Efficient anti-icing device and system applied to low-altitude aircraft and application

Abstract

The invention belongs to the related technical field of aircrafts, and discloses an efficient anti-icing device and system applied to a low-altitude aircraft and application. The device comprises a group of upper substrates, a group of lower substrates and a thermoelectric layer arranged between the upper substrates and the lower substrates, the thermoelectric layer is an array formed by arranging P-type semiconductors and N-type semiconductors in a staggered and spaced mode, the P-type semiconductors and the N-type semiconductors are connected in series through wires to form a closed loop, and the thermoelectric layer is connected with an external power source to be powered on. The invention further discloses an anti-icing system comprising the deicing device. According to the invention, the problems of low efficiency and high energy consumption in a low-altitude electric aircraft deicing technology are solved.

Description

Technical Field

[0001] This invention belongs to the field of aircraft-related technical technology, and more specifically, relates to a highly efficient anti-icing device, system, and application for low-altitude aircraft. Background Technology

[0002] The rapid development of the low-altitude economy has made it commonplace for low-altitude aircraft to perform missions under various weather conditions. However, when aircraft fly in supercooled water droplet clouds, critical components such as wings, propellers, and sensors are highly susceptible to icing. Icing significantly alters the aerodynamic shape of the aircraft, leading to reduced lift and increased drag, seriously affecting flight safety. To address this issue, various anti-icing and de-icing solutions exist in current technology, which can be mainly categorized as follows: 1) Electrothermal De-icing Technology: This is currently the most widely used de-icing method. Its working principle involves embedding resistance wires or other electrothermal elements on the aircraft surface, utilizing Joule heating to melt or prevent icing. For example, US patents US6,056,243 and US 7,370,836 disclose de-icing systems using heating pads or resistance wires. However, this technology has the following significant drawbacks: 1) High energy consumption: Resistance heating requires a huge amount of electrical energy, typically requiring a power density of over 3 kW / m² to maintain the de-icing effect. This is unacceptable for low-altitude electric aircraft with strictly limited battery capacity and power density. 2) Uneven heat distribution: Resistance wire heating may lead to uneven heat distribution, posing a risk of localized overheating or insufficient heating.

[0003] 2) Aerodynamic thermal de-icing technology: This technology uses high-temperature, high-pressure gas extracted from the engine to heat the leading edge of the wing. However, this method is mainly used in large passenger aircraft and is not suitable for low-altitude electric aircraft that are not equipped with gas turbine engines.

[0004] 3) Chemical anti-icing technology: This method lowers the freezing point of supercooled water droplets by spraying anti-icing fluid (such as ethylene glycol) to prevent icing. However, this method increases the weight of the aircraft, requires frequent refueling, and poses environmental pollution problems, making it unsuitable for long-term or continuous anti-icing missions.

[0005] In summary, existing anti-icing technologies are insufficient to meet the urgent needs of low-altitude electric aircraft for high-efficiency, low-energy-consumption anti-icing systems. Traditional electrothermal anti-icing and de-icing technologies consume excessive energy, posing a serious challenge to battery endurance. Therefore, developing a new low-energy-consumption, high-efficiency anti-icing technology is imperative. This invention aims to solve the above problems by providing a low-energy-consumption anti-icing device or system based on a thermoelectric heat pump. It utilizes the Peltier effect of the thermoelectric module to achieve active heat transport, combined with Joule heating for synergistic heating, to achieve efficient and precise anti-icing, providing effective protection for the safe flight of low-altitude electric aircraft. Summary of the Invention

[0006] In view of the above-mentioned defects or improvement needs of the existing technology, the present invention provides a high-efficiency anti-icing device, system and application for low-altitude aircraft, which solves the problems of low efficiency and high energy consumption in the de-icing technology of low-altitude electric aircraft.

[0007] To achieve the above objectives, according to one aspect of the present invention, a high-efficiency anti-icing device for low-altitude aircraft is provided. The device includes an upper substrate, a lower substrate, and a thermoelectric layer disposed between the upper substrate and the lower substrate. The thermoelectric layer is an array formed by alternating P-type semiconductors and N-type semiconductors, and the P-type semiconductors and N-type semiconductors are connected in series by wires to form a closed loop. The thermoelectric layer is connected to an external power source for power supply.

[0008] More preferably, the spacing between the P-type semiconductor and the N-type semiconductor is 0.2 mm to 1 mm, and the thickness of both the P-type semiconductor and the N-type semiconductor is 0.2 mm to 0.5 mm.

[0009] More preferably, the thickness of both the upper substrate and the lower substrate is 0.2 mm to 0.5 mm.

[0010] More preferably, direct current is passed through the heating layer, and the pulse frequency, amplitude, and duty cycle of the direct current are adjustable.

[0011] More preferably, the upper substrate and the lower substrate are made of ceramic material.

[0012] More preferably, a metal wire with insulating support is provided below the wire for fixing and connecting the P-type semiconductor and the N-type semiconductor.

[0013] According to another aspect of the present invention, a high-efficiency anti-icing system for low-altitude aircraft is provided. This system includes the aforementioned high-efficiency anti-icing device, enhanced heat dissipation device, and control module for low-altitude aircraft, wherein: The anti-icing device is attached to the surface of the object to be treated, the enhanced heat dissipation device is attached to the surface of the anti-icing device, the control module is connected to the anti-icing device, the control module calculates the required power of the current to be passed into the anti-icing device by collecting the temperature of the surface of the object to be treated, and the control module passes the current into the anti-icing device according to the obtained power.

[0014] More preferably, the formula for calculating the power of the current is as follows:

[0015] Where P is the power of the current. α The Seebeck coefficient, I The current intensity passing through the electric arm, T 1 and T2 represents the thermodynamic temperatures of the heat-emitting and heat-absorbing ends of the electric arm, respectively. R The resistance of the electrode arm.

[0016] More preferably, the enhanced heat dissipation device is a microfin or microchannel heat sink, and the heat sink is made of aluminum alloy or copper.

[0017] According to another aspect of the present invention, an application of the above-described high-efficiency anti-icing system for low-altitude aircraft is provided on the leading edge of the wing, propeller, or sensor surface of the low-altitude aircraft.

[0018] In summary, the technical solutions conceived by this invention have the following beneficial effects compared with the prior art: 1. This invention employs an array of P-type and N-type semiconductors arranged in an alternating pattern. This is because the two types use holes and electrons as charge carriers respectively, and their charge properties are opposite. The alternating arrangement creates a synergistic path for the directional movement of charge carriers. Simultaneously, by superimposing the thermal effects of multiple semiconductor units in the array, heat is uniformly concentrated on the anti-icing surface, and the unit density can be maximized within a limited space to accommodate thin-film structures. The formation of a closed loop is necessary because the thermoelectric effect requires a continuous current flow through the semiconductor. The closed loop provides the necessary conditions for current circulation, and the direction of heat transport can be precisely controlled by adjusting the current direction. It can also stably respond to pulsed currents to adapt to different icing conditions. This design maximizes the synergistic effect of the Peltier effect and Joule heating, improving the efficiency of directional heat transport and reducing overall energy consumption compared to traditional electrothermal technologies. Furthermore, the array structure enhances the device's vibration resistance, and the thin-film characteristics allow for flexible attachment to complex curved surfaces without affecting the aerodynamic performance of the aircraft.

[0019] 2. This invention employs a spacing of 0.2–1 mm between P-type and N-type semiconductors. This spacing ensures effective thermoelectric coupling between adjacent units to achieve synergistic thermal effects, while avoiding electric field interference or short-circuit risks. It also provides installation space for wires and insulation support structures and reserves a small air gap to aid localized heat dissipation. Furthermore, this spacing allows for a reasonable number of units to be arranged within a unit area (e.g., a 20×20mm substrate can accommodate more than 100 units), balancing heat output density and fabrication feasibility. Both types of semiconductors are set to a thickness of 0.2–0.5 mm because this thickness is compatible with bismuth telluride (Bi2Te3)-based semiconductors. The carrier migration characteristics fully trigger the Peltier effect to reduce internal conduction losses, and the overall thickness of the thermoelectric layer can be controlled within 1mm, with the total thickness after combining the upper and lower substrates controlled within 2mm. This meets the stringent space and weight restrictions of aircraft and shortens the heat conduction path, enabling the device to complete hot-end heating in milliseconds under pulsed current drive, improving the response speed by more than 50% compared to traditional thick semiconductor structures. This size setting achieves a balance between thermoelectric conversion efficiency, structural safety, ease of processing, and device thinness, precisely meeting the core requirements of low-altitude aircraft for low energy consumption and small size. 3. The anti-icing device of this invention utilizes the Peltier effect and Joule heating synergy of thermoelectric heat pumps to achieve "active heat pumping." Compared to simple resistance wire heating, it can achieve the same or even better anti-icing effect with lower power consumption, and the coefficient of performance (COP) is much higher than that of traditional methods. In addition, the anti-icing device has an extremely fast thermal response speed, which can quickly start when the risk of icing occurs and reach the temperature required for anti-icing in a short time, thus effectively responding to sudden weather changes.

[0020] 4. The de-icing device of this invention is small in size and light in weight, and can be easily integrated into the surface of key components of aircraft (such as wings, rotors, and sensors). It has minimal impact on the aerodynamic shape and overall weight of the aircraft, has a compact structure, is easy to integrate, and effectively reduces average power consumption through pulse control, thus solving the energy consumption pain point of existing technologies. By combining thermoelectric heat pump technology with intelligent control strategies, efficient and low-energy de-icing of low-altitude aircraft is achieved. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a de-icing device constructed according to a preferred embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of the structure of a high-efficiency anti-icing system constructed according to a preferred embodiment of the present invention.

[0023] Figure 3 This is a flowchart of the operation of a high-efficiency anti-icing system constructed according to a preferred embodiment of the present invention.

[0024] Figure 4This is a cloud map showing the icing growth rate on the wing surface in an embodiment constructed according to a preferred embodiment of the present invention.

[0025] Figure 5 This is a curve showing the change in energy efficiency ratio (COP) with current intensity I, constructed according to a preferred embodiment of the present invention.

[0026] Figure 6 This is a schematic diagram of the wing heating surface division constructed according to a preferred embodiment of the present invention.

[0027] Figure 7 This is a cloud map showing the growth rate of icing on the wing surface after de-icing of a thermoelectric heat pump under operating conditions, constructed according to a preferred embodiment of the present invention.

[0028] In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein: 1-Upper substrate, 2-Lower substrate, 3-Thermoelectric layer, 4-P-type semiconductor, 5-N-type semiconductor, 6-Insulating support, 7-Wire, 8-De-icing device, 9-Enhanced heat exchange device, 10-Wing. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0030] like Figure 1 As shown, a low-energy anti-icing device based on a thermoelectric heat pump includes an upper substrate 1, a lower substrate 2, and a thermoelectric layer 3. The thermoelectric layer 3 is composed of alternating P-type semiconductors 4 and N-type semiconductors 5, connected by wires 7 to form an electrical circuit. Below the wires, an insulating support 6 is provided to fix the metal wires connecting the P-type semiconductors 4 and N-type semiconductors 5. The anti-icing device is a miniature thin-film type. The thermoelectric layer often uses a series electrical connection and a parallel thermal connection. In one embodiment of the invention, the thickness of the anti-icing device is less than 2 mm.

[0031] The alternating arrangement of P-type semiconductors 4 and N-type semiconductors 5 is key to achieving thermoelectric conversion. P-type semiconductors use holes as charge carriers, while N-type semiconductors use electrons. The different charge carrier characteristics of the two semiconductors, when working together, can significantly enhance the thermoelectric effect.

[0032] The conductor 7, made of highly conductive metals such as copper and silver, connects the adjacent P-type semiconductor 4 and N-type semiconductor 5 to form a closed electrical circuit. Its function is to ensure smooth flow of current and charge carriers, while reducing contact resistance, minimizing energy loss, and preventing the waste of anti-icing energy due to heat generated by resistance.

[0033] Both the upper substrate 1 and the lower substrate 2 are made of ceramic substrates, which have the characteristics of insulation, high temperature resistance, and high thermal conductivity. On the one hand, the ceramic substrate can isolate the semiconductor from external metal components, prevent short circuits, and ensure the safe operation of the device; on the other hand, it can quickly transfer the heat generated by the semiconductor to the surface that is prone to freezing, or absorb heat from the frosted surface, and can resist low temperature and humid environments, preventing the module from being damaged by moisture.

[0034] The working principle of the anti-icing device of the present invention is described below.

[0035] (1) Active heating and anti-icing (Peltier effect) When a DC power supply flows through the thermoelectric module circuit, it begins to operate based on the Peltier effect. In heating mode, the current drives holes in the P-type semiconductor 4 to move towards the upper surface of the module, and electrons in the N-type semiconductor 5 also move towards the upper surface. Charge carriers accumulate at the contact interface on the upper surface and release heat energy, causing the temperature of the upper surface (close to easily icing components) to rise and the temperature of the lower surface (facing inward) to drop. The generated heat directly acts on easily icing surfaces, such as heat exchangers and pipe walls, effectively preventing water vapor from condensing into ice or melting existing thin ice, thus achieving active anti-icing.

[0036] The de-icing device is driven by direct current and utilizes the Peltier effect and Joule heating synergistically to provide heat to surfaces prone to icing.

[0037] The de-icing device uses pulse current control, and the frequency, amplitude, and duty cycle of the pulse are adjustable.

[0038] (2) Assisted energy saving (Seebeck effect) When a temperature difference exists between the upper and lower surfaces of the de-icing device, the Seebeck effect comes into play. At this time, the surface of the de-icing device frosts or freezes due to the low ambient temperature, creating a temperature difference with the internal warm components. Holes in the P-type semiconductor 4 move from the high-temperature end (inside) to the low-temperature end (frost-covered surface), while electrons in the N-type semiconductor 5 move from the low-temperature end (frost-covered surface) to the high-temperature end (inside). The directional movement of charge carriers forms a closed loop through the wires, thereby generating direct current (DC) energy. This energy can be recovered and reused to power the sensors and control modules of the anti-icing system, reducing overall energy consumption and achieving an auxiliary energy-saving effect.

[0039] In this embodiment, the anti-icing device 9 has a size of 20x20mm and a thickness of 1mm to ensure its integration and response speed. Its small size and thinness significantly improve its integration, making it suitable for installation in confined spaces; its large specific surface area facilitates rapid heat transfer, enhancing response speed and enabling the device to respond to icing conditions more promptly and efficiently, thus ensuring anti-icing effectiveness.

[0040] like Figure 2 As shown, a high-efficiency anti-icing system for low-altitude aircraft includes the aforementioned de-icing device, enhanced heat exchange device, and control module. The upper substrate 1 of the de-icing device 8 is the hot end, which is tightly bonded to the aircraft's icy surface, such as the inner skin of the leading edge of the wing 10, using high thermal conductivity adhesive or direct pressing to ensure efficient heat transfer from the thermoelectric module to the outside. The lower substrate 2 of the de-icing device 8 is the cold end, which is connected to an enhanced heat dissipation device 9 mounted on the aircraft surface.

[0041] In one embodiment of the present invention, the enhanced heat dissipation device 9 is a set of microfins or microchannel radiators made of high thermal conductivity aluminum alloy or copper, which are in contact with the air or cooling medium inside the wing, absorb heat from the environment, and transfer the absorbed heat to the hot end through the cold end to maintain an effective working temperature difference.

[0042] like Figure 3 As shown, the control module includes a sensor data unit, an icing prediction numerical model, and a control unit.

[0043] The sensor data unit is used to acquire environmental parameters in real time, such as temperature, humidity and liquid water content (LWC) data of the wing leading edge through temperature sensors, humidity sensors and liquid water content (LWC) sensors, and input them to the control unit.

[0044] The icing prediction numerical model can be integrated into the control unit or acquired from a ground station or onboard computer via wireless / wired means. Based on computational fluid dynamics (CFD) theory, this icing prediction numerical model can simulate the airflow field and water droplet trajectory of an aircraft under current weather conditions, accurately predict the icing area and ice thickness, and thus calculate the required anti-icing heat flux density.

[0045] The control unit dynamically adjusts the input power of the de-icing device 8 based on the required heat flux density calculated by the icing prediction model.

[0046] The control unit employs a pulsed current drive method, controlling the frequency, amplitude, and duty cycle of the pulses to achieve precise control of the heating power of the de-icing device. For example, under conditions of slight icing, a pulsed current with a low duty cycle can be used; while under conditions of severe icing, the duty cycle or pulse amplitude can be increased to ensure sufficient anti-icing heat.

[0047] The control module operates as follows: First, the sensor data unit and the icing prediction numerical model predict the icing conditions on the aircraft surface. Then, the icing prediction numerical model calculates the required heat flux density based on the prediction results and dynamically adjusts the power supply to the de-icing device. Upon power-up, an external power source provides DC current that flows through the de-icing device. At this time, the hot end of the de-icing device releases heat due to the Peltier effect, and simultaneously, Joule heat generated by the current flowing through the semiconductor is also released. These two sources of heat work together to provide heat to the wing surface, achieving either anti-icing or de-icing. Simultaneously, the cold end of the de-icing device absorbs heat and transfers it to the enhanced heat dissipation device, where it is dissipated through heat exchange with the internal air or cooling medium. This process is a closed loop; the control unit continuously monitors the icing condition and adjusts the drive pulses in real time to ensure that the heat output always matches the anti-icing requirements.

[0048] The calculation principle for the input power of the de-icing device 9 is as follows: According to the Peltier effect principle, Peltier heat Q p The calculation formula is as shown in formula (1).

[0049] (1) In the formula, α The Seebeck coefficient, I The current intensity passing through the electric arm, T These are the thermodynamic temperatures at both ends of the electric arm. Combined with Joule heating... Q j The influence of the thermal conductivity of the arm material was also considered to obtain the heat dissipation at the hot end of the arm. Q h and the heat absorption end Q c The calculation formulas are shown in equations (3) and (4). In the equations... T 1. T 2 represents the thermodynamic temperatures of the heat-emitting and heat-absorbing ends of the electric arm, respectively. R For the resistance of the electric arm, K denoted as , where is the thermal conductivity of the arm material.

[0050] (2) (3) The input power is obtained from the law of conservation of energy. P The calculation formula is shown in Formula 5.

[0051] (4) The COP value of the thermoelectric device is Equation (6).

[0052] (5) The formulas for calculating the total resistance, total thermal conductivity, and total Seebeck coefficient of a pair of thermoelectric arm units are shown in equation (6-8).

[0053] (6) (7) (8) The present invention will be further described below with reference to specific embodiments.

[0054] For a single P-type or N-type semiconductor, a typical commercial bismuth telluride (Bi2Te3)-based thermoelectric material is selected. The height h of a single P-type or N-type semiconductor is 1 mm, and the cross-sectional area A is 1 mm². The physical properties of bismuth telluride at 300 K are detailed in Table 1. The flight parameters of the aircraft are as follows: 1000 m altitude, -30°C static air temperature, 70 m / s flight speed, and 0.21 g / m³ liquid water content. Based on icing calculations, the required complete de-icing heat load is 2056 W, and the maximum required heat flux density for the wing wall is 2.797 × 10⁴ W / m². The cloud map showing the wing wall icing growth rate is shown below. Figure 4 As shown. Figure 4 This is a cloud map showing the instantaneous icing rate distribution on the surface of aerodynamic components of an aircraft (such as a wing). The map uses "icing rate increase" as the physical quantity and employs color gradients to represent the differences in icing rates across different regions: the color bars correspond to values ​​ranging from 0 (dark blue) to 6.56594 × 10⁻⁶. -3 (Red) The icing rate of the main part is close to 0, while the leading edge surface shows yellow-red stripes, which is a concentrated area with a significantly higher icing rate. This figure clearly shows the key areas of icing, providing intuitive data support for the layout design of anti-icing devices (such as the key coverage areas of the thermoelectric de-icing layer).

[0055] Table 1 Physical properties of bismuth telluride-based semiconductor materials

[0056] The total resistance of a pair of thermoelectric arm units can be calculated to be 2.03 × 10⁻⁶. -2 Ω, total thermal conductivity is 3.05×10 -3 W / K, the total Seebeck coefficient is 4.3 × 10 -4 V / K.

[0057] In anti-icing calculations, the hot end, due to its contact with the icing surface, is the heat source. T h =273.15K, and to ensure de-icing effect, the temperature difference between the hot end and the airfoil surface is 40K, that is... T 1 = 313.15 K. The cold end is in contact with the air inside the wing, therefore the cold source... Tc =243.15K, and the temperature difference is chosen to be 40K, that is T 2 = 283.15 K. The calculated heat release, input power, and COP of a pair of thermocouple units are shown in equation (10-12).

[0058] (10) (11) (12) For the COP value curve, see [link / details]. Figure 5 The maximum energy efficiency ratio (COP) is achieved when the current I = 1.746 A. max =1.978, at this time Q c =0.1670W, P=0.08444W. Based on the required maximum wall heat flux density q... max =2.797×10 4 W / m 2 The minimum area occupied by a pair of thermoelectric arm units on the wing surface is 5.97 mm. 2 Based on the total heat load calculation, the minimum number of thermoelectric arm units required for the wing is N=12312. With a 10% margin, the total number of thermoelectric arm units is 13543. Therefore, the power consumption of the thermoelectric heat pump de-icing device is 1143W, which saves 1119W compared to electrothermal de-icing (assuming 100% efficiency).

[0059] Figure 6 To prevent icing, the anti-icing wall surface is divided into four regions: H1, H2, H3, and H0, based on the distribution of anti-icing heat flux density. Figure 6 The load ratio of H1-H3 is approximately 5.2:2.8:1, and their areas are 0.0349 m², respectively. 2 0.0502m 2 0.0899m 2 The heat flux density was calculated accordingly and used as the input boundary condition. The highest temperature on the protective zone wall was found to be 44.17℃ after thermal coupling calculation, and the icing growth rate cloud map obtained from the thermal coupling calculation is as follows: Figure 7 As shown, the design of this thermoelectric heat pump basically meets the anti-icing requirements.

[0060] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A high-efficiency anti-icing device applied to a low-altitude aircraft, characterized in that, The device comprises a set of upper substrate (1), lower substrate (2) and thermoelectric layer (3) arranged between the upper substrate (1) and the lower substrate (2), the thermoelectric layer (3) is an array formed by alternating and spaced P-type semiconductor (4) and N-type semiconductor (5), and the P-type semiconductor (4) and the N-type semiconductor (5) are connected in series by wires to form a closed loop, and the thermoelectric layer (3) is connected to an external power supply for power supply.

2. A high efficiency ice protection system for low altitude aircraft as claimed in claim 1, wherein, The spacing between the P-type semiconductor (4) and the N-type semiconductor (5) is 0.2mm-1mm, and the thickness of the P-type semiconductor (4) and the N-type semiconductor (5) is 0.2mm-0.5mm.

3. A high efficiency ice protection system for low altitude aircraft as defined in Claim 1 wherein, The thickness of the upper substrate (1) and the lower substrate (2) is 0.2mm-0.5mm.

4. A high efficiency ice protection system for low altitude aircraft as defined in Claim 1 wherein, The heating layer is connected to a direct current, and the pulse frequency, amplitude and duty cycle of the direct current are adjustable.

5. A high efficiency ice protection system for low altitude aircraft as defined in claim 1 wherein, The upper substrate (1) and the lower substrate (2) are made of ceramic material.

6. A high efficiency ice protection system for low altitude aircraft as defined in claim 1 wherein, An insulating support (6) is arranged below the wires for fixing the metal wires connected to the P-type semiconductor (4) and the N-type semiconductor (5).

7. A highly efficient de-icing system for low altitude aircraft, characterized in that, The system comprises the high-efficiency anti-icing device, the reinforced heat dissipation device and the control module applied to the low-altitude aircraft according to any one of claims 1-6, wherein: The anti-icing device is attached to the surface of the object to be treated, the reinforced heat dissipation device is attached to the surface of the anti-icing device, and the control module is connected to the anti-icing device, and the required power of the current flowing into the anti-icing device is calculated by collecting the temperature of the surface of the object to be treated, and the current is flowed into the anti-icing device according to the obtained power of the current.

8. A highly efficient ice protection system for low altitude aircraft as in claim 1, wherein, The calculation formula of the power of the current is as follows: where P is the power of the current, α is the Seebeck coefficient, I is the current intensity through the electric arm, T 1 and T 2 are the thermodynamic temperatures of the electric arm at the heat emitting end and the heat absorbing end, respectively, R is the electric arm resistance.

9. A high efficiency ice protection system for use on low altitude aircraft as defined in claim 1 wherein, The reinforced heat dissipation device is a micro-fin or micro-channel heat sink, and the material of the heat sink is aluminum alloy or copper.

10. The application of the high-efficiency anti-icing system applied to the low-altitude aircraft according to any one of claims 7-9 to the leading edge of the wing, the propeller or the surface of the sensor of the low-altitude aircraft.

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