Multi-mode flexible tactile sensor capable of realizing full-surface continuous sensing, module and preparation method of multi-mode flexible tactile sensor

Abstract

The invention discloses a multi-mode flexible tactile sensor capable of realizing full-surface continuous sensing, a module and a preparation method of the multi-mode flexible tactile sensor capable of realizing full-surface continuous sensing, and the multi-mode flexible tactile sensor comprises a collector circuit board, the upper surface of the collector circuit board is regularly provided with a flexible pressure sensor used for pressure signal measurement and pressure sensing, a flexible temperature sensor used for temperature signal measurement and temperature sensing, and a mixed magnetic particle adhesive film used for generating a magnetic field. A Hall sensor array used for magnetic field signal measurement and three-dimensional force sensing and a signal processing module used for signal acquisition and processing are regularly arranged on the lower surface of the collector circuit board. According to the multi-mode flexible touch sensor capable of continuously sensing the whole surface, through cooperative work of the mixed magnetic particle glue film, the flexible pressure sensor / flexible temperature sensor and the Hall sensor layer, accurate collection of three-dimensional force signals / temperature signals and magnetic field changes can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of flexible sensor, in particular to a multi-modal flexible tactile sensor capable of full-surface continuous sensing, a sensor module, a preparation method thereof, and a body-possessed intelligent robot. BACKGROUND

[0002] In modern manufacturing and intelligent service scenarios, body-possessed intelligent robots undertake increasingly complex tasks. However, the limitations of body-possessed intelligent robots in tactile sensing have become a key bottleneck restricting the performance breakthrough of body-possessed intelligent robots.

[0003] From the perspective of hardware integration, most traditional tactile sensing sensors only focus on collecting single tactile information, such as pure force or only identifying contact position. If multi-dimensional tactile data is to be obtained, multiple independent sensing modules need to be stacked on the surface of the robot, which not only increases the hardware volume and weight, but also inevitably produces time and space lag due to the differences in signal transmission path and timing sequence caused by the physical separation of each module.

[0004] In terms of sensing continuity and accuracy, traditional rigid tactile sensors are difficult to adapt to complex curved surface contact scenarios. When the robot interacts with irregular and flexible objects, the rigid sensing structure cannot fully contact the surface, resulting in sensing blind areas, and the transmission of contact force is easily distorted due to the rigid material, leading to distorted tactile information collected. From the perspective of materials and sensing principles, some traditional tactile sensors rely on complex optical, piezoelectric ceramic, and other components, which not only have high costs and complicated preparation processes, but also have poor flexibility and durability, which undoubtedly reduces the overall reliability and economy of the robot system.

[0005] In summary, the technical defects of traditional tactile sensors in integration, sensing continuity and accuracy, material adaptability, etc. make it difficult to meet the needs of body-possessed intelligent robots for precise adaptation to complex environments and multi-dimensional efficient interaction. Therefore, developing a multi-modal flexible tactile sensing technology with high integration, continuous and accurate sensing, and flexible material adaptation has become an urgent need to promote intelligent robots with multi-modal tactile sensing to more extensive application scenarios. SUMMARY

[0006] The technical problem solved by the present application is to provide a multi-modal flexible tactile sensor capable of full-surface continuous sensing, a sensor module, a preparation method thereof, and a body-possessed intelligent robot integrated with the sensor module.

[0007] The technical solution adopted by the present application to solve its technical problem is: A multi-modal flexible tactile sensor capable of full-surface continuous sensing, comprising a collector circuit board, The upper surface of the data acquisition circuit board is regularly arranged with a flexible pressure sensor for pressure signal measurement and pressure sensing, a flexible temperature sensor for temperature signal measurement and temperature sensing, and a hybrid magnetic microparticle film for generating a magnetic field. The lower surface of the data acquisition circuit board is regularly arranged with a Hall sensor array for magnetic field signal measurement and three-dimensional force sensing, as well as a signal processing module for signal acquisition and processing; The hybrid magnetic microparticle film and the Hall sensor array together form a magnetic sensor. The flexible pressure sensor includes an array of flexible force-sensitive materials and an array of force-sensitive electrodes, and the flexible temperature sensor includes an array of flexible temperature-sensitive materials and an array of temperature-sensitive electrodes. The flexible force-sensitive material array and the flexible temperature-sensitive material array are alternately arranged and integrated on the lower surface of the first flexible substrate, forming a sensing material layer on its surface. The upper surface of the first flexible substrate is bonded to a hybrid magnetic microparticle film by an adhesive or hot pressing process to form a magnetic multimodal flexible sensing film. Alternatively, the flexible force-sensitive material array and the flexible temperature-sensitive material array are alternately arranged and integrated on the surface of the hybrid magnetic microparticle film, forming a sensing material layer on its surface, and together with it, forming a multimodal flexible sensing film with magnetism. The force-sensitive electrode array and the temperature-sensitive electrode array are directly integrated on the upper surface of the collector circuit board, or integrated on the surface of the second flexible substrate to form an electrode layer on its surface. A magnetic multimodal flexible sensing film is fixedly mounted on the upper surface of the data acquisition circuit board by an adhesive or hot-pressing process; or, it is bonded to a second flexible substrate with an integrated electrode layer by an adhesive or hot-pressing process to form an independent magnetic multimodal flexible sensor, and then the independent magnetic multimodal flexible sensor is fixedly mounted on the upper surface of the data acquisition circuit board by an adhesive or hot-pressing process. Flexible pressure sensors and flexible temperature sensors arranged in an array are alternately arranged on the upper surface of the data acquisition circuit board to form a densely packed sensing unit for continuous full-surface sensing of the multimodal flexible tactile sensor. The hybrid magnetic microparticle film is a functional elastic colloidal film with good deformation and recovery properties and magnetic properties, and contains uniformly dispersed magnetic microparticles inside.

[0008] Furthermore, the thickness of the hybrid magnetic microparticle film is 50μm-2000μm, and the particle size of the magnetic microparticles inside it is ≤50μm.

[0009] Furthermore, the sensing material of the flexible force-sensitive material array is a metal nanowire, a two-dimensional material, or a carbon nanomaterial, with a thickness of 1μm-100μm.

[0010] Furthermore, the sensing material of the flexible temperature-sensitive material array is a composite material containing nano-conductive materials and polymers, with a thickness of 1μm-100μm.

[0011] A multimodal flexible tactile sensor module capable of continuous sensing across the entire surface comprises the aforementioned multimodal flexible tactile sensor capable of continuous sensing across the entire surface, a signal processing module for signal acquisition and processing, a microprocessor for logic and function control, a power management module for voltage conversion and distribution, and a communication module for communication with a host computer. The microprocessor, the power management module, and the communication module are directly integrated on the acquisition circuit board or independently disposed in a circuit module inside the base. The multimodal flexible tactile sensor capable of continuous sensing across the entire surface is mounted and integrated on the base.

[0012] Furthermore, the sensor module also integrates a rechargeable battery module and a USB interface module for signal transmission or charging the battery.

[0013] An embodied intelligent robot with multimodal tactile perception, comprising the aforementioned multimodal flexible tactile sensor module capable of continuous sensing across the entire surface, wherein the multimodal flexible tactile sensor module capable of continuous sensing across the entire surface is integrated into the embodied intelligent robot to realize the distributed measurement and perception of three-dimensional force and temperature by the embodied intelligent robot.

[0014] A method for fabricating a multimodal flexible tactile sensor capable of continuous sensing across the entire surface includes the following steps: S1: Preparation of mixed magnetic microparticle film: Magnetic microparticles are added to a liquid adhesive precursor with high elasticity. The magnetic microparticles are uniformly dispersed in the liquid adhesive precursor by vacuum stirring or ultrasonic stirring. Then, the film is vulcanized and molded at a low temperature of 60℃-80℃ to prepare a flexible film of mixed magnetic microparticles with a thickness of 50μm-2000μm. The film is then cut and shaped according to actual needs to obtain the mixed magnetic microparticle film. S2: Preparation of multimodal flexible sensing film: Using flexible printed circuit technology, an m×n array patterned flexible force-sensitive material array and an m×n array patterned flexible temperature-sensitive material array are respectively fabricated on the lower surface of the first flexible substrate. Then, the hybrid magnetic microparticle film is bonded to the upper surface of the first flexible substrate by medical-grade adhesive or hot pressing process to prepare a magnetic multimodal flexible sensing film. Alternatively, an m×n array patterned flexible force-sensitive material array and an m×n array patterned flexible temperature-sensitive material array can be fabricated directly on the lower surface of the hybrid magnetic microparticle film to prepare a magnetic multimodal flexible sensing film. The flexible force-sensitive material array and the flexible temperature-sensitive material array are arranged alternately; S3: Fabrication of the data acquisition circuit board: Several Hall sensors are soldered on the lower surface of the data acquisition circuit board using surface mount technology, thereby forming a Hall sensor array on the lower surface of the data acquisition circuit board. S4: Electrode layer fabrication: On the upper surface of the collector circuit board, the electrode layer is etched by combining the array patterned flexible force-sensitive material array and the flexible temperature-sensitive material array. Alternatively, the electrode layer can be fabricated on the upper surface of the second flexible substrate using printed electronics technology; S5: Layered Assembly: The magnetic multimodal flexible sensing film is fixed on the upper surface of the collector circuit board using medical-grade adhesive or hot pressing process to prepare the multimodal flexible tactile sensor capable of continuous sensing of the entire surface as described above; subsequently, the multimodal flexible tactile sensor capable of continuous sensing of the entire surface is fixed on the base using the medical-grade adhesive, fasteners, and cable ties to prepare the multimodal flexible tactile sensor module capable of continuous sensing of the entire surface as described above.

[0015] Furthermore, it also includes the following steps: S6: Encapsulation protection: The multimodal flexible tactile sensor or the multimodal flexible tactile sensor module capable of continuous sensing across the entire surface is encapsulated by using a biocompatible flexible encapsulation material. Alternatively, it can be encapsulated and protected using thin, breathable, and flexible packaging materials.

[0016] Furthermore, in step S1, the preparation of the hybrid magnetic microparticle film can also be achieved by uniformly mixing magnetic microparticles with a rubber matrix, followed by a calendering process to prepare a flexible film of hybrid magnetic microparticles. Subsequently, the film is cut to the required size according to actual needs, and then magnetized by gradient magnetization to prepare a hybrid magnetic microparticle film with a magnetic field.

[0017] The beneficial effects of this invention are:

[0018] This invention relates to a multimodal flexible tactile sensor capable of continuous sensing across the entire surface. Through the coordinated operation of a hybrid magnetic particle film, a flexible pressure sensor / flexible temperature sensor, and a Hall sensor layer, it achieves precise acquisition of three-dimensional force signals, temperature signals, and magnetic field changes. The multimodal design integrates three-dimensional force / tactile sensing and temperature sensing functions, providing richer information compared to single-function sensors. In industrial robotic arm grasping, it can sense three-dimensional force and temperature, providing more data support for automated control and fault diagnosis, and improving the intelligence level of equipment. Attached Figure Description

[0019] Figure 1 This is an exploded view of a multimodal flexible tactile sensor capable of continuous sensing across the entire surface, as described in this invention. Figure 2 for Figure 1 The combined state diagram; Figure 3 for Figure 2 Top view; Figure 4 for Figure 3 A cross-sectional view along the AA direction; Figure 5 These are schematic diagrams of the sensor devices in different embodiments; Figure 6 for Figure 1 The exploded view of the multimodal flexible tactile sensor with the first flexible substrate is omitted. in: 11. Data acquisition circuit board; 12. Signal processing module; 13. Microprocessor; 21. First flexible substrate; 22. Sensing material layer; 23. Adhesive layer; 24. Electrode layer; 25. Second flexible substrate; 221. Flexible force-sensitive material array; 222. Flexible temperature-sensitive material array; 241. Force-tactile electrode array; 242. Temperature-sensitive electrode array. 31. Hybrid magnetic microparticle film; 32. Hall sensor array; 311. Magnetic microparticles; 4. Base. Detailed Implementation

[0020] To make the above-mentioned contents, objectives, and beneficial effects of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0021] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] like Figures 1-4 As shown, this invention provides a multimodal flexible tactile sensor capable of continuous sensing across the entire surface, comprising a data acquisition circuit board 11. The upper surface of the data acquisition circuit board 11 is regularly arranged with a flexible pressure sensor for pressure signal measurement and sensing, a flexible temperature sensor for temperature signal measurement and sensing, and a hybrid magnetic microparticle film 31 for generating a magnetic field. The lower surface of the data acquisition circuit board 11 is regularly arranged with a Hall sensor array 32 for measuring magnetic field signals such as magnetic field strength and distribution and for three-dimensional force sensing, and a signal processing module 12 for signal acquisition and processing. The hybrid magnetic microparticle film 31 and the Hall sensor array 32 together form a magnetic sensor.

[0023] Furthermore, such as Figure 1 As shown, the flexible pressure sensor includes an array of flexible force-sensitive materials 221 and a force-sensitive electrode array 241 arranged in an array, and the flexible temperature sensor includes an array of flexible temperature-sensitive materials 222 and a temperature-sensitive electrode array 242 arranged in an array. The flexible force-sensitive materials array 221 and the flexible temperature-sensitive materials array 222 are integrated onto the surface of the first flexible substrate 21, thereby forming a sensing material layer 22 on the surface of the first flexible substrate 21. The force-sensitive electrode array 241 and the temperature-sensitive electrode array 242 are directly integrated onto the upper surface of the data acquisition circuit board 11, or integrated onto the surface of another flexible substrate, thereby forming an electrode layer 24 on the upper surface of the data acquisition circuit board 11 or the surface of another flexible substrate.

[0024] Furthermore, such as Figure 1 As shown, in one embodiment, the flexible force-sensitive material array 221 and the force-tactile electrode array 241, the flexible temperature-sensitive material array 222 and the temperature-sensitive electrode array 242 are arranged opposite to each other and are separated by an adhesive layer 23. When subjected to force contact, corresponding electrical signals are generated.

[0025] like Figure 5As shown in -a, when the electrode layer 24 is directly disposed on the upper surface of the collector circuit board 11, the first flexible substrate 21, which integrates the sensing material layer 22, is fixed to the edge of the collector circuit board 11 by an adhesive layer 23 or a thermoforming process, thus fixing the first flexible substrate 21 to the upper surface of the collector circuit board 11, thereby sealing the sensing material layer 22 and the electrode layer 24 between the first flexible substrate 21 and the upper surface of the collector circuit board 11. The hybrid magnetic microparticle film 31 is fixed to the upper surface of the first flexible substrate 21 by an adhesive layer or a thermoforming process.

[0026] like Figure 5 As shown in -b, when the electrode layer 24 is disposed on another flexible substrate, the first flexible substrate 21 with the integrated sensing material layer 22 and the second flexible substrate 25 with the integrated electrode layer 24 are fixed together by an adhesive layer 23 or a hot-pressing process to form an independent multimodal flexible sensor. Then, the independent multimodal flexible sensor is fixedly disposed on the upper surface of the data acquisition circuit board 11 by an adhesive layer or a hot-pressing process. The hybrid magnetic microparticle film 31 is fixedly disposed on the upper surface of the first flexible substrate 21 by an adhesive layer or a hot-pressing process.

[0027] The material of the adhesive layer is not limited, including but not limited to medical-grade adhesive materials such as double-sided tape and glue.

[0028] Furthermore, such as Figure 5 As shown in -c, the hybrid magnetic microparticle film 31 can also be made of other magnetic materials, such as micro magnetic elastic protrusions arranged in an array on the surface of the flexible substrate 21, thereby forming a magnetic field layer on the surface of the flexible substrate 21 for generating a magnetic field.

[0029] Furthermore, such as Figure 6 As shown, in one embodiment, the first flexible substrate 21 can be omitted, and the sensing material layer 22 can be directly prepared on the surface of the hybrid magnetic microparticle film 31 through processes such as printed motor technology, atomic layer deposition, and molecular assembly.

[0030] In this invention, the flexible force-sensitive material array 221 is prepared on the surface of the first flexible substrate 21 using processes such as printed circuit technology, atomic layer deposition, and molecular assembly, thereby forming a functional thin film with high flexibility and force-sensitive response characteristics; or it can be directly prepared on the surface of the hybrid magnetic microparticle film 31, thereby forming a functional thin film that simultaneously possesses high flexibility, force-sensitive response characteristics, and magnetism. The material of the first flexible substrate 21 may be the same as or different from the material of the hybrid magnetic microparticle film 31, and it is a flexible thin film with a thickness of 10 μm-2000 μm.

[0031] Furthermore, the sensing material of the flexible force-sensitive material array 221 includes, but is not limited to, metal nanowires, two-dimensional materials, carbon nanomaterials, etc., with a thickness of 1μm-100μm. When the flexible force-sensitive material array 221 is prepared on the surface of the first flexible substrate 21 or the hybrid magnetic microparticle film 31, it will not affect the flexibility of the first flexible substrate 21 or the hybrid magnetic microparticle film 31, thus forming a flexible functional thin film together with it.

[0032] In this invention, the flexible temperature-sensitive material array 222 is a composite material containing nano-conductive materials and polymers. It is prepared in the blank area on the surface of the first flexible substrate 21 or the hybrid magnetic microparticle film 31 through coating, printing, or other processes. This array is alternately arranged with the flexible force-sensitive material array 222 on the same surface of the first flexible substrate 21 or the hybrid magnetic microparticle film 31, thereby forming a flexible sensing film with force-sensitive, temperature-sensitive, and magnetic field-sensitive properties. The thickness of the flexible temperature-sensitive material array 222 is 1 μm-100 μm.

[0033] Furthermore, such as Figure 1 As shown, the flexible force-sensitive material array 221 and the flexible temperature-sensitive material array 222 are alternately arranged on the lower surface of the first flexible substrate 21 or the hybrid magnetic microparticle film 31 to form densely arranged sensing units, thereby enabling continuous sensing of the entire surface of the multimodal flexible tactile sensor.

[0034] like Figure 1 As shown, the hybrid magnetic microparticle film 31 is a functional elastic colloidal film with good deformation and recovery properties and magnetic properties. The substrate of the hybrid magnetic microparticle film is made of flexible materials such as medical-grade silicone, polydimethylsiloxane, silicone rubber, and polyurethane, and contains uniformly dispersed magnetic microparticles. The thickness of the hybrid magnetic microparticle film is 50μm-2000μm. The uniformly dispersed magnetic microparticles 311 in the hybrid magnetic microparticle film construct a magnetic field layer whose magnetic field distribution can change with the deformation of the hybrid magnetic microparticle film 31.

[0035] Furthermore, the magnetic microparticle film of the present invention is uniformly mixed with magnetic microparticles 311 into the liquid adhesive precursor through high-energy stirring dispersion, magnetic field-assisted dispersion and other processes to form a magnetic liquid adhesive. After curing into a film shape and calendering, a flexible film of magnetic microparticles is formed, which can then be cut to the required size according to the actual situation.

[0036] Furthermore, the magnetic microparticles include, but are not limited to, ferrite microparticles, neodymium iron boron microparticles, and other microparticle materials with magnetic response characteristics, with a particle size of less than 50 μm.

[0037] Furthermore, the magnetic microparticles are dispersed using a magnetic field-guided dispersion + ultrasonic synergistic process. First, a magnetic field is used to initially arrange the magnetic microparticles in an orderly manner. Then, ultrasonic mechanical force breaks up the particle aggregation, promoting uniform dispersion into independent units within the liquid gel precursor. Subsequently, in-situ curing is performed to form a composite gel film. The hybrid magnetic microparticle silicone film prepared by this synergistic process ensures the continuity and predictability of magnetic field changes during film deformation due to the uniform dispersion of the microparticles. Furthermore, the magnetic field guidance and ultrasonic synergy enhance the interfacial bonding between the magnetic microparticles and the film substrate, significantly improving the deformation-magnetic field change conversion efficiency, allowing the Hall sensor to more accurately capture magnetic field signals.

[0038] This invention discloses a multimodal flexible tactile sensor capable of continuous sensing across the entire surface. Through a layered design, it enables the simultaneous collection of tactile information from multiple modalities on a single sensor, significantly improving the sensor's integration and reducing temporal and spatial hysteresis. A sensing material layer 22 (a force-sensitive tactile array layer and a temperature-sensitive array layer) is prepared on one side of a hybrid magnetic microparticle film 31 or a first flexible substrate 21. This side of the film is then bonded to a PCB circuit board (i.e., the data acquisition circuit board 11) with a Hall sensor array to form a highly sensitive multimodal flexible tactile sensor array.

[0039] When the flexible hybrid magnetic microparticle film 31 on the sensor surface undergoes a slight elastic deformation, the magnetic microparticles within it will experience displacement relative to the Hall sensor array. The Hall sensor array outputs proportional electrical signals based on the magnetic field strength, thereby sensing the magnitude and direction of the external contact force. The sensing sensitivity can be adjusted by the hardness of the film; the lower the film hardness, the higher the sensitivity.

[0040] When the pressure applied to the multimodal flexible tactile sensor device is small, the flexible pressure sensor, composed of the flexible force-sensitive material array 221 and the force-sensitive electrode array 241, separates and does not trigger, and the device does not output a signal. When the applied pressure increases, the flexible force-sensitive material array 221 and the force-sensitive electrode array 241 come into contact, and the flexible pressure sensor is triggered. The pressure-sensitive characteristics of its nanomaterial convert the external pressure signal into an electrical signal output. The output electrical signal changes with the pressure applied to the sensor surface. Through a specific pressure-electrical signal relationship, the magnitude and direction of the pressure can be measured.

[0041] When in contact with an external object, the surface temperature information of the contact point is detected. The electrical signal output by the flexible temperature sensor changes with the change in contact temperature, thus realizing the temperature detection function.

[0042] like Figure 1As shown, the present invention also provides a multimodal flexible tactile sensor module capable of continuous sensing across the entire surface, comprising the aforementioned multimodal flexible tactile sensor capable of continuous sensing across the entire surface, a signal processing module for signal acquisition and processing, a microprocessor 13 for logic and function control, a power management module for voltage conversion and distribution, and a communication module for communication with a host computer. The microprocessor for logic and function control, the power management module for voltage conversion and distribution, and the communication module for communication with the host computer can be directly integrated onto the acquisition circuit board 11, or can be independently housed in a circuit module within the base 4, and then the multimodal flexible tactile sensor is mounted and integrated onto the base 4.

[0043] Furthermore, when integrated into the base 4, the multimodal flexible tactile sensor, capable of continuous sensing across the entire surface, is electrically connected to the circuit module inside the base via wires or contacts.

[0044] Furthermore, the multimodal flexible tactile sensor module capable of continuous sensing across the entire surface also integrates a rechargeable battery module and a USB interface module for signal transmission or battery charging.

[0045] Furthermore, the signal processing module 12 includes circuit units for signal sampling (signal detection), signal amplification, filtering, and AD conversion, which are used to acquire and process signals from the multimodal flexible tactile sensor capable of continuous sensing across the entire surface, and ultimately output stable and accurate digital signals.

[0046] The present invention also provides an embodied intelligent robot with multimodal tactile perception, including the above-mentioned multimodal flexible tactile sensor module capable of continuous full-surface perception. By integrating the above-mentioned multimodal flexible tactile sensor module capable of continuous full-surface perception onto the embodied intelligent robot, the embodied intelligent robot can realize distributed measurement and perception of three-dimensional force and temperature.

[0047] like Figures 1-5 As shown, the present invention also provides a method for fabricating a multimodal flexible tactile sensor capable of continuous sensing across the entire surface, comprising the following steps: S1: Preparation of the mixed magnetic microparticle film 31: Ferrite microparticles, neodymium iron boron microparticles, and other magnetic microparticles are added to a liquid adhesive precursor with high elasticity. The magnetic microparticles are uniformly dispersed in the liquid adhesive precursor by vacuum stirring or ultrasonic stirring. Then, the film is vulcanized at a low temperature of 60℃-80℃ to prepare a flexible film of mixed magnetic microparticles with a thickness of 50μm-2000μm. The film is then cut and shaped according to actual needs to obtain the mixed magnetic microparticle film 31.

[0048] Furthermore, medical-grade high-elasticity silicone material is preferred for the liquid adhesive precursor, as it has good biocompatibility and flexibility.

[0049] Furthermore, the thickness of the hybrid magnetic microparticle film is preferably 1mm-1.5mm. This thickness can ensure the sensitivity during operation and prevent structural fragility caused by an excessively thin film.

[0050] Furthermore, when vacuum stirring is used, the mixture is stirred for 10 minutes at a pressure of 1 MPa to ensure uniform dispersion of the magnetic particles, followed by vulcanization molding at 80°C.

[0051] In another embodiment, the hybrid magnetic microparticle film is prepared by uniformly mixing magnetic microparticles with a rubber matrix, followed by a calendering process to obtain a flexible film of hybrid magnetic microparticles, which is then cut to the required size according to actual needs. Then, a gradient magnetization process is used to further magnetize the film, resulting in a hybrid magnetic microparticle film with a magnetic field.

[0052] S2: Fabrication of the multimodal flexible sensing film: Using flexible printed circuit technology, an m×n patterned flexible force-sensitive material array 221 is fabricated on the surface of the first flexible substrate 21 or directly on the surface of the hybrid magnetic microparticle film 31, thereby forming a flexible force-sensitive array on the surface of the first flexible substrate or the hybrid magnetic microparticle film. Subsequently, an m×n patterned flexible temperature-sensitive material array 222 is fabricated in the blank area of ​​the same surface of the first flexible substrate or the hybrid magnetic microparticle film on which the flexible force-sensitive layer is fabricated, thereby forming a flexible temperature-sensitive array on the surface of the first flexible substrate or the hybrid magnetic microparticle film.

[0053] Furthermore, flexible force-sensitive arrays and flexible temperature-sensitive arrays are arranged alternately.

[0054] Furthermore, temperature-sensitive materials can be made from composite materials of nanomaterials and polymers to achieve flexible temperature-sensitive materials. Examples include composite temperature-sensitive materials made from nano-platinum metal materials and epoxy resin, carbon nanotube materials and polyurethane, or nano-ZnO materials and polydimethylsiloxane.

[0055] Furthermore, the dimensions of the flexible force-sensitive material array 221 and the flexible temperature-sensitive material array 222 are not limited, and their thickness is 5μm-50μm.

[0056] Furthermore, in step S2, when the flexible force-sensitive material array 221 and the flexible temperature-sensitive material array 222 are fabricated on the first substrate 21, the following steps are also included: S21: Combination of hybrid magnetic microparticle film and multimodal flexible sensing film: The hybrid magnetic microparticle film and the multimodal flexible sensing film are bonded together using medical-grade adhesives or hot pressing processes to prepare a magnetic multimodal flexible sensing film.

[0057] S3: Fabrication of the data acquisition circuit board 11: Hall sensors are soldered on the lower surface of the data acquisition circuit board using surface mount technology, thereby forming a Hall sensor array on the lower surface of the data acquisition circuit board.

[0058] S4: Fabrication of electrode layer 24: On the upper surface of the collector circuit board 11, an electrode layer is etched by combining an array patterned flexible force-sensitive array and a flexible temperature-sensitive array. Alternatively, on the surface of the second flexible substrate 25, an electrode layer is fabricated using printed electronics technology based on the flexible force-sensitive array and the flexible temperature-sensitive array.

[0059] S5: Layered assembly: Using medical-grade adhesives, hot pressing and other technologies, the multimodal flexible sensing film with magnetic field is fixed on the upper surface of the collector circuit board. Then, using medical-grade adhesives, fasteners, cable ties and other technologies, the collector circuit board is fixed on the base 4.

[0060] Furthermore, encapsulation can be achieved using biocompatible flexible encapsulation materials. Alternatively, waterproof, dustproof, and electromagnetic interference-resistant industrial-grade encapsulation materials can be used to enhance the stability and durability of the sensor in industrial settings. Alternatively, lightweight and breathable encapsulation materials can be used to meet the portability and comfort requirements of smart wearable devices.

[0061] Furthermore, when using medical-grade adhesives and hot-pressing processes, it is necessary to press and fix them according to the actual situation to ensure the stability and firmness between the multimodal flexible sensing membrane with magnetic field and the collector, and between the collector and the base.

[0062] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-modal flexible tactile sensor capable of full-surface continuous sensing, characterized in that: The acquisition circuit board (11) comprises a flexible pressure sensor for pressure signal measurement and pressure sensing, a flexible temperature sensor for temperature signal measurement and temperature sensing, and a mixed magnetic particle adhesive film (31) for generating a magnetic field, which are regularly arranged on the upper surface of the acquisition circuit board (11). A Hall sensor array (32) for magnetic field signal measurement and three-dimensional force sensing, and a signal processing module for signal acquisition and processing are regularly arranged on the lower surface of the acquisition circuit board (11). The mixed magnetic particle adhesive film (31) and the Hall sensor array (32) form a magnetic sensor. The flexible pressure sensor comprises an array of flexible force-sensitive sensing material (221) and a force touch electrode array (241), and the flexible temperature sensor comprises an array of flexible temperature-sensitive sensing material (222) and a temperature-sensitive electrode array (242). The flexible force-sensitive sensing material array (221) and the flexible temperature-sensitive sensing material array (222) are alternately arranged and integrated on the lower surface of the first flexible substrate (21) to form a sensing material layer (22) on the surface thereof, and the upper surface of the first flexible substrate (21) is bonded to the mixed magnetic particle adhesive film (31) by an adhesive or a hot pressing process to form a multi-modal flexible sensing film with magnetism. Alternatively, the flexible force-sensitive sensing material array (221) and the flexible temperature-sensitive sensing material array (222) are alternately arranged and integrated on the surface of the mixed magnetic particle adhesive film (31) to form a sensing material layer (22) thereon, and together form a multi-modal flexible sensing film with magnetism. The force touch electrode array (241) and the temperature-sensitive electrode array (242) are directly integrated on the upper surface of the acquisition circuit board (11) or on the surface of the second flexible substrate (25) to form an electrode layer (24) thereon. The multi-modal flexible sensing film with magnetism is fixed on the upper surface of the acquisition circuit board (11) by an adhesive or a hot pressing process, or is bonded and fixed together with the second flexible substrate integrated with the electrode layer (24) by an adhesive or a hot pressing process to form an independent multi-modal flexible sensor with magnetism, which is then fixed on the upper surface of the acquisition circuit board (11) by an adhesive or a hot pressing process. The arrayed flexible pressure sensor and the flexible temperature sensor are alternately arranged on the upper surface of the acquisition circuit board (11) to form densely arranged sensing units for full-surface continuous sensing of the multi-modal flexible tactile sensor. The mixed magnetic particle adhesive film (31) is a functional elastic adhesive film with good deformation and recovery characteristics and magnetism, and contains uniformly dispersed magnetic particles inside. The thickness of the mixed magnetic particle adhesive film (31) is 50-2000 μm, and the particle size of the magnetic particles inside is ≤50 μm. 2.The multi-modal flexible tactile sensor capable of full-surface continuous sensing according to claim 1, wherein: ​ 3.The multi-modal flexible tactile sensor capable of full-surface continuous sensing according to claim 1, wherein: The sensing material of the flexible force-sensitive sensing material array is metal nanowire, two-dimensional material or carbon nanomaterial, and the thickness is 1-100 μm. 4.The multi-modal flexible tactile sensor capable of full-surface continuous sensing according to claim 1, wherein: The sensing material of the flexible temperature-sensitive sensing material array is a composite material containing nanometer conductive material and polymer, and the thickness is 1-100 μm.

5. A full-surface continuous sensing multi-modal flexible tactile sensor module, characterized in that: The full-surface continuous sensing multi-modal flexible tactile sensor and the signal processing module for signal acquisition and processing, the microprocessor for logic and function control, the power management module for voltage conversion and distribution and the communication module for communication with the host computer are integrated; the microprocessor, the power management module and the communication module are directly integrated on the collector circuit board or independently arranged in the circuit module in the base, and the full-surface continuous sensing multi-modal flexible tactile sensor is mounted and integrated on the base. 6.The multi-modal flexible tactile sensor module capable of full-surface continuous sensing according to claim 5, wherein: The sensor module is further integrated with a battery module that can be charged and discharged, and a USB interface module for signal transmission or charging the battery.

7. An embodied intelligent robot with multimodal haptic perception, characterized by: The full-surface continuous sensing multi-modal flexible tactile sensor module is integrated in the embodied intelligent robot to realize distributed measurement and sensing of three-dimensional force and temperature of the embodied intelligent robot.

8. A method for preparing a full-surface continuous sensing multi-modal flexible tactile sensor, characterized in that: The method comprises the following steps: S1: preparation of the mixed magnetic particle adhesive film: magnetic particles are added to a liquid adhesive precursor with high elasticity, and the magnetic particles are uniformly dispersed in the liquid adhesive precursor by vacuum stirring or ultrasonic stirring process, and then vulcanized and formed at 60-80 DEG C to prepare a mixed magnetic particle flexible adhesive film with a thickness of 50-2000 μm, which is then cut and formed according to actual needs to obtain a mixed magnetic particle adhesive film; S2: preparation of the multi-modal flexible sensing film: using flexible printed circuit technology, an m*n array patterned flexible force-sensitive sensing material array and an m*n array patterned flexible temperature-sensitive sensing material array are respectively made on the lower surface of the first flexible substrate, and then the mixed magnetic particle adhesive film is bonded on the upper surface of the first flexible substrate by a medical-grade adhesive or hot pressing process to prepare a multi-modal flexible sensing film with magnetism; Alternatively, an m*n array patterned flexible force-sensitive sensing material array and an m*n array patterned flexible temperature-sensitive sensing material array are directly made on the lower surface of the mixed magnetic particle adhesive film to prepare a multi-modal flexible sensing film with magnetism; The flexible force-sensitive sensing material array and the flexible temperature-sensitive sensing material array are alternately arranged; S3: preparation of the collector circuit board: a plurality of Hall sensors are welded on the lower surface of the collector circuit board by surface mounting technology to form a Hall sensor array on the lower surface of the collector circuit board; S4: preparation of the electrode layer: the electrode layer is etched on the upper surface of the collector circuit board in combination with the array patterned flexible force-sensitive sensing material array and flexible temperature-sensitive sensing material array. Or, on the upper surface of the second flexible substrate, the electrode layer is prepared by printing electronic technology; S5: Layered assembly: through medical grade adhesive or hot pressing process, the multi-modal flexible sensing film with magnetic properties is fixedly arranged on the upper surface of the collector circuit board, to obtain a multi-modal flexible tactile sensor capable of full-surface continuous sensing according to claim 1; subsequently, through the medical grade adhesive, fastener, and tie, the multi-modal flexible tactile sensor capable of full-surface continuous sensing is fixedly arranged on the base, to obtain a multi-modal flexible tactile sensing module capable of full-surface continuous sensing according to claim 5.

9. The method of claim 8, wherein the method further comprises: Further comprising the following steps: S6: Film protection: the multi-modal flexible tactile sensor capable of full-surface continuous sensing or the multi-modal flexible tactile sensing module capable of full-surface continuous sensing is wrapped and packaged by using a biocompatible flexible packaging material; Or, a light, thin, and breathable flexible packaging material is used for packaging protection.

10. The method of claim 8, wherein the method further comprises: coating the first and second electrodes with a flexible material. In step S1, the preparation of the mixed magnetic particle adhesive film can also be performed by uniformly mixing magnetic particles with a rubber matrix, and then through a calendering process, a flexible adhesive film of mixed magnetic particles is prepared, and subsequently, according to actual requirements, the desired size is cut, and a gradient magnetization method is used for magnetization treatment, to obtain a mixed magnetic particle adhesive film with a magnetic field.

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