A perlite insulation board containing epoxy shell light spheres and a method of making the same

Abstract

The present application relates to the field of building materials, and more particularly to a perlite insulation board containing epoxy shell light balls and a preparation method thereof, the perlite insulation board is composed of expanded perlite, cement, epoxy shell light balls, glue powder, chopped fibers and water, wherein the epoxy shell light ball is a cage-shaped light microsphere formed by a plurality of hollow glass microspheres coated by epoxy resin glue, by pre-treating the hollow glass microspheres, the hollow glass microspheres are adhered together by the epoxy resin glue to form a cage-shaped mother particle of a plurality of hollow balls, then the expanded perlite powder, cement, glue powder and water are stirred to form a mortar, the epoxy shell light balls are added and stirred uniformly, and pouring, molding, drying and curing are performed to obtain the perlite insulation board, the present application can effectively reduce the bulk density of the insulation board and improve the heat insulation effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of building materials, in particular to a perlite insulation board containing epoxy shell light-weight spheres and a preparation method thereof. BACKGROUND

[0002] At present, the common perlite insulation board on the market has been widely used in the field of building exterior wall insulation and has certain insulation performance, but with the implementation of green building, ultra-low energy consumption building and higher fire safety standards, more stringent requirements are put forward for the comprehensive performance of the exterior wall insulation material. Especially in terms of achieving lower bulk density to reduce structural load, higher mechanical strength to ensure construction and service reliability, and further improving the insulation performance to reduce building operation energy consumption, the existing perlite insulation board still has obvious deficiencies.

[0003] The patent application with the application number 201510370649.7 discloses a manufacturing process of a perlite insulation board, which is composed of SiO2 aerogel, glass microspheres, expanded perlite, aluminum phosphate liquid, silane coupling agent and calcium silicate fiber, and is prepared through the steps of slurry forming, dehumidification drying, cutting and trimming glass fiber grid cloth, preparing fabric layer, extruding and polishing and trimming, preparing bottom material layer, extruding and polishing and trimming again, sealing and packaging; the patent application with the application number 201810330633.7 discloses a light-weight insulation board prepared by using waste glass, which contains cement, high-strength gypsum, polystyrene foam, perlite, glass microspheres, sodium silicate water glass, chopped fiber, water, retarder and foaming agent. The above two kinds of insulation boards are both prepared by adding glass microspheres, which greatly reduces the density of the insulation board while ensuring the insulation and heat insulation performance of the material. However, experiments have found that with the increase of the amount of glass microspheres added, the bulk density of the insulation board shows a trend of first decreasing and then increasing. When the amount of glass microspheres added is greater than 20wt%, the bulk density is even higher than that when no glass microspheres are added. Comprehensive judgment may be that because the shell of glass microspheres is thin and brittle, a large amount of glass microspheres are broken during stirring, resulting in that the actual filler is broken glass with higher density, which finally increases the bulk density of the insulation board. SUMMARY

[0004] In view of the problems existing in the prior art, the present application utilizes epoxy resin glue to wrap hollow glass microspheres, so that the hollow glass microspheres remain in a hollow state (not broken) in the perlite insulation board, thereby reducing the bulk density of the insulation board and improving the heat insulation effect.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] The invention discloses a kind of perlite insulation board containing epoxy shell light ball, the perlite insulation board is by expanded perlite, cement, epoxy shell light ball, glue powder, short cut fiber and water composite, wherein the epoxy shell light ball is by a plurality of hollow glass microsphere is covered and adhered to form cage-shaped microspheres by epoxy resin glue.

[0007] Preferably, the epoxy shell light ball comprises the following raw materials by mass fraction: hollow glass microsphere: 30-65 parts, epoxy resin: 20-50 parts, epoxy curing agent: 8-25 parts, rolling medium: 1-5 parts.

[0008] Preferably, the hollow glass microsphere particle size is 5-200 μm, and the bulk density is 0.03-0.25 g / cm 3 ; the rolling medium is 1-6 mm glass beads, which provides a triple mechanical energy of "rolling-collision-shearing" to beat the originally easy-to-group epoxy droplets and hollow glass microspheres into uniform and dense thin-shell balls. The glass beads are 10-20 times heavier than the hollow glass microspheres, and can act as "millstones" in dynamic coating to repeatedly roll the wet particle surface, making the epoxy glue film smoother and more round; in addition, the "ball-ball" shearing surface between the glass beads and the microspheres can tear the local high-viscosity glue group, making the glue distribution more uniform, and at the same time, exposing the dry beads on the surface of the hollow glass microspheres to the glue liquid again, improving the coating rate.

[0009] Preferably, the epoxy resin includes one or more of low-viscosity bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin.

[0010] Preferably, the epoxy curing agent is an amine curing agent, including one or more of aliphatic amine, alicyclic amine, aromatic amine and modified amine.

[0011] A preparation method of a perlite insulation board containing epoxy shell light ball, comprising the following steps:

[0012] S1, mix the epoxy resin and the epoxy curing agent at an active hydrogen equivalent ratio of 0.5-1.5, and pre-react at 30-90°C for 10 s-15 min to obtain a pre-gel;

[0013] S2, add the hollow glass microspheres and the rolling medium into the reactor, and keep the rolling bed temperature at 20-80°C and the rolling speed at 5-60 r / min;

[0014] S3, add the pre-gel of step S1 into the rolling bed, and continuously roll for 1-20 min to form wet particles with a particle size of 0.1-6 mm;

[0015] S4, segmentally cure the wet particles at 50-130°C for 3-60 min to obtain the epoxy shell light ball;

[0016] S5, the raw materials for preparing the perlite insulation board, i.e. expanded perlite, cement, glue powder and short-cut fiber, are mixed in proportion to prepare a composite dry powder, which is stirred with water to prepare a mortar, and then the epoxy shell light ball prepared in S4 is added and stirred uniformly;

[0017] S6, pouring, molding, air-drying and curing are performed as required to obtain the perlite insulation board containing the epoxy shell light ball.

[0018] Preferably, the apparent density of the epoxy shell light ball prepared in S4 is 0.2-1.0 g / cm 3 , and the roundness is greater than or equal to 0.6.

[0019] Preferably, the mass fractions of the raw materials of the perlite insulation board are as follows:

[0020] Expanded perlite: 20-60 parts, cement: 15-55 parts, epoxy shell light ball: 1-15 parts, glue powder: 0.1-1 part, short-cut fiber: 0.1-1 part, and water: 20-80 parts.

[0021] Preferably, the particle size of the expanded perlite is 30-100 mesh, and the particle size of the epoxy shell light ball is 0.3-3 mm.

[0022] Preferably, the cement is 42.5 ordinary Portland cement.

[0023] Preferably, the glue powder is one or more of EVA glue powder, TPU hot melt glue powder, rubber powder and 801 building glue powder.

[0024] Preferably, the short-cut fiber is one or more of carbon fiber, glass fiber, aramid fiber and polypropylene fiber.

[0025] The technical scheme has the following beneficial effects:

[0026] In the present application, the hollow glass microspheres are not directly added to the raw materials for preparing the perlite insulation board, but the hollow glass microspheres are pre-processed, a plurality of hollow glass microspheres are bonded together by using epoxy resin glue to make a cage-shaped master batch of millimeter-level multi-bead clusters, then the epoxy shell light-weight spheres are mixed with perlite, cement and other components to make a mortar, and then pouring, molding, drying and curing are performed to obtain the perlite insulation board. The advantage of this is that a plurality of hollow glass microspheres "bare balls" are bonded together by the epoxy resin to form a thin shell of epoxy resin. Since the epoxy resin has a certain toughness and protective effect, the breakage rate of the hollow glass microspheres in the epoxy shell light-weight spheres is significantly reduced, ensuring that the hollow glass microspheres remain hollow (not broken) during use. When the hollow glass microspheres are added to the perlite board formula, although the density of the epoxy shell light-weight spheres is slightly higher than that of the hollow glass microspheres, the epoxy shell protects the hollow glass microspheres and reduces the breakage rate of the hollow glass microspheres during mixing. Therefore, the weight reduction effect of the epoxy shell light-weight spheres is better, which can effectively reduce the bulk density of the insulation board and improve the thermal insulation effect. Moreover, because the epoxy resin absorbs the stress during compression, the compressive strength of the insulation board is also improved. BRIEF DESCRIPTION OF DRAWINGS

[0027] The present application will be further described in detail below in combination with the drawings and specific embodiments.

[0028] Figure 1 Epoxy shell light-weight spheres;

[0029] Figure 2 Perlite insulation board containing epoxy shell light-weight spheres;

[0030] Figure 3 Epoxy shell light-weight spheres;

[0031] Figure 4 SEM image of epoxy shell light-weight spheres;

[0032] Figure 5 SEM image of the cross section of the epoxy shell light-weight spheres after manual cutting. DETAILED DESCRIPTION

[0033] Preparation of epoxy shell light-weight spheres:

[0034] Example 1:

[0035] 60 parts of hollow glass microspheres (Wenzhou Weizhen New Material Co., Ltd., 5020, particle size 55 μm) and 4 parts of rolling medium (3 mm glass beads, Quanzhou Precision Glass Bead Factory) were poured into a 500 mL single-neck flask and rolled at a speed of 50 r / min at 40°C.

[0036] Pre-gel liquid was obtained by pre-reacting 30 parts of bisphenol F epoxy resin (HS-170, Chuzhou Huisheng Electronic Material Co., Ltd.) with 10 parts of modified aliphatic amine curing agent 593 (Henan Shuizhi Circle Industry Co., Ltd.) at 60°C for 90s.

[0037] The pre-gel liquid was added to a single-neck flask in a fine stream in three times with an interval of 5s, and gently shaken 2-3 times, and then rolled for 6min, to obtain wet particles with a particle size of 0.1-6mm.

[0038] The wet particles were pre-cured at 80°C for 8min, and then cured at 100°C for 15min, and then sieved, to obtain epoxy shell light-weight spheres a.

[0039] The active hydrogen equivalent ratio described in the present application is calculated according to the following formula:

[0040] r = (m 固化剂 AHEW) ÷ (m 树脂 EEW)

[0041] Wherein: r is the active hydrogen equivalent ratio;

[0042] m 固化剂 is the mass fraction of the curing agent;

[0043] m 树脂 is the mass fraction of the epoxy resin;

[0044] AHEW is the active hydrogen equivalent of the curing agent (g / eq);

[0045] EEW is the epoxy equivalent of the epoxy resin (g / eq);

[0046] In the present example, AHEW(593) = 46g / eq, EEW(HS-170) = 170g / eq, and r = (10 / 46) ÷ (30 / 170) = 1.23 according to the above formula.

[0047] Example 2:

[0048] 40 parts of hollow glass microspheres (Wenzhou Weizhen New Material Co., Ltd., 5020, particle size 55μm), and 2 parts of rolling medium (3mm glass beads, Quanzhou Precision Glass Bead Factory) were poured into a 500mL single-neck flask, and rolled at a speed of 30r / min at 40°C.

[0049] Pre-gel liquid was obtained by pre-reacting 45 parts of bisphenol A epoxy E51 (Baling Petrochemical Co., Ltd.) with 15 parts of alicyclic amine (1,3-BAC, Chuzhou Huisheng Electronic Material Co., Ltd.) at 70°C for 100s.

[0050] The pre-gel liquid is added into the single-neck flask in three times with a fine stream, with an interval of 5 s, and gently shaken for 2-3 times, and then rolled for 10 min to obtain wet particles with a particle size of 0.1-6 mm.

[0051] The wet particles are pre-cured at 50°C for 15 min, and then cured at 110°C for 10 min, and then sieved to obtain the epoxy shell lightweight spheres a.

[0052] Example 3:

[0053] 53 parts of hollow glass microspheres (Wenzhou Weizhen New Material Co., Ltd., 5020, particle size 55 μm), 3 parts of rolling medium (3 mm glass beads, Quanzhou Precision Glass Bead Factory), are poured into a 500 mL single-neck flask, and rolled at a speed of 10 r / min at 40°C.

[0054] 35 parts of alicyclic epoxy resin ERL-4221 (Shanghai Aladdin Reagent Co., Ltd.), 12 parts of alicyclic amine (IPDA, Shanghai Aladdin Reagent Co., Ltd.), are pre-reacted at 40°C for 120 s to obtain a pre-gel liquid.

[0055] The pre-gel liquid is added into the single-neck flask in three times with a fine stream, with an interval of 5 s, and gently shaken for 2-3 times, and then rolled for 15 min to obtain wet particles with a particle size of 0.1-6 mm.

[0056] The wet particles are pre-cured at 70°C for 10 min, and then cured at 120°C for 10 min, and then sieved to obtain the epoxy shell lightweight spheres c.

[0057] The three kinds of epoxy shell lightweight spheres prepared in the above three examples are used in the following example of preparing perlite insulation board:

[0058] Example 4:

[0059] The raw materials for preparing the perlite insulation board: 50-70 mesh expanded perlite 40 parts, 42.5 ordinary portland cement 30 parts, Vinnapas4115N glue powder 0.5 parts, chopped fiber 0.4 parts, and water 45 parts are mixed uniformly to prepare a mortar.

[0060] Then 7 parts of the epoxy shell lightweight spheres a with a particle size of 0.3-3 mm screened are slowly added, and stirred uniformly, and then poured, molded, dried, and cured as required to obtain the perlite insulation board A.

[0061] Example 5:

[0062] The raw materials for preparing the perlite insulation board: 50-70 mesh expanded perlite 40 parts, 42.5 ordinary portland cement 30 parts, Vinnapas4115N glue powder 0.5 parts, chopped fiber 0.4 parts, and water 45 parts are mixed uniformly to prepare a mortar.

[0063] Slowly add 15 parts of epoxy shell light spheres with a particle size of 0.3-3 mm screened, slowly stir evenly, then pour, shape, dry, and maintain as required to obtain perlite insulation board B.

[0064] Example 6:

[0065] Mix each raw material for preparing the perlite insulation board: 20 parts of expanded perlite of 50-70 mesh, 15 parts of 42.5 ordinary portland cement, 0.2 parts of Vinnapas4115N glue powder, 0.2 parts of chopped fiber, and 20 parts of water to prepare a mortar;

[0066] Slowly add 1 part of epoxy shell light spheres c with a particle size of 0.3-3 mm screened, slowly stir evenly, then pour, shape, dry, and maintain as required to obtain perlite insulation board C.

[0067] Comparative Example 1:

[0068] Mix each raw material for preparing the perlite insulation board: 40 parts of expanded perlite of 50-70 mesh, 30 parts of 42.5 ordinary portland cement, 0.5 parts of Vinnapas4115N glue powder, 0.4 parts of chopped fiber, and 45 parts of water to prepare a mortar;

[0069] Slowly add 7 parts of hollow glass microspheres (Wenzhou Weizhen New Material Co., Ltd., 5020, particle size 55 μm), slowly stir evenly, then pour, shape, dry, and maintain as required to obtain perlite insulation board A'.

[0070] The perlite insulation boards obtained in the above examples were tested as follows:

[0071] perlite plate A B C A’ Container weight (kg / m 3 ) 393.3 376.2 409.7 418.5 compressive strength (kPa) 1133.6 1035.4 1047.3 1004.5 thermal conductivity (W / (m·K)) 0.076325 0.073712 0.080923 0.082138

[0072] As can be seen from the above table, by coating the hollow glass microspheres with epoxy resin glue to prepare epoxy shell light spheres, and adding the epoxy shell light spheres to the perlite insulation board, the bulk density and thermal conductivity of the insulation board are reduced, and the compressive strength is increased, and the compressive strength of the insulation board is the highest when the mass fraction of the epoxy shell light spheres in Example 1 is 7 parts.

[0073] In the above table, (1) the bulk density test method refers to GB / T20473-2021, 6.8.1 dry density, and the specific method is to prepare the mixture according to Appendix B of this standard, and perform it according to the provisions of Appendix C.

[0074] According to the raw material composition and mass fraction in the above examples, 3 pieces of perlite plate samples with a size of 70.7mmx70.7mmx70.7mm were prepared respectively, and cured for 28d according to the experimental requirements, and then placed in an oven at 105℃, and dried to constant weight, and the dry density of the test piece was calculated according to the following formula:

[0075]

[0076] In the formula: ρ is the density of the test piece, unit: kg / m 3 ; G is the mass of the test piece after drying, unit: kg; V1 is the volume of the test piece, unit: m 3 .

[0077] (2) Compressive strength according to GB / T20473-2021, 6.8.2 Compressive strength.

[0078] The perlite plate sample with tested bulk density was tested for compressive strength on a universal testing machine with a load speed of 10mm / min, and the compressive strength of the test piece was calculated according to the following formula:

[0079]

[0080] In the formula: σ is the compressive strength of the test piece, unit: MPa; P1 is the failure load of the test piece, unit: N; S is the compressive area of the test piece, unit: mm 2 .

[0081] (3) Thermal conductivity is tested according to the method in GB / T10294-2008.

[0082] According to the raw material composition and mass fraction in the above examples, 2 pieces of perlite plate samples with a size of 0.3m x 0.3m x 25mm were prepared respectively, and a double test piece device was used, and the thermal conductivity was calculated according to the following formula:

[0083]

[0084] In the formula: λ is the thermal conductivity, unit: W / (m·K); is the average heating power of the heating unit measurement part, unit: W; T1 is the average value of the hot surface temperature of the test piece, unit: K; T2 is the average value of the cold surface temperature of the test piece, unit: K; A is the measurement area, unit: m 2 ; d is the average thickness of the test piece, unit: m.

[0085] The above examples are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalent ones; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the protection scope of the technical solutions of the embodiments of the present application.

Claims

1. A perlite insulation board containing epoxy shell light weight spheres, characterized by: The perlite insulation board is composed of expanded perlite, cement, epoxy shell light ball, glue powder, short fiber and water, wherein the epoxy shell light ball is a cage-shaped microsphere formed by a plurality of hollow glass microbeads being coated and adhered by epoxy resin glue.

2. The perlite thermal insulation board containing epoxy shell light spheres according to claim 1, characterized by: The epoxy shell light ball comprises the following raw materials in terms of mass fraction: hollow glass microbeads: 30-65 parts, epoxy resin: 20-50 parts, epoxy curing agent: 8-25 parts, and rolling medium: 1-5 parts.

3. The perlite board containing epoxy shell light-weight spheres according to claim 2, characterized in that: The hollow glass microbeads have a particle size of 5-200 μm and a bulk density of 0.03-0.25 g / cm 3 ; the rolling medium is 1-6 mm glass beads.

4. The perlite board containing epoxy shell light-weight spheres according to claim 2, characterized in that: The epoxy resin comprises one or more of low-viscosity bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin; and the epoxy curing agent is an amine curing agent, which comprises one or more of aliphatic amine, alicyclic amine, aromatic amine and modified amine.

5. A method for producing a perlite thermal insulation board containing epoxy shell light spheres according to any one of claims 2 to 4, characterized by: The method comprises the following steps: S1: mixing the epoxy resin and the epoxy curing agent at an active hydrogen equivalent ratio of 0.5-1.5 and pre-reacting at 30-90℃ for 10s-15min to obtain a pre-gel; S2: adding the hollow glass microbeads and the rolling medium into a reactor, keeping the temperature of the rolling bed at 20-80℃ and the rolling speed at 5-60r / min; S3: adding the pre-gel of step S1 into the rolling bed and continuously rolling for 1-20min to form wet particles with a particle size of 0.1-6mm; S4: segmentally curing the wet particles at 50-130℃ for 3-60min to obtain the epoxy shell light ball; S5: mixing the raw materials for preparing the perlite insulation board, i.e. expanded perlite, cement, glue powder and short fiber, according to the proportion to prepare a composite dry powder, adding water and stirring to prepare a mortar, and then adding the epoxy shell light ball prepared in S4 and stirring uniformly; S6: pouring, forming, air-drying and curing according to requirements to obtain the perlite insulation board containing the epoxy shell light ball.

6. The method of claim 5, wherein the method is characterized by: The mass fraction of each raw material in step S5 is as follows: Expanded perlite: 20-60 parts, cement: 15-55 parts, epoxy shell light ball: 1-15 parts, glue powder: 0.1-1 part, short fiber: 0.1-1 part, and water: 20-80 parts.

7. The method of claim 6, wherein the method is characterized by: The expanded perlite has a particle size of 30-100 mesh, and the epoxy shell light ball has a particle size of 0.3-3mm.

8. The perlite board containing epoxy shell light-weight spheres according to claim 6, characterized in that: The cement is 42.5 ordinary portland cement.

9. The method of claim 6, wherein the method is characterized by: The glue powder is one or more of EVA glue powder, TPU hot melt glue powder, rubber powder and 801 building glue powder.

10. The method of claim 6, wherein the method is characterized by: The short fiber is one or more of carbon fiber, glass fiber, aramid fiber and polypropylene fiber.

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