Laser processing device

Abstract

The embodiment of the application provides a kind of laser processing device, it is related to laser processing technical field, for solving the problem that laser processing device is poor in adaptability or cannot process when coping with the processing demand of diversified material, laser processing device includes infrared laser source, blue light laser source, laser source switching module, first optical beam combining element and focusing module, infrared laser source outputs infrared laser, blue light laser source outputs blue light laser, first optical beam combining element is located on the optical path of infrared laser and blue light laser, it is high to infrared laser high reflection, it is high to blue light laser high transmission, to combine infrared laser and blue light laser as coaxial beam;Focusing module is located on the optical path of coaxial beam, to focus coaxial beam to the same focal point;Based on material type intelligent instantaneous switching red blue laser source, cope with the processing demand of diversified material;Also through focusing module and adjusting infrared laser source, make the focal point of red blue laser source coincide, guarantee processing precision.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a laser processing device. BACKGROUND

[0002] The laser processing technology is widely applied to cutting, welding, surface treatment and other processes of metal, non-metal and other materials. At present, the laser processing device is usually configured with a single-wavelength laser source, such as a 1064 nm near-infrared fiber laser. Due to the significant difference in the absorption characteristics of different materials to laser wavelength, the absorption rate of high-reflective metals such as copper and gold, and non-metallic materials such as plastic, glass and ceramic to near-infrared band laser is extremely low, resulting in low processing efficiency and serious energy waste, and it is difficult to achieve effective processing. The above-mentioned materials have high absorption rate to short-wavelength laser (such as 450 nm blue light laser). Therefore, the single-wavelength laser source has obvious limitations in dealing with diversified material processing requirements.

[0003] In order to overcome the problem of insufficient adaptability of the above-mentioned materials, the related technology provides a dedicated laser processing device for different materials, such as infrared laser and blue light laser. However, this scheme has high investment cost, large space occupation, and is extremely inconvenient in the flexible manufacturing scene of multiple materials and small batch.

[0004] Alternatively, the related technology integrates laser sources of different wavelengths on the same laser processing device, and switches between different laser processing heads through a mechanical switching mechanism. However, this scheme needs to repeatedly calibrate the optical path and focal point position during switching, which is tedious, time-consuming, unstable, introduces human error, and is difficult to meet the requirements of processing efficiency and flexibility of automatic production line. SUMMARY

[0005] Embodiments of the present application provide a laser processing device to solve the problem of poor adaptability or inability to process in the related art laser processing device when dealing with diversified material processing requirements.

[0006] Embodiments of the present application provide a laser processing device, which comprises: an infrared laser source, the infrared laser source is used to output infrared laser; a blue light laser source, the blue light laser source is used to output blue light laser; a laser source switching module, the laser source switching module is used to start the corresponding laser source according to the material type of the workpiece to be processed, and turn off the unselected laser source; an optical beam combining element, the optical beam combining element is arranged on the optical path of the infrared laser and the blue light laser, the optical beam combining element is high-reflective to the infrared laser and high-transmissive to the blue light laser, and is used to combine the infrared laser and the blue light laser into a coaxial light beam; a focusing module, the focusing module is arranged on the optical path of the coaxial light beam, and the focusing module is used to focus the coaxial light beam to the same focal point.

[0007] In a possible implementation, the blue laser source comprises a second optical beam combining element; the blue laser light comprises blue laser light of a first wavelength and blue laser light of a second wavelength, the second optical beam combining element is arranged on an optical path of the blue laser light of the first wavelength and the blue laser light of the second wavelength, the second optical beam combining element is high-transmissive to the blue laser light of the first wavelength and high-reflective to the blue laser light of the second wavelength, and is configured to combine the blue laser light of the first wavelength and the blue laser light of the second wavelength into a coaxial blue light beam.

[0008] In a possible implementation, the blue laser source further comprises a first optical reflection element; the first optical reflection element is arranged on an optical path of the blue laser light of the second wavelength, and is configured to reflect the blue laser light of the second wavelength to the second optical beam combining element.

[0009] In a possible implementation, the blue laser source further comprises: a blue chip configured to output two paths of the blue laser light of the first wavelength and two paths of the blue laser light of the second wavelength; a first polarization beam combining element arranged on an optical path of the two paths of the blue laser light of the first wavelength, and configured to perform polarization beam combining on the two paths of the blue laser light of the first wavelength; and a second polarization beam combining element arranged on an optical path of the two paths of the blue laser light of the second wavelength, and configured to perform polarization beam combining on the two paths of the blue laser light of the second wavelength.

[0010] In a possible implementation, the blue laser source further comprises: a second optical reflection element and a third optical reflection element; the second optical reflection element is arranged on an optical path of one of the paths of the blue laser light of the first wavelength, and is configured to reflect the one of the paths of the blue laser light of the first wavelength to the first polarization beam combining element; and the third optical reflection element is arranged on an optical path of one of the paths of the blue laser light of the second wavelength, and is configured to reflect the one of the paths of the blue laser light of the second wavelength to the second polarization beam combining element.

[0011] In a possible implementation, the blue laser source further comprises a support, and the second optical beam combining element, the first optical reflection element, the first polarization beam combining element, the second polarization beam combining element, the second optical reflection element, and the third optical reflection element are fixedly arranged on the support, respectively.

[0012] In a possible implementation, the laser processing device comprises an inner housing; three side walls of the inner housing are detachably connected with the infrared laser source, the blue laser source and the focusing module respectively, the three side walls of the inner housing have a first input end, a second input end and a beam output end respectively, the first input end is in communication with the output port of the infrared laser source, the second input end is in communication with the output port of the blue laser source, and the beam output end is in communication with the beam input end of the focusing module; the optical beam combining element is fixedly arranged in the inner housing.

[0013] In a possible implementation, the laser processing device further comprises an outer housing having a sealed cavity, the infrared laser source, the blue laser source, the first optical beam combining element and the focusing module are arranged in the sealed cavity; a displacement sensing module is arranged on an outer wall of the outer housing, the displacement sensing module is used to measure the distance between the laser processing device and the workpiece to be processed in real time; an axial movement mechanism, the outer housing is movably arranged on the axial movement mechanism, the axial movement mechanism is used to control the movement of the outer housing according to the distance between the laser processing device and the workpiece to be processed, so as to adjust the distance between the laser processing device and the workpiece to be processed.

[0014] In a possible implementation, the laser processing device further comprises an air cooling module; the air cooling module is arranged in the outer housing, the outer housing is provided with a heat dissipation hole, and the air cooling module forms a cooling airflow path when it is running, which flows through the infrared laser source, the blue laser source and the first optical beam combining element and is finally discharged from the heat dissipation hole.

[0015] In a possible implementation, the focusing module is provided with a nozzle; the outer housing is provided with a protective gas interface configured to connect an external gas source, and the outer housing is provided with an internal gas channel extending from the protective gas interface to the nozzle, so that the external gas source can be sprayed from the nozzle through the internal gas channel and cover the processing area of the workpiece to be processed.

[0016] In a possible implementation, the laser processing device further comprises: a fastening shell, the fastening shell comprising a first side wall, a second side wall and a third side wall, the first side wall and the second side wall being opposite along the light path direction of the coaxial light beam, the third side wall intersecting the first side wall and the second side wall respectively, the first side wall and the second side wall being detachably connected with the blue laser source and the focusing module respectively, the head of the infrared laser source extending into the fastening shell from the third side wall, and the inner shell being detachably arranged in the fastening shell; and a locking unit, the locking unit being arranged on the third side wall and sleeved on the outer periphery of the tail of the infrared laser source, the locking unit being used for adjusting the pose of the infrared laser source and / or locking the pose of the infrared laser source.

[0017] In a possible implementation, the laser source switching module comprises: a material identification unit, the material identification unit being used for identifying the material type information of the workpiece to be processed; a parameter matching unit, the parameter matching unit being used for calling corresponding laser source selection parameters according to the material type information; and a laser source control unit, the laser source control unit being used for starting the corresponding laser source and stopping the unselected laser source according to the laser source selection parameters.

[0018] The laser processing device provided by the embodiments has the following effects:

[0019] The infrared laser source and the blue laser source are integrated, and the infrared laser source and the blue laser source are automatically switched according to the material type of the workpiece to be processed through the laser source switching module, so that the intelligent instantaneous switching of the red and blue laser sources based on the material type is realized, the diversified material processing requirements are met, and the one-machine-multiple-use is truly realized.

[0020] The coaxial light beam is formed by the optical beam combining element, and the focal points of the red and blue laser sources are coincided by adjusting the infrared laser source, so that the consistency of the processing precision is ensured and the processing efficiency is improved without recalibrating the light path. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings, which are incorporated into and form a part of the specification, illustrate one embodiment consistent with the present application and, together with the description, serve to explain the principles of the application.

[0022] Figure 1 Structure diagram of the laser processing device provided by the present application Figure 1 ;

[0023] Figure 2 Structure diagram of the laser processing device provided by the present application Figure 2 ;

[0024] Figure 3A schematic diagram of the optical path of blue light laser and infrared laser of the laser processing device provided in the present application is shown in the following figure:

[0025] Figure 4 A schematic diagram of the structure of the laser processing device provided in the present application is shown in the following figure Figure 3 .

[0026] Reference signs:

[0027] 100 - infrared laser source;

[0028] 101 - infrared laser; 110 - workpiece to be processed;

[0029] 200 - blue light laser source;

[0030] 201 - accommodating housing; 202 - blue light laser;

[0031] 2021 - second optical beam combining element; 2022 - first optical reflecting element; 2023 - first polarization beam combining element; 2024 - second polarization beam combining element; 2025 - second optical reflecting element; 2026 - third optical reflecting element;

[0032] 300 - first optical beam combining element;

[0033] 301 - inner housing;

[0034] 400 - focusing module;

[0035] 500 - displacement sensing module;

[0036] 501 - measurement laser;

[0037] 600 - air cooling module;

[0038] 700 - protective gas interface;

[0039] 800 - locking unit;

[0040] 900 - fastening housing.

[0041] The specific embodiments of the present application have been shown in the above figures, and will be described in more detail hereinafter. These figures and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0042] The exemplary embodiments will be described in detail herein with reference to the attached drawings. In the following description, like reference numerals refer to like elements, unless the context clearly dictates otherwise. The following description of exemplary embodiments is not representative of all possible embodiments consistent with the present application. Instead, they are merely examples of apparatuses and methods consistent with some aspects of the present application as detailed in the appended claims.

[0043] To solve the problem that the laser processing device is poor in adaptability or unable to process when dealing with diversified material processing requirements, the related art also proposes to combine multiple wavelengths of lasers, for example, using a fiber combiner or adding a spatial light and fiber transmission path in the optical path.

[0044] However, the above-mentioned beam combination scheme has the problems of complex structure, large optical path loss, low coupling efficiency, beam quality degradation, and insufficient system stability. Moreover, in the processing process, the focal point positions of different wavelengths of lasers are maintained consistent mainly depending on artificial experience or mechanical positioning, which is low in precision and difficult to guarantee consistency, directly affecting the processing quality.

[0045] Embodiments of the present application provide a laser processing device integrating an infrared laser source and a blue laser source, and automatically switching the infrared laser source and the blue laser source according to the material type of a workpiece to be processed through a laser source switching module, realizing intelligent instantaneous switching of the red and blue laser sources based on the material type to cope with diversified material processing requirements. The optical beam combining element and the focusing lens are used to automatically coincide the focal points of the red and blue laser sources, without the need to recalibrate the optical path, thereby guaranteeing the consistency of processing precision and improving the processing efficiency.

[0046] The technical solutions of the present application and how the technical solutions of the present application solve the above-mentioned technical problems will be described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes can not be described again in some embodiments. The embodiments of the present application will be described below with reference to the drawings.

[0047] Reference Figure 1 and Figure 3 The laser processing device provided by the present application comprises an infrared laser source 100, a blue laser source 200, a laser source switching module, a first optical beam combining element 300, and a focusing module 400.

[0048] The infrared laser source 100 is configured to output infrared laser 101, and the wavelength of the infrared laser 101 can be 1064 nm or 1070 nm.

[0049] The blue laser source 200 is configured to output blue laser 202, and the wavelength of the blue laser 202 can be 450 nm.

[0050] The light path of the infrared laser 101 is also different from that of the blue laser 202.

[0051] The first optical beam combining element 300 is arranged on the light path of the infrared laser 101 and the blue laser 202, and the first optical beam combining element 300 is high-reflective to the infrared laser 101 and high-transmissive to the blue laser 202, and is used to combine the infrared laser 101 and the blue laser 202 into a coaxial light beam.

[0052] The coaxial light beam means that the infrared laser 101 and the blue laser 202 share the same central axis, and the central axis is the center line of the light beam propagation; the infrared laser 101 and the blue laser 202 are parallel or coincident with the central axis.

[0053] The focusing module 400 is arranged on the light path of the coaxial light beam, and the focusing module 400 is used to focus the coaxial light beam to the same focal point; the focusing to the same focal point means that the focusing module 400 can change the propagation direction of the light rays in the coaxial light beam, so that the incident parallel light rays are bent inward, thereby converging all the light rays at a point, so that the focal points of the red and blue lasers can be accurately focused to the same point on the surface of the workpiece 110.

[0054] The laser source switching module is used to open the corresponding laser source according to the material type of the workpiece 110, and close the unselected laser source.

[0055] When the material type of the workpiece 110 is a material that absorbs infrared laser well, such as steel, iron or part of plastic, the laser source switching module controls the infrared laser source 100 to be turned on and controls the blue laser source 200 to be turned off, and processes the workpiece 110 with infrared laser. When the material type of the workpiece 110 is a material that absorbs blue laser well, such as copper, gold, aluminum, glass, ceramic or plastic, etc., the laser source switching module controls the blue laser source 200 to be turned on and controls the infrared laser source 100 to be turned off, and processes the workpiece 110 with blue laser.

[0056] Therefore, the laser processing device provided by the embodiment of the present application integrates the infrared laser source 100 and the blue laser source 200, and automatically switches the infrared laser source 100 and the blue laser source 200 according to the material type of the workpiece 110 through the laser source switching module, realizes the intelligent instantaneous switching of the red and blue laser sources based on the material type, meets the diversified material processing requirements, and truly realizes one machine with multiple functions.

[0057] The coaxial light beam is obtained by the first optical beam combining element 300, and the focal points of the red and blue laser sources are coincident by the focusing module 400 and by adjusting the infrared laser source, without the need to recalibrate the light path, thereby ensuring the consistency of the processing precision and improving the processing efficiency.

[0058] Continue to refer toFigure 1 and Figure 3 In the embodiment of the present application, the blue laser source 200 comprises a second optical beam combining element 2021.

[0059] The blue laser 202 comprises a first wavelength blue laser 2031 and a second wavelength blue laser 2032. The second optical beam combining element 2021 is arranged on the optical path of the first wavelength blue laser 2031 and the second wavelength blue laser 2032. The second optical beam combining element 2021 is highly transmissive to the first wavelength blue laser 2031 and highly reflective to the second wavelength blue laser 2032, and is used to combine the first wavelength blue laser 2031 and the second wavelength blue laser 2032 into a coaxial blue light beam.

[0060] Thus, the blue laser source 200 comprises two blue lasers with different wavelengths, which is suitable for various processing scenarios.

[0061] In the embodiment of the present application, the first optical beam combining element 300 and the second optical beam combining element 2021 can be a dichroic mirror. The dichroic mirror can combine or separate the optical paths in a compact space, thereby greatly simplifying the structure of the entire optical system and making it smaller and more stable.

[0062] With reference to Figure 1 and Figure 3 In the embodiment of the present application, the blue laser source 200 further comprises a first optical reflection element 2022.

[0063] The first optical reflection element 2022 is arranged on the optical path of the second wavelength blue laser 2032. The first optical reflection element 2022 is used for adjusting the direction of the light beam and reflecting the second wavelength blue laser 2032 to the second optical beam combining element 2021.

[0064] Meanwhile, the first optical reflection element 2022 provides sufficient adjustment freedom, and can freely guide the light beam to the required incident point of the second optical beam combining element 2021 and incident at a specified angle. The first optical reflection element 2022 can be adjusted by adjusting the handle for slight pitching and yawing adjustment.

[0065] The first optical reflection element 2022 can be a mirror.

[0066] With reference to Figure 1 and Figure 3 In the embodiment of the present application, the blue laser source 200 further comprises a blue chip, a first polarization beam combining element 2023 and a second polarization beam combining element 2024.

[0067] The blue light chip is configured to output two paths of blue light laser beams of a first wavelength 2031 and two paths of blue light laser beams of a second wavelength 2032; the first polarization beam combining element 2023 is arranged on an optical path of the two paths of blue light laser beams of the first wavelength 2031, and is configured to perform polarization beam combining on the two paths of blue light laser beams of the first wavelength 2031; and the second polarization beam combining element 2024 is arranged on an optical path of the two paths of blue light laser beams of the second wavelength 2032, and is configured to perform polarization beam combining on the two paths of blue light laser beams of the second wavelength 2032.

[0068] The first polarization beam combining element 2023 and the second polarization beam combining element 2024 can be polarization beam combining mirrors.

[0069] With reference to the foregoing Figure 1 and Figure 3 In the embodiment, the blue light laser source 200 further includes a second optical reflection element 2025 and a third optical reflection element 2026.

[0070] The second optical reflection element 2025 is arranged on an optical path of one of the two paths of blue light laser beams of the first wavelength 2031, and is configured to adjust the direction of the light beam and reflect the one of the two paths of blue light laser beams of the first wavelength 2031 to the first polarization beam combining element 2023.

[0071] Meanwhile, the second optical reflection element 2025 provides sufficient adjustment freedom, and can freely guide the light beam to a required incident point of the first polarization beam combining element 2023 and incident at a specified angle. The first polarization beam combining element 2023 can be adjusted by a handle to perform slight pitching and yawing adjustment.

[0072] The third optical reflection element 2026 is arranged on an optical path of one of the two paths of blue light laser beams of the second wavelength 2032, and is configured to adjust the direction of the light beam and reflect the one of the two paths of blue light laser beams of the second wavelength 2032 to the second polarization beam combining element 2024.

[0073] Meanwhile, the third optical reflection element 2026 provides sufficient adjustment freedom, and can freely guide the light beam to a required incident point of the second polarization beam combining element 2024 and incident at a specified angle. The second polarization beam combining element 2024 can be adjusted by a handle to perform slight pitching and yawing adjustment.

[0074] The second optical reflection element 2025 and the third optical reflection element 2026 can be mirrors.

[0075] That is, the blue light chip outputs four parallel and parallel blue light lasers, and the wavelength of the blue light laser of each two of the four blue light lasers is the same, and the two blue light lasers of the same wavelength are combined into one after the mirror and the polarization beam combiner; Therefore, two blue light lasers with different wavelengths are obtained; The two blue light lasers with different wavelengths are combined by the mirror and the first dichroic mirror to obtain a blue light coaxial beam, which will pass through the next dichroic mirror.

[0076] With reference to Figure 1 and Figure 3 In the embodiment of the application, the blue light laser source 200 comprises a containing housing 201 and a support.

[0077] The blue light chip, the second optical beam combining element 2021, the first optical reflecting element 2022, the first polarization beam combiner 2023, the second polarization beam combiner 2024, the second optical reflecting element 2025 and the third optical reflecting element 2026 are all arranged in the containing housing 201.

[0078] So that the second optical beam combining element 2021, the first optical reflecting element 2022, the first polarization beam combiner 2023, the second polarization beam combiner 2024, the second optical reflecting element 2025 and the third optical reflecting element 2026 are always in the calibrated spatial position and angle, thereby ensuring the accuracy and stability of the blue light output.

[0079] The support can be a metal support.

[0080] It should be noted that the blue light laser source 200 can be a semiconductor laser pump, and the output is spatial light.

[0081] The focusing module 400 can be a focusing lens group.

[0082] With reference to Figure 1 In the embodiment of the application, the laser processing device further comprises an inner housing 301.

[0083] The three side walls of the inner housing 301 are respectively detachably connected with the infrared laser source 100, the blue light laser source 200 and the focusing module 400, and the first optical beam combining element 300 is fixedly arranged in the inner housing 301; The three side walls of the inner housing 301 respectively have a first input end, a second input end and a beam output end, the first input end and the output port of the infrared laser source 100 are in communication, the second input end and the output port of the blue light laser source 200 are in communication, and the beam output end and the beam input end of the focusing module 400 are in communication.

[0084] The infrared laser 101 enters the inner shell 301 through a first input end, and the blue laser 202 enters the inner shell 301 through a second input end. After being reflected by the first optical beam combining element 300 and being transmitted by the first optical beam combining element 300, the infrared laser 101 and the blue laser 202 are combined into a coaxial light beam. The coaxial light beam enters the focusing module 400 through a light beam output end.

[0085] The first optical beam combining element 300 is fixedly arranged in the inner shell 301, so that the position and angle of the first optical beam combining element 300 are stable. The inner shell 301 is detachably connected, so that the first optical beam combining element 300 can be maintained and replaced later.

[0086] Reference Figure 1 In the embodiment of the application, the laser processing device further comprises an outer shell, a displacement sensing module 500, and an axial movement mechanism.

[0087] The infrared laser source 100, the blue laser source 200, the first optical beam combining element 300, and the focusing module 400 are arranged in the outer shell. The displacement sensing module 500 is arranged on the outer wall of the outer shell. The displacement sensing module 500 is used to measure the distance between the laser processing device and the workpiece 110 in real time.

[0088] The outer shell is movably arranged on the axial movement mechanism. The axial movement mechanism is used to control the outer shell to move in the vertical direction shown in the figure according to the distance between the laser processing device and the workpiece 110, so as to adjust the distance between the laser processing device and the workpiece 110.

[0089] By adjusting the distance between the laser processing device and the workpiece 110 in real time, the focus drift caused by the uneven surface or thermal deformation of the workpiece 110 is eliminated, the consistency of the processing focal length is ensured, and the stability of the processing quality is improved.

[0090] In the embodiment of the application, the displacement sensing module 500 is a laser displacement sensor.

[0091] The laser displacement sensor can non-contact, high-speed, and high-precision measure the displacement, vibration, thickness, and other geometric dimensions of an object by emitting measuring laser 501 to the surface of the workpiece 110 and analyzing the reflected light. The laser displacement sensor can also monitor the actual mechanical displacement generated by the laser processing device when performing fine adjustment in real time, so as to ensure that each adjustment is accurate.

[0092] In the embodiment of the application, the outer shell has a sealed chamber. The infrared laser source 100, the blue laser source 200, the first optical beam combining element 300, and the focusing module 400 are arranged in the sealed chamber.

[0093] The sealed outer shell prevents dust or impurities from entering, avoids pollution and wear of internal components, and thus improves the reliability of long-term operation of the equipment.

[0094] ReferenceFigure 4 In the embodiment of the present application, the laser processing device further comprises an air cooling module 600.

[0095] The air cooling module 600 is arranged in the outer shell, and the outer shell is provided with a heat dissipation hole. When the air cooling module 600 is running, a cooling airflow path is formed, which flows through the infrared laser source 100, the blue laser source 200 and the first optical beam combining element 300 and is finally discharged from the heat dissipation hole.

[0096] The air cooling design simplifies the cooling configuration structure, improves the portability and ease of use of the device, and at the same time, the forced convection cooling can ensure the temperature stability of the infrared laser source 100, the blue laser source 200 and the first optical beam combining element 300, and avoid performance degradation or element aging caused by high temperature.

[0097] Reference Figure 4 In the embodiment of the present application, the air cooling module 600 comprises a fan and a heat conduction member.

[0098] The side wall of the heat conduction member is in thermal contact with the infrared laser source 100, the blue laser source 200 and the inner shell. When the fan is running, a cooling airflow path is formed, which flows through the heat conduction member and is finally discharged from the heat dissipation hole.

[0099] The heat generated by the infrared laser source 100, the blue laser source 200 and the first optical beam combining element 300 is exchanged to the heat conduction member, and the heat conduction member is cooled by the fan, further optimizing the heat dissipation efficiency.

[0100] In the embodiment of the present application, the focusing module 400 is provided with a nozzle; the outer shell is provided with a protective gas interface 700, which is configured to connect an external gas source, and the outer shell is provided with an internal gas channel extending from the protective gas interface 700 to the nozzle, so that the external gas source can be sprayed from the nozzle through the internal gas channel and cover the processing area of the workpiece 110.

[0101] The protective gas interface 700 and the nozzle are integrated, and the protective gas such as air, nitrogen or argon is blown to the processing area of the workpiece 110, which inhibits the slag, smoke and material oxidation, and reduces pollution.

[0102] In the embodiment of the present application, the infrared laser source 100 comprises an infrared pumping unit and a collimation unit.

[0103] The infrared pumping unit is used to output infrared laser 101, and the collimation unit is arranged on the light path of the infrared laser 101 and located between the first optical beam combining element 300 and the infrared pumping unit, and the collimation unit is used to collimate the infrared laser 101.

[0104] The non-collimated infrared laser is divergent, and the light spot will become large rapidly with the increase of the propagation distance, resulting in power reduction; the collimated light beam is almost parallel, and the light spot size will not become large significantly in a very long distance, so that the energy is transmitted highly concentrated, further improving the beam combining efficiency and optical path stability.

[0105] With reference to Figure 1 and Figure 2 In the embodiment of the present application, the laser processing device further comprises a fastening shell 900 and a locking unit 800.

[0106] The fastening shell 900 comprises a first side wall, a second side wall and a third side wall, the first side wall and the second side wall are opposite along the optical path direction of the coaxial light beam, the third side wall intersects with the first side wall and the second side wall respectively, and the first side wall and the second side wall are detachably connected with the blue laser source 200 and the focusing module 400 respectively. The head of the infrared laser source 100 extends into the fastening shell 900 from the third side wall, and the inner shell 301 is detachably arranged in the fastening shell 900, and the inner shell 301 and the infrared laser source 100 are arranged in front and back in the horizontal direction shown in the figure.

[0107] The locking unit 800 is arranged on the third side wall and is sleeved on the outer periphery of the tail of the infrared laser source 100, and the locking unit 800 is used for adjusting the pose of the infrared laser source 100 and / or locking the pose of the infrared laser source 100.

[0108] That is, the infrared laser source 100 is fixed on the fastening shell 900 through the locking unit 800, so as to ensure the optical path precision and stability. The fastening shell 900, the inner shell 301, the blue laser source 200 and the focusing module 400 are detachably connected, so as to facilitate subsequent maintenance and replacement.

[0109] In the embodiment of the present application, the infrared laser source 100 is a fiber collimation input device.

[0110] The fiber collimation input device pre-collimates the infrared laser through the integrated collimation function inside, directly outputs the collimated light, does not need to arrange an additional collimation mirror group, simplifies the optical path structure, reduces the optical path loss and the system volume.

[0111] At the same time, the fiber collimation input device adjusts or locks the pose through the externally arranged locking mechanism, ensures the optical path precision and stability, does not need to arrange an additional locking mechanism, simplifies the system structure and reduces the system volume.

[0112] The fiber collimation input device can be QCS or QCH, that is, a fixed fiber collimator based on gradient refractive index lens. QCS is a standard type and is applied to conventional optical power; QCH is a high-power type and is applied to high optical power.

[0113] In the embodiment of the present application, the laser source switching module comprises a material identification unit, a parameter matching unit and a laser source control unit.

[0114] The material identification unit is configured to identify material type information of the workpiece 110, the parameter matching unit is configured to call corresponding laser source selection parameters according to the material type information, and the laser source control unit is configured to turn on the corresponding laser source according to the laser source selection parameters and turn off the unselected laser source.

[0115] That is, the laser source switching module calls a preset parameter library according to the material type information of the workpiece 110, selects corresponding laser source selection parameters and starts the selected laser source, and outputs a laser beam matched with the material type.

[0116] The laser processing device provided by the present application is manufactured by the following manufacturing method, which comprises the following steps:

[0117] The positions and angles of the second optical beam combining element 2021, the first optical reflecting element 2022, the first polarization beam combining element 2023, the second polarization beam combining element 2024, the second optical reflecting element 2025 and the third optical reflecting element 2026 in the blue laser source 200 are adjusted by the mechanical gripper, so as to achieve the purpose of adjusting the blue laser, so that two blue laser beams with different wavelengths can be focused to the same focal point by the focusing module 400.

[0118] Then, the curing mechanism is used to set a heat-curing material to the second optical beam combining element 2021, the first optical reflecting element 2022, the first polarization beam combining element 2023, the second polarization beam combining element 2024, the second optical reflecting element 2025 and the third optical reflecting element 2026 and heat the heat-curing material, so as to cure the above-mentioned optical elements. The cured optical elements are fixed at the calibrated spatial positions and angles, thereby ensuring the accuracy and stability of the blue light emission.

[0119] The curing mechanism can be a dispensing needle extending into the containing housing 201.

[0120] The heat-curing material can include ultraviolet curing glue, epoxy resin glue or heat-curing glue. The ultraviolet curing glue has fast curing speed and good processability. The epoxy resin glue has high adhesive strength and strong environmental resistance. The heat-curing glue has both convenient operation and high performance.

[0121] In summary, the embodiment of the present application provides a laser processing device, which comprises: an infrared laser source 100, a blue laser source 200, a laser source switching module, a first optical beam combining element 300 and a focusing module 400, the infrared laser source 100 is used to output infrared laser 101, the blue laser source 200 is used to output blue laser 202, the first optical beam combining element 300 is arranged on the light path of the infrared laser 101 and the blue laser 202, the first optical beam combining element 300 is high-reflective to the infrared laser 101 and high-transmissive to the blue laser 202, and is used to combine the infrared laser 101 and the blue laser 202 into a coaxial beam; the focusing module 400 is arranged on the light path of the coaxial beam, and is used to focus the coaxial beam to the same focal point; the laser source switching module is used to open the corresponding laser source according to the material type of the workpiece 110 to be processed, and close the unselected laser source.

[0122] By integrating the infrared laser source 100 and the blue laser source 200, and automatically switching the infrared laser source 100 and the blue laser source 200 through the laser source switching module according to the material type of the workpiece 110 to be processed, the intelligent instantaneous switching of the red-blue laser source based on the material type is realized, the diversified material processing demand is met, and the one-machine multi-use is truly realized.

[0123] Further, the first optical beam combining element 300 is used to combine the red-blue laser source into a coaxial beam, and the focusing module 400 is used to make the focal points of the red-blue laser source coincide by adjusting the infrared laser source 100, so that the consistency of the processing precision is guaranteed, and the processing efficiency is improved.

[0124] Finally, it should be noted that: other embodiments of the present application will be easily thought of by those skilled in the art after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any variations, uses or adaptive changes of the present application, which follow the general principles of the present application and include the common knowledge or conventional technical means in the art which are not disclosed by the present application, and are not limited to the precise structure described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present application is only limited by the appended claims.

Claims

1. A laser processing apparatus characterized by comprising: The application relates to a laser processing device. The laser processing device comprises an infrared laser source, a blue laser source, a first optical beam combining element, a focusing module and an inner housing. The infrared laser source is a fiber collimation input device for outputting infrared laser pre-collimated by an internally integrated collimation function. The blue laser source comprises a blue chip, a first polarization beam combining element, a second polarization beam combining element and a second optical beam combining element. The blue chip is used for outputting two paths of blue laser of a first wavelength and two paths of blue laser of a second wavelength. The first polarization beam combining element is arranged on the light path of the two paths of blue laser of the first wavelength and is used for polarization beam combining of the two paths of blue laser of the first wavelength. The second polarization beam combining element is arranged on the light path of the two paths of blue laser of the second wavelength and is used for polarization beam combining of the two paths of blue laser of the second wavelength. The second optical beam combining element is arranged on the light path of the polarization beam combined blue laser of the first wavelength and the polarization beam combined blue laser of the second wavelength and is used for high transmission of the blue laser of the first wavelength and high reflection of the blue laser of the second wavelength so as to combine the blue laser of the first wavelength and the blue laser of the second wavelength into a coaxial blue light beam. The laser source switching module is used for starting the corresponding laser source according to the material type of a workpiece to be processed and stopping the unselected laser source.

2. The laser processing apparatus according to claim 1, characterized by The first optical beam combining element is arranged on the light path of the infrared laser and the coaxial blue light beam, the first optical beam combining element is used for high reflection of the infrared laser and high transmission of the coaxial blue light beam, and the first optical beam combining element is used for combining the infrared laser and the coaxial blue light beam into a coaxial light beam. The focusing module is arranged on the light path of the coaxial light beam and is used for focusing the coaxial light beam into a same focal point.

3. The laser processing apparatus according to claim 2, characterized by The blue laser source further comprises a first optical reflection element. The first optical reflection element is arranged on the light path of the blue laser of the second wavelength and is used for reflecting the polarization beam combined blue laser of the second wavelength to the second optical beam combining element. The blue laser source further comprises a second optical reflection element and a third optical reflection element.

4. The laser processing apparatus according to claim 3, characterized by The second optical reflection element is arranged on the light path of one of the blue laser of the first wavelength and is used for reflecting the blue laser of the first wavelength to the first polarization beam combining element.

5. The laser processing apparatus according to claim 1, characterized by The third optical reflection element is arranged on the light path of one of the blue laser of the second wavelength and is used for reflecting the blue laser of the second wavelength to the second polarization beam combining element. The blue laser source further comprises a support, and the second optical beam combining element, the first optical reflection element, the first polarization beam combining element, the second polarization beam combining element, the second optical reflection element and the third optical reflection element are fixedly arranged on the support. The laser processing device comprises an inner housing. The three side walls of the inner shell are respectively detachably connected with the infrared laser source, the blue laser source and the focusing module, and the three side walls of the inner shell respectively have a first input end, a second input end and a light beam output end, the first input end is communicated with an output port of the infrared laser source, the second input end is communicated with an output port of the blue laser source, and the light beam output end is communicated with a light beam input end of the focusing module. The first optical beam combining element is fixedly arranged in the inner shell.

6. The laser processing apparatus according to claim 1, characterized by The laser processing device further comprises: An outer shell having a sealed cavity, wherein the infrared laser source, the blue laser source, the first optical beam combining element and the focusing module are arranged in the sealed cavity; A displacement sensing module arranged on an outer wall of the outer shell, the displacement sensing module being used for measuring the distance between the laser processing device and the workpiece to be processed in real time; An axial movement mechanism, wherein the outer shell is movably arranged on the axial movement mechanism, and the axial movement mechanism is used for controlling the movement of the outer shell according to the distance between the laser processing device and the workpiece to be processed, so as to adjust the distance between the laser processing device and the workpiece to be processed.

7. The laser processing apparatus according to claim 6, characterized by The laser processing device further comprises a forced air cooling module; The forced air cooling module is arranged in the outer shell, and the outer shell is provided with a heat dissipation hole, and when the forced air cooling module is in operation, a cooling air flow path is formed, which flows through the infrared laser source, the blue laser source and the first optical beam combining element and is finally discharged from the heat dissipation hole.

8. The laser processing device according to claim 6, wherein The focusing module is provided with a nozzle; The outer shell is provided with a protective gas interface configured to be connected to an external gas source, and an internal gas channel extending from the protective gas interface to the nozzle is arranged in the outer shell, so that the external gas source can be sprayed from the nozzle through the internal gas channel and cover the processing area of the workpiece to be processed.

9. The laser processing apparatus according to claim 5, characterized by The laser processing device further comprises: A fastening shell comprising a first side wall, a second side wall and a third side wall, the first side wall and the second side wall being opposite along the light path direction of the coaxial light beam, and the third side wall intersecting with the first side wall and the second side wall respectively, the first side wall and the second side wall being detachably connected with the blue laser source and the focusing module respectively, the head of the infrared laser source extending into the fastening shell from the third side wall, and the inner shell being detachably arranged in the fastening shell; A locking unit arranged on the third side wall and sleeved on the outer periphery of the tail of the infrared laser source, the locking unit being used for adjusting the pose of the infrared laser source and / or locking the pose of the infrared laser source.

10. The laser processing apparatus according to claim 1, characterized by The laser source switching module comprises: A material identification unit for identifying the material type information of the workpiece to be processed; A parameter matching unit for calling corresponding laser source selection parameters according to the material type information. A laser source control unit is configured to turn on a corresponding laser source according to the laser source selection parameter, and turn off a non-selected laser source.

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