Preparation method of high-brightness light guide plate

Abstract

The invention discloses a processing technology of a high-brightness light guide plate, which comprises the following steps: placing a substrate in punching equipment, and carrying out groove matrix processing on the substrate based on the punching equipment to obtain a die plate; electroplating and turning casting are conducted on the mold plate, so that a plurality of lattice point structures are formed in the groove matrix of the mold plate, and a lattice point structure nickel layer is obtained through separation; a composite film layer of a transition film and a diffusion film is prepared through a co-extrusion process, and the composite film layer is processed through a net point structure nickel layer to form a net point structure film layer; the screen dot structure film layer is attached to a light guide plate base material through a hot pressing transfer printing technology, and a light guide plate body is formed; and covering a reflecting film on the bottom surface of the light guide plate main body to form the high-brightness light guide plate. The composite film layer formed by matching the transition film and the diffusion film is arranged, the microstructure layer of the light guide plate is formed through the composite film layer, the influence of microstructure processing on the light guide plate base material is avoided, and the light emitting effect of a finished product of the light guide plate is improved.

Description

Technical Field

[0001] This invention relates to the field of light guide plate technology, and specifically to a method for preparing a high-brightness light guide plate. Background Technology

[0002] A light guide plate is an optical device structure that receives light emitted from a light source and guides the light to propagate, thereby adjusting the light emission effect. It is widely used in devices such as electronic displays.

[0003] The light-emitting surface of existing light guide plates is mainly formed by hot pressing a nickel plate with several protrusions, which is formed by electroplating and casting. This creates a microstructure surface with several grooves and dots, which is used to adjust the light emission effect. However, this method requires direct structural adjustment of the light guide plate substrate, which affects the light guiding effect of the substrate. Furthermore, due to processing errors, the light guiding effect of the substrate cannot be accurately set by relying on the dot structure design, which can easily affect the light emission effect of the finished light guide plate. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art. This invention provides a processing technology for a high-brightness light guide plate. By setting a composite film layer consisting of a transition film and a diffusion film, the microstructure layer of the light guide plate is formed through the composite film layer, avoiding the influence of microstructure processing on the light guide plate substrate and improving the light output effect of the finished light guide plate.

[0005] This invention provides a processing technology for a high-brightness light guide plate, the processing technology including:

[0006] S11: Place the substrate in the punching equipment and perform groove matrix processing on the substrate based on the punching equipment to obtain the mold plate.

[0007] S12: Electroplating and casting are performed on the mold plate to form several dot structures within the groove matrix of the mold plate, and the dot structure nickel layer is separated.

[0008] S13: A composite film layer forming a transition film and a diffusion film is prepared by co-extrusion process, and a dotted structure film layer is formed by processing the composite film layer with a dotted structure nickel layer;

[0009] S14: The dot structure film layer is attached to the light guide plate substrate by hot pressing transfer process to form the main body of the light guide plate;

[0010] S15: A reflective film is covered on the bottom surface of the light guide plate body to form a high-brightness light guide plate.

[0011] Furthermore, step S11 includes:

[0012] Based on the specifications and dimensions of the light guide plate, set the first and second punching parameters for the punching equipment;

[0013] The substrate is punched sequentially using the first punching parameter and the second punching parameter to form a plurality of staggered first grooves and second grooves on the substrate.

[0014] Furthermore, step S12 includes:

[0015] The mold plate and nickel plate are placed in an electrolyte solution and electrically connected by external circuit wires.

[0016] After an electrolysis operation of a preset time, a dotted nickel layer with several first bumps and several second bumps is formed on the mold plate.

[0017] Furthermore, step S12 also includes:

[0018] The mold plate is placed in an electroplating copper solution, and a copper sacrificial layer is formed on the surface of the mold plate based on the electroplating process;

[0019] The mold plate with the copper sacrificial layer is electroplated and cast to form the dotted nickel layer on the surface of the copper sacrificial layer.

[0020] Furthermore, step S12 also includes:

[0021] The mold plate with the dotted nickel layer is placed in an etching solution, and the copper sacrificial layer is etched and cleaned based on the etching solution, thereby achieving separation between the dotted nickel layer and the mold plate.

[0022] Furthermore, step S13 includes:

[0023] Maleic anhydride-grafted polyolefin particles were used as the transition membrane material, and MS resin particles were used as the diffusion membrane material.

[0024] Co-extrusion is performed according to a preset ratio and a preset extrusion rate to form a composite film layer of transition film and diffusion film;

[0025] A number of dot structures are transferred onto the composite film by hot pressing a nickel layer with a dot structure, thus forming a dot structure film.

[0026] Furthermore, step S13 also includes:

[0027] The ratio of the extrusion rate of the transition membrane to the extrusion rate of the diffusion membrane is set to 1:4.

[0028] Furthermore, the processing technology of the high-brightness light guide plate also includes:

[0029] After the transfer of the dot structure is completed, the dot structure film is etched using a laser etching device to form several transition grooves between several dot structures in the dot structure film.

[0030] Furthermore, step S14 includes:

[0031] The dotted structure membrane layer is attached to the mold plate accordingly;

[0032] The light guide plate substrate is installed and positioned inside the static pressure equipment, and the mold plate is set as the pressing plate of the static pressure equipment;

[0033] The pressing plate of the static pressure equipment is preheated, and the preheated pressing plate is pressed onto the light guide plate substrate.

[0034] Furthermore, step S15 includes:

[0035] The light guide plate substrate is kept under constant pressure during hot pressing and then demolded after cooling to obtain a high-brightness light guide plate.

[0036] This invention provides a method for preparing a high-brightness light guide plate. The method involves processing grooves in a mold plate, electroplating and casting to form a nickel layer with a dot structure, and combining this with a composite film hot-press transfer process. This method achieves precise replication of the dot structure while avoiding direct hot pressing of the substrate. It has the advantages of improving the processing accuracy of the dot structure, reducing damage to the optical performance of the substrate, and improving the brightness and uniformity of the light output of the light guide plate. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a process flow diagram of the high-brightness light guide plate in an embodiment of the present invention;

[0039] Figure 2 This is a process flow diagram of the composite film layer in an embodiment of the present invention. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] Figure 1 A process flow diagram of the high-brightness light guide plate in an embodiment of the present invention is shown. The process includes:

[0042] S11: Place the substrate in the punching equipment and perform groove matrix processing on the substrate based on the punching equipment to obtain the mold plate.

[0043] Groove matrix processing refers to forming a regularly arranged array of grooves on a substrate using a punching machine. Specifically, a CNC punching machine or laser engraving equipment can be used. First and second punching parameters are set to punch holes in the substrate, forming staggered first and second grooves. This processing method provides a precise mold foundation for subsequent dot matrix structures, ensuring that the groove distribution matches the light guiding requirements and reducing processing errors.

[0044] Furthermore, the substrate can be made of stainless steel plate. Since the stainless steel plate serves as the carrier for the groove matrix, the substrate has sufficient structural rigidity to meet the requirements of punching processing.

[0045] S12: Electroplating and casting are performed on the mold plate to form several dot structures within the groove matrix of the mold plate, and the dot structure nickel layer is separated.

[0046] Specifically, electroplating casting refers to the formation of a metal mesh structure in the groove of a mold plate using the principle of electrolytic deposition. Specifically, a copper sacrificial layer can be used as an intermediate medium. The mold plate and nickel plate are placed in an electrolytic solution, and a mesh structure nickel layer is formed on the surface of the copper sacrificial layer through an electroplating process. Then, the copper layer is removed by etching to separate the nickel layer, thereby obtaining a nickel layer with several bump structures.

[0047] S13: A composite film layer consisting of a transition film and a diffusion film is prepared by co-extrusion process, and a dotted structure film layer is formed by processing the composite film layer with a dotted structure nickel layer.

[0048] Specifically, the co-extrusion process for preparing the composite film refers to the simultaneous extrusion of two different materials. Maleic anhydride-grafted polyolefin particles and MS resin particles can be used as raw materials, and a transition film and a diffusion film can be simultaneously extruded in a preset ratio using a twin-screw extruder to form a composite film with optical control functions. This process improves light diffusion efficiency through material synergy.

[0049] S14: The dot structure film layer is attached to the light guide plate substrate by hot pressing transfer process to form the main body of the light guide plate;

[0050] Specifically, the hot-press transfer process refers to transferring the dot structure from a nickel layer to a composite film layer. This can be achieved by using a preheated mold plate as the pressing material, pressing the dot structure nickel layer onto the surface of the composite film layer under hot-pressing temperature to form the dot structure film layer. This process avoids the substrate directly bearing the processing stress through indirect transfer.

[0051] S15: A reflective film is covered on the bottom surface of the light guide plate body to form a high-brightness light guide plate.

[0052] Specifically, the reflective coating refers to setting a high reflectivity film layer on the bottom surface of the light guide plate. Specifically, a PET-based reflective film can be applied to the bottom surface of the substrate using vacuum coating or lamination processes. The reflective film can improve the overall brightness of the light guide plate by reflecting scattered light.

[0053] Furthermore, by processing the mold plate and composite film layer in stages, the dot structure is indirectly transferred to the surface of the light guide plate substrate. Specifically, a precise groove matrix is ​​first formed on an independent mold plate, and a separable nickel layer with dot structure is generated through electroplating and casting. Then, a composite film layer with optical control function is prepared through co-extrusion. Finally, the dot structure is hot-pressed and transferred to the composite film layer and attached to the substrate. This method avoids direct structural processing of the light guide plate substrate, reduces damage to the light guide path of the substrate, and improves the accuracy of the dot structure and the light control effect through the synergistic effect of the mold plate and composite film layer.

[0054] Specifically, the high-brightness light guide plate processing method provided in this embodiment of the invention effectively solves the problems caused by direct processing of the substrate in traditional processes through a step-by-step, indirect processing method. By separating the dot structure formation process from the substrate, the damage to the internal structure of the substrate caused by hot-pressing stress is avoided. At the same time, the introduction of the composite film layer not only ensures the accurate transfer of the dot structure, but also provides additional optical control capabilities.

[0055] Specifically, step S11 includes:

[0056] Based on the specifications and dimensions of the light guide plate, first and second punching parameters are set for the punching equipment. The substrate is then punched sequentially using these parameters, forming several staggered first and second grooves on the substrate. By setting first and second grooves of different sizes, the electroplated nickel layer can form several first and second bump structures. These bump structures with varying heights improve the light diffusion and reflection effects on the light-emitting surface of the light guide plate, thereby enhancing the light emission efficiency.

[0057] According to the specifications and dimensions of the light guide plate, the first punching parameters and the second punching parameters of the punching equipment are set; the substrate is punched sequentially with the first punching parameters and the second punching parameters to form a number of staggered first grooves and second grooves on the substrate.

[0058] The first and second punching parameters can include different punch diameters, punching depths, or punching spacings. For example, the first punching parameter might have a punch diameter of 0.5 mm, a punching depth of 30% of the substrate thickness, and a punching spacing of 1.2 mm; the second punching parameter might have a punch diameter of 0.8 mm, a punching depth of 40% of the substrate thickness, and a punching spacing of 1.5 mm. These two parameters are executed alternately during the punching process, resulting in a complementary arrangement of the dimensional differences between the first and second grooves. Through two punching operations with different parameters, the distribution density of the first and second grooves is superimposed, avoiding the regular gaps caused by a single parameter. During the punching process, the substrate is fixed to the punching equipment table with a positioning reference, ensuring that the positional deviation between the two punching operations is controlled within ±0.05 mm.

[0059] Specifically, the punching equipment matches the punching parameter combination according to the target size of the light guide plate. For example, when the light guide plate is 500 mm long, the punching row spacing in the first punching parameter is set to 3 mm, and the punching row spacing in the second punching parameter is set to 3.5 mm, with the two punching row directions offset by 1.5 mm. In the groove matrix formed by the parameter difference, the first and second grooves are asymmetrically distributed in both the horizontal and vertical directions. During the punching process, the first grooves formed when the first punching parameter is executed are arranged along the diagonal direction of the substrate, and the second grooves formed when the second punching parameter is executed are arranged along the other diagonal direction of the substrate, and the two intersect to form a diamond grid structure. This staggered arrangement reduces the minimum spacing between grooves from 0.8 mm under a single parameter to 0.4 mm, effectively improving the groove distribution density. In the subsequent electroplating and casting process, the formed groove matrix can form a complementary dot structure through nickel layer filling, reducing the problem of uneven light scattering caused by punching errors.

[0060] Specifically, step S12 includes:

[0061] A mold plate and a nickel plate are placed in an electrolyte solution and electrically connected via external wiring. After an electrolysis operation of a preset time, a dotted nickel layer with several first bumps and several second bumps is formed on the mold plate. The electrical connection between the mold plate and the nickel plate in the electrolyte solution is achieved through external wiring, which can be made of copper or silver, for example, multi-strand stranded copper wire to reduce resistance. The deposition rate can be adjusted by controlling the current density during the preset electrolysis operation; for example, the current density can be set to 0.5-2.0 A / dm³. 2The electrolysis time is controlled between 30 and 60 minutes. The distribution pattern of the first and second bumps can be achieved by adjusting the size difference of the grooves on the surface of the mold plate. For example, the depth of the first groove is 50-80 μm, and the depth of the second groove is 30-50 μm, so that a highly graded bump structure is formed after electrolytic deposition. The distance between the mold plate and the nickel plate can be set to 10-20 cm to balance the uniformity of the electric field and the deposition efficiency.

[0062] Specifically, a pre-processed matrix of grooves on the surface of the mold plate serves as a template for electrolytic deposition. Metal ions in the electrolyte migrate directionally to the mold plate surface under the influence of an applied electric field and preferentially deposit within the grooves to form bumps. The electrical connection method of the external circuitry ensures uniform current distribution, preventing dot adhesion caused by localized over-deposition. Pre-set time control ensures the deposition process terminates when the target bump height is reached; for example, the first bump height is 45-75 μm, and the second bump height is 25-40 μm, thus avoiding structural deformation caused by over-deposition. Different types of bumps are formed through variations in groove size; for example, the first groove width is 100-150 μm, and the second groove width is 60-100 μm, ensuring that the post-deposition bump size matches the groove, guaranteeing consistent dot structure morphology. After electrolysis, the nickel layer of the dot structure is separated from the mold plate by mechanical separation or chemical etching. The separation efficiency can be optimized by controlling the deposition layer thickness and interfacial adhesion. As a result, the forming accuracy and separation efficiency of the dot structure nickel layer are significantly improved, while avoiding the demolding damage problem caused by excessive bonding force in traditional electroplating casting.

[0063] Furthermore, step S12 also includes:

[0064] The mold plate is placed in a copper plating solution, and a copper sacrificial layer is formed on the surface of the mold plate using the electroplating process. The mold plate with the copper sacrificial layer is then electroplated and cast, and the dotted nickel layer is formed on the surface of the copper sacrificial layer. The formation of the copper sacrificial layer can be achieved by controlling the electroplating process parameters, for example, using a copper sulfate solution as the electroplating solution at a current density of 2-5 A / dm³. 2 Electroplating is performed for 10-30 minutes under suitable conditions. The copper layer thickness can be controlled within the range of 5-20 μm, ensuring both the uniformity of subsequent nickel layer deposition and facilitating etching separation. During the electroplating casting process, the nickel layer preferentially deposits on the copper layer surface. Due to the high lattice matching degree between copper and nickel, the nickel layer can grow uniformly along the copper layer surface, thereby improving the forming accuracy of the dot structure to within ±2 μm.

[0065] After a copper sacrificial layer is placed between the mold plate and the nickel layer, the separation operation can be achieved through chemical etching. For example, a mixed solution of nitric acid and ferric chloride is used to selectively etch the copper layer, while the nickel layer is preserved intact due to its high corrosion resistance. The etching time can be adjusted according to the thickness of the copper layer, usually 3-10 minutes. During this time, the surface roughness of the mold plate can be controlled to Ra≤0.1μm, meeting the requirements for repeated processing.

[0066] Specifically, after a copper sacrificial layer forms on the surface of the mold plate, a metallic bond is formed between the nickel layer and the copper layer during the electroplating and casting process. This bond strength is higher than the direct bond strength between the nickel layer and the mold plate. When separation is required, the copper sacrificial layer is dissolved by an etching solution, completely eliminating the interfacial bonding force between the nickel layer and the mold plate. The separation process requires no external mechanical force. For example, after immersing in the etching solution for 5 minutes, the nickel layer can automatically detach from the mold plate surface, improving separation efficiency by more than 50%.

[0067] By adjusting the electroplating copper process parameters, the bonding strength between the copper layer and the mold plate can be optimized. For example, when the copper layer thickness is 10μm, its peel strength with the mold plate is 0.5-0.8 N / mm. 2 It can withstand the scouring of the solution during the electroplating casting process while ensuring complete interface failure during etching separation. A gradient current density control strategy is employed, with an initial current density of 1 A / dm³. 2 The current density for depositing the copper substrate was initially increased to 3 A / dm². 2 Accelerated deposition can reduce the surface roughness of the copper layer to Rz≤5μm, which is beneficial to the forming accuracy control of the nickel layer dot structure.

[0068] Specifically, step S12 further includes:

[0069] A mold plate with a dotted nickel layer is placed in an etching solution. The copper sacrificial layer is then etched and cleaned using the etching solution, achieving separation between the dotted nickel layer and the mold plate. The copper sacrificial layer is formed on the surface of the mold plate through an electroplating process, and its thickness can be controlled within the range of 5-20 micrometers.

[0070] Furthermore, in this embodiment, the etching solution can be an acidic solution system, such as a mixture of nitric acid and sulfuric acid, wherein the concentration of nitric acid can be 10%-30% and the concentration of sulfuric acid can be 5%-15%. The immersion time of the mold plate and the dot structure nickel layer in the etching solution can be 10-60 minutes, with the specific time adjusted according to the thickness of the copper layer. The substrate of the mold plate can be stainless steel or titanium alloy, whose corrosion resistance can prevent erosion by the etching solution. The thickness of the dot structure nickel layer can be 0.1-0.5 mm, and its dense structure can effectively block the penetration of the etching solution.

[0071] Specifically, when the composite structure is placed in the etching solution, the copper sacrificial layer undergoes a redox reaction with the acidic solution, generating soluble copper salts which are gradually dissolved. During this process, the metal substrate of the mold plate forms a protective oxide film due to its passivation properties, while the nickel layer of the dot structure remains stable due to its high standard electrode potential. As the copper layer is completely dissolved, the bonding force between the nickel layer and the mold plate is completely eliminated, allowing for non-destructive separation with only slight external force. For example, when the copper layer thickness is 15 micrometers, etching can be completed by using a mixture of 20% nitric acid and 8% sulfuric acid at 40°C for 25 minutes. This separation method avoids the deformation of the nickel layer dots caused by traditional mechanical peeling, while eliminating the influence of copper residue on subsequent hot-press transfer processes, ensuring that the dimensional accuracy of the light guide plate dot structure is controlled within ±2 micrometers.

[0072] Specifically, Figure 2 A process flow chart of the composite film layer in an embodiment of the present invention is shown, wherein step S13 includes:

[0073] S131: Maleic anhydride-grafted polyolefin particles are set as the transition membrane material, and MS resin particles are set as the diffusion membrane material.

[0074] Specifically, the grafted polar groups of maleic anhydride-grafted polyolefin particles can form chemical bonds with the metal surface of the dotted nickel layer, enhancing the interfacial bonding force; the high light transmittance and light scattering properties of MS resin particles can optimize the light diffusion uniformity of the composite film.

[0075] S132: Co-extrusion operation is performed according to a preset ratio and preset extrusion rate to form a composite film layer of transition film and diffusion film;

[0076] The thickness ratio of the transition film to the diffusion film and the degree of interface fusion are controlled by setting a preset ratio and extrusion rate.

[0077] S133: By hot pressing the dot-structured nickel layer with the composite film layer, several dot structures are transferred onto the composite film layer to form a dot-structured film layer.

[0078] During the hot pressing process, the dot structure nickel layer is precisely transferred to the surface of the composite film layer. The transfer temperature can be controlled at 150-180℃, and the pressure range is set to 5-10MPa to ensure the complete replication of the dot structure.

[0079] Specifically, maleic anhydride-grafted polyolefin particles are melt-extruded using a twin-screw extruder to form a transition film, while MS resin particles are extruded using another extruder to form a diffusion film. These two molten materials are then layered in a pre-defined ratio within a co-extrusion die to form a composite film layer with fused interfaces. This composite film layer is then fed into a hot press, where it comes into contact with a pre-prepared dot-structured nickel layer. Under the influence of temperature and pressure, the raised dot structures on the nickel layer surface are pressed into the composite film layer surface, forming corresponding grooved dot structures. Due to the flexibility and polar groups of the transition film, the dot structure maintains its integrity during the transfer process, preventing edge cracking or deformation. The light scattering properties of the diffusion film ensure uniform light diffusion within the composite film layer, reducing local brightness differences. Thus, the composite film layer achieves high-precision structural transfer with the dot-structured nickel layer while ensuring the optical uniformity of the light guide plate, allowing for indirect control of the light guiding effect without directly processing the light guide plate substrate.

[0080] Furthermore, step S13 also includes:

[0081] The extrusion rate ratio between the transition membrane and the diffusion membrane is set to 1:4. The transition membrane uses maleic anhydride-grafted polyolefin particles as raw material, and the diffusion membrane uses MS resin particles as raw material. The melt flow rate of the maleic anhydride-grafted polyolefin can be controlled within the range of 0.5-2.0 g / 10 min, and the melt flow rate of the MS resin can be controlled within the range of 8.0-10.0 g / 10 min. The rate ratio can be further set to 1:3 to 1:5, for example, 1:4. During co-extrusion, the transition membrane is extruded at a lower rate to form a support layer, and the diffusion membrane is extruded at a higher rate to form a cover layer. The difference in flow characteristics between the two materials is adjusted by the rate ratio so that the difference in melt flow rate at the die exit is controlled within ±5%. By controlling the extrusion rates of the two raw materials, the two raw materials can be formed into a film according to a preset ratio, ensuring the formation of a composite film material of the transition membrane and the diffusion membrane.

[0082] Specifically, maleic anhydride-grafted polyolefin particles are extruded through a first extruder at a temperature of 180-220℃ and a linear velocity of 0.8-1.2 m / min, while MS resin particles are extruded through a second extruder at a temperature of 200-240℃ and a linear velocity of 3.2-4.8 m / min. When the two melts converge in the co-extrusion die, the flow rate of the transition film is limited to 25% of the flow rate of the diffusion film, thereby eliminating abrupt changes in interfacial shear stress. The thickness of the support layer of the transition film is controlled at 10-20 μm, and the thickness of the cover layer of the diffusion film is controlled at 40-80 μm. Through this rate ratio, the surface roughness of the composite film layer can be reduced to Ra≤0.5 μm before entering the hot-press transfer process, thereby ensuring that the bumps of the dot-matrix nickel layer can be completely transferred to the surface of the composite film layer. As a preferred embodiment, the solution of this application is implemented as follows: When preparing the composite film layer of the transition film and the diffusion film in the co-extrusion process, the ratio of the extrusion rate of the transition film to the extrusion rate of the diffusion film is set to 1:4. Specifically, the extrusion rate of the transition film can be set to 25 mm / s, and the extrusion rate of the diffusion film can be set to 100 mm / s. This rate ratio setting can ensure that the two materials form a uniformly distributed composite film layer during the co-extrusion process. The transition film uses maleic anhydride-grafted polyolefin particles as raw material, and the diffusion film uses MS resin particles as raw material. Thus, the transition film is extruded at a lower rate to form a stable support structure, while the diffusion film is extruded at a higher rate to quickly cover the surface of the transition film, forming a uniform diffusion functional layer.

[0083] Specifically, the processing technology of the high-brightness light guide plate also includes:

[0084] After the transfer of the dot structure is completed, the dot structure film is etched using a laser etching device to form several transition grooves between several dot structures in the dot structure film. The processing parameters of the laser etching device can be set to a wavelength range of 355 nm to 1064 nm, and the power density can be controlled at 5 × 10⁻⁶. 4 Watts / cm² to 1×10 6 Within the watt-per-square-centimeter range, the pulse frequency is set to 10 kHz to 100 kHz. Transition grooves are formed on the composite film layer using laser etching equipment. The depth of the transition grooves can be set to 10% to 30% of the dot structure height, and the width to 20% to 50% of the dot spacing. The distribution density is adjusted according to the density of the dot structure. During the etching process, the sidewalls of the transition grooves are tilted at an angle of 5 to 15 degrees by focusing the laser beam, thereby guiding the light to form a gradual refraction between adjacent dots.

[0085] Furthermore, on the dot-structured film layer formed by hot-press transfer, laser etching equipment selectively processes the inter-dot gap regions through scanning path planning. When the laser beam acts on the surface of the composite film layer, the high energy density causes the film material to vaporize or melt, forming transition grooves with specific geometric parameters. The microstructure of these transition grooves can change the propagation direction of light at the edges of the dots, allowing the originally discrete scattering paths to form a continuous light distribution through the refraction of the transition grooves. In actual use of the light guide plate, the inclined sidewalls of the transition grooves can convert some of the laterally propagating light into longitudinally propagating light, reducing the brightness difference between the dot structures to below 5%, ultimately improving the uniformity of the light-emitting surface.

[0086] Specifically, step S14 includes:

[0087] The dotted structure membrane layer is attached to the mold plate accordingly;

[0088] The light guide plate substrate is installed and positioned inside the static pressure equipment, and the mold plate is set as the pressing plate of the static pressure equipment;

[0089] The pressing plate of the static pressure equipment is preheated, and the preheated pressing plate is pressed onto the light guide plate substrate.

[0090] During the positioning process of the mold plate and the light guide plate substrate, their positions can be calibrated using mechanical limiting devices or a vision positioning system. For example, a clamp with positioning pins can be used to fix the light guide plate substrate, maintaining a preset distance between it and the dot structure of the mold plate. The preheating temperature can be controlled within the range of 100-150℃, and the pressing time can be set to 5-10 seconds. This combination of parameters ensures that the dot structure film layer is transferred in a softened state. The preheating process of the pressing plate can adopt a segmented heating method to avoid deformation of the material due to sudden temperature changes.

[0091] Specifically, the bonding of the dot-matrix structure film layer and the mold plate must ensure a one-to-one correspondence between the dot positions. This can be achieved by pre-setting positioning marks, such as setting a crosshair reference line on the edge of the mold plate and aligning it with the corresponding mark on the dot-matrix structure film layer. The installation and positioning of the light guide plate substrate within the static pressing equipment must eliminate horizontal displacement. For example, a vacuum adsorption platform can be used to fix the substrate, while a pressure sensor monitors the pressure distribution on the pressing contact surface. When the pressure difference exceeds 5%, position correction is triggered. When the preheated pressing plate contacts the light guide plate substrate, its temperature gradient must be controlled within ±3℃. This can be achieved by monitoring the surface temperature of the plate in real time using a thermal imager and adjusting the heating power using a closed-loop temperature control system. During the pressing process, the dot-matrix structure film layer, under uniform pressure in a thermally softened state, gradually embeds into the surface of the light guide plate substrate. For example, a continuous pressure of 0.5-1.0 MPa can be applied to form a molecular-level bond between the film layer and the substrate interface. As a result, the transfer accuracy of the dot structure can be controlled within ±5μm, and the uniformity of hot-pressing stress distribution is improved to over 90%, effectively ensuring the consistency of the optical performance of the light guide plate body.

[0092] Specifically, step S15 includes:

[0093] A high-brightness light guide plate is obtained by maintaining a stable pressure on the light guide plate substrate under hot-pressing temperature and demolding after cooling. The stable pressure bonding can be achieved by using a closed-loop pressure control system or a mechanical limiting structure to maintain the bonding pressure within a constant range, such as 0.5-2.0 MPa, to offset pressure fluctuations caused by thermal expansion. The cooling and demolding step can be achieved through gradient cooling, for example, by reducing the temperature in stages at a rate of 5-10°C per minute to avoid material shrinkage differences due to sudden cooling. The stable pressure bonding and the co-extrusion process of the composite film layer in the preceding steps have a synergistic effect. Under constant pressure, the maleic anhydride-grafted polyolefin transition film can fully fill the microscopic gaps in the dotted nickel layer, while the MS resin diffusion film can suppress crystallization stress during controlled cooling. The combination of these two processes improves interfacial adhesion and optical uniformity.

[0094] Specifically, during the hot-pressing process, the light guide plate substrate and the dot-matrix structure film are continuously pressurized above their glass transition temperature, causing the transition film to melt and flow, completely filling the groove structure formed by the nickel layer bumps. For example, a pressure of 1.2 MPa is maintained at 120-150°C for 30-60 seconds. The cooling stage is achieved through stepwise cooling. First, the temperature is lowered to 80-100°C by natural cooling, and then accelerated to room temperature by air cooling. This process causes the molecular chains of the diffusion film to arrange in an orderly manner, reducing the rebound of the dot structure caused by thermal stress. The combination of stable pressure pressing and gradient cooling controls the dot structure transfer depth deviation within ±3μm, while the interface peel strength is increased to over 2.5N / mm, a significant improvement compared to the 1.8N / mm of the traditional rapid cooling process. The resulting light guide plate body, after being covered with the reflective film, can achieve a light utilization rate of over 92%, and the dot deformation rate is less than 0.5%.

[0095] This invention provides a method for preparing a high-brightness light guide plate. The method involves processing grooves in a mold plate, electroplating and casting to form a nickel layer with a dot structure, and combining this with a composite film hot-press transfer process. This method achieves precise replication of the dot structure while avoiding direct hot pressing of the substrate. It has the advantages of improving the processing accuracy of the dot structure, reducing damage to the optical performance of the substrate, and improving the brightness and uniformity of the light guide plate.

[0096] Furthermore, the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A process for processing a high brightness light guide plate, characterized by, The processing technology comprises: S11: placing the substrate in a punching device, processing the substrate based on the punching device to form a groove matrix, and obtaining a mold plate; S12: electroplating the mold plate to form a plurality of dot structures in the groove matrix of the mold plate, and separating to obtain a nickel layer of the dot structure; S13: preparing a composite film layer of a transition film and a diffusion film through a co-extrusion process, and processing the composite film layer through the nickel layer of the dot structure to form a dot structure film layer; S14: attaching the dot structure film layer to the light guide plate substrate through a hot pressing transfer printing process to form a light guide plate body; S15: covering a reflective film on the bottom surface of the light guide plate body to form a high-brightness light guide plate.

2. The process for manufacturing a high brightness light guide plate according to claim 1, wherein, The step S11 comprises: According to the size of the light guide plate, set the first punching parameter and the second punching parameter of the punching device; In turn, the first punching parameter and the second punching parameter are used to punch the substrate to form a plurality of first grooves and second grooves distributed in a staggered manner on the substrate.

3. The process for manufacturing a high-luminance light guide plate according to claim 1, wherein The step S12 comprises: Place the mold plate and the nickel plate in the electrolytic solution, and electrically connect the mold plate and the nickel plate through the external circuit wire; After a preset time of electrolysis, a nickel layer with a plurality of first protrusions and a plurality of second protrusions is formed on the mold plate.

4. The process for manufacturing a high-luminance light guide plate according to claim 3, wherein The step S12 further comprises: Place the mold plate in the electroplating copper liquid, and form a copper sacrificial layer on the surface of the mold plate based on the electroplating process; The mold plate with the copper sacrificial layer is electroplated to form the nickel layer on the surface of the copper sacrificial layer.

5. The process for processing a high-luminance light guide plate according to claim 4, wherein The step S12 further comprises: Place the mold plate with the nickel layer in the etching solution, and etch and clean the copper sacrificial layer based on the etching solution to separate the nickel layer and the mold plate.

6. The process for manufacturing a high-luminance light guide plate according to claim 1, wherein The step S13 comprises: Set maleic anhydride grafted polyolefin particles as the transition film raw material, and set MS resin particles as the diffusion film raw material; Carry out co-extrusion operation at a preset ratio and a preset extrusion rate to form a composite film layer of a transition film and a diffusion film; Heat press the dot structure nickel layer and the composite film layer to transfer a plurality of dot structures on the composite film layer to form a dot structure film layer.

7. The process for processing a high-luminance light guide plate according to claim 6, wherein The step S13 further comprises: The rate ratio between the extrusion rate of the transition film and the extrusion rate of the diffusion film is 1:

4.

8. The process for manufacturing a high-luminance light guide plate according to claim 1, wherein The processing technology of the high-brightness light guide plate further comprises: After the transfer of the dot structure is completed, etch the dot structure film layer based on a laser etching device to form a plurality of transition grooves between the plurality of dot structures of the dot structure film layer.

9. The process for manufacturing a high-luminance light guide plate according to claim 1, wherein The step S14 comprises: The dot structure film layer is correspondingly attached to the mold plate; Install and position the light guide plate substrate in the static pressure device, and set the mold plate as the pressing plate of the static pressure device; Preheat the pressing plate of the static pressure device, and press the preheated pressing plate on the light guide plate substrate.

10. The process for manufacturing a high-luminance light guide plate according to claim 9, wherein The step S15 comprises: Maintain the stable pressing of the light guide plate substrate at the hot pressing temperature, and complete demolding after cooling to obtain a high-brightness light guide plate.

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