Inspection device and method for passive radon gas measurement equipment and electronic equipment

Abstract

The invention provides an inspection device and method for passive radon gas measuring equipment and electronic equipment, and the device comprises an MCU controller, a first box body, a second box body, active radon gas measuring equipment, the second box body and the first box body are connected through a first gas inlet pipe and a first gas outlet pipe. The second box body and the active radon gas measuring equipment are connected through a second gas inlet pipe and a second gas outlet pipe; wherein the first box body is provided with a hygrothermograph, the first air inlet pipe is provided with an air pump, and the flow of the air pump is set as a first air pump flow value; the MCU controller is in communication connection with the hygrothermograph, the active radon gas measuring device and the gas pump. By adopting the embodiment of the invention, the inspection efficiency of the passive radon gas measurement equipment can be improved.

Description

Technical Field

[0001] This application relates to the field of instrument testing technology, and in particular to a testing device, method and electronic equipment for passive radon gas measuring equipment. Background Technology

[0002] Passive radon measurement devices (such as home radon meters) are widely used in radon concentration detection scenarios such as homes and offices due to their low cost and ease of operation. Before leaving the factory, these devices must undergo accuracy testing to ensure the reliability of the measurement results. The core of this testing is the need for a stable and controllable standard radon concentration environment as a calibration benchmark.

[0003] Currently, existing radon concentration standard environments (such as radon chamber validation systems) have many shortcomings and are difficult to adapt to the batch validation requirements of passive radon gas measurement equipment before it leaves the factory. The Ra-226 solid radon source used in these systems is highly hazardous, and there are significant radioactive safety risks when preparing high-concentration radon gas. In addition, operation requires professional personnel and supporting protective equipment, and the overall process is complicated. At the same time, the construction and maintenance costs of radon chambers are high, and they are limited to fixed laboratory settings. The number of devices that can be tested at one time is small and the cycle is long, which completely fails to meet the efficiency requirements of large-scale factory validation of passive radon gas measurement equipment.

[0004] Therefore, improving the testing efficiency of passive radon gas measuring equipment has become an urgent problem to be solved. Summary of the Invention

[0005] This application provides an inspection device, method, and electronic equipment for passive radon gas measurement devices. By using granite as a natural radon source, employing a dual-box layered layout, and using multiple fans for uniform distribution, the stability of the radon concentration environment is ensured. At the same time, the multi-layer placement allows for the parallel inspection of multiple devices, and the modular structure reduces costs and operational barriers, thereby improving the inspection efficiency of passive radon gas measurement devices.

[0006] In a first aspect, embodiments of this application provide a testing device for a passive radon gas measuring device. The device includes an MCU controller, a first housing, a second housing, and an active radon gas measuring device. The second housing and the first housing are connected via a first inlet pipe and a first outlet pipe. The second housing and the active radon gas measuring device are connected via a second inlet pipe and a second outlet pipe. The first housing is equipped with a thermometer and hygrometer, and the first inlet pipe is equipped with an air pump. The flow rate of the air pump is set to a first air pump flow rate value. The MCU controller is communicatively connected to the thermometer and hygrometer, the active radon gas measuring device, and the air pump, respectively. The first chamber is a radon gas generator. Its interior is vertically arranged from top to bottom as a first space, a second space, and a third space. The first space is a first gas circulation space, which is equipped with the thermometer and hygrometer and a fans, where a is an even number greater than or equal to 4. The second space is a desiccant placement area, used to place desiccant to keep the first chamber dry. The third space is a granite placement area, used to place granite to generate radon gas. The second enclosure is a test device placement box. Inside, from top to bottom, there are a fourth space and a fifth space. The fourth space includes m layers of test device placement positions, each containing m passive radon gas measuring devices. Each test device placement position corresponds to one passive radon gas measuring device, where m is an integer greater than or equal to 2. The fifth space is a second gas circulation space, equipped with b fans, where b is an even number greater than or equal to 6.

[0007] Optionally, the first housing and the second housing form a gas circulation loop through the first air inlet pipe and the first air outlet pipe; The top of the first housing is provided with a first air inlet and a first air outlet; the top of the second housing is provided with a second air inlet, a second air outlet, a third air inlet, and a third air outlet. One end of the first air intake pipe extends into the second air intake position to a depth not less than a preset depth, and the other end extends into the first air outlet position to a depth not less than the preset depth; One end of the first air outlet extends into the second air outlet position to a depth not less than the preset depth, and the other end extends into the first air inlet position to a depth not less than the preset depth.

[0008] Optionally, the second housing and the active radon gas measuring device form a gas monitoring loop through the second inlet pipe and the second outlet pipe; One end of the second air inlet pipe is connected to the air inlet of the active radon gas measuring device, and the other end extends into the third air outlet with an insertion depth not less than the preset depth. One end of the second outlet pipe is connected to the outlet end of the active radon gas measuring device, and the other end extends into the third inlet position with an insertion depth not less than the preset depth.

[0009] Optionally, the volume of the third space is greater than or equal to twice the sum of the volumes of the first space and the second space.

[0010] Secondly, embodiments of this application provide a testing method for a passive radon gas measuring device, applied to an MCU controller in the device described in the first aspect, the method comprising: Determine the target radon concentration range corresponding to the preset target radon concentration; The active radon gas measuring device receives radon concentration data of the second chamber and adjusts the flow rate of the gas pump according to the radon concentration data to control the radon concentration in the second chamber to be within the target radon concentration range. Based on the target radon concentration range, the m passive radon gas measuring devices are calibrated to obtain a first calibration index and m second calibration indexes; each second calibration index corresponds to one passive radon gas measuring device. If the first verification index meets the preset first condition, then the second verification index that meets the preset second condition among the m second verification indices is obtained, resulting in n second verification indices; n is a natural number. It is determined that among the m passive radon gas measuring devices, the n passive radon gas measuring devices corresponding to the n second verification indicators have passed the verification.

[0011] Thirdly, embodiments of this application provide an electronic device, including a processor, a memory, a communication interface, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the processor, and the programs include instructions for performing the steps in the method described in the second aspect of embodiments of this application.

[0012] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program for electronic data interchange, wherein the computer program causes a computer to perform some or all of the steps described in the method of the second aspect of embodiments of this application.

[0013] By implementing the embodiments of this application, natural granite radon sources can be used to replace traditional high-risk radioactive radon sources, avoiding the safety hazards of radioactive radon sources. At the same time, by utilizing the dual-box layered layout, multi-fan uniform design, and MCU controller closed-loop control, a stable, uniform, and controllable standard radon concentration environment can be provided. Multiple passive radon gas measuring devices can be tested in parallel through multi-layered test device placement positions. Combined with the modular structure, operation is simplified and construction and maintenance costs are reduced. While ensuring the accuracy of testing, the batch testing efficiency of passive radon gas measuring devices is greatly improved, effectively meeting the requirements for low-cost, high-efficiency, and large-scale accuracy verification before delivery. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of an inspection device for a passive radon gas measuring equipment provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a first box provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a second housing provided in an embodiment of this application; Figure 4 This is a schematic flowchart of a testing method for a passive radon gas measuring device provided in an embodiment of this application; Figure 5 This is a schematic diagram of a process for controlling the radon concentration in a second chamber, provided in an embodiment of this application. Figure 6 This is a schematic diagram of the process for calibrating a passive radon gas measuring device provided in an embodiment of this application; Figure 7 This is a schematic diagram of an automated monitoring process for the drying environment of a first chamber, provided in an embodiment of this application. Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0016] Explanation of reference numerals in the attached diagram: 100: Inspection device for passive radon gas measurement equipment; 1: MCU controller; 2: First housing; 3: Second housing; 4: Active radon gas measurement equipment; 5: First inlet pipe; 6: First outlet pipe; 7: Second inlet pipe; 8: Second outlet pipe; 9: Thermometer and hygrometer; 21: First space; 22: Second space; 23: Third space; 24: First flip door; 31: Fourth space; 32: Fifth space; 33: Second flip door; 51: Air pump. Detailed Implementation

[0017] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0018] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0019] It should be understood that the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document indicates that the preceding and following related objects are in an "or" relationship. In the embodiments of this application, "multiple" refers to two or more.

[0020] In the embodiments of this application, "at least one item" or its similar expression refers to any combination of these items, including any combination of a single item or a plurality of items. "One or more" means one or more, while "multiple" means two or more. For example, "at least one item" of a, b, or c can represent the following seven cases: a, b, c; a and b; a and c; b and c; a, b, and c. Each of a, b, and c can be an element or a set containing one or more elements.

[0021] In this application, the term "connection" refers to various connection methods, such as direct connection or indirect connection, to achieve communication between devices. This application does not impose any limitations on this.

[0022] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0023] The following is an explanation of the relevant terms used in this application: Ra-226 solid radon source: refers to a solid-state radon gas generator that uses the radioactive nuclide radium-226 as its core radiation source, and is solidified, molded, and sealed. It can generate radon gas through alpha decay and release radon gas in a controlled manner.

[0024] A radon chamber is a specially designed, sealed experimental setup used to precisely simulate and control radon gas concentrations and environmental parameters to verify and calibrate the performance of radon detection instruments. Its core objective is to provide a standardized and traceable testing environment for radon measurement equipment, ensuring the accuracy and reliability of measurement results.

[0025] Microcontroller Unit (MCU): refers to a "chip-level computer" that integrates functional modules such as a central processing unit, memory, timer / counter, input / output interface, analog-to-digital converter, and communication interface onto a single chip.

[0026] Passive radon measurement devices (such as home radon meters) are widely used in radon concentration detection scenarios such as homes and offices due to their low cost and ease of operation. Before leaving the factory, these devices must undergo accuracy testing to ensure the reliability of the measurement results. The core of this testing is the need for a stable and controllable standard radon concentration environment as a calibration benchmark.

[0027] Currently, existing radon concentration standard environments (such as radon chamber validation systems) have many shortcomings and are difficult to adapt to the batch validation requirements of passive radon gas measurement equipment before it leaves the factory. The Ra-226 solid radon source used in these systems is highly hazardous, and there are significant radioactive safety risks when preparing high-concentration radon gas. In addition, operation requires professional personnel and supporting protective equipment, and the overall process is complicated. At the same time, the construction and maintenance costs of radon chambers are high, and they are limited to fixed laboratory settings. The number of devices that can be tested at one time is small and the cycle is long, which completely fails to meet the efficiency requirements of large-scale factory validation of passive radon gas measurement equipment.

[0028] Therefore, improving the testing efficiency of passive radon gas measuring equipment has become an urgent problem to be solved.

[0029] To address the aforementioned problems, this application provides an inspection device, method, and electronic device for passive radon gas measurement equipment. The device includes an MCU controller, a first housing, a second housing, and an active radon gas measurement device. The second housing and the first housing are connected via a first inlet pipe and a first outlet pipe. The second housing and the active radon gas measurement device are connected via a second inlet pipe and a second outlet pipe. The first housing is equipped with a thermometer and hygrometer, and the first inlet pipe is equipped with an air pump. The flow rate of the air pump is set to a first air pump flow rate value. The MCU controller is communicatively connected to the thermometer and hygrometer, the active radon gas measurement device, and the air pump. The first housing is a radon gas generating chamber, and its interior is vertically arranged from top to bottom with a first... The enclosure comprises a first space, a second space, and a third space. The first space is a first gas circulation space, equipped with the thermometer and hygrometer and *a* fans, where *a* is an even number greater than or equal to 4. The second space is a desiccant placement area, used to place desiccant to keep the first enclosure dry. The third space is a granite placement area, used to place granite to generate radon gas. The second enclosure is a test device placement box, with a fourth space and a fifth space arranged vertically from top to bottom. The fourth space includes *m* layers of test device placement areas, holding *m* passive radon gas measuring devices, with each test device placement area corresponding to one passive radon gas measuring device, where *m* is an integer greater than or equal to 2. The fifth space is a second gas circulation space, equipped with *b* fans, where *b* is an even number greater than or equal to 6.

[0030] It is evident that by using granite as a natural radon source, employing a dual-box layered layout, and using multiple fans for homogenization, the stability of the radon concentration environment can be ensured. At the same time, the multi-layer placement allows for the parallel testing of multiple devices, and the modular structure reduces costs and operational barriers, thereby improving the testing efficiency for passive radon gas measurement equipment.

[0031] For easier understanding, please refer to Figure 1 , Figure 1 This is a schematic diagram of a testing device for a passive radon gas measuring device provided in an embodiment of this application. The testing device 100 for the passive radon gas measuring device can include: an MCU controller 1, a first housing 2, a second housing 3, and an active radon gas measuring device 4. The second housing 3 and the first housing 2 are connected via a first air inlet pipe 5 and a first air outlet pipe 6. The second housing 3 and the active radon gas measuring device 4 are connected via a second air inlet pipe 7 and a second air outlet pipe 8. The first housing 2 is equipped with a thermometer and hygrometer 9, and the first air inlet pipe 5 is equipped with an air pump 51, the flow rate of which is set to a first air pump flow rate value. The MCU controller 1 is communicatively connected to the thermometer and hygrometer 9, the active radon gas measuring device 4, and the air pump 51.

[0032] The MCU controller 1 can receive real-time temperature and humidity data from the temperature and humidity meter 9 inside the first chamber 2 via serial communication. When the humidity is detected to be greater than a preset threshold (e.g., 70%RH), it generates a first prompt signal (e.g., an audible and visual alarm signal) to prompt the operator to replace the desiccant, ensuring a stable drying environment in the first chamber 2. The MCU controller 1 communicates bidirectionally with the active radon gas measuring device 4, receiving real-time radon concentration data from the second chamber 3 and sending measurement parameter configuration instructions (e.g., sampling frequency, measurement accuracy level) to it. The MCU controller 1 is also connected to the air pump 51, which can dynamically adjust the air pump flow rate based on the deviation between the radon concentration data uploaded by the active radon gas measuring device 4 and the preset target concentration, thereby controlling the radon delivery rate in the first air inlet pipe 5 and achieving closed-loop stable control of the radon concentration in the second chamber 3.

[0033] The first chamber 2 is a radon gas generator. Its interior is arranged vertically from top to bottom as a first space 21, a second space 22, and a third space 23. The first space 21 is a first gas circulation space, which is equipped with a thermometer and hygrometer 9 and a fans, where a is an even number greater than or equal to 4. The second space 22 is a desiccant placement position, used to place desiccant to keep the first chamber 2 dry. The third space 23 is a granite placement position, used to place granite to generate radon gas.

[0034] For easier understanding, please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of a first housing provided in an embodiment of this application. The first housing 2 is provided with a first flip-top door 24 on the top. The first flip-top door 24 is rotatably connected to the top edge of the first housing 2 via a hinge. A sealing ring is provided at the contact point between the first flip-top door 24 and the first housing 2 to ensure the airtightness of the first housing 2. It can be flipped up and opened to facilitate the operator to quickly take out and put in the granite in the third space 23 and the desiccant in the second space 22. At the same time, it is convenient to inspect and maintain components such as the fan and thermometer / hygrometer 9 inside the first housing 2, so as to improve the ease of operation and maintenance of the inspection device 100 for passive radon gas measurement equipment.

[0035] The height of the first space 21 is not less than 15cm, which provides sufficient space for gas circulation and ensures that the airflow generated by the fan can form a complete circulation path, avoiding dead air zones. The a fans of the first space 21 are symmetrically arranged on both sides of the first box 2, with the airflow direction blowing in opposite directions (forming a cross-circulation airflow). They can be directly connected to the power supply and started without the need for control by the MCU controller 1, which accelerates the mixing of radon gas released by the granite with the air in the first box 2. The temperature and humidity meter 9 of the first space 21 can monitor the temperature and humidity data in the first box 2 in real time and transmit the relevant data to the MCU controller 1 to trigger the desiccant replacement prompt.

[0036] The second space 22, with a height of 5 cm, is used to place a desiccant. This desiccant controls the humidity inside the first chamber 2 through physical adsorption, preventing excessive humidity from causing radon gas to form aerosols and affecting the accuracy of measurements. Desiccants include, but are not limited to, silica gel desiccants, molecular sieve desiccants, activated alumina desiccants, and calcium chloride desiccants; specific limitations are not specified here.

[0037] The third space 23 is used to house granite to release radon gas, providing a safe and stable base gas source for the testing device 100 for passive radon measurement equipment, replacing traditional high-risk radioactive radon sources. The volume of the third space 23 is greater than or equal to twice the sum of the volumes of the first space 21 and the second space 22; that is, the volume of the third space 23 occupies at least two-thirds of the volume of the first enclosure 2, facilitating the containment of sufficiently large granite to ensure adequate radon generation. For example, if the volume of the first enclosure 2 is 3m³... 3 The space is 3m long, 1m wide, and 1m high. The height of the first space 21 can be set to 15cm, the height of the second space 22 can be set to 5cm, and the height of the third space 23 can be set to 80cm to meet the volume ratio requirements and fully guarantee the radon gas supply capacity.

[0038] The second housing 3 is a test chamber, and its interior is arranged vertically from top to bottom as a fourth space 31 and a fifth space 32. The fourth space 31 includes m layers of test chamber placement positions, which hold m passive radon gas measuring devices. Each test chamber placement position corresponds to one passive radon gas measuring device, where m is an integer greater than or equal to 2. The fifth space 32 is a second gas circulation space, which is equipped with b fans, where b is an even number greater than or equal to 6.

[0039] For easier understanding, please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of a second housing provided in an embodiment of this application. A second flip-top door 33 is provided on the side of the second housing 3. The second flip-top door 33 is rotatably connected to the side edge of the second housing 3 by a hinge. A sealing ring is provided at the contact point between the second flip-top door 33 and the second housing 3 to ensure the airtightness of the second housing 3. It can be flipped outward to open, which is convenient for batch insertion or removal of passive radon gas measuring equipment, and for cleaning or maintenance of the fan inside the second housing 3.

[0040] The fourth space 31 includes m layers of test device placement positions, each capable of holding one passive radon gas measuring device. The height of each test device placement position can be determined based on the height of the passive radon gas measuring device, and the number of test device placement positions can be determined in conjunction with the height of the fourth space 31. The passive radon gas measuring device is a testing device 100 (such as a household radon meter) that requires no external power supply and relies on its physical / chemical properties to achieve cumulative radon gas measurement.

[0041] The b fans in the fifth space 32 can be directly connected to the power supply and started without the need for additional control by the MCU controller 1, thus simplifying circuit design and reducing maintenance costs. These b fans are evenly arranged in a matrix (e.g., a 2×3 matrix distribution when b=6, and a 2×4 matrix distribution when b=8), and are mounted on a mounting plate at the bottom of the fifth space 32. This mounting plate has ventilation holes to ensure unobstructed airflow. The airflow direction of the fans is designed to point towards the top diagonal position of the second enclosure 3: the airflow from the fans in the left area points towards the top right diagonal, and the airflow from the fans in the right area points towards the top left diagonal, forming a cross-spiral circulating airflow.

[0042] In some embodiments, the first housing 2 and the second housing 3 form a gas circulation loop through the first air inlet pipe 5 and the first air outlet pipe 6; the top of the first housing 2 is provided with a first air inlet position and a first air outlet position; the top of the second housing 3 is provided with a second air inlet position, a second air outlet position, a third air inlet position and a third air outlet position; one end of the first air inlet pipe 5 extends into the second air inlet position with an insertion depth not less than a preset depth, and the other end extends into the first air outlet position with an insertion depth not less than a preset depth; one end of the first air outlet pipe 6 extends into the second air outlet position with an insertion depth not less than a preset depth, and the other end extends into the first air inlet position with an insertion depth not less than a preset depth.

[0043] Specifically, the top of the first housing 2 is provided with a first air inlet and a first air outlet, and both interfaces are equipped with sealing joints (such as rubber sealing rings and clamps) to ensure the airtightness of the pipeline connection; the top of the second housing 3 is provided with a second air inlet, a second air outlet, a third air inlet and a third air outlet, and each interface is equipped with a sealing joint to ensure the airtightness of the pipeline connection.

[0044] One end of the first air inlet pipe 5 passes through the second air inlet and extends into the second housing 3 to a depth not less than a preset depth; the other end of the first air inlet pipe 5 passes through the first air outlet and extends into the first space 21 of the first housing 2 to a depth not less than the preset depth, ensuring that the extracted gas is a stable, well-mixed gas source. Similarly, one end of the first air outlet pipe 6 passes through the second air outlet and extends into the second housing 3 to a depth not less than the preset depth; the other end of the first air outlet pipe 6 passes through the first air inlet and extends into the first space 21 of the first housing 2 to a depth not less than the preset depth. The preset depth can be set to 10 cm to ensure that both the inlet and outlet of the pipes are in the core area where the gas mixing is most complete, avoiding the extraction of low-concentration gas at the edges or leaked external air, and ensuring the uniformity of radon concentration within the circulation loop.

[0045] It should be noted that in this gas circulation loop, the radon gas generated in the first chamber 2 is transported to the second chamber 3 through the first outlet pipe 6 to provide a test gas source for the passive radon gas measuring device; the gas in the second chamber 3 flows back to the first chamber 2 through the first inlet pipe 5 to realize the recycling of radon gas, which reduces radon gas loss and avoids excessively high concentration due to continuous gas production, thus reducing the adjustment pressure of the MCU controller 1.

[0046] In some embodiments, the second housing 3 and the active radon gas measuring device 4 form a gas monitoring circuit through the second inlet pipe 7 and the second outlet pipe 8; one end of the second inlet pipe 7 is connected to the inlet end of the active radon gas measuring device 4, and the other end extends into the third outlet position with an insertion depth not less than a preset depth; one end of the second outlet pipe 8 is connected to the outlet end of the active radon gas measuring device 4, and the other end extends into the third inlet position with an insertion depth not less than a preset depth.

[0047] Specifically, one end of the second air inlet pipe 7 is fixedly connected to the air inlet of the active radon gas measuring device 4 via a sealing joint. The connection can be double-sealed using threaded locking and rubber sealing rings to ensure airtightness. The other end passes through the third air outlet of the second housing 3 and extends into the interior of the second housing 3, with an insertion depth not less than a preset depth. One end of the second air outlet pipe 8 is fixedly connected to the air outlet of the active radon gas measuring device 4 via a sealing joint, and the sealing method is the same as that of the second air inlet pipe 7. The other end passes through the third air inlet of the second housing 3 and extends into the interior of the second housing 3, with an insertion depth not less than a preset depth, ensuring that the return gas can be evenly integrated into the airflow circulation inside the housing.

[0048] It should be noted that in the gas monitoring loop, the active radon gas measuring device 4 draws the mixed gas in the second chamber 3 through the second inlet pipe 7, measures and outputs the radon concentration data to the MCU controller 1 in real time; the MCU controller 1 can compare the radon concentration data with the preset target concentration. If the radon concentration is too high, the flow rate of the gas pump 51 is reduced (reducing the amount of radon gas delivered from the first chamber 2 to the second chamber 3). If the radon concentration is too low, the flow rate of the gas pump 51 is increased, thereby achieving closed-loop precise control of the radon concentration in the second chamber 3. The gas monitored by the active radon gas measuring device 4 is then returned to the interior of the second chamber 3 through the second outlet pipe 8.

[0049] For easier understanding, please refer to Figure 4 , Figure 4 This is a flowchart illustrating a testing method for a passive radon gas measuring device provided in an embodiment of this application. The testing method for a passive radon gas measuring device is applied to the MCU controller in the testing apparatus for the passive radon gas measuring device, and the method includes, but is not limited to, the following steps: Step S401: Determine the target radon concentration range corresponding to the preset target radon concentration.

[0050] Specifically, a target radon concentration can be set according to the requirements of the calibration scenario to obtain a preset target radon concentration. Common calibration concentrations for passive radon measurement equipment include 100 Bq / m³, 200 Bq / m³, 300 Bq / m³, and 500 Bq / m³, without further specific limitations. Then, a deviation percentage threshold (e.g., ±5%) is determined based on the industry accuracy of active radon measurement equipment and the factory allowable error of passive equipment. Finally, the target radon concentration range is determined based on the preset target radon concentration and the deviation percentage threshold. Alternatively, the target radon concentration range corresponding to the preset target radon concentration can be determined based on the mapping relationship between the preset target radon concentration and the target radon concentration range (e.g., 200-250 Bq / m³), without further specific limitations.

[0051] Step S402: Receive radon concentration data of the second chamber transmitted by the active radon gas measuring device, and adjust the gas pump flow rate value of the gas pump according to the radon concentration data to control the radon concentration in the second chamber to be within the target radon concentration range.

[0052] The specific steps of receiving radon concentration data of the second chamber transmitted by the active radon gas measuring device, and adjusting the gas pump flow rate based on the radon concentration data to control the radon concentration in the second chamber to be within the target radon concentration range include: A1. Within a preset first time period, receive the radon concentration data collected by the active radon gas measuring device in the second chamber to obtain the first radon concentration dataset; A2. If there are no two consecutive radon concentrations in the first radon concentration dataset that are both greater than the preset target radon concentration, then the flow rate of the air pump is maintained at the first air pump flow rate value; otherwise, the flow rate of the air pump is set to the second air pump flow rate value; the second air pump flow rate value is less than the first air pump flow rate value. A3. Within a preset second time period, receive radon concentration data collected by the active radon gas measuring device in the second chamber to obtain a second radon concentration dataset; the start time of the preset second time period is the end time of the preset first time period. A4. If there are no two consecutive radon concentrations in the second radon concentration dataset that are both greater than the preset reference radon concentration, then the flow rate of the air pump is maintained at the second air pump flow rate value; otherwise, the air pump is set to the off state; the preset reference radon concentration is greater than the preset target radon concentration. A5. Within a preset third time period, receive radon concentration data collected by the active radon gas measuring device in the second chamber to obtain a third radon concentration dataset; the start time of the preset third time period is the end time of the preset second time period. A6. If there are no two consecutive radon concentrations in the third radon concentration dataset that are both less than the preset target radon concentration, then the air pump is kept in the off state; otherwise, the air pump is set to the on state and the air pump flow rate is set to the second air pump flow rate value to control the radon concentration in the second chamber to be within the target radon concentration range.

[0053] The active radon gas measurement device includes, but is not limited to, Alphaguard and RAD7 devices, and can be used to perform a periodic calibration system of once a year to ensure the long-term stability of the device's measurement accuracy; no specific limitations are made here. This active radon gas measurement device has a rapid data output capability, and can complete a set of effective radon concentration measurements and output data within 10 minutes.

[0054] In a specific embodiment, within a preset first time period, the MCU controller can receive radon concentration data collected by the active radon gas measuring device from the second chamber at preset time intervals (e.g., every 10 minutes), and integrate them to form a first radon concentration dataset. If there are no two consecutive radon concentrations in the first radon concentration dataset that are both greater than a preset target radon concentration (e.g., 200 Bq / m³), the flow rate of the gas pump is maintained at a first gas pump flow rate value (e.g., 1 m³ / h); otherwise, the flow rate of the gas pump is set to a second gas pump flow rate value (e.g., 0.1 m³ / h), wherein the second gas pump flow rate value is less than the first gas pump flow rate value.

[0055] Next, within a preset second time period, radon concentration data from the second chamber collected by the active radon gas measuring device is received to obtain a second radon concentration dataset. The start time of the preset second time period is the end time of the preset first time period. If there are no two consecutive radon concentrations in the second radon concentration dataset that are both greater than a preset reference radon concentration (e.g., 250 Bq / m³), the air pump flow rate is maintained at the second air pump flow rate value; otherwise, the air pump is set to the off state. The preset reference radon concentration is greater than the preset target radon concentration.

[0056] Then, within a preset third time period, radon concentration data from the second chamber collected by an active radon gas measuring device is received to obtain a third radon concentration dataset. The start time of the preset third time period is the end time of the preset second time period. If there are no two consecutive radon concentrations in the third radon concentration dataset that are both lower than the preset target radon concentration, the air pump remains off; otherwise, the air pump is turned on, and the air pump flow rate is set to the second air pump flow rate value, thereby cyclically controlling the radon concentration in the second chamber to remain within the target radon concentration range.

[0057] It is evident that by setting differentiated radon concentration judgment thresholds and air pump flow parameters in stages, combined with precise radon concentration judgment rules, and gradually adjusting the air pump flow level or start / stop status, a closed-loop control logic is formed. This can quickly bring the radon concentration in the second chamber to the target radon concentration range, while effectively avoiding concentration exceeding the standard or being too low, thus achieving stable and precise control of radon concentration.

[0058] For easier understanding, please refer to Figure 5 , Figure 5This is a schematic diagram of a process for controlling the radon concentration in a second chamber, provided in an embodiment of this application. In the initial stage, the MCU controller controls the gas pump to operate at full speed with a first gas pump flow rate (e.g., 1 m³ / h) to rapidly deliver radon gas to the second chamber, shortening the time to reach the target concentration and quickly adapting to the radon requirements of the second chamber. During this process, an active radon gas measuring device collects a set of radon concentration data every 10 minutes and uploads it to the MCU controller. Then, it is determined whether there are two consecutive radon concentrations in the collected first radon concentration data set that are both greater than the preset target radon concentration. If not, the current first gas pump flow rate is maintained, and radon gas delivery continues; if so, the gas pump flow rate is reduced to the second gas pump flow rate. After switching the air pump flow rate to the second air pump flow rate value, it is determined whether there are two consecutive radon concentrations in the subsequently collected second radon concentration dataset that are both greater than the preset reference radon concentration. If not, the current second air pump flow rate value is maintained, and radon gas delivery continues; if so, the air pump is turned off, and radon gas delivery stops. After turning the air pump off, it is determined whether there are two consecutive radon concentrations in the subsequently collected third radon concentration dataset that are both less than the preset target radon concentration. If not, the air pump remains off; if so, the process returns to the step of "setting the air pump flow rate to the second air pump flow rate value" and restarts the adjustment cycle.

[0059] It is evident that precise control of the gas pump flow or start / stop based on periodic data collection can maintain stable radon concentration, reduce resource waste and energy consumption, and achieve efficient, energy-saving and stable radon supply control.

[0060] Step S403: Verify the m passive radon gas measuring devices to obtain a first verification index and m second verification indexes; each second verification index corresponds to one passive radon gas measuring device.

[0061] For easier understanding, please refer to Figure 6 , Figure 6 This is a schematic flowchart illustrating the verification process of a passive radon gas measuring device according to an embodiment of this application. The specific steps of verifying the m passive radon gas measuring devices to obtain a first verification index and m second verification indices include: B1. Obtain the measurement value of each of the m passive radon gas measuring devices for a preset time, and obtain m measurement values; B2. Calculate the coefficient of variation for the m measured values ​​according to the preset first formula; B3. Use the coefficient of variation as the first verification index; B4. Receive the radon concentration data collected by the active radon gas measuring device at the preset time to obtain the fourth radon concentration dataset; B5. The average value of all radon concentrations in the fourth radon concentration dataset is taken as the agreed truth value; B6. Based on the preset second formula and the agreed true value, calculate each of the m measured values ​​to obtain m error rates; B7. Use the m error rates as the m second verification indicators.

[0062] In a specific embodiment, firstly, m passive radon gas measuring devices are continuously placed in the radon concentration environment of the second chamber for a preset time (e.g., 96 hours, to accommodate the cumulative measurement characteristics of the passive radon gas measuring devices). Then, the final measurement result of each passive radon gas measuring device is read, resulting in m measurement values. Next, the m measurement values ​​are calculated according to a preset first formula to obtain the coefficient of variation. The coefficient of variation is then used as the first verification index. The preset first formula is as follows:

[0063] in, Indicates the coefficient of variation; This represents the standard deviation of m measurements. This represents the arithmetic mean of m measurements. Then, radon concentration data collected by the active radon gas measuring device over a preset time period is received to obtain the fourth radon concentration dataset. The average value of all radon concentrations in the fourth radon concentration dataset is then calculated to obtain the agreed-upon true value. Next, based on the preset second formula and the agreed-upon true value, m error rates are calculated for each of the m measured values. Finally, the m error rates are used as m second verification indicators. The preset second formula is as follows:

[0064] in, Represents the m-th error rate Error rate; Represents the m-th measurement value One measurement value; This indicates the agreed-upon truth value.

[0065] Step S404: If the first verification index meets the preset first condition, then obtain the second verification index that meets the preset second condition from the m second verification indices to obtain n second verification indices; n is a natural number.

[0066] Specifically, first, determine whether the first verification indicator (i.e., coefficient of variation) meets a preset first condition. When m is 5, this preset first condition can be a coefficient of variation less than or equal to 15%, without specific limitations. If the first verification indicator meets the preset first condition, then determine whether there is a second verification indicator among the m second verification indicators that meets the preset second condition. This preset second condition can be that the second verification indicator is within 0 ± 25%, without specific limitations. Then, obtain the second verification indicators among the m second verification indicators that meet the preset second condition, resulting in n second verification indicators.

[0067] Step S405: Determine that the n passive radon gas measuring devices corresponding to the n second verification indicators among the m passive radon gas measuring devices have passed the verification.

[0068] Specifically, from m passive radon gas measuring devices, n passive radon gas measuring devices corresponding to the second verification index are selected (i.e., n passive radon gas measuring devices with acceptable error rates), and it is determined that the n passive radon gas measuring devices have passed the verification and can directly enter the subsequent packaging and shipping process.

[0069] For easier understanding, please refer to Figure 7 , Figure 7 This is a schematic diagram of an automated monitoring process for the drying environment of a first chamber provided in an embodiment of this application, wherein the method further includes the following steps: C1. Receive the temperature and humidity data of the first enclosure transmitted by the temperature and humidity meter; the temperature and humidity data includes multiple temperatures and multiple humidity levels; C2. Determine the average values ​​of the plurality of temperatures and the plurality of humidity levels respectively to obtain the average temperature and average humidity values; C3. Determine the reference humidity corresponding to the average temperature; C4. If the average humidity is greater than the reference humidity, a first prompt signal is generated; the first prompt signal is used to prompt the replacement of the desiccant to ensure that the passive radon gas measuring device is in a dry environment.

[0070] In a specific embodiment, firstly, the MCU controller receives real-time temperature and humidity data from a temperature and humidity meter at a preset frequency (e.g., every 5 minutes) inside the first chamber via serial communication, obtaining multiple temperatures and multiple humidity levels. Then, the average values ​​of the multiple temperatures and multiple humidity levels are calculated to obtain the average temperature and average humidity. Next, based on a preset mapping relationship between temperature and reference humidity, the reference humidity corresponding to the average temperature is determined; this reference humidity is the maximum permissible relative humidity at that average temperature. It should be noted that a preset threshold can also be used as the reference humidity for subsequent determination of whether the desiccant needs to be replaced; this is not specifically limited here. If the average humidity is greater than the reference humidity, a first prompt signal is generated to prompt for desiccant replacement, ensuring the first chamber remains dry and thus ensuring the passive radon gas measuring device is in a dry environment.

[0071] As can be seen, the MCU controller automatically collects the temperature and humidity of the first chamber and takes the average value. Combined with the temperature, it matches the maximum allowable humidity. When the humidity exceeds the standard, it prompts to replace the desiccant, ensuring that the calibration environment of the passive measuring equipment is dry and thus ensuring the reliability of the calibration results.

[0072] For easier understanding, please refer to Figure 8 , Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device includes one or more processors, a memory, a communication interface, and one or more programs. The processor is communicatively connected to the memory and the communication interface via an internal communication bus. The electronic device may include more or fewer structural elements than shown in the block diagram above, such as a power module, physical buttons, a Wi-Fi module, a speaker, a Bluetooth module, a sensor, and a display module, etc., without limitation herein. It is understood that this electronic device can be used to perform the testing method for a passive radon gas measuring device.

[0073] This application also provides a computer-readable storage medium storing a computer program for electronic data interchange, which causes a computer to perform some or all of the steps of any of the methods described in the above method embodiments, wherein the computer includes an electronic device.

[0074] It should be noted that, for the sake of simplicity, the above embodiments are all described as a series of actions. Those skilled in the art should understand that this application is not limited to the described order of actions, as some steps in the embodiments of this application can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions, steps, modules, or units involved are not necessarily essential to the embodiments of this application.

[0075] In the above embodiments, the descriptions of each embodiment in this application have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0076] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

[0077] The steps of the methods or algorithms described in the embodiments of this application can be implemented in hardware or by a processor executing software instructions. The software instructions can consist of corresponding software modules, which can be stored in RAM, flash memory, ROM, EPROM, electrically erasable programmable read-only memory (EEPROM), registers, hard disk, portable hard disk, read-only optical disk (CD-ROM), or any other form of storage medium well known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and storage medium can reside in an ASIC. Furthermore, the ASIC can reside in a terminal device or management device. Alternatively, the processor and storage medium can exist as discrete components in the terminal device or management device.

[0078] Those skilled in the art will recognize that, in one or more of the examples above, the functions described in the embodiments of this application can be implemented, in whole or in part, by software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital video discs (DVDs)), or semiconductor media (e.g., solid-state disks (SSDs)).

[0079] The modules / units included in the various devices and products described in the above embodiments can be software modules / units, hardware modules / units, or a combination of both. For example, for devices and products applied to or integrated into a chip, all modules / units can be implemented using hardware methods such as circuits, or at least some modules / units can be implemented using software programs that run on a processor integrated within the chip, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits. For devices and products applied to or integrated into a chip module, all modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components of the chip module, or at least some modules / units can be implemented using hardware methods such as circuits. The implementation is achieved through a software program that runs on the processor integrated within the chip module. The remaining modules / units (if any) can be implemented using hardware methods such as circuits. For various devices and products applied to or integrated into terminal equipment, each of their modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components within the terminal equipment. Alternatively, at least some modules / units can be implemented through a software program that runs on the processor integrated within the terminal equipment, while the remaining modules / units (if any) can be implemented using hardware methods such as circuits.

[0080] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above descriptions are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A testing device for a passive radon measurement apparatus, characterized in that, The device comprises an MCU controller, a first box, a second box, an active radon measuring device, the second box and the first box are connected through a first air inlet pipe and a first air outlet pipe, the second box and the active radon measuring device are connected through a second air inlet pipe and a second air outlet pipe; wherein, the first box is provided with a temperature and humidity meter, the first air inlet pipe is provided with an air pump, the flow rate of the air pump is set as a first air pump flow rate value; the MCU controller is in communication connection with the temperature and humidity meter, the active radon measuring device and the air pump respectively, wherein: The first box is a radon generating box, and a first space, a second space and a third space are sequentially arranged in the first box from top to bottom along a vertical direction, the first space is a first gas circulation space, and the temperature and humidity meter and a plurality of fans are arranged in the first space, and a is an even number greater than or equal to 4; the second space is a desiccant placement position, and is used for placing a desiccant to keep the first box dry; the third space is a granite placement position, and is used for placing granite to generate radon; The second box is a device to be measured placement box, and a fourth space and a fifth space are sequentially arranged in the second box from top to bottom along a vertical direction, the fourth space comprises m layers of device to be measured placement positions, and m passive radon measuring devices are placed in the device to be measured placement positions, each device to be measured placement position corresponds to one passive radon measuring device, and m is an integer greater than or equal to 2; the fifth space is a second gas circulation space, and b fans are arranged in the fifth space, and b is an even number greater than or equal to 6.

2. The apparatus of claim 1, wherein, The first box and the second box form a gas circulation loop through the first air inlet pipe and the first air outlet pipe; A first air inlet position and a first air outlet position are arranged on the top of the first box; a second air inlet position, a second air outlet position, a third air inlet position and a third air outlet position are arranged on the top of the second box; One end of the first air inlet pipe is inserted into the second air inlet position and the insertion depth is not less than a preset depth, and the other end is inserted into the first air outlet position and the insertion depth is not less than the preset depth; One end of the first air outlet pipe is inserted into the second air outlet position and the insertion depth is not less than the preset depth, and the other end is inserted into the first air inlet position and the insertion depth is not less than the preset depth.

3. The apparatus of claim 2, wherein, The second box and the active radon measuring device form a gas monitoring loop through the second air inlet pipe and the second air outlet pipe; One end of the second air inlet pipe is connected with an air inlet end of the active radon measuring device, and the other end is inserted into the third air outlet position and the insertion depth is not less than the preset depth; One end of the second air outlet pipe is connected with an air outlet end of the active radon measuring device, and the other end is inserted into the third air inlet position and the insertion depth is not less than the preset depth.

4. The apparatus of claim 1, wherein, The volume of the third space is greater than or equal to twice the sum of the volumes of the first space and the second space.

5. A method of testing a passive radon measurement device, characterized by, The MCU controller applied to the device of any one of claims 1-4, the method comprises: determining a target radon concentration range corresponding to a preset target radon concentration; receive the radon concentration data of the second box transmitted by the active radon measurement device, and adjust the gas pump flow value of the gas pump according to the radon concentration data, so as to control the radon concentration in the second box to be within the target radon concentration range; verify the m passive radon measurement devices to obtain a first verification index and m second verification indexes; each second verification index corresponds to a passive radon measurement device; if the first verification index meets a preset first condition, obtain a second verification index that meets a preset second condition from the m second verification indexes to obtain n second verification indexes; n is a natural number; determine that the n passive radon measurement devices corresponding to the n second verification indexes in the m passive radon measurement devices pass the verification.

6. The method of claim 5, wherein, The receiving the radon concentration data of the second box transmitted by the active radon measurement device, and adjusting the gas pump flow value of the gas pump according to the radon concentration data, so as to control the radon concentration in the second box to be within the target radon concentration range, comprises: within a preset first time period, receive the radon concentration data in the second box collected by the active radon measurement device to obtain a first radon concentration data set; if there are no two consecutive radon concentrations greater than the preset target radon concentration in the first radon concentration data set, maintain the flow of the gas pump as the first gas pump flow value; otherwise, set the flow of the gas pump as a second gas pump flow value; the second gas pump flow value is less than the first gas pump flow value; within a preset second time period, receive the radon concentration data in the second box collected by the active radon measurement device to obtain a second radon concentration data set; the starting time of the preset second time period is the ending time of the preset first time period; if there are no two consecutive radon concentrations greater than a preset reference radon concentration in the second radon concentration data set, maintain the flow of the gas pump as the second gas pump flow value; otherwise, set the gas pump to a closed state; the preset reference radon concentration is greater than the preset target radon concentration; within a preset third time period, receive the radon concentration data in the second box collected by the active radon measurement device to obtain a third radon concentration data set; the starting time of the preset third time period is the ending time of the preset second time period; if there are no two consecutive radon concentrations less than the preset target radon concentration in the third radon concentration data set, maintain the gas pump in the closed state; otherwise, set the gas pump to an open state and set the flow of the gas pump to the second gas pump flow value, so as to control the radon concentration in the second box to be within the target radon concentration range.

7. The method of claim 6, wherein, The verifying the m passive radon measurement devices to obtain a first verification index and m second verification indexes comprises: obtain the measurement value of each passive radon measurement device in the m passive radon measurement devices within a preset time length to obtain m measurement values; calculate the m measurement values according to a preset first formula to obtain a coefficient of variation; take the coefficient of variation as the first verification index; receiving radon concentration data collected by the active radon measurement device in the preset time length, to obtain a fourth radon concentration data set; taking the average of all radon concentrations in the fourth radon concentration data set as a true value; calculating each of the m measurement values according to a preset second formula and the true value, to obtain m error rates; taking the m error rates as the m second check indicators.

8. The method of claim 6 or 7, wherein, The method further comprises: receiving temperature and humidity data of the first box transmitted by the temperature and humidity meter; the temperature and humidity data include multiple temperatures and multiple humidities; determining the average of the multiple temperatures and the multiple humidities respectively, to obtain a temperature average and a humidity average; determining a reference humidity corresponding to the temperature average; if the humidity average is greater than the reference humidity, generating a first prompt signal; the first prompt signal is used to prompt to replace the desiccant, to ensure that the passive radon measurement device is in a dry environment.

9. An electronic device, comprising: comprise: a processor, a memory, a communication interface, and one or more programs; the one or more programs are stored in the memory and configured to be executed by the processor, and the programs include instructions for executing the steps in the method of any one of claims 5-8.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a computer program, and the computer program includes program instructions, which, when executed by a processor, cause the processor to execute the method of any one of claims 5-8.

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