of the ribbon cable element 51. In some embodiments, the ribbon cable element 51 may be a flexible circuit board or a rigid-flex printed circuit board. Furthermore, the connector 53 is disposed at one end of the ribbon cable element 51 for electrical connection to the motherboard (not shown) of an electronic device.
[0036] Continue to refer to Figure 5 and Figure 6 ,like Figure 5 As shown, the substrate 12 includes a stepped portion 123, which is recessed inward from the first side 121 toward the second side 122 and adjacent to the cutout portion 120. The edge 111 of the sensor chip 11 is disposed within the stepped portion 123. Figure 6 As shown, the bottom 21 of the package 20 is stacked on the substrate 12, and the flange 23 of the package 20 covers the edge 31 of the filter 30, so that the filter 30 is disposed between the flange 23 and the substrate 12. It is worth noting that this application uses, for example, a low-pressure molding process to fill a mold with a plastic (PA) material with a Shore hardness of D70 to form a package 20 stacked on the substrate 12, so as to directly encapsulate the component. This reduces the assembly clearance space required between the traditional sensor base and the electronic component, and the material filling method achieves the minimum encapsulation thickness. It is thinner than the wall thickness of the traditional sensor base, thereby reducing the size of the substrate 12 in the X and Y axes. Furthermore, the formed package 20 can effectively protect the encapsulated electronic component.
[0037] Reference Figure 8 and Figure 9 and cooperate Figure 1 , Figure 8Fig. 1 is a perspective view of a lens module according to an embodiment of the present application. Figure 9 Fig. 2 is a perspective view of a lens module according to another embodiment of the present application. Figure 4 Fig. 3 is a sectional view of the lens module of Fig. 2 taken along the A-A line. Figure 8 Fig. 4 is a perspective view of a lens module according to another embodiment of the present application. Figure 9 Fig. 5 is a sectional view of the lens module of Fig. 4 taken along the A-A line. Figure 8 Fig. 6 is a perspective view of a lens module according to another embodiment of the present application. Figure 9 Fig. 7 is a sectional view of the lens module of Fig. 6 taken along the A-A line. Fig. 8 is a perspective view of a lens module according to another embodiment of the present application.
[0038] Fig. 9 is a sectional view of the lens module of Fig. 8 taken along the A-A line. Figure 10 Fig. 10 is a perspective view of a lens module according to another embodiment of the present application. Figure 10 Fig. 11 is a sectional view of the lens module of Fig. 10 taken along the A-A line. Figure 10 Fig. 12 is a perspective view of a lens module according to another embodiment of the present application. Figure 1 to Figure 6 Fig. 13 is a sectional view of the lens module of Fig. 12 taken along the A-A line. Figure 10 Fig. 14 is a perspective view of a lens module according to another embodiment of the present application. Fig. 15 is a sectional view of the lens module of Fig. 14 taken along the A-A line.
[0039] Fig. 16 is a perspective view of a lens module according to another embodiment of the present application.In summary, the sensor chip is arranged on the substrate of ceramic material by flip chip process, so that the signal transmission path is formed between the sensor chip and the substrate, and the area space required by the traditional horizontal gold wire and the connection of the joint point with the substrate is reduced. Secondly, the package is stacked on the substrate by mold forming process to directly cover the elements on the substrate, which reduces the assembly avoidance space required by the traditional sensor base and electronic elements, achieves the purpose of reducing the size of the X-axis and Y-axis of the substrate, and better protects the covered elements. Furthermore, the lens barrel and the retaining member are integrated, avoiding the use of traditional additional packages, reducing the thickness of the carrier of the driving element, and further reducing the size of the X-axis and Y-axis of the entire lens module, thereby achieving the purpose of reducing the size of the lens module.
[0040] The embodiments of the present application are described in detail above, and the specific examples are applied to explain the principles and implementation modes of the present application. The above description of the embodiments is only used to help understand the technical solutions and core ideas of the present application; those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A lens module, comprising: A sensor assembly includes a sensor chip and a substrate, wherein the sensor chip is disposed on the substrate; The package includes a package bottom and a light-transmitting portion, wherein the package bottom extends to the light-transmitting portion and is stacked on the substrate; A filter, corresponding to the light-transmitting portion, is disposed on the substrate and faces the sensor chip; as well as A lens assembly is mounted on the package.
2. The lens module as described in claim 1, characterized in that, The light-transmitting portion penetrates two opposite sides of the package, the package includes a flange, the flange is adjacent to the light-transmitting portion and extends toward the light-transmitting portion, wherein the filter is disposed between the flange and the substrate, and the flange covers the edge of the filter.
3. The lens module as described in claim 1, characterized in that, The substrate includes a first side and a second side disposed opposite to each other, and a cutout portion. The cutout portion is disposed corresponding to the filter and penetrates the first side and the second side. The sensor chip is disposed adjacent to the cutout portion, and the edge of the sensor chip is connected to the first side of the substrate.
4. The lens module as described in claim 3, characterized in that, The package and the filter are respectively disposed on the second side of the substrate, and the cutout portion is between the filter and the sensor chip.
5. The lens module as described in claim 4, characterized in that, The substrate includes a stepped portion that is recessed inward from the first side toward the second side and adjacent to the cutout portion, and the edge of the sensor chip is disposed within the stepped portion.
6. The lens module as described in claim 1, characterized in that, The sensor assembly includes electronic components disposed on the substrate, and the package covers the electronic components.
7. The lens module as described in claim 1, characterized in that, The lens assembly is disposed on the package and includes a lens barrel and a driving element, wherein the lens barrel is movably connected to the driving element.
8. A lens module, comprising: A sensor assembly includes a sensor chip and a substrate, wherein the sensor chip is disposed on the substrate; The package is disposed on the substrate; A filter is disposed on the substrate and faces the sensor chip; as well as A lens assembly is disposed on the package and includes a lens barrel and a driving element. The lens barrel includes a retainer disposed on the side wall of the lens barrel, and the driving element includes an actuator, wherein the retainer is fixed to the actuator, and the actuator is driven by the driving element to move the lens barrel.
9. The lens module as described in claim 8, characterized in that, The mirror holder protrudes from the side wall of the mirror barrel and extends toward the actuator of the drive element.
10. The lens module as described in claim 8, characterized in that, A portion of the retaining member engages with the actuator of the driving element.