Automatic positioning and loading device and method for sealing semiconductor device tray covers

Abstract

This invention provides an automatic positioning and placement device and method for sealing semiconductor device tray covers. First, a cover plate fixture is fitted onto a cover plate. Then, a positioning post positions the cover plate fixture and the cover plate, allowing the cover plate fixture to be stacked on the cover plate. Through the cooperation of a first clamping mechanism and a clamping assembly, the cover plate placed on the cover plate buffer mechanism is stably clamped. The clamped cover plate is then moved above the tray buffer mechanism through the cooperation of a horizontal drive module, a vertical drive module, and a Z-axis drive module. Next, a tray positioning assembly first positions and aligns the trays stacked on the tray fixture, ensuring no positional shift. Then, a lifting mechanism acts on a support body, raising the tray positioned by the tray positioning assembly to the desired height. Finally, the tray engages with the clamped cover plate, placing it onto the tray.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and specifically to an automatic positioning and loading device and method for sealing semiconductor device tray covers. Background Technology

[0002] Semiconductor devices are the core of modern electronic technology, mainly used to realize signal control, energy conversion and information sensing. They also effectively promote the miniaturization, efficiency and intelligence of electronic devices. For example, chips, as common semiconductor devices, are made by manufacturing semiconductor materials. They can effectively process integrated circuit signals in electronic devices to quickly realize the related functions of electronic devices. During the production process, chips need to be placed on trays for transportation.

[0003] For example, patent application number 202411462375.X, published on January 10, 2025, discloses a copper sheet bonding device for punching and feeding semiconductor devices and its assembly method. The material is transported through a first conveying mechanism, which is a first linear motor and a first tray. The first linear motor is mounted on an installation platform, and the first tray is mounted on the first linear motor. The first tray is used to hold the frame tray, and then the tray is clamped by two tray clamps. The above document only realizes material transportation through the tray. However, for small materials, since the front and back sides need to be checked during the transportation process, it is necessary to use a cover plate to cover the tray to prevent the material from falling out of the tray.

[0004] As for placing the cover plate, if only a robotic arm is used to grip the cover plate, since the cover plate needs to be placed on the material tray, it needs to be gripped from both sides. Therefore, space needs to be reserved on both sides of the cover plate for the grippers to hold it. If the gripping is not in place, it will lead to unreliable gripping during the gripping process. Furthermore, when placing the cover plate, the grippers on both sides need to be moved out, which can cause the cover plate to move easily, resulting in poor placement effect. At the same time, since the cover plate is only gripped by the grippers, if the grippers have problems, the cover plate can easily fall off during the movement, resulting in poor stability of the cover plate gripping. Summary of the Invention

[0005] This invention provides an automatic positioning and placement device and method for sealing semiconductor device tray covers, which can effectively improve the stability of clamping and placing the cover, and at the same time improve the efficiency of picking up and placing the cover.

[0006] To achieve the above objectives, the present invention provides an automatic positioning and placement device for sealing semiconductor device tray covers, comprising a cover plate clamping mechanism, a cover plate buffer mechanism, and a tray buffer mechanism. The cover plate clamping mechanism includes a movable module with a connecting seat, a first clamping mechanism fixed to the bottom of the connecting seat, a cover plate fixture disposed at the bottom of the connecting seat, and a clamping component disposed on the cover plate fixture. A cover plate is disposed on the cover plate buffer mechanism, and a buffer driving mechanism is disposed on the cover plate buffer mechanism for clamping or clamping the cover plate from both sides of the bottom of the cover plate. A positioning post is disposed on the upper surface of the cover plate, and a first through hole is disposed on the cover plate fixture corresponding to the positioning post. After the movable module drives the cover plate fixture to abut against the cover plate of the cover plate buffer mechanism, the positioning post on the cover plate protrudes from the cover plate fixture through the first through hole. The clamping component engages the positioning post in a direction perpendicular to the axial direction of the positioning post. After the first clamping mechanism places the cover plate on the tray of the tray buffer mechanism, it clamps the tray and the cover plate together.

[0007] The above setup involves first fitting a cover plate fixture onto the cover plate, then using positioning pins to position the cover plate fixture and the cover plate vertically, allowing the cover plate fixture to be stacked on the cover plate. A clamping assembly then engages the positioning pins, limiting the cover plate fixture and the cover plate within their respective planes and preventing rotation of the cover plate within the fixture's plane. Under the action of the moving module, the cover plate fixture is used to clamp the cover plate from above and move it. Because the positioning pins and clamping assembly limit the cover plate's position both horizontally and vertically within the cover plate fixture, thus... The cover plate clamping mechanism is reliable and can be clamped from above. Simultaneously, the cover plate is placed on the material tray from above, and then the first clamping mechanism located on both sides clamps the cover plate and the material tray together from both sides, which facilitates the movement of the cover plate and the material tray together. When it is necessary to detect the material in the material tray, the cover plate clamping mechanism drives the cover plate to move onto the cover plate buffer mechanism. The buffer drive mechanism clamps the cover plate on both sides of the bottom of the cover plate and then releases the clamping components and the positioning column limit. Then, under the drive of the connecting seat, the cover plate fixture is disengaged from the cover plate, thus achieving reliable placement of the cover plate.

[0008] Furthermore, the tray buffer mechanism includes a support body fixed to the base plate, a tray positioning mechanism located within the support body, and a lifting mechanism slidably connected to the base plate. The tray positioning mechanism limits the movement along the diagonal of the tray fixture located on the support body. The lifting mechanism drives the tray positioning mechanism to rise and fall to match the height of the clamping cover plate, so that the cover plate covers the lifted tray and the first clamping mechanism clamps the cover plate and the tray from both sides.

[0009] The above configuration allows the tray positioning mechanism to first limit and fix the tray to prevent positional deviation during the lifting process. Then, the tray positioning mechanism releases the tray limit along the diagonal of the tray fixture, making it easier for the cover plate to match the position and height of the tray. This facilitates the cover plate to be placed on the tray, and after the limit is released, the cover plate and tray can be gripped by the first gripping mechanism.

[0010] Furthermore, the cover plate clamping mechanism also includes a self-weight adjustment assembly slidably disposed on both sides of the first clamping mechanism. The self-weight adjustment assembly includes a first fixed plate fixed to both sides of the first driving member, a self-weight adjustment plate slidably connected to the first fixed plate, and a second limiting protrusion fixed to the upper end of the self-weight adjustment plate. A clearance groove is provided at the lower end of the self-weight adjustment plate near the clamping assembly. The two ends of the cover plate fixture are respectively provided with first stepped portions that match and connect to the self-weight adjustment plates. A first connecting plate is provided between the self-weight adjustment plate and the first fixed plate. An oblong hole is provided on the first connecting plate, and a fixing member is disposed within the oblong hole and connected to the first connecting plate. The moving module includes a transverse driving module disposed on the frame and... The longitudinal drive module has its two ends respectively set on the output end of the transverse drive module and the longitudinal sliding rod. The output end of the transverse drive module is provided with a Z-axis drive module. One end of the connecting seat is fixed to the output end of the Z-axis drive module, and the other end of the connecting seat is fixedly connected to the first clamping mechanism. The first clamping mechanism includes a first drive member, two or more first sliding rods connected to the output end of the first drive member, and a first clamping plate connected to the first sliding rods through a first connecting block. The first clamping plates are relatively offset on both sides of the cover plate fixture. The bottom of the first drive member is provided with a second sliding groove that matches the first sliding rod. A first limiting protrusion is provided near the end of the second sliding groove and located in the second sliding groove.

[0011] The above configuration, through the positioning pin, guides the stacking of the cover plate fixture on the cover plate, facilitating the matching and engagement of the first through hole of the cover plate fixture with the positioning pin. This allows for relative sliding between the self-weight adjusting plate and the first fixed plate after the cover plate fixture abuts against the cover plate. Specifically, the first fixed plate moves slightly downward relative to the self-weight adjusting plate, eliminating the impact force generated when the cover plate fixture abuts against the cover plate. Simultaneously, when the cover plate is placed on the material tray, the first clamping plate moves downward relative to the self-weight adjusting plate, allowing it to descend and clamp the sides of the cover plate. After clamping the cover plate, the self-weight adjusting plate and the cover plate fixture, under their own weight, cause the self-weight adjusting plate to move downward relative to the first fixed plate. The second limiting protrusion limits the descent distance of the self-weight adjusting plate, preventing it from descending too far.

[0012] The first clamping mechanism can be precisely moved above the cover plate buffer mechanism through the cooperation of the horizontal drive module, the vertical drive module and the Z-axis drive module. This facilitates the subsequent self-weight adjustment component to drive the cover plate fixture to abut against the cover plate. Under the action of the first drive component, the two first clamping plates can be driven to move synchronously and relatively in opposite directions in a direction perpendicular to the bottom of the connecting seat. During the movement, the distance of the first slide rod sliding relatively in opposite directions in the second slide groove can be limited by the first limiting protrusion to prevent the first slide rod from disengaging from the second slide groove.

[0013] Furthermore, the clamping assembly includes a clamping cylinder, a snap-fit ​​component fixedly connected to the output end of the clamping cylinder, and a first sensor inclined to the moving direction of the snap-fit ​​component and disposed on the opposite side of the snap-fit ​​component. The clamping cylinder is disposed on the top surface of the cover plate fixture and located in the clearance groove. The snap-fit ​​component is provided with a first latch that matches the positioning post. The opening direction of the first latch is on the same horizontal straight line as the moving direction of the snap-fit ​​component. The moving direction of the snap-fit ​​component is perpendicular to the moving direction of the first clamping plate. The first sensor is disposed on the side opposite to the first latch.

[0014] The above configuration allows the clamping cylinder to move the latching component in a direction perpendicular to the first clamping plate, thereby horizontally engaging the first latching slot with the positioning post. The first sensor detects whether the positioning post is engaged in the first latching slot, allowing the limiting protrusion on the positioning post to limit the latching component in the vertical direction, enabling it to move vertically and raise or lower the cover plate. Simultaneously, the first clamping plate clamps the cover plate from both sides, ensuring stable clamping and movement. Furthermore, by adjusting the distance between the two first clamping plates and then matching the clamping cylinder with the positioning post, cover plates of different sizes can be clamped. This allows for the clamping and transfer of cover plates of different sizes using the same clamping device, effectively improving the efficiency of clamping cover plates of different sizes.

[0015] Furthermore, the cover plate buffer mechanism also includes a storage plate connected to the frame via a support column. The buffer drive mechanism is located at the bottom of the material plate. The material plate is provided with a sunken buffer compartment that matches the cover plate. The cover plate has second steps on both sides. The center of the cover plate has a positioning column protruding from the cover plate. The buffer drive mechanism includes a second cylinder and a gripper opposite to the output end of the second cylinder. The second cylinder is connected to the bottom of the material plate via a second fixing plate. The gripper has a second latch. After the gripper moves horizontally along the bottom surface of the material plate, the second latch engages between the second step and the bottom surface of the material plate. The material plate has a clearance groove opposite to the material plate. The axis of the clearance groove is perpendicular to the axis of the second step.

[0016] The above configuration allows the cover plate to be placed in the sunken buffer chamber when it is not needed, with the cover plate protruding from the top surface of the material plate. This magnetic attraction provides initial fixation between the cover plate and the buffer chamber. Then, the second cylinder moves the two grippers horizontally relative to each other, causing the second latch to engage between the second step and the bottom surface of the material plate, thus vertically limiting the cover plate and effectively preventing it from detaching from the buffer chamber and deviating from its position, which would affect the positioning and docking of the cover plate fixture and the cover plate. When the cover plate is needed, the second cylinder moves the second latch away from both sides of the cover plate, allowing the cover plate fixture to be positioned and docked with the cover plate. A clamping cylinder then engages the locking element to lock the positioning post, while the first clamping plate clamps both sides of the cover plate from the clearance groove.

[0017] Furthermore, the tray buffer mechanism also includes a base plate, the bottom of which is provided with two or more first guide posts. A first notch is formed on one side of a support body fixedly connected to the base plate. A tray fixture is fixed on the top of the support body. The tray fixture includes a tray fixture body and first limiting parts symmetrically arranged about the diagonal of the tray fixture body. The tray fixture body is provided with first protrusions on both sides along the diagonal direction. A first guide groove is formed between the first protrusions and the first limiting parts. A first limiting boss is provided on the first limiting boss. A first step, a second step higher than the first step, and a third step higher than the second step are provided on the first limiting boss. There is a gap between the first step and the second step and between the second step and the third step. Second limiting bosses symmetrical about the first limiting boss are provided on both sides of the first limiting boss. A fourth step aligned with the second step and a fifth step aligned with the third step are provided on the second limiting boss.

[0018] The above configuration, through the combined action of the tray fixture body, the first step, and the second limiting boss, positions the tray placed on the tray fixture body; through the combined action of the second and fourth steps, positions the tray placed on the first step; and through the combined action of the third and fifth steps, positions the trays placed on the second and fourth steps. In this way, by using different steps together, trays of different sizes can be positioned and stored.

[0019] Furthermore, the tray positioning mechanism includes a third fixed plate, a fourth fixed plate connected to the third fixed plate via a connecting block, a first motor, a disc disposed between the third and fourth fixed plates, and a tray positioning assembly slidably disposed with the disc. The two ends of the fourth fixed plate are respectively connected to a third limiting protrusion fixed on the lifting mechanism. The tray positioning assembly includes a second slide rail connected to the third fixed plate, two second sliders slidably connected to the second slide rail, and a positioning rod connected to the second sliders and protruding from the tray fixture after passing through the first guide groove. The third fixed plate has first slots on both sides that match the positioning rods. The disc has two first sliding grooves that are symmetrical about the center of the disc and spirally unfold outward from the center of the disc. The bottom of the second slider has a first pulley that is slidably connected to the first sliding groove. The output end of the first motor fixed on the fourth fixed plate passes through the fourth fixed plate and is fixedly connected to the second connecting block fixed on the bottom of the disc.

[0020] With the above configuration, when the trays are stacked on the tray fixture, the first motor can drive the disc to rotate. Since the first sliding groove on the disc is spirally extended outward, after the first pulley slides with the first sliding groove, it drives the two second sliders to slide along the second slide rail. In turn, it drives the positioning rods on the two second sliders to move relative to each other along the diagonal of the tray fixture in the first guide groove, thereby positioning the trays stacked on the tray fixture, ensuring that the trays stacked on the tray fixture are neatly arranged, and preventing the stacked trays from shifting position.

[0021] Furthermore, the lifting mechanism includes a base connected to the frame via a connecting column and a third cylinder mounted on the base. The output end of the third cylinder is fixedly connected to a first push rod, which passes through the base and abuts against the base plate. The base is provided with a first guide hole that matches the first guide column, and the end of the first guide column is provided with a fourth limiting protrusion.

[0022] The above configuration allows the third cylinder to drive the first push rod to lift the base plate, which in turn drives the support body connected to the base plate to rise. This, in turn, allows the tray, which has been positioned by the tray positioning component, to rise to the expected height, ensuring that the clamped cover plate is accurately placed on the tray.

[0023] The present invention also provides an automatic positioning and placement method for a cover plate of a semiconductor device tray, comprising the following steps:

[0024] S1 moves the first clamping mechanism above the cover plate buffer mechanism by moving the module, and then sets the positioning post on the cover plate through the first through hole of the cover plate fixture so that the cover plate fixture abuts against the cover plate.

[0025] The first sensor of S2 detects the positioning post and clamps the positioning post that passes through the cover plate fixture through the clamping assembly;

[0026] S3 disengages from both sides of the cover plate via the buffer drive mechanism and moves the clamped cover plate above the material tray buffer mechanism via the moving module;

[0027] S4 Place the cover plate above the tray buffer mechanism and lower the first clamping mechanism so that the first clamping mechanism clamps the cover plate and the tray from both sides and moves them together to the next process.

[0028] The first clamping mechanism of S5 releases the cover plate and the tray. The cover plate fixture drives the cover plate to move above the cover plate buffer mechanism. The cover plate is clamped from both sides of the bottom of the cover plate by the buffer drive mechanism. Then the clamping component is released and the cover plate clamping mechanism moves upward, causing the clamping component to disengage from the positioning post and the cover plate is placed back on the cover plate buffer mechanism.

[0029] The above method first involves fitting a cover plate fixture onto a cover plate. Then, positioning pins are used to vertically position the cover plate fixture and the cover plate, allowing the cover plate fixture to be stacked on top of the cover plate. A clamping assembly then engages the positioning pins, limiting the cover plate fixture and the cover plate within their respective planes and preventing rotation of the cover plate within the fixture's plane. Under the action of the moving module, the cover plate fixture is used to clamp the cover plate from above and move it. Because the positioning pins and clamping assembly limit the cover plate's position in both the horizontal and vertical planes of the cover plate fixture, the cover plate... The clamping is reliable, and the cover plate can be clamped from above. The cover plate is placed on the material tray from above, and then the first clamping mechanism on both sides clamps the cover plate and the material tray together, which can facilitate the movement of the cover plate and the material tray together. When it is necessary to detect the material in the material tray, the cover plate clamping mechanism drives the cover plate to move to the cover plate buffer mechanism. The buffer drive mechanism clamps the cover plate on both sides of the bottom of the cover plate and then releases the clamping component and the positioning column limit. Then, under the drive of the connecting seat, the cover plate fixture is disengaged from the cover plate, thus realizing the reliable placement of the cover plate.

[0030] Furthermore, step S2 also includes:

[0031] The clamping cylinder drives the snap-fit ​​component to move in a direction perpendicular to the first clamping plate. After the first sensor detects that the first snap-fit ​​component has snapped into the positioning post, the clamping cylinder stops working.

[0032] Step S4 also includes:

[0033] The trays stacked on the tray fixture are positioned along the diagonal of the tray fixture by the tray positioning component. Then, the first push rod is driven by the third cylinder to lift the support body, so as to lift the trays positioned by the tray positioning component to the expected height.

[0034] The above method uses a clamping cylinder to move the locking component and cooperate with the first sensor to limit and fix the cover plate in the vertical direction. At the same time, the first clamping plate clamps the cover plate from both sides to limit and fix the cover plate in the horizontal direction, thereby clamping and fixing the cover plate from different directions to ensure that the cover plate can move stably.

[0035] The beneficial effects of this invention are:

[0036] First, a cover plate fixture is fitted onto the cover plate. Then, positioning pins are used to position the cover plate fixture and the cover plate vertically, allowing the cover plate fixture to be stacked on the cover plate. Next, a clamping assembly engages the positioning pins, limiting the cover plate fixture and the cover plate within their respective planes to prevent rotation within the fixture's plane. Under the action of the moving module, the cover plate fixture is used to clamp the cover plate from above and then move it. Because the positioning pins and clamping assembly limit the cover plate's position in both the horizontal and vertical planes of the cover plate fixture, the cover plate is effectively clamped. It has good reliability, and the cover plate can be clamped from above. The cover plate is placed on the material tray from above, and then the first clamping mechanism on both sides clamps the cover plate and the material tray together, which can easily move the cover plate and the material tray together. When it is necessary to detect the material in the material tray, the cover plate clamping mechanism drives the cover plate to move to the cover plate buffer mechanism. The buffer drive mechanism clamps the cover plate on both sides of the bottom of the cover plate and then releases the clamping component and the positioning column limit. Then, under the drive of the connecting seat, the cover plate fixture is disengaged from the cover plate, so that the cover plate is reliably placed. Attached Figure Description

[0037] Figure 1 This is a structural block diagram of the present invention.

[0038] Figure 2 This is a three-dimensional structural diagram of the cover plate clamping mechanism in this invention.

[0039] Figure 3 This is a schematic diagram of the structure of the first clamping mechanism, the self-weight adjustment component, and the clamping component in this invention.

[0040] Figure 4 This is a first-view schematic diagram of the material tray buffer mechanism in this invention.

[0041] Figure 5 This is a second-view schematic diagram of the tray buffer mechanism in this invention.

[0042] Figure 6 This is a schematic diagram of the material tray buffer mechanism in this invention.

[0043] Figure 7 This is a schematic diagram of the material tray positioning mechanism and the lifting mechanism in this invention.

[0044] Figure 8 This is a schematic diagram of the cover plate fixture and support body in this invention.

[0045] Figure 9 This is a schematic diagram of the structure of the first sliding groove on the disk in this invention.

[0046] Figure 10 This is a top view of the tray positioning mechanism in this invention.

[0047] Explanation of icon numbers:

[0048] 01c-Cover plate buffer mechanism; 02c-Cover plate clamping mechanism; 03c-Plate positioning mechanism; 04c-Weight adjustment component; 05c-Buffer drive mechanism; 06c-Plate buffer mechanism; 07c-Lifting mechanism; 1c-Horizontal drive module; 2c-Vertical drive module; 3c-Vertical sliding rod; 4c-Vertical fixing frame; 5c-Z-axis drive module; 6c-Connecting seat; 7c-First drive component; 8c-First sliding rod; 9c-First connecting block; 10c-First clamping plate; 11c-Cover plate fixture; 112c-Second sliding groove; 13c-First fixing plate; 14c-Weight adjustment plate; 141c-First connecting plate; 1411c-Oval hole; 15c-Second limiting protrusion; 16c-Allowing groove; 17c - Positioning pin; 18c - Clamping cylinder; 19c - Snap-fit ​​component; 20c - First sensor; 21c - First bayonet; 22c - Support pin; 23c - Material plate; 24c - Cover plate; 25c - Second step; 26c - Second cylinder; 27c - Gripper; 28c - Second bayonet; 29c - Relief groove; 30c - Base plate; 31c - Support body; 32c - Material tray fixture body; 33c - First limiting part; 34c - First protrusion; 35c - First guide groove; 36c - First limiting boss; 37c - First step; 38c - Second step; 39c - Third step; 40c - Second limiting boss; 41c - Fourth step; 42c - Fifth step; 43c - Third fixing plate; 431c - First slot; 44c - Connecting block; 45c - Fourth fixing plate; 46c - First motor; 47c - Disc; 48c - Third limiting boss; 49c - Second slide rail; 50c - Second slider; 51c - Positioning rod; 12c - First slide groove; 52c - Connecting column; 53c - Base; 54c - Third cylinder; 55c - First push rod; 56c - First guide column; 57c - Fourth limiting boss. Detailed Implementation

[0049] like Figures 1-10As shown, an automatic positioning and placement device for sealing semiconductor device tray covers includes a cover plate clamping mechanism 02c, a cover plate buffer mechanism 01c, and a tray buffer mechanism 06c. The cover plate clamping mechanism 02c is used to clamp the cover plate 24c from the cover plate buffer mechanism 01c and place it into the tray on the tray buffer mechanism 06c. The cover plate clamping mechanism 02c includes a movable module with a connecting seat 6c, a first clamping mechanism fixed to the bottom of the connecting seat 6c, a self-weight adjustment component 04c slidably disposed on both sides of the first clamping mechanism, a cover plate fixture 11c connected between the self-weight adjustment components 04c, and a clamping component disposed on the cover plate fixture 11c.

[0050] like Figure 3 , Figure 5 and Figure 6 As shown, the tray buffer mechanism 06c includes a support body 31c fixed on the base plate 30c, a tray positioning mechanism located within the support body 31c, and a lifting mechanism slidably connected to the base plate 30c. After the moving module drives the cover plate fixture 11c to abut against the cover plate 24c of the cover plate buffer mechanism 01c, the positioning post 17c on the cover plate 24c protrudes from the cover plate fixture 11c. The clamping assembly engages the positioning post 17c along the top surface of the cover plate fixture 11c. The first clamping mechanism adjusts relative to the self-weight adjustment assembly towards... After sliding down, it sinks into the clearance groove 29c of the cover plate 24c buffer mechanism to avoid it. When the first clamping mechanism clamps the cover plate and the tray, the first clamping mechanism moves down to both sides of the cover plate 24c and clamps the cover plate 24c and the tray from both sides. The tray positioning mechanism limits the position along the diagonal of the tray fixture located on the support body 31c. The lifting mechanism drives the tray fixture to rise and fall to match the height of clamping the cover plate 24c, so that the cover plate 24c covers the lifted tray.

[0051] like Figure 2As shown, the moving module includes a transverse drive module 1c and a longitudinal drive module 2c mounted on a frame (not shown in the figure). The two ends of the longitudinal drive module 2c are respectively mounted on the output end of the transverse drive module 1c and on a longitudinal sliding rod 3c. The longitudinal sliding rod 3c is mounted on a longitudinal fixing frame 4c. A Z-axis drive module 5c is mounted on the output end of the transverse drive module 1c. One end of a connecting seat 6c is fixed to the output end of the Z-axis drive module 5c, and the other end of the connecting seat 6c is fixedly connected to a first clamping mechanism. The first clamping mechanism includes a first drive member 7c, two or more first sliding rods 8c connected to the output end of the first drive member 7c, and a first clamping plate 10c connected to the first sliding rods 8c via a first connecting block 9c. The first clamping plates 10c are relatively offset on both sides of the cover plate fixture 11c. The bottom of the first drive member 7c has a second sliding groove 112c that matches the first sliding rods 8c. A first limiting protrusion (not shown in the figure) is provided near the end of the second slide groove 112c and within the second slide groove 112c. This allows the first gripping mechanism to be precisely moved above the cover plate buffer mechanism through the cooperation of the transverse drive module 1c, the longitudinal drive module 2c, and the Z-axis drive module 5c. This facilitates the subsequent self-weight adjustment component to drive the cover plate fixture 11c to abut against the cover plate 24c. Under the action of the first drive component 7c, the two first gripping plates 10c can be driven to move synchronously and relatively in opposite directions in a direction perpendicular to the self-weight adjustment component 04c. During the movement, the first limiting protrusion can limit the distance of the first slide rod 8c sliding relatively in opposite directions in the second slide groove 112c to prevent the first slide rod 8c from disengaging from the second slide groove 112c. In this embodiment, the first drive component 7c can be a pneumatic finger structure or an electric gripper depending on the actual driving stroke required.

[0052] like Figures 2-3As shown, there are two weight adjustment components. The weight adjustment component 04c includes a first fixing plate 13c fixed to both sides of the first driving member 7c, a weight adjustment plate 14c slidably connected to the first fixing plate 13c, and a second limiting protrusion 15c fixed to the upper end of the weight adjustment plate 14c. In this embodiment, the sliding connection between the first fixing plate 13c and the weight adjustment plate 14c is achieved by matching and sliding the first slide rail on the first fixing plate 13c with the first slider on the weight adjustment plate 14c. The weight adjustment plate 14c closer to the clamping component is located below... The end is provided with a clearance groove 16c, which is used for the wire of the first sensor 20c to pass through. The two ends of the cover plate fixture 11c are respectively provided with a first step portion that matches and connects to the self-weight adjustment plate 14c. The first step portion of the cover plate fixture 11c is fixedly connected to the self-weight adjustment plate 14c. The center of the cover plate fixture 11c is provided with a first through hole (not shown in the figure) that matches the positioning post 17c. A first connecting plate 141c is provided between the self-weight adjustment plate 14c and the first fixing plate 13c. The first connecting plate 141c is provided with a waist-shaped hole 1411c. A fixing member is provided in the hole 1411c to connect the first connecting plate 141c and the self-weight adjusting plate 14c, and the fixing member is slidably disposed in the oblong hole 1411c; in this way, the positioning post 17c can guide the cover plate fixture 11c to be stacked on the cover plate 24c, so that the first through hole of the cover plate fixture 11c can be matched and sleeved with the positioning post 17c. In this way, after the cover plate fixture 11c abuts against the cover plate 24c, the self-weight adjusting plate 14c and the first fixing plate 13c can slide relative to each other. That is, when the cover plate abuts against the material tray, the first fixing plate 13c relative to the material tray slides. The self-weight adjusting plate 14c moves downward, causing the first clamping plate 10c to move downward relative to the self-weight adjusting plate 14c, so that the first clamping plate 10c can descend and clamp the two sides of the cover plate 24c. After clamping the cover plate 24c and the tray, the self-weight adjusting plate 14c and the cover plate fixture 11c, under their own weight, cause the self-weight adjusting plate 14c to move downward relative to the first fixed plate 13c. The second limiting protrusion 15c abuts against the upper end of the first fixed plate 13c, which can limit the distance of descent of the self-weight adjusting plate 14c and prevent the self-weight adjusting plate 14c from descending too far.

[0053] like Figures 2-3As shown, the clamping assembly includes a clamping cylinder 18c, a latching member 19c fixedly connected to the output end of the clamping cylinder 18c, and a first sensor 20c inclined to the moving direction of the latching member 19c and located on the opposite side of the latching member 19c. The first sensor 20c is a proximity sensor used to detect whether a positioning post passes through the first through hole. The clamping cylinder 18c is located on the top surface of the cover plate fixture 11c and within the clearance groove 16c. The latching member 19c has a first bayonet 21c that matches the positioning post 17c. The opening direction of the first bayonet 21c is on the same horizontal line as the moving direction of the latching member 19c. The moving direction of the latching member 19c is perpendicular to the moving direction of the first clamping plate 10c. The first sensor 20c is located on the side opposite to the first bayonet 21c, so that the clamping cylinder 18c can drive the latching member 19c to move in a direction perpendicular to the first clamping plate 10c. The device moves to the first bayonet 21c, causing the first bayonet 21c to horizontally engage with the positioning post 17c. The first sensor 20c can detect whether the positioning post 17c is engaged in the first bayonet 21c. This allows the limiting boss on the positioning post 17c to limit the locking member 19c in the vertical direction, enabling it to move vertically and drive the cover plate 24c to rise and fall. At the same time, the first clamping plate 10c clamps the cover plate 24c from both sides, thus stably clamping and moving the cover plate 24c. In addition, by adjusting the distance between the two first clamping plates 10c, and then matching the locking member 19c with the positioning post 17c driven by the clamping cylinder 18c, cover plates 24c of different sizes can be clamped. Thus, cover plates 24c of different sizes can be clamped and transferred using the same clamping device, effectively improving the working efficiency of clamping cover plates 24c of different sizes.

[0054] like Figures 4-5 As shown, the cover plate buffer mechanism includes a material plate 23c connected to the frame by a support column 22c and a buffer drive mechanism disposed at the bottom of the material plate 23c. In this embodiment, the material plate 23c is provided with three recessed buffer chambers (not shown in the figure) that match the cover plates 24c of different sizes. The cover plates 24c are provided with second step portions 25c on both sides. The center of the cover plate 24c is provided with a positioning column 17c protruding from the cover plate 24c. The bottom of the material plate 23c is provided with a buffer drive mechanism 05c at a position corresponding to each recessed buffer chamber.

[0055] The buffer drive mechanism 05c includes a second cylinder 26c and a gripper 27c disposed opposite to the output end of the second cylinder 26c. The second cylinder 26c is connected to the bottom of the material plate 23c via a second fixing plate. The gripper 27c is provided with a second latch 28c. After the gripper 27c moves horizontally along the bottom surface of the material plate 23c, the second latch 28c engages between the second step portion 25c and the bottom surface of the material plate 23c. The material plate 23c is provided with a relief groove 29c disposed opposite to the material plate 23c. The axis of the relief groove 29c is perpendicular to the axis of the second step portion 25c. This allows the cover plate 24c to be placed in the sunken buffer chamber when it is not needed, so that the cover plate 24c protrudes from the top surface of the material plate 23c. In one embodiment, the cover plate 24c and the sunken buffer chamber are magnetically attracted. After initial fixation, the two grippers 27c are moved horizontally relative to each other by the second cylinder 26c. The second cylinder 26c is a pneumatic finger, which causes the second latch 28c to engage between the second step 25c and the bottom surface of the material plate 23c, thereby limiting the cover plate 24c in the vertical direction. This effectively prevents the cover plate 24c from detaching from the sinking buffer chamber and deviating from its position, thus affecting the positioning and docking of the cover plate fixture 11c and the cover plate 24c. When the cover plate 24c needs to be used, the second cylinder 26c drives the second latch 28c to disengage from both sides of the cover plate 24c, so that the cover plate fixture 11c and the cover plate 24c are positioned and docked. The clamping cylinder 18c drives the snap-fit ​​part 19c to lock the positioning post 17c, while the first clamping plate 10c moves away from the clearance groove 29c.

[0056] like Figures 6-8As shown, the tray buffer mechanism 06c also includes a base plate 30c. The bottom of the base plate 30c is provided with two or more first guide posts 56c. A support body 31c, fixedly connected to the base plate 30c, has a first notch on one side. A tray fixture is fixed to the top of the support body 31c. The tray fixture includes a tray fixture body 32c and first limiting parts 33c symmetrically arranged diagonally about the tray fixture body 32c. The tray fixture body 32c has first protrusions 34c on both sides along the diagonal direction. The first protrusions 34c and the first limiting parts... A first guide groove 35c is formed between 33c. A first limiting boss 36c is provided on the first limiting part 33c. The first limiting boss 36c is provided with a first step 37c, a second step 38c which is higher than the first step 37c, and a third step 39c which is higher than the second step 38c. There are gaps between the first step 37c and the second step 38c, and between the second step 38c and the third step 39c, and the gaps are different. The height between the first step 37c and the second step 38c is... The height difference is equal to the height difference between the second step 38c and the third step 39c. A second limiting boss 40c, symmetrical about the first limiting boss 36c, is located on both sides of the first limiting boss 36c. A clearance space is provided between the first limiting boss 36c and the second limiting boss 40c. The second limiting boss 40c has a fourth step 41c aligned with the second step 38c and a fifth step 42c aligned with the third step 39c. Thus, through the material tray fixture body 32c and the first step 38c... The combined action of 7c and the second limiting boss 40c positions the tray placed on the tray fixture body 32c; the combined action of the second step 38c and the fourth step 41c positions the tray placed on the first step 37c; the combined action of the third step 39c and the fifth step 42c positions the trays placed on the second step 38c and the fourth step 41c; thus, by using the combined action of different steps, trays of different sizes can be positioned and stored.

[0057] like Figures 6-7 , Figure 9 and Figure 10As shown, the tray positioning mechanism 03c includes a third fixed plate 43c, a fourth fixed plate 45c connected to the third fixed plate 43c via a connecting block 44c, a first motor 46c, a disc 47c disposed between the third fixed plate 43c and the fourth fixed plate 45c, and a tray positioning assembly slidably disposed with the disc 47c. The two ends of the fourth fixed plate 45c are respectively connected to a third limiting protrusion 48c fixed on the lifting mechanism 07c. The tray positioning assembly includes a second slide rail 4 connected to the third fixed plate 43c. 9c, two second sliders 50c slidably connected to the second slide rail 49c, and a positioning rod 51c connected to the second sliders 50c and protruding from the material tray fixture after passing through the first guide groove 35c. Each second slider 50c is provided with two positioning rods 51c. The third fixing plate 43c has first slots 431c on both sides that match the positioning rods 51c. The disc 47c has two first sliding grooves 12c that are symmetrical about the center of the disc 47c and spirally unfold outward from the center of the disc 47c. Figure 8 As shown, the first pulley in the first groove 12c moves in direction A, and the first pulley in the other groove 12c moves in direction B. The bottom of the second slider 50c is provided with a first pulley that is matched and slidably connected to the first groove 12c. The output end of the first motor 46c, which is fixed on the fourth fixed plate 45c, passes through the fourth fixed plate 45c and is fixedly connected to the second connecting block fixed on the bottom of the disc 47c. In this way, when the trays are stacked on the tray fixture, the first motor 46c can drive the disc 47c to rotate. Since the first groove 12c on the disc 47c is spirally extended outward, after the first pulley slides with the first groove 12c, it drives the two second sliders 50c to slide along the second slide rail 49c. This, in turn, drives the positioning rods 51c on the two second sliders 50c to move relative to each other along the diagonal of the tray fixture in the first guide groove 35c, thereby positioning the trays stacked on the tray fixture, ensuring that the trays stacked on the tray fixture are neatly arranged, and preventing the stacked trays from shifting position.

[0058] like Figures 6-8 As shown, the lifting mechanism 07c includes a base 53c connected to the frame via a connecting column 52c and a third cylinder 54c mounted on the base 53c. The output end of the third cylinder 54c is fixedly connected to a first push rod 55c. The first push rod 55c passes through the base 53c and abuts against the base plate 30c. The base 53c is provided with a first guide hole that matches the first guide column 56c. The end of the first guide column 56c is provided with a fourth limiting protrusion 57c. Thus, the third cylinder 54c can drive the first push rod 55c to lift the base plate 30c, thereby driving the support body 31c connected to the base plate 30c and the material tray fixture to rise. This allows the material tray, after being positioned by the material tray positioning assembly, to rise to the expected height, ensuring that the clamped cover plate 24c is accurately placed on the material tray.

[0059] An automatic positioning and placement method for sealing semiconductor device tray covers specifically includes the following steps:

[0060] S1 moves the first clamping mechanism above the cover plate buffer mechanism 01c through the cooperation of the horizontal drive module 1c, the vertical drive module 2c and the Z-axis drive module 5c. Then, the positioning post 17c on the cover plate 24c passes through the first through hole of the cover plate fixture and makes the cover plate fixture abut against the cover plate 24c.

[0061] S2 drives the clamping cylinder 18c to move the snap-fit ​​component 19c in a direction perpendicular to the movement of the first clamping plate 10c. After the first sensor 20c detects that the first snap-fit ​​21c of the snap-fit ​​component 19c is engaged with the positioning post 17c, the clamping cylinder 18c stops working. Then, the Z-axis drive module 5c drives the first clamping plate 10c to continue moving downward relative to the self-weight adjustment plate 14c. The first clamping plate 10c descends to the clearance groove 29c of the material plate 23c to make way.

[0062] S3 drives the second jaw 28c of the gripper 27c to disengage from both sides of the cover plate 24c through the buffer drive mechanism 05c. The clamped cover plate 24c is moved above the material tray buffer mechanism 06c through the cooperation of the horizontal drive module 1c, the vertical drive module 2c and the Z-axis drive module 5c.

[0063] S4 places the cover plate 24c above the tray buffer mechanism and causes the first clamping mechanism to descend and clamp the cover plate and tray from both sides of the cover plate 24c and the tray, moving them together to the next process.

[0064] Step S4 also includes: the tray buffer mechanism positions and lifts the tray: the first motor 46c drives the disc 47c to rotate, so that the first pulley slides with the first slide groove 12c, and drives the two second sliders 50c to slide in opposite directions along the second slide rail 49c, thereby driving the positioning rods 51c on the two second sliders 50c to move in opposite directions along the diagonal of the tray fixture in the first guide groove 35c, so as to position the trays stacked on the tray fixture. Then, the third cylinder 54c drives the first push rod 55c to lift the support body 31c, so as to lift the tray after it has been positioned by the tray fixture to the expected height.

[0065] The first clamping mechanism of S5 releases the cover plate 24c and the tray. The cover plate fixture moves the cover plate 24c to the top of the cover plate buffer mechanism. The cover plate 24c is clamped from both sides of the bottom of the cover plate 24c by the buffer drive mechanism. Then the clamping assembly is released and the cover plate clamping mechanism moves upward, causing the clamping assembly to disengage from the positioning post 17c and the cover plate 24c is placed back on the cover plate buffer mechanism.

[0066] The working principle of this invention is as follows: First, the cover plate fixture 11c is sleeved onto the cover plate 24c. Then, the positioning post 17c positions the cover plate fixture 11c and the cover plate 24c, thereby stacking the cover plate fixture 11c on the cover plate 24c. Through the cooperation of the first clamping mechanism and the clamping assembly, the cover plate 24c placed on the cover plate buffer mechanism 01c is stably clamped. The clamped cover plate 24c is then moved above the tray buffer mechanism 06c through the cooperation of the transverse drive module 1c, the longitudinal drive module 2c, and the Z-axis drive module 5c. Then, the tray positioning assembly first positions and aligns the trays stacked on the tray fixture to ensure... Once the stacked trays are in the correct position, the lifting mechanism acts on the support 31c, which in turn lifts the trays, positioned by the tray fixture, to the desired height. The trays then cooperate with the clamping cover plate 24c, placing it on the tray. Simultaneously, by adjusting the distance between the first clamping mechanism holding the cover plate 24c and the sides of the tray, the cover plate 24c can be returned to the cover plate buffer mechanism. Furthermore, it can cooperate with the clamping assembly to clamp cover plates 24c of different sizes on the cover plate buffer mechanism, thus adapting to trays of different sizes on the tray buffer mechanism and effectively improving the efficiency of clamping different cover plates 24c to fit different sized trays.

Claims

1. An automatic positioning and loading device for sealing semiconductor device tray covers, characterized in that: The device includes a cover plate clamping mechanism, a cover plate buffer mechanism, and a tray buffer mechanism. The cover plate clamping mechanism includes a movable module with a connecting seat, a first clamping mechanism fixed to the bottom of the connecting seat, a cover plate fixture set at the bottom of the connecting seat, and a clamping component set on the cover plate fixture. A cover plate is provided on the cover plate buffer mechanism, and a buffer drive mechanism is provided on the cover plate buffer mechanism to clamp or clamp the cover plate from both sides of the bottom of the cover plate. A positioning post is provided on the upper surface of the cover plate, and a first through hole is provided on the cover plate fixture corresponding to the positioning post. After the movable module drives the cover plate fixture to abut against the cover plate of the cover plate buffer mechanism, the positioning post on the cover plate protrudes from the cover plate fixture through the first through hole. The clamping component clamps the positioning post in a direction perpendicular to the axial direction of the positioning post. After the first clamping mechanism places the cover plate on the tray of the tray buffer mechanism, it clamps the tray and the cover plate together. The tray buffer mechanism includes a support body fixed to the base plate, a tray positioning mechanism located within the support body, and a lifting mechanism slidably connected to the base plate. The tray positioning mechanism limits the movement along the diagonal of the tray fixture located on the support body. The lifting mechanism drives the tray fixture to rise and fall to match the height of the clamping cover plate, so that the cover plate covers the lifted tray and the first clamping mechanism clamps the cover plate and the tray from both sides. The tray positioning mechanism includes a third fixed plate, a fourth fixed plate connected to the third fixed plate via a connecting block, a first motor, a disc disposed between the third and fourth fixed plates, and a tray positioning assembly slidably disposed with the disc. The two ends of the fourth fixed plate are respectively connected to a third limiting protrusion fixed on the lifting mechanism. The tray positioning assembly includes a second slide rail connected to the third fixed plate, two second sliders slidably connected to the second slide rail, and a positioning rod connected to the second slider and protruding from the tray fixture after passing through the first guide groove. Each second slider is provided with two positioning rods. The two sides of the third fixed plate are provided with first slots that match the positioning rods. The disc is provided with two first sliding grooves that are symmetrical about the center of the disc and spirally unfold outward from the center of the disc. The bottom of the second slider is provided with a first pulley that matches and is slidably connected to the first sliding groove. The output end of the first motor fixed on the fourth fixed plate passes through the fourth fixed plate and is fixedly connected to the second connecting block fixed on the bottom of the disc.

2. The automatic positioning and placement device for sealing semiconductor device tray covers according to claim 1, characterized in that: The cover plate clamping mechanism also includes a self-weight adjustment assembly slidably disposed on both sides of the first clamping mechanism. The self-weight adjustment assembly includes a first fixed plate fixed to both sides of the first driving member, a self-weight adjustment plate slidably connected to the first fixed plate, and a second limiting protrusion fixed to the upper end of the self-weight adjustment plate. A clearance groove is provided at the lower end of the self-weight adjustment plate near the clamping assembly. First stepped portions matching and connected to the self-weight adjustment plates are provided at both ends of the cover plate fixture. A first connecting plate is provided between the self-weight adjustment plate and the first fixed plate. An oblong hole is provided on the first connecting plate, and a fixing member is provided within the oblong hole to connect the self-weight adjustment plate to the first connecting plate. The moving module includes a transverse drive module disposed on the frame. The longitudinal drive module has two ends respectively set on the output end of the transverse drive module and the longitudinal sliding rod. The output end of the transverse drive module is provided with a Z-axis drive module. One end of the connecting seat is fixed on the output end of the Z-axis drive module, and the other end of the connecting seat is fixedly connected to the first clamping mechanism. The first clamping mechanism includes a first drive member, two or more first sliding rods connected to the output end of the first drive member, and a first clamping plate connected to the first sliding rods through a first connecting block. The first clamping plates are relatively offset on both sides of the cover plate fixture. The bottom of the first drive member is provided with a second sliding groove that matches the first sliding rod. A first limiting protrusion is provided near the end of the second sliding groove and located in the second sliding groove.

3. The automatic positioning and placement device for sealing semiconductor device tray covers according to claim 1, characterized in that: The clamping assembly includes a clamping cylinder, a snap-fit ​​component fixedly connected to the output end of the clamping cylinder, and a first sensor that is inclined to the moving direction of the snap-fit ​​component and located on the opposite side of the snap-fit ​​component. The clamping cylinder is located on the top surface of the cover plate fixture and in the clearance groove. The snap-fit ​​component has a first latch that matches the positioning post. The opening direction of the first latch is on the same horizontal straight line as the moving direction of the snap-fit ​​component. The moving direction of the snap-fit ​​component is perpendicular to the moving direction of the first clamping plate. The first sensor is located on the side opposite to the first latch.

4. The automatic positioning and loading device for sealing semiconductor device tray covers according to claim 1, characterized in that: The cover plate buffer mechanism also includes a storage plate connected to the frame by a support column. The buffer drive mechanism is located at the bottom of the material plate. The material plate is provided with a sunken buffer chamber that matches the cover plate. The two sides of the cover plate are provided with second steps. The center of the cover plate is provided with a positioning column that protrudes from the cover plate. The buffer drive mechanism includes a second cylinder and a gripper that is positioned opposite to the output end of the second cylinder. The second cylinder is connected to the bottom of the material plate by a second fixing plate. The gripper is provided with a second latch. After the gripper moves horizontally along the bottom surface of the material plate, the second latch is engaged between the second step and the bottom surface of the material plate. The material plate is provided with a relief groove that is positioned opposite to the bottom surface of the material plate. The axis of the relief groove is perpendicular to the axis of the second step.

5. The automatic positioning and loading device for sealing semiconductor device tray covers according to claim 1, characterized in that: The tray buffer mechanism also includes a base plate, the bottom of which is provided with two or more first guide posts. A first notch is formed on one side of a support body fixedly connected to the base plate. A tray fixture is fixed on the top of the support body. The tray fixture includes a tray fixture body and first limiting parts symmetrically arranged about the diagonal of the tray fixture body. The tray fixture body is provided with first protrusions on both sides along the diagonal direction. A first guide groove is formed between the first protrusions and the first limiting parts. A first limiting boss is provided on the first limiting boss. A first step, a second step higher than the first step, and a third step higher than the second step are provided on the first limiting boss. There is a gap between the first step and the second step and between the second step and the third step. Second limiting bosses symmetrical about the first limiting boss are provided on both sides of the first limiting boss. A fourth step aligned with the second step and a fifth step aligned with the third step are provided on the second limiting boss.

6. The automatic positioning and placement device for sealing semiconductor device tray covers according to claim 1, characterized in that: The lifting mechanism includes a base connected to the frame via a connecting column and a third cylinder mounted on the base. The output end of the third cylinder is fixedly connected to a first push rod, which passes through the base and abuts against the base plate. The base is provided with a first guide hole that matches the first guide column, and the end of the first guide column is provided with a fourth limiting protrusion.

7. The picking and placing method for the automatic positioning and picking device for sealing semiconductor device tray covers according to claim 1, characterized in that: Includes the following steps: S1 moves the first clamping mechanism above the cover plate buffer mechanism by moving the module, and then sets the positioning post on the cover plate through the first through hole of the cover plate fixture so that the cover plate fixture abuts against the cover plate. S2 clamps the positioning post that passes through the cover plate fixture using the clamping assembly; S3 disengages from both sides of the cover plate via the buffer drive mechanism and moves the clamped cover plate above the material tray buffer mechanism via the moving module; S4 Place the cover plate above the tray buffer mechanism and lower the first clamping mechanism so that the first clamping mechanism clamps the cover plate and the tray from both sides and moves them together to the next process. The first clamping mechanism of S5 releases the cover plate and the tray. The cover plate fixture drives the cover plate to move above the cover plate buffer mechanism. The cover plate is clamped from both sides of the bottom of the cover plate by the buffer drive mechanism. Then the clamping component is released and the cover plate clamping mechanism moves upward, causing the clamping component to disengage from the positioning post and the cover plate is placed back on the cover plate buffer mechanism.

8. The automatic positioning and placement method for sealing semiconductor device tray covers according to claim 7, characterized in that: Step S2 also includes: The clamping cylinder drives the snap-fit ​​component to move in a direction perpendicular to the first clamping plate. After the first sensor detects that the first snap-fit ​​component has snapped into the positioning post, the clamping cylinder stops working. Step S4 also includes: positioning the trays stacked on the tray fixture along the diagonal of the tray fixture using the tray positioning component, and then using the third cylinder to drive the first push rod to lift the support body, so as to lift the trays positioned by the tray positioning component to the expected height.

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