Thermal management device and numerical control center

Abstract

The invention discloses a thermal management device and a numerical control center, and relates to the field of thermal management, an air cooling mechanism comprises a first heat exchanger and forms a first air duct, and the first heat exchanger corresponds to the first air duct; the liquid cooling mechanism is used for adjusting the load temperature, is connected with the first heat exchanger and is used for adjusting the temperature of first gas in the first air duct through the first heat exchanger; the refrigerant mechanism is used for adjusting the temperature of the first gas in the first air duct and adjusting the load temperature. Therefore, the heat management device integrates the air cooling mechanism, the liquid cooling mechanism and the refrigerant mechanism, purchase, installation, debugging, operation and maintenance, troubleshooting and linkage control of all parts of the heat management device are facilitated, the occupied area, the assembly complexity and the cost of the heat management device can be reduced, the refrigerant mechanism can adjust the load temperature and is high in temperature control capacity, and in addition, the heat management device is convenient to use. All parts of the heat management device can be arranged outside the machine room, so that the space utilization rate of the machine room is improved.

Description

Technical Field

[0001] This invention relates to the field of thermal management, and in particular to a thermal management device and a numerical control center. Background Technology

[0002] In related technologies, liquid cooling and air cooling equipment exist in the same data center computer room. The liquid cooling and air cooling equipment are independent of each other. The components of the liquid cooling and air cooling equipment are generally from different suppliers. The procurement, installation, commissioning, operation and maintenance, troubleshooting, and linkage control are all relatively complex. Furthermore, because the liquid cooling and air cooling equipment are independent of each other, they occupy a large area, are complicated to install, and have high costs. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a thermal management device that integrates an air-cooling mechanism, a liquid-cooling mechanism, and a refrigerant mechanism, which has a small footprint, low assembly complexity, and low cost.

[0004] The present invention further proposes a numerical control center.

[0005] The thermal management device according to the present invention includes: an air-cooling mechanism, a liquid-cooling mechanism, and a refrigerant mechanism. The air-cooling mechanism includes a first heat exchanger and forms a first air duct, the first heat exchanger corresponding to the first air duct. The liquid-cooling mechanism is used to regulate the load temperature and is connected to the first heat exchanger. The liquid-cooling mechanism is used to regulate the temperature of a first gas in the first air duct through the first heat exchanger. The refrigerant mechanism is used to regulate the temperature of the first gas in the first air duct and to regulate the load temperature.

[0006] According to the thermal management device of the present invention, the thermal management device of this application integrates the air-cooling mechanism, the liquid-cooling mechanism, and the refrigerant mechanism, which facilitates the procurement, installation, commissioning, operation and maintenance, troubleshooting, and linkage control of each component of the thermal management device. In addition, it can reduce the footprint, assembly complexity, and cost of the thermal management device. Moreover, the refrigerant mechanism can regulate the load temperature and has strong temperature control capability. Furthermore, all components of the thermal management device proposed in this application can be located outside the computer room, which is beneficial to improving the space utilization of the computer room.

[0007] In some examples of the present invention, the refrigerant mechanism includes a compressor, a second heat exchanger, a first expansion valve, and a third heat exchanger connected and forming a first refrigerant circuit, the refrigerant mechanism being used to regulate the load temperature via the third heat exchanger.

[0008] In some examples of the present invention, the refrigerant mechanism further includes: a second expansion valve, a fourth heat exchanger, the compressor, the second heat exchanger, and the second expansion valve, the fourth heat exchanger forming a second refrigerant circuit, the fourth heat exchanger corresponding to the first air duct, and the refrigerant mechanism being used to regulate the temperature of the first gas in the first air duct through the fourth heat exchanger.

[0009] In some examples of the present invention, the fourth heat exchanger is located downstream of the first heat exchanger along the flow direction of the first gas.

[0010] In some examples of the present invention, the second heat exchanger has a first refrigerant flow channel and a first heat exchange medium flow channel, wherein the first refrigerant flow channel is configured as part of the first refrigerant circuit and as part of the second refrigerant circuit, and the liquid cooling mechanism is connected to the first heat exchange medium flow channel.

[0011] In some examples of the present invention, the liquid cooling mechanism, the first heat exchanger, and the first heat exchange medium channel are connected in sequence, and the first heat exchange medium channel is located downstream of the first heat exchanger.

[0012] In some examples of the present invention, the air-cooling mechanism further includes a first fan, and the air-cooling mechanism also forms a first inlet and a first outlet. The first inlet and the first outlet are respectively located at both ends of the first air duct and are both connected to the first air duct. The first fan is used to guide the first gas from the first inlet into the first air duct and out from the first outlet.

[0013] In some examples of the present invention, the liquid cooling mechanism includes: a first driving member and a fifth heat exchanger, wherein the first driving member and the fifth heat exchanger form a first flow path, and the first flow path and the first heat exchanger form a first loop.

[0014] In some examples of the present invention, the first drive member is located upstream or downstream of the fifth heat exchanger.

[0015] In some examples of the present invention, the liquid cooling mechanism further includes a second fan for guiding a second gas through the fifth heat exchanger.

[0016] In some examples of the present invention, the liquid cooling mechanism has a second air duct, a second inlet, and a second outlet. The fifth heat exchanger corresponds to the second air duct. The second inlet and the second outlet are located at both ends of the second air duct and are both connected to the second air duct. The second fan is used to guide the second gas from the second inlet into the second air duct and out from the second outlet.

[0017] In some examples of the present invention, the liquid cooling mechanism further includes a humidifier located upstream of the fifth heat exchanger along the flow direction of the second gas, the humidifier being used to humidify the second gas.

[0018] In some examples of the invention, the liquid cooling mechanism further includes a sprayer for spraying water toward the fifth heat exchanger.

[0019] In some examples of the present invention, the liquid cooling mechanism further includes: a sixth heat exchanger and a second driving member, the sixth heat exchanger forming a second heat exchange medium flow channel and a third heat exchange medium flow channel, the first flow channel and the second heat exchange medium flow channel forming a second loop, and the third heat exchange medium flow channel and the second driving member being adapted to form a third loop with the load to regulate the load temperature.

[0020] In some examples of the present invention, the third heat exchanger forms a fourth heat exchange medium flow channel and a second refrigerant flow channel, the second refrigerant flow channel being constructed as part of the first refrigerant circuit, and the fourth heat exchange medium flow channel, the third heat exchange medium flow channel, and the second drive member being adapted to form the third circuit with the load to regulate the load temperature.

[0021] In some examples of the present invention, the liquid cooling mechanism further includes: a bypass valve, wherein the third heat exchange medium flow channel and the fourth heat exchange medium flow channel together form a second flow path, and the bypass valve is connected in parallel with the second flow path.

[0022] In some examples of the invention, the first flow path is adapted to form a fourth loop with the load to regulate the load temperature.

[0023] In some examples of the present invention, the third heat exchanger is formed with a fourth heat exchange medium flow channel and a second refrigerant flow channel, the second refrigerant flow channel being constructed as part of the first refrigerant circuit, and the first flow channel and the fourth heat exchange medium flow channel being adapted to form the fourth circuit with the load to regulate the load temperature.

[0024] The CNC center according to the present invention includes: a thermal management device and a machine room, wherein a load is provided in the machine room, the thermal management device is the aforementioned thermal management device, the first gas in the first air duct can flow into the machine room, and the liquid cooling mechanism is used to regulate the temperature of the load.

[0025] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0026] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the thermal management device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the thermal management device according to an embodiment of the present invention.

[0027] Figure label: Thermal management device 10; Air-cooled mechanism 1; First heat exchanger 11; First fan 12; Liquid cooling mechanism 2; first drive unit 21; fifth heat exchanger 22; second fan 23; humidifier 24; sixth heat exchanger 25; second heat exchange medium flow channel 251; third heat exchange medium flow channel 252; second drive unit 26; bypass valve 27; Refrigerant mechanism 3; First refrigerant circuit 31; Second refrigerant circuit 32; Compressor 33; Second heat exchanger 34; First refrigerant flow channel 341; First heat exchange medium flow channel 342; First expansion valve 35; Third heat exchanger 36; Fourth heat exchange medium flow channel 361; Second refrigerant flow channel 362; Second expansion valve 37; Fourth heat exchanger 38; First flow path 4; Second flow path 5; First loop 6; Second circuit 7; Third circuit 8. Detailed Implementation

[0028] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0029] The following is for reference. Figure 1 and Figure 2 A thermal management device 10 according to an embodiment of the present invention is described.

[0030] like Figure 1 and Figure 2As shown, the thermal management device 10 according to an embodiment of the present invention includes: an air-cooling mechanism 1, a liquid-cooling mechanism 2, and a refrigerant mechanism 3. The air-cooling mechanism 1 includes a first heat exchanger 11 and forms a first air duct, the first heat exchanger 11 corresponding to the first air duct; the liquid-cooling mechanism 2 is used to adjust the load temperature, and the liquid-cooling mechanism 2 is connected to the first heat exchanger 11, and the liquid-cooling mechanism 2 is used to adjust the temperature of a first gas in the first air duct through the first heat exchanger 11; the refrigerant mechanism 3 is used to adjust the temperature of the first gas in the first air duct, and the refrigerant mechanism 3 is used to adjust the load temperature.

[0031] The air-cooling mechanism 1 has a first air duct, and the first heat exchanger 11 corresponds to the first air duct so that the first gas in the first air duct flows through the first heat exchanger 11. As some embodiments of this application, the first heat exchanger 11 can cool the first gas flowing through the first heat exchanger 11 to reduce the temperature of the first gas.

[0032] As some embodiments of this application, the first heat exchanger 11 may be configured as a heat dissipation coil, the first gas may be configured as air, and the heat dissipation coil cools the air flowing through it.

[0033] As some embodiments of this application, the thermal management device 10 of this application can be configured as a thermal management device for a CNC center. This application describes the thermal management device 10 used for thermal management in a CNC center as an example.

[0034] As some embodiments of this application, the CNC center includes: a computer room, a first air duct connecting the outside of the computer room and the inside of the computer room, a first gas flowing from the outside of the computer room into the inside of the computer room, and a first heat exchanger 11 cooling the flowing first gas to reduce the temperature of the first gas, so that the first gas can dissipate heat to components (such as storage and low power density chips) inside the computer room that require cooling, and also so that the first gas can cool down the temperature inside the computer room.

[0035] As some embodiments of this application, the CNC center includes: a computer room, a first air duct located inside the computer room, a first gas that can circulate inside the computer room, the first gas flowing into the first air duct being high-temperature return air, and a first heat exchanger 11 cooling the first gas to reduce its temperature, so as to dissipate heat from components (such as storage and low-power density chips) inside the computer room that require cooling, and also to facilitate the first gas to cool down the temperature inside the computer room.

[0036] The liquid cooling mechanism 2 is used to regulate the load temperature. As some embodiments of this application, the load can be constructed as a component with cooling requirements inside the computer room, such as a high power density computing chip.

[0037] The liquid cooling mechanism 2 is connected to the first heat exchanger 11. As some embodiments of this application, the liquid cooling mechanism 2 and the first heat exchanger 11 can be connected by a pipeline.

[0038] The liquid cooling mechanism 2 is used to regulate the temperature of the first gas in the first air duct through the first heat exchanger 11. As some embodiments of this application, the first heat exchange medium flows from the liquid cooling mechanism 2 into the first heat exchanger 11 and exchanges heat with the first gas through the first heat exchanger 11 to regulate the temperature of the first gas. Specifically, the first heat exchange medium absorbs heat from the first gas to reduce the temperature of the first gas. This arrangement allows the liquid cooling mechanism 2 to be integrated with the air cooling mechanism 1.

[0039] As some embodiments of this application, both the air-cooled mechanism 1 and the liquid-cooled mechanism 2 can be installed outside the computer room. The air-cooled mechanism 1 is installed close to the computer room, while the liquid-cooled mechanism 2 has no installation restrictions. For example, the liquid-cooled mechanism 2 can be installed close to the air-cooled mechanism 1 or installed freely. Furthermore, the air-cooled mechanism 1 and the liquid-cooled mechanism 2 can be connected by pipelines.

[0040] The refrigerant mechanism 3 is used to regulate the temperature of the first gas in the first air duct. As some embodiments of this application, a refrigerant flows through the refrigerant mechanism 3, and the refrigerant exchanges heat with the first gas to regulate the temperature of the first gas. Specifically, the refrigerant absorbs heat from the first gas to lower the temperature of the first gas.

[0041] The refrigerant mechanism 3 is used to regulate the load temperature. In some embodiments of this application, the refrigerant mechanism 3 works in conjunction with the liquid cooling mechanism 2 to regulate the load temperature.

[0042] It should be noted that, compared to traditional CNC center cooling equipment, the thermal management device 10 of this application integrates the air-cooling mechanism 1, liquid-cooling mechanism 2, and refrigerant mechanism 3 to achieve a modular design. The air-cooling mechanism 1, liquid-cooling mechanism 2, and refrigerant mechanism 3 can be installed in the factory and then transported as a single unit to the data center for installation. Alternatively, the air-cooling mechanism 1, liquid-cooling mechanism 2, and refrigerant mechanism 3 can be transported to the data center separately and installed separately. The installation method is selectable, simple, and cost-effective. Furthermore, by integrating the air-cooling mechanism 1, liquid-cooling mechanism 2, and refrigerant mechanism 3, the procurement, installation, commissioning, operation and maintenance, troubleshooting, and linkage control of the various components of the thermal management device 10 are facilitated. Moreover, the heat dissipation sides of the air-cooling mechanism 1 and liquid-cooling mechanism 2 can be integrated, solving the problem of redundancy on the heat dissipation side of the thermal management device 10, which helps reduce the footprint, assembly complexity, and cost of the thermal management device 10. In addition, the refrigerant mechanism 3 can regulate the load temperature and has strong temperature control capabilities.

[0043] Therefore, the thermal management device 10 of this application integrates the air-cooling mechanism 1, the liquid-cooling mechanism 2, and the refrigerant mechanism 3, which facilitates the procurement, installation, commissioning, operation and maintenance, troubleshooting, and linkage control of each component of the thermal management device 10. In addition, it can reduce the floor space, assembly complexity, and cost of the thermal management device 10. Moreover, the refrigerant mechanism 3 can regulate the load temperature and has strong temperature control capability. Furthermore, each component of the thermal management device 10 proposed in this application can be located outside the computer room, which is conducive to improving the space utilization of the computer room.

[0044] In some embodiments of the present invention, such as Figure 2 As shown, the refrigerant mechanism 3 includes a compressor 33, a second heat exchanger 34, a first expansion valve 35, and a third heat exchanger 36 connected to and forming a first refrigerant circuit 31. The refrigerant mechanism 3 is used to regulate the load temperature through the third heat exchanger 36.

[0045] As some embodiments of this application, the compressor 33, the second heat exchanger 34, the first expansion valve 35, and the third heat exchanger 36 are connected in sequence through pipelines to form a first refrigerant circuit 31. In other words, the compressor 33, the second heat exchanger 34, the first expansion valve 35, and the third heat exchanger 36 are connected in series through pipelines to form a first refrigerant circuit 31.

[0046] As some embodiments of this application, a refrigerant flows through the first refrigerant circuit 31, such as, but not limited to, R134a (1,1,1,2-tetrafluoroethane), R1234YF (2,3,3,3-tetrafluoropropylene), etc.

[0047] As some embodiments of this application, the second heat exchanger 34 may be configured as a condenser plate heat exchanger, which is capable of condensing the refrigerant from a gaseous state to a liquid state and releasing heat.

[0048] The refrigerant mechanism 3 is used to regulate the load temperature through the third heat exchanger 36. As some embodiments of this application, the third heat exchanger 36 and the load are connected in series through a pipeline to form a loop. The first refrigerant loop 31 and the loop where the load is located can exchange heat through the third heat exchanger 36 to regulate the load temperature.

[0049] In the first refrigerant circuit 31, the refrigerant is compressed into a high-temperature, high-pressure gaseous refrigerant by the compressor 33, and then flows through the second heat exchanger 34 to condense, changing from a gaseous state to a liquid state. Then, the liquid refrigerant flows through the first expansion valve 35 and becomes a low-temperature, low-pressure liquid refrigerant. Then, the liquid refrigerant flows to the third heat exchanger 36 and exchanges heat with the circuit where the load is located, raising the temperature of the liquid refrigerant. Then, it is re-drawn into the compressor 33, completing the cycle of the first refrigerant circuit 31. In this way, the first refrigerant circuit 31 can continuously supply liquid refrigerant to the third heat exchanger 36, and the third heat exchanger 36 continuously exchanges heat between the liquid refrigerant and the circuit where the load is located, thereby enabling the refrigerant mechanism 3 to continuously regulate the load temperature.

[0050] As some embodiments of this application, the third heat exchanger 36 can be configured as a plate heat exchanger, through which the refrigerant flows and evaporates to absorb heat, and the plate heat exchanger can regulate the load temperature.

[0051] By using the refrigerant mechanism 3 to regulate the load temperature through the third heat exchanger 36, the first refrigerant circuit 31 and the circuit where the load is located can continuously exchange heat through the third heat exchanger 36, thereby enabling the refrigerant mechanism 3 to continuously regulate the load temperature, with strong temperature control capability and adaptability to high-power loads.

[0052] In some embodiments of the present invention, such as Figure 2 As shown, the refrigerant mechanism 3 also includes: a second expansion valve 37, a fourth heat exchanger 38, a compressor 33, a second heat exchanger 34, a second expansion valve 37, and a fourth heat exchanger 38 forming a second refrigerant circuit 32. The fourth heat exchanger 38 corresponds to the first air duct, and the refrigerant mechanism 3 is used to regulate the temperature of the first gas in the first air duct through the fourth heat exchanger 38.

[0053] As some embodiments of this application, the compressor 33, the second heat exchanger 34, the second expansion valve 37, and the fourth heat exchanger 38 are connected in sequence through pipelines to form a second refrigerant circuit 32. In other words, the compressor 33, the second heat exchanger 34, the second expansion valve 37, and the fourth heat exchanger 38 are connected in series through pipelines to form a second refrigerant circuit 32.

[0054] As some embodiments of this application, the second refrigerant circuit 32 and the first refrigerant circuit 31 use the same refrigerant, such as, but not limited to, R134a (1,1,1,2-tetrafluoroethane), R1234YF (2,3,3,3-tetrafluoropropylene), etc.

[0055] The working principle of the second refrigerant circuit 32 can be understood as compression-condensation-expansion-evaporation. Specifically, in the second refrigerant circuit 32, the refrigerant is compressed into a high-temperature, high-pressure gaseous refrigerant under the action of the compressor 33, and then flows through the second heat exchanger 34 to condense, changing from a gaseous state to a liquid state. Then, the liquid refrigerant flows through the second expansion valve 37 to become a low-temperature, low-pressure liquid refrigerant. Then, the liquid refrigerant flows to the fourth heat exchanger 38 and evaporates, absorbing heat and vaporizing into a gas. Then, it is re-drawn into the compressor 33, completing the cycle of the second refrigerant circuit 32. In this way, the second refrigerant circuit 32 can continuously provide liquid refrigerant to the fourth heat exchanger 38, and the fourth heat exchanger 38 continuously causes the liquid refrigerant to evaporate, absorb heat, and vaporize into a gas, thereby absorbing the heat of the first gas to reduce the temperature of the first gas.

[0056] The fourth heat exchanger 38 corresponds to the first air duct. As some embodiments of this application, the fourth heat exchanger 38 corresponds to the first air duct so that the first gas in the first air duct flows through the fourth heat exchanger 38. As some embodiments of this application, the fourth heat exchanger 38 can cool the flowing first gas and further reduce the temperature of the first gas.

[0057] As some embodiments of this application, the fourth heat exchanger 38 may be configured as an evaporator that can cool the first gas.

[0058] The refrigerant mechanism 3 is used to regulate the temperature of the first gas in the first air duct through the fourth heat exchanger 38. As some embodiments of this application, the compressor 33, the second heat exchanger 34, the second expansion valve 37, and the fourth heat exchanger 38 are connected in sequence through pipelines. Refrigerant flows through the pipelines and flows into the fourth heat exchanger 38. The refrigerant exchanges heat with the first gas through the fourth heat exchanger 38 to regulate the temperature of the first gas. Specifically, the refrigerant absorbs heat from the first gas to lower the temperature of the first gas.

[0059] By aligning the fourth heat exchanger 38 with the first air duct, the refrigerant mechanism 3 can adjust the temperature of the first gas in the first air duct through the fourth heat exchanger 38, which can further reduce the temperature of the first gas, thereby improving the temperature control capability of the thermal management device 10 and facilitating heat dissipation for components and personnel in the machine room.

[0060] In some embodiments of the present invention, such as Figure 2 As shown, along the flow direction of the first gas, the fourth heat exchanger 38 is located downstream of the first heat exchanger 11.

[0061] As some embodiments of this application, along the flow direction of the first gas, the first heat exchanger 11 can pre-cool the first gas before the fourth heat exchanger 38 to reduce the temperature of the first gas, and the fourth heat exchanger 38 cools the first gas flowing through the first heat exchanger 11 to further reduce the temperature of the first gas.

[0062] This arrangement allows for a reasonable placement of the first heat exchanger 11 and the fourth heat exchanger 38, enabling them to perform tiered cooling of the first gas, resulting in a better cooling effect.

[0063] In some embodiments of the present invention, such as Figure 2 As shown, the second heat exchanger 34 has a first refrigerant flow channel 341 and a first heat exchange medium flow channel 342. The first refrigerant flow channel 341 is constructed as part of the first refrigerant circuit 31 and as part of the second refrigerant circuit 32. The liquid cooling mechanism 2 is connected to the first heat exchange medium flow channel 342.

[0064] The second heat exchanger 34 has a first refrigerant flow channel 341 and a first heat exchange medium flow channel 342. As some embodiments of this application, the first refrigerant flow channel 341 and the first heat exchange medium flow channel 342 are integrated into the second heat exchanger 34, and the first refrigerant flow channel 341 and the first heat exchange medium flow channel 342 are not interconnected.

[0065] The first refrigerant flow channel 341 is constructed as part of the first refrigerant circuit 31. As some embodiments of this application, the first refrigerant flow channel 341 is connected to other components of the first refrigerant circuit 31 through pipelines. In other words, the compressor 33, the first refrigerant flow channel 341 of the second heat exchanger 34, the first expansion valve 35, and the third heat exchanger 36 are sequentially connected through pipelines to form the first refrigerant circuit 31.

[0066] The first refrigerant flow channel 341 is constructed as part of the second refrigerant circuit 32. As some embodiments of this application, the first refrigerant flow channel 341 is connected to other components of the second refrigerant circuit 32 through pipelines. In other words, the compressor 33, the first refrigerant flow channel 341 of the second heat exchanger 34, the second expansion valve 37, and the fourth heat exchanger 38 are sequentially connected through pipelines to form the second refrigerant circuit 32.

[0067] The liquid cooling mechanism 2 is connected to the first heat exchange medium flow channel 342. As some embodiments of this application, the liquid cooling mechanism 2 and the first heat exchange medium flow channel 342 are connected by a pipeline.

[0068] It should be noted that the refrigerant is compressed into a high-temperature, high-pressure gaseous refrigerant under the action of the compressor 33, and then flows through the first refrigerant channel 341 of the second heat exchanger 34 to condense and release heat. By connecting the first heat exchange medium channel 342 of the second heat exchanger 34 to the liquid cooling mechanism 2, the relatively low-temperature first heat exchange medium flowing out from the liquid cooling mechanism 2 can exchange heat with the refrigerant in the first refrigerant channel 341 in the first heat exchange medium channel 342 to assist the refrigerant in condensing and releasing heat. This allows the liquid cooling mechanism 2 to be integrated with the refrigerant mechanism 3, enabling the liquid cooling mechanism 2 to assist the refrigerant mechanism 3 in working, improving the power of the refrigerant mechanism 3, improving the cooling effect of the first gas and the load, and also improving the modularity of the thermal management device 10.

[0069] In some embodiments of the present invention, such as Figure 2 As shown, the liquid cooling mechanism 2, the first heat exchanger 11, and the first heat exchange medium flow channel 342 are connected in sequence, and the first heat exchange medium flow channel 342 is located downstream of the first heat exchanger 11.

[0070] As some embodiments of this application, the liquid cooling mechanism 2, the first heat exchanger 11, and the first heat exchange medium flow channel 342 are connected in sequence through pipelines.

[0071] The first heat exchange medium flow channel 342 is located downstream of the first heat exchanger 11. As some embodiments of this application, the first heat exchanger 11 and the first heat exchange medium flow channel 342 are connected by a pipeline, and the first heat exchange medium flowing out from the liquid cooling mechanism 2 flows through the first heat exchanger 11 and the first heat exchange medium flow channel 342 in sequence.

[0072] This configuration allows the first heat exchange medium with a lower temperature flowing out of the liquid cooling mechanism 2 to preferentially flow into the first heat exchanger 11 to effectively pre-cool the first gas. Then, the first heat exchange medium flowing out of the first heat exchanger 11 flows into the first heat exchange medium flow channel 342, using the residual cold energy to assist the operation of the refrigerant mechanism 3 and improve the utilization rate of the cold energy.

[0073] In some embodiments of the present invention, the air-cooling mechanism 1 further includes a first fan 12. The air-cooling mechanism 1 also has a first inlet and a first outlet. The first inlet and the first outlet are located at both ends of the first air duct and are both connected to the first air duct. The first fan 12 is used to guide the first gas from the first inlet into the first air duct and out from the first outlet.

[0074] In some embodiments of this application, the first inlet can be located at the top of the air-cooling mechanism 1, and the first outlet can be located on the side of the air-cooling mechanism 1. The first gas enters the first air duct from the first inlet and flows out from the first outlet. In some embodiments of this application, the first inlet can be located at the top of the air-cooling mechanism 1, and the first outlet can be located at the bottom of the air-cooling mechanism 1. The first gas enters the first air duct from the first inlet and flows out from the first outlet. In some embodiments of this application, the first outlet can be located on the side of the air-cooling mechanism 1 facing the computer room.

[0075] As some embodiments of this application, along the flow direction of the first gas, the first inlet is located upstream of the first heat exchanger 11, and the first outlet is located downstream of the fourth heat exchanger 38.

[0076] This configuration allows the first gas to flow into the first air duct from the first inlet, and allows the cooled first gas in the first air duct to flow out of the first air duct through the first outlet, which helps to ensure smooth flow of the first gas in the first air duct.

[0077] The first fan 12 is used to guide the first gas from the first inlet into the first air duct and out from the first outlet. As some embodiments of this application, such as... Figure 2 As shown, along the flow direction of the first gas, the first fan 12 is located downstream of the fourth heat exchanger 38, and the first fan 12 can be arranged close to the first outlet.

[0078] By setting the first fan 12, the first gas can be continuously guided from the first inlet into the first air duct and out of the first outlet, thereby increasing the flow rate of the first gas and increasing the air volume of the first gas flowing through the first air duct per unit time, thereby improving the heat exchange efficiency between the first gas and the first heat exchanger 11 and the fourth heat exchanger 38, and improving the cooling effect of the air-cooling mechanism 1.

[0079] In some embodiments of the present invention, such as Figure 2 As shown, the liquid cooling mechanism 2 includes: a first driving member 21 and a fifth heat exchanger 22. The first driving member 21 and the fifth heat exchanger 22 form a first flow path 4, and the first flow path 4 and the first heat exchanger 11 form a first loop 6.

[0080] The first driving element 21 and the fifth heat exchanger 22 form a first flow path 4. As some embodiments of this application, the first driving element 21 and the fifth heat exchanger 22 can be connected by a pipeline, in which a first heat exchange medium flows. The first driving element 21 provides power to the first heat exchange medium so that the first heat exchange medium flows smoothly through the fifth heat exchanger 22.

[0081] As some embodiments of this application, the first drive unit 21 can be configured as a water pump, and the fifth heat exchanger 22 can be configured as a heat dissipation coil.

[0082] The first flow path 4 and the first heat exchanger 11 form a first loop 6. Specifically, the first drive unit 21, the fifth heat exchanger 22 and the first heat exchanger 11 are connected by a pipeline to form the first loop 6, and the first heat exchange medium flows in the first loop 6.

[0083] In the first loop 6, the first flow path 4 cools the first heat exchange medium to reduce its temperature. Specifically, when the first heat exchange medium flows into the fifth heat exchanger 22, it can exchange heat with the outside through the fifth heat exchanger 22 to reduce its temperature. The first heat exchange medium with a lower temperature flows out of the first flow path 4 and into the first heat exchanger 11 to exchange heat with the first gas in the first air duct. The first heat exchange medium transfers its cooling capacity to the first gas, and its temperature rises. The first heat exchange medium with a higher temperature flows out of the first heat exchanger 11 and back into the first flow path 4, completing the cycle of the first loop 6.

[0084] As some embodiments of this application, the first loop 6 also includes a second heat exchanger 34, that is, the first flow path 4 together with the first heat exchanger 11 and the second heat exchanger 34 forms the first loop 6, and the second heat exchanger 34 is located downstream of the first heat exchanger 11.

[0085] At this time, in the first loop 6, when the first heat exchange medium flows into the fifth heat exchanger 22, the first heat exchange medium can exchange heat with the outside through the fifth heat exchanger 22 to reduce the temperature of the first heat exchange medium. The first heat exchange medium with a lower temperature flows out from the first flow path 4 and flows into the first heat exchanger 11 to exchange heat with the first gas in the first air duct. The first heat exchange medium transfers the cold energy to the first gas, and the temperature of the first heat exchange medium rises. Then, the first heat exchange medium flows out from the first heat exchanger 11 and flows into the first heat exchange medium flow path 342 of the second heat exchanger 34. The residual cold energy of the first heat exchange medium assists the operation of the refrigerant mechanism 3, and the temperature of the first heat exchange medium rises further. The first heat exchange medium with a higher temperature flows out from the first heat exchanger 11 and flows back to the first flow path 4, completing the cycle of the first loop 6.

[0086] By forming a first loop 6 with the first flow path 4 and the first heat exchanger 11, both the liquid cooling mechanism 2 and the air cooling mechanism 1 can dissipate heat through the fifth heat exchanger 22. This integrates the heat dissipation sides of the liquid cooling mechanism 2 and the air cooling mechanism 1, allowing for a more sophisticated thermal management architecture design. It also solves the problem of redundancy on the heat dissipation side of the thermal management device 10, improving the integration level of the liquid cooling mechanism 2 and the air cooling mechanism 1, and reducing the footprint and cost of the thermal management device 10. Furthermore, this configuration allows the thermal management device 10 to have a natural cooling function, eliminating the need for an additional natural cooling module outside the thermal management device 10, thus reducing costs and construction time.

[0087] In some embodiments of the present invention, such as Figure 2 As shown, the first driving component 21 is located upstream or downstream of the fifth heat exchanger 22.

[0088] In some embodiments of this application, the first driving member 21 is located upstream of the fifth heat exchanger 22, and the first driving member 21 is connected to the fifth heat exchanger 22 via a pipeline. The first heat exchange medium flows through the first driving member 21 and is transported to the fifth heat exchanger 22 via the first driving member 21. In some embodiments of this application, the first driving member 21 may be configured as a water pump, which transports the first heat exchange medium to the fifth heat exchanger 22.

[0089] As some embodiments of this application, the first driving member 21 is located downstream of the fifth heat exchanger 22. The first driving member 21 is connected to the fifth heat exchanger 22 through a pipeline. The first heat exchange medium flows through the fifth heat exchanger 22 and is drawn in by the first driving member 21 to be delivered to the first heat exchanger 11.

[0090] This configuration allows for flexible placement of the first drive unit 21, which can be positioned upstream or downstream of the fifth heat exchanger 22 as needed, resulting in better compatibility.

[0091] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, the liquid cooling mechanism 2 also includes a second fan 23, which is used to guide the second gas through the fifth heat exchanger 22.

[0092] By setting up the second fan 23, the second gas can be guided to flow through the fifth heat exchanger 22, increasing the air volume flowing through the fifth heat exchanger 22 per unit time, improving the heat exchange efficiency between the second gas and the fifth heat exchanger 22, thereby improving the efficiency of the first heat exchange medium to exchange heat with the outside through the fifth heat exchanger 22, and improving the cooling efficiency of the first heat exchange medium, thus improving the cooling capacity of the liquid cooling mechanism 2 and the air cooling mechanism 1.

[0093] In some embodiments of the present invention, the liquid cooling mechanism 2 has a second air duct, a second inlet, and a second outlet. The fifth heat exchanger 22 corresponds to the second air duct. The second inlet and the second outlet are located at both ends of the second air duct and are connected to the second air duct. The second fan 23 is used to guide the second gas from the second inlet into the second air duct and out from the second outlet.

[0094] The fifth heat exchanger 22 corresponds to the second air duct. As some embodiments of this application, the fifth heat exchanger 22 corresponds to the second air duct so that the second gas in the second air duct flows through the fifth heat exchanger 22, and the second gas exchanges heat with the first heat exchange medium flowing through the fifth heat exchanger 22 to reduce the temperature of the first heat exchange medium.

[0095] The second inlet and the second outlet are located at opposite ends of the second air duct and are both connected to the second air duct. In some embodiments of this application, the second inlet can be located at the bottom of the liquid cooling mechanism 2, and the second outlet can be located at the top of the liquid cooling mechanism 2. The second gas enters the second air duct from the second inlet and flows out from the second outlet. In some embodiments of this application, the second inlet can be located on the side of the liquid cooling mechanism 2, and the second outlet can be located at the top of the liquid cooling mechanism 2. The second gas enters the second air duct from the second inlet and flows out from the second outlet.

[0096] As some embodiments of this application, along the flow direction of the second gas, the second inlet is located upstream of the fifth heat exchanger 22, and the second outlet is located downstream of the fifth heat exchanger 22.

[0097] This configuration allows the second gas to flow into the second air duct from the second inlet, and allows the second gas in the second air duct, after heat exchange with the fifth heat exchanger 22, to flow out of the second air duct through the second outlet, which is beneficial for the smooth flow of the second gas in the second air duct.

[0098] The second fan 23 is used to guide the second gas from the second inlet into the second air duct and out from the second outlet. As some embodiments of this application, such as... Figure 2 As shown, along the flow direction of the second gas, the second fan 23 is located downstream of the fifth heat exchanger 22, and the second fan 23 can be arranged close to the second outlet.

[0099] By setting up a second fan 23, the second gas can be continuously guided from the second inlet into the second air duct and out of the second outlet, thereby increasing the flow rate of the second gas, increasing the air volume of the second gas flowing through the second air duct per unit time, improving the heat exchange efficiency between the second gas and the fifth heat exchanger 22, and thus rapidly cooling the first heat exchange medium flowing through the fifth heat exchanger 22.

[0100] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, the liquid cooling mechanism 2 also includes a humidifier 24, which is located upstream of the fifth heat exchanger 22 along the flow direction of the second gas. The humidifier 24 is used to humidify the second gas.

[0101] As some embodiments of this application, the humidifier 24 can be configured as a wet film humidifier 24. The wet film has excellent water absorption and easily forms a uniform water film, which can increase the surface area of ​​the water and the air flow speed above the water surface to increase the evaporation rate of the water and humidify the second gas. It is understood that by humidifying the second gas, the heat exchange rate between the second gas and the fifth heat exchanger 22 can be increased, which is beneficial to the rapid cooling of the first heat exchange medium flowing through the fifth heat exchanger 22 and to improving the cooling capacity of the thermal management device 10.

[0102] This configuration allows the second gas to be humidified, causing it to evaporate and absorb heat from the fifth heat exchanger 22, thereby cooling the first heat exchange medium flowing through the fifth heat exchanger 22 and improving the cooling capacity of the thermal management device 10.

[0103] In some embodiments of the present invention, the liquid cooling mechanism 2 further includes a sprayer for spraying water toward the fifth heat exchanger 22.

[0104] The sprayer can spray the fifth heat exchanger 22 to directly reduce the temperature of the fifth heat exchanger 22. Furthermore, the water sprayed on the fifth heat exchanger 22 evaporates and absorbs the heat of the fifth heat exchanger 22, further reducing the temperature of the fifth heat exchanger 22, thereby significantly improving the cooling effect on the first heat exchange medium flowing through the fifth heat exchanger 22.

[0105] In some embodiments of the present invention, such as Figure 2 As shown, the liquid cooling mechanism 2 also includes: a sixth heat exchanger 25 and a second drive member 26. The sixth heat exchanger 25 forms a second heat exchange medium flow channel 251 and a third heat exchange medium flow channel 252. The first flow path 4 and the second heat exchange medium flow channel 251 form a second loop 7, and the third heat exchange medium flow channel 252 and the second drive member 26 are adapted to form a third loop 8 with the load to regulate the load temperature.

[0106] The sixth heat exchanger 25 has a second heat exchange medium flow channel 251 and a third heat exchange medium flow channel 252. As some embodiments of this application, the second heat exchange medium flow channel 251 and the third heat exchange medium flow channel 252 are integrated into the sixth heat exchanger 25, and the second heat exchange medium flow channel 251 and the third heat exchange medium flow channel 252 are not connected to each other.

[0107] The first flow path 4 and the second heat exchange medium flow channel 251 form a second loop 7. Specifically, the first driving member 21, the fifth heat exchanger 22 and the second heat exchange medium flow channel 251 are connected by a pipeline to form the second loop 7, and the first heat exchange medium flows through the second loop 7.

[0108] In the second loop 7, the first flow path 4 cools the first heat exchange medium to reduce its temperature. Specifically, when the first heat exchange medium flows into the fifth heat exchanger 22, it can exchange heat with the outside through the fifth heat exchanger 22 to reduce its temperature. The lower-temperature first heat exchange medium flows out of the first flow path 4 and is divided into two parts. One part flows into the first heat exchanger 11 and exchanges heat with the first gas in the first air duct. The other part flows into the second heat exchange medium flow channel 251 of the sixth heat exchanger 25. The first heat exchange medium flowing through the second heat exchange medium flow channel 251 exchanges heat with the second heat exchange medium flowing through the third heat exchange medium flow channel 252 to transfer cooling to the second heat exchange medium. The temperature of the first heat exchange medium rises. The higher-temperature first heat exchange medium flows out of the second heat exchange medium flow channel 251 of the sixth heat exchanger 25 and flows back to the first flow path 4, completing the cycle of the second loop 7. The temperature of the second heat exchange medium decreases and cools the load to regulate the load temperature.

[0109] The third heat exchange medium flow channel 252 and the second driving member 26 are adapted to form a third loop 8 with the load to regulate the load temperature. As some embodiments of this application, the third heat exchange medium flow channel 252, the second driving member 26, and the load are sequentially connected through pipelines to form a third loop 8 to regulate the load temperature, and the third loop 8 is circulated with the second heat exchange medium.

[0110] In the third loop 8, the second heat exchange medium flows through the load and exchanges heat with the load, increasing the temperature of the second heat exchange medium. The second heat exchange medium with a higher temperature is driven into the third heat exchange medium channel 252 by the second driving element 26. The second heat exchange medium flowing through the third heat exchange medium channel 252 exchanges heat with the first heat exchange medium flowing through the second heat exchange medium channel 251 and transfers heat to the first heat exchange medium. The temperature of the second heat exchange medium decreases, and the second heat exchange medium with a lower temperature flows out of the third heat exchange medium channel 252 and into the load, completing the cycle of the third loop 8.

[0111] As some embodiments of this application, the first heat exchange medium may be constructed as, but is not limited to, an aqueous solution of ethylene glycol, an aqueous solution of propylene glycol, etc., and the second heat exchange medium may be constructed as, but is not limited to, an aqueous solution of ethylene glycol, an aqueous solution of propylene glycol, etc. As some embodiments of this application, the first heat exchange medium and the second heat exchange medium may be the same or different.

[0112] As some embodiments of this application, the second drive member 26 may be configured as a water pump, and the sixth heat exchanger 25 may be configured as a plate heat exchanger.

[0113] By forming a second loop 7 with the first flow path 4 and the second heat exchange medium flow channel 251, and by adapting the third heat exchange medium flow channel 252 and the second driving member 26 to form a third loop 8 with the load to regulate the load temperature, the first heat exchange medium flowing through the second heat exchange medium flow channel 251 and the second heat exchange medium flowing through the third heat exchange medium flow channel 252 can exchange heat, which facilitates the regulation of the load temperature. Furthermore, the load can be indirectly heated by the liquid cooling mechanism 2, which is not connected to the load, thus ensuring the quality of the liquid flowing through the load.

[0114] In some embodiments of the present invention, such as Figure 2 As shown, the third heat exchanger 36 has a fourth heat exchange medium flow channel 361 and a second refrigerant flow channel 362. The second refrigerant flow channel 362 is constructed as part of the first refrigerant circuit 31. The fourth heat exchange medium flow channel 361, the third heat exchange medium flow channel 252, and the second drive member 26 are adapted to form a third circuit 8 with the load to regulate the load temperature.

[0115] The third heat exchanger 36 has a fourth heat exchange medium flow channel 361 and a second refrigerant flow channel 362. As some embodiments of this application, the fourth heat exchange medium flow channel 361 and the second refrigerant flow channel 362 are integrated into the third heat exchanger 36, and the fourth heat exchange medium flow channel 361 and the second refrigerant flow channel 362 are not interconnected.

[0116] The second refrigerant flow channel 362 is constructed as part of the first refrigerant circuit 31. As some embodiments of this application, the second refrigerant flow channel 362 is connected to other components of the first refrigerant circuit 31 through pipelines. In other words, the compressor 33, the first refrigerant flow channel 341 of the second heat exchanger 34, the first expansion valve 35, and the second refrigerant flow channel 362 of the third heat exchanger 36 are sequentially connected through pipelines to form the first refrigerant circuit 31.

[0117] The fourth heat exchange medium flow channel 361, the third heat exchange medium flow channel 252, and the second drive member 26 are adapted to form a third loop 8 with the load to regulate the load temperature. That is, the third heat exchanger 36, the sixth heat exchanger 25, and the second drive member 26 are adapted to form a third loop 8 with the load to regulate the load temperature. As some embodiments of this application, the second drive member 26, the third heat exchange medium flow channel 252, the fourth heat exchange medium flow channel 361, and the load are sequentially connected via pipelines to form a third loop 8 to regulate the load temperature.

[0118] The second refrigerant flow channel 362 is configured as part of the first refrigerant circuit 31, and the fourth heat exchange medium flow channel 361, the third heat exchange medium flow channel 252, and the second driving member 26 are adapted to form a third circuit 8 with the load to regulate the load temperature. This enables the refrigerant flowing through the second refrigerant flow channel 362 to exchange heat with the second heat exchange medium flowing through the fourth heat exchange medium flow channel 361, thereby significantly reducing the temperature of the second heat exchange medium flowing through the fourth heat exchange medium flow channel 361 and effectively regulating the load temperature. This can significantly improve the cooling capacity of the thermal management device 10 for the load.

[0119] In some embodiments of the present invention, such as Figure 2 As shown, the liquid cooling mechanism 2 also includes: a bypass valve 27, a third heat exchange medium flow channel 252 and a fourth heat exchange medium flow channel 361 forming a second flow path 5, and the bypass valve 27 is connected in parallel with the second flow path 5.

[0120] The third heat exchange medium flow channel 252 and the fourth heat exchange medium flow channel 361 together form the second flow path 5. As some embodiments of this application, the third heat exchange medium flow channel 252 and the fourth heat exchange medium flow channel 361 can be connected by a pipeline. The second heat exchange medium flows in the pipeline, and the second driving member 26 provides power to the second heat exchange medium so that the second heat exchange medium flows smoothly into the second flow path 5.

[0121] The bypass valve 27 is connected in parallel with the second flow path 5. As some embodiments of this application, one end of the bypass valve 27 is located upstream of the second flow path 5, and the other end of the bypass valve 27 is located downstream of the second flow path 5, so that the bypass valve 27 is connected in parallel with the second flow path 5.

[0122] It should be noted that by connecting the bypass valve 27 in parallel with the second flow path 5, the bypass valve 27 can be adjusted according to the heat dissipation requirements of the load. At this time, the second heat exchange medium flowing through the load can be divided into two parts. One part of the second heat exchange medium flows into the second flow path 5 and completes the circulation in the third loop 8, while the other part of the second heat exchange medium flows back to the load through the bypass valve 27. When the load's heat dissipation demand is high, the bypass valve 27 can be closed, or the opening of the bypass valve 27 can be reduced to increase the flow rate of the second heat exchange medium flowing through the second flow path 5, thereby improving the cooling effect of the liquid cooling mechanism 2 and the refrigerant mechanism 3 on the load. When the load's heat dissipation demand is low, the bypass valve 27 can be opened, or the opening of the bypass valve 27 can be increased to reduce the flow rate of the second heat exchange medium flowing through the second flow path 5, thereby reducing the cooling effect of the liquid cooling mechanism 2 and the refrigerant mechanism 3 on the load. In short, by adjusting the opening of the bypass valve 27, the cooling capacity of the load can be adjusted, thereby enabling real-time control of the thermal management capability according to the current temperature of the load. This is beneficial for keeping the load within a suitable temperature range for a long time and for improving the service life of the load.

[0123] By connecting the bypass valve 27 in parallel with the second flow path 5, the bypass valve 27 can be adjusted according to the heat dissipation requirements of the load, which helps to keep the load in a suitable temperature range for a long time and improves the service life of the load.

[0124] In some embodiments of the present invention, the first flow path 4 is adapted to form a fourth loop with the load to regulate the load temperature.

[0125] The first flow path 4 is adapted to form a fourth loop with the load to regulate the load temperature. That is, the first drive member 21 and the fifth heat exchanger 22 are adapted to form a fourth loop with the load to regulate the load temperature. As some embodiments of this application, the first drive member 21, the fifth heat exchanger 22, and the load are connected in sequence through pipelines.

[0126] In the fourth loop, the first flow path 4 cools the first heat exchange medium to reduce its temperature. Specifically, when the first heat exchange medium flows into the fifth heat exchanger 22, it can exchange heat with the outside through the fifth heat exchanger 22 to reduce its temperature. The first heat exchange medium with a lower temperature flows directly into the load after exiting the first flow path 4. The first heat exchange medium flowing through the load exchanges heat with the load, transferring cooling energy to the load to reduce its temperature and regulate its temperature. The temperature of the first heat exchange medium rises, and the first heat exchange medium with a higher temperature flows back to the first flow path 4, completing the cycle of the fourth loop.

[0127] By adapting the first flow path 4 to form a fourth loop with the load to regulate the load temperature, the first heat exchange medium flowing through the first flow path 4 can directly flow into the load and regulate the load temperature. The structure is simple, easy to arrange, and the heat dissipation effect is relatively significant.

[0128] In some embodiments of the present invention, the third heat exchanger 36 is formed with a fourth heat exchange medium flow channel 361 and a second refrigerant flow channel 362. The second refrigerant flow channel 362 is constructed as part of the first refrigerant circuit 31. The first flow path 4 and the fourth heat exchange medium flow channel 361 are adapted to form a fourth circuit with the load to regulate the load temperature.

[0129] The third heat exchanger 36 has a fourth heat exchange medium flow channel 361 and a second refrigerant flow channel 362. As some embodiments of this application, the fourth heat exchange medium flow channel 361 and the second refrigerant flow channel 362 are integrated into the third heat exchanger 36, and the fourth heat exchange medium flow channel 361 and the second refrigerant flow channel 362 are not interconnected.

[0130] The second refrigerant flow channel 362 is constructed as part of the first refrigerant circuit 31. As some embodiments of this application, the second refrigerant flow channel 362 is connected to other components of the first refrigerant circuit 31 through pipelines. In other words, the compressor 33, the first refrigerant flow channel 341 of the second heat exchanger 34, the first expansion valve 35, and the second refrigerant flow channel 362 of the third heat exchanger 36 are sequentially connected through pipelines to form the first refrigerant circuit 31.

[0131] The first flow path 4 and the fourth heat exchange medium flow channel 361 are adapted to form a fourth loop with the load to regulate the load temperature. That is, the first drive member 21, the fifth heat exchanger 22, and the fourth heat exchange medium flow channel 361 are adapted to form a fourth loop with the load to regulate the load temperature. As some embodiments of this application, the first drive member 21, the fifth heat exchanger 22, the fourth heat exchange medium flow channel 361, and the load are connected in sequence through pipelines.

[0132] In the fourth loop, the first flow path 4 cools the first heat exchange medium to reduce its temperature. Specifically, when the first heat exchange medium flows into the fifth heat exchanger 22, it can exchange heat with the outside through the fifth heat exchanger 22 to reduce its temperature. The lower-temperature first heat exchange medium flows out of the first flow path 4 and into the fourth heat exchange medium flow channel 361. The first heat exchange medium flowing through the fourth heat exchange medium flow channel 361 exchanges heat with the refrigerant flowing through the second refrigerant flow channel 362 to further reduce its temperature. The lower-temperature first heat exchange medium flows out of the fourth heat exchange medium flow channel 361 and directly into the load. The first heat exchange medium flowing through the load exchanges heat with the load, transferring cooling energy to the load to reduce its temperature and regulate its temperature. The temperature of the first heat exchange medium rises, and the higher-temperature first heat exchange medium flows back to the first flow path 4, completing the cycle of the fourth loop.

[0133] By adapting the first flow path 4 and the fourth heat exchange medium flow channel 361 to form a fourth loop with the load to regulate the load temperature, the first heat exchange medium flowing through the first flow path 4 and the fourth heat exchange medium flow channel 361 can directly flow into the load and regulate the load temperature. The structure is simple, easy to arrange, and the heat dissipation effect is relatively significant.

[0134] According to an embodiment of the present invention, the CNC center includes: a thermal management device 10 and a machine room. A load is installed in the machine room. The thermal management device 10 is the aforementioned thermal management device 10. A first gas in the first air duct can flow into the machine room. A liquid cooling mechanism 2 is used to regulate the load temperature.

[0135] As some embodiments of this application, a central air duct is formed in the computer room. The end of the central air duct near the first outlet is connected to the first outlet. The first gas in the first air duct can flow into the computer room through the central air duct and dissipate heat to the components inside the computer room that have cooling requirements, and can also cool down the temperature inside the computer room.

[0136] The thermal management device 10 of this application integrates the air-cooling mechanism 1, the liquid-cooling mechanism 2, and the refrigerant mechanism 3, which facilitates the procurement, installation, commissioning, operation and maintenance, troubleshooting, and linkage control of each component of the thermal management device 10. In addition, it can reduce the floor space, assembly complexity, and cost of the thermal management device 10. Furthermore, each component of the thermal management device 10 proposed in this application can be located outside the computer room, which is beneficial to improving the space utilization of the computer room.

[0137] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0138] In the description of this invention, "first feature" and "second feature" may include one or more of the features.

[0139] In the description of this invention, "a plurality of" means two or more.

[0140] In the description of this invention, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or it may include the first and second features not being in direct contact but being in contact through another feature between them.

[0141] In the description of this invention, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature.

[0142] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0143] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A thermal management device, characterized in that, include: An air-cooling mechanism, the air-cooling mechanism including a first heat exchanger and forming a first air duct, the first heat exchanger corresponding to the first air duct; A liquid cooling mechanism is used to regulate the load temperature, and the liquid cooling mechanism is connected to the first heat exchanger. The liquid cooling mechanism is used to regulate the temperature of the first gas in the first air duct through the first heat exchanger. The refrigerant mechanism is used to regulate the temperature of the first gas in the first air duct and to regulate the load temperature.

2. The thermal management device according to claim 1, characterized in that, The refrigerant mechanism includes a compressor, a second heat exchanger, a first expansion valve, and a third heat exchanger connected to form a first refrigerant circuit. The refrigerant mechanism is used to regulate the load temperature through the third heat exchanger.

3. The thermal management device according to claim 2, characterized in that, The refrigerant mechanism further includes: a second expansion valve, a fourth heat exchanger, the compressor, the second heat exchanger, and the second expansion valve. The fourth heat exchanger forms a second refrigerant circuit and corresponds to the first air duct. The refrigerant mechanism is used to regulate the temperature of the first gas in the first air duct through the fourth heat exchanger.

4. The thermal management device according to claim 3, characterized in that, Along the flow direction of the first gas, the fourth heat exchanger is located downstream of the first heat exchanger.

5. The thermal management device according to claim 3, characterized in that, The second heat exchanger has a first refrigerant flow channel and a first heat exchange medium flow channel. The first refrigerant flow channel is constructed as part of the first refrigerant circuit and as part of the second refrigerant circuit. The liquid cooling mechanism is connected to the first heat exchange medium flow channel.

6. The thermal management device according to claim 5, characterized in that, The liquid cooling mechanism, the first heat exchanger, and the first heat exchange medium flow channel are connected in sequence, with the first heat exchange medium flow channel located downstream of the first heat exchanger.

7. The thermal management device according to claim 1, characterized in that, The air-cooling mechanism further includes a first fan, and the air-cooling mechanism also forms a first inlet and a first outlet. The first inlet and the first outlet are located at both ends of the first air duct and are both connected to the first air duct. The first fan is used to guide the first gas from the first inlet into the first air duct and out from the first outlet.

8. The thermal management device according to claim 2, characterized in that, The liquid cooling mechanism includes: a first driving element and a fifth heat exchanger, wherein the first driving element and the fifth heat exchanger form a first flow path, and the first flow path and the first heat exchanger form a first loop.

9. The thermal management device according to claim 8, characterized in that, The first driving element is located upstream or downstream of the fifth heat exchanger.

10. The thermal management device according to claim 8, characterized in that, The liquid cooling mechanism further includes a second fan, which guides the second gas through the fifth heat exchanger.

11. The thermal management device according to claim 10, characterized in that, The liquid cooling mechanism has a second air duct, a second inlet, and a second outlet. The fifth heat exchanger corresponds to the second air duct. The second inlet and the second outlet are located at both ends of the second air duct and are connected to the second air duct. The second fan is used to guide the second gas from the second inlet into the second air duct and out from the second outlet.

12. The thermal management device according to claim 10, characterized in that, The liquid cooling mechanism further includes a humidifier located upstream of the fifth heat exchanger, along the flow direction of the second gas, and the humidifier is used to humidify the second gas.

13. The thermal management device according to any one of claims 8-12, characterized in that, The liquid cooling mechanism further includes a sprayer for spraying water toward the fifth heat exchanger.

14. The thermal management device according to any one of claims 8-12, characterized in that, The liquid cooling mechanism further includes: a sixth heat exchanger and a second driving member. The sixth heat exchanger forms a second heat exchange medium flow channel and a third heat exchange medium flow channel. The first flow channel and the second heat exchange medium flow channel form a second loop. The third heat exchange medium flow channel and the second driving member are adapted to form a third loop with the load to regulate the load temperature.

15. The thermal management device according to claim 14, characterized in that, The third heat exchanger has a fourth heat exchange medium flow channel and a second refrigerant flow channel. The second refrigerant flow channel is constructed as part of the first refrigerant circuit. The fourth heat exchange medium flow channel, the third heat exchange medium flow channel, and the second driving member are adapted to form the third circuit with the load to regulate the load temperature.

16. The thermal management device according to claim 15, characterized in that, The liquid cooling mechanism further includes a bypass valve, wherein the third heat exchange medium flow channel and the fourth heat exchange medium flow channel together form a second flow path, and the bypass valve is connected in parallel with the second flow path.

17. The thermal management device according to any one of claims 8-12, characterized in that, The first flow path is adapted to form a fourth loop with the load to regulate the load temperature.

18. The thermal management device according to claim 17, characterized in that, The third heat exchanger has a fourth heat exchange medium flow channel and a second refrigerant flow channel. The second refrigerant flow channel is constructed as part of the first refrigerant circuit. The first flow channel and the fourth heat exchange medium flow channel are adapted to form the fourth circuit with the load to regulate the load temperature.

19. A numerical control center, characterized in that, include: A thermal management device and a computer room, wherein a load is installed in the computer room, the thermal management device is a thermal management device according to any one of claims 1-18, the first gas in the first air duct can flow into the computer room, and the liquid cooling mechanism is used to regulate the temperature of the load.

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