A high-frequency PCB board dielectric constant online calibration and pressing device

Abstract

This invention relates to the field of high-frequency printed circuit board (PCB) manufacturing technology, and more particularly to an online calibration and pressing device for the dielectric constant of high-frequency PCB materials. The technical solution includes a pressing machine body, a sealing partition, a hydraulic cylinder, a lower pressing plate, a guide rod, a support base, a multi-zone micro-heating array mechanism, a sliding plate, a calibration mechanism, a positioning mechanism, a driving mechanism, a lifting mechanism, an automatic opening and closing mechanism, and a vacuum device. This invention performs a pre-scan through the calibration mechanism and uses a terahertz transmitter and receiver to perform an online penetrating scan of the board material during the pressing process, acquiring dielectric constant data in real time. Subsequently, based on this data, it controls the individual temperature zones in the multi-zone micro-heating array mechanism to perform differentiated heating, achieving active compensation and precise control of the local dielectric constant. This invention transforms passive pressing into active intelligent calibration, fundamentally solving the problem of uneven dielectric constant distribution in high-frequency PCBs, and significantly improving product performance consistency and production yield.

Description

Technical Field

[0001] This invention relates to the field of high-frequency printed circuit board manufacturing technology, and in particular to an online calibration and pressing device for the dielectric constant of high-frequency PCB materials. Background Technology

[0002] With the rapid development of high-frequency technologies such as 5G communication and millimeter-wave radar, the performance requirements for high-frequency printed circuit boards are becoming increasingly stringent. Dielectric constant is one of the most critical performance indicators of high-frequency PCB materials, and its uniformity and stability directly determine the integrity and reliability of signal transmission.

[0003] Currently, the lamination manufacturing of high-frequency PCBs generally employs traditional large-scale hot-pressing equipment. While this type of equipment can provide a high-temperature, high-pressure environment, it has significant limitations. Its hot-press plates typically only have a single or a few temperature zones, making it impossible to perform differentiated and precise temperature control across different areas of the board. Furthermore, during the heat curing process, the dielectric constant of the board can experience unpredictable spatial fluctuations due to factors such as heat field distribution, resin flow, and uneven filler distribution. This results in inconsistent electrical properties in the final product, making it difficult to improve yield rates.

[0004] The more fundamental flaw lies in the fact that the existing lamination process is a "blind operation." Lacking effective online monitoring methods, it is impossible to perceive the dynamic changes in the dielectric constant within the substrate during lamination in real time, and therefore, it is impossible to actively adjust the process based on monitoring results. The industry urgently needs a new generation of intelligent lamination equipment capable of real-time monitoring and active adjustment of the dielectric constant during the lamination process. Summary of the Invention

[0005] The purpose of this invention is to address the problems existing in the background art by proposing an online calibration and pressing device for the dielectric constant of high-frequency PCB boards.

[0006] This application provides a high-frequency PCB board dielectric constant online calibration and pressing device, including a pressing machine body with a mechanical housing and a sealed chamber inside, and further including:

[0007] A sealing partition is fixed to the upper middle part of the inner wall of the press body to seal the working area inside the press body, forming a sealed chamber. A hydraulic cylinder is installed on the upper surface of the sealing partition. The output end of the hydraulic cylinder passes through the sealing partition and is fixed to a lower pressure plate. A guide rod that slides through the sealing partition is fixed on the upper surface of the lower pressure plate. A vacuum device is also installed on the upper side of the inner wall of the press body. A support base is fixed on the lower side of the inner wall of the press body. Two sliding plates are slidably connected to the inner wall of the support base.

[0008] Two multi-zone micro-heating array mechanisms are respectively set on the upper surface of the support base and inside the lower pressure plate, and the local dielectric constant is adjusted by local temperature control;

[0009] A calibration mechanism is used to measure the dielectric constant. The calibration mechanism includes a miniature microwave resonant cavity sensor, a terahertz transmitter, and a terahertz receiver. Four miniature microwave resonant cavity sensors are provided, one on each of the upper and lower sides of the outer wall of the two sliding plates. The terahertz transmitter is installed in the middle of the multi-zone micro-heating array mechanism located inside the lower pressure plate, and the terahertz receiver is installed in the middle of the multi-zone micro-heating array mechanism located inside the support base.

[0010] Optionally, the multi-zone micro-heating array mechanism includes a protective frame, a hot plate, a heating actuator, and a temperature sensor. The protective frame is installed inside the lower pressure plate and on the upper surface of the support base. Several hot plates, heating actuators, and temperature sensors are provided in equal numbers. The hot plates are connected by a snap-fit ​​design and assembled on the inner wall of the protective frame. Several heating actuators are arranged parallel above the hot plates, and several temperature sensors are arranged parallel above the heating actuators.

[0011] Optionally, the pressing device also includes,

[0012] The positioning mechanism, located inside the sliding plate, is used to drive the circuit board to be positioned in the center.

[0013] The positioning mechanism includes a support plate and a V-shaped limiting plate. The outer wall of the support plate is fixed to one side of the sliding plate. One side of the outer wall of the V-shaped limiting plate is located inside the sliding plate. A connecting ring is fixed inside the V-shaped limiting plate. A sliding shaft is rotatably mounted on the inner wall of the connecting ring. A torsion spring is provided between the connecting ring and the sliding shaft. One end of the torsion spring is fixed to the inner wall of the connecting ring, and the other end is fixed to the outer wall of the sliding shaft. A rectangular limiting plate is fixed on the upper surface of the sliding shaft.

[0014] Optionally, the positioning mechanism further includes a limiting block that slides inside the sliding shaft. The lower surface of the limiting block is provided with a telescopic spring, and the sliding plate has multiple limiting holes inside. The upper side of the outer wall of the limiting block slides inside the limiting holes.

[0015] Optionally, the V-shaped limiting plate is designed in a V-shape and is used to fit the top corner of the circuit board, and the rectangular limiting plate is designed in a rectangular shape and slides inside the sliding plate to prevent the sliding shaft from rotating.

[0016] Optionally, the pressing device also includes a drive mechanism, which is disposed inside the pressing machine body, for driving the sliding plate to move;

[0017] The driving mechanism includes an electric push rod fixed inside the press body and two racks sliding inside the press body. The output end of the electric push rod is fixedly connected to the outer wall of one of the racks. A gear rotates in the middle of the press body. The two racks mesh with the outer walls of the gear respectively. A connecting plate is fixedly connected to the ends of the two racks. The connecting plate is connected to the sliding plate through a sliding column and an internally sliding rectangular sliding plate.

[0018] Optionally, the driving mechanism further includes a guide rail for guiding the movement of the connecting plate, wherein a slider inside the guide rail is fixedly connected to the lower surface of the connecting plate.

[0019] Optionally, the pressing device also includes a lifting mechanism, which is located inside the pressing machine body and is used to drive the sliding plate to rise and fall;

[0020] The lifting mechanism includes an electric push rod II fixed inside the press body. The output end of the electric push rod II is fixedly connected to a connecting plate. The outer wall of the connecting plate has four protruding corners, which are fixedly connected to four rectangular sliding plates.

[0021] Optionally, the pressing device also includes an automatic opening and closing mechanism, which is located on one side of the outer wall of the pressing machine body for automatic opening and closing;

[0022] The automatic opening and closing mechanism includes a fixed frame that is sealed and installed on one side of the outer wall of the press body. An electric push rod three is fixed to the outer wall of the fixed frame. A connecting steel cable is fixedly connected to the output end of the electric push rod three. A sealing baffle is fixedly connected to one end of the connecting steel cable. The sealing baffle slides on the inner wall of the fixed frame.

[0023] Optionally, the rectangular sliding plate slides inside the sliding column, and the connecting plate has a telescopic design.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] This invention integrates a terahertz online monitoring system with a multi-zone micro-heating array to achieve real-time sensing and dynamic control of the dielectric constant of the board material during the pressing process. This transforms the traditional blind pressing process into an intelligent process that can be calibrated online, ensuring the uniformity and consistency of product performance from the source.

[0026] Furthermore, by precisely controlling the temperature difference in different areas of the board, the dielectric constant fluctuations caused by factors such as uneven thermal field and resin flow are effectively compensated, greatly reducing the stress and defects inside the laminate, thereby significantly reducing the risk of board warping and delamination, and improving the final quality and production yield of high-frequency PCB products.

[0027] Finally, it integrates functions such as automatic positioning, drive feeding and discharging, automatic opening and closing sealing, and vacuuming, realizing full automation of the entire process from feeding, positioning, pressing and calibration to unloading, reducing human intervention, improving production efficiency, and ensuring the reproducibility and reliability of the process. Attached Figure Description

[0028] Figure 1 A schematic diagram of the overall structure of a high-frequency PCB board dielectric constant online calibration and lamination device according to the present invention is provided.

[0029] Figure 2 This is a schematic diagram of one side of the automatic opening and closing mechanism;

[0030] Figure 3 This is a schematic diagram of the internal structure of the pressing machine body;

[0031] Figure 4 This is a schematic diagram of the structure above the support base;

[0032] Figure 5 This is a schematic diagram of the internal structure of the lower pressure plate;

[0033] Figure 6 This is a schematic diagram of one side of the sliding plate structure;

[0034] Figure 7 This is a schematic diagram of the structure below the support base;

[0035] Figure 8 This is a schematic diagram of the internal structure of the sliding plate;

[0036] Figure 9 This is a schematic diagram of the cross-section of the V-shaped limiting plate;

[0037] Figure 10 This is a schematic diagram of an automatic opening and closing mechanism.

[0038] Reference numerals: 1. Pressing machine body; 2. Sealing partition; 3. Hydraulic cylinder; 4. Lower pressure plate; 5. Guide rod; 6. Support base; 7. Multi-zone micro-heating array mechanism; 701. Protective frame; 702. Hot press plate; 703. Heating actuator; 704. Temperature sensor; 8. Sliding plate; 9. Calibration mechanism; 901. Miniature microwave resonant cavity sensor; 902. Terahertz transmitter; 903. Terahertz receiver; 10. Positioning mechanism; 1001. Bearing plate; 1002. V-shaped limit plate; 1003. Connecting ring; 1004. Torsion spring; 1005. Sliding shaft; 1006. Rectangular limiting plate; 1007. Telescopic spring; 1008. Limiting block; 1009. Limiting hole; 11. Drive mechanism; 1101. Electric push rod one; 1102. Rack; 1103. Gear; 1104. Connecting plate; 1105. Guide rail; 1106. Sliding column; 1107. Rectangular sliding plate; 12. Lifting mechanism; 1201. Electric push rod two; 1202. Connecting plate; 13. Automatic opening and closing mechanism; 1301. Fixed frame; 1302. Sealing baffle; 1303. Connecting steel cable; 1304. Electric push rod three; 14. Vacuum device. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] like Figures 1-5 As shown, the present invention proposes an online calibration and pressing device for the dielectric constant of high-frequency PCB boards, comprising a pressing machine body 1 that provides the mounting base for all other components, withstands the enormous mechanical stress generated during the pressing process, and protects the internal precision mechanisms, and a sealing partition 2 fixed to the upper part of the inner wall of the pressing machine body 1 to seal the internal working area of ​​the pressing machine body 1, forming a sealed chamber; in one embodiment, a hydraulic cylinder 3 is installed on the upper surface of the sealing partition 2, the output end of the hydraulic cylinder 3 passes through the sealing partition 2 and is fixed with a lower pressure plate 4, a guide rod 5 is fixed on the upper surface of the lower pressure plate 4 and slides through the sealing partition 2, a vacuum device 14 is also installed on the upper side of the inner wall of the pressing machine body 1, and a support seat 6 is fixed on the lower side of the inner wall of the pressing machine body 1, with two sliding plates 8 slidably connected to the inner wall of the support seat 6. The pressing device is described in detail below:

[0041] In this embodiment, the sealing partition 2 inside the pressing machine body 1 forms a sealed chamber, which is evacuated by the vacuum device 14 to provide a bubble-free environment for pressing. During pressing, the hydraulic cylinder 3 drives the lower pressure plate 4 to press down precisely along the guide rod 5.

[0042] like Figures 1-5 As shown, the pressing device also includes two multi-zone micro-heating array mechanisms 7 respectively disposed on the upper surface of the support base 6 and inside the lower pressure plate 4. In one embodiment, the multi-zone micro-heating array mechanism 7 includes a protective frame 701, a hot pressing plate 702, a heating actuator 703, and a temperature sensor 704. The protective frame 701 is installed inside the lower pressure plate 4 and on the upper surface of the support base 6. Several hot pressing plates 702, heating actuators 703, and temperature sensors 704 are provided in equal numbers. The hot pressing plates 702 are interlocked and assembled on the inner wall of the protective frame 701. Several heating actuators 703 are arranged parallel above the several hot pressing plates 702, and several temperature sensors 704 are arranged parallel above the several heating actuators 703. The multi-zone micro-heating array mechanism 7 is described in detail below:

[0043] In this embodiment, the multi-zone micro-heating array mechanism 7 set on the support base 6 and the lower pressure plate 4 together apply pressure to the PCB board. Multiple hot press plates 702 in the protective frame 701 are combined in a snap-fit ​​manner. Each hot press plate 702 unit is provided with a heating actuator 703 and a temperature sensor 704 arranged in parallel above it, which together constitute an independent temperature control unit. This allows the device to perform differentiated heating on different areas of the board. By controlling the local temperature, the resin flow and curing process of the area can be directly regulated, thereby actively controlling its local dielectric constant.

[0044] like Figures 1-5 As shown, the pressing device also includes a calibration mechanism 9 for measuring the dielectric constant. In one embodiment, the calibration mechanism 9 includes a miniature microwave resonant cavity sensor 901, a terahertz transmitter 902, and a terahertz receiver 903. Four miniature microwave resonant cavity sensors 901 are provided, one on each of the upper and lower sides of the outer walls of the two sliding plates 8. The terahertz transmitter 902 is installed in the middle of the multi-zone micro-heating array mechanism 7 located inside the lower pressure plate 4. The terahertz receiver 903 is installed in the middle of the multi-zone micro-heating array mechanism 7 located inside the support base 6. The calibration mechanism 9 is described in detail below:

[0045] In this embodiment, a terahertz transmitter 902 integrated within the lower pressure plate 4 emits a signal that penetrates the plate and is received by a terahertz receiver 903 located on the sliding plate. This enables real-time, online, and penetrating measurement of the plate's dielectric constant, providing a data foundation for closed-loop control. The micro-microwave resonant cavity sensor 901 performs a pre-scan before pressing to establish an initial baseline for the dielectric constant distribution.

[0046] like Figure 1 , Figure 6 , Figure 7 , Figure 8and Figure 9 As shown, the pressing device also includes a positioning mechanism 10 disposed inside the sliding plate 8 for driving the circuit board to be positioned in the center. In one embodiment, the positioning mechanism 10 includes a support plate 1001 and a V-shaped limiting plate 1002. The outer wall of the support plate 1001 is fixed to one side of the sliding plate 8, and one side of the outer wall of the V-shaped limiting plate 1002 is disposed inside the sliding plate 8. A connecting ring 1003 is fixed inside the V-shaped limiting plate 1002. A sliding shaft 1005 is rotatably mounted on the inner wall of the connecting ring 1003. A torsion spring 1004 is disposed between the connecting ring 1003 and the sliding shaft 1005. One end of the torsion spring 1004 is fixed to the inner wall of the connecting ring 1003, and the other end is fixed to the outer wall of the sliding shaft 1005. A rectangular limiting plate 1006 is fixed on the upper surface of the sliding shaft 1005.

[0047] The positioning mechanism 10 also includes a limiting block 1008 that slides inside the sliding shaft 1005. A telescopic spring 1007 is provided on the lower surface of the limiting block 1008. Multiple limiting holes 1009 are opened inside the sliding plate 8. The upper side of the outer wall of the limiting block 1008 slides inside the limiting hole 1009.

[0048] The V-shaped limiting plate 1002 is designed to fit the top corner of the circuit board. The rectangular limiting plate 1006 is designed to slide inside the sliding plate 8 to prevent the sliding shaft 1005 from rotating. The positioning mechanism 10 is described in detail below:

[0049] In this embodiment, the limiting block 1008 is first pressed and slides inside the limiting hole 1009 preset inside the sliding shaft 1005 and the sliding plate 8, thereby causing the telescopic spring 1007 to contract. When the limiting block 1008 moves completely inside the sliding shaft 1005, the sliding shaft 1005 can be pulled to slide inside the sliding plate 8, thereby adjusting the position of the V-shaped limiting plate 1002 so that it can be adapted to different high-frequency PCB materials. When the V-shaped limiting plate 1002 is used, one of the top corners of the V-shaped limiting plate 1002 will move under the pressure of the high-frequency PCB material, thereby causing the connecting ring 1003 to rotate on the outer wall of the sliding shaft 1005. At the same time, the torsion spring 1004 is torsion. When the V-shaped limiting plate 1002 rotates to a certain angle, both top corners of the V-shaped limiting plate 1002 can be attached to the outer wall of the high-frequency PCB material, thereby limiting the high-frequency PCB material and enabling the high-frequency PCB material to be effectively centered and positioned.

[0050] like Figure 1 , Figure 6 and Figure 7As shown, the pressing device also includes a drive mechanism 11 disposed inside the pressing machine body 1 for driving the sliding plate 8 to move; in one embodiment, the drive mechanism 11 includes an electric push rod 1101 fixed inside the pressing machine body 1 and two racks 1102 sliding inside the pressing machine body 1. The output end of the electric push rod 1101 is fixedly connected to the outer wall of one of the racks 1102. A gear 1103 rotates in the middle of the pressing machine body 1. The two racks 1102 are respectively meshed on both sides of the outer wall of the gear 1103. A connecting plate 1104 is fixedly connected to the ends of the two racks 1102. The connecting plate 1104 is connected to the sliding plate 8 through a sliding column 1106 and an internally sliding rectangular sliding plate 1107.

[0051] The drive mechanism 11 also includes a guide rail 1105 that guides the movement of the connecting plate 1104. The slider inside the guide rail 1105 is fixedly connected to the lower surface of the connecting plate 1104. The drive mechanism 11 is described in detail below:

[0052] In this embodiment, the electric push rod 1101 is first driven to drive the rack 1102 to slide inside the press body 1. At the same time, through the meshing relationship between the rack 1102 and the gear 1103, the gear 1103 drives the racks 1102 on both sides to move relative to each other. Thus, the connecting plate 1104, together with the sliding column 1106 and the rectangular sliding plate 1107, drives the sliding plate 8 to move relative to each other. Then, the movement of the sliding plate 8 drives the positioning mechanism 10 and the bearing plate 1001 to clamp and lift the high-frequency PCB board.

[0053] like Figure 1 , Figure 6 and Figure 7 As shown, the pressing device also includes a lifting mechanism 12 disposed inside the pressing machine body 1 for driving the sliding plate 8 to rise and fall; in one embodiment, the lifting mechanism 12 includes an electric push rod 1201 fixed inside the pressing machine body 1, the output end of the electric push rod 1201 is fixedly connected to a connecting plate 1202, the outer wall of the connecting plate 1202 has four apex corners protruding, and is fixedly connected to four rectangular sliding plates 1107.

[0054] The rectangular sliding plate 1107 slides inside the sliding column 1106, and the connecting plate 1202 is telescopic. The lifting mechanism 12 is described in detail below:

[0055] In this embodiment, after the high-frequency PCB board is lifted, the electric push rod 1201 is activated to drive the connecting plate 1202 to move up and down, and then the rectangular sliding plate 1107 drives the sliding plate 8 and the high-frequency PCB board to move up and down. When the high-frequency PCB board is raised, it can be easily detected by the micro microwave resonant cavity sensor 901.

[0056] like Figure 1, Figure 2 and Figure 10 As shown, the pressing device also includes an automatic opening and closing mechanism 13 disposed on one side of the outer wall of the pressing machine body 1 for automatic opening and closing; in one embodiment, the automatic opening and closing mechanism 13 includes a fixed frame 1301 sealed and installed on one side of the outer wall of the pressing machine body 1, an electric push rod 1304 fixed on the outer wall of the fixed frame 1301, a connecting steel cable 1303 fixedly connected to the output end of the electric push rod 1304, a sealing baffle 1302 fixedly connected to one end of the connecting steel cable 1303, and the sealing baffle 1302 sliding on the inner wall of the fixed frame 1301. The automatic opening and closing mechanism 13 is described in detail below:

[0057] In this embodiment, the electric push rod 1304 is activated to move one end of the connecting steel cable 1303, thereby causing the sealing baffle 1302 to slide on the inner wall of the fixed frame 1301 through the other end of the connecting steel cable 1303, thus realizing fully automatic control of the sealing baffle 1302.

[0058] The above specific embodiments are merely several optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A high-frequency PCB board material dielectric constant on-line calibration pressing device, comprising a press body (1) provided with a sealed chamber in the inside of a device mechanical shell, characterized in that, Also include: Sealing partition (2) is fixed in the upper side of the inner wall of the pressing machine body (1), which is used for sealing the working area of the pressing machine body (1) to form a sealed chamber. The upper surface of the sealing partition (2) is provided with a hydraulic cylinder (3), the output end of the hydraulic cylinder (3) penetrates the sealing partition (2) and is fixed with a lower pressing plate (4), the upper surface of the lower pressing plate (4) is fixed with a guide rod (5) which slides in the sealing partition (2), the upper side of the inner wall of the pressing machine body (1) is also provided with a vacuumizing device (14), the lower side of the inner wall of the pressing machine body (1) is fixed with a support seat (6), the inner wall of the support seat (6) is slidably connected with two sliding plates (8); Two multi-zone micro-heating array mechanisms (7) are arranged on the upper surface of the support seat (6) and the inside of the lower pressing plate (4), which can control the local dielectric constant by local temperature control; The calibration mechanism (9) is used for measuring the dielectric constant, which includes a micro microwave resonant cavity sensor (901), a terahertz transmitter (902) and a terahertz receiver (903). The micro microwave resonant cavity sensor (901) is provided with four, one of which is arranged on the outer wall of the two sliding plates (8) on the upper and lower sides, the terahertz transmitter (902) is installed in the middle of the multi-zone micro-heating array mechanism (7) inside the lower pressing plate (4), and the terahertz receiver (903) is installed in the middle of the multi-zone micro-heating array mechanism (7) inside the support seat (6); The pressing device also includes a positioning mechanism (10) arranged in the inside of the sliding plate (8) for driving the circuit board to be positioned in the center; The positioning mechanism (10) includes a bearing plate (1001) and a V-shaped limiting plate (1002), the outer wall of the bearing plate (1001) is fixed on one side of the sliding plate (8), the outer wall of the V-shaped limiting plate (1002) is arranged in the inside of the sliding plate (8), the inside of the V-shaped limiting plate (1002) is fixed with a connecting ring (1003), the inner wall of the connecting ring (1003) is rotatably provided with a sliding shaft (1005), a torsion spring (1004) is arranged between the connecting ring (1003) and the sliding shaft (1005), one end of the torsion spring (1004) is fixed on the inner wall of the connecting ring (1003), and the other end is fixed on the outer wall of the sliding shaft (1005), the upper surface of the sliding shaft (1005) is fixed with a rectangular limiting plate (1006); The pressing device also includes a driving mechanism (11) arranged in the inside of the pressing machine body (1) for driving the sliding plate (8) to move; The driving mechanism (11) comprises an electric push rod I (1101) fixed inside the pressing machine body (1), and two racks (1102) sliding inside the pressing machine body (1), the output end of the electric push rod I (1101) is fixedly connected with the outer wall of one of the racks (1102), a gear (1103) is rotatably arranged in the middle of the pressing machine body (1), the two racks (1102) are respectively engaged on the two sides of the outer wall of the gear (1103), the end portions of the two racks (1102) are fixedly connected with connecting plates (1104), the connecting plates (1104) are connected with the sliding plate (8) through sliding columns (1106) and rectangular sliding plates (1107) sliding inside. The pressing device further comprises a lifting mechanism (12) arranged inside the pressing machine body (1) and used for driving the sliding plate (8) to lift; The lifting mechanism (12) comprises an electric push rod II (1201) fixed inside the pressing machine body (1), and the output end of the electric push rod II (1201) is fixedly connected with a connecting plate (1202), the outer wall of the connecting plate (1202) protrudes four top corners and is fixedly connected with four rectangular sliding plates (1107); The pressing device further comprises an automatic opening and closing mechanism (13) arranged on one side of the outer wall of the pressing machine body (1) and used for automatic opening and closing; The automatic opening and closing mechanism (13) comprises a fixed frame (1301) sealingly arranged on one side of the outer wall of the pressing machine body (1), the outer wall of the fixed frame (1301) is fixedly connected with an electric push rod III (1304), the output end of the electric push rod III (1304) is fixedly connected with a connecting steel cable (1303), one end of the connecting steel cable (1303) is fixedly connected with a sealing baffle (1302), and the sealing baffle (1302) slides on the inner wall of the fixed frame (1301).

2. The high-frequency PCB board dielectric constant online calibration pressing device according to claim 1, characterized in that, The multi-zone micro-heating array mechanism (7) comprises a protection frame (701), a hot pressing plate (702), a heating actuator (703) and a temperature sensor (704), the protection frame (701) is arranged inside the lower pressing plate (4) and on the upper surface of the supporting seat (6), the hot pressing plate (702), the heating actuator (703) and the temperature sensor (704) are arranged in plurality and have the same number, the plurality of hot pressing plates (702) are designed in clamping connection and are combined and arranged on the inner wall of the protection frame (701), the plurality of heating actuators (703) are arranged in parallel above the plurality of hot pressing plates (702), and the plurality of temperature sensors (704) are arranged in parallel above the plurality of heating actuators (703).

3. The high-frequency PCB board dielectric constant online calibration press-bonding device according to claim 1, characterized in that, The positioning mechanism (10) further comprises a limiting block (1008) sliding inside the sliding shaft (1005), the lower surface of the limiting block (1008) is provided with an elastic spring (1007), a plurality of limiting holes (1009) are formed in the sliding plate (8), and the outer wall of the limiting block (1008) slides on the inner wall of the limiting hole (1009).

4. The high-frequency PCB board dielectric constant on-line calibration press bonding device according to claim 3, characterized in that, The V-shaped limiting plate (1002) is designed in a V shape, is used for fitting the top corner of the circuit board, the rectangular limiting plate (1006) is designed in a rectangle, and is used for preventing the rotating movement of the sliding shaft (1005) by sliding in the sliding plate (8).

5. The high-frequency PCB board material dielectric constant online calibration pressing device according to claim 1, characterized in that, The driving mechanism (11) further comprises a guide rail (1105) for guiding the movement of the connecting plate (1104), and the sliding block fixedly connected to the lower surface of the connecting plate (1104) is inside the guide rail (1105).

6. The high-frequency PCB board material dielectric constant online calibration pressing device according to claim 1, characterized in that, The rectangular sliding plate (1107) slides in the sliding column (1106), and the connecting plate (1202) is designed to be telescopic.

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