Copper-based alloy material, method for preparing the same, and use thereof

Abstract

The application provides a copper-based alloy material and a preparation method and application thereof, and belongs to the technical field of copper-based alloy materials.The copper-based alloy material comprises Ag elements, Zr elements, Cu elements and inevitable impurity elements; the weight content of the Ag elements is 0.001-0.045%, the weight content of the Zr elements is 0.001-0.01%, the total weight content of the inevitable impurity elements is less than or equal to 0.001%, and the balance is the Cu elements.The application limits the content of the Ag elements, the Zr elements and the inevitable impurity elements in the copper-based alloy material, not only further improves the softening resistance of the copper-based alloy material, but also simultaneously makes the electric conductivity and the hardness of the copper-based alloy material in a better range, realizes the comprehensive improvement of the performance of the copper-based alloy material.In addition, the control of the content of the above elements in the copper-based alloy material also realizes the control of the cost of the copper-based alloy material, and ensures the maximization of the economic benefits of the copper-based alloy material.

Description

Technical Field

[0001] This invention relates to the field of alloy materials technology, and more specifically, to a copper-based alloy material, its preparation method, and its application. Background Technology

[0002] Pure copper, as an excellent basic material, has been widely used in many fields such as electronics, aerospace, and electrical appliances due to its high electrical and thermal conductivity, excellent corrosion resistance, ease of processing, and good mechanical properties. It is found in various key components of electronic devices, such as heat sinks, lead frames, micro-motor rectifiers, and stacked buses. With the rapid development of power electronics and 5G communication technologies, electronic components are moving towards higher power, miniaturization, lightweight, high integration, and high reliability. This trend requires the copper strip materials used to possess superior performance—they not only need to maintain high electrical and thermal conductivity but also exhibit higher strength and better softening resistance to ensure the stable operation of high-end electronic components. However, pure copper has significant shortcomings in mechanical properties and softening resistance. At temperatures exceeding 250℃, pure copper softens, making it difficult to use, which poses a challenge to the high-performance requirements of copper in the electronic components field. Especially under the triple coupling of heat, electricity, and force, the performance of pure copper further degrades, significantly reducing its overall stability.

[0003] The core of this dilemma stems from the dislocation annihilation and recrystallization phenomena within copper, leading to insufficient stability in thermal environments and severely limiting its potential in high-end applications. Traditional microalloying techniques, by adding elements such as Cr, Sn, and Mg, can improve copper's resistance to softening to some extent, but the introduction of these elements also brings new problems—the increased number of solute atoms in the Cu matrix exacerbates the inelastic scattering of free electrons, inevitably reducing copper's conductivity. In contrast, Ag (silver), with its similar atomic radius to Cu (Ag: 0.144 nm, Cu: 0.128 nm) and the same crystal structure (both are FCC structures), becomes an ideal choice to improve the softening resistance of pure copper without sacrificing conductivity or other important properties. However, silver is expensive and its market is highly volatile. Excessive addition of silver not only significantly increases production costs, but more importantly, it negatively impacts copper's conductivity, contradicting our dual goals of pursuing high performance and low cost.

[0004] In summary, developing a novel copper-based alloy material that, by precisely adjusting the content of each element in the material, can both preserve the excellent conductivity of copper-based materials and avoid the cost burden caused by the excessive use of precious metals such as silver, while also significantly enhancing its resistance to high-temperature softening, has become an urgent problem to be solved in order to maximize the economic benefits and market adaptability of copper-based alloy materials. Summary of the Invention

[0005] The main objective of this invention is to provide a copper-based alloy material to solve the problem that existing copper-based materials cannot simultaneously achieve both electrical conductivity and high-temperature softening resistance, while also controlling their manufacturing costs. The aim is to provide a novel copper-based alloy material that can maintain the excellent electrical conductivity of copper-based materials, avoid the cost burden caused by the excessive use of precious metal elements such as silver, and significantly enhance its high-temperature softening resistance, thereby maximizing the economic benefits and market adaptability of copper-based alloy materials.

[0006] This application provides a copper-based alloy material, which, by weight percentage, includes Ag, Zr, Cu, and unavoidable impurity elements; wherein the weight content of Ag is 0.001 to 0.045%, the weight content of Zr is 0.001 to 0.01%, the total weight content of unavoidable impurity elements is ≤0.001%, and the balance is Cu.

[0007] Furthermore, in copper-based alloy materials, the weight content of Ag element is 0.01–0.045%.

[0008] Furthermore, in the copper-based alloy material, the weight content of Ag is 0.001–0.005%, and the weight content of Zr is 0.007–0.01%; and / or, in the copper-based alloy material, the weight content of Ag is 0.005–0.01%, and the weight content of Zr is 0.004–0.007%; and / or, in the copper-based alloy material, the weight content of Ag is 0.01–0.045%, and the weight content of Zr is 0.001–0.004%.

[0009] Furthermore, in the copper-based alloy material, the sum of the weight contents of Ag and Zr elements is 0.008 to 0.0455%; preferably, in the copper-based alloy material, the sum of the weight contents of Ag and Zr elements is 0.015 to 0.0451%.

[0010] Furthermore, the copper-based alloy material has a hardness ≥99HV, a conductivity ≥100% IACS, and a softening temperature of 325~440℃; preferably, the copper-based alloy material has a hardness ≥103HV, a conductivity ≥100% IACS, and a softening temperature of 385~440℃.

[0011] Furthermore, the average grain size of the copper-based alloy material is 20μm to 28μm, and the recrystallized grain ratio is ≤1.5%.

[0012] According to another aspect of the present invention, a method for preparing the above-mentioned copper-based alloy material is also provided. The method includes the following steps: weighing the required alloy raw materials according to the desired composition content of the material, placing them in a melting device for melting and casting operations to obtain a casting billet; subjecting the casting billet to homogenization treatment, hot rolling, solution treatment, milling, cold rolling, annealing, acid and alkali washing, and precision rolling in sequence to obtain the copper-based alloy material.

[0013] Further, the melting temperature is 1150–1200℃, and the time is 60–70 min; preferably, the casting temperature is 1110–1150℃; preferably, the homogenization treatment temperature is 900–970℃, and the time is 2–6 h; more preferably, the homogenization treatment temperature is 920–950℃, and the time is 2–4 h; preferably, the hot rolling process temperature is 900–950℃, and the temperature after the hot rolling process is 800–850℃; preferably, the deformation amount of the hot rolling operation is 75–85%; preferably, the milling operation includes: double-sided milling of the solution-treated material, and the thickness of the double-sided milling process is 0.3–0.5 mm; preferably, the deformation amount of the cold rolling operation is 80–90%.

[0014] Furthermore, the annealing operation includes: first holding the cold-rolled material at a first temperature, and then air cooling it after furnace cooling to 150-200°C; preferably, the temperature of the first holding is 350-450°C and the time is 1-4 hours; more preferably, the temperature of the first holding is 325-375°C and the time is 1-2 hours; preferably, the deformation amount in the finishing rolling process is 75-85%.

[0015] According to a third aspect of the present invention, an application of the above-mentioned copper-based alloy material is also provided, wherein the copper-based alloy material is used in the field of electronic components; preferably, the copper-based alloy material is used in a heat dissipation substrate or a lead frame.

[0016] This application provides a copper-based alloy material, comprising, by weight percentage, Ag, Zr, Cu, and unavoidable impurity elements; wherein the weight content of Ag is 0.001–0.045%, the weight content of Zr is 0.001–0.01%, the total weight content of unavoidable impurity elements is ≤0.001%, and the balance is Cu. This application limits the content of Ag, Zr, and unavoidable impurity elements in the copper-based alloy material, which not only further optimizes the softening resistance of the copper-based alloy material but also keeps its electrical conductivity and hardness within a good range, achieving a comprehensive improvement in the performance of the copper-based alloy material. Furthermore, controlling the content of the above elements in the copper-based alloy material can further control the cost of the copper-based alloy material. The copper-based alloy material provided by this application is a novel copper alloy material that can significantly enhance its high-temperature softening resistance without compromising the excellent electrical conductivity of copper-based materials, avoid the cost burden caused by the excessive use of precious metals such as silver, and ensure the maximization of the economic benefits and market adaptability of the copper-based alloy material. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0018] Figure 1 The EBSD grain diagram of the copper-based alloy material prepared according to Example 3 of the present invention is shown;

[0019] Figure 2 The EBSD grain diagram of the copper-based alloy material prepared according to Example 7 of the present invention is shown;

[0020] Figure 3 The diagram shows the proportion of EBSD recrystallization in the 420°C annealed state of the copper-based alloy material prepared according to Example 3 of the present invention.

[0021] Figure 4 The diagram shows the percentage of EBSD recrystallization in the 420°C annealed state of the copper-based alloy material prepared according to Example 7 of the present invention.

[0022] Figure 5 The EBSD grain diagram of the copper-based alloy material prepared according to Comparative Example 1 of the present invention is shown. Detailed Implementation

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] As described in the background section, pure copper has significant shortcomings in mechanical properties and resistance to softening, posing a challenge to meeting the demands of high-performance applications. Especially under the combined effects of heat, electricity, and force, the performance of pure copper further degrades, and its overall stability decreases dramatically. Developing a novel copper-based alloy that can preserve the excellent electrical conductivity of copper, avoid the cost burden caused by the excessive use of precious metals such as silver, and significantly enhance its resistance to high-temperature softening, thereby maximizing the economic benefits and market adaptability of copper-based alloys, has become an urgent problem to be solved.

[0025] To address the aforementioned problems, this application provides a copper-based alloy material. By weight percentage, the copper-based alloy material comprises Ag, Zr, Cu, and unavoidable impurity elements; wherein the weight content of Ag is 0.001–0.045%, the weight content of Zr is 0.001–0.01%, the total weight content of unavoidable impurity elements is ≤0.001%, and the balance is Cu. By strictly controlling the content of Ag, Zr, and impurity elements within the aforementioned ranges, the mechanical properties and softening resistance of the copper-based alloy material can be optimized. More importantly, the aforementioned elemental composition effectively ensures the electrical conductivity of the copper-based alloy material and further controls the material's manufacturing cost. The combined advantages of these properties enable the obtained copper-based alloy material to meet the urgent needs of the electronics, aerospace, and civilian industries for high-performance copper alloys.

[0026] Firstly, Cu, as the main component of copper-based alloys, provides the fundamental mechanical and electrical properties of the materials. The combined use of Cu and Ag, which shares similar atomic radii and crystal structures with Cu, allows trace amounts of Ag to effectively delay the recrystallization process of copper-based alloys through solid solution strengthening and grain boundary pinning, thereby improving their thermal stability. Simultaneously, the addition of trace amounts of Ag has almost no impact on the alloy's electrical conductivity. Through the synergistic effect of these two elements, the strength, hardness, softening temperature, and electrical conductivity of copper-based alloys can be adjusted to meet the demands of applications requiring higher standards.

[0027] Secondly, the addition of Ag to copper-based alloys can significantly improve their strength and softening resistance. In particular, the control of Ag content in copper-based alloys in this application is based on a comprehensive consideration of factors such as conductivity, softening temperature, and economic efficiency. Excessive Ag addition not only increases the cost of copper-based alloys but also negatively impacts their conductivity. Especially when the Ag content exceeds 0.05%, its effect on increasing the softening temperature weakens, and it may also reduce conductivity. Therefore, controlling the Ag content below 0.045% helps maintain the alloy's conductivity, achieving a balance between performance improvement and cost control.

[0028] Thirdly, the addition of Zr (zirconium) to copper-based alloys, with its weight content controlled between 0.001% and 0.01%, plays several important roles. First, during heat treatment, trace amounts of Zr can inhibit abnormal grain growth, enhancing the alloy's strength, hardness, and softening resistance through a grain refinement mechanism. This helps improve the material's overall mechanical properties and refines the grain size, making the resulting copper-based alloy more suitable for high-temperature and high-stress environments. Second, the addition of Zr increases the alloy's recrystallization activation energy, delaying the recrystallization process and maintaining the material's hardness and strength at high temperatures, preventing premature softening. Especially with the synergistic effect of Ag, it can significantly improve the softening resistance temperature of copper-based alloys. Furthermore, Zr, as a metallic element, is relatively expensive. Controlling the Zr content within the range of 0.001% to 0.01% ensures that material performance is improved without significantly reducing conductivity. The limited and precise addition of Zr has a significant effect on improving the performance of copper-based alloy materials, especially in terms of softening resistance, grain refinement, conductivity retention, and cost control.

[0029] Fourth, the presence of impurity elements (such as O, P, S, etc.) can adversely affect the properties of the alloy, including reducing electrical conductivity and affecting the thermal stability and mechanical properties of the material. By limiting the total weight percentage of impurity elements to an extremely low range (≤0.001%), the high purity of copper-based alloy materials can be ensured, thereby maintaining and optimizing their electrical conductivity and overall performance. Furthermore, controlling the content of impurity elements in copper-based alloy materials can further avoid defects in the casting process, which is beneficial for further improving the comprehensive performance of the prepared copper-based alloy materials and better maintaining the stability of the material's microstructure, thus ensuring the alloy's performance.

[0030] In summary, this application limits the content of Ag, Zr, and unavoidable impurity elements in copper-based alloy materials. This not only further optimizes the softening resistance of the copper-based alloy materials but also keeps their electrical conductivity and hardness within a favorable range, achieving a comprehensive improvement in the performance of the copper-based alloy materials. Furthermore, controlling the content of these elements in the copper-based alloy materials can further control the cost. The copper-based alloy material provided by this application is a novel copper alloy material that can maintain the excellent electrical conductivity of copper-based materials, avoid the cost burden caused by the excessive use of precious metals such as silver, and significantly enhance its high-temperature softening resistance, thereby maximizing the economic benefits and market adaptability of the copper-based alloy materials.

[0031] In a preferred embodiment, the weight content of Ag in the copper-based alloy material is 0.01–0.045%. As mentioned above, the addition of trace amounts of Ag to the copper-based alloy material can significantly improve its strength and softening resistance, and also balance the efficiency between the performance and cost of the copper-based alloy material, maintaining the excellent conductivity of the alloy and achieving dual optimization of material performance and economic benefits. Controlling the weight content of Ag in the copper-based alloy material within the above-mentioned preferred range allows for better performance in terms of conductivity and softening resistance while controlling the cost of the copper-based alloy material.

[0032] In a preferred embodiment, the copper-based alloy material contains 0.001–0.005% Ag and 0.007–0.01% Zr by weight; and / or, 0.005–0.01% Ag and 0.004–0.007% Zr by weight; and / or, 0.01–0.045% Ag and 0.001–0.004% Zr by weight. Through extensive experimentation, the inventors have creatively discovered that controlling the weight ratio of Ag and Zr in the copper-based alloy material within the aforementioned range is more effective in improving the electrical conductivity and softening temperature resistance of the copper-based alloy material. This is likely because the aforementioned relationship allows for better synergistic effects between the two elements, resulting in improved performance of the copper-based alloy material.

[0033] In a preferred embodiment, the total weight content of Ag and Zr in the copper-based alloy material is 0.008–0.0455%. Limiting the total weight content of Ag and Zr to this range allows for better utilization of their unique properties while mitigating their potential negative effects. This leads to further improvements in the performance of the copper-based alloy material and better control over its manufacturing costs. Specifically, Ag significantly enhances the material's resistance to softening due to its solid solution strengthening and grain boundary pinning capabilities, while Zr strengthens the alloy's strength and thermal stability by refining grains and increasing recrystallization activation energy. Controlling the total Ag and Zr content within the aforementioned range effectively promotes the synergistic effect of these two elements, avoiding performance degradation or cost spikes caused by excessive addition. This not only optimizes the material's resistance to softening, mechanical strength, and electrical conductivity but also balances economic efficiency and performance consistency, demonstrating the comprehensive thinking and technological breakthroughs of this invention in the development of high-performance copper alloy materials. The aforementioned limiting strategy is a key factor in achieving sustainable development and enhancing the competitiveness of copper-based alloys in high-end applications. Preferably, the sum of the weight contents of Ag and Zr elements in the copper-based alloy material is 0.015% to 0.0451%. Controlling the sum of the weight contents of Ag and Zr elements in the copper-based alloy material within the above range can improve the aforementioned effects, thereby enhancing the overall performance of the copper-based alloy material.

[0034] In a preferred embodiment, the copper-based alloy material has a hardness ≥99 HV, conductivity ≥100% IACS, and softening temperature of 325–440°C. By controlling the content of each element in the copper-based alloy material within the above-mentioned range, this application effectively improves the mechanical properties, conductivity, and softening temperature of the copper-based alloy material, making it suitable for a wider range of applications in high-end electronics and electrical appliances. Preferably, the copper-based alloy material has a hardness ≥103 HV, conductivity ≥100% IACS, and softening temperature of 385–440°C. When the performance parameters of the copper-based alloy material are within the above range, its performance is even better.

[0035] In a preferred embodiment, the average grain size of the copper-based alloy material is 20 μm to 28 μm, and the recrystallized grain ratio is ≤1.5%. This application, by controlling the content of Ag, Zr, and unavoidable impurity elements in the copper-based alloy material, can further control the average grain size and recrystallized grain ratio, thereby further improving the performance of the copper-based alloy material. Preferably, the average grain size of the copper-based alloy material at the softening temperature is 15 μm to 21 μm, the recrystallized grain ratio is 4% to 10%, and the orientation difference between the recrystallized grains and adjacent grains is less than 1°. This application, by controlling the proportion of elements in the copper-based alloy material, can achieve better performance of the copper-based alloy material in the softened state.

[0036] According to another aspect of the present invention, a method for preparing the above-mentioned copper-based alloy material is also provided. The preparation method includes the following steps: weighing the required alloy raw materials according to the desired composition content of the material, placing them in a melting device for melting and casting operations to obtain a casting billet; subjecting the casting billet to homogenization treatment, hot rolling, solution treatment, milling, cold rolling, annealing, acid and alkali washing, and precision rolling in sequence to obtain the copper-based alloy material.

[0037] Specifically, in the above preparation method, firstly, melting and casting are the initial stages of copper-based alloy material preparation. The melting process ensures the uniform distribution of alloying elements, while casting forms the original microstructure of the alloy. These two stages are used to heat the raw materials to a molten state and then cool and solidify them into a cast billet. Next, the homogenization treatment, through high-temperature annealing, allows the solute elements in the alloy to fully diffuse, eliminates the compositional inhomogeneity in the cast alloy, ensures the alloying elements are fully dissolved, avoids local performance differences, and forms a uniform microstructure, providing a good microstructure basis for subsequent hot working. The hot rolling operation involves plastically deforming the cast billet at high temperature, changing its shape and size through extrusion or stretching, while simultaneously refining the microstructure through hot working. The hot rolling operation can further homogenize and refine the grains, improve the mechanical and processing properties of the alloy, and provide a better material state for subsequent processing steps. Solution treatment is a heat treatment process that involves heating the alloy to a certain temperature to allow the alloying elements to fully dissolve in the base metal, followed by rapid cooling to obtain a supersaturated solid solution. Solution treatment can improve the strength and hardness of alloys, while providing the necessary microstructure conditions for subsequent aging treatment, which helps to optimize the final material properties.

[0038] Furthermore, milling removes oxide scale and defects from the alloy surface through machining, improving surface quality and preventing the adverse effects of surface defects on material properties. This provides a clean, smooth alloy surface for subsequent processing steps. Cold rolling increases the dislocation density within the material, refines the grains, and improves the alloy's strength and hardness while controlling the final dimensional accuracy. Annealing eliminates internal stresses generated during processing, promotes grain recrystallization and homogenization, thereby helping to restore the alloy's ductility and plasticity, reduce hardness, and ensure uniform grain refinement, improving the material's structural stability. Acid and alkali washing removes residual oxides and contaminants from the alloy surface through chemical reactions, improving surface cleanliness and activity, providing a contamination-free surface that facilitates subsequent finishing and surface treatment, improving the material's surface quality and corrosion resistance. Finish rolling is the final stage of material processing, used to further adjust the material's thickness, dimensional accuracy, and surface quality. Through finish rolling, the alloy material is ensured to achieve the precise dimensions and surface finish required for the final application, while optimizing its mechanical properties to meet specific application standards.

[0039] The aforementioned processing steps, from smelting and casting to precision rolling, are meticulously designed at every stage to ensure optimized microstructure, improved performance, and cost-effectiveness of the copper-based alloy material. The combined effect of these steps further enhances the high quality and performance of the final copper-based alloy material, meeting the demands for high-performance copper alloys in fields such as electronics, aerospace, and civilian applications.

[0040] In a preferred embodiment, the melting temperature is 1150–1200°C, and the time is 60–70 min; preferably, the casting temperature is 1110–1150°C. By precisely controlling the melting temperature and casting conditions, element segregation and inclusions can be effectively avoided, providing a uniform alloy billet for subsequent processing. Preferably, the homogenization treatment temperature is 900–970°C, and the time is 2–6 h; more preferably, the homogenization treatment temperature is 920–950°C, and the time is 2–4 h; preferably, the hot rolling process temperature is 900–950°C, and the temperature after the hot rolling process is 800–850°C; preferably, the deformation amount of the hot rolling operation is 75–85%; preferably, the milling operation includes: double-sided milling of the solution-treated material, with a thickness of 0.3–0.5 mm during the double-sided milling process; preferably, the deformation amount of the cold rolling operation is 80–90%. In a preferred embodiment, the annealing operation includes: first holding the cold-rolled material at a first temperature, then furnace cooling to 150–200°C, followed by air cooling; preferably, the first holding temperature is 350–450°C for 1–4 hours; more preferably, the first holding temperature is 325–375°C for 1–2 hours; preferably, the deformation during the finishing rolling process is 75–85%. By controlling the conditions and parameters of each step, such as temperature, pressure, and time, further regulation of the alloy's microstructure can be achieved, thereby further optimization of material properties, including improving strength, hardness, resistance to softening, and maintaining good electrical conductivity.

[0041] According to a third aspect of the present invention, an application of the above-mentioned copper-based alloy material is also provided, wherein the copper-based alloy material is used in the field of electronic components; preferably, the copper-based alloy material is used in a heat dissipation substrate or a lead frame to meet the requirements of high power and stable operation of the heat dissipation substrate or the lead frame.

[0042] The present application will be further described in detail below with reference to specific embodiments, which should not be construed as limiting the scope of protection claimed in the present application.

[0043] Example 1

[0044] The composition of the copper-based alloy material in Example 1 is shown in Table 2, and the specific preparation steps are as follows:

[0045] (a) Melting: Melting was carried out in an induction furnace. The materials were prepared according to the composition shown in Example 1 of Table 2, wherein Ag was added in the form of pure metal, Cu was added in the form of cathode copper, and Zr was added in the form of intermediate alloy. After complete melting, the holding temperature was 1200℃. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. The casting temperature was 1130℃.

[0046] (b) Homogenization, hot rolling and solution treatment: The ingot is placed in a walking beam furnace for homogenization treatment at a temperature of 950°C for 2 hours. Then the ingot is sent to a hot rolling mill at a rolling temperature of 950°C, with a hot rolling deformation of 80%. The final rolling temperature is controlled at 800°C. The hot-rolled plate is then water-cooled and coiled.

[0047] (c) Milling: The solution-treated alloy obtained in step (b) is milled to remove the oxide scale generated on the surface after hot rolling and solution treatment. 0.4 mm is milled off on both the top and bottom surfaces.

[0048] (d) Preliminary rolling: The plate after milling in step (c) is subjected to preliminary rolling with a rolling deformation of 80%.

[0049] (e) Intermediate annealing: The cold-rolled sheet obtained in step (f) is annealed in a bell-type annealing furnace at a temperature of 350°C for 1 hour.

[0050] (d) Finish rolling: The annealed plate in step (e) is finished rolled with a rolling deformation of 23% to obtain the final plate, which is a copper-based alloy material.

[0051] Example 2

[0052] The composition of the copper-based alloy material in Example 2 is shown in Table 2, and the specific preparation steps are as follows:

[0053] (a) Melting: Melting was carried out in an induction furnace, with the ingredients prepared according to the composition shown in Example 2 of Table 2, wherein Ag was added in the form of pure metal, Cu was added in the form of cathode copper, and Zr was added in the form of intermediate alloy. After complete melting, the holding temperature was 1200℃. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. The casting temperature was 1130℃.

[0054] (b) Homogenization, hot rolling and solution treatment: The ingot is placed in a walking beam furnace for homogenization treatment at a temperature of 950°C for 2 hours. Then the ingot is sent to a hot rolling mill at a rolling temperature of 950°C, with a hot rolling deformation of 80%. The final rolling temperature is controlled at 800°C. The hot-rolled plate is then water-cooled and coiled.

[0055] (c) Milling: The solution-treated alloy obtained in step (b) is milled to remove the oxide scale generated on the surface after hot rolling and solution treatment. 0.4 mm is milled off on both the top and bottom surfaces.

[0056] (d) Preliminary rolling: The plate after milling in step (c) is subjected to preliminary rolling with a rolling deformation of 80%.

[0057] (e) Intermediate annealing: The cold-rolled sheet obtained in step (f) is annealed in a bell-type annealing furnace at a temperature of 350°C for 1 hour.

[0058] (d) Finish rolling: The annealed plate in step (e) is finished rolled with a rolling deformation of 23% to obtain the final plate, which is a copper-based alloy material.

[0059] Example 3

[0060] The composition of the copper-based alloy material in Example 3 is shown in Table 2, and the specific preparation steps are as follows:

[0061] (a) Melting: Melting was carried out in an induction furnace, with the ingredients prepared according to the composition shown in Example 3 of Table 2, wherein Ag was added in the form of pure metal, Cu was added in the form of cathode copper, and Zr was added in the form of intermediate alloy. After complete melting, the holding temperature was 1200℃. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. The casting temperature was 1130℃.

[0062] (b) Homogenization, hot rolling and solution treatment: The ingot is placed in a walking beam furnace for homogenization treatment at a temperature of 950°C for 2 hours. Then the ingot is sent to a hot rolling mill at a rolling temperature of 950°C, with a hot rolling deformation of 80%. The final rolling temperature is controlled at 800°C. The hot-rolled plate is then water-cooled and coiled.

[0063] (c) Milling: The solution-treated alloy obtained in step (b) is milled to remove the oxide scale generated on the surface after hot rolling and solution treatment. 0.5 mm is milled off on both the top and bottom surfaces.

[0064] (d) Preliminary rolling: The plate after milling in step (c) is subjected to preliminary rolling with a rolling deformation of 80%.

[0065] (e) Intermediate annealing: The cold-rolled sheet obtained in step (f) is annealed in a bell-type annealing furnace at a temperature of 350°C for 1 hour.

[0066] (d) Finish rolling: The annealed plate in step (e) is finished rolled with a rolling deformation of 23% to obtain the final plate, which is a copper-based alloy material.

[0067] Example 4

[0068] The composition of the copper-based alloy material in Example 4 is shown in Table 2, and the specific preparation steps are as follows:

[0069] (a) Melting: Melting was carried out in an induction furnace, with the ingredients prepared according to the composition shown in Example 4 of Table 2, wherein Ag was added in the form of pure metal, Cu was added in the form of cathode copper, and Zr was added in the form of intermediate alloy. After complete melting, the holding temperature was 1200℃. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. The casting temperature was 1130℃.

[0070] (b) Homogenization, hot rolling and solution treatment: The ingot is placed in a walking beam furnace for homogenization treatment at a temperature of 950°C for 2 hours. Then the ingot is sent to a hot rolling mill at a rolling temperature of 950°C, with a hot rolling deformation of 80%. The final rolling temperature is controlled at 800°C. The hot-rolled plate is then water-cooled and coiled.

[0071] (c) Milling: The solution-treated alloy obtained in step (b) is milled to remove the oxide scale generated on the surface after hot rolling and solution treatment. 0.4 mm is milled off on both the top and bottom surfaces.

[0072] (d) Preliminary rolling: The plate after milling in step (c) is subjected to preliminary rolling with a rolling deformation of 80%.

[0073] (e) Intermediate annealing: The cold-rolled sheet obtained in step (f) is annealed in a bell-type annealing furnace at a temperature of 350°C for 1 hour.

[0074] (d) Finish rolling: The annealed plate in step (e) is finished rolled with a rolling deformation of 23% to obtain the final plate, which is a copper-based alloy material.

[0075] Example 5

[0076] The differences between Example 5 and Example 1 are shown in Tables 1 and 2.

[0077] Example 6

[0078] The differences between Example 6 and Example 1 are shown in Tables 1 and 2.

[0079] Example 7

[0080] The differences between Example 7 and Example 1 are shown in Tables 1 and 2.

[0081] Example 8

[0082] The differences between Example 8 and Example 1 are shown in Tables 1 and 2.

[0083] Example 9

[0084] The differences between Example 9 and Example 1 are shown in Tables 1 and 2.

[0085] Example 10

[0086] The differences between Example 10 and Example 1 are shown in Tables 1 and 2.

[0087] Example 11

[0088] The differences between Example 11 and Example 1 are shown in Tables 1 and 2.

[0089] Example 12

[0090] The differences between Example 12 and Example 1 are shown in Tables 1 and 2.

[0091] Example 13

[0092] The differences between Example 13 and Example 1 are shown in Tables 1 and 2.

[0093] Example 14

[0094] The differences between Example 14 and Example 1 are shown in Tables 1 and 2.

[0095] Comparative Example 1

[0096] The differences between Comparative Example 1 and Example 1 are shown in Tables 1 and 2.

[0097] Comparative Example 2

[0098] The differences between Comparative Example 2 and Example 1 are shown in Tables 1 and 2.

[0099] Comparative Example 3

[0100] The differences between Comparative Example 3 and Example 1 are shown in Tables 1 and 2.

[0101] Comparative Example 4

[0102] The differences between Comparative Example 4 and Example 1 are shown in Tables 1 and 2.

[0103] Table 1 lists the parameters used in the preparation of the copper-based alloy materials in the above embodiments and comparative examples, as well as the differences from Example 1. Table 2 lists the differences in elemental composition between the copper-based alloy materials in the above embodiments and comparative examples and Example 1. The relevant properties of the copper-based alloy materials prepared in the above embodiments and comparative examples were tested, and the results are shown in Table 3. Regarding the performance testing methods, further explanation is needed here:

[0104] Conductivity: The conductivity test method shall be in accordance with the method specified in GB / T 32791-2016 "Eddy Current Test Method for Conductivity of Copper and Copper Alloys";

[0105] Microhardness: The microhardness test method shall be carried out in accordance with the test method specified in GB / T 4340.1-2009 Metallic Materials Vickers Hardness Test Part 1: Test Method;

[0106] Softening resistance temperature: The softening resistance temperature test is the temperature at which the hardness of the corresponding copper-based alloy material decreases to 80% of its initial hardness after holding it at the corresponding annealing temperature for 20 minutes.

[0107] Table 1

[0108]

[0109]

[0110] Table 2

[0111]

[0112]

[0113] Table 3

[0114]

[0115]

[0116] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0117] This application provides a copper-based alloy material. In Examples 1 to 14, copper-based alloy materials were obtained by adding Ag and Zr elements to a copper base and further controlling the content of Ag, Zr, and unavoidable impurity elements. According to the data in Table 3, limiting and controlling the content of the above elements can further improve the softening resistance temperature of the prepared copper-based alloy material, while also keeping the electrical conductivity and hardness parameters within a good range. In particular, controlling the content of Ag, Zr, etc., added to the copper-based alloy material within a preferred range results in better performance in terms of softening resistance temperature and electrical conductivity.

[0118] Comparative Example 1 uses only copper. While its electrical conductivity is acceptable, its softening temperature and hardness are both low, making it difficult to meet the high standards required for practical applications. Comparative Example 2 adds Ag and Zr to the copper base, but the amounts of both are high. The resulting copper-based alloy has a acceptable softening temperature, but its electrical conductivity is low, resulting in poor overall performance. Comparative Example 3 adds only Ag to the copper base. The resulting copper-based alloy has a acceptable softening temperature, but its electrical conductivity is poor. Comparative Example 4 adds only Zr to the copper base. The softening temperature and electrical conductivity of the resulting copper-based alloy are significantly different from those of the copper-based alloys in the embodiments of this application.

[0119] In addition, scanning electron microscopy was used to measure the copper-based alloy materials prepared in Examples 3, 7, and Comparative Example 1, and the EBSD grain patterns of the measured copper-based alloy materials were obtained, as shown in the figures below. Figure 1 , Figure 2 and Figure 5The results of the three comparative examples show that: in Comparative Example 1, without the addition of Ag and Zr elements, the resulting copper-based material has a slightly larger grain size and poor uniformity; while in Examples 3 and 7, with the addition of appropriate amounts of Ag and Zr elements, the corresponding alloy grain sizes are more uniform and refined; in particular, in the copper-based alloy material of Example 7, the contents of Ag and Zr elements are within the preferred range, resulting in better uniformity and refinement of the alloy grain size. Furthermore, scanning electron microscopy was used to measure the 420℃ annealed state of the copper-based alloy materials prepared in Examples 3 and 7, and the recrystallization ratio of the samples was analyzed using AZtecCrystal analysis software. The EBSD recrystallization ratio diagrams of the copper-based alloy materials in the 420℃ annealed state are shown in the figures. Figure 3 and Figure 4 As can be seen from the figure, when the test temperature reaches 420℃, both Examples 3 and 7 reach the softened state. At this point, the recrystallization rate of the Example 3 sample reaches about 80%, while the recrystallization rate of the Example 7 sample is only about 10%. Therefore, this application can increase the recrystallization temperature of the alloy and inhibit recrystallization by increasing the amount of Ag added, thereby improving the alloy's resistance to softening.

[0120] In summary, by limiting the content of Ag, Zr, and unavoidable impurity elements, this application not only optimizes the mechanical properties and softening resistance of copper-based alloy materials but also considers cost control and maintenance of electrical conductivity. A novel copper-based alloy material is provided that, without compromising the excellent electrical conductivity of copper, avoids the cost burden caused by excessive use of precious metals such as silver, and significantly enhances its high-temperature softening resistance, thereby maximizing the economic benefits and market adaptability of copper-based alloy materials.

[0121] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for preparing a copper-based alloy material, characterized in that, The preparation method includes the following steps: Weigh the required alloy raw materials according to the desired composition content, place them in a melting device for melting and casting operations, and obtain a cast billet; The cast billet is subjected to homogenization treatment, hot rolling, solution treatment, milling, cold rolling, annealing, acid and alkali washing, and fine rolling in sequence to obtain the copper-based alloy material. The homogenization treatment is carried out at a temperature of 920-950℃ for 2-4 hours; the hot rolling process is carried out at a temperature of 900-950℃, and the temperature after the hot rolling process is 800-850℃; the deformation of the hot rolling operation is 75-85%; the milling operation includes: double-sided milling of the solution-treated material, with a thickness of 0.3-0.5 mm; the deformation of the cold rolling operation is 80-90%; the annealing operation includes: first holding the cold-rolled material at a first temperature, then furnace cooling to 150-200℃, followed by air cooling; the first holding temperature is 350-450℃, and the time is 1-4 hours. The copper-based alloy material comprises Ag, Zr, Cu, and unavoidable impurity elements by weight percentage. Wherein, the weight content of Ag element is 0.001~0.045%, the weight content of Zr element is 0.001~0.01%, the total weight content of unavoidable impurity elements is ≤0.001%, and the balance is Cu element.

2. The method for preparing copper-based alloy materials according to claim 1, characterized in that, In the copper-based alloy material, the weight content of Ag element is 0.01~0.045%.

3. The method for preparing the copper-based alloy material according to claim 1, characterized in that, In the copper-based alloy material, the weight content of Ag is 0.001~0.005%, and the weight content of Zr is 0.007~0.01%; or, In the copper-based alloy material, the weight content of Ag is 0.005~0.01%, and the weight content of Zr is 0.004~0.007%; or, In the copper-based alloy material, the weight content of Ag element is 0.01~0.045%, and the weight content of Zr element is 0.001~0.004%.

4. The method for preparing the copper-based alloy material according to any one of claims 1 to 3, characterized in that, In the copper-based alloy material, the sum of the weight contents of Ag and Zr is 0.008~0.0455%.

5. The method for preparing the copper-based alloy material according to any one of claims 1 to 3, characterized in that, The copper-based alloy material has a hardness ≥99HV, a conductivity ≥100%IACS, and a softening temperature of 325~440℃.

6. The method for preparing the copper-based alloy material according to claim 5, characterized in that, The copper-based alloy material has a hardness ≥103HV, a conductivity ≥100%IACS, and a softening temperature of 385~440℃.

7. The method for preparing the copper-based alloy material according to any one of claims 1 to 3, characterized in that, The average grain size of the copper-based alloy material is 20μm~28μm, and the recrystallized grain ratio is ≤1.5%.

8. The method for preparing copper-based alloy materials according to claim 1, characterized in that, The melting temperature is 1150~1200℃, and the time is 60~70min.

9. The method for preparing copper-based alloy materials according to claim 1, characterized in that, The casting temperature is 1110~1150℃.

10. The method for preparing the copper-based alloy material according to claim 1, characterized in that, The deformation during the finishing rolling process is 75-85%.

11. The application of a copper-based alloy material prepared by the preparation method according to any one of claims 1 to 10, characterized in that, The copper-based alloy material is used in the field of electronic components.

12. The application of the copper-based alloy material prepared by the method according to claim 11, characterized in that, The copper-based alloy material is used in heat dissipation substrates or lead frames.

Images