A head binding device, a correction mounting system and a die bonding apparatus

Abstract

The application relates to a head binding device, a correction mounting system and a die bonding equipment. The head binding device is used for picking up a chip and mounting the chip to a substrate, and comprises a driving assembly, a working assembly and a suction nozzle assembly. The two ends of the working assembly are connected with the driving assembly and the suction nozzle assembly respectively. The working assembly comprises a rotating seat, a first elastic member and an air floating bearing. A rotating shaft is arranged in the rotating seat and is slidably installed in the rotating seat. The two ends of the rotating shaft are a transmission end and a working end respectively. The transmission end of the rotating shaft is connected with the driving assembly, and the working end of the rotating shaft is connected with the suction nozzle assembly. First and second cavities penetrating and communicating with each other are arranged on the driving assembly and the rotating shaft respectively. The air floating bearing is sleeved on the rotating shaft, and the outer side of the air floating bearing abuts against the inner wall surface of the rotating seat. One end of the first elastic member abuts against the rotating shaft, and the other end abuts against the rotating seat. When the rotating shaft and the rotating seat slide relative to each other, the first elastic member is elastically deformed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a head-binding device, a calibration and mounting system, and a die bonding device. Background Technology

[0002] Lead bonding devices are indispensable equipment in the integrated circuit packaging process. They are mainly used in the semiconductor industry for picking up and placing chips during the automated chip placement process. Chip picking involves using the nozzle of the lead bonding device to remove the chip from the wafer, while chip placement involves placing the removed chip onto the lead frame.

[0003] However, existing bonding head devices are not effective in aligning chips to the corresponding positions on the lead frame for mounting, making it difficult to meet the high precision requirements of chip mounting. In view of this, the present invention provides a bonding head device with high chip mounting precision, which can align the chip's upper surface and mounting position identification points in real time during mounting, thereby solving the above-mentioned technical problems. Summary of the Invention

[0004] To address the technical problem that existing chip mounters with binding heads are ineffective in aligning and mounting chips, failing to meet the high-precision requirements of chip mounting, this invention provides a binding head device, a mounting method, and a die bonding device.

[0005] The present invention provides a bonding device for picking up chips and mounting them onto a substrate. The bonding device includes a drive assembly, a working assembly, and a nozzle assembly. The two ends of the working assembly are connected to the drive assembly and the nozzle assembly, respectively. The working assembly includes a rotating base, a first elastic element, and an air bearing. A rotating shaft is provided inside the rotating base and is slidably mounted therein. The two ends of the rotating shaft are a transmission end and a working end, respectively. The transmission end of the rotating shaft is connected to the drive assembly, and the working end of the rotating shaft is connected to the nozzle assembly. The drive assembly and the rotating shaft are respectively provided with a through-hole and communicating first cavity and second cavity. The air bearing is sleeved on the rotating shaft, and the outer side of the air bearing abuts against the inner wall of the rotating base. One end of the first elastic element abuts against the rotating shaft, and the other end abuts against the rotating base. When the rotating shaft slides relative to the rotating base, the first elastic element undergoes elastic deformation.

[0006] Preferably, the head-binding device further includes a guide assembly, which includes a guide shaft, a guide bearing, and a guide block. One end of the guide shaft is fixed to the rotating shaft, and the guide bearing is sleeved on the other end of the guide shaft. The guide shaft and the first elastic element are respectively disposed on both sides of the rotating shaft in the length direction. The guide shaft is perpendicular to the rotating shaft, and the first elastic element is parallel to the rotating shaft, with the deformation direction of the first elastic element being the same as the sliding direction of the rotating shaft. The rotating seat has a hollow channel extending horizontally, and the guide shaft and the guide bearing are located in the hollow channel. The length of the hollow channel in the vertical direction is greater than the outer diameter of the guide bearing. The guide block is fixed to the rotating seat and abuts against the outer ring of the guide bearing. When the rotating shaft slides relative to the rotating seat, the guide bearing can slide relative to the guide block.

[0007] Preferably, the drive assembly includes a hollow rotary motor and a connector. A fixed base is provided between the rotary motor and the connector, and the rotary motor is mounted on the fixed base. The rotary motor, the fixed base, and the connector are arranged in sequence. A first limiting block is provided on the side of the fixed base facing the connector, and a second limiting block is provided on the outer peripheral surface of the connector. When the rotary motor is working, the first limiting block and the second limiting block cooperate to make the rotation angle range of the rotary motor drive range from 0° to 240°.

[0008] Preferably, the head-binding device further includes a self-weight balancing component, which includes a balance shaft and a second elastic element. The balance shaft passes through the hollow channel and is perpendicular to the guide shaft and the rotating shaft, respectively. One end of the second elastic element is connected to the bottom of the connector, and the other end is connected to the balance shaft. The rotating shaft is provided with a placement groove. The bottom end of the first elastic element abuts against the bottom wall of the placement groove, the side of the first elastic element abuts against the side wall of the placement groove, and the top end of the first elastic element abuts against the outer bottom wall of the rotating seat. The first elastic element is a compression spring, and the second elastic element is a tension spring.

[0009] Preferably, the suction nozzle assembly includes an adsorption component and a vacuum nozzle connected to one end of the adsorption component, the other end of the adsorption component being connected to the rotating shaft, and the vacuum nozzle being at least partially transparent; the adsorption component includes an air passage guide seat, a first transparent seal, and a sealing ring, the first transparent seal being sealed and fixed between the air passage guide seat and the rotating shaft, the end of the air passage guide seat away from the first transparent seal being detachably connected to the vacuum nozzle, and the sealing ring being sleeved on the outside of the first transparent seal.

[0010] Preferably, the binding device further includes a ventilation component, which includes a first air pipe connector disposed on the air bearing. The first air pipe connector has a first air inlet for the air bearing to receive air. The first air inlet is connected to the internal air passage of the air bearing through the first air pipe connector.

[0011] Preferably, the ventilation assembly further includes a second air pipe connector and a third air pipe connector disposed on the rotating shaft near one end of the vacuum nozzle. The second air pipe connector has a second air inlet, and the third air pipe connector has a third air inlet. The second air inlet passes through the rotating shaft, the air passage guide seat, and the internal air passage of the vacuum nozzle in sequence before communicating with the outside, forming a nozzle adsorption air passage. The third air inlet passes through the rotating shaft, the air passage guide seat, and the internal air passage of the vacuum nozzle in sequence before communicating with the outside, forming a material adsorption air passage. The nozzle adsorption air passage and the material adsorption air passage are not interconnected.

[0012] Preferably, the head-binding device further includes a force control detection component, which includes a cooperating position sensor and a magnetic component; the outer surface of the rotating base is provided with a first positioning component, and the outer surface of the rotating shaft is provided with a second positioning component, the first positioning component being disposed vertically corresponding to the second positioning component and having a gap; the position sensor is mounted on the first positioning component, the magnetic component is mounted on the second positioning component, and the magnetic component is disposed corresponding to the working end of the position sensor.

[0013] The present invention also provides a calibration mounting system for calibrating the angle of a chip during pickup and mounting. The calibration mounting system includes a vision calibration component and the aforementioned head-binding device. The vision calibration component is disposed at the end of the first cavity away from the nozzle component.

[0014] The present invention also provides a die bonding device, which includes the above-described head-binding device.

[0015] Compared with the prior art, the head-binding device, correction and mounting system, and die bonding equipment provided by the present invention have the following advantages:

[0016] 1. This invention provides a bonding head device for picking up chips and mounting them onto a substrate. The bonding head device includes a driving assembly, a working assembly, and a nozzle assembly. The working assembly includes a rotating base, a first elastic element, and an air bearing. A rotating shaft is provided inside the rotating base and is slidably mounted therein. The two ends of the first elastic element abut against the rotating shaft and the rotating base, respectively. When the rotating shaft and the rotating base slide relative to each other, the first elastic element undergoes elastic deformation to provide a buffering effect, preventing excessive mounting pressure during placement from damaging the chip and / or substrate. It has high force control efficiency and occupies less internal space in the bonding head device. The air bearing is sleeved on the rotating shaft, providing high-precision guiding constraints for the rotating shaft and reducing radial offset when the rotating shaft moves in the vertical direction. This design enhances the stability of the rotating shaft during lifting and rotation. The outer side of the air bearing also abuts against the inner wall of the rotating seat, reducing friction between the rotating shaft and the rotating seat and making the sliding of the rotating shaft relative to the rotating seat smoother. This reduces the impact of vertical motion resistance on the mounting pressure during the operation of the bonding head device, improving the accuracy of the bonding head device in placing the chip onto the substrate. The first cavity on the drive assembly and the second cavity on the rotating shaft are connected and penetrate each other, enabling the chip and substrate positions, as well as the corresponding mounting position identification points, to be identified from directly above the chip after the chip is picked up and adsorbed at the working end of the rotating shaft. This allows for real-time alignment and mounting, improving the mounting accuracy of the bonding head device and meeting the high-precision requirements of chip mounting.

[0017] 2. In the binding device provided in this embodiment of the invention, the guiding component includes a guide shaft, a guide bearing, and a guide block. The guiding component can provide guidance for the rotating shaft in the vertical direction. The overall structure helps to ensure the stability and accuracy of the working end of the rotating shaft in the vertical direction, thereby improving the accuracy of chip mounting. One end of the guide shaft is fixed to the rotating shaft, and the guide shaft is set perpendicular to the rotating shaft. This can accurately limit the direction of movement of the rotating shaft, prevent the rotating shaft from deviating during movement, and improve the mounting guidance accuracy of the binding device in the vertical direction. The length of the hollow channel in the vertical direction is greater than the outer diameter of the guide bearing. The guide bearing can limit the sliding stroke of the rotating shaft, further providing accurate guidance for the vertical movement of the rotating shaft and preventing excessive sliding of the rotating shaft in the vertical direction, which would reduce the mounting force. Excessive force protects the chip and substrate; furthermore, the guide bearing is sleeved on the other end of the guide shaft, and the guide block is fixed on the rotating seat and abuts against the outer ring of the guide bearing, so that the guide bearing can only slide in the vertical direction relative to the guide block and cannot rotate relative to it. Through this design, the rotation shaft can be prevented from shifting in the horizontal direction. Setting the guide bearing can reduce friction during the movement, making the vertical movement of the rotation shaft smoother, and further preventing the rotation shaft from shaking during the movement; the guide shaft and the first elastic element are respectively located on both sides of the rotation shaft in the length direction, and the first elastic element is arranged parallel to the rotation shaft. The deformation direction of the first elastic element is the same as the sliding direction of the rotation shaft, which can balance the force on the rotation shaft, making the sliding of the rotation shaft in the hollow channel more stable, and further ensuring the mounting accuracy.

[0018] 3. In the head-binding device provided in this embodiment of the invention, the fixed seat is disposed between the rotary motor and the connector. The rotary motor, fixed seat, and connector are arranged sequentially. The rotary motor is installed on the fixed seat, and the structural connection is stable. This ensures that the power of the rotary motor is accurately transmitted to the rotary shaft through the connector, thereby improving the motion stability of the rotary shaft. The first limiting block and the second limiting block cooperate to limit the rotation angle driven by the rotary motor to 0° to 240°. This can accurately control the rotation range of the nozzle assembly, meet the angle positioning requirements of chip mounting, and, under the premise that the rotation angle driven by the rotary motor meets the mounting requirements, prevent the wires on the head-binding device from getting tangled, thus affecting the safety of the head-binding device. The limiting structure can also prevent the rotary motor from rotating excessively, extending the service life of the head-binding device.

[0019] 4. In the head-binding device provided in the embodiments of the present invention, the balance shaft and the second elastic element are exposed in the working component. The balance shaft passes through the hollow channel and is perpendicular to the guide shaft and the rotating shaft respectively. One end of the second elastic element is connected to the bottom of the connecting member, and the other end is connected to the balance shaft. That is, the force of the second elastic element can drive the balance shaft to move, thereby driving the rotating shaft to elastically reset in the vertical direction, balancing the weight of the rotating shaft and the weight of the load on the rotating shaft.

[0020] Understandably, the first elastic element is set in the placement groove opened on the rotating shaft. The bottom end of the first elastic element is connected to the rotating shaft, and the top end is connected to the rotating seat. The rotating shaft and the rotating seat can slide relative to each other through the first elastic element. The first elastic element is a compression spring, and the second elastic element is a tension spring. In this embodiment of the invention, the compression spring is used as the driving force for the bonding pressure. Combined with the weight ratio of the tension spring, the adjustable range of the bonding pressure can be expanded, and the high precision requirement of the chip mounting force can be guaranteed.

[0021] 5. In the binding head device provided in this embodiment of the invention, when using the binding head device to pick up and mount chips, the air passage seat is responsible for adsorbing the vacuum nozzle, and the vacuum nozzle adsorbs the chip to achieve chip picking and mounting; a first transparent sealing element is placed on the end of the air passage seat away from the vacuum nozzle to prevent vacuum leakage. The first transparent sealing element is sealed and fixed between the air passage seat and the rotating shaft. Before chip mounting, the calibration device can sequentially pass through the first cavity, the second cavity and the first transparent sealing element to perform feature recognition. Feature recognition includes the identification points of the chip and the mounting position, thereby improving the mounting accuracy of the binding head device; a sealing ring is sleeved on the outside of the first transparent sealing element, and the sealing ring seals and fixes the first transparent sealing element between the air passage seat and the rotating shaft to ensure that the first transparent sealing element has good vacuum sealing performance.

[0022] 6. In the head-binding device provided in the embodiments of the present invention, the first air pipe connector is provided with a first air passage. The first air passage is connected to the internal air passage of the air bearing through the first air pipe connector, which can stably supply air to the air bearing, ensure the normal operation of the air bearing and improve the motion accuracy of the rotating shaft. The separate air inlet of the air bearing can avoid mutual interference between the air inlet of the air bearing and the vacuum passage of the suction nozzle assembly, and ensure the independence and stability of each air passage.

[0023] 7. In the binding device provided in this embodiment of the invention, the second air pipe connector is provided with a second air port. The second air port passes through the rotating shaft, the air passage guide seat and the internal air passage of the vacuum nozzle in sequence and then connects to the outside to form a nozzle adsorption air passage. The second air port can draw a vacuum for the vacuum nozzle, reduce the influence of the vacuum air passage of the nozzle on the placement force control process, and avoid the vacuum nozzle from shifting when picking up and placing chips. Through this design, on the one hand, the sealing of the vacuum nozzle can be guaranteed, so as to ensure the stability of chip adsorption when the vacuum nozzle picks up and places chips, and improve the overall stability and reliability of the binding device. On the other hand, it can ensure that the vacuum nozzle and the rotating shaft remain relatively stationary, so that when the chip and the substrate are in contact, they will not be affected by the adsorption air passage of the nozzle, thereby avoiding errors.

[0024] Understandably, the third air connector has a third air inlet. This third air inlet connects to the outside world after passing through the rotating shaft, the air passage guide seat, and the internal air passage of the vacuum nozzle, forming a material adsorption air passage. This third air inlet allows the chip to be stably attached to the working end of the vacuum nozzle, thereby enabling the vacuum nozzle to pick up and mount the chip. Furthermore, it allows for better adjustment of the mounting angle during chip mounting. This design ensures the rigidity of the bonding head device for deep cavity chip mounting, meeting the high-precision requirements of chip mounting position. It should be noted that the nozzle adsorption air passage and the material adsorption air passage are not interconnected; that is, the air passages for adsorbing the vacuum nozzle and adsorbing the chip are independent of each other, allowing for separate adsorption of the vacuum nozzle and adsorption of the chip by the vacuum nozzle.

[0025] 8. In the head-binding device provided in the embodiments of the present invention, the outer surfaces of the rotating seat and the rotating shaft are respectively provided with a first positioning component and a second positioning component. The position sensor is installed on the first positioning component, and the magnetic component is installed on the second positioning component. Through the cooperation of the position sensor and the magnetic component, the positioning detection can be realized when the chip contacts the substrate when the head-binding device presses down. Compared with the use of ordinary photoelectric sensors, the position sensor is smaller in size and has a faster response speed. The non-contact sensing measurement method also has the characteristics of high sensitivity and anti-electromagnetic interference, no risk of physical wear, and long service life. The position sensor and the magnetic component have small structural volume and flexible installation, and do not occupy a lot of space in the head-binding device, which is conducive to the overall miniaturization design of the equipment.

[0026] 9. This embodiment of the invention also provides a calibration mounting system for correcting the angle of chips during pickup and mounting. The calibration mounting system includes a vision correction component and the aforementioned head-binding device. The vision correction component is disposed at the end of the first cavity away from the nozzle assembly. It should be noted that this calibration mounting system has the same beneficial effects as the aforementioned head-binding device, and will not be described in detail here.

[0027] 10. This embodiment of the invention also provides a die bonding apparatus, including the aforementioned head-binding device. It should be noted that this die bonding apparatus has the same beneficial effects as the aforementioned head-binding device, and will not be described in detail here. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the overall structure of the head-binding device according to an embodiment of the present invention. Figure 1 .

[0030] Figure 2 This is a cross-sectional view of the head-binding device according to an embodiment of the present invention, including its internal structure.

[0031] Figure 3 This is a schematic diagram of the overall structure of the head-binding device according to an embodiment of the present invention. Figure 2 .

[0032] Figure 4 yes Figure 2 Enlarged view of section A.

[0033] Figure 5 This is a schematic diagram of the overall structure of the head-binding device according to an embodiment of the present invention. Figure 3 .

[0034] Figure 6 This is a schematic diagram of the overall structure of the calibration and mounting system according to an embodiment of the present invention.

[0035] Figure 7 This is a schematic diagram of the overall framework of the die bonding device according to an embodiment of the present invention.

[0036] Explanation of reference numerals in the attached diagram:

[0037] 10. Header binding device; 20. Alignment and mounting system; 30. Die bonding equipment;

[0038] 1. Drive assembly; 11. First cavity; 12. Rotary motor; 13. Connector; 131. Second limiting block; 14. Fixed seat; 141. First limiting block; 2. Working assembly; 21. Rotary seat; 211. Rotary shaft; 2111. Second cavity; 2112. Placement slot; 2113. Second positioning element; 212. First positioning element; 213. Hollow channel; 22. First elastic element; 23. Air bearing;

[0039] 3. Suction nozzle assembly; 31. Adsorption assembly; 311. Air passage guide seat; 312. First transparent seal; 313. Sealing ring; 32. Vacuum nozzle; 321. Observation channel; 322. Second transparent seal; 4. Guide assembly; 41. Guide shaft; 42. Guide bearing; 43. Guide block; 5. Self-weight balance assembly; 51. Balance shaft; 52. Second elastic element; 6. Ventilation assembly; 61. First air pipe connector; 611. First air passage; 62. Second air pipe connector; 621. Second air passage; 63. Third air pipe connector; 631. Third air passage; 7. Force control detection assembly; 71. Position sensor; 72. Magnetic element; 8. Visual correction assembly. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information. It should be understood that "an embodiment" or "one embodiment" mentioned throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in one embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the invention. In the various embodiments of this invention, it should be understood that the sequence number of the above processes does not necessarily imply a necessary order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this invention. The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0041] Please see Figure 1 and Figure 2This invention provides a chip-binding device 10 for picking up chips and mounting them onto a substrate. The chip-binding device 10 includes a drive assembly 1, a working assembly 2, and a nozzle assembly 3. The two ends of the working assembly 2 are connected to the drive assembly 1 and the nozzle assembly 3, respectively. The working assembly 2 includes a rotating base 21, a first elastic element 22, and an air bearing 23. A rotating shaft 211 is provided inside the rotating base 21 and is slidably mounted therein. The two ends of the rotating shaft 211 are a transmission end and a working end, respectively. The transmission end is connected to the drive assembly 1, and the working end of the rotating shaft 211 is connected to the suction nozzle assembly 3. The drive assembly 1 and the rotating shaft 211 are respectively provided with a through and connected first cavity 11 and a second cavity 2111. The air bearing 23 is sleeved on the rotating shaft 211, and the outer side of the air bearing 23 abuts against the inner wall surface of the rotating seat 21. One end of the first elastic member 22 abuts against the rotating shaft 211, and the other end abuts against the rotating seat 21. When the rotating shaft 211 and the rotating seat 21 slide relative to each other, the first elastic member 22 undergoes elastic deformation.

[0042] The chip-binding device 10 provided in this embodiment of the invention can be used for chip picking and placement in the automated placement process of the semiconductor industry. The chip-binding device 10 is applied in applications requiring high-precision chip placement. When picking up and adsorbing the chip, it can expose the features that need to be identified, and when placing the chip, it can realize a placement process that aligns the chip's upper surface and the identification points of the placement position in real time.

[0043] Specifically, the working component 2 includes a rotating base 21, within which a rotating shaft 211 is provided. The rotating shaft 211 is slidably mounted within the rotating base 21 and can move up and down relative to the rotating base 21. The working end of the rotating shaft 211 is exposed outside the rotating base 21. The working end of the rotating shaft 211 is connected to the nozzle assembly 3 and can be connected to nozzles of different specifications to adsorb different types of chips. The nozzle is responsible for picking up and adsorbing chips and completing chip mounting. The transmission end of the rotating shaft 211 is connected to the drive assembly 1, which can control the rotation of the rotating shaft 211 to correct the chip angle when picking up or mounting chips. During the vertical movement of the rotating shaft 211 relative to the rotating base 21, only minor adjustments are made. When the entire binding head device 10 descends until the nozzle at the working end of the rotating shaft 211 reaches the chip pickup or placement position and the nozzle presses against the chip and exerts downward pressure on it, the nozzle assembly 3 pushes the rotating shaft 211 upward relative to the rotating base 21. After one chip placement is completed, the entire binding head device 10 rises, causing the downward pressure of the nozzle on the chip to gradually decrease until it disappears. Then, the rotating shaft 211 is subjected to gravity and descends relative to the rotating base 21.

[0044] Furthermore, the working component 2 also includes a first elastic element 22 and an air bearing 23. The two ends of the first elastic element 22 abut against the rotating shaft 211 and the rotating seat 21 respectively. When the rotating shaft 211 and the rotating seat 21 slide relative to each other, the first elastic element 22 undergoes elastic deformation to provide a buffering effect, avoiding excessive mounting pressure during mounting and damage to the chip and / or substrate. It has high force control efficiency and occupies less internal space in the binding head device 10, which is conducive to the miniaturization of the binding head device 10.

[0045] It should be noted that the air bearing 23 is sleeved on the rotating shaft 211, which can provide high-precision guiding constraints for the rotating shaft 211, reduce the radial offset of the rotating shaft 211 when it moves in the vertical direction, and improve the stability of the rotating shaft 211 when it completes lifting and rotating actions. The outer side of the air bearing 23 also abuts against the inner wall surface of the rotating seat 21, which can reduce the friction between the rotating shaft 211 and the rotating seat 21, making the sliding of the rotating shaft 211 relative to the rotating seat 21 smoother. During the operation of the binding head device 10, the influence of vertical movement resistance on the mounting pressure is reduced, and the accuracy of the mounting pressure of the binding head device 10 when mounting the chip to the substrate is improved.

[0046] Understandably, the first cavity 11 on the drive assembly 1 and the second cavity 2111 on the rotating shaft 211 are connected and penetrate each other. This allows the chip to be picked up and adsorbed at the working end of the rotating shaft 211, and the position of the chip, the substrate and the corresponding mounting position identification point can be identified from directly above the chip by the calibration device. This enables real-time alignment and mounting, improves the mounting accuracy of the binding head device 10 and meets the high-precision requirements of chip mounting.

[0047] Please continue reading. Figure 1 , Figure 2 and Figure 3 The head-binding device 10 also includes a guide assembly 4, which includes a guide shaft 41, a guide bearing 42, and a guide block 43. One end of the guide shaft 41 is fixed to the rotating shaft 211, and the guide bearing 42 is sleeved on the other end of the guide shaft 41. The guide shaft 41 and the first elastic member 22 are respectively disposed on both sides of the rotating shaft 211 in the length direction. The guide shaft 41 is perpendicular to the rotating shaft 211, and the first elastic member 22 is parallel to the rotating shaft 211. The deformation direction of the first elastic member 22 is the same as the sliding direction of the rotating shaft 211.

[0048] Furthermore, the rotating seat 21 is provided with a hollow channel 213 that runs horizontally through it. The guide shaft 41 and the guide bearing 42 are located in the hollow channel 213. The length of the hollow channel 213 in the vertical direction is greater than the outer diameter of the guide bearing 42. The guide block 43 is fixedly mounted on the rotating seat 21 and abuts against the outer ring of the guide bearing 42. When the rotating shaft 211 slides relative to the rotating seat 21, the guide bearing 42 can slide relative to the guide block 43.

[0049] In the binding device 10 provided in this embodiment of the invention, the guide component 4 can provide guidance for the rotating shaft 211 in the vertical direction. The overall structure helps to ensure the stability and accuracy of the working end of the rotating shaft 211 in the vertical direction, thereby improving the chip mounting accuracy. One end of the guide shaft 41 is fixed to the rotating shaft 211, and the other end of the guide shaft 41 is sleeved by the guide bearing 42. The guide shaft 41 is set perpendicular to the rotating shaft 211, which can accurately limit the movement direction of the rotating shaft 211, prevent the rotating shaft 211 from deviating during the movement, and improve the mounting guidance accuracy of the binding device 10 in the vertical direction.

[0050] Specifically, the vertical length of the hollow channel 213 is greater than the outer diameter of the guide bearing 42. The guide bearing 42 can limit the sliding stroke of the rotating shaft 211, further providing precise guidance for the vertical movement of the rotating shaft 211. This prevents the rotating shaft 211 from sliding excessively in the vertical direction, which would result in excessive mounting force and protect the chip and substrate. It can be understood that the guide bearing 42 is sleeved on the guide shaft 41 at the end away from the rotating shaft 211. The guide block 43 is fixedly mounted on the rotating seat 21 and abuts against the outer ring of the guide bearing 42. This allows the guide bearing 42 to slide only relative to the guide block 43 in the vertical direction and not to rotate relative to it. Through this design, the horizontal offset of the rotating shaft 211 can be avoided. The guide bearing 42 reduces friction during movement, making the vertical movement of the rotating shaft 211 smoother and further preventing the rotating shaft 211 from shaking during movement.

[0051] It should be noted that the vertical arrangement of the guide shaft 41 and the rotating shaft 211, and the engagement of the outer ring of the guide bearing 42 with the rotating seat 21, forms a stable structure with multi-directional constraints. This structure can counteract the lateral force that may be generated at the working end of the rotating shaft 211 during the mounting process, further suppressing the slight wobbling of the rotating shaft 211 and ensuring the positional accuracy of the binding head device 10 at the moment of mounting.

[0052] In the embodiments of the present invention, the guide shaft 41 and the first elastic element 22 are respectively located on both sides of the rotating shaft 211 in the length direction, and the first elastic element 22 is arranged parallel to the rotating shaft 211 to avoid mutual interference between the guide shaft 41 and the first elastic element 22 affecting the chip picking and corresponding mounting effect of the binding head device 10; the deformation direction of the first elastic element 22 is the same as the sliding direction of the rotating shaft 211, which can balance the force on the rotating shaft 211 in its sliding direction, making the sliding of the rotating shaft 211 in the hollow channel 213 more stable, and further ensuring the mounting accuracy.

[0053] In some embodiments, the top and bottom of the hollow channel 213 are provided with limits for the guide bearing 42. The guide bearing 42 can slide up and down in the vertical direction by a distance of 2mm to 4mm, preferably 3mm, which is suitable for the force control stroke range required for most types of chip mounting. By setting the upper and lower limits to prevent exceeding the force control stroke, on the one hand, it can avoid over-pressure and damage to the chip and / or substrate, and on the other hand, it can enhance the safety and durability of the guide assembly 4 and extend the service life of the binding head device 10.

[0054] In some embodiments, the number of guide bearings 42 is at least two, and the guide bearings 42 do not slide relative to the guide shaft 41 after being fitted. It can be understood that the purpose of setting the guide bearings 42 is mainly to limit the sliding stroke of the rotating shaft 211 and improve the stability of the binding device 10 during the mounting process. Therefore, the number of guide bearings 42 can be determined according to actual needs. When increasing the number of guide bearings 42, it is only necessary to adjust the length of the guide shaft 41 accordingly so that the guide bearings 42 do not slide relative to the guide shaft 41 when fitted. The specific implementation of this embodiment cannot be used to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

[0055] Please continue reading. Figure 1 and Figure 2 The drive assembly 1 includes a hollow rotary motor 12 and a connector 13. A fixed seat 14 is provided between the rotary motor 12 and the connector 13. The rotary motor 12 is mounted on the fixed seat 14. The rotary motor 12, the fixed seat 14 and the connector 13 are arranged in sequence.

[0056] In the head-binding device 10 provided in this embodiment of the invention, the fixed seat 14 is disposed between the rotary motor 12 and the connector 13. The rotary motor 12, the fixed seat 14 and the connector 13 are arranged in sequence. The rotary motor 12 is installed on the fixed seat 14, and the structure is firmly connected, which can ensure that the power of the rotary motor 12 is accurately transmitted to the rotary shaft 211 through the connector 13, thereby improving the motion stability of the rotary shaft 211.

[0057] Furthermore, a first limiting block 141 is provided on the side of the fixed base 14 facing the connector 13, and a second limiting block 131 is provided on the outer peripheral surface of the connector 13. When the rotary motor 12 is working, the first limiting block 141 and the second limiting block 131 cooperate to make the rotation angle driven by the rotary motor 12 range from 0° to 240°.

[0058] Understandably, the first limiting block 141 and the second limiting block 131 cooperate to limit the rotation angle driven by the rotary motor 12 to 0° to 240°, which can precisely control the rotation range of the nozzle assembly 3, meet the angle positioning requirements of chip mounting, and, under the premise that the rotation angle driven by the rotary motor 12 meets the mounting requirements, avoid the wires on the binding head device 10 from getting tangled, thereby affecting the safety of the binding head device 10.

[0059] In some embodiments, there are two first limiting blocks 141 and one second limiting block 131. The two first limiting blocks 141 are symmetrically arranged, and the non-rotatable wire on the binding device 10 is located between the first limiting blocks 141. When the rotary motor 12 is working, it will drive the connector 13 to rotate. When the second limiting block 131 abuts against one of the first limiting blocks 141, the rotary motor 12 can only drive the connector 13 to rotate in the other direction until the second limiting block 131 abuts against the other first limiting block 141. During this process, the rotary motor 12 drives the second limiting block 131 to rotate by an angle of 240°. It should be noted that when the binding device 10 of this embodiment is assembled for the first time, the original position of the second limiting block 131 is on the axis of symmetry of the two first limiting blocks 141. The second limiting block 131 can rotate ±120° to abut against the two symmetrically arranged first limiting blocks 141 respectively. The limiting structure composed of the first limiting block 141 and the second limiting block 131 can also prevent the working end of the rotary motor 12 from rotating excessively and extend the service life of the head-binding device 10.

[0060] Please see Figure 1 , Figure 2 , Figure 3 as well as Figure 4 The head-binding device 10 also includes a self-weight balancing component 5, which includes a balance shaft 51 and a second elastic element 52. The balance shaft 51 passes through the hollow channel 213 and is perpendicular to the guide shaft 41 and the rotating shaft 211 respectively. One end of the second elastic element 52 is connected to the bottom of the connector 13, and the other end is connected to the balance shaft 51.

[0061] In the head-binding device 10 provided in this embodiment of the invention, the balance shaft 51 and the second elastic element 52 are exposed in the working component 2. One end of the second elastic element 52 is connected to the bottom of the connector 13, and the other end of the second elastic element 52 is connected to the balance shaft 51. The balance shaft 51 passes through the hollow channel 213 and is perpendicular to the guide shaft 41 and the rotating shaft 211 respectively. That is, the force of the second elastic element 52 can drive the balance shaft 51 to move, thereby driving the rotating shaft 211 to elastically reset in the vertical direction, balancing the weight of the rotating shaft 211 and the weight of the load on the rotating shaft 211.

[0062] The hollow channel 213 integrates a balance shaft 51, a guide shaft 41, and a guide bearing 42, which makes the structural layout of the guide assembly 4 more compact and does not occupy the external space of the binding device 10. This is conducive to the miniaturization and integration of the binding device 10 as a whole. The centralized layout of each component also facilitates later maintenance and replacement, further reducing the maintenance cost of the binding device 10.

[0063] Furthermore, the rotating shaft 211 is provided with a placement groove 2112. The bottom end of the first elastic member 22 abuts against the bottom wall of the placement groove 2112, the side of the first elastic member 22 abuts against the side wall of the placement groove 2112, and the top end of the first elastic member 22 abuts against the outer bottom wall of the rotating seat 21. Understandably, the first elastic member 22 is disposed within the placement groove 2112 opened on the rotating shaft 211. The bottom end of the first elastic member 22 is connected to the rotating shaft 211, and the top end is connected to the rotating seat 21. The rotating shaft 211 and the rotating seat 21 can slide relative to each other through the first elastic member 22.

[0064] In some embodiments, the first elastic element 22 is a compression spring, and the second elastic element 52 is a tension spring. By employing a compression spring as the driving force for the bonding pressure, combined with the weight ratio of the tension spring, this embodiment of the invention can both expand the adjustable range of the bonding pressure and ensure the high precision required for chip mounting force.

[0065] Please see Figure 2 and Figure 4 The suction nozzle assembly 3 includes an adsorption assembly 31 and a vacuum nozzle 32 connected to one end of the adsorption assembly 31. The other end of the adsorption assembly 31 is connected to the rotating shaft 211. The vacuum nozzle 32 is at least partially transparent. The adsorption assembly 31 includes an air passage seat 311, a first transparent seal 312, and a sealing ring 313. The first transparent seal 312 is sealed and fixed between the air passage seat 311 and the rotating shaft 211. The end of the air passage seat 311 away from the first transparent seal 312 is detachably connected to the vacuum nozzle 32. The sealing ring 313 is sleeved on the outside of the first transparent seal 312.

[0066] In the head-binding device 10 provided in this embodiment of the invention, when using the head-binding device 10 to pick up and mount chips, the air passage conduction seat 311 is responsible for adsorbing the vacuum nozzle 32, and the vacuum nozzle 32 adsorbs the chip to realize the chip picking up and mounting.

[0067] Understandably, by setting the first transparent seal 312 and placing it on the end of the air passage seat 311 away from the vacuum nozzle 32, vacuum leakage can be prevented. The first transparent seal 312 is sealed and fixed between the air passage seat 311 and the rotating shaft 211. Before chip mounting, the calibration device can sequentially pass through the first cavity 11, the second cavity 2111, and the first transparent seal 312 to perform feature identification. Feature identification includes the identification points of the chip and the mounting position, thereby improving the mounting accuracy of the binding head device 10. The sealing ring 313 is sleeved on the outside of the first transparent seal 312. The sealing ring 313 seals and fixes the first transparent seal 312 between the air passage seat 311 and the rotating shaft 211 to ensure that the first transparent seal 312 has good vacuum sealing performance. The sealing ring 313 in this embodiment of the invention can be a nano sealing ring. As an important sealing element, its main functions include preventing leakage or seepage of liquid or gas, maintaining a pressure difference or even a complete vacuum between the inside of the device and the outside, and preventing the entry of pollutants and dust.

[0068] In some embodiments, the first transparent sealing element 312 used in the binding device 10 is high-transmittance glass with a light transmittance of at least 99%, which satisfies the feature recognition of the chip and the mounting position identification point by the calibration device, and further ensures the accuracy of chip mounting.

[0069] In some embodiments, the vacuum nozzle 32 is partially transparent or completely transparent. When the vacuum nozzle 32 is partially transparent, it also satisfies the requirement that the calibration device sequentially passes through the first cavity 11, the second cavity 2111, and the first transparent seal 312 to perform feature recognition. That is, the transparent part of the vacuum nozzle 32 at least exposes the chip and the identification point of its mounting position. In the embodiments of the present invention, the vacuum nozzle 32 is completely transparent in order to eliminate visual errors of the calibration device. The higher alignment accuracy can reduce defects such as bridging, open circuits, and poor soldering caused by misalignment.

[0070] In some embodiments, the vacuum nozzle 32 is further provided with an observation channel 321 extending through both ends in the vertical direction. A second transparent sealing member 322 is provided on the side of the vacuum nozzle 32 near the air passage seat 311. The second transparent sealing member 322 is sealed and fixed to the vacuum nozzle 32 to prevent vacuum leakage from the observation channel 321, which would affect the adsorption effect of the vacuum nozzle 32 and / or the chip. In this embodiment of the invention, the observation channel 321 is opened on the vacuum nozzle 32. The identification features of the substrate that needs to be aligned during subsequent mounting can be observed sequentially through the first cavity 11, the second cavity 2111, the adsorption component 31 and the observation channel 321.

[0071] Optionally, the head-binding device 10 also includes a device for replacing the vacuum nozzle 32, such as a nozzle holder assembly. The end of the air passage guide seat 311 away from the first transparent seal 312 can be connected to vacuum nozzles 32 of different sizes. The replacement of the vacuum nozzle 32 can be automatic or manual, depending on the actual situation. By setting the nozzle holder assembly, it is possible to meet the requirement of compatible replacement of vacuum nozzles 32 of different sizes.

[0072] Please see Figure 1 , Figure 2 and Figure 5 The binding device 10 also includes a ventilation component 6, which includes a first air pipe connector 61 disposed on the air bearing 23. The first air pipe connector 61 is provided with a first air passage 611, which is used for air intake of the air bearing 23. The first air passage 611 is connected to the internal air passage of the air bearing 23 through the first air pipe connector 61.

[0073] In the head-binding device 10 provided in the embodiment of the present invention, the first air pipe connector 61 is provided with a first air passage 611. The first air passage 611 is connected to the internal air passage of the air bearing 23 through the first air pipe connector 61, which can stably supply air to the air bearing 23, ensure the normal operation of the air bearing 23, and improve the motion accuracy of the rotating shaft 211.

[0074] Understandably, the separate air inlet of the air bearing 23 can avoid mutual interference between the air inlet of the air bearing 23 and the vacuum path of the nozzle assembly 3, ensuring the independence and stability of their respective air paths. The friction coefficient of the air bearing 23 is typically between 0.0001 and 0.0002. In this embodiment of the invention, a low-friction air bearing 23 is used as the Z-axis guide of the rotating shaft 211, which can reduce the influence of Z-axis motion resistance on the bonding pressure of the rotating shaft 211, further improving the bonding pressure accuracy of the binding head device 10.

[0075] Furthermore, the ventilation assembly 6 also includes a second air pipe connector 62 and a third air pipe connector 63 located on the rotating shaft 211 near the vacuum nozzle 32. The second air pipe connector 62 has a second air passage 621, and the third air pipe connector 63 has a third air passage 631. The second air passage 621 is connected to the outside after passing through the rotating shaft 211, the air passage guide seat 311, and the internal air passage of the vacuum nozzle 32 in sequence, forming a nozzle adsorption air passage. The third air passage 631 is connected to the outside after passing through the rotating shaft 211, the air passage guide seat 311, and the internal air passage of the vacuum nozzle 32 in sequence, forming a material adsorption air passage.

[0076] In the binding device 10 provided in this embodiment of the invention, the second air port 621 is connected to the outside after passing through the internal air passage of the rotating shaft 211, the air passage guide seat 311 and the vacuum nozzle 32 in sequence, forming a nozzle adsorption air passage. The second air port 621 can draw a vacuum for the vacuum nozzle 32, reducing the influence of the vacuum air passage of the nozzle on the placement force control process, so as to avoid the vacuum nozzle 32 from shifting when picking up and placing chips. Through this design, on the one hand, the sealing of the vacuum drawing of the vacuum nozzle 32 can be guaranteed, so as to ensure the stability of chip adsorption when the vacuum nozzle 32 picks up and places chips, thereby improving the overall stability and reliability of the binding device 10. On the other hand, it can ensure that the vacuum nozzle 32 and the rotating shaft 211 remain relatively stationary, so that when the chip and the substrate are in contact, they will not be affected by the adsorption air passage of the nozzle, thereby avoiding errors.

[0077] Understandably, the third air port 631 connects to the outside world after passing through the rotating shaft 211, the air passage guide seat 311, and the internal air passage of the vacuum nozzle 32, forming a material adsorption air passage. The third air port 631 can stably attach the chip to the working end of the vacuum nozzle 32, thereby realizing the picking up and mounting of the chip by the vacuum nozzle 32. Furthermore, it can better adjust the mounting angle during chip mounting. Through this design, the rigidity of the bonding head device 10 for deep cavity chip mounting can be guaranteed, meeting the high precision requirements of chip mounting position.

[0078] It should be noted that the suction nozzle adsorption gas path and the material adsorption gas path are not connected to each other. That is, the adsorption vacuum nozzle 32 and the adsorption chip gas path are independent of each other, so as to achieve adsorption of the vacuum nozzle 32 and adsorption of the chip by the vacuum nozzle 32 respectively. Specifically, after the vacuum nozzle 32 is in contact with the air passage connector 311 and the two are internally connected, the second air pipe connector 62 is sealed to the external air extraction device. The air extraction device is turned on to continuously extract air from the nozzle's adsorption air passage, thereby removing the gas from the rotating shaft 211, the air passage connector 311, and the internal air passage of the vacuum nozzle 32. This creates a pressure difference between the inside of the vacuum nozzle 32 and the outside atmosphere, ultimately achieving a stable connection between the vacuum nozzle 32 and the air passage connector 311. This facilitates subsequent chip pickup and mounting, ensuring the rigidity of deep cavity mounting and meeting the high-precision requirements of chip mounting position. Similarly, the chip can also be stably attached to the working end of the nozzle by sealing it with another external air extraction device through the third air pipe connector 63. This air extraction device is turned on to continuously extract air from the material adsorption air passage, removing the gas inside the material adsorption air passage.

[0079] In some embodiments, the first air pipe connector 61 is disposed on the outer peripheral surface of the air bearing 23, and the second air pipe connector 62 and the third air pipe connector 63 are disposed on the outer peripheral surface of the rotating shaft 211. The first air pipe connector 61 needs to be connected to an external air supply device through an air pipe seal connection, and the second air pipe connector 62 and the third air pipe connector 63 need to be connected to different air extraction devices through air pipe seal connections. In this embodiment of the invention, the rotation angle driven by the rotary motor 12 is limited to 0° to 240° by the cooperation of the first limiting block 141 and the second limiting block 131 to control the rotation range of the nozzle assembly 3. Under the premise that the rotation angle meets the mounting requirements, the wires between the various air pipes on the head binding device 10 can be prevented from tangling, thereby affecting the safety and stability of the head binding device 10.

[0080] Please see Figure 2 and Figure 5 The head-binding device 10 also includes a force control detection component 7, which includes a cooperating position sensor 71 and a magnetic component 72. The outer surface of the rotating seat 21 is provided with a first positioning component 212, and the outer surface of the rotating shaft 211 is provided with a second positioning component 2113. The first positioning component 212 is arranged vertically corresponding to the second positioning component 2113 and there is a gap between them. The position sensor 71 is installed on the first positioning component 212, and the magnetic component 72 is installed on the second positioning component 2113. The magnetic component 72 is arranged corresponding to the working end of the position sensor 71.

[0081] In the head-binding device 10 provided in this embodiment of the invention, the outer surface of the rotating seat 21 and the outer surface of the rotating shaft 211 are respectively provided with a first positioning member 212 and a second positioning member 2113. The position sensor 71 is installed on the first positioning member 212 and the magnetic member 72 is installed on the second positioning member 2113. Through the cooperation of the position sensor 71 and the magnetic member 72, the positioning detection can be realized when the head-binding device 10 presses down to make the chip contact the substrate.

[0082] Understandably, compared to using ordinary photoelectric sensors, the position sensor 71 is smaller and has a faster response speed. The non-contact sensing measurement method also has the characteristics of high sensitivity and anti-electromagnetic interference, no risk of physical wear and tear, and long service life. The position sensor 71 and the magnetic component 72 have a small structure and flexible installation, and do not require a large amount of space in the binding device 10, which is conducive to the overall miniaturization design of the equipment and also ensures the accuracy of the position detection when the chip contacts the substrate.

[0083] It should be noted that existing technologies for detecting chip contact with the substrate typically place a sensor on the side of the nozzle to directly detect changes in nozzle height to determine whether the chip is in contact with the substrate. This approach has several drawbacks: Firstly, side-mounting the nozzle will occupy actual mounting space, affecting the efficiency of chip mounting to the substrate. Secondly, when mounting multiple chip types, nozzles of different sizes and lengths need to be replaced, and the sensor's detection reference needs to be readjusted each time the nozzle is replaced, affecting the accuracy of nozzle height change detection.

[0084] Compared with the prior art, when the chip contacts the substrate, the bonding device 10 of this invention allows the rotating shaft 211 to slide upward relative to the rotating seat 21, causing the second positioning member 2113 and the magnetic member 72 to move upward synchronously. The position sensor 71 detects the magnetic member 72 to achieve positioning detection. This method does not occupy the actual mounting space near the working end of the rotating shaft 211, nor is it affected by different nozzle types, thereby ensuring mounting efficiency, improving the detection accuracy when the chip contacts the substrate, and avoiding overvoltage damage to the chip or undervoltage leading to poor bonding.

[0085] In this embodiment of the invention, the position sensor 71 is a Hall element and the magnetic component 72 is a magnet. With this design, when the chip contacts the substrate, the Hall element can sense the magnet to achieve position detection. It is understood that the position sensor 71 may also include, but is not limited to, fiber optic sensors, laser rangefinders, grating sensors, infrared sensors, capacitive sensors, and inductive sensors. The type of magnetic component 72 can be matched with different position sensors 71, which will not be elaborated here.

[0086] Please see Figure 1 and Figure 6 The present invention also provides a calibration mounting system 20 for calibrating the angle of the chip during picking and mounting. The calibration mounting system 20 includes a vision calibration component 8 and the aforementioned head-binding device 10.

[0087] Understandably, the vision correction component 8 is located at the end of the first cavity 11 away from the nozzle component 3, and is responsible for real-time alignment and correction of the upper surface of the chip and the identification point of the placement position during chip placement.

[0088] The workflow of the calibration and placement system 20 is as follows: The main control binding head device 10 of the calibration and placement system 20 descends. When the vacuum nozzle 32 contacts the chip, the material vacuum is opened through the material adsorption gas path. After the vacuum nozzle 32 ensures stable adsorption of the chip, the main control binding head device 10 of the calibration and placement system 20 rises. After the binding head device 10 and the vision correction component 8 move above the placement position, the main control binding head device 10 of the calibration and placement system 20 descends again until it is close to the placement position. The vision correction component 8 first performs real-time alignment. The placement position is corrected according to the recognition of the vision correction component 8. After the correction is completed, the binding head device 10 is slightly pressed down to complete the chip placement. After the material vacuum is closed, the binding head device 10 rises, completing one placement operation.

[0089] It should be noted that the calibration and mounting system 20 of this embodiment of the invention has the same beneficial effects as the head-binding device 10 described above, and will not be repeated here.

[0090] Please see Figure 1 and Figure 7 This invention also provides a die bonding apparatus 30, which includes the aforementioned head-binding device 10. It should be noted that the die bonding apparatus 30 has the same beneficial effects as the aforementioned head-binding device 10, and will not be described in detail here.

[0091] The foregoing provides a detailed description of a head-binding device, a calibration and mounting system, and a die-bonding device according to embodiments of the present invention. Specific examples are used to illustrate the principles and implementation methods of the invention. The descriptions of these embodiments are solely for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bonding device for picking up chips and mounting them onto a substrate, characterized in that, The head-binding device includes a drive assembly, a working assembly, and a suction nozzle assembly, with both ends of the working assembly connected to the drive assembly and the suction nozzle assembly, respectively. The working assembly includes a rotating seat, a first elastic element, and an air bearing. The rotating seat is provided with a rotating shaft, which is slidably installed in the rotating seat. The two ends of the rotating shaft are a transmission end and a working end, respectively. The transmission end of the rotating shaft is connected to the drive assembly, and the working end of the rotating shaft is connected to the suction nozzle assembly. The drive assembly and the rotating shaft are respectively provided with a through and connected first cavity and a second cavity. The air bearing is sleeved on the rotating shaft, and the outer side of the air bearing abuts against the inner wall surface of the rotating seat. One end of the first elastic member abuts against the rotating shaft and the other end abuts against the rotating seat. When the rotating shaft and the rotating seat slide relative to each other, the first elastic member undergoes elastic deformation. The head-binding device further includes a guide assembly, which includes a guide shaft, a guide bearing, and a guide block. One end of the guide shaft is fixed to the rotating shaft, and the guide bearing is sleeved on the other end of the guide shaft. The guide shaft and the first elastic element are respectively disposed on both sides of the rotating shaft in the length direction. The guide shaft is perpendicular to the rotating shaft, and the first elastic element is parallel to the rotating shaft. The deformation direction of the first elastic element is the same as the sliding direction of the rotating shaft. The rotating seat is provided with a hollow channel running horizontally through it. The guide shaft and the guide bearing are located in the hollow channel. The length of the hollow channel in the vertical direction is greater than the outer diameter of the guide bearing. The guide block is fixedly mounted on the rotating seat and abuts against the outer ring of the guide bearing. When the rotating shaft slides relative to the rotating seat, the guide bearing can slide relative to the guide block. The drive assembly includes a hollow rotary motor and a connector. A fixed base is provided between the rotary motor and the connector. The rotary motor is mounted on the fixed base. The rotary motor, the fixed base, and the connector are arranged in sequence. The fixed base is provided with a first limiting block on the side facing the connector, and the connector is provided with a second limiting block on its outer peripheral surface. When the rotary motor is working, the first limiting block and the second limiting block cooperate to make the rotation angle driven by the rotary motor range from 0° to 240°. The head-binding device also includes a self-weight balancing component, which includes a balance shaft and a second elastic element. The balance shaft passes through the hollow channel and is perpendicular to the guide shaft and the rotation shaft, respectively. One end of the second elastic element is connected to the bottom of the connector and the other end is connected to the balance shaft. The rotating shaft is provided with a placement groove. The bottom end of the first elastic member abuts against the bottom wall of the placement groove, the side of the first elastic member abuts against the side wall of the placement groove, and the top end of the first elastic member abuts against the outer bottom wall of the rotating seat. The first elastic element is a compression spring, and the second elastic element is a tension spring.

2. The head-binding device as described in claim 1, characterized in that: The suction nozzle assembly includes an adsorption component and a vacuum nozzle connected to one end of the adsorption component. The other end of the adsorption component is connected to the rotating shaft. The vacuum nozzle is at least partially transparent. The adsorption assembly includes an air passage seat, a first transparent seal, and a sealing ring. The first transparent seal is sealed and fixed between the air passage seat and the rotating shaft. The end of the air passage seat away from the first transparent seal is detachably connected to the vacuum nozzle. The sealing ring is sleeved on the outside of the first transparent seal.

3. The head-binding device as described in claim 2, characterized in that: The binding device further includes a ventilation component, which includes a first air pipe connector disposed on the air bearing. The first air pipe connector is provided with a first air inlet, which is used for air intake of the air bearing. The first air inlet is connected to the internal air passage of the air bearing through the first air pipe connector.

4. The head-binding device as described in claim 3, characterized in that: The ventilation assembly further includes a second air pipe connector and a third air pipe connector located on the rotating shaft near one end of the vacuum nozzle. The second air pipe connector has a second air inlet, and the third air pipe connector has a third air inlet. The second air inlet passes through the rotating shaft, the air passage guide seat, and the internal air passage of the vacuum nozzle in sequence before connecting to the outside, forming a suction nozzle adsorption air passage; the third air inlet passes through the rotating shaft, the air passage guide seat, and the internal air passage of the vacuum nozzle in sequence before connecting to the outside, forming a material adsorption air passage; The suction nozzle adsorption air path and the material adsorption air path are not interconnected.

5. The head-binding device as described in claim 1, characterized in that: The head-binding device also includes a force control detection component, which includes a matching position sensor and a magnetic component; The outer surface of the rotating base is provided with a first positioning element, and the outer surface of the rotating shaft is provided with a second positioning element. The first positioning element is arranged vertically corresponding to the second positioning element and there is a gap between them. The position sensor is installed on the first positioning element, and the magnetic element is installed on the second positioning element, and the magnetic element is arranged corresponding to the working end of the position sensor.

6. A calibration and placement system for calibrating the angle of chips during pickup and placement, characterized in that, The calibration and application system includes a visual calibration component and a head-binding device as described in any one of claims 1-5, wherein the visual calibration component is disposed at the end of the first cavity away from the nozzle component.

7. A die bonding apparatus, characterized in that, The die bonding equipment includes the head-binding device according to any one of claims 1-5.

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