Packaging device with electromagnetic shielding function and forming method thereof

Abstract

The invention relates to a packaging device with an electromagnetic shielding function and a forming method thereof. The packaging device with the electromagnetic shielding function comprises a substrate, the substrate comprises a front face and a back face which are oppositely distributed in the first direction, the substrate comprises a dielectric layer, a wiring layer and an electromagnetic shielding layer, the wiring layer and the electromagnetic shielding layer are located in the dielectric layer, the wiring layer comprises a plurality of signal transmission lines, at least one signal transmission line is a to-be-protected line, and the electromagnetic shielding layer is located in the dielectric layer; the electromagnetic shielding layer comprises at least one first electromagnetic shielding wire, the first electromagnetic shielding wire is located on the outer side of the to-be-protected wire, a first gap is formed between the first electromagnetic shielding wire and the to-be-protected wire, and the first electromagnetic shielding wire is grounded or electrically connected with constant voltage; and the chip is mounted on the front surface of the substrate, and the chip is electrically connected with the signal transmission line. According to the invention, the manufacturing process of the electromagnetic shielding layer is compatible with the manufacturing process of the wiring layer, and targeted independent shielding of a single wire is realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a packaged device with electromagnetic shielding function and a method for forming the same. Background Technology

[0002] In microelectronic systems, signal interference and signal loss are pervasive and far-reaching technical challenges, especially for circuits operating at high frequencies (such as GHz and above). Signal integrity and signal loss directly determine the performance stability, data transmission rate, and power consumption of chips and the entire electronic system, making them core technical specifications that must be carefully considered during chip design, packaging design, and system integration. Currently, the industry commonly uses metal shielding frames or metal shielding covers as the primary means of signal shielding and protection. However, traditional metal shielding structures such as metal shielding frames and covers typically require additional assembly processes after packaging to fix them to the packaging substrate or chip.

[0003] However, traditional metal shielding frames and covers are independent metal shielding structures, requiring separate metal processing techniques for manufacturing, thus increasing component production costs. Furthermore, assembling the metal shielding frame or cover is an additional process step, requiring specialized assembly equipment and precise positioning technology, which not only extends the packaging production cycle but also increases the difficulty of process control and manufacturing costs. In addition, the traditional design approach of metal shielding structures is to provide overall encapsulation and shielding for the entire chip or package module, failing to provide targeted protection for individual signal traces within the package. In modern packaging systems, different signal traces have significantly different functions and sensitivities to interference. For example, high-speed data transmission lines and clock signal lines are extremely sensitive to interference, while ordinary power supply lines or low-speed control signal lines have relatively high tolerance to interference.

[0004] With the development of advanced packaging technology, multiple functional chips and a large number of passive devices are integrated into a single package. The signal routing is intricate and complex, and the interference problems between different chips and between different types of signal lines are more complicated and serious.

[0005] Therefore, how to improve the electromagnetic shielding effect inside the packaged device while achieving targeted electromagnetic shielding of conductive components, simplifying the manufacturing process of the packaged device, and reducing the manufacturing cost of the packaged device are the technical problems that urgently need to be solved. Summary of the Invention

[0006] This invention provides a packaged device with electromagnetic shielding function and a method for forming the same, which improves the electromagnetic shielding effect inside the packaged device, achieves targeted electromagnetic shielding of conductive components, simplifies the manufacturing process of the packaged device, and reduces the manufacturing cost of the packaged device.

[0007] According to some embodiments, the present invention provides a packaging device with electromagnetic shielding function, comprising: A substrate includes a front side and a back side distributed opposite to each other along a first direction. The substrate includes a dielectric layer and a wiring layer and an electromagnetic shielding layer, both located within the dielectric layer. The wiring layer includes multiple signal transmission lines, at least one of which is a line to be protected. The electromagnetic shielding layer includes at least one first electromagnetic shielding line, which is located outside the line to be protected and has a first gap with the line to be protected. The first electromagnetic shielding line is grounded or electrically connected to a constant voltage. The chip is mounted on the front side of the substrate and is electrically connected to the signal transmission line.

[0008] In some embodiments, the electromagnetic shielding layer includes multiple first electromagnetic shielding lines, and the multiple first electromagnetic shielding lines are distributed around the outer periphery of the line to be protected.

[0009] In some embodiments, multiple first electromagnetic shielding wires together completely surround the wire to be protected from the side, and adjacent first electromagnetic shielding wires are connected.

[0010] In some embodiments, the width of the first electromagnetic shielding wire is greater than or equal to the width of the wire to be protected.

[0011] In some embodiments, the cross-section of the first electromagnetic shielding wire is a closed loop, and the wire to be protected is located at the axial position of the closed loop of the first electromagnetic shielding wire.

[0012] In some embodiments, the first electromagnetic shielding line is located only on one side of the line to be protected, and the projection of the first electromagnetic shielding line on the front side of the substrate covers the projection of the line to be protected on the front side of the substrate.

[0013] In some embodiments, the electromagnetic shielding layer includes at least two first electromagnetic shielding lines, and the two first electromagnetic shielding lines are distributed on opposite sides of the line to be protected.

[0014] In some embodiments, the dielectric layer fills the first gap; or... The first gap is an air gap.

[0015] In some embodiments, the material of the first electromagnetic shielding wire is the same as the material of the signal transmission line.

[0016] In some embodiments, the wiring layer further includes a signal input line, at least partially located within the dielectric layer, the signal input line being electrically connected to the input end of the line to be protected; The electromagnetic shielding layer further includes at least one second electromagnetic shielding line, which is located outside the signal input line. There is a second gap between the second electromagnetic shielding line and the signal input line. The second electromagnetic shielding line is grounded or electrically connected to the constant voltage.

[0017] In some embodiments, at least two second electromagnetic shielding lines are distributed on opposite sides of the signal input line along a second direction, the second direction being parallel to the front side of the substrate.

[0018] In some embodiments, a plurality of the second electromagnetic shielding lines are distributed around the outer periphery of the signal input line.

[0019] In some embodiments, the first electromagnetic shielding wire is electrically connected to the second electromagnetic shielding wire; or... The first electromagnetic shielding wire and the second electromagnetic shielding wire are independent of each other.

[0020] In some embodiments, the wiring layer further includes a signal output line, at least partially located within the dielectric layer, and the signal output line is electrically connected to the output terminal of the line to be protected. The electromagnetic shielding layer further includes at least one third electromagnetic shielding line, which is located outside the signal output line. There is a third gap between the third electromagnetic shielding line and the signal output line. The third electromagnetic shielding line is grounded or electrically connected to the constant voltage.

[0021] In some embodiments, at least two of the third electromagnetic shielding lines are distributed along a second direction on opposite sides of the signal output line, the second direction being parallel to the front side of the substrate.

[0022] In some embodiments, multiple third electromagnetic shielding lines are distributed around the outer periphery of the signal output line.

[0023] In some embodiments, a plurality of the chips are arranged at intervals on the front side of the substrate in a direction parallel to the front side of the substrate; The signal input line is electrically connected to one of the plurality of chips, and the signal output line is electrically connected to another of the plurality of chips.

[0024] In some embodiments, the signal input line is electrically connected to the chip, and the signal output line is exposed on the back side of the substrate.

[0025] In some embodiments, the electromagnetic shielding layer includes a plurality of first electromagnetic shielding lines, at least one of the first electromagnetic shielding lines is distributed around the outer periphery of the line to be protected, and the line to be protected is distributed around the outer periphery of at least another first electromagnetic shielding line.

[0026] In some embodiments, the cross-section of the first electromagnetic shielding wire distributed around the outer periphery of the wire to be protected is a closed loop, the cross-section of the wire to be protected is a closed loop, and the first electromagnetic shielding wire distributed around the outer periphery of the wire to be protected is coaxially arranged with the wire to be protected.

[0027] In some embodiments, the first electromagnetic shielding wire surrounded by the wire to be protected is a straight line; or... The cross-section of the first electromagnetic shielding wire, which is surrounded by the wire to be protected, is a closed loop and is coaxial with the wire to be protected.

[0028] In some embodiments, the first electromagnetic shielding wires distributed around the outer periphery of the wire to be protected are electrically connected to the first electromagnetic shielding wires surrounded by the wire to be protected; or... There is a constant potential difference between the first electromagnetic shielding wire distributed around the outer periphery of the wire to be protected and the first electromagnetic shielding wire surrounded by the wire to be protected.

[0029] According to other embodiments, the present invention also provides a method for forming a packaged device with electromagnetic shielding function, comprising the following steps: A substrate is formed, the substrate including a front side and a back side distributed opposite to each other along a first direction, the substrate including a dielectric layer and a wiring layer and an electromagnetic shielding layer both located within the dielectric layer, the wiring layer including a plurality of signal transmission lines, at least one of the signal transmission lines being a line to be protected, the electromagnetic shielding layer including at least one first electromagnetic shielding line, the first electromagnetic shielding line being located outside the line to be protected and having a first gap between it and the line to be protected, the first electromagnetic shielding line being grounded or electrically connected to a constant voltage; The chip is mounted on the front side of the substrate, and the chip is electrically connected to the signal transmission line.

[0030] In some embodiments, the specific steps for forming the substrate include: Provide carrier board; A deposition medium material is deposited on the surface of the carrier plate to form a lower medium layer covering the carrier plate; The dielectric material is deposited on the lower dielectric layer to form an intermediate dielectric layer covering the lower dielectric layer; Multiple first electromagnetic shielding lines and the line to be protected are formed in the intermediate dielectric layer, and the multiple first electromagnetic shielding lines are distributed around the outer periphery of the line to be protected. The dielectric material is deposited on the intermediate dielectric layer to form an upper dielectric layer covering the intermediate dielectric layer, the line to be protected, and the first electromagnetic shielding line, thereby forming the dielectric layer including the lower dielectric layer, the intermediate dielectric layer, and the upper dielectric layer.

[0031] In some embodiments, before depositing the dielectric material on the lower dielectric layer to form an intermediate dielectric layer covering the lower dielectric layer, the method further includes the following steps: A signal output line and a third electromagnetic shield line located at least outside the signal output line are formed in the lower dielectric layer. The third electromagnetic shield line and the signal output line have a third gap. The signal output line is used to electrically connect to the output end of the line to be protected. The third electromagnetic shield line is used to ground or electrically connect to the constant voltage.

[0032] In some embodiments, the specific steps of forming multiple first electromagnetic shielding lines and the lines to be protected in the intermediate dielectric layer include: The intermediate dielectric layer is patterned to form signal line trenches and outer shielding trenches distributed around the outer periphery of the signal line trenches; Metallic material is deposited in the signal line trench and the outer shielding trench. The line to be protected is formed in the signal line trench, and the first electromagnetic shielding line is formed in the outer shielding trench.

[0033] In some embodiments, the width of the outer shielding trench is greater than or equal to the width of the signal line trench.

[0034] In some embodiments, the specific steps of forming multiple first electromagnetic shielding lines and the lines to be protected in the intermediate dielectric layer include: The intermediate dielectric layer is patterned to form an inner shielding trench, signal line trenches distributed around the outer periphery of the inner shielding trench, and an outer shielding trench distributed around the outer periphery of the signal line trench. Metallic material is deposited in the inner shielding trench, the signal line trench, and the outer shielding trench. Simultaneously, a first electromagnetic shielding line is formed in the inner shielding trench, the line to be protected is formed in the signal line trench, and another first electromagnetic shielding line is formed in the outer shielding trench.

[0035] In some embodiments, the outer shielding groove is coaxially arranged with the signal line groove, and the inner shielding groove is located at the axial position of the signal line groove.

[0036] In some embodiments, after forming an upper dielectric layer covering the intermediate dielectric layer, the line to be protected, and the first electromagnetic shielding line, the following steps are further included: A signal input line and a second electromagnetic shield line located at least outside the signal input line are formed in the upper dielectric layer. The second electromagnetic shield line and the signal input line have a second gap. The signal input line is used to electrically connect to the input end of the line to be protected. The second electromagnetic shield line is used to ground or electrically connect to the constant voltage.

[0037] The present invention provides an electromagnetic shielding packaged device and its forming method. By providing a dielectric layer, a wiring layer, and an electromagnetic shielding layer within the dielectric layer on a substrate, the wiring layer includes multiple signal transmission lines, at least one of which is a line to be protected. The electromagnetic shielding layer includes at least one first electromagnetic shielding line, which is located outside the line to be protected and has a first gap with it. The first electromagnetic shielding line is grounded or electrically connected to a constant voltage. This embeds the electromagnetic shielding layer into the substrate, making the manufacturing process of the electromagnetic shielding layer compatible with that of the wiring layer. It eliminates the need for additional metal shielding covers or frames on the package, avoiding extra assembly processes, simplifying the packaging device manufacturing process, and improving the production efficiency of the packaged device.

[0038] Moreover, the manufacturing process of the electromagnetic shielding layer in this invention is compatible with and carried out simultaneously with the manufacturing process of the wiring layer. It can perform electromagnetic shielding on specific lines to be protected, achieving targeted independent shielding for individual traces. This breaks the limitation of traditional processes that can only perform overall shielding, thereby optimizing the transmission quality of specific signal transmission lines, improving the electromagnetic shielding effect within the packaged device, and meeting the refined design requirements of microelectronic systems. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a cross-sectional schematic diagram of a packaging device with electromagnetic shielding function in a specific embodiment of the present invention; Figure 2 This is another cross-sectional schematic diagram of the packaging device with electromagnetic shielding function in a specific embodiment of the present invention; Figure 3 This is a cross-sectional schematic diagram of the substrate in a specific embodiment of the present invention; Figure 4 This is a three-dimensional structural diagram of the first electromagnetic shielding wire and the wire to be protected in a specific embodiment of the present invention; Figure 5 This is a top view of the top of the upper dielectric layer in a specific embodiment of the present invention; Figure 6 This is a cross-sectional schematic diagram of the middle part of the upper dielectric layer in a specific embodiment of the present invention; Figure 7 This is a top view schematic diagram of the intermediate dielectric layer in a specific embodiment of the present invention; Figure 8 This is a cross-sectional schematic diagram of the middle part of the lower dielectric layer in a specific embodiment of the present invention; Figure 9 This is a cross-sectional schematic diagram of the bottom of the lower dielectric layer in a specific embodiment of the present invention; Figure 10 This is a schematic diagram showing another relative positional relationship between the line to be protected and the first electromagnetic shielding line in a specific embodiment of the present invention; Figure 11 This is a schematic diagram showing another relative positional relationship between the line to be protected and the first electromagnetic shielding line in a specific embodiment of the present invention; Figure 12 These are two top views of the line to be protected and the first electromagnetic shielding line in a specific embodiment of the present invention; Figure 13 This is a flowchart illustrating the method for forming a packaged device with electromagnetic shielding function in a specific embodiment of the present invention.

[0041] Explanation of reference numerals in the attached figures 10 substrates 11 wiring layer 12 dielectric layers 14 sealing layers 15 chips 16 pads 17 Adhesive Layer 18 protection lines 30 First electromagnetic shielding wire 31 signal transmission lines 40 signal input line 41 Second electromagnetic shielding wire 50-layer interconnection line 70 signal output line 71 Third Electromagnetic Shielding Line Detailed Implementation The following detailed description, in conjunction with the accompanying drawings, illustrates the specific embodiments of the electromagnetic shielding packaging device and its formation method provided by the present invention.

[0042] This specific embodiment provides a packaging device with electromagnetic shielding function. Figure 1 This is a cross-sectional schematic diagram of a packaging device with electromagnetic shielding function according to a specific embodiment of the present invention. Figure 3 This is a cross-sectional schematic diagram of the substrate in a specific embodiment of the present invention. For example... Figure 1 and Figure 3 As shown, the encapsulated device with electromagnetic shielding function includes: The substrate 10 includes a front side and a back side that are distributed opposite to each other along a first direction D1. The substrate 10 includes a dielectric layer 12 and a wiring layer 11 and an electromagnetic shielding layer, both located within the dielectric layer 12. The wiring layer 11 includes a plurality of signal transmission lines 31, at least one of which is a line to be protected 18. The electromagnetic shielding layer includes at least one first electromagnetic shielding line 30. The first electromagnetic shielding line 30 is located outside the line to be protected 18 and has a first gap with the line to be protected 18. The first electromagnetic shielding line 30 is grounded or electrically connected to a constant voltage. Chip 15 is mounted on the front side of the substrate 10 and is electrically connected to the signal transmission line 31.

[0043] Specifically, the substrate 10 includes a front side and a back side opposite to the front side along the first direction D1, and at least one chip 15 is mounted on the front side of the substrate 10. In one example, the chip 15 includes a functional surface with multiple pads 16, and the chip 15 is mounted on the front side of the substrate 10 with the functional surface facing the substrate 10, i.e., the chip 15 is flip-chip mounted on the substrate 10. In one example, the substrate 10 has a redistribution layer (RDL). The substrate 10 includes the dielectric layer 12 and the wiring layer 11 and the electromagnetic shielding layer located within the dielectric layer 12. The wiring layer 11 is a high-density wiring layer. The wiring layer 11 includes multiple signal transmission lines 31, which are connected to the chip 15 and used to transmit control signals to the chip 15 or to lead signals from the chip 15 to the outside. In one example, the material of the dielectric layer 12 is an insulating dielectric material, such as any one or a combination of two or more of polyimide, photosensitive polyimide, silicon dioxide, silicon carbide nitrogen, and silicon nitride, to electrically isolate the adjacent signal transmission lines 31.

[0044] In this specific embodiment, by providing at least one first electromagnetic shielding line 30 on the outside of the line to be protected 18, electromagnetic shielding of the line to be protected 18 can be achieved through the first electromagnetic shielding line 30, reducing or even avoiding interference from other signal transmission lines 31 (i.e., signal transmission lines 31 other than the line to be protected 18) in the wiring layer 11. This achieves electromagnetic shielding between the line to be protected 18 and other signal transmission lines 31, ensuring the quality and integrity of signal transmission in the line to be protected 18. Moreover, by embedding the electromagnetic shielding layer into the dielectric layer 12 of the substrate 10, the manufacturing process of the electromagnetic shielding layer is compatible with the manufacturing process of the wiring layer. The electromagnetic shielding layer can be manufactured simultaneously with the wiring layer, eliminating the need for additional metal shielding covers or metal shielding frames on the package, avoiding additional manufacturing and assembly processes, simplifying the packaging device manufacturing process, reducing production costs, and improving the production efficiency of the packaging device. Furthermore, the manufacturing process of the electromagnetic shielding layer in this specific embodiment is compatible with and carried out synchronously with the manufacturing process of the wiring layer. This allows for electromagnetic shielding of specific lines 18 to be protected, achieving targeted independent shielding of a single line or any selected number of traces (i.e., the signal transmission lines). This overcomes the limitations of traditional processes that can only perform overall shielding, thereby optimizing the transmission quality of specific signal transmission lines, improving the electromagnetic shielding effect within the packaged device, and meeting the refined design requirements of microelectronic systems. By grounding (GND) or electrically connecting the first electromagnetic shielding line 30 to the constant voltage, a stable potential is used to ensure the electromagnetic shielding effect of the first electromagnetic shielding line 30, preventing the input and output of electromagnetic interference.

[0045] In some embodiments, the electromagnetic shielding layer includes multiple first electromagnetic shielding lines 30, and the multiple first electromagnetic shielding lines 30 are distributed around the outer periphery of the line to be protected 18.

[0046] For example, the electromagnetic shielding layer includes multiple first electromagnetic shielding lines 30, which are distributed around the periphery of the line to be protected 18. This allows for electromagnetic shielding of the line to be protected 18 from multiple directions, preventing signal crosstalk between the line to be protected 18 and other signal transmission lines 31 around it, thereby further improving the signal transmission quality of the line to be protected 18. In one example, the number of first electromagnetic shielding lines 30 distributed around the periphery of the line to be protected 18 and the spacing between adjacent first electromagnetic shielding lines 30 can be set according to the relative positional relationship between the line to be protected 18 and other signal transmission lines 31 in the wiring layer. In this specific embodiment, "multiple" refers to two or more lines.

[0047] In some embodiments, multiple first electromagnetic shielding lines 30 together completely surround the line to be protected 18 from the side, and adjacent first electromagnetic shielding lines 30 are connected.

[0048] For example, the line to be protected 18 extends along the second direction D2 (see...). Figure 1 The second direction D2 is parallel to the front surface of the substrate 10. The electromagnetic shielding layer includes multiple first electromagnetic shielding lines 30 extending along the second direction D2, i.e., multiple first electromagnetic shielding lines 30 are arranged in parallel, and any one of the first electromagnetic shielding lines 30 is parallel to the line to be protected 18. Any two adjacent first electromagnetic shielding lines 30 are in contact with each other, so that multiple first electromagnetic shielding lines 30 together form an electromagnetic shielding cavity. The line to be protected 18 is located in the electromagnetic shielding cavity, thereby providing all-round electromagnetic shielding for the line to be protected 18, and further improving the electromagnetic shielding effect of the line to be protected 18. Figure 3 The diagram shows that the electromagnetic shielding layer includes four first electromagnetic shielding lines 30, and the ends of adjacent first electromagnetic shielding lines 30 are connected in contact, so that the four first electromagnetic shielding lines 30 together enclose an electromagnetic shielding cavity with a rectangular cross-section, and the line to be protected 18 is located inside the electromagnetic shielding cavity.

[0049] In some embodiments, the width of the first electromagnetic shielding wire 30 is greater than or equal to the width of the wire to be protected 18.

[0050] For example, the width of the first electromagnetic shielding line 30 (e.g., the thickness of the first electromagnetic shielding line 30 along the first direction D1 or the width of the first electromagnetic shielding line 30 along the third direction D3) is greater than or equal to the width of the line to be protected 18 (e.g., the thickness of the line to be protected 18 along the first direction D1 or the width of the line to be protected 18 along the third direction D3). This ensures that the projection of the first electromagnetic shielding line 30 on the front surface of the substrate 10 completely covers the projection of the line to be protected 18 on the front surface of the substrate 10, thereby further preventing the line to be protected 18 from interference from other signal transmission lines 31. Moreover, a wider first electromagnetic shielding line 30 increases the overall size of the first electromagnetic shielding line 30. A larger first electromagnetic shielding line 30 increases the absorption and reflection loss of electromagnetic waves, thereby enhancing the electromagnetic shielding effect on high-frequency signals. This further ensures the integrity of signal transmission in the line to be protected 18 and prevents the signal in the line to be protected 18 from interference by high-frequency signals. Furthermore, the wider first electromagnetic shielding line 30 is easier to control in terms of dimensional accuracy, thereby helping to further simplify the manufacturing process of the packaged device with electromagnetic shielding function. The third direction D3 is parallel to the front side of the substrate 10, and the third direction D3 intersects perpendicularly with the second direction D2.

[0051] Figure 4 This is a three-dimensional structural diagram of the first electromagnetic shielding wire and the wire to be protected in a specific embodiment of the present invention. Figure 12 These are two top views illustrating the line to be protected and the first electromagnetic shielding line in specific embodiments of the present invention. In other embodiments, the cross-section of the first electromagnetic shielding line 30 is a closed loop, and the line to be protected 18 is located at the axial position of the closed loop of the first electromagnetic shielding line 30, such as... Figure 4 and Figure 12 As shown in (a) of the diagram. For example, the cross-section of the first electromagnetic shielding wire 30 is a closed loop, thereby forming an electromagnetic shielding cavity within the loop of the first electromagnetic shielding wire 30. The wire to be protected 18 is located within the electromagnetic shielding cavity, thus providing all-around electromagnetic shielding for the wire to be protected 18, further improving the electromagnetic shielding effect of the wire to be protected 18. The wire to be protected 18 is located at the axial position of the closed loop of the first electromagnetic shielding wire 30, so that the first electromagnetic shielding wire 30 is symmetrically distributed around the outer periphery of the wire to be protected 18, which helps to further simplify the manufacturing process of the packaging device with electromagnetic shielding function.

[0052] Figure 10This is a schematic diagram illustrating another relative positional relationship between the line to be protected and the first electromagnetic shielding line in a specific embodiment of the present invention. In some other embodiments, the first electromagnetic shielding line 30 is located only on one side of the line to be protected 18, and the projection of the first electromagnetic shielding line 30 on the front surface of the substrate 10 covers the projection of the line to be protected 18 on the front surface of the substrate 10.

[0053] For example, such as Figure 10 and Figure 12 As shown in (b), the first electromagnetic shielding line 30 is located only on one side of the line to be protected 18, that is, the first electromagnetic shielding line 30 is only provided on one side of the line to be protected 18. The projection of the first electromagnetic shielding line 30 on the front surface of the substrate 10 covers the projection of the line to be protected 18 on the front surface of the substrate 10. Thus, while ensuring the electromagnetic shielding effect of the first electromagnetic shielding line 30 on the line to be protected 18, there is no need to form a ring-shaped electromagnetic shielding structure, which simplifies the manufacturing process of the substrate 10. Moreover, it can also reduce the space occupied by the first electromagnetic shielding line 30 in the substrate 10, and avoid affecting the setting and arrangement of the high-density signal transmission lines 31. At the same time, by only setting one first electromagnetic shielding line 30 on one side of the line to be protected 18, without forming a structure surrounding the line to be protected 18, not only can the parasitic capacitance effect between the first electromagnetic shielding line 30 and the line to be protected 18 be reduced, but short circuits between the first electromagnetic shielding line 30 and the line to be protected 18 can also be avoided.

[0054] Figure 7 This is a top view of the intermediate dielectric layer in a specific embodiment of the present invention. In some other embodiments, the electromagnetic shielding layer includes at least two first electromagnetic shielding lines 30, and the two first electromagnetic shielding lines 30 are distributed on opposite sides of the line to be protected 18.

[0055] In one example, the dielectric layer includes a lower dielectric layer, an intermediate dielectric layer covering the lower dielectric layer, and an upper dielectric layer covering the intermediate dielectric layer. Taking the line to be protected 18 located in the intermediate dielectric layer as an example, the electromagnetic shielding layer includes at least two first electromagnetic shielding lines 30 located in the intermediate dielectric layer, and the two first electromagnetic shielding lines 30 are distributed on opposite sides of the line to be protected 18 (for example, the two first electromagnetic shielding lines 30 are distributed on opposite sides of the line to be protected 18 along the third direction D3). This simplifies the manufacturing process of the substrate 10, reduces the space occupied by the first electromagnetic shielding lines 30 within the substrate 10, further improves the electromagnetic shielding effect of the electromagnetic shielding layer on the line to be protected 18, and effectively avoids short circuits between the first electromagnetic shielding lines 30 and the line to be protected 18.

[0056] In some embodiments, the dielectric layer 12 fills the first gap; or... The first gap is an air gap.

[0057] Specifically, the first electromagnetic shielding line 30, located outside the line to be protected 18 or surrounding the outer periphery of the line to be protected 18, has the first gap with the line to be protected 18. That is, the first electromagnetic shielding line 30 and the line to be protected 18 are not in direct contact, and the first gap is an air gap or is filled with the dielectric layer 12. This can electrically isolate the first electromagnetic shielding line 30 and the line to be protected 18 through the air gap or the dielectric layer 12, avoiding short circuits between the first electromagnetic shielding line 30 and the line to be protected 18, and no additional manufacturing process is required, thereby helping to further improve the manufacturing efficiency of the packaged device with electromagnetic shielding function.

[0058] In some embodiments, the material of the first electromagnetic shielding wire 30 is the same as the material of the signal transmission line 31. In one example, the first electromagnetic shielding wire 30 and the signal transmission line 31 are made of the same material, for example, both are metallic materials (e.g., copper, silver, or aluminum).

[0059] Figure 5 This is a top view of the top of the upper dielectric layer in a specific embodiment of the present invention. In some embodiments, such as... Figure 4 and Figure 5 As shown, the wiring layer also includes a signal input line 40, which is at least partially located within the dielectric layer 12, and the signal input line 40 is electrically connected to the input terminal of the line to be protected 18; The electromagnetic shielding layer further includes at least one second electromagnetic shielding line 41, which is located outside the signal input line 40. The second electromagnetic shielding line 41 has a second gap with the signal input line 40, and the second electromagnetic shielding line 41 is grounded or electrically connected to the constant voltage.

[0060] For example, the dielectric layer includes a lower dielectric layer, an intermediate dielectric layer covering the lower dielectric layer, and an upper dielectric layer covering the intermediate dielectric layer. The line to be protected 18 is located in the intermediate dielectric layer and extends along the second direction D2. The signal input line 40 is located in the upper dielectric layer and extends along the first direction D1. One end of the signal input line 40 is electrically connected to the chip 15, and the other end is electrically connected to the input terminal of the line to be protected 18. See [link to relevant documentation]. Figure 4This allows the signal in the chip 15 to be transmitted to the protected line 18 via the signal input line 40. To ensure the integrity of the signal transmitted from the signal input line 40 to the protected line 18, the electromagnetic shielding layer further includes at least one second electromagnetic shielding line 41 located outside the signal input line 40. The second electromagnetic shielding line 41 is grounded or electrically connected to the constant voltage to shield the signal transmitted via the signal input line 40 from interference by other signals. In one example, the second electromagnetic shielding line 41 is made of the same material as the signal input line 40, such as a metal (e.g., copper, silver, or aluminum). A second gap exists between the second electromagnetic shielding line 41 and the signal input line 40, meaning the second electromagnetic shielding line 41 does not directly contact the signal input line 40 to avoid a short circuit between them. In one example, the second gap is an air gap or is filled with the dielectric layer 12.

[0061] Figure 6 This is a cross-sectional schematic diagram of the middle part of the upper dielectric layer in a specific embodiment of the present invention. In some embodiments, such as... Figure 6 As shown, at least two second electromagnetic shielding lines 41 are distributed along a second direction D2 on opposite sides of the signal input line 40, and the second direction D2 is parallel to the front side of the substrate 10.

[0062] In some embodiments, a plurality of second electromagnetic shielding lines 41 are distributed around the outer periphery of the signal input line 40.

[0063] For example, the signal input line 40 extends along the first direction D1. The signal input line 40 may have only one second electromagnetic shielding line 41 on its outer side, or only two second electromagnetic shielding lines 41 may be distributed along the second direction D2 on opposite sides of the signal input line 41, or multiple second electromagnetic shielding lines 41 may be distributed around the outer periphery of the signal input line 40, or second electromagnetic shielding lines 41 with a closed loop cross-section may be distributed around the outer periphery of the signal input line 40. This multi-directional electromagnetic shielding of the signal input line 40 further ensures the integrity of the signals transmitted by the signal input line 40 and the protected line 18. In one example, the wiring layer includes multiple layers of signal transmission lines 31 arranged along the first direction D1, and the signal transmission lines 31 arranged along the first direction D1 are electrically connected through interlayer interconnects 50.

[0064] In one example, multiple second electromagnetic shielding lines 41 or second electromagnetic shielding lines 41 with a closed loop cross-section completely wrap around the entire outer wall of the signal input line 41, thereby shielding the signal input line 41 from electromagnetic interference from the signal transmission line 31 in multiple directions around the signal input line 41, so as to maximize the electromagnetic shielding of the signal input line 41.

[0065] In some embodiments, the first electromagnetic shielding wire 30 is electrically connected to the second electromagnetic shielding wire 41; or... The first electromagnetic shielding line 30 and the second electromagnetic shielding line 41 are independent of each other.

[0066] In one example, the second electromagnetic shielding line 41 is located above the first electromagnetic shielding line 30 along the first direction D1, so that the first electromagnetic shielding line 30 and the second electromagnetic shielding line 41 can be electrically connected through the upper through-hole interconnect line, so that the first electromagnetic shielding line 30 and the second electromagnetic shielding line 41 are simultaneously grounded or electrically connected to the constant voltage, thereby simplifying the wiring arrangement in the substrate 10.

[0067] In another example, the first electromagnetic shielding line 30 and the second electromagnetic shielding line 41 are independent of each other, that is, the first electromagnetic shielding line 30 and the second electromagnetic shielding line 41 are not connected to each other, so as to flexibly control the potential of the first electromagnetic shielding line 30 and the second electromagnetic shielding line 41 respectively.

[0068] Figure 8 This is a cross-sectional schematic diagram of the middle part of the lower dielectric layer in a specific embodiment of the present invention. Figure 9 This is a cross-sectional schematic diagram of the bottom of the lower dielectric layer in a specific embodiment of the present invention. In some embodiments, such as... Figure 8 and Figure 9 As shown, the wiring layer also includes a signal output line 70, which is at least partially located within the dielectric layer 12, and the signal output line 70 is electrically connected to the output terminal of the line to be protected 18. The electromagnetic shielding layer further includes at least one third electromagnetic shielding line 71, which is located outside the signal output line 70. The third electromagnetic shielding line 71 and the signal output line 70 have a third gap. The third electromagnetic shielding line 71 is grounded or electrically connected to the constant voltage.

[0069] For example, the dielectric layer includes a lower dielectric layer, an intermediate dielectric layer covering the lower dielectric layer, and an upper dielectric layer covering the intermediate dielectric layer. The line to be protected 18 is located in the intermediate dielectric layer and extends along the second direction D2. The signal output line 70 is located within the lower dielectric layer and extends along the first direction D1. The signal output line 70 is electrically connected to the output terminal of the line to be protected 18, thereby enabling it to receive the signal transmitted by the line to be protected 18. To ensure the integrity of the signal transmitted by the signal output line 70, the electromagnetic shielding layer further includes at least one third electromagnetic shielding line 71 located outside the signal output line 70. The third electromagnetic shielding line 71 is grounded or electrically connected to the constant voltage to shield the signal transmitted by the signal output line 70 from interference by other signals. In one example, the third electromagnetic shielding line 71 and the signal output line 70 are made of the same material, such as metal (e.g., copper, silver, or aluminum). A third gap exists between the third electromagnetic shielding line 71 and the signal output line 70 to prevent a short circuit between them. In one example, the third gap is an air gap or is filled with the dielectric layer 12.

[0070] In some embodiments, at least two of the third electromagnetic shielding lines 71 are distributed along a second direction D2 on opposite sides of the signal output line 70, the second direction D2 being parallel to the front side of the substrate 10.

[0071] In some embodiments, a plurality of the third electromagnetic shielding lines 71 are distributed around the outer periphery of the signal output line 70.

[0072] For example, the signal output line 70 extends along the first direction D1. The signal output line 70 may have only one third electromagnetic shielding line 71 on its outer side, or only two third electromagnetic shielding lines 71 may be distributed along the second direction D2 on opposite sides of the signal output line 70, or multiple third electromagnetic shielding lines 71 may be distributed around the outer periphery of the signal output line 70, or third electromagnetic shielding lines 71 with a closed loop cross-section may be distributed around the outer periphery of the signal output line 70. This multi-directional electromagnetic shielding can further ensure the integrity of the signal transmitted by the signal output line 70.

[0073] In one example, multiple third electromagnetic shielding lines 71 or third electromagnetic shielding lines 71 with a closed loop cross-section completely wrap around the entire outer wall of the signal output line 70, thereby shielding the signal output line 70 from electromagnetic interference from the signal transmission lines 31 in multiple directions around the signal output line 70, so as to maximize the electromagnetic shielding of the signal output line 70.

[0074] In some embodiments, the first electromagnetic shielding wire 30 is electrically connected to the third electromagnetic shielding wire 71; or... The first electromagnetic shielding line 30 and the third electromagnetic shielding line 71 are independent of each other.

[0075] In one example, the third electromagnetic shielding line 71 is located above or below the first electromagnetic shielding line 30 along the first direction D1, so that the first electromagnetic shielding line 30 and the third electromagnetic shielding line 71 can be electrically connected through the upper through-hole interconnect or the lower through-hole interconnect, so that the first electromagnetic shielding line 30 and the third electromagnetic shielding line 71 are simultaneously grounded or electrically connected to the constant voltage, thereby simplifying the wiring arrangement in the substrate 10.

[0076] In another example, the first electromagnetic shielding line 30 and the third electromagnetic shielding line 71 are independent of each other, that is, the first electromagnetic shielding line 30 and the third electromagnetic shielding line 71 are not connected to each other, so as to flexibly control the potential of the first electromagnetic shielding line 30 and the third electromagnetic shielding line 71 respectively.

[0077] In some embodiments, a plurality of the chips 15 are arranged at intervals on the front side of the substrate 10 along a direction parallel to the front side of the substrate 10; The signal input line 40 is electrically connected to one of the plurality of chips 15, and the signal output line 70 is electrically connected to another of the plurality of chips 15.

[0078] For example, such as Figure 1As shown, a plurality of chips 15 are mounted on the front side of the substrate 10 at intervals along the second direction D2. Each chip 15 has a plurality of pads 16 on its surface facing the substrate 10, and an adhesive layer 17 is filled between the chip 15 and the substrate 10 to enhance the connection strength between the chip 15 and the substrate 10. The front side of the substrate 10 also has a molding layer 14 that continuously encapsulates the plurality of chips 15. One of the plurality of chips 15 is used as an output chip, and another of the plurality of chips 15 is used as an input chip. One end of the signal input line 40 is electrically connected to a pad 16 on the output chip, and the other end is electrically connected to the input end of the line to be protected 18. One end of the signal output line 70 is electrically connected to the output end of the line to be protected 18, and the other end is electrically connected to a pad 16 on the input chip. By setting the first electromagnetic shielding line 30 on the outside of the line to be protected 18, the second electromagnetic shielding line 41 on the outside of the signal input line 40, and the third electromagnetic shielding line 71 on the outside of the signal output line 70, pin-to-pin electromagnetic shielding is achieved, which can ensure the integrity of signal transmission and maintain the flexibility of wiring design.

[0079] In some embodiments, the adhesive layer 17 may be made of polyimide, epoxy resin, acrylic resin, phenolic resin, benzocyclobutene (BCB), polybenzoxazole (PBO), or any other suitable polymer dielectric material.

[0080] Figure 2 This is another cross-sectional schematic diagram of a packaged device with electromagnetic shielding function in a specific embodiment of the present invention. In some other embodiments, the signal input line 40 is electrically connected to the chip 15, and the signal output line 70 is exposed on the back side of the substrate 10.

[0081] For example, such as Figure 2As shown, a plurality of chips 15 are mounted on the front side of the substrate 10 at intervals along the second direction D2. Each chip 15 has a plurality of pads 16 on its surface facing the substrate 10, and an adhesive layer 17 is filled between the chip 15 and the substrate 10 to enhance the connection strength between the chip 15 and the substrate 10. The front side of the substrate 10 also has a molding layer 14 that continuously encapsulates the plurality of chips 15. One of the plurality of chips 15 is used as an output chip, and another of the plurality of chips 15 is used as an input chip. In one example, one end of the signal input line 40 is electrically connected to one of the pads 16 on the output chip, and the other end is electrically connected to the input end of the line to be protected 18. One end of the signal output line 70 is electrically connected to the output end of the line to be protected 18, and the other end is exposed on the back side of the substrate 10, so that the signal output line 70 can be electrically connected to the conductive bumps or lead-out solder balls on the back side of the substrate 10. By setting the first electromagnetic shielding line 30 on the outside of the line to be protected 18, the second electromagnetic shielding line 41 on the outside of the signal input line 40, and the third electromagnetic shielding line 71 on the outside of the signal output line 70, electromagnetic shielding from the chip to the substrate or other signal transmission interface is achieved, which can ensure the integrity of signal transmission and maintain the flexibility of the routing design.

[0082] Figure 11 This is a schematic diagram illustrating the relative positional relationship between the wire to be protected and the first electromagnetic shielding wire in a specific embodiment of the present invention. In some embodiments, such as Figure 11 As shown, the electromagnetic shielding layer includes multiple first electromagnetic shielding lines 30, at least one first electromagnetic shielding line 30 is distributed around the outer periphery of the line to be protected 18, and the line to be protected 18 is distributed around the outer periphery of at least another first electromagnetic shielding line 30.

[0083] For example, such as Figure 11As shown, at least one first electromagnetic shielding wire 30 is distributed around the outer periphery of the line to be protected 18, and the line to be protected 18 is distributed around the outer periphery of at least another first electromagnetic shielding wire 30, thereby forming a triaxial structure (or sandwich structure) electromagnetic shielding layer. This allows the line to be protected 18 to be sandwiched between the two first electromagnetic shielding wires 30, creating a double electromagnetic shielding effect, which further enhances the suppression of electromagnetic interference, especially for high-frequency and strong interference signals. The first electromagnetic shielding wire 30 distributed around the outer periphery of the line to be protected 18 serves as the outer electromagnetic shielding wire, and the first electromagnetic shielding wire 30 around the line to be protected 18 serves as the inner electromagnetic shielding wire. The dielectric layer 12 fills the space between the outer electromagnetic shielding wire and the line to be protected 18 to prevent short circuits between them. The dielectric layer 12 also fills the space between the inner electromagnetic shielding wire and the line to be protected 18 to prevent short circuits between them.

[0084] To further enhance the electromagnetic shielding effect, in some embodiments, the cross-section of the first electromagnetic shielding wire 30 distributed around the outer periphery of the line to be protected 18 is a closed loop, the cross-section of the line to be protected 18 is a closed loop, and the first electromagnetic shielding wire 30 distributed around the outer periphery of the line to be protected 18 is coaxially arranged with the line to be protected 18.

[0085] In some embodiments, the first electromagnetic shielding wire 30 surrounded by the wire to be protected 18 is straight; or... The cross-section of the first electromagnetic shielding wire 30, which is surrounded by the wire to be protected 18, is a closed loop and is coaxially arranged with the wire to be protected 18.

[0086] In some embodiments, the first electromagnetic shielding wire 30 distributed around the outer periphery of the wire to be protected 18 is electrically connected to the first electromagnetic shielding wire 30 surrounded by the wire to be protected 18; or, There is a constant potential difference between the first electromagnetic shielding wire 30 distributed around the outer periphery of the line to be protected 18 and the first electromagnetic shielding wire 30 surrounded by the line to be protected 18.

[0087] In one example, the first electromagnetic shielding wires 30 distributed around the outer periphery of the line to be protected 18 are electrically connected to the first electromagnetic shielding wires 30 surrounded by the line to be protected 18, so that the first electromagnetic shielding wires 30 in the sandwich structure are all grounded or connected to the same constant voltage, thereby simplifying the wiring structure in the substrate 10.

[0088] In another example, there is a constant potential difference between the first electromagnetic shielding wire 30 distributed around the outer periphery of the line to be protected 18 and the first electromagnetic shielding wire 30 surrounded by the line to be protected 18, in order to meet specific electromagnetic interference suppression requirements.

[0089] This specific embodiment also provides a method for forming a packaged device with electromagnetic shielding function. Figure 13 This is a flowchart illustrating the method for forming a packaged device with electromagnetic shielding function according to a specific embodiment of the present invention. The structure of the packaged device with electromagnetic shielding function formed in this specific embodiment can be found in [reference needed]. Figures 1-11 .like Figures 1-13 As shown, the method for forming the packaged device with electromagnetic shielding function includes the following steps: Step S111: Forming a substrate 10, the substrate 10 includes a front side and a back side distributed opposite to each other along a first direction D1, the substrate 10 includes a dielectric layer 12 and a wiring layer and an electromagnetic shielding layer both located within the dielectric layer 12, the wiring layer includes a plurality of signal transmission lines 31, at least one of the signal transmission lines 31 being a line to be protected 18, the electromagnetic shielding layer includes at least one first electromagnetic shielding line 30, the first electromagnetic shielding line 30 being located outside the line to be protected 18 and having a first gap between it and the line to be protected 18, the first electromagnetic shielding line 30 being grounded or electrically connected to a constant voltage; Step S112: The chip 15 is mounted onto the front side of the substrate 10, and the chip 15 is electrically connected to the signal transmission line 31.

[0090] In some embodiments, the specific steps for forming the substrate 10 include: Provide carrier board; A deposition medium material is deposited on the surface of the carrier plate to form a lower medium layer covering the carrier plate; The dielectric material is deposited on the lower dielectric layer to form an intermediate dielectric layer covering the lower dielectric layer; Multiple first electromagnetic shielding lines 30 and the line to be protected 18 are formed in the intermediate dielectric layer, and the multiple first electromagnetic shielding lines 30 are distributed around the outer periphery of the line to be protected 18. The dielectric material is deposited on the intermediate dielectric layer to form an upper dielectric layer covering the intermediate dielectric layer, the line to be protected 18, and the first electromagnetic shielding line 30, thereby forming the dielectric layer including the lower dielectric layer, the intermediate dielectric layer, and the upper dielectric layer.

[0091] In some embodiments, before depositing the dielectric material on the lower dielectric layer to form an intermediate dielectric layer covering the lower dielectric layer, the method further includes the following steps: A signal output line 70 and a third electromagnetic shielding line 71 located at least outside the signal output line 70 are formed in the lower dielectric layer. The third electromagnetic shielding line 71 and the signal output line 70 have a third gap. The signal output line 70 is used to electrically connect to the output terminal of the line to be protected 18. The third electromagnetic shielding line 71 is used to ground or electrically connect to the constant voltage.

[0092] In some embodiments, the specific steps of forming multiple first electromagnetic shielding lines 30 and the lines to be protected 18 in the intermediate dielectric layer include: The intermediate dielectric layer is patterned to form signal line trenches and outer shielding trenches distributed around the outer periphery of the signal line trenches; Metallic material is deposited in the signal line trench and the outer shielding trench. The line to be protected 18 is formed in the signal line trench, and the first electromagnetic shielding line 30 is formed in the outer shielding trench.

[0093] In some embodiments, the width of the outer shielding trench is greater than or equal to the width of the signal line trench.

[0094] In some embodiments, the specific steps of forming multiple first electromagnetic shielding lines 30 and the lines to be protected 18 in the intermediate dielectric layer include: The intermediate dielectric layer is patterned to form an inner shielding trench, signal line trenches distributed around the outer periphery of the inner shielding trench, and an outer shielding trench distributed around the outer periphery of the signal line trench. Metallic material is deposited in the inner shielding trench, the signal line trench, and the outer shielding trench. Simultaneously, one first electromagnetic shielding line 30 is formed in the inner shielding trench, the line to be protected 18 is formed in the signal line trench, and another first electromagnetic shielding line 30 is formed in the outer shielding trench. (See also...) Figure 11 .

[0095] Specifically, at least one first electromagnetic shielding wire 30 is distributed around the outer periphery of the line to be protected 18, and the line to be protected 18 is distributed around the outer periphery of at least another first electromagnetic shielding wire 30, thereby forming a triaxial (or sandwich) electromagnetic shielding layer. This allows the line to be protected 18 to be sandwiched between the two first electromagnetic shielding wires 30, creating a double electromagnetic shielding effect, which further enhances the suppression of electromagnetic interference, especially for high-frequency and strong interference signals. The first electromagnetic shielding wire 30 distributed around the outer periphery of the line to be protected 18 serves as the outer electromagnetic shielding wire, and the first electromagnetic shielding wire 30 around the line to be protected 18 serves as the inner electromagnetic shielding wire. The dielectric layer 12 fills the space between the outer electromagnetic shielding wire and the line to be protected 18 to prevent short circuits. The dielectric layer 12 also fills the space between the inner electromagnetic shielding wire and the line to be protected 18 to prevent short circuits.

[0096] To further enhance the electromagnetic shielding effect, in some embodiments, the cross-section of the first electromagnetic shielding wire 30 distributed around the outer periphery of the line to be protected 18 is a closed loop, the cross-section of the line to be protected 18 is a closed loop, and the first electromagnetic shielding wire 30 distributed around the outer periphery of the line to be protected 18 is coaxially arranged with the line to be protected 18.

[0097] In some embodiments, the outer shielding groove is coaxially arranged with the signal line groove, and the inner shielding groove is located at the axial position of the signal line groove.

[0098] In some embodiments, after forming an upper dielectric layer covering the intermediate dielectric layer, the line to be protected, and the first electromagnetic shielding line, the following steps are further included: A signal input line 40 and a second electromagnetic shielding line 41 located at least outside the signal input line 40 are formed in the upper dielectric layer. The second electromagnetic shielding line 41 and the signal input line 40 have a second gap. The signal input line 40 is used to electrically connect to the input end of the line to be protected 18. The second electromagnetic shielding line 41 is used to ground or electrically connect to the constant voltage.

[0099] For example, the formation process of the substrate 10 specifically includes: depositing dielectric materials such as polyimide, photosensitive polyimide, silicon dioxide, silicon carbide nitride, or silicon nitride on the surface of the carrier using a chemical vapor deposition process to form the lower dielectric layer. Next, a signal output line 70 and a third electromagnetic shielding line 71 located at least outside the signal output line 70 are formed in the lower dielectric layer using photolithography, deposition, and electroplating processes. The third electromagnetic shielding line 71 has a third gap with the signal output line 70. The signal output line 70 is used for electrical connection to the output terminal of the line to be protected 18, and the third electromagnetic shielding line 71 is used for grounding or electrical connection to the constant voltage. Afterwards, the dielectric material is deposited on the lower dielectric layer using a chemical vapor deposition process to form the intermediate dielectric layer covering the lower dielectric layer, the signal output line 70, and the third electromagnetic shielding line 71. Next, multiple first electromagnetic shielding lines 30 and the line to be protected 18 are formed in the intermediate dielectric layer using photolithography, deposition, and electroplating processes, with the multiple first electromagnetic shielding lines 30 distributed around the outer periphery of the line to be protected 18. Then, the dielectric material is deposited on the intermediate dielectric layer using chemical vapor deposition to form the upper dielectric layer covering the intermediate dielectric layer, the line to be protected 18, and the first electromagnetic shielding lines 30. The signal input line 40 and the second electromagnetic shielding line 41 located at least outside the signal input line 40 are formed in the upper dielectric layer using photolithography, deposition, and electroplating processes. Afterward, the chip 15 is mounted on the front side of the substrate 10, and a molding layer 14 is formed to encapsulate the chip 15. See [link to documentation]. Figure 1 and Figure 2 .

[0100] In one example, such as Figure 1As shown, a plurality of chips 15 are mounted on the front side of the substrate 10 at intervals along the second direction D2. Each chip 15 has a plurality of pads 16 on its surface facing the substrate 10, and an adhesive layer 17 is filled between the chip 15 and the substrate 10 to enhance the connection strength between the chip 15 and the substrate 10. The front side of the substrate 10 also has a molding layer 14 that continuously encapsulates the plurality of chips 15. One of the plurality of chips 15 is used as an output chip, and another of the plurality of chips 15 is used as an input chip. One end of the signal input line 40 is electrically connected to a pad 16 on the output chip, and the other end is electrically connected to the input end of the line to be protected 18. One end of the signal output line 70 is electrically connected to the output end of the line to be protected 18, and the other end is electrically connected to a pad 16 on the input chip. By setting the first electromagnetic shielding line 30 on the outside of the line to be protected 18, the second electromagnetic shielding line 41 on the outside of the signal input line 40, and the third electromagnetic shielding line 71 on the outside of the signal output line 70, pin-to-pin electromagnetic shielding is achieved, which can ensure the integrity of signal transmission and maintain the flexibility of wiring design.

[0101] In another example, such as Figure 2 As shown, a plurality of chips 15 are mounted on the front side of the substrate 10 at intervals along the second direction D2. Each chip 15 has a plurality of pads 16 on its surface facing the substrate 10, and an adhesive layer 17 is filled between the chip 15 and the substrate 10 to enhance the connection strength between the chip 15 and the substrate 10. The front side of the substrate 10 also has a molding layer 14 that continuously encapsulates the plurality of chips 15. One of the plurality of chips 15 is used as an output chip, and another of the plurality of chips 15 is used as an input chip. In one example, one end of the signal input line 40 is electrically connected to one of the pads 16 on the output chip, and the other end is electrically connected to the input end of the line to be protected 18. One end of the signal output line 70 is electrically connected to the output end of the line to be protected 18, and the other end is exposed on the back side of the substrate 10, so that the signal output line 70 can be electrically connected to the conductive bumps or lead-out solder balls on the back side of the substrate 10. By setting the first electromagnetic shielding line 30 on the outside of the line to be protected 18, the second electromagnetic shielding line 41 on the outside of the signal input line 40, and the third electromagnetic shielding line 71 on the outside of the signal output line 70, electromagnetic shielding from the chip to the substrate or other signal transmission interface is achieved, which can ensure the integrity of signal transmission and maintain the flexibility of the routing design.

[0102] The electromagnetic shielding packaged device and its forming method provided in this specific embodiment embed the electromagnetic shielding layer into the substrate by setting a dielectric layer, a wiring layer and an electromagnetic shielding layer both located within the dielectric layer, wherein the wiring layer includes multiple signal transmission lines, at least one of which is a line to be protected, and the electromagnetic shielding layer includes at least one first electromagnetic shielding line located outside the line to be protected and having a first gap between them. The first electromagnetic shielding line is grounded or electrically connected to a constant voltage, thereby making the manufacturing process of the electromagnetic shielding layer compatible with that of the wiring layer. This eliminates the need for additional metal shielding covers or frames on the package, avoids additional assembly processes, simplifies the manufacturing process of the packaged device, and improves the production efficiency of the packaged device.

[0103] Moreover, in this specific embodiment, the manufacturing process of the electromagnetic shielding layer is compatible with and carried out simultaneously with the manufacturing process of the wiring layer. It can perform electromagnetic shielding on specific lines to be protected, achieving targeted independent shielding for individual traces. This breaks the limitation of traditional processes that can only perform overall shielding, thereby optimizing the transmission quality of specific signal transmission lines, improving the electromagnetic shielding effect within the packaged device, and meeting the refined design requirements of microelectronic systems.

[0104] It should be noted that the terms "comprising" and "having," and their variations, used in this invention document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context; it should be understood that such use of data can be interchanged where appropriate. The term "one or more" depends at least in part on the context and can be used to describe features, structures, or characteristics in a singular sense, or in a plural sense to describe combinations of features, structures, or characteristics. The term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can instead, also at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, embodiments and features in embodiments of this invention can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this invention. In the various embodiments described above, each embodiment focuses on its differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.

[0105] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A packaged device with electromagnetic shielding function, characterized in that, The application relates to a substrate and a chip. The substrate comprises a front surface and a back surface oppositely distributed along a first direction, and comprises a dielectric layer, a wiring layer and an electromagnetic shielding layer, which are all located in the dielectric layer; the wiring layer comprises a plurality of signal transmission lines, at least one of which is a protected line; the electromagnetic shielding layer comprises at least one first electromagnetic shielding line, which is located outside the protected line and has a first gap with the protected line; the first electromagnetic shielding line is connected to ground or a constant voltage. The chip is attached to the front surface of the substrate and is electrically connected to the signal transmission lines.

2. The package device having an electromagnetic shield function according to claim 1, wherein, The electromagnetic shielding layer comprises a plurality of first electromagnetic shielding lines, which are collectively distributed around the outer periphery of the protected line.

3. The package device having an electromagnetic shield function according to claim 2, wherein, The plurality of first electromagnetic shielding lines collectively and completely surround the protected line from the side, and adjacent first electromagnetic shielding lines are connected.

4. The package device having an electromagnetic shield function according to claim 2, wherein, The width of the first electromagnetic shielding line is greater than or equal to the width of the protected line.

5. The package device having an electromagnetic shield function according to claim 1, wherein, The cross section of the first electromagnetic shielding line is a closed ring, and the protected line is located on the axis of the closed ring-shaped first electromagnetic shielding line.

6. The package device having an electromagnetic shield function according to claim 1, wherein, The first electromagnetic shielding line is located on one side of the protected line, and the projection of the first electromagnetic shielding line on the front surface of the substrate covers the projection of the protected line on the front surface of the substrate.

7. The package device having an electromagnetic shield function according to claim 1, wherein The electromagnetic shielding layer comprises at least two first electromagnetic shielding lines, which are distributed on opposite sides of the protected line.

8. The package device having an electromagnetic shield function according to claim 1, wherein, The dielectric layer fills the first gap; or The first gap is an air gap.

9. The package device having an electromagnetic shield function according to Claim 1, wherein The material of the first electromagnetic shielding line is the same as that of the signal transmission line.

10. The package device having an electromagnetic shield function according to claim 2, wherein, The wiring layer further comprises a signal input line, at least part of which is located in the dielectric layer, and the signal input line is electrically connected to the input end of the protected line. The electromagnetic shielding layer further comprises at least one second electromagnetic shielding line, which is located outside the signal input line, and has a second gap with the signal input line; the second electromagnetic shielding line is connected to ground or a constant voltage.

11. The package device having an electromagnetic shield function according to claim 10, wherein, At least two second electromagnetic shielding lines are distributed on opposite sides of the signal input line along a second direction, which is parallel to the front surface of the substrate.

12. The package device having an electromagnetic shield function according to claim 11, wherein, A plurality of second electromagnetic shielding lines are distributed around the outer periphery of the signal input line.

13. The package device having an electromagnetic shield function according to claim 10, wherein, The first electromagnetic shielding line is electrically connected to the second electromagnetic shielding line; or The first electromagnetic shielding line and the second electromagnetic shielding line are independent of each other.

14. The package device having an electromagnetic shield function according to claim 10, wherein, The wiring layer further comprises a signal output line, at least part of which is located in the dielectric layer, and the signal output line is electrically connected to the output end of the protected line. The electromagnetic shielding layer further comprises at least one third electromagnetic shielding line, which is located outside the signal output line, and has a third gap with the signal output line; the third electromagnetic shielding line is connected to ground or a constant voltage.

15. The package device having an electromagnetic shield function according to claim 14, wherein, At least two third electromagnetic shielding lines are distributed on opposite sides of the signal output line along a second direction, which is parallel to the front surface of the substrate.

16. The package device having an electromagnetic shield function according to claim 15, wherein, The third electromagnetic shielding lines are distributed around the outer periphery of the signal output line.

17. The package device having an electromagnetic shield function according to claim 14, wherein, The chips are arranged on the front surface of the substrate in a direction parallel to the front surface of the substrate. The signal input line is electrically connected to one of the chips, and the signal output line is electrically connected to another of the chips.

18. The package device having an electromagnetic shield function according to Claim 17, wherein, The signal input line is electrically connected to the chip, and the signal output line is exposed on the back surface of the substrate.

19. The package device having an electromagnetic shield function according to Claim 1, wherein The electromagnetic shielding layer includes the first electromagnetic shielding lines, at least one of the first electromagnetic shielding lines is distributed around the outer periphery of the to-be-protected line, and the to-be-protected line is distributed around at least one of the first electromagnetic shielding lines.

20. The package device having an electromagnetic shield function according to claim 19, wherein, The cross section of the first electromagnetic shielding line distributed around the outer periphery of the to-be-protected line is a closed loop, the cross section of the to-be-protected line is a closed loop, and the first electromagnetic shielding line distributed around the outer periphery of the to-be-protected line is coaxially arranged with the to-be-protected line.

21. The package device having an electromagnetic shield function according to Claim 20, wherein, The first electromagnetic shielding line surrounded by the to-be-protected line is linear; or, The cross section of the first electromagnetic shielding line surrounded by the to-be-protected line is a closed loop, and the first electromagnetic shielding line surrounded by the to-be-protected line is coaxially arranged with the to-be-protected line.

22. The package device having an electromagnetic shield function according to Claim 19, wherein The first electromagnetic shielding line distributed around the outer periphery of the to-be-protected line is electrically connected to the first electromagnetic shielding line surrounded by the to-be-protected line; or, There is a constant potential difference between the first electromagnetic shielding line distributed around the outer periphery of the to-be-protected line and the first electromagnetic shielding line surrounded by the to-be-protected line.

23. A method of forming a packaged device having electromagnetic shielding functionality, comprising: The method comprises the following steps: forming a substrate, the substrate comprising a front surface and a back surface oppositely distributed along a first direction, the substrate comprising a dielectric layer, a wiring layer and an electromagnetic shielding layer, all located in the dielectric layer, the wiring layer comprising a plurality of signal transmission lines, at least one of the signal transmission lines being a to-be-protected line, the electromagnetic shielding layer comprising at least one first electromagnetic shielding line, the first electromagnetic shielding line being located on the outside of the to-be-protected line and having a first gap with the to-be-protected line, the first electromagnetic shielding line being grounded or electrically connected to a constant voltage; attaching a chip to the front surface of the substrate, and the chip being electrically connected to the signal transmission line.

24. The method for forming a packaged device having an electromagnetic shield function according to claim 23, wherein The specific steps of forming the substrate comprise: providing a carrier plate; depositing a dielectric material on the surface of the carrier plate to form a lower dielectric layer covering the carrier plate; depositing the dielectric material on the lower dielectric layer to form an intermediate dielectric layer covering the lower dielectric layer; forming a plurality of the first electromagnetic shielding lines and the to-be-protected line in the intermediate dielectric layer, and a plurality of the first electromagnetic shielding lines being collectively distributed around the outer periphery of the to-be-protected line; depositing the dielectric material on the intermediate dielectric layer to form an upper dielectric layer covering the intermediate dielectric layer, the to-be-protected line and the first electromagnetic shielding line, so as to form the dielectric layer comprising the lower dielectric layer, the intermediate dielectric layer and the upper dielectric layer.

25. The method for forming a packaged device having an electromagnetic shield function according to claim 24, wherein Before depositing the dielectric material on the lower dielectric layer to form the intermediate dielectric layer covering the lower dielectric layer, the method further comprises the following steps: forming a signal output line and a third electromagnetic shielding line at least located outside the signal output line in the lower dielectric layer, the third electromagnetic shielding line and the signal output line having a third gap therebetween, the signal output line being configured to electrically connect with an output end of the protected line, and the third electromagnetic shielding line being configured to be electrically connected with the constant voltage or grounded.

26. The method for forming a packaged device having an electromagnetic shield function according to claim 24, wherein The specific steps of forming the plurality of first electromagnetic shielding lines and the protected line in the intermediate dielectric layer include: patterning the intermediate dielectric layer to form a signal line trench and an outside shielding line trench distributed around the outer periphery of the signal line trench; depositing a metal material in the signal line trench and the outside shielding line trench to form the protected line in the signal line trench and the first electromagnetic shielding line in the outside shielding line trench.

27. The method for forming a packaged device having an electromagnetic shield function according to claim 26, wherein The width of the outside shielding line trench is greater than or equal to the width of the signal line trench.

28. The method of forming a packaged device with electromagnetic shielding functionality of claim 24, wherein, The specific steps of forming the plurality of first electromagnetic shielding lines and the protected line in the intermediate dielectric layer include: patterning the intermediate dielectric layer to form an inside shielding line trench, a signal line trench distributed around the outer periphery of the inside shielding line trench, and an outside shielding line trench distributed around the outer periphery of the signal line trench; depositing a metal material in the inside shielding line trench, the signal line trench and the outside shielding line trench to form one of the first electromagnetic shielding lines in the inside shielding line trench, the protected line in the signal line trench and the other of the first electromagnetic shielding lines in the outside shielding line trench.

29. The method for forming a packaged device having an electromagnetic shield function according to claim 28, wherein The outside shielding line trench is coaxially arranged with the signal line trench, and the inside shielding line trench is located at the axial position of the signal line trench.

30. The method for forming a packaged device having an electromagnetic shield function according to claim 24, wherein After forming an upper dielectric layer covering the intermediate dielectric layer, the protected line and the first electromagnetic shielding line, the method further includes the following steps: forming a signal input line and a second electromagnetic shielding line at least located outside the signal input line in the upper dielectric layer, the second electromagnetic shielding line and the signal input line having a second gap therebetween, the signal input line being configured to electrically connect with an input end of the protected line, and the second electromagnetic shielding line being configured to be electrically connected with the constant voltage or grounded.

Images