RFID electronic tag and packaging method of RFID electronic tag

Abstract

The invention relates to the technical field of RFID electronic tag packaging, in particular to an RFID electronic tag and a packaging method of the RFID electronic tag. Comprising the following steps: an inner layer packaging step: providing an RFID core function unit, and coating the RFID core function unit with a hard polymer material by adopting a first packaging process to form a chemical barrier inner layer; and an outer layer packaging step: taking the semi-finished product forming the chemical barrier inner layer as an insert, and coating the chemical barrier inner layer with a flexible polymer material by adopting a second packaging process so as to form a vibration dissipation outer layer. According to the invention, a coupling failure chain of vibration acceleration chemical erosion is blocked, so that the reliability and the service life of the electronic tag in an extreme industrial environment are improved by several times and even one order of magnitude.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of RFID electronic tag packaging, in particular to an RFID electronic tag and a packaging method thereof.

[0002] The present application relates to the technical field of RFID electronic tag packaging, in particular to an RFID electronic tag and a packaging method thereof. BACKGROUND

[0003] As the core sensing element of the Internet of Things, RFID electronic tags have been widely used in asset management, industrial automation, and supply chain, etc. In the conventional environment, the standard RFID tag packaging is sufficient to provide the necessary protection. However, in many extreme industrial application scenarios, such as the management of the tool shank of numerical control machine tools, the inspection of petrochemical equipment, and the tracking of parts of heavy machinery, RFID tags face the severe challenge of coexistence of high-frequency micro-vibration and chemical medium corrosion.

[0004] Although the packaging with a single hard material has good chemical protection, it is easy to produce micro-cracks due to the brittleness of the material under long-term vibration load. Once these micro-cracks are formed, they will become a channel for the rapid invasion of chemical media, greatly accelerating the corrosion failure of the internal chip and antenna. On the contrary, if a single flexible material is used, although it can effectively reduce vibration, its molecular structure is usually loose and it is difficult to effectively block the long-term penetration of chemical media.

[0005] Therefore, the existing technology generally has the coupling failure problem of vibration accelerating chemical corrosion, which leads to insufficient reliability of the tag in extreme industrial environments, and the service life is far from the expected one, and there is an urgent need for a new packaging solution that can simultaneously solve the contradiction between chemical protection and mechanical protection.

[0006] The above information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore it can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0007] To solve the above technical problems, the present application discloses an RFID electronic tag and a packaging method thereof, in particular, the technical scheme of the present application is as follows:

[0008] A packaging method of an RFID electronic tag, comprising:

[0009] An inner layer packaging step: providing an RFID core functional unit, using a first packaging process, and using a hard polymer material to cover the RFID core functional unit to form a chemical barrier inner layer;

[0010] An outer layer packaging step: using the semi-finished product formed with the chemical barrier inner layer as an insert, using a second packaging process, and using a flexible polymer material to cover the outside of the chemical barrier inner layer to form a vibration dissipation outer layer.

[0011] Preferably, before the inner layer encapsulating step, further comprising:

[0012] Determining the effective thickness of the chemical barrier inner layer based on a preset coupling failure characteristic life model and according to a target coupling failure characteristic life.

[0013] Preferably, the coupling failure characteristic life model is used to calculate the coupling failure characteristic life based on the vibration dissipation efficiency, the static effective diffusion coefficient, and the effective thickness.

[0014] Wherein, the vibration dissipation efficiency is determined by the flexible polymer material;

[0015] Wherein, the static effective diffusion coefficient is determined by the hard polymer material.

[0016] Preferably, the vibration dissipation efficiency is determined by the ratio of the loss modulus to the storage modulus of the flexible polymer material at a preset operating angular frequency.

[0017] Preferably, the outer layer encapsulating step specifically is:

[0018] Using multi-material co-injection technology, an integrated gradient modulus interface layer is formed between the chemical barrier inner layer and the vibration dissipation outer layer.

[0019] Wherein, the Young's modulus of the gradient modulus interface layer decreases in the direction from the chemical barrier inner layer to the vibration dissipation outer layer.

[0020] An RFID electronic tag, comprising:

[0021] A core functional unit containing a substrate, an RFID chip, and an antenna;

[0022] A multi-layer heterogeneous encapsulation body wrapped outside the core functional unit, and comprising:

[0023] A chemical barrier inner layer composed of a hard polymer material;

[0024] A vibration dissipation outer layer composed of a flexible polymer material, wrapped outside the chemical barrier inner layer.

[0025] Preferably, the effective thickness of the chemical barrier inner layer is determined based on a target coupling failure characteristic life and using a coupling failure characteristic life model.

[0026] Preferably, the multi-layer heterogeneous encapsulation body further comprises:

[0027] A gradient modulus interface layer arranged between the chemical barrier inner layer and the vibration dissipation outer layer;

[0028] wherein the gradient modulus interface layer has a Young's modulus that decreases in a direction from the chemical barrier inner layer to the vibration dissipation outer layer.

[0029] Preferably, the rigid polymer material has a static effective diffusion coefficient for the preset chemical medium that is lower than a preset diffusion threshold.

[0030] Preferably, the flexible polymer material has a loss tangent that is higher than a preset dissipation threshold at a preset operating angular frequency.

[0031] Compared with the prior art, the present application has the following beneficial effects:

[0032] 1. The present application decouples the two functions of chemical protection and mechanical protection by using double-layer heterogeneous packaging and selecting rigid and flexible polymer materials respectively. The rigid inner layer acts as a chemical barrier, while the flexible outer layer is responsible for dissipating vibrations. This design completely solves the inherent contradiction between chemical inertness and mechanical toughness of a single homogeneous material, breaks the coupling failure chain of vibration accelerating chemical corrosion from the root, and significantly improves the reliability and service life of electronic tags in extreme industrial environments.

[0033] 2. The present application introduces a model-driven quantitative design method, which accurately relates the thickness of the chemical barrier inner layer to the final target life of the tag through a preset coupling failure characteristic life model. This method upgrades the packaging design from the traditional trial-and-error mode to a scientific and refined stage, and can inversely solve the optimal structure parameters according to the reliability requirements. This not only ensures that the product can accurately meet the preset reliability target, but also avoids the cost and size waste caused by design redundancy, achieving the best balance between performance and economy.

[0034] 3. The present application uses multi-material co-injection technology to integrally form a gradient modulus interface layer between the rigid inner layer and the flexible outer layer. The Young's modulus of the interface layer smoothly transitions in the thickness direction, effectively relieving the interface stress concentration problem caused by the sudden change of the physical properties of the inner and outer layers. This design significantly enhances the interlayer bonding strength and fatigue resistance, fundamentally inhibiting the risk of interface delamination and peeling under long-term vibration load, thereby ensuring the structural integrity and long-term stability of the entire multi-layer heterogeneous packaging.

[0035] 4、The application proposes scientific and quantifiable material screening standards, which convert vague performance requirements into clear physical indicators. It requires the static effective diffusion coefficient of hard polymer materials to be lower than the preset threshold to ensure chemical shielding capability; at the same time, it requires the tangent of the loss angle of flexible polymer materials at the working frequency to be higher than the preset threshold to ensure the vibration dissipation efficiency. This material selection process based on quantitative indicators provides a scientific and repeatable basis for achieving high-performance packaging and lays a solid material foundation for the excellent reliability of the label. BRIEF DESCRIPTION OF DRAWINGS

[0036] The application will be further explained below in conjunction with the accompanying drawings and embodiments:

[0037] Figure 1 is a flow chart of the packaging method of the RFID electronic tag of the application.

[0038] Figure 2 is a structural block diagram of the RFID electronic tag of the application. DETAILED DESCRIPTION

[0039] To make the purpose, technical solutions and advantages of the application clearer and more apparent, the application will be further described in detail below in conjunction with specific embodiments.

[0040] Embodiment 1:

[0041] Please refer to Figure 1 A packaging method of an RFID electronic tag, comprising:

[0042] Inner layer packaging step: providing an RFID core functional unit, using a first packaging process, and using a hard polymer material to cover the RFID core functional unit to form a chemical barrier inner layer;

[0043] Outer layer packaging step: using a second packaging process, using a flexible polymer material to cover the outside of the chemical barrier inner layer to form a vibration dissipation outer layer, with the chemical barrier inner layer formed as an insert;

[0044] The embodiment of the application provides a packaging method of an RFID electronic tag, aiming to solve the problem of premature failure caused by design contradictions in the existing technology in a high-frequency micro-vibration-chemical corrosion coupling environment; the core idea of the method is functional decoupling, which distributes the responsibilities of chemical protection and mechanical protection to different, specially optimized material layers through multi-layer heterogeneous packaging;

[0045] In a specific application scenario, for example, an RFID electronic tag that needs to be installed on a numerical control machine tool handle is packaged, and the handle working environment exists high-frequency vibration and continuously contacts oil-based cutting fluid; the method of the embodiment includes the following core steps:

[0046] The inner layer encapsulation step is performed to provide a compact and chemically inert final protective barrier for the electronic core of the RFID tag. At the beginning, a RFID core functional unit, i.e. a component carrying all the electronic functions of the tag, is provided, which usually includes a rigid or flexible substrate, and an RFID chip and an antenna electrically connected thereto fixed on the substrate. In this embodiment, a first encapsulation process of precision injection molding is adopted to melt and precisely coat a selected hard polymer material, such as perfluoroalkoxy alkane (PFA) having extremely low chemical permeability, outside the RFID core functional unit, and after cooling and solidification, a seamless and compact chemical barrier inner layer is formed. The inner layer directly contacts and seals the electronic components, and its core function is to resist the penetration and corrosion of external chemical media;

[0047] The outer layer encapsulation step is performed to provide a high-efficiency mechanical energy dissipation mechanism for the entire tag structure to weaken or eliminate the transmission of destructive vibration energy from the source. In this step, the semi-finished product with the chemical barrier inner layer formed in the previous step is fixed as an insert in a second set of injection molding molds. A second encapsulation process of secondary injection molding is adopted to coat a selected flexible polymer material, such as silicone rubber with high damping properties, outside the chemical barrier inner layer. After solidification, a vibration dissipation outer layer is formed. The outer layer is the first interface of the tag interacting with the external vibration environment, and its core function is to absorb and dissipate high-frequency micro-vibration energy to protect the relatively brittle and fragile chemical barrier inner layer from continuous dynamic stress impact, thereby inhibiting the initiation and propagation of micro-cracks.

[0048] The method of this embodiment creatively decouples the two contradictory performance requirements of chemical protection and mechanical protection through structural internal and external layering and material rigidity and flexibility. The chemical barrier inner layer focuses on chemical shielding, and the vibration dissipation outer layer focuses on energy dissipation. This design solves the inherent defect that mechanical toughness and chemical impermeability cannot be considered in traditional single homogeneous material encapsulation, so that the encapsulated RFID electronic tag can obtain several times or even an order of magnitude improvement in reliability and life in extreme industrial environments with vibration and corrosion.

[0049] Embodiment 2:

[0050] Before the inner layer encapsulation step, it further includes:

[0051] Based on the preset coupling failure characteristic life model, and according to the target coupling failure characteristic life, the effective thickness of the chemical barrier inner layer is determined;

[0052] This embodiment introduces a model-driven quantitative design method based on embodiment 1, aiming to accurately associate the key structural parameters of the encapsulation design with the final reliability target.

[0053] Specifically, before the inner layer encapsulation step, a key structural design and optimization link is added; the core task of this link is to scientifically determine the effective thickness of the chemical barrier inner layer; the effective thickness refers to the minimum distance that the chemical medium needs to penetrate in the thinnest path, which is a key design variable that directly affects the chemical penetration time; the determination of this thickness is not based on experience or with a wide margin, but is calculated and optimized based on the target coupling failure characteristic life and based on the preset coupling failure characteristic life model;

[0054] The target coupling failure characteristic life is a pre-set engineering design index, which clearly defines the average trouble-free working time that the label needs to achieve in a specific application scenario; its setting basis is the reliability requirement of the specific application scenario, for example, the CNC tool management system requires that the label life be not less than 5 years;

[0055] The coupling failure characteristic life model is a mathematical tool for quantitatively predicting the life of an RFID tag under vibration and chemical coupling stress; its role is to correlate material performance parameters such as diffusion coefficient, damping efficiency, structural design parameters such as inner layer thickness, and environmental stress parameters such as vibration intensity, thereby outputting a predicted characteristic life value; the theoretical source of this model is based on a deep insight into and mathematical modeling of the core failure mechanism of vibration-induced micro-cracks and then accelerated chemical penetration;

[0056] In this embodiment, the designer determines the target life and then uses the coupling failure characteristic life model to iteratively calculate the inner layer thickness t barrier as a variable, and finally solves a minimum effective thickness value that can meet or exceed the target life;

[0057] This embodiment improves the packaging design of RFID tags from the traditional experience and trial mode to the model-driven scientific and refined stage by introducing a model-driven design step; it provides a direct and quantitative scientific basis for the design of the thickness of the chemical barrier inner layer, a key structural parameter, avoiding insufficient reliability due to over-thin design or cost and size waste due to over-thick design; this pre-positioned, model-based optimization design greatly improves the research and development efficiency and the probability of one-time success, and ensures that the final product can accurately meet the preset reliability target.

[0058] Embodiment 3:

[0059] The coupling failure characteristic life model is used to calculate the coupling failure characteristic life based on the vibration dissipation efficiency, the static effective diffusion coefficient, and the effective thickness;

[0060] Among them, the vibration dissipation efficiency is determined by the flexible polymer material;

[0061] The static effective diffusion coefficient is determined by the rigid polymer material;

[0062] The vibration dissipation efficiency is determined by the ratio of the loss modulus and the storage modulus of the flexible polymer material at a preset working angular frequency;

[0063] The embodiment based on the embodiment 2, coupling failure characteristic life model is more specific description, illustrates its core elements and the direct association with material performance, these elements together constitute the model can be the basis of scientific prediction;

[0064] The core logic of the coupling failure characteristic life model is that the coupling failure characteristic life τ cpl is based on the interaction between the three core variables: vibration dissipation efficiency, static effective diffusion coefficient, and effective thickness; A specific model expression is as follows:

[0065]

[0066] Where t barrier is the effective thickness of the chemical barrier inner layer; D eff,static is the static effective diffusion coefficient; α dmg is the damage acceleration factor, which quantifies the acceleration effect of vibration on chemical penetration, and its value is inhibited by the vibration dissipation efficiency; γ interface is the interface coupling integrity factor;

[0067] The static effective diffusion coefficient D eff,static in the model is determined by the rigid polymer material; this coefficient refers to the rate of diffusion and penetration of a specific chemical medium in the rigid polymer material in a pure static chemical environment without vibration stress, and its dimension is m 2 / s; this parameter is a measure of the inherent chemical shielding performance of the material, which constitutes the basis of the label theory life; its value can be measured by standard permeability test, such as ASTM F739 standard, or obtained from the technical manual of high-end material suppliers;

[0068] The vibration dissipation efficiency in the model is determined by the flexible polymer material; this efficiency refers to the inherent ability of the flexible polymer material to irreversibly convert input mechanical vibration energy into heat energy, and the higher the value, the better the damping effect of the material; this efficiency is specifically determined by the ratio of the loss modulus E ″ (ω) and the storage modulus E ′ (ω) of the flexible polymer material at a preset working angular frequency ω; this ratio is called the loss tangent tan δ(ω) in material science;

[0069]

[0070] where ω is the main vibration frequency that the tag will be subjected to in its actual deployment location, which is obtained by installing an acceleration sensor in the field, collecting vibration signals and performing Fourier spectrum analysis; the storage modulus E ′ (ω) represents the material's ability to store elastic deformation energy, while the loss modulus E ″ (ω) represents the material's ability to dissipate energy; both parameters can be obtained by standardized testing through a dynamic mechanical analyzer (DMA);

[0071] In this embodiment, the main vibration frequency that contributes most to structural fatigue damage is selected as the reference for design to simplify the model; in an environment with a complex vibration spectrum, the effects of multiple frequency components can also be comprehensively considered using the equivalent damage principle, or multiple key frequencies can be optimized;

[0072] To ensure the implementability of the model, the semi-empirical parameters involved in the model need to be determined through independent calibration experiments; the damage acceleration factor a dmg can be expressed as a monotonic decreasing function of tan δ(ω), and a specific semi-empirical form is:

[0073]

[0074] where S vib is a dimensionless vibration severity parameter; a small positive number ε is introduced as a regularization term here to ensure that the model remains mathematically robust in the extreme case where tan δ(ω) tends to zero, avoiding the occurrence of infinite values, which is more in line with the physical reality that the damage acceleration effect will reach a maximum value rather than infinity;

[0075] The calibration process of this parameter is as follows: a series of tag samples without a vibration-dissipating outer layer are prepared, placed in environments with different vibration intensity levels, and their failure life in the chemical medium is measured, denoted as L fail ; based on multiple sets of experimental data points, the S vib value representing the vibration damage resistance potential of the specific inner layer material can be calibrated through mathematical fitting methods;

[0076] It should be noted that this damage acceleration factor is a semi-empirical formula that effectively reflects the macroscopic inhibitory effect of vibration dissipation efficiency on damage in physics, and its prediction accuracy in a specific material system and working condition range is ensured through the calibration of the parameter S vib ;

[0077] The interface coupling integrity factor γ interface in the interface process correction coefficient k also needs to be calibrated; the dimension of this coefficient k is the same as the interfacial bonding strength σ bondThe same represents the critical interfacial failure stress characteristic value of the material system and the process flow; the process is: preparing test samples with different interfacial processes, measuring the interfacial bonding strength through tensile shear or fatigue peeling experiment, denoted as σ bond ; based on multiple sets of σ bond data, through fitting with the model, a reliable k value can be determined for a specific material system and process flow; the experimental measurement used in the calibration process is an independent experimental observation, which is distinguished from the variables input during model operation;

[0078] The interfacial coupling integrity factor γ interface can be determined by the calibrated coefficient k and the measured interfacial bonding strength σ bond through a predetermined functional relationship; a specific form can be γ interface = exp(-k / σ bond ), which can reasonably represent the physical trend that the higher the interfacial bonding strength, the smaller the factor on the life loss effect;

[0079] The embodiment provides a clear and quantitative scientific guide for the selection of packaging materials by specificizing the model; it clearly points out that the selection of the inner layer material should focus on minimizing D eff,static , and the selection of the outer layer material should focus on maximizing tan δ(ω) at the target working frequency ω; this parameterized material selection method based on the physical model replaces the vague qualitative description, enabling designers to accurately select the optimal material combination for a specific working condition, specific chemicals and vibration frequency, thereby maximizing the life of the label;

[0080] It should be noted that the model proposed in the embodiment is analyzed at a predetermined constant working temperature; in application scenarios with large temperature changes, the static effective diffusion coefficient D eff,static and the vibration dissipation efficiency tan δ(ω) will both show a dependence on temperature, and temperature correction terms can be further introduced based on the model, for example, correcting the diffusion coefficient based on the Arrhenius equation to improve the universality of the prediction;

[0081] To verify the effectiveness of the model, multiple sets of RFID electronic tag samples with different inner layer thicknesses, such as 0.5mm, 0.7mm, and 1.0mm, can be prepared; these samples are placed in the same coupling environment as the calibration experiment for accelerated life testing, and the actual failure time is recorded; if the average failure time of each group of samples is highly consistent with the characteristic life value predicted by the model, for example, the error is within 15%, it proves that the coupling failure characteristic life model has good prediction accuracy and robustness.

[0082] Embodiment 4:

[0083] The outer layer encapsulation step is specifically:

[0084] A gradient modulus interface layer is integrally formed between the chemically resistant inner layer and the vibration dissipating outer layer by using multi-material co-injection technology;

[0085] The Young's modulus of the gradient modulus interface layer decreases in the direction from the chemically resistant inner layer to the vibration dissipating outer layer.

[0086] This embodiment provides an optimized specific implementation of the outer layer encapsulation step based on Embodiment 1, aiming to solve the problem of weak interfacial bonding force caused by the large difference in physical properties, especially modulus, between the inner and outer layers.

[0087] In this optimized implementation, the outer layer encapsulation step is specifically: a gradient modulus interface layer and a vibration dissipating outer layer are integrally formed on the semi-finished product forming the chemically resistant inner layer by using multi-material co-injection technology; multi-material co-injection technology is an advanced injection molding process that allows two or more polymers with different properties to be injected by multiple injection units in a single mold cycle according to a predetermined program, thereby forming a complex heterogeneous structure inside the product; its role in this application is to build a seamless physical transition from the hard inner layer to the flexible outer layer.

[0088] The gradient modulus interface layer formed by this technology is a unique transition area, and the Young's modulus of this layer decreases in the direction from the chemically resistant inner layer to the vibration dissipating outer layer; this gradient modulus interface layer refers to a special functional layer in which the material composition and / or microstructure changes continuously in space, resulting in a smooth transition in its macroscopic mechanical properties; its role is to eliminate the large interfacial stress concentration between hard and flexible materials caused by modulus discontinuity; during manufacturing, a small amount of intermediate modulus material can be injected in the area close to the inner layer first, followed by the injection of flexible outer layer material, and the smooth transition of modulus is naturally formed by the flow and mixing of the melt in the mold cavity.

[0089] This embodiment improves the structural integrity and reliability of the multi-layer heterogeneous package in long-term vibration environment by introducing a gradient modulus interface layer; the traditional hard-soft direct bonding interface is a stress concentration point, which is prone to micro-cracks under dynamic load and eventually leads to delamination failure; the presence of the gradient modulus interface layer is equivalent to a mechanical cushion, effectively dispersing the interfacial stress and significantly enhancing the bonding strength and fatigue resistance between the inner and outer layers; this integrally formed design ensures that the vibration dissipating outer layer can stably adhere to and protect the inner layer, thereby ensuring the effective implementation of the entire decoupling design concept.

[0090] Embodiment 5:

[0091] Please refer to Figure 2An RFID electronic tag, comprising:

[0092] a core functional unit containing a substrate, an RFID chip and an antenna;

[0093] a multi-layer heterogeneous encapsulant encapsulating the core functional unit and comprising:

[0094] a chemical barrier inner layer composed of a hard polymer material;

[0095] a vibration dissipation outer layer composed of a flexible polymer material encapsulating the chemical barrier inner layer;

[0096] The embodiment of the present application provides a high-reliability RFID electronic tag suitable for extreme industrial environments;

[0097] The RFID electronic tag comprises a core functional unit, which is a basic electronic assembly for realizing the function of radio frequency identification, and contains a substrate, an RFID chip and an antenna; the chip is mounted on the substrate and is electrically connected to the antenna through a welding point or the like;

[0098] The core innovation of the RFID electronic tag lies in its unique encapsulation structure, i.e. a multi-layer heterogeneous encapsulant; the encapsulant refers to a composite encapsulant with a layered structure composed of two or more polymer materials with significantly different physical and chemical properties; the function of the encapsulant is to break through the performance bottleneck of a single material and realize the synergistic optimization of multiple protection functions; the encapsulant completely encapsulates the core functional unit and comprises the following two basic functional layers:

[0099] Chemical barrier inner layer: the layer directly contacts and seals the core functional unit and is composed of a hard polymer material; here, the hard polymer material refers to a material with high rigidity, dense molecular structure and excellent chemical inertness, such as perfluoroalkoxy alkane (PFA); the core function of the chemical barrier inner layer is to serve as the final physical barrier against the penetration of corrosive chemical media from the outside world;

[0100] Vibration dissipation outer layer: the layer encapsulates the chemical barrier inner layer and is the direct contact surface of the tag with the external environment and is composed of a flexible polymer material; here, the flexible polymer material refers to a material with low modulus, high toughness and high mechanical loss characteristics, such as high-damping silicone rubber; the core function of the vibration dissipation outer layer is to absorb and dissipate high-frequency micro-vibration energy from the external environment and protect the internal structure from dynamic stress damage;

[0101] The RFID electronic tag of the embodiment realizes decoupling of two protection functions of chemical shielding and vibration dissipation through its innovative multi-layer heterogeneous package design; the hard inner layer provides extreme chemical resistance, and the flexible outer layer effectively suppresses the transmission of vibration energy inward, preventing the coupling failure chain of vibration-induced micro-cracks and further accelerating chemical corrosion; this design concept makes the tag, compared with the tag using the traditional single-layer homogeneous package, exhibit excellent reliability and ultra-long service life in the harsh industrial environment coexisting with vibration and chemical corrosion.

[0102] Embodiment 6:

[0103] The effective thickness of the chemical barrier inner layer is determined based on the target coupling failure characteristic life and by using a coupling failure characteristic life model;

[0104] The embodiment further limits a key parameter of the structure design of the RFID electronic tag of embodiment 5, embodying the concept of reliability-first design;

[0105] Specifically, the effective thickness of the chemical barrier inner layer is not an empirically set value, but a result of precise calculation and optimization; the thickness value is determined based on the target coupling failure characteristic life and by using a coupling failure characteristic life model;

[0106] The target coupling failure characteristic life is a quantitative reliability index, for example, the tag must work stably for at least 5 years in the cutting fluid and vibration environment of a CNC machine tool; the coupling failure characteristic life model is a core mathematical tool guiding the design, which establishes a quantitative relationship between the inner layer thickness and the final life; in the design stage, the engineer will input the target life into the model, combined with the performance parameters of the selected material, to inversely solve the minimum effective thickness of the inner layer required to meet the life requirement; for example, in the specific CNC tool application case, through model calculation, it is finally determined to use an inner layer thickness of 0.7 mm to ensure that the characteristic life exceeds the design target of 5 years;

[0107] The embodiment materializes the advanced design concept into the physical structure of the tag; the reliability of the RFID electronic tag is changed from unpredictable to designable, predictable and verifiable; the inner layer thickness accurately determined by the model enables the tag to meet the stringent reliability requirements while avoiding unnecessary material waste and size redundancy, achieving the best balance of performance, cost and volume; this feature of designing for reliability is one of the core advantages of the tag that distinguishes it from the prior art products.

[0108] Embodiment 7:

[0109] The multi-layer heterogeneous package further comprises:

[0110] a gradient modulus interface layer disposed between the chemical barrier inner layer and the vibration dissipation outer layer;

[0111] wherein the Young's modulus of the gradient modulus interface layer decreases in a gradient along a direction from the chemical barrier inner layer to the vibration dissipation outer layer;

[0112] The embodiment further optimizes the structure of the multi-layer heterogeneous package of the RFID electronic tag in Embodiment 5, and introduces a key feature for enhancing the structural stability;

[0113] In the optimized embodiment, the multi-layer heterogeneous package further comprises a gradient modulus interface layer, which is physically disposed between the chemical barrier inner layer and the vibration dissipation outer layer; the gradient modulus interface layer is a functional transition region, and the Young's modulus of the internal material of the gradient modulus interface layer is not a constant value but continuously changes in a gradient in space; the Young's modulus of the gradient modulus interface layer decreases in a gradient along a direction from the chemical barrier inner layer to the vibration dissipation outer layer; this means that the modulus smoothly transitions to a lower value on the side close to the rigid inner layer;

[0114] The embodiment enhances the long-term structural stability and fatigue resistance of the entire package by adding the gradient modulus interface layer; without the layer, the interface between the rigid inner layer and the flexible outer layer will become a stress concentration point due to the huge modulus mutation, and will easily delaminate and peel off under repeated vibration loads; the introduction of the gradient modulus interface layer effectively relieves the stress concentration, so that the stress can be smoothly transmitted and transitioned from the outer layer to the inner layer, greatly enhancing the interlayer bonding force; this ensures that the vibration dissipation outer layer can always effectively protect the chemical barrier inner layer, so that the entire decoupling protection system works stably as a whole, thereby further prolonging the service life of the tag in an extreme environment.

[0115] Embodiment 8:

[0116] the static effective diffusion coefficient of the rigid polymer material for the preset chemical medium is lower than a preset diffusion threshold;

[0117] the loss tangent of the flexible polymer material at a preset operating angular frequency is higher than a preset dissipation threshold;

[0118] The embodiment specifically and quantitatively defines the selection criteria of the packaging material in the RFID electronic tag in Embodiment 5, thereby providing a material level guarantee for realizing high reliability, and embodying the implementability of the scheme of the present application;

[0119] For the chemical barrier inner layer, the rigid polymer material used must meet a key chemical performance index: the static effective diffusion coefficient of the rigid polymer material for the preset chemical medium is lower than a preset diffusion threshold;

[0120] Pre-set chemical medium refers to a specific chemical substance with potential corrosivity that the tag will be in long-term contact with in its target application scenario; for example, in CNC machine tool applications, this medium is a specific type of oil-based cutting fluid;

[0121] Static effective diffusion coefficient (D eff,static ) is a physical quantity that measures the penetration speed of the chemical medium in the material;

[0122] Pre-set diffusion threshold is an engineering reference value set according to reliability requirements; its determination method can be: set based on the comprehensive consideration of acceptable penetration rate and target service life; when selecting materials, it must be ensured that its D eff,static is lower than this threshold; for example, if the target service life requirement is extremely high, the threshold can be set to 1×10 -15 m 2 / s, then the selected PFA material D eff,static = 5×10 -16 m 2 / s meets the standard;

[0123] For the vibration dissipation outer layer, the flexible polymer material used must meet a key dynamic mechanical property index: its loss tangent at a pre-set working angular frequency is higher than a pre-set dissipation threshold;

[0124] Pre-set working angular frequency (ω) refers to the main vibration frequency in the tag's working environment, for example, the main frequency of the CNC machine tool spindle vibration is 400 Hz;

[0125] Loss tangent (tanδ(ω)) is a dimensionless parameter that measures the efficiency of the material in dissipating vibration energy at this frequency;

[0126] Pre-set dissipation threshold is a performance threshold set to ensure effective vibration damping; its determination method can be: set based on the engineering requirement of effectively suppressing vibration damage acceleration effect; when selecting materials, it must be ensured that its tanδ(ω) is higher than this threshold; for example, for high requirement damping applications, the threshold can be set to 0.3, then the selected high damping silicone rubber has a tanδ of 0.4 measured at 400 Hz, which meets the standard;

[0127] This embodiment provides a scientific and repeatable material selection basis for the manufacture of high-performance RFID tags by setting clear and quantifiable material performance thresholds; it converts the two vague qualitative requirements of good chemical resistance and excellent damping into D eff,staticand tan delta (ω) indicators; this screening process based on quantitative indicators ensures that each material constituting the multi-layer heterogeneous package has the core performance of the function it undertakes, thereby providing a solid material basis for the excellent reliability of the entire label; the two standards work together to ensure that the inner layer can withstand and the outer layer can dissipate, achieving the perfect unity of design concept and physical reality.

[0128] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for encapsulating an RFID electronic tag, characterized in that, include: Inner layer encapsulation step: Provide RFID core functional unit, adopt the first encapsulation process, and use rigid polymer material to encapsulate the RFID core functional unit to form a chemical barrier inner layer; Outer encapsulation step: The semi-finished product with the chemical barrier inner layer is used as an insert, and a second encapsulation process is adopted to cover the outside of the chemical barrier inner layer with a flexible polymer material to form a vibration dissipation outer layer.

2. The RFID electronic tag packaging method according to claim 1, characterized in that, Prior to the inner layer encapsulation step, the following is also included: Based on a preset coupling failure characteristic lifetime model and according to the target coupling failure characteristic lifetime, the effective thickness of the chemical barrier inner layer is determined.

3. The RFID electronic tag encapsulation method according to claim 2, characterized in that, The coupled failure characteristic lifetime model is used to calculate the coupled failure characteristic lifetime based on the vibration dissipation efficiency, the static effective diffusion coefficient, and the effective thickness. The vibration dissipation efficiency is determined by the flexible polymer material. The static effective diffusion coefficient is determined by the rigid polymer material.

4. The RFID electronic tag encapsulation method according to claim 3, characterized in that, The vibration dissipation efficiency is determined by the ratio of the loss modulus to the storage modulus of the flexible polymer material at a preset operating angular frequency.

5. The RFID electronic tag encapsulation method according to claim 1, characterized in that, The outer layer encapsulation step is specifically as follows: A gradient modulus interface layer is integrally formed between the chemical barrier inner layer and the vibration dissipation outer layer using multi-material co-injection technology. The Young's modulus of the gradient modulus interface layer decreases in a gradient direction from the chemical barrier inner layer to the vibration dissipation outer layer.

6. An RFID electronic tag, based on the encapsulation method of an RFID electronic tag according to claims 1-5, characterized in that, include: The core functional unit includes a substrate, an RFID chip, and an antenna; A multilayer heterogeneous package, which encloses the core functional unit and includes: A chemical barrier inner layer made of rigid polymer material; A vibration-dissipating outer layer, made of a flexible polymer material, covers the outside of the chemically barrier inner layer.

7. The RFID electronic tag according to claim 6, characterized in that, The effective thickness of the chemical barrier inner layer is determined based on the target coupling failure characteristic lifetime and using the coupling failure characteristic lifetime model.

8. The RFID electronic tag according to claim 6, characterized in that, The multilayer heterogeneous package also includes: A gradient modulus interface layer is disposed between the chemical barrier inner layer and the vibration dissipation outer layer; The Young's modulus of the gradient modulus interface layer decreases in a gradient direction from the chemical barrier inner layer to the vibration dissipation outer layer.

9. The RFID electronic tag according to claim 6, characterized in that, The static effective diffusion coefficient of the rigid polymer material to the preset chemical medium is lower than the preset diffusion threshold.

10. The RFID electronic tag according to claim 6, characterized in that, The loss tangent of the flexible polymer material at the preset operating angular frequency is higher than the preset dissipation threshold.

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