Cold storage heat preservation box, refrigeration module and application method of refrigeration module

Abstract

The invention relates to the technical field of heat preservation boxes, and provides a cold accumulation heat preservation box, a refrigeration module and an application method thereof.The cold accumulation heat preservation box comprises a box body, a cold accumulation part and a first cold accumulation body, the cold accumulation part is arranged in the box body, and the cold accumulation part comprises an inner cylinder coaxially arranged with the box body, an outer cylinder arranged on the outer side of the inner cylinder in a sleeving mode and rotating relative to the inner cylinder and a second cold accumulation body located between the inner cylinder and the outer cylinder; the partition plates are connected with the inner cylinder; a cold accumulation cavity is formed between every two adjacent partition plates, and the first cold accumulation bodies are arranged in the cold accumulation cavities. A plurality of through grooves are formed in the outer cylinder, and the number of the through grooves is smaller than that of the cold storage cavities. When the refrigerator is applied, part of the cold storage bodies are used for refrigerating articles, the other part of the cold storage bodies can be kept at low temperature for a long time under isolation of the refrigerator body and the outer barrel, and after the temperature of the previous cold storage bodies rises, the outer barrel is rotated for switching, so that the cold storage cavities which are not communicated with the refrigerator body in advance are communicated, and the cold storage bodies are not communicated with the refrigerator body in advance. And the cold accumulation body in the cold accumulation cavity continues to maintain the low temperature, so that the low-temperature storage time of the articles can be effectively prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of incubators, in particular to a cold storage incubator, a refrigeration module and an application method thereof. BACKGROUND

[0002] An incubator is a special incubator for maintaining the temperature of an object, which can ensure that the heat of the object is not lost or the temperature of the object is not increased, thereby avoiding problems such as deterioration and damage of the stored object. The existing cold storage incubator is mainly used to slow down the temperature rise of the object by placing a cold storage body in the incubator.

[0003] The existing patent with the authorization announcement No. CN108996032B discloses an incubator and a method for replacing a cold storage body, and relates to the technical field of incubators. The incubator comprises an incubator body and a blocking piece, and the method for replacing the cold storage body comprises opening a side cover, taking out the cold storage body to be replaced from the box through a second opening; controlling the blocking piece to block the second opening; loading the new cold storage body into the box through the second opening; controlling the blocking piece to separate from the second opening; and closing the side cover.

[0004] As in the above technical solution, the cold storage body is placed in the box to slow down the temperature rise. The current cold storage box also adopts this way, but only the box is used for heat insulation, and the temperature rises quickly, so it is difficult to achieve long-term incubation. Therefore, how to prolong the temperature rise of the cold storage body and ensure that the object can be stored at low temperature for a long time has become a problem to be solved. SUMMARY

[0005] Therefore, the present application provides a cold storage incubator, a refrigeration module and an application method thereof, which can delay the temperature rise of the cold storage body and ensure long-term storage of the object.

[0006] The technical solution of the present application is as follows: On the one hand, the present application provides a cold storage incubator, which comprises a box, a cold storage part and a first cold storage body, wherein, The box has a cylindrical structure; The cold storage part is arranged in the box, and the cold storage part comprises an inner cylinder coaxially arranged with the box, an outer cylinder arranged outside the inner cylinder and relatively rotating with the inner cylinder, and a plurality of partitions arranged between the inner cylinder and the outer cylinder and connected with the inner cylinder; The adjacent two partitions form a cold storage cavity, and the first cold storage body is arranged in the cold storage cavity; A plurality of through grooves are formed in the outer cylinder, and the number of the through grooves is less than the number of the cold storage cavities.

[0007] On the basis of the above technical solution, preferably, the cold storage part further comprises a cylinder cover, one end of the inner cylinder is fixedly connected with the box, and one end of the outer cylinder is rotatably connected with the box. The cap is fastened onto the outer cylinder, and the inner cylinder passes through the cap.

[0008] Based on the above technical solutions, preferably, the enclosure includes a lower enclosure, an enclosure cover, and a grating panel, wherein, The cold storage section and the first cold storage body are located inside the lower chamber; The lid is fastened onto the lower box body; The grating is fitted onto the lower body and extends to the outside of the lid.

[0009] On the other hand, the present invention provides a refrigeration module for use in the aforementioned cold storage and insulation box, comprising a semiconductor cooling chip and a cooling fan, wherein, The thermoelectric cooler is arranged on the inner cylinder, with the cold end of the thermoelectric cooler located between the inner and outer cylinders, and the hot end of the thermoelectric cooler located inside the inner cylinder. The inner cylinder runs through the casing, and the cooling fan is located inside the inner cylinder.

[0010] Based on the above technical solutions, preferably, it also includes a flow guide frame, which comprises multiple lower frame bodies, multiple upper frame bodies, and multiple base plates, wherein... The lower frame is located on the outside of the lower housing and extends to the inside of the housing; The upper frame is installed inside the lower box, with one end of the upper frame inserted into the lower frame and the other end inserted into the cylinder cover; The base plate is located inside the lower box and connects to two adjacent upper frames.

[0011] Based on the above technical solutions, preferably, a second cold storage element is also included, and the housing further includes a bottom shell, wherein... The bottom shell is located on the end of the lower box body away from the box cover, and the lower frame body is located inside the bottom shell; Multiple second cold storage bodies are installed inside the bottom shell and are separated and fixed by the lower frame. The bottom shell is connected to the internal space of the box and / or the interior of the inner cylinder, and an air vent is provided on the bottom shell.

[0012] Based on the above technical solutions, the preferred embodiment also includes a circulating pump, which is installed inside the inner cylinder; The lower frame is connected to the upper frame, and the end of the lower frame away from the upper frame is connected to the air inlet of the circulating pump; The end of the upper frame furthest from the lower frame, as well as the outlet of the circulating pump, are connected to the cold storage chamber.

[0013] Based on the above technical solutions, preferably, the number of cold storage chambers is the same as the number of the first cold storage body; the number of through slots, semiconductor cooling chips and flow guides is the same and is half the number of cold storage chambers; In the initial state, half of the cold storage cavities are communicated with the inside of the box, and the semiconductor refrigerating sheet and the flow guide frame are arranged corresponding to the cold storage cavities not communicated with the box. The barrel cover is provided with a plurality of insertion slots, and the upper frame body is inserted with the insertion slots to selectively switch the cold storage cavities communicated with the box or make all the cold storage cavities communicated with the box.

[0014] Preferably, the baffle is provided with a baffle on both sides. The first cold storage body is provided in a fan-shaped structure, and the side of the first cold storage body is fixed by the baffle.

[0015] In another aspect, the application provides a method for using the above refrigeration module, comprising the following steps: S1, placing the first cold storage body in the cold storage cavity, rotating the outer barrel to make part of the cold storage cavities communicated with the inside of the box, and then installing the barrel cover, S2, installing the upper frame body on the lower frame body, and inserting the end of the upper frame body with the barrel cover to position the barrel cover and the outer barrel, S3, placing the goods in the box, and pressing the bottom plate to position the upper frame body; In use, the semiconductor refrigerating sheet works to refrigerate the cold storage cavities not communicated with the box, keeping the low temperature of the corresponding first cold storage body, and after the first cold storage body in the cold storage cavity communicated with the box is warmed up, the upper frame body is lifted to be separated from the lower frame body and the barrel cover, and then the barrel cover and the outer barrel are rotated to make the corresponding cold storage cavity of the semiconductor refrigerating sheet communicated with the box, and the cooling fan works to cool the semiconductor refrigerating sheet. In use, the circulating pump works, the airflow in the cold storage cavity enters the upper frame body, and then enters the circulating pump through the lower frame body, and then flows back to the cold storage cavity through the circulating pump, and in the airflow flow process, the inside space of the box is fully cooled; The cooling fan and the circulating pump do not work at the same time. In use, the bottom shell is selectively communicated with the inside space of the box or the inside of the inner barrel to refrigerate the goods or cool the semiconductor refrigerating sheet.

[0016] The cold storage heat preservation box, the refrigeration module and the application method thereof have the following advantages over the prior art: By arranging the cold storage part in the box, the cold storage cavities communicated with the box can be switched by rotating the outer barrel, so that in use, part of the cold storage bodies are used to refrigerate the goods, and the other part of the cold storage bodies can maintain low temperature for a long time under the isolation of the box and the outer barrel, and after the temperature of the previous cold storage body is increased, the outer barrel is rotated to switch, so that the cold storage cavity not communicated with the box is communicated, and the cold storage body in the cold storage cavity can continue to maintain low temperature, which can effectively prolong the low temperature storage time of the goods. Both the inner and outer cylinders are coaxially aligned with the cabinet body, which facilitates the installation of thermoelectric cooling chips and cooling fans inside the inner cylinder. Relying on the cooling effect of the thermoelectric cooling chips, the low-temperature storage time of some cold storage materials can be further extended. At the same time, the cooling fans can dissipate heat from the hot end of the thermoelectric cooling chips to ensure their cooling performance. When the cold storage materials cooled by the thermoelectric cooling chips are used to refrigerate items, the thermoelectric cooling chips stop operating. After the cold storage materials heat up, the thermoelectric cooling chips have finished dissipating heat and start cooling again, thus ensuring long-term low-temperature storage of items. The flow guide frame consists of a lower frame and an upper frame. The lower frame is mounted on the housing, while the upper frame is detachably connected to the lower frame, forming a detachable structure. The upper frame is also connected to the cylinder cover, which in turn is connected to the outer cylinder. Thus, during application, after rotating and adjusting the outer cylinder, the upper frame is inserted into the lower frame and then into the cylinder cover to position the outer cylinder, preventing rotation and thus avoiding interference with the connection between the cold storage chamber and the housing. The flow rack is also equipped with a base plate, which connects the adjacent upper rack. When items to be refrigerated are placed into the box, the base plate can be pressed down, which secures the upper rack and ensures a stable connection between the upper rack, lower rack, and lid. Furthermore, the flow rack also serves to separate and store items. By installing a second cold storage body in the bottom shell, and configuring the bottom shell to communicate with the interior of the cabinet and / or inner cylinder, the low temperature inside the cabinet can be ensured through the second cold storage body. This can ensure that the items are kept at a low temperature for a relatively short period of time. When the bottom shell is connected to the inner cylinder, the air vent and cooling fan can be opened, so that the airflow enters through the air vent and is cooled by the second cold storage body, which in turn cools the hot end of the semiconductor refrigeration chip, thus ensuring that the semiconductor refrigeration chip can work for a longer period of time. At this time, the cold storage chamber where the semiconductor refrigeration chip is installed is opened, and the cold storage chamber is connected to the interior of the cabinet, which can ensure that the temperature fluctuation of the items is small for a longer period of time, thereby reducing the rate of temperature rise of the items. By setting up a circulation pump, the cold air in the cold storage chamber can be circulated by the air guide frame, which helps to ensure a relatively uniform temperature inside the chamber and avoid local overheating or overcooling. At the same time, the bottom plate of the air guide frame is in direct contact with the refrigerated items, which can conduct heat and facilitate the removal of heat through the air guide frame to ensure the low-temperature storage of the items. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a perspective view of the cold storage and heat preservation box of the present invention; Figure 2 This is an exploded view of the cold storage and insulation box of the present invention; Figure 3 For the present invention Figure 2 Enlarged view of the structure at point A in the middle; Figure 4 This is a perspective view of the inner cylinder and partition structure of the cold storage and heat preservation box of the present invention; Figure 5 This is a front view of the cold storage and heat preservation box of the present invention; Figure 6 For the present invention Figure 5 Sectional view along the AA direction; Figure 7 This is a top view of the cold storage and heat preservation box of the present invention; Figure 8 For the present invention Figure 7 Cross-sectional view along the BB direction; Figure 9 This is a structural diagram of the flow guide frame and circulation pump of the refrigeration module of the present invention; Figure 10 A diagram showing the interconnected structure of all cold storage chambers in the cold storage and insulation box of the present invention; In the diagram: 1. Housing; 11. Lower housing; 12. Housing cover; 13. Grille; 14. Bottom shell; 1401. Air vent; 2. Cold storage section; 21. Inner cylinder; 22. Outer cylinder; 23. Partition; 231. Baffle; 24. Cylinder cover; 201. Through slot; 202. Slot; 3. First cold storage body; 4. Semiconductor cooling chip; 5. Cooling fan; 6. Air guide frame; 61. Lower frame; 62. Upper frame; 63. Bottom plate; 7. Second cold storage body; 8. Circulation pump; 100. Cold storage chamber. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0020] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0021] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0024] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. Additionally, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0025] like Figures 1-10 As shown, the cold storage and heat preservation box of the present invention includes a box body 1, a cold storage section 2, and a first cold storage body 3; like Figures 1-6As shown, the box body 1 has a cylindrical structure; the cold storage section 2 is disposed inside the box body 1. The cold storage section 2 includes an inner cylinder 21 coaxially disposed with the box body 1, an outer cylinder 22 sleeved on the outside of the inner cylinder 21 and rotating relative to it, and a plurality of partitions 23 located between the inner cylinder 21 and the outer cylinder 22 and connected to the inner cylinder 21; a cold storage cavity 100 is formed between two adjacent partitions 23, and a first cold storage body 3 is disposed inside the cold storage cavity 100; a plurality of through slots 201 are opened on the outer cylinder 22, and the number of through slots 201 is less than the number of cold storage cavities 100; As described above, the interior of the housing 1 is provided with a cold storage section 2. The cold storage section 2 forms a accommodating space through the inner cylinder 21 and the outer cylinder 22. This space is divided by the partition 23 to form multiple cold storage chambers 100. Each cold storage chamber 100 is provided with a first cold storage body 3. The outer cylinder 22 has a through groove 201, which can connect part of the cold storage chamber 100 with the internal space of the box 1, so that the first cold storage body 3 in this part of the cold storage chamber 100 can be used to refrigerate and store items. The first cold storage body 3 in another part of the cold storage chamber 100 is sealed by the outer cylinder 22 and the inner cylinder 21 to maintain a low temperature for a longer period of time. After the first cold storage body 3 in the cold storage chamber 100 previously connected to the box 1 is heated, the outer cylinder 22 is rotated to switch the cold storage chamber 100 connected to the box 1. The low-temperature first cold storage body 3 then continues to store the items at low temperatures, thus ensuring that the items are stored at low temperatures for a longer period of time. Preferably, the outer cylinder 22 and the inner cylinder 21 are made of materials with good thermal insulation properties to achieve double-layer thermal insulation with the box body 1, so as to keep it at a low temperature for a long time.

[0026] like Figure 3 and Figure 8 As shown, the cold storage unit 2 also includes a cylinder cover 24. One end of the inner cylinder 21 is fixedly connected to the box body 1, and one end of the outer cylinder 22 is rotatably connected to the box body 1. The cylinder cover 24 is fastened to the outer cylinder 22, and the inner cylinder 21 passes through the cylinder cover 24. As described above, the cold storage unit 2 is also provided with a cover 24 to seal the internal space of the inner cylinder 21 and the outer cylinder 22. The cover 24 is connected to the outer cylinder 22. Thus, when the outer cylinder 22 needs to be rotated, the cover 24 is rotated, and the outer cylinder 22 is rotated through the cover 24. The inner cylinder 21 passes through the cylinder cover 24, and the fitting structure can be used for positioning to ensure the convenience of assembling each component.

[0027] like Figure 2 As shown, the box 1 includes a lower box 11, a box cover 12 and a grid plate 13, wherein the cold storage unit 2 and the first cold storage body 3 are disposed inside the lower box 11; the box cover 12 is fastened to the lower box 11; the grid plate 13 is fitted onto the lower box 11 and extends to the outside of the box cover 12. As described above, the lower box 11 of the box 1 and the box cover 12 form an accommodating space for housing the cold storage unit 2 and the first cold storage body 3. The grating plate 13 is fitted onto the lower housing 11 and extends to the outside of the housing cover 12. The grating plate 13 provides good protection, preventing the lower housing 11 from being deformed by impact. It also protects the connection between the lower housing 11 and the housing cover 12 to prevent damage from external forces that could prevent the housing from opening, thus ensuring good application performance.

[0028] The cooling module of the present invention includes a semiconductor cooling chip 4, a heat dissipation fan 5, a flow guide 6, a second cold storage body 7, and a circulation pump 8.

[0029] like Figure 6 and Figure 8 As shown, the thermoelectric cooler 4 is arranged on the inner cylinder 21, with the cold end of the thermoelectric cooler 4 located between the inner cylinder 21 and the outer cylinder 22, and the hot end of the thermoelectric cooler 4 located inside the inner cylinder 21; the inner cylinder 21 penetrates the box body 1, and the cooling fan 5 is arranged inside the inner cylinder 21. As described above, in order to further ensure cooling performance, a semiconductor cooling chip 4 is provided. The inner cylinder 21 and the outer cylinder 22 are both coaxially arranged with the box body 1. This makes it convenient to arrange the semiconductor cooling chip 4 and the cooling fan 5 inside the inner cylinder 21. Relying on the cooling effect of the semiconductor cooling chip 4, the low-temperature storage time of some of the cold storage body can be further extended. When refrigerating items, some of the cold storage chambers 100 are connected to the internal space of the cabinet 1, while the cold storage chambers 100 that are not connected to the internal space of the cabinet 1 are equipped with semiconductor cooling chips 4, which are used to maintain the low temperature of the first cold storage body 3. Specifically, when the first cold storage body 3, cooled by the semiconductor refrigeration chip 4, refrigerates the items, the semiconductor refrigeration chip 4 stops. After the cold storage body heats up, the semiconductor refrigeration chip 4 dissipates heat and refrigerates again, thereby ensuring that the items are stored at low temperatures for a long time. Meanwhile, the hot end of the thermoelectric cooler 4 is located inside the inner cylinder 21, which facilitates the installation of the cooling fan 5. The cooling fan 5 can dissipate heat from the hot end of the thermoelectric cooler 4 to ensure the cooling performance of the thermoelectric cooler.

[0030] Specifically, a mobile power supply can be installed inside the inner cylinder 21 or on the outside of the box 1 to supply power to electrical components such as the semiconductor cooling chip 4 and the cooling fan 5.

[0031] like Figure 8 and Figure 9As shown, the flow guide 6 includes multiple lower frame bodies 61, multiple upper frame bodies 62, and multiple base plates 63. The lower frame bodies 61 are located on the outside of the lower housing 11 and extend to the inside of the housing 1. The upper frame bodies 62 are disposed inside the lower housing 11, with one end of the upper frame body 62 inserted into the lower frame body 61 and the other end inserted into the cylinder cover 24. The base plates 63 are disposed inside the lower housing 11 and connect two adjacent upper frame bodies 62. As described above, in the structure of the flow guide frame 6, there is a lower frame 61 and an upper frame 62. The lower frame 61 is installed in the lower box 11, and multiple lower frames 61, multiple upper frames 62 and multiple base plates 63 are arranged in a circular array with the axis of the box 1 as the reference. The upper frame 62 is inserted into the lower frame 61. The upper frame 62 and the lower frame 61 are detachably connected to form a disassembled structure. The upper frame 62 is also connected to the cylinder cover 24, which in turn is connected to the outer cylinder 22. Thus, in application, after rotating and adjusting the outer cylinder 22, the upper frame 62 and the lower frame 61 are inserted and then inserted into the cylinder cover 24 to achieve the positioning of the outer cylinder 22, thereby preventing the outer cylinder 22 from rotating and thus avoiding affecting the communication between the cold storage chamber 100 and the box 1. The flow guide 6 is also equipped with a base plate 63, which connects the adjacent upper shelf 62. When items to be refrigerated are placed into the box 1, the base plate 63 can be pressed down, which fixes the upper shelf 62 and ensures a stable connection between the upper shelf 62, the lower shelf 61, and the cylinder cover 24. Furthermore, the flow guide 6 also serves to separate and store items. like Figure 2 and Figure 8 As shown, the housing 1 also includes a bottom shell 14, wherein the bottom shell 14 is disposed on the end of the lower housing 11 away from the housing cover 12, and the lower frame 61 is located inside the bottom shell 14; multiple second cold storage bodies 7 are disposed inside the bottom shell 14 and are fixed by the lower frame 61; the bottom shell 14 is connected to the internal space of the housing 1 and / or the interior of the inner cylinder 21, and an air vent 1401 is provided on the bottom shell 14; As described above, the housing 1 is also provided with a bottom shell 14, which forms an accommodating space with the housing 1 for installing the second cold storage body 7. Multiple second cold storage bodies 7 are provided and are separated by the lower frame 61. When the second cold storage body 7 is set, the internal space of the bottom shell 14 is selectively connected with the interior of the box 1 or the inner cylinder 21. When the internal space of the bottom shell 14 is connected with the interior of the box 1, the low temperature inside the box 1 can be ensured by the second cold storage body 7. This can ensure that the items are kept at a low temperature for a relatively short period of time. When the bottom shell 14 is connected to the inner cylinder 21, the air vent 1401 and the cooling fan 5 can be opened. The airflow enters through the air vent 1401 and is cooled by the second cold storage body 7, which in turn cools the hot end of the semiconductor refrigeration chip 4, thus ensuring that the semiconductor refrigeration chip 4 can work for a longer period of time. At this time, the cold storage chamber 100 where the semiconductor refrigeration chip 4 is installed is opened, so that the cold storage chamber 100 is connected to the inside of the box, which can ensure that the temperature fluctuation of the refrigerated items is small for a longer period of time, thereby reducing the rate of temperature rise of the items.

[0032] like Figure 8 and Figure 9 As shown, the circulating pump 8 is installed inside the inner cylinder 21; the lower frame 61 is connected to the upper frame 62, and the end of the lower frame 61 away from the upper frame 62 is connected to the air inlet of the circulating pump 8; the end of the upper frame 62 away from the lower frame 61 and the air outlet of the circulating pump 8 are both connected to the cold storage chamber 100. As described above, the circulating pump 8 is used for airflow circulation. When the circulating pump 8 is working, the airflow in the cold storage chamber 100 will circulate in the guide frame 6 to ensure that the temperature in the chamber 1 is relatively balanced and to avoid local overheating or overcooling. Meanwhile, the base plate 63 of the air guide 6 is in direct contact with the refrigerated items, which can conduct heat and facilitate the removal of heat through the air guide 6 to ensure the low-temperature storage of the items. With this structure, when the bottom shell is connected to the interior of the housing 1, the lower frame 61 of the flow guide 6 can be used for airflow circulation and can also contact the second cold storage body 7 to achieve heat conduction, so as to ensure that the second cold storage body 7 is fully utilized within a unit time.

[0033] The number of cold storage chambers 100 is the same as that of the first cold storage body 3; the number of through slots 201, semiconductor cooling chips 4 and flow guides 6 is the same and is half the number of cold storage chambers 100; in the initial state, half of the cold storage chambers 100 are connected to the interior of the housing 1, and the semiconductor cooling chips 4 and flow guides 6 are set for the cold storage chambers 100 that are not connected to the housing 1; the cylinder cover 24 is provided with several slots 202, and the upper frame 62 is inserted into the slots 202 to selectively switch the cold storage chambers 100 connected to the housing 1, or to make all the cold storage chambers 100 connected to the housing 1; As described above, the cold storage chamber 100 is arranged in a ring around the inner cylinder 21, and each cold storage chamber 100 is provided with a first cold storage body 3; The number of through slots 201, semiconductor cooling chips 4 and flow guides 6 is half the number of cold storage chambers; In the initial state, half of the cold storage chambers 100 are connected to the interior of the housing 1 through the through slot 201, while the other half of the cold storage chambers 100 are in a closed state. The semiconductor cooling chip 4 and the flow guide 6 are set up to correspond to the closed state of the cold storage chambers 100. In the early stage of refrigeration, the first cold storage body 3, which is connected to the cold storage chamber 100 inside the cabinet 1, works first, and then the cold storage chamber 100 can be switched. like Figure 3 , Figure 8 and Figure 10 As shown, when it is necessary to switch the cold storage chamber 100, lift the guide frame 6 to separate the upper frame 62 from the lower frame 61. At this time, the outer cylinder 22 can be rotated to switch the cold storage chamber 100 corresponding to the through slot 201. Then, the guide frame 6 can be lowered for positioning. Among them, such as Figure 10 As shown, in some embodiments, it is also possible to switch to a single through slot 201 corresponding to two cold storage chambers 100, so that all the first cold storage bodies 3 and semiconductor cooling chips 4 can work simultaneously to ensure the best refrigeration performance.

[0034] like Figure 4 and Figure 6 As shown, baffles 231 are provided on both sides of the partition 23; the first cold storage body 3 is configured as a fan-shaped structure, and the side of the first cold storage body 3 is supported and fixed by the baffles 231. As described above, a baffle 231 is provided on the side wall of the partition 23, and the first cold storage body 3 is configured with a fan-shaped structure. Figure 6 As shown, due to the above structure, the baffle 231 is used to limit the position of the first cold storage body 3, which can ensure the stability of the position of the first cold storage body 3. Meanwhile, the baffle 231 ensures that the first cold storage body 3 does not come into close contact with the semiconductor cooling chip 4, thereby avoiding affecting the cooling performance of the semiconductor cooling chip 4. Meanwhile, the baffle 231 also provides a gas flow channel, which can ensure smooth gas flow when the circulating pump 8 is working, so as to ensure temperature balance.

[0035] The application method of the refrigeration module of the present invention includes the following steps: S1. Place the first cold storage body 3 into the cold storage chamber 100, rotate the outer cylinder 22 to connect part of the cold storage chamber 100 with the interior of the housing 1, and then install the cylinder cover 24. S2. Install the upper frame 62 onto the lower frame 61, and insert the end of the upper frame 62 into the cylinder cover 24 to position the cylinder cover 24 and the outer cylinder 22. S3. Place items into the box 1 and press down the bottom plate 63 to position the upper frame 62. In application, the semiconductor refrigeration chip 4 works to cool the cold storage chamber 100 that is not connected to the housing 1, maintaining the low temperature of the corresponding first cold storage body 3. After the first cold storage body 3 in the cold storage chamber 100 connected to the housing 1 heats up, the upper frame 62 is lifted to separate it from the lower frame 61 and the cylinder cover 24. Then, the cylinder cover 24 and the outer cylinder 22 are rotated to connect the cold storage chamber 100 corresponding to the semiconductor refrigeration chip 4 with the housing 1. At the same time, the cooling fan 5 works to dissipate heat from the semiconductor refrigeration chip 4. In application, the circulating pump 8 operates, and the airflow in the cold storage chamber 100 enters the upper frame 62, then enters the circulating pump 8 through the lower frame 61, and then flows back to the cold storage chamber 100 through the circulating pump 8. During the airflow process, the internal space of the box 1 is ensured to be fully cooled. In this configuration, the cooling fan 5 and the circulating pump 8 do not operate simultaneously. In application, the bottom shell 14 is selectively connected to the internal space of the box 1 or the interior of the inner cylinder 21 to refrigerate items or cool the semiconductor cooling chip 4.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A cold storage and heat preservation box, characterized in that: It includes a housing (1), a cold storage section (2), and a first cold storage body (3), wherein, The box (1) has a cylindrical structure; The cold storage unit (2) is disposed inside the box body (1). The cold storage unit (2) includes an inner cylinder (21) coaxially disposed with the box body (1), an outer cylinder (22) sleeved on the outside of the inner cylinder (21) and rotating relative to it, and a plurality of partitions (23) located between the inner cylinder (21) and the outer cylinder (22) and connected to the inner cylinder (21). A cold storage cavity (100) is formed between two adjacent partitions (23), and the first cold storage body (3) is disposed in the cold storage cavity (100); The outer cylinder (22) has multiple through slots (201), the number of which is less than the number of the cold storage chambers (100).

2. The cold storage and heat preservation box as described in claim 1, characterized in that: The cold storage unit (2) also includes a cylinder cover (24), one end of the inner cylinder (21) is fixedly connected to the box body (1), and one end of the outer cylinder (22) is rotatably connected to the box body (1); The cap (24) is fastened to the outer cylinder (22), and the inner cylinder (21) passes through the cap (24).

3. The cold storage and heat preservation box as described in claim 2, characterized in that: The enclosure (1) includes a lower enclosure (11), an enclosure cover (12), and a grid panel (13), wherein, The cold storage unit (2) and the first cold storage body (3) are disposed inside the lower housing (11); The lid (12) is fastened to the lower box body (11); The grating plate (13) is fitted onto the lower housing (11), and the grating plate (13) extends to the outside of the housing cover (12).

4. A refrigeration module, applied to the cold storage and insulation box as described in claim 3, characterized in that: Includes a semiconductor cooling chip (4) and a cooling fan (5), wherein, The semiconductor cooling chip (4) is arranged on the inner cylinder (21), with the cold end of the semiconductor cooling chip (4) located between the inner cylinder (21) and the outer cylinder (22), and the hot end of the semiconductor cooling chip (4) located inside the inner cylinder (21). The inner cylinder (21) penetrates the box body (1), and the cooling fan (5) is located inside the inner cylinder (21).

5. The cooling module as described in claim 4, characterized in that: It also includes a flow guide frame (6), which comprises multiple lower frame bodies (61), multiple upper frame bodies (62), and multiple base plates (63), wherein, The lower frame (61) is located outside the lower box (11), and the lower frame (61) extends to the inside of the box (1); The upper frame (62) is disposed inside the lower box (11), one end of the upper frame (62) is inserted into the lower frame (61), and the other end is inserted into the cylinder cover (24); The base plate (63) is disposed inside the lower box (11), and the base plate (63) connects two adjacent upper frames (62).

6. The cooling module as described in claim 5, characterized in that: It also includes a second cold storage body (7), and the housing (1) also includes a bottom shell (14), wherein, The bottom shell (14) is located on one end of the lower box (11) away from the box cover (12), and the lower frame (61) is located inside the bottom shell (14); The second cold storage body (7) is provided in multiple units inside the bottom shell (14) and is separated and fixed by the lower frame (61); The bottom shell (14) is connected to the internal space of the box body (1) and / or the interior of the inner cylinder (21), and an air vent (1401) is provided on the bottom shell (14).

7. The refrigeration module as described in claim 6, characterized in that: It also includes a circulation pump (8), which is disposed inside the inner cylinder (21); The lower frame (61) is connected to the upper frame (62), and the end of the lower frame (61) away from the upper frame (62) is connected to the air inlet of the circulating pump (8). The end of the upper frame (62) away from the lower frame (61) and the outlet of the circulating pump (8) are both connected to the cold storage chamber (100).

8. The refrigeration module as described in claim 7, characterized in that: The number of cold storage chambers (100) is the same as the number of the first cold storage bodies (3); The number of the through slots (201), the semiconductor cooling chip (4), and the flow guide (6) are the same, and the number is half that of the cold storage chambers (100); In the initial state, half of the cold storage chambers (100) are connected to the interior of the housing (1), and the semiconductor cooling chip (4) and the flow guide (6) are set for the cold storage chambers (100) that are not connected to the housing (1); The cylinder cover (24) has several slots (202), and the upper frame (62) is inserted into the slots (202) to selectively switch the cold storage chamber (100) connected to the box (1), or to make all cold storage chambers (100) connected to the box (1).

9. The refrigeration module as described in claim 4, characterized in that: Both sides of the partition (23) are provided with baffles (231); The first cold storage body (3) is configured as a fan-shaped structure, and the side of the first cold storage body (3) is held and fixed by the baffle (231).

10. A method for applying the refrigeration module as described in claim 8, characterized in that, Includes the following steps: S1. Place the first cold storage body (3) into the cold storage chamber (100), rotate the outer cylinder (22) to make part of the cold storage chamber (100) communicate with the interior of the box (1), and then install the cylinder cover (24). S2. Install the upper frame (62) onto the lower frame (61) and insert the end of the upper frame (62) into the cylinder cover (24) to position the cylinder cover (24) and the outer cylinder (22). S3. Place items into the box (1) and press down the bottom plate (63) to position the upper frame (62). In application, the semiconductor refrigeration chip (4) works to cool the cold storage cavity (100) that is not connected to the housing (1), maintaining the low temperature of the first cold storage body (3). After the first cold storage body (3) in the cold storage cavity (100) connected to the housing (1) heats up, the upper frame (62) is lifted to separate it from the lower frame (61) and the cylinder cover (24). Then, the cylinder cover (24) and the outer cylinder (22) are rotated to connect the cold storage cavity (100) corresponding to the semiconductor refrigeration chip (4) with the housing (1). At the same time, the cooling fan (5) works to dissipate heat from the semiconductor refrigeration chip (4). In application, the circulation pump (8) operates, and the airflow in the cold storage chamber (100) enters the upper frame (62), then enters the circulation pump (8) through the lower frame (61), and then flows back to the cold storage chamber (100) through the circulation pump (8). During the airflow process, the internal space of the box (1) is ensured to be fully cooled. The cooling fan (5) and the circulating pump (8) do not operate simultaneously; In application, the bottom shell (14) is selectively connected to the internal space of the box (1) or the interior of the inner cylinder (21) to refrigerate the items or cool the semiconductor cooling chip (4).

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