Laser precision correction method, laser processing method, storage medium and related system

Abstract

The embodiment of the application relates to the technical field of laser processing, and provides a laser precision correction method, a laser processing method, a storage medium and related systems. The laser precision correction method comprises data acquisition, speed calculation, correction matrix generation and iterative optimization.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and more specifically, to a laser precision correction method, a laser processing method, a storage medium, and a related system. Background Technology

[0002] Existing laser processing methods are insufficient to guarantee the precision of laser processing, resulting in problems such as misalignment of broken parts of the pattern, misalignment of splicing, and inconsistent spacing during the laser processing process. Summary of the Invention

[0003] The first aspect of this application provides a laser accuracy correction method, which includes:

[0004] Data acquisition: Acquire the timing coordinates and timing of the marking path at multiple locations within the processing area. The timing coordinates of the marking path include the coordinates generated when the laser moves along each of the four directions: the positive direction of the first axis, the negative direction of the first axis, the positive direction of the second axis, and the negative direction of the second axis. The first axis is perpendicular to the second axis.

[0005] Velocity calculation: Based on the timing coordinates and timing of the marking path at the multiple locations, the local instantaneous velocities of each of the multiple locations in the four directions are calculated;

[0006] Correction matrix generation: Based on the local instantaneous velocity and corresponding theoretical velocity in each of the four directions, a set of correction matrices is generated, the set of correction matrices comprising four correction matrices corresponding to the four directions respectively; and

[0007] Iterative optimization: Determine whether the local instantaneous velocities of the multiple positions in the four directions are all within the preset accuracy range. If not, update the laser processing accuracy parameters using the correction matrix group and repeat the data acquisition steps to the iterative optimization steps. If yes, store the laser processing accuracy parameters generated last time.

[0008] The laser precision correction method of the first aspect of this application, through iterative optimization, continuously reduces the deviation between the actual laser processing speed and the theoretical speed, which is beneficial for compensating for the precision of laser processing. Furthermore, the correction matrix is ​​calculated based on actual measurement data and can adaptively compensate for processing deviations caused by speed fluctuations during laser marking, thereby improving graphic accuracy and the uniformity of processing results.

[0009] In some embodiments, the data acquisition step includes:

[0010] Using a pulsed laser, marking is performed by reciprocating along the first and second axes within the processing area, and the timing coordinates of the marking path are obtained by measuring the laser pulse points generated during marking.

[0011] or,

[0012] The timing coordinates of the marking path are obtained by using the galvanometer position feedback signal of the laser processing system.

[0013] In some embodiments, in the velocity calculation step, at coordinates (x... i ,y j) The local instantaneous velocity v along the positive direction of the first axis at that location. x+ (i,j), local instantaneous velocity v along the negative direction of the first axis x -(i,j), local instantaneous velocity v along the positive direction of the second axis y+ (i,j), local instantaneous velocity v along the negative direction of the second axis y- (i,j) respectively satisfy:

[0014] v x+ (i,j)=(x + i+1 -x + i-1 ) / (2·Δt);

[0015] v x- (i,j)=(x - i+1 -x - i-1 ) / (2·Δt);

[0016] v y+ (i,j)=(y + j+1 -y + j-1 ) / (2·Δt);

[0017] v y- (i,j)=(y - j+1 -y - j-1 ) / (2·Δt);

[0018] Where, x + i+1 and x + i-1 The coordinates are (x) i ,y j At position ), along the positive upward direction of the first axis, the first axis coordinate of the timing coordinate of the next marking path and the first axis coordinate of the timing coordinate of the previous marking path;

[0019] x - i+1 and x - i-1The coordinates (x) i ,y j At position ), along the negative direction of the first axis, the first axis coordinate of the timing coordinate of the next marking path and the first axis coordinate of the timing coordinate of the previous marking path;

[0020] y + j+1 and y + j-1 The coordinates (x) i ,y j At point ), along the positive upward direction of the second axis, the second axis coordinates of the timing coordinates of the next marking path and the second axis coordinates of the timing coordinates of the previous marking path;

[0021] y - j+1 and y - j-1 The coordinates (x) i ,y j At position ), along the negative direction of the second axis, the second axis coordinates of the timing coordinates of the next marking path and the second axis coordinates of the timing coordinates of the previous marking path;

[0022] i and j are both integers greater than or equal to 2, and Δt is the time interval.

[0023] In some embodiments, the step of generating the correction matrix includes:

[0024] For any of the four directions, the corresponding correction matrix M -1 Calculated using the following formula:

[0025] M -1 =T ij ·A ij -1 ;

[0026] Among them, T ij A is a theoretical velocity matrix composed of the theoretical velocities of the multiple positions in this direction; ij -1 It is the inverse matrix of the measured velocity matrix, which is composed of the local instantaneous velocities calculated from the multiple positions in this direction.

[0027] In some embodiments, the preset accuracy means that the deviation between the local instantaneous velocity of the plurality of positions in any of the four directions and the theoretical velocity does not exceed 0.05%.

[0028] A second aspect of this application provides a laser processing method, which performs laser processing using a correction matrix set generated by the laser accuracy correction method provided in the first aspect of this application, comprising:

[0029] Obtain the target speed of the laser processing system;

[0030] The target velocity is decomposed into a first-axis velocity component and a second-axis velocity component;

[0031] Based on the directions of the first axis velocity component and the second axis velocity component, a corresponding correction matrix is ​​selected from the correction matrix group;

[0032] The target velocity is compensated using the selected correction matrix to obtain the compensated drive velocity; and

[0033] The laser processing system is controlled to perform processing based on the compensated drive speed.

[0034] The laser processing method of the second aspect of this application has at least the same advantages as the laser accuracy correction method provided in the first aspect of this application, and will not be described in detail here.

[0035] In some embodiments, the processing parameters of the laser processing system satisfy one or more of the following parameters: wavelength from 300 nm to 1200 nm, pulse width of 10 nm. -13 s to 10 -7 s, single pulse energy is 10 -5 J to 1J, with a frequency of 10 5 Hz to 2×10 6 Hz, with processing speeds ranging from 1m / s to 200m / s.

[0036] A third aspect of this application provides a computer-readable storage medium. This computer-readable storage medium stores a computer program, which, when executed by a processor, implements the laser precision correction method provided in the first aspect of this application or the laser processing method provided in the second aspect of this application.

[0037] The computer-readable storage medium of the third aspect of this application has at least the same advantages as the laser precision correction method provided in the first aspect of this application or the laser processing method provided in the second aspect of this application, and will not be described in detail hereafter.

[0038] The fourth aspect of this application provides a laser processing system. The laser processing system includes a laser, a galvanometer, a field lens, and a control module. The laser is used to emit a laser beam; the galvanometer is located between the laser and the field lens and is used to deflect the laser beam to the field lens; the field lens is used to focus the laser beam onto the processing area; the control module is used to control the operation of the laser and the galvanometer, and to execute the laser accuracy correction method provided in the first aspect of this application or the laser processing method provided in the second aspect of this application.

[0039] The laser processing system of the fourth aspect of this application has at least the same advantages as the laser accuracy correction method provided in the first aspect of this application or the laser processing method provided in the second aspect of this application, and will not be described in detail here.

[0040] In some embodiments, the galvanometer further includes at least one set of lenses for dynamically focusing the laser beam on a third axis perpendicular to the first and second axes.

[0041] In some embodiments, the laser processing system further includes a beam shaping module located between the laser and the galvanometer for modulating the laser beam.

[0042] In some embodiments, the beam shaping module includes: at least two mirrors, a beam expander, and a diffractive optical element; the at least two mirrors are used to adjust the direction of the laser beam; the beam expander is used to expand the laser beam; and the diffractive optical element is used to adjust the energy density distribution of the laser beam so that the laser beam spot presents any one of the following forms: a circular flat-top spot, a rectangular flat-top spot, a stripe spot, a dotted spot, or a dot matrix spot. Attached Figure Description

[0043] Figure 1 This is a flowchart of a laser accuracy correction method according to an embodiment of this application.

[0044] Figure 2 This is a schematic diagram of a laser processing system according to an embodiment of this application.

[0045] Explanation of key component symbols: S21, S22, S23, S24: steps; 100: laser processing system; 10: laser; 20: galvanometer; 30: field mirror; 40: control module; 50: beam shaping module; 51: first reflecting mirror; 52: second reflecting mirror; 53: beam expander; 54: diffractive optical element; A: processing area.

[0046] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0047] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of this application, and should not be construed as limiting this application.

[0048] In the description of the embodiments of this application, the terms "upper", "lower", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the implementation of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0049] In the description of the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features.

[0050] In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0051] In the description of the embodiments of this application, unless otherwise stated, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the two components; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components.

[0052] Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0053] The inventors of this application discovered during the development of this application that in existing high-speed laser marking methods using galvanometers and F-Theta lenses, to ensure the accuracy of laser processing and compensate for pattern distortion caused by the F-Theta lens, it is usually necessary to calibrate the galvanometer to match the actual value of the marking position with the theoretical value. Specifically, the galvanometer controls the laser to mark a dot matrix on the processing area, and the actual coordinates of each point in the dot matrix are measured using measuring equipment. These coordinates are then fitted and calculated with the theoretical coordinates of each point. After several calibration steps, the deviation between the actual coordinates and the theoretical coordinates of each point in the dot matrix is ​​brought within a controlled precision.

[0054] However, existing galvanometer calibration methods only consider positional accuracy and compensation during laser marking. This is applicable to simple graphics and low-speed marking applications, but when faced with complex graphics, such as graphics turning, breaking, splicing, and alignment, or for high-speed marking, such as laser processing speeds greater than 50m / s, conventional calibration methods are insufficient to guarantee laser processing accuracy. This will lead to problems such as misaligned graphics break positions, misaligned splicing, and inconsistent spacing. In the semiconductor processing field, especially in the photovoltaic cell processing field, this has become a bottleneck for laser processing accuracy.

[0055] In response, this application provides a laser precision correction method that corrects the actual laser processing speed to make the actual laser processing speed consistent with the theoretical speed, thereby eliminating the speed difference of reciprocating marking, improving the pattern accuracy and processing uniformity, and achieving compensation for laser precision.

[0056] It should be noted that the speed difference in reciprocating marking mentioned above is an inherent speed variation of the galvanometer during its movement. Its amplitude is generally 0.2% to 0.5% of the set speed, and it introduces a significant cumulative error with each laser reciprocating marking process. Specifically, during high-speed laser marking, due to differences in galvanometer control methods and stability, the actual marking speed cannot be guaranteed to be completely consistent with the theoretical speed. A speed fluctuation of 0.2% to 0.5% is typical during reciprocating marking. This will lead to a significant speed difference in high-speed marking, resulting in a large pattern alignment error over time, typically ±20μm to 50μm, which is unacceptable in laser precision machining.

[0057] Figure 1 This is a flowchart of a laser accuracy correction method according to an embodiment of this application. Figure 1 As shown, a laser accuracy correction method according to an embodiment of this application includes steps S21 to S24. Depending on different requirements, the order of some steps or sub-steps in the laser accuracy correction method can be changed, and some steps or sub-steps can be omitted or combined.

[0058] Step S21: Data Acquisition.

[0059] In some embodiments, step S21 includes acquiring the timing coordinates and timing of the marking path at multiple positions within the processing area. The timing coordinates of the marking path include the coordinates generated when the laser moves along each of the four directions: the positive direction of the first axis, the negative direction of the first axis, the positive direction of the second axis, and the negative direction of the second axis. The first axis is perpendicular to the second axis. In some embodiments, the first axis is also referred to as the X-axis, and the second axis as the Y-axis.

[0060] In some embodiments, the data acquisition step uses one of the following methods to obtain the timing coordinates of the marking path at each position within the processing area:

[0061] Method 1: Using a pulsed laser, reciprocate marking along the first axis and the second axis within the processing area, and measure the timing coordinates of the marking path along the positive direction of the first axis, the negative direction of the first axis, the positive direction of the second axis, and the negative direction of the second axis at each position within the processing area;

[0062] Method 2: Obtain the timing coordinates of the marking path at each position by using the galvanometer position feedback signal of the laser processing system.

[0063] In some embodiments, method one includes pre-marking. Pre-marking includes: using a pulsed laser with preset laser processing parameters, reciprocatingly marking along a first and second axis that are perpendicular to each other within a preset processing area.

[0064] In some embodiments, during the pre-marking step, the preset laser processing parameters satisfy the following: the wavelength of the pulsed laser is 300nm to 1200nm (e.g., 300nm to 500nm, 500nm to 800nm, 800nm ​​to 1000nm, 1000nm to 1200nm), and the pulse width is 10. - 13 s to 10 -7 s (e.g., 10) -13 s to 10 -11 s, 10 -11 s to 10 -9 s, 10 -9 s to 10 -8 s, 10 -8 s to 10 -7 s), single pulse energy is 10 - 5 J to 1J (e.g., 10) -5 J to 10 -4 J, 10 -4 J to 10 -3 J, 10 -3 J to 10 -2 J, 10 -2 J to 10 -1 J, 10 -1 J to 1J), with a frequency of 10 5 Hz to 2×10 6 Hz (e.g., 10) 5 Hz to 10 6 Hz, 10 6 Hz to 1.5×10 6 Hz, 1.5×10 6 Hz to 2×10 6 Hz), processing speeds from 1m / s to 200m / s (e.g., 1m / s to 20m / s, 20m / s to 50m / s, 50m / s to 80m / s, 80m / s to 120m / s, 120m / s to 150m / s, 150m / s to 200m / s).

[0065] Based on the aforementioned preset laser processing parameters, marking is performed reciprocally along the positive and negative directions of the first axis within the preset processing area, as well as reciprocally along the positive and negative directions of the second axis.

[0066] In some embodiments, the marking trajectory can be, but is not limited to, line segments, grids, or other preset patterns.

[0067] In some embodiments, optical measuring equipment is used to measure the timing coordinates of the marking path at various locations within the processing area. The optical measuring equipment can be, but is not limited to, a charge-coupled device (CCD) camera or an optical microscope.

[0068] In some embodiments, the measurement points should cover the entire processing area and be dense enough to reflect speed changes.

[0069] Step S22: Speed ​​calculation.

[0070] In some embodiments, step S22 includes calculating the local instantaneous velocity of each of the multiple locations in the four directions based on the timing coordinates and timing of the marking path of the multiple locations.

[0071] In some embodiments, step S22 includes differentiating the coordinates of each location with respect to time to obtain the local instantaneous velocity of each location in the four directions.

[0072] In some embodiments, in step S22, for each of the positive, negative, positive and negative directions of the first axis, the measured pulse point coordinates are differentiated over time to calculate the local instantaneous velocity of each position in the above four directions.

[0073] At coordinates (x i ,y j) At that point, the local instantaneous velocity v of the laser along the positive direction of the first axis x+ (i,j), local instantaneous velocity v along the negative direction of the first axis x- (i,j), local instantaneous velocity v along the positive direction of the second axis y+ (i,j), local instantaneous velocity v along the negative direction of the second axis y -(i,j) respectively satisfy:

[0074] v x+ (i,j)=(x + i+1 -x + i-1 ) / (2·Δt);

[0075] v x- (i,j)=(x - i+1 -x - i-1 ) / (2·Δt);

[0076] v y+ (i,j)=(y + j+1 -y + j-1 ) / (2·Δt);

[0077] v y- (i,j)=(y -j+1 -y - j-1 ) / (2·Δt).

[0078] Where, x + i+1 and x + i-1 The coordinates (x) i ,y j At position ), along the positive upward direction of the first axis, the coordinates of the first axis of the timing coordinates of the subsequent marking path and the first axis of the timing coordinates of the previous marking path; x - i+1 and x - i-1 The coordinates (x) i ,y j At position ), along the negative direction of the first axis, the coordinates of the first axis of the timing coordinates of the subsequent marking path and the coordinates of the first axis of the timing coordinates of the previous marking path; y + j+1 and y + j-1 The coordinates (x) i ,y j At position ), along the positive upward direction of the second axis, the second axis coordinates of the timing coordinates of the subsequent marking path and the second axis coordinates of the timing coordinates of the previous marking path; y - j+1 and y - j-1 The coordinates (x) i ,y j At position ), along the negative direction of the second axis, the second axis coordinates of the timing coordinates of the next marking path and the second axis coordinates of the timing coordinates of the previous marking path; i and j are both integers greater than or equal to 2, and Δt is the timing interval.

[0079] In some embodiments, pulsed lasers are used for marking and measurement, where Δt is the pulse interval.

[0080] In step S22, the local instantaneous velocities at each position in the positive, negative, positive, and negative directions of the first and second axes are approximated by dividing the coordinate difference between adjacent pulse points by the time interval. This makes the calculation more feasible and more accurately reflects local instantaneous velocity changes. Furthermore, step S22 calculates the instantaneous velocities in the positive and negative directions of the first and second axes respectively, which helps to more comprehensively reflect the motion characteristics of the laser.

[0081] Step S23: Generate the correction matrix.

[0082] Step S23 includes: generating a correction matrix group based on the local instantaneous velocity and the corresponding theoretical velocity in each of the four directions, wherein the correction matrix group includes four correction matrices corresponding to the four directions respectively.

[0083] In some embodiments, step S23 includes fitting the local instantaneous velocity of each position in the four directions with respect to the corresponding theoretical velocity to obtain four correction matrices corresponding to the four directions respectively. The fitting methods include, but are not limited to, bidirectional cloud curve algorithms, multi-stage correction algorithms, etc.

[0084] In some embodiments, step S23 includes: for any one of the four directions, the corresponding correction matrix M -1 Calculated using the following formula:

[0085] M -1 =T ij ·A ij -1 ;

[0086] Among them, T ij A is a theoretical velocity matrix composed of the theoretical velocities of the multiple positions in this direction; ij -1 This is the inverse matrix of the measured velocity matrix, which is composed of the local instantaneous velocities calculated from the multiple positions in this direction. For example, all v values ​​in the positive direction of the first axis... x+ The data at (i,j) constitute the positive measured velocity matrix A of the first axis. ij The theoretical velocity matrix for the positive direction of the first axis is T. ij There is a mapping relationship between the measured velocity matrix and the theoretical velocity matrix: M·T ij =A ij The correction matrix M for the velocity of the laser in the positive direction of the first axis is calculated. -1 M -1 =T ij ·(A ij ) -1 .

[0087] Similarly, based on all v values ​​in the negative direction of the first axis... x- The data of (i,j) form a mapping relationship between the measured velocity matrix and the theoretical velocity matrix in the negative direction of the first axis, and the correction matrix for the velocity of the laser in the negative direction of the first axis can be calculated.

[0088] Based on all v in the positive direction of the second axis y+The data of (i,j) form a mapping relationship between the measured velocity matrix in the positive direction of the second axis and the theoretical velocity matrix in the positive direction of the second axis, and the correction matrix for the velocity of the laser in the positive direction of the second axis can be calculated.

[0089] Based on all v values ​​in the negative direction of the second axis y- The data of (i,j) form a mapping relationship between the measured velocity matrix in the negative direction of the second axis and the theoretical velocity matrix in the negative direction of the second axis, and the correction matrix for the velocity of the laser in the negative direction of the second axis can be calculated.

[0090] In step S23, a mapping relationship between theoretical speed and actual speed is established through matrix operations. The calculation method of the correction matrix is ​​simple, reliable, and easy to implement.

[0091] Step S24: Iterative optimization.

[0092] Step S24 includes: determining whether the local instantaneous velocities of the multiple positions in the four directions are all within a preset accuracy range; if not, updating the laser processing accuracy parameters using the correction matrix group and repeating the data acquisition step to the iterative optimization step; if yes, storing the last generated laser processing accuracy parameters.

[0093] In step S24, the velocity errors of multiple position points can be corrected simultaneously by using the correction matrix group, thereby achieving more accurate compensation.

[0094] The aforementioned laser precision correction method achieves an automated calibration process through a closed-loop workflow of "data acquisition, speed calculation, correction matrix generation, and iterative optimization." By iterating through algorithms until the error converges to the preset precision range, the efficiency and accuracy of calibration are greatly improved.

[0095] In some embodiments, the preset accuracy means that the deviation between the local instantaneous velocity at each position and the theoretical velocity in any of the four directions does not exceed 0.05% (e.g., 0.01% to 0.02%, 0.02% to 0.03%, 0.03% to 0.04%, 0.04% to 0.05%). This sets specific accuracy requirements for the deviation between the local instantaneous velocity at each position and the theoretical velocity in the four directions, which helps ensure processing quality and provides a clear termination condition for the iterative optimization process.

[0096] In some embodiments, step S24 involves storing the final obtained laser processing accuracy parameters for application in the actual laser marking process. During subsequent laser processing, the stored laser processing accuracy parameters are used to adjust the galvanometer control signal in the laser processing system based on a preset theoretical speed, thereby facilitating high-precision laser processing.

[0097] The laser accuracy correction method in this application incorporates speed fluctuations during laser marking (especially during high-speed laser marking). Through iterative optimization, it continuously reduces the deviation between the actual processing speed and the theoretical speed, thereby improving processing accuracy. Furthermore, the correction matrix is ​​calculated based on actual measurement data and can adaptively compensate for processing deviations caused by motion errors of components such as the galvanometer. Moreover, the laser accuracy correction method in this application ensures processing accuracy and consistency across the entire processing area by correcting the entire processing area. Additionally, the iterative correction method in this application eliminates the need for prior precise calibration of the laser processing system, reducing the difficulty of debugging the laser processing system.

[0098] The laser precision correction method of this application simulates or actually measures the speed of each position and each marking direction within the entire processing area, and obtains a correction matrix based on the mapping relationship between the actual speed and the theoretical speed. This makes the laser precision correction method universal, without requiring a regularity in the marking speed, and can correct the speed deviation of any position to a limited range, thereby ensuring the uniformity of the entire area and each marking direction. It is suitable for high-speed, large-area, and high-precision laser marking requirements.

[0099] This application also provides a laser processing method that utilizes a set of correction matrices generated by the laser accuracy correction method described above for laser processing. The laser processing method includes: acquiring a target speed of the laser processing system; decomposing the target speed into a first-axis speed component and a second-axis speed component; selecting a corresponding correction matrix from the set of correction matrices based on the directions of the first-axis speed component and the second-axis speed component; compensating the target speed using the selected correction matrix to obtain a compensated driving speed; and controlling the laser processing system to perform processing based on the compensated driving speed.

[0100] In the laser processing method of this application embodiment, the target velocity is decomposed into a first-axis velocity component and a second-axis velocity component, and a corresponding correction matrix is ​​selected according to its direction (positive or negative) for compensation, thereby achieving real-time correction of vector velocity in any direction. For example, in laser processing, the target velocity of the laser processing system has a velocity component along the positive direction of the first axis and a velocity component along the negative direction of the second axis. The correction matrix along the positive direction of the first axis and the correction matrix along the negative direction of the second axis can be selected to compensate for the target velocity of the laser processing system, thereby obtaining the compensated driving speed; and the laser processing system is controlled to perform processing according to the compensated driving speed.

[0101] In some embodiments, the above-described laser processing method, by correcting the actual laser speed, can reduce speed fluctuations from 0.2% to 0.5% to 0.05% or less, achieving consistency between the actual marking speed and the theoretical marking speed. This improves the accuracy of the pattern and the uniformity of the processing effect, and can reduce the alignment error from ±20μm to 50μm to within ±10μm, showing good application prospects in the field of laser precision processing.

[0102] In some embodiments, for symmetrical graphics, the symmetry can be used to simplify the correction calculation and reduce the degrees of freedom, thereby providing correction coefficients with a limited number of variables and achieving simple speed correction. For example, for circular or rectangular graphics, their symmetry can be used to correct the speed at only a few key locations, and then the speed correction coefficients for the entire processing area can be obtained through interpolation or fitting.

[0103] In some embodiments, dynamic speed correction can be performed to address speed variations during processing. For example, the correction coefficient can be dynamically adjusted based on real-time speed feedback during laser processing to ensure processing accuracy.

[0104] In some embodiments, position correction and velocity correction can be combined to achieve higher precision laser processing.

[0105] This application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of the laser precision correction method or the laser processing method described in the above embodiments of this application.

[0106] In some embodiments, the computer-readable storage medium can be any medium capable of storing program code. The computer-readable storage medium can be, but is not limited to, read-only memory (ROM), random access memory (RAM), hard disk, optical disk, flash memory, solid-state drive, etc.

[0107] This application also provides a laser processing system. For example... Figure 2 As shown, the laser processing system 100 includes a laser 10, a galvanometer 20, a field lens 30, and a control module 40. The laser 10, galvanometer 20, and field lens 30 are arranged sequentially. The control module 40 is connected to the laser 10, galvanometer 20, and field lens 30 respectively.

[0108] Laser 10 is used to emit a parallel laser beam. The laser beam is a pulsed laser. The parameters of the pulsed laser can be, but are not limited to, the following: wavelength from 300 nm to 1200 nm, pulse width of 10 nm. -13 s to 10 -7s, single pulse energy is 10 -5 J to 1J, frequency 10 5 Hz to 2×10 6 Hz. The energy density of a laser beam can exhibit a Gaussian distribution.

[0109] The galvanometer 20 is located between the laser 10 and the field mirror 30 and is used to deflect the laser beam to the field mirror 30.

[0110] Field lens 30 is used to focus the laser beam reflected by galvanometer 20 onto the processing area A, thereby achieving the processing effect. Field lens 30 can be, but is not limited to, an F-Theta lens.

[0111] The control module 40 is used to control the operation of the laser 10 and the galvanometer 20, and to execute the laser accuracy correction method or the laser processing method of the above embodiments of this application. The control module 40 can be, but is not limited to, a computer, a control card, etc.

[0112] In the laser precision correction method of the above embodiments or the laser processing method of the above embodiments of this application, the laser processing speed is the moving speed of the laser spot on the working plane, which is controlled by the galvanometer 20 and the field mirror 30, and its value is from 1m / s to 200m / s.

[0113] In some embodiments, the galvanometer 20 includes at least two sets of reflective mirrors (not shown) for adjusting the angle of the laser beam emitted by the laser 10, thereby projecting the laser spot onto a designated position of the processing surface A in the first and second axial directions.

[0114] In some embodiments, the galvanometer 20 further includes at least one set of lenses (not shown). This at least one set of lenses is used to dynamically focus the laser beam on a third axis perpendicular to the first and second axes. Therefore, dynamic focusing via this at least one set of lenses facilitates three-dimensional laser processing, improving the processing capability of the laser processing system 100. Furthermore, the focal position of the laser beam can be adjusted as needed, enabling more flexible processing.

[0115] In some embodiments, the laser processing system 100 further includes a beam shaping module 50. This beam shaping module 50 is located between the laser 10 and the galvanometer 20 and is used to modulate the laser beam. Thus, the beam shaping module 50 can optimize the spot shape and / or energy distribution of the laser beam, improving processing quality.

[0116] In some embodiments, the beam shaping module 50 includes at least two mirrors, a beam expander 53, and a diffractive optical element 54. The at least two mirrors in the beam shaping module 50 are used to adjust the direction of the laser beam or to fine-tune the laser beam. The beam expander 53 is used to expand the laser beam or to adjust its beam diameter. The diffractive optical element 54 is used to adjust the energy density distribution of the laser beam, so that the laser beam spot presents any one of the following forms: a circular flat-top spot, a rectangular flat-top spot, a stripe spot, a dotted spot, or a lattice spot. Therefore, by combining various optical elements, the beam shaping module 50 can achieve diverse beam shaping to meet different processing requirements.

[0117] Figure 2 The diagram illustrates two mirrors in the beam shaping module 50, namely the first mirror 51 and the second mirror 52. The laser beam emitted from the laser 10 is reflected by the first mirror 51 and the second mirror 52, and then incident on the beam expander 53. After being expanded by the beam expander 53, the laser beam is incident on the diffractive optical element 54. After being adjusted by the diffractive optical element 54, the laser beam is incident on the galvanometer 20, which deflects the laser beam to the field mirror 30, which focuses the laser beam onto the processing area A.

[0118] In other embodiments, the arrangement order of the reflector, beam expander 53, and diffractive optical element 54 in the beam shaping module 50 is not limited to... Figure 2 As shown, adjustments can be made according to actual needs.

[0119] In some embodiments, the laser processing system 100 further includes an optical measuring device (not shown) for measuring the timing coordinates of the marking path at various locations within the processing area A. The optical measuring device may be, but is not limited to, a CCD camera or an optical microscope.

[0120] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A laser precision calibration method, characterized in that, include: Data acquisition: Acquire the timing coordinates and timing of the marking path at multiple locations within the processing area. The timing coordinates of the marking path include the coordinates generated when the laser moves along each of the four directions: the positive direction of the first axis, the negative direction of the first axis, the positive direction of the second axis, and the negative direction of the second axis. The first axis is perpendicular to the second axis. Velocity calculation: Based on the timing coordinates and timing of the marking path at the multiple locations, the local instantaneous velocities of each of the multiple locations in the four directions are calculated; Correction matrix generation: Based on the local instantaneous velocity and corresponding theoretical velocity in each of the four directions, a set of correction matrices is generated, the set of correction matrices comprising four correction matrices corresponding to the four directions respectively; and Iterative optimization: Determine whether the local instantaneous velocities of the multiple positions in the four directions are all within the preset accuracy range. If not, update the laser processing accuracy parameters using the correction matrix group and repeat the data acquisition steps to the iterative optimization steps. If yes, store the laser processing accuracy parameters generated last time.

2. The laser accuracy correction method according to claim 1, characterized in that, The data acquisition steps include: Using a pulsed laser, marking is performed by reciprocating along the first and second axes within the processing area, and the timing coordinates of the marking path are obtained by measuring the laser pulse points generated during marking. or, The timing coordinates of the marking path are obtained by using the galvanometer position feedback signal of the laser processing system.

3. The laser accuracy correction method according to claim 1, characterized in that, In the velocity calculation step, at coordinates (x i ,y j) The local instantaneous velocity v along the positive direction of the first axis at that location. x+ (i,j), local instantaneous velocity v along the negative direction of the first axis x -(i,j), local instantaneous velocity v along the positive direction of the second axis y+ (i,j), local instantaneous velocity v along the negative direction of the second axis y- (i,j) respectively satisfy: v x+ (i,j)=(x + i+1 -x + i-1 ) / (2·Δt); v x- (i,j)=(x - i+1 -x - i-1 ) / (2·Δt); v y+ (i,j)=(y + j+1 -y + j-1 ) / (2·Δt); v y- (i,j)=(y - j+1 -y - j-1 ) / (2·Δt); Where, x + i+1 and x + i-1 The coordinates are (x) i ,y j At position ), along the positive upward direction of the first axis, the first axis coordinate of the timing coordinate of the next marking path and the first axis coordinate of the timing coordinate of the previous marking path; x - i+1 and x - i-1 The coordinates are (x) i ,y j At position ), along the negative direction of the first axis, the first axis coordinate of the timing coordinate of the next marking path and the first axis coordinate of the timing coordinate of the previous marking path; y + j+1 and y + j-1 The coordinates are (x) i ,y j At point ), along the positive upward direction of the second axis, the second axis coordinates of the timing coordinates of the next marking path and the second axis coordinates of the timing coordinates of the previous marking path; y - j+1 and y - j-1 The coordinates are (x) i ,y j At position ), along the negative direction of the second axis, the second axis coordinates of the timing coordinates of the next marking path and the second axis coordinates of the timing coordinates of the previous marking path; i and j are both integers greater than or equal to 2, and Δt is the time interval.

4. The laser accuracy correction method according to any one of claims 1 to 3, characterized in that, The steps for generating the correction matrix include: For any of the four directions, the corresponding correction matrix M -1 Calculated using the following formula: M -1 =T ij ·A ij -1 ; Among them, T ij A is a theoretical velocity matrix composed of the theoretical velocities of the multiple positions in this direction; ij -1 It is the inverse matrix of the measured velocity matrix, which is composed of the local instantaneous velocities calculated from the multiple positions in this direction.

5. The laser accuracy correction method according to claim 1, characterized in that, The preset accuracy means that the deviation between the local instantaneous velocity of the multiple positions in any of the four directions and the theoretical velocity does not exceed 0.05%.

6. A laser processing method, characterized in that, Laser processing using a set of correction matrices generated by the laser precision correction method according to any one of claims 1 to 5 includes: Obtain the target speed of the laser processing system; The target velocity is decomposed into a first-axis velocity component and a second-axis velocity component; Based on the directions of the first axis velocity component and the second axis velocity component, a corresponding correction matrix is ​​selected from the correction matrix group; The target velocity is compensated using the selected correction matrix to obtain the compensated drive velocity; and The laser processing system is controlled to perform processing based on the compensated drive speed.

7. The laser processing method according to claim 6, characterized in that, The processing parameters of the laser processing system meet one or more of the following parameters: wavelength from 300nm to 1200nm, pulse width of 10... -13 s to 10 -7 s, single pulse energy is 10 -5 J to 1J, with a frequency of 10 5 Hz to 2×10 6 Hz, with processing speeds ranging from 1m / s to 200m / s.

8. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the laser precision correction method as described in any one of claims 1 to 5, or the laser processing method as described in claim 6 or 7.

9. A laser processing system, characterized in that, The system includes a laser, a galvanometer, a field lens, and a control module. The laser is used to emit a laser beam. The galvanometer is located between the laser and the field lens and is used to deflect the laser beam to the field lens. The field lens is used to focus the laser beam onto a processing area. The control module is used to control the operation of the laser and the galvanometer and to execute the laser accuracy correction method as described in any one of claims 1 to 5, or to implement the laser processing method as described in claim 6 or 7.

10. The laser processing system according to claim 9, characterized in that, The galvanometer also includes at least one set of lenses for dynamically focusing the laser beam on a third axis perpendicular to the first axis and the second axis.

11. The laser processing system according to claim 9, characterized in that, The laser processing system also includes a beam shaping module located between the laser and the galvanometer, which is used to modulate the laser beam.

12. The laser processing system according to claim 11, characterized in that, The beam shaping module includes at least two mirrors, a beam expander, and a diffractive optical element; the at least two mirrors are used to adjust the direction of the laser beam; the beam expander is used to expand the laser beam; and the diffractive optical element is used to adjust the energy density distribution of the laser beam so that the laser beam spot appears as any one of the following forms: a circular flat-top spot, a rectangular flat-top spot, a stripe spot, a dotted spot, or a dot matrix spot.

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