Intracranial brain electrode resistance testing equipment
By designing an intracranial brain electrode resistance testing device, a circuit is formed by a docking module and a resistance testing motherboard. Combined with metal detection components and spring pins to ensure contact, the problem of cumbersome and time-consuming multi-channel resistance testing is solved, and efficient and accurate resistance value measurement is achieved.
Patent Information
- Application Number
- CN202511301700.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-12
- Publication Date
- 2025-12-05
AI Technical Summary
In the existing technology, the resistance value test of multi-channel intracranial brain electrodes is cumbersome, time-consuming and labor-intensive, and manual testing is prone to inaccurate resistance values.
An intracranial brain electrode resistance testing device was designed, including a first testing device and a second testing device. The first testing device is fixedly connected to the electrode contacts and connection terminals through a docking module. Combined with the resistance testing motherboard, a circuit is formed to quickly measure the multi-channel resistance value. Metal detection components and spring pins are used to ensure complete contact and reduce manual operation.
It enables convenient and accurate multi-channel resistance testing, reduces labor costs, improves testing efficiency, and ensures the accuracy of resistance values.
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Figure CN121069022A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of medical devices, more particularly, to an intracranial brain electrode resistance testing device. BACKGROUND
[0002] The intracranial brain electrode is mainly used for monitoring abnormal discharge of epilepsy in deep brain designated parts and positioning lesions. Before the operation, stereotactic positioning is needed to define the path of electrode implantation to reach the preset position and avoid brain blood vessels. The stereotactic positioning adopts a visualization method such as X-ray, angiography, and nuclear magnetic resonance imaging. After the electrode is implanted through the operation, the electroencephalogram cable is connected to the electroencephalograph, the electroencephalogram change is observed, the brain area with abnormal electroencephalogram change is recorded, and thus the lesion point is analyzed. The intracranial brain electrode includes an electrode contact part, a catheter part, and a connection terminal part. The intracranial brain electrode needs to ensure that each connection terminal channel is connected to the electrode contact.
[0003] However, since the multi-channel intracranial brain electrode is a non-standard part, there is no professional device on the market for testing the multi-channel resistance value of the electrode. At present, it still needs to rely on manual testing of the resistance value of each channel by using a multimeter. If the resistance value of each channel of the multi-channel intracranial brain electrode produced in large quantities is tested one by one, it will be very time-consuming and labor-intensive, the labor cost will be high, the testing process will be more complicated, and there will be problems such as inaccurate measured resistance value due to incomplete contact. SUMMARY
[0004] One purpose of the present application is to provide an intracranial brain electrode resistance testing device, which can at least solve the technical problems of the prior art that the use of a multimeter to test the multi-channel resistance value of the intracranial brain electrode is more complicated and time-consuming.
[0005] In order to achieve the above purpose, the present application provides the following technical solutions.
[0006] The intracranial brain electrode resistance testing device according to the first aspect of the present application is applied to test the multi-channel resistance value of the intracranial brain electrode. The intracranial brain electrode to be tested includes a front-end electrode part and a connection port. The device includes: a first testing device for fixedly connecting at least one electrode contact on the front-end electrode part; a second testing device including a docking module for fixedly connecting a plurality of connection terminals in the connection port through the docking module; and a resistance testing mainboard, to which the first testing device and the second testing device are respectively connected through a first wire. The resistance testing mainboard includes an access device interface. The access device interface corresponding to the first testing device and the access device interface corresponding to the second testing device are respectively connected to an external resistance tester and form a path, so that the resistance tester displays the multi-channel resistance value of the intracranial brain electrode to be tested.
[0007] Optionally, the first testing device comprises a mounting bottom plate, a mounting top plate and a mounting base plate vertically arranged on the mounting bottom plate, and a pressing upper plate and a pressing lower plate are arranged between the mounting top plate and the mounting bottom plate, and the pressing lower plate is fixedly connected with the mounting bottom plate.
[0008] Optionally, both sides of the mounting top plate, the mounting bottom plate and the pressing upper plate are provided with corresponding mounting hole positions, and the first testing device further comprises two guide rods and two linear bearings, the guide rods pass through the mounting hole positions on one side of the pressing upper plate and are fixedly arranged on a single linear bearing below the pressing upper plate, and the two ends of the guide rods are fixedly connected with the mounting hole positions on the corresponding sides of the mounting top plate and the mounting bottom plate.
[0009] Optionally, the mounting base plate is fixedly provided with a mounting member, a fixing seat, a lifting handle connected with the mounting member, a crank connected with the lifting handle, and a linkage push rod connected with the crank, the fixing seat comprises a bending member and a sleeve, the sleeve passes through a through hole on the upper surface of the mounting top plate, the linkage push rod extends into the sleeve and is connected with a mounting piece fixedly arranged on one side of the pressing upper plate facing the mounting top plate, so that the pressing upper plate slides up and down along the guide rods under the driving of the lifting handle.
[0010] Optionally, one side of the pressing lower plate facing the pressing upper plate is provided with a boss, one side of the boss facing the guide rod is provided with an electrode penetration hole, and the side of the boss away from the mounting base plate is provided with an accommodation space, a plurality of metal detection members are arranged in the accommodation space, and the metal detection members are in contact with each electrode contact extending into the electrode penetration hole; and / or one side of the pressing upper plate facing the mounting bottom plate is provided with a plurality of spring needles, the spring needles are in contact with each electrode contact extending into the electrode penetration hole when the pressing upper plate and the pressing lower plate are pressed against each other, and the arrangement gap between each metal detection member or spring needle is consistent with the arrangement gap between each electrode contact.
[0011] Optionally, the pressing upper plate is provided with an accommodation space and an electric signal acquisition mainboard, the electric signal acquisition mainboard is electrically connected with the spring needles, one side of the pressing upper plate facing the mounting top plate is provided with a first socket, the first socket is electrically connected with the electric signal acquisition mainboard, the bottom surface of the mounting bottom plate is provided with a second socket, the second socket is electrically connected with the metal detection members, and the first socket and the second socket are connected through a second wire.
[0012] Optionally, the spring needles and the metal detection members are gold-plated copper members.
[0013] Optionally, the second testing device further comprises a bottom plate, and a docking module is arranged on the bottom plate, the docking module comprises a docking socket, a docking socket matched with the connecting port and a quick pop-up assembly, the docking socket is arranged at one end of the docking module, and the docking socket and the quick pop-up assembly are arranged at the other end.
[0014] Optionally, the two sides of the socket are provided with a groove and a first extension, the quick ejection assembly includes a push rod and a shovel component connected with the push rod, a spring member is arranged between the push rod and the first extension, and the shovel component is slidable in the groove.
[0015] Optionally, the front end of the shovel head of the shovel component is in a slope shape.
[0016] The intracranial brain electrode resistance test device 1000 of the application realizes convenient and effective multi-channel resistance test of the intracranial brain electrode. The resistance values of all channels in the intracranial brain electrode can be quickly measured by only one-time two-end connection, which is very convenient, fast, accurate, efficient, and can be adapted to different models of intracranial brain electrodes and test the multi-channel resistance values by only adjusting the arrangement parameters of the metal detection member and the spring member. The upper pressing plate and the lower pressing plate are respectively provided with detection members, which double guarantee the complete contact of the electrode contacts of the intracranial brain electrode, greatly improve the stability of the multi-channel resistance test, greatly reduce the labor cost, save the complicated test operation process, and do not need to manually connect and test each channel in the intracranial brain electrode, which greatly improves the test efficiency and solves the problem of inaccurate electrode channel resistance value caused by incomplete contact with the electrode contact when the multi-channel resistance value is tested by using a multimeter.
[0017] Other features and advantages of the application will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0018] The accompanying drawings incorporated in and forming a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.
[0019] Figure 1 FIG. 1 is a structural schematic diagram of an intracranial brain electrode resistance test device according to an embodiment of the application;
[0020] Figure 2 FIG. 2 is a schematic diagram of an intracranial brain electrode resistance test device according to an embodiment of the application;
[0021] Figure 3 FIG. 3 is a schematic diagram of a first test device of an intracranial brain electrode resistance test device according to another embodiment of the application;
[0022] Figure 4 FIG. 4 is a schematic diagram of a first test device of an intracranial brain electrode resistance test device according to another embodiment of the application;
[0023] Figure 5 FIG. 5 is a schematic diagram of a first test device of an intracranial brain electrode resistance test device according to another embodiment of the application;
[0024] Figure 6 schematic diagram of a first testing device of an intracranial brain electrode resistance testing apparatus according to another embodiment of the present application;
[0025] Figure 7 schematic diagram of a second testing device of an intracranial brain electrode resistance testing apparatus according to another embodiment of the present application;
[0026] Figure 8 schematic diagram of a second testing device of an intracranial brain electrode resistance testing apparatus according to another embodiment of the present application;
[0027] Figure 9 schematic diagram of a second testing device of an intracranial brain electrode resistance testing apparatus according to another embodiment of the present application;
[0028] Figure 10 schematic diagram of a second testing device of an intracranial brain electrode resistance testing apparatus according to another embodiment of the present application;
[0029] Figure 11 schematic diagram of a second testing device of an intracranial brain electrode resistance testing apparatus according to another embodiment of the present application; Figure 10
[0030] Figure 12 schematic diagram of a first testing device of an intracranial brain electrode resistance testing apparatus according to another embodiment of the present application;
[0031] Figure 13 schematic diagram of a first testing device of an intracranial brain electrode resistance testing apparatus according to another embodiment of the present application;
[0032] Figure 14 schematic diagram of a first testing device of an intracranial brain electrode resistance testing apparatus according to another embodiment of the present application.
[0033] Reference Signs:
[0034] front end electrode piece 10; electrode contact 11; connection port 12;
[0035] intracranial brain electrode resistance testing apparatus 1000;
[0036] First testing device 100; first cable 101; mounting bottom plate 102; mounting top plate 103; mounting base plate 104; mounting member 105; fixing seat 106; bending member 107; sleeve 108; lifting handle 109; crank 110; linkage push rod 111; press-fit upper plate 112; press-fit lower plate 113; mounting hole 114; guide rod 115; linear bearing 116; boss 117; electrode insertion hole 118; metal detection member 119; spring needle 120; electrical signal acquisition mainboard 121; first socket 122; second socket 123; second cable 124; wiring cover 125; mounting sheet 126; mainboard output port 127; protruding tooth member 128;
[0037] Second testing device 200; docking socket 201; bottom plate 202; docking module 203; docking socket 204; groove 205; first extension 206; quick ejection assembly 207; push rod 208; shovel-out assembly 209; spring member 210; front end shovel head 211; limiting column 212; connecting column 213;
[0038] Resistance testing mainboard 300; access device interface 301. DETAILED DESCRIPTION
[0039] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions, and numerical values set forth in these embodiments are illustrative only and do not limit the scope of the present application unless otherwise specifically stated.
[0040] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application or its application or uses.
[0041] Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, such techniques, methods, and devices can be viewed as part of the specification and may
[0042] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as a limitation. Thus, other examples of exemplary embodiments can have different values.
[0043] It should be noted that like references and characters herein relate to like items throughout the figures, and once an item is defined in one figure, it need not be discussed further in subsequent figures.
[0044] The intracranial brain electrode resistance testing device 1000 according to an embodiment of the present application will now be described in detail below with reference to the accompanying drawings.
[0045] In one embodiment of the present application, the intracranial brain electrode resistance testing device 1000 is applied to test, for example,Figure 13 The intracranial brain electrode shown in the multi-channel resistance value, to be tested intracranial brain electrode includes the front electrode piece 10 and the connection port 12. The intracranial brain electrode resistance test device 1000 in the embodiment comprises: a first test device 100, which is fixedly connected to at least one electrode contact 11 on the front electrode piece 10; a second test device 200, which comprises a docking module 203 for fixedly connecting a plurality of connection terminals (not shown in the figure) in the connection port 12 through the docking module 203; and a resistance test mainboard 300, to which the first test device 100 and the second test device 200 are connected through a first wire 101 respectively. The resistance test mainboard 300 comprises a device interface 301, and the device interface 301 corresponding to the first test device 100 and the device interface 301 corresponding to the second test device 200 are respectively connected with an external resistance tester and form a path, so that the resistance tester displays the multi-channel resistance value of the intracranial brain electrode to be detected.
[0046] Specifically, as shown in the drawings, Figure 1 The intracranial brain electrode resistance test device 1000 provided by the application is used for multi-channel resistance value test of the intracranial brain electrode, and whether the resistance value is in the normal resistance range is judged according to the resistance value corresponding to each channel of the intracranial brain electrode, so that if the resistance value corresponding to each channel of the intracranial brain electrode is in the normal resistance range, it is judged that the multi-channel resistance value of the intracranial brain electrode is qualified. As shown in the drawings, Figure 13 The conventional intracranial brain electrode comprises a front electrode piece 10 and a connection port 12. The front surface of the front electrode piece 10 is embedded with a plurality of electrode contacts 11 arranged at intervals. The electrode contacts 11 are used to contact the target points of the brain tissue of the patient, so as to obtain the electroencephalogram signals at the target points of the brain tissue. Different electrode contacts 11 can contact different target points. Each electrode contact corresponds to a channel, so that multi-channel electroencephalogram signals can be collected. The inside of the front electrode piece 10 is provided with a guide wire connected to each electrode contact 11. The electroencephalogram signals collected by each electrode contact 11 are connected to the connection port 12 at the rear end of the intracranial brain electrode through the respective guide wires. The connection port 12 is connected with a transmission cable, so as to transmit the multi-channel electroencephalogram signals to an external electroencephalograph and display. This is known to those skilled in the art, and will not be described here.
[0047] It should be noted that the above describes the signal transmission principle of the intracranial EEG electrode in normal acquisition of the target target point multi-channel EEG signal of the patient. Based on this, the intracranial EEG electrode resistance test device 1000 provided by the embodiment of the application is used to test the multi-channel resistance value of the intracranial EEG electrode. Only the test device needs to be in contact and fixed connection with the plurality of electrode contacts 11 of the front electrode piece 10 at one end, and in contact and fixed connection with the plurality of connection terminals in the connection port 12 at the other end, so as to form a loop at the head and tail of the multi-channel of the intracranial EEG electrode, and the resistance value of the multi-channel of the intracranial EEG electrode can be tested to determine whether the resistance value corresponding to each channel is within the normal threshold range. The following content will describe the technical content of the intracranial EEG electrode resistance test device 1000 provided by the application in detail, and the outline in the drawing is a dotted line or a dashed line.
[0048] For the test of the multi-channel resistance of the intracranial EEG electrode, as shown in the figure, Figure 2 The intracranial EEG electrode resistance test device 1000 provided by the application includes a first test device 100 and a second test device 200. The first test device 100 is used to fix the front electrode piece 10 of the intracranial EEG electrode and is in fixed contact connection with one or more electrode contacts 11 thereon. That is, the first test device 100 can form a path with each electrode contact 11 on the front electrode piece 10 of the intracranial EEG electrode.
[0049] The second test device 200 is used to fix all the connection terminals in the connection port 12 at the rear of the intracranial EEG electrode by using the docking module 203 arranged thereon. For the intracranial EEG electrode, the plurality of connection terminals can correspond to the output of the channel EEG signals transmitted from each electrode contact 11 on the front electrode piece 10. In other words, one connection terminal corresponds to the EEG signal collected by one electrode contact 11. Based on this, the docking module 203 of the second test device 200 can also one-to-one correspond to the plurality of connection terminals in the connection port 12 at the rear of the intracranial EEG electrode, that is, the second test device 200 can form a path with the plurality of connection terminals in the connection port 12 of the intracranial EEG electrode, which will be described in detail below, and will not be described here.
[0050] In the embodiment, the resistance test mainboard 300 is used to connect the channels corresponding to each contact electrode with each test channel of the external resistance tester in the same order through the interface to form a loop after the channel order is arranged. Specifically, the first test device 100 and the second test device 200 are connected with one resistance test mainboard 300 through two first wires 101 respectively. Each resistance test mainboard 300 includes an access device interface 301. The access device interface 301 is used to connect the external resistance tester. In addition, the resistance test mainboard 300 also includes an internal circuit channel, which can adjust the channel order of each electrode contact 11 in the channel to be consistent with the test channel order of the external resistance tester. Here, it is understood by those skilled in the art that it is not the focus of the present application and will not be described in detail. Based on this, the access device interface 301 corresponding to the first test device 100 and the access device interface 301 corresponding to the second test device 200 are connected with the external resistance tester to form the loop shown in the figure and make the test channel order of the external resistance tester consistent with the channel order corresponding to each electrode contact 11, so that the external resistance tester displays the resistance value corresponding to each channel of the intracranial brain electrode to be detected according to the arrangement order of each electrode contact 11. According to the above content, those skilled in the art can accurately determine which electrode contact 11 corresponding to the channel resistance value on the tested intracranial brain electrode is abnormal according to the resistance value corresponding to each channel of the intracranial brain electrode displayed by the external resistance tester. Here, it is understood by those skilled in the art that it will not be described in detail. Figure 1
[0051] In the embodiment, in the case that the first test device 100 is connected with each electrode contact 11 on the front electrode piece 10 to realize the channel and the second test device 200 is connected with the multiple connection terminals of the intracranial brain electrode to realize the channel, the first test device 100 can be connected with one resistance test mainboard 300 through the first wire 101, and the second test device 200 can be connected with another resistance test mainboard 300 through another first wire 101. Each resistance test mainboard 300 is provided with an access device interface 301. Specifically, the access device interface 301 of the resistance test mainboard 300 connected with the first test device 100 and the access device interface 301 of the other resistance test mainboard 300 connected with the second test device 200 are respectively connected with the external resistance tester to form a loop.
[0052] As shown in the figure, the first test device 100 is connected with the access device interface 301 of the resistance test mainboard 300 through the first wire 101, and the second test device 200 is connected with the access device interface 301 of the other resistance test mainboard 300 through the first wire 101. The access device interface 301 of the resistance test mainboard 300 connected with the first test device 100 and the access device interface 301 of the other resistance test mainboard 300 connected with the second test device 200 are respectively connected with the external resistance tester to form a loop. Figure 1 As shown, the external resistance tester indirectly connects the electrode contact 11 of one end of the intracranial brain electrode to be detected, and indirectly connects a plurality of connection terminals in the connection port 12 of the other end of the intracranial brain electrode, thereby forming a complete connection path, so that the external resistance tester can display the resistance value corresponding to each channel of the multi-channel intracranial brain electrode. It should be noted that the external resistance tester in the present application is a conventional instrument used by those skilled in the art, and the resistance tester needs to be powered by an external power supply during testing. The working principle and use method are not described here.
[0053] In another embodiment of the present application, the first test device 100 includes a mounting bottom plate 102, a mounting top plate 103, and a mounting base plate 104 vertically arranged on the mounting bottom plate 102. The mounting top plate 103 and the mounting bottom plate 102 are provided with a compression upper plate 112 and a compression lower plate 113, and the compression lower plate 113 is fixedly connected with the mounting bottom plate 102.
[0054] Briefly, as shown in the drawings, Figure 6 As shown, the first test device 100 includes a mounting bottom plate 102, a mounting top plate 103, and a mounting base plate 104 vertically arranged on the mounting bottom plate 102. The mounting bottom plate 102 or the mounting top plate 103 can be made of plastic or metal, which is not limited here. The vertically arranged mounting base plate 104 can be made of aluminum alloy or stainless steel. The bottom of the mounting base plate 104 can be fixedly connected with the mounting bottom plate 102 by screws, or the mounting bottom plate 102 and the mounting base plate 104 can also be provided as an integrated component. The mounting top plate 103 and the mounting bottom plate 102 are further provided with a compression upper plate 112 and a compression lower plate 113 from top to bottom. The compression lower plate 113 is fixedly connected with the mounting bottom plate 102. The bottom surface of the compression lower plate 113 can be adhesively fixed with the mounting bottom plate 102, or the compression lower plate 113 can be provided as an integrated component with the mounting bottom plate 102.
[0055] In some other embodiments of the present application, the mounting top plate 103, the mounting bottom plate 102, and the two sides of the compression upper plate 112 are provided with corresponding mounting hole positions 114. The first test device 100 further includes two guide rods 115 and two linear bearings 116. The guide rods 115 pass through the mounting hole positions 114 on one side of the compression upper plate 112 and a single linear bearing 116 fixedly arranged below the compression upper plate 112. The two ends of the guide rods 115 are fixedly connected with the mounting hole positions 114 on the corresponding sides of the mounting top plate 103 and the mounting bottom plate 102.
[0056] Specifically, in the present embodiment, as shown in the drawings, Figures 4 to 6As shown, mounting top plate 103, mounting bottom plate 102, and pressing upper plate 112 all have corresponding mounting holes 114 on both sides in the horizontal direction for mounting guide rods 115. The inner diameter of these mounting holes 114 is adapted to the outer diameter of the guide rods 115, and the inner diameter of the hole in the linear bearing 116 is also adapted to the outer diameter of the guide rods 115. Thus, the guide rods 115 on both sides can pass through the middle holes of the linear bearings 116 on both sides and the pressing upper plate 112, and the two ends of the guide rods 115 on both sides extend into the corresponding mounting holes 114 of the mounting bottom plate 102 and the mounting top plate 103 and are fixedly installed. The linear bearings 116 and the pressing upper plate 112 are fixedly connected, and the two can slide up and down along the guide rods 115. In this embodiment, the linear bearings 116 play a light, high-speed, precise, and smooth linear guiding function during the up and down sliding of the pressing upper plate 112 along the guide rods 115. The top surface of the linear bearing 116 can be glued to the bottom surface of the pressing plate 112 or fixed in other ways, which is not limited here.
[0057] In another embodiment of this application, a mounting component 105, a fixing seat 106, a lifting handle 109 connected to the mounting component 105, a crank 110 connected to the lifting handle 109, and a linkage push rod 111 connected to the crank 110 are fixedly provided on the mounting base 104. The fixing seat 106 includes a bending component 107 and a sleeve 108. The sleeve 108 passes through a through hole on the upper surface of the mounting top plate 103. The linkage push rod 111 extends into the sleeve 108 and is connected to the mounting piece 126 fixedly provided on the side of the pressing upper plate 112 facing the mounting top plate 103, so that the pressing upper plate 112 slides up and down along the guide rod 115 under the drive of the lifting handle 109.
[0058] Specifically, such as Figures 2 to 6 As shown, a mounting component 105 is fixedly mounted on the upper end of the mounting base 104. The mounting component 105 can be welded onto the mounting base 104. One end of the lifting handle 109 is movably connected to the mounting component 105 via a pin. The mounting component 105 serves as a fixed support, providing a center of rotation for the lifting handle 109, allowing it to rotate around its axis. The other end of the lifting handle 109 is connected to the upper end of the linkage push rod 111 via a crank 110. The lifting handle 109, crank 110, and linkage push rod 111 are all sequentially movably connected via pins, which will not be elaborated further here.
[0059] In addition, such as Figures 2 to 6As shown, the mounting base 104 is fixedly mounted on the mounting substrate 104 by screws. The mounting base 106 is mounted below the mounting member 105. The mounting base 106 is composed of two parts, i.e., a bending member 107 and a sleeve 108. A through hole is formed in the center of the upper surface of the mounting top plate 103, and the inner diameter of the through hole is greater than the outer diameter of the sleeve 108. Thus, the sleeve 108 can extend into the through hole of the mounting top plate 103. The sleeve 108 can be fixedly connected to the mounting top plate 103 by adhesion or the like. In some embodiments, the front end of the sleeve 108 extending into the through hole can be flush with the lower surface of the mounting top plate 103, so as to avoid the part of the sleeve 108 protruding from the lower surface of the mounting top plate 103 from hindering the up-and-down sliding of the compression top plate 112.
[0060] The sleeve 108 in the present embodiment is provided with an inner tube, and the inner diameter of the inner tube is adapted to the outer diameter of the linkage push rod 111, so that the linkage push rod 111 can extend into the sleeve 108, and the linkage push rod 111 can be welded to the mounting piece 126 on the side of the compression top plate 112 facing the mounting top plate 103 after extending through the sleeve 108. In the present embodiment, the mounting piece 126 can be fixedly connected to the compression top plate 112 by screws. Based on the above structure, the compression top plate 112 can slide up and down along the guide rod 115 under the driving of the lifting handle 109.
[0061] Further, the tester can press down the lifting handle 109 by hand, the lifting handle 109 can drive the crank 110 and the linkage push rod 111 to move downward, the mounting piece 126 at the other end of the linkage push rod 111 also moves downward, thereby driving the compression top plate 112 to move vertically downward along the guide rod 115 until the compression top plate 112 is compressed with the compression bottom plate 113. Conversely, the tester can lift up the lifting handle 109 by hand, the lifting handle 109 drives the crank 110 and the linkage push rod 111 to move upward, the mounting piece 126 at the other end of the linkage push rod 111 also moves upward, thereby driving the compression top plate 112 to move vertically upward along the guide rod 115, and the compression top plate 112 is separated from the compression bottom plate 113. Here, the pressing down or lifting up of the lifting handle 109 can be manually operated or automatically controlled by a machine, and the specific control mode is not limited herein.
[0062] In still another embodiment of the present application, the pressing lower plate 113 is provided with a boss 117 on the side facing the pressing upper plate 112, the boss 117 is provided with an electrode insertion hole 118 on the side facing the guide rod 115, and the side of the boss 117 away from the mounting base plate 104 is provided with a receiving space, and a plurality of metal detection members 119 are arranged in the receiving space, the metal detection members 119 are in contact with each electrode contact 11 extending into the electrode insertion hole 118; and / or the pressing upper plate 112 is provided with a plurality of spring pins 120 on the side facing the mounting base plate 102, and when the pressing upper plate 112 and the pressing lower plate 113 are pressed against each other, the spring pins 120 are in contact with each electrode contact 11 extending into the electrode insertion hole 118, and the arrangement gap between each metal detection member 119 or spring pin 120 is consistent with the arrangement gap between each electrode contact 11.
[0063] Specifically, as shown in Figure 6 the pressing lower plate 113 is provided with a boss 117 on the side facing the pressing upper plate 112. The side of the boss 117 facing any one of the guide rods 115 can be provided with an electrode insertion hole 118, and the electrode insertion hole 118 is a through hole, and the side of the boss 117 facing the other guide rod 115 is not provided with an electrode insertion hole 118. The front electrode member 10 of the intracranial brain electrode to be detected can enter the boss 117 through the electrode insertion hole 118, and when the tester extends the front electrode member 10 into the boss 117 and the front electrode member 10 cannot be advanced by abutting against the inner wall of the side of the boss 117 not provided with the electrode insertion hole 118, it indicates that the front electrode member 10 has been completely inserted into the boss 117 and indicates that the placement is complete.
[0064] Further, in the present embodiment, as shown in Figure 6 and Figure 14As shown, the convex platform 117 is further provided with a plurality of spaced teeth 128 on the side facing the second wiring 124. The teeth 128 in the embodiment can be integrated with the convex platform 117. The spaces between the teeth 128 form a plurality of independent accommodation spaces. The bottom of each accommodation space can be embedded with a metal detection piece 119. The upper surface of the metal detection piece 119 can be at the same level as the upper surface of the compression lower plate 113 or slightly protrude from the level of the upper surface of the compression lower plate 113, so that the metal detection piece 119 can better contact each electrode contact 11 on the front electrode piece 10 of the intracranial brain electrode inserted into one end of the convex platform 117. The sidewall of each tooth 128 can be provided with a through hole (not shown in the figure) at the corresponding position, so that the front electrode piece 10 of the intracranial brain electrode to be detected can pass through the through hole of the sidewall of each tooth 128 straightly to reach the other end of the convex platform 117. In short, the front electrode piece 10 of the intracranial brain electrode to be detected passes through the convex platform 117 from the electrode insertion hole 118 on the side of the convex platform 117, and then passes through the through hole of the sidewall of each tooth 128 in turn, until the front electrode piece 10 is placed against the inner wall of the side of the convex platform 117 not provided with the electrode insertion hole 118. In the case that the front electrode piece 10 is placed, each electrode contact 11 on the intracranial brain electrode can be in each accommodation space and can contact the metal detection piece 119 at the bottom of each accommodation space.
[0065] In the embodiment, the metal detection piece 119 can be a conductive copper column. It should be noted that in the embodiment, the upper surface of each metal detection piece 119 can contact each electrode contact 11 inserted into the electrode insertion hole 118. It should be noted that in the embodiment, the arrangement gap between the plurality of metal detection pieces 119 can be consistent with the arrangement gap between the electrode contacts 11 inserted into the electrode insertion hole 118, so that each electrode contact 11 inserted into the electrode insertion hole 118 can contact each metal detection piece 119 arranged in the convex platform 117. It should be noted that the arrangement gap between the plurality of metal detection pieces 119 and other parameters can be adjusted by the person skilled in the art according to the arrangement gap between the electrode contacts 11 on the intracranial brain electrode to be detected, the number of contacts and other parameters of different models, which is not limited herein.
[0066] In addition, in the embodiment, as shown, Figure 4 the compression upper plate 112 can be further fixed with a plurality of spring needles 120 on the side facing the mounting bottom plate 102. When the user presses the lifting handle 109 to make the compression upper plate 112 and the compression lower plate 113 press each other, each spring needle 120 can contact each electrode contact 11 on the intracranial brain electrode at the corresponding position.
[0067] It is worth noting that the arrangement gap between each spring needle 120 in the row of the upper plate 112 and the arrangement gap between each electrode contact 11 extending into the electrode penetration hole 118 can be set to be consistent, so that each electrode contact 11 extending into the electrode penetration hole 118 can be in contact with each spring needle 120 in the row of the upper plate 112. It is worth noting here that for the arrangement gap between each spring needle 120 in the row of the upper plate 112 and other parameters, those skilled in the art can adjust them according to the arrangement gap between the electrode contacts 11 on the intracranial brain electrode of different models, the number of contacts, and other parameters to adapt, which is not limited here.
[0068] In addition, it is worth noting that according to the above content, the arrangement gap between each metal detection piece 119 and each spring needle 120 in the embodiment and the arrangement gap between each electrode contact 11 on the intracranial brain electrode extending into the electrode penetration hole 118 are consistent. In fact, if only the side of the lower plate 113 facing the upper plate 112 is provided with multiple metal detection pieces 119 in contact with the electrode contacts 11, or only the side of the upper plate 112 facing the mounting bottom plate 102 is provided with multiple spring needles 120 in contact with the electrode contacts 11, the contact between the detection piece and the electrode contact 11 can also be achieved. However, there may be a problem of incomplete contact or seemingly contacting but not actually contacting, which may cause the external resistance tester to not display the resistance values of some channels of the multi-channel intracranial brain electrode.
[0069] Therefore, in order to avoid this situation, as shown in Figure 12 the embodiment of the present application adopts the technical solution of providing contact pieces on both the upper plate 112 and the lower plate 113, so that the contact pieces on the upper plate 112 and the lower plate 113 can simultaneously contact each electrode contact 11 extending into the electrode penetration hole 118 when the upper plate 112 and the lower plate 113 are pressed together. The advantage of this is that even if the multiple metal detection pieces 119 on the lower plate 113 do not fully contact some electrode contacts 11, the multiple spring needles 120 on the upper plate 112 can ensure contact with these electrode contacts 11, thereby further increasing the stability of the contact and greatly reducing the failure rate of problems such as incomplete contact or seemingly contacting but not actually contacting.
[0070] In another embodiment of the present application, the upper plate 112 is provided with a receiving space and an electric signal acquisition main board 121, the electric signal acquisition main board 121 is electrically connected with the spring needle 120, the upper plate 112 is provided with a first socket 122 on the side facing the mounting top plate 103, the first socket 122 is electrically connected with the electric signal acquisition main board 121, the bottom surface of the mounting bottom plate 102 is provided with a second socket 123, the second socket 123 is electrically connected with the metal detection piece 119, and the first socket 122 and the second socket 123 are connected through a second wire 124.
[0071] Specifically, in the present embodiment, the compression upper plate 112 is internally provided with a receiving space. The receiving space can be installed with an electric signal acquisition mainboard 121 (not shown in the figure). The electric signal acquisition mainboard 121 in the present embodiment is electrically connected with the spring pins 120 at the lower end of the compression upper plate 112. Specifically, each spring pin 120 is connected with the electric signal acquisition mainboard 121 arranged inside the compression upper plate 112 in sequence through a wire, so that when each spring pin 120 is in contact with each electrode contact 11, the multi-channel electric signals received by the electric signal acquisition mainboard 121 are also consistent with the arrangement order of each electrode contact 11, thereby ensuring that the subsequent obtained resistance values of each channel of the intracranial brain electrode do not occur channel confusion, in other words, since the multi-channel arrangement order in the complete path between the electrode contact and the external resistance tester is always consistent, the external resistance tester can accurately display the resistance value corresponding to each channel, and thus the specific channel of the intracranial brain electrode corresponding to the resistance value in the abnormal state can be accurately measured. Here, it can be understood by those skilled in the art that this will not be described in detail.
[0072] In addition, in the present embodiment, as Figure 6As shown, the first socket 122 is arranged on the side of the compression upper plate 112 facing the installation top plate 103. The first socket 122 is electrically connected with the signal acquisition mainboard 121 arranged in the compression upper plate 112. The bottom surface of the installation bottom plate 102 is fixedly provided with the second socket 123. The second socket 123 is also electrically connected with the plurality of metal detection members 119 on the boss 117 through respective connecting wires. Secondly, the first socket 122 and the second socket 123 in the embodiment are connected through the second wire 124. The advantage of this is that the first socket 122 and the second socket 123 are connected through the second wire 124 in front of the first test device 100. The second wire 124 in the embodiment can connect the plurality of electrode contacts 11 contacted by the plurality of metal detection members 119 on the compression lower plate 113 and the plurality of spring needles 120 on the compression upper plate 112 in series. In short, even if the plurality of metal detection members 119 on the compression lower plate 113 do not completely contact some electrode contacts 11, as long as the plurality of spring needles 120 on the compression upper plate 112 contact these electrode contacts 11, the measured resistance value of the channels corresponding to these electrode contacts will not be affected. In this way, it can be ensured that each electrode contact 11 is at least contacted by one of the metal detection members 119 or the spring needles 120 at the corresponding position, so that the measured resistance value of the channel corresponding to any electrode contact will not be affected. The advantage of this is that it can greatly increase the success rate of measuring the multi-channel resistance values of all electrode contacts 11 on the intracranial brain electrode. In some other embodiments of the application, the tester can adjust the arrangement parameters between the plurality of metal detection members and the plurality of spring members in the test device according to the arrangement parameters, interval distance, contact width and other parameter data between the plurality of electrode contacts of the intracranial brain electrode to be tested, so as to adapt to intracranial brain electrodes of different models and different channel numbers and test the multi-channel resistance values thereof. Here, those skilled in the art can understand that this will not be described in detail.
[0073] In the embodiment, the plurality of metal detecting members 119 are electrically connected to the second socket 123 through respective wires, the second socket 123 is connected to the first socket 122 through the second wire harness 124, and the first socket 122 is electrically connected to the electrical signal acquisition mainboard 121 arranged in the press-fit upper plate 112. Therefore, the plurality of metal detecting members 119 are indirectly connected to the electrical signal acquisition mainboard 121. Based on this, since the plurality of spring pins 120 are also connected to the electrical signal acquisition mainboard 121, the electrode contacts 11 connected to the plurality of spring pins 120 and the electrode contacts 11 connected to the plurality of metal detecting members 119 are actually connected to the electrical signal acquisition mainboard 121. That is, the electrical signal acquisition mainboard 121 in the embodiment can form a path through the plurality of spring pins 120 and the plurality of electrode contacts 11, and can also form a path through the plurality of metal detecting members 119 and the plurality of electrode contacts 11. For example, if a spring pin 120 does not completely contact the electrode contact 11 at the corresponding position during detection, the electrical signal acquisition mainboard 121 can still communicate with the electrode contact 11 and measure the resistance value of the corresponding path since the metal detecting member 119 at the corresponding position completely contacts the electrode contact 11. It is understood by those skilled in the art that this will not be described in detail here.
[0074] In the embodiment, as shown in Figures 2 to 6 The wiring cover 125 is also screw-fixedly mounted on the mounting base plate 102. The wiring cover 125 is mounted on the side of the electrical signal acquisition mainboard 121 on the mounting base plate 104 and located behind the press-fit upper plate 112. One face of the wiring cover 125 facing the press-fit upper plate 112 is open. The press-fit upper plate 112 has a mainboard output port 127 on the face facing the wiring cover 125. The mainboard output port 127 is electrically connected to the electrical signal acquisition mainboard 121. A plurality of wires are connected to the mainboard output port 127. The plurality of wires sequentially form paths with the respective channels of the electrode contacts. The plurality of wires enter the wiring cover 125 from the opening of the wiring cover 125, converge inside the wiring cover 125, and are connected to the first wire harness 101 arranged on the back of the wiring cover 125. The other end of the first wire harness 101 is electrically connected to the resistance test mainboard 300. It is understood by those skilled in the art that the wiring process will not be described in detail here.
[0075] In addition, in some other embodiments of the present application, the spring pins 120 and the metal detecting members 119 in the present application can be gold-plated copper pieces. The gold-plated copper pieces have the advantages of good electrical conductivity, more stability, corrosion resistance, accurate resistance value measurement, etc.
[0076] In still another embodiment of the present application, the second testing device further comprises a bottom plate 202, and the docking module 203 is arranged on the bottom plate 202, the docking module 203 comprises the docking socket 201, the docking jack 204 matched with the connecting port 12 and the quick ejection assembly 207, the docking socket 201 is arranged at one end of the docking module 203, and the docking jack 204 and the quick ejection assembly 207 are arranged at the other end.
[0077] Specifically, as shown in Figures 8 to 9 The second testing device 200 comprises the bottom plate 202 and the docking module 203 arranged on the bottom plate 202. As shown in Figure 9 The docking socket 201 can be arranged at one end of the docking module 203. The docking socket 201 on the docking module 203 can be connected with the resistance testing main board 300 through the first wire 101. The other end of the docking module 203 can be provided with the docking jack 204 matched with the connecting port 12 and the quick ejection assembly 207. When the intracranial brain electrode is tested, the front electrode piece 10 at one end of the intracranial brain electrode is connected with the first testing device 100, and the connecting port 12 at the other end can be docked with the docking jack 204 on the second testing device 200 to form a passage. The quick ejection assembly 207 is further arranged on the side of the docking jack 204 away from the docking socket 201. The quick ejection assembly 207 can quickly and effectively separate the connecting port 12 of the intracranial brain electrode from the docking jack 204 after the intracranial brain electrode is tested, thereby saving the complicated and laborious process of manually separating or separating by using a lever tool.
[0078] In some other embodiments of the present application, the docking jack 204 is provided with the groove 205 and the first extension 206 on both sides, the quick ejection assembly 207 comprises the push rod 208 and the shovel assembly 209 connected with the push rod 208, the push rod 208 and the first extension 206 are provided with the spring piece 210, and the shovel assembly 209 is slidable in the groove 205. The front shovel head 211 of the shovel assembly 209 is in a slope shape.
[0079] Specifically, as shown in Figure 9As shown, two sides of the docking socket 204 can be respectively provided with a groove 205. The outer side of the two side grooves 205 can be respectively provided with a first extension 206. The quick ejection assembly 207 includes a push rod 208 and two side-digging assemblies 209 connected with the push rod 208. The side-digging assembly 209 can be arranged on the side of the push rod 208 facing the docking socket 204. A spring member 210 can be arranged between the push rod 208 and the two first extensions 206. The spring member 210 includes a connecting column 213 and a spring sleeved on the connecting column 213. The push rod 208 is provided with a through hole at both ends. One end of the connecting column 213 is fixedly connected with the first extension 206, and the other end of the connecting column 213 penetrates through the through hole at both ends of the push rod 208. The side of the push rod 208 away from the spring is provided with two limiting columns 212. The limiting column 212 is fixedly arranged on the bottom plate 202 and located behind both ends of the push rod 208. The limiting column 212 is used to limit the disconnection of the push rod 208 and the spring member 210.
[0080] As shown in the figure, Figures 9 to 11 When the push rod 208 is not pushed (the spring member 210 is in a completely relaxed state), the front end digging head 211 of the two side-digging assemblies 209 can be in the groove 205, and at this time, the limiting column 212 can abut against both ends of the push rod 208, thereby limiting the disconnection of the push rod 208 and the spring member 210. In this application, the connection port 12 of the intracranial brain electrode and the docking socket 204 are in Figure 2 the docking state shown in the figure. The connection port 12 in the docking state covers the area of the docking socket 204 and the two end grooves 205. Actually, there is a gap between the bottom of the connection port 12 and the bottom surface of the groove 205. Therefore, when the connection port 12 of the intracranial brain electrode and the docking socket 204 are intended to be disconnected after the intracranial brain electrode test is completed, the tester can push the push rod 208 in the horizontal direction towards the docking socket 204. The push rod 208 moves inward along the connecting column 213, the spring member 210 is compressed under force, and the side-digging assembly 209 can slide in the groove 205 towards the docking socket 204. The front end digging head 211 of the side-digging assembly 209 in this embodiment can be provided in a slope shape as shown in the figure, which is convenient for being inserted into the gap between the connection port 12 and the bottom surface of the groove 205 to dig the connection port 12 of the intracranial brain electrode in the docking state, so as to quickly disconnect the connection port 12 of the intracranial brain electrode and the docking socket 204. Figure 11
[0081] In summary, the intracranial brain electrode resistance test device 1000 provided by the embodiment of the present application has at least the following beneficial effects: convenient and effective multi-channel resistance test of the intracranial brain electrode is achieved, and all channel resistance values of the intracranial brain electrode can be quickly measured by only one-time two-end docking, which has the advantages of convenience, speed, accuracy, efficiency, etc.; the arrangement parameters of the metal detection member and the spring member can be adjusted automatically, so that the intracranial brain electrode of different models can be adapted and the multi-channel resistance values thereof can be tested; the detection members are arranged on the upper pressing plate and the lower pressing plate respectively, so that the complete contact of all electrode contacts of the intracranial brain electrode is double guaranteed, the stability of the multi-channel resistance test is greatly improved, and the problem of inaccurate resistance value caused by incomplete contact of the electrode when the multimeter is manually used to test the contact is avoided; finally, the labor cost is greatly reduced, the cumbersome test operation process is saved, and manual connection and test of each channel in the intracranial brain electrode are not needed, so that the test efficiency is greatly improved.
[0082] Although some specific embodiments of the present application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, but not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.
Claims
1. An intracranial brain electrode resistance test device for testing multi-channel resistance values of an intracranial brain electrode, the intracranial brain electrode to be tested comprising a front electrode piece and a connection port, characterized in that, The utility model relates to a kind of test device for intracranial electrode, including: First test device, for at least one electrode contact on the front electrode piece Fixed connection; Second test device, the second test device includes docking module, for by the docking module in the multiple connection terminals in the connection port Fixed connection; Resistance test mainboard, the first test device and second test device are connected one resistance test mainboard respectively by first wire, and the resistance test mainboard includes access device interface, the access device interface corresponding to the first test device and the access device interface corresponding to the second test device are connected with external resistance tester respectively and form passage, so that the resistance tester shows the multiple-channel resistance value of the intracranial brain electrode to be detected.
2. The intracranial brain electrode resistance test device of claim 1, wherein, The first test device includes installation bottom plate, installation top plate and installation base plate vertically arranged on the installation bottom plate, and the installation top plate and the installation bottom plate are provided with pressing upper plate and pressing lower plate, and the pressing lower plate is fixedly connected with the installation bottom plate.
3. The intracranial brain electrode resistance testing device of claim 2, wherein, Both sides of the installation top plate, the installation bottom plate and the pressing upper plate are provided with corresponding mounting hole positions, and the first test device further includes two guide rods and two linear bearings, the guide rods pass through the mounting hole positions on one side of the pressing upper plate and are fixedly arranged in a single linear bearing below the pressing upper plate, and the two ends of the guide rods are fixedly connected with the mounting hole positions on the corresponding sides of the installation top plate and the installation bottom plate respectively.
4. The intracranial brain electrode resistance testing device of claim 3, wherein, The installation base plate is fixedly provided with a mounting member, a fixed seat, a lifting handle connected with the mounting member, a crank connected with the lifting handle and a linkage push rod connected with the crank, the fixed seat includes a bent member and a sleeve, the sleeve penetrates a through hole on the upper surface of the installation top plate, the linkage push rod extends into the sleeve and is connected with a mounting piece fixedly arranged on the side of the pressing upper plate facing the installation top plate, so that the pressing upper plate slides up and down along the guide rod under the drive of the lifting handle.
5. The intracranial brain electrode resistance testing device of claim 4, wherein, One side of the pressing lower plate facing the pressing upper plate is provided with a boss, one side of the boss facing the guide rod is provided with an electrode penetration hole, and the side of the boss away from the installation base plate is provided with an accommodation space, a plurality of metal detection members are arranged in the accommodation space, and each electrode contact extending into the electrode penetration hole is in contact with the metal detection member; and / or the pressing upper plate is provided with a plurality of spring needles on the side facing the installation bottom plate, and each electrode contact extending into the electrode penetration hole is in contact with the spring needle when the pressing upper plate and the pressing lower plate are pressed against each other, and the arrangement gap between each metal detection member or spring needle is consistent with the arrangement gap between each electrode contact.
6. The intracranial brain electrode resistance testing device of claim 5, wherein, The pressing upper plate is provided with an accommodation space and an electrical signal acquisition mainboard, the electrical signal acquisition mainboard is electrically connected with the spring needle, the side of the pressing upper plate facing the installation top plate is provided with a first socket, the first socket is electrically connected with the electrical signal acquisition mainboard, the bottom surface of the installation bottom plate is provided with a second socket, the second socket is electrically connected with the metal detection member, and the first socket and the second socket are connected by a second wire.
7. The intracranial brain electrode resistance testing device of claim 6, wherein, The spring needle and the metal detection member are gold-plated copper members.
8. The intracranial brain electrode resistance testing device of claim 7, wherein, The second testing device further comprises a bottom plate, the docking module is arranged on the bottom plate, the docking module comprises a docking socket, a docking jack matched with the connecting port and a quick ejection assembly, the docking socket is arranged at one end of the docking module, and the quick ejection assembly and the docking jack are arranged at the other end of the docking module.
9. The intracranial brain electrode resistance testing device of claim 8, wherein, Both sides of the docking jack are provided with a groove and a first extension, the quick ejection assembly comprises a push rod and a shoveling assembly connected with the push rod, a spring member is arranged between the push rod and the first extension, and the shoveling assembly can slide in the groove.
10. The intracranial brain electrode resistance testing device of claim 9, wherein, The front end of the shoveling assembly is in a slope shape.