A miniaturized hybrid bridge coupling filter combining module based on copper-based LTCC

Abstract

The application discloses a miniaturized hybrid bridge coupling filter combining module based on a copper-based LTCC and belongs to the technical field of wireless communication, which comprises a ceramic block Sub, the inner bottom side of the ceramic block Sub is provided with a symmetrically distributed first quadrature hybrid bridge C1 and a second quadrature hybrid bridge C2; the inner top side of the ceramic block Sub is provided with a parallel first band-pass filter F1 and a second band-pass filter F2; the first quadrature hybrid bridge C1 and the second quadrature hybrid bridge C2 are located in the lower half of the ceramic block Sub, while the first band-pass filter F1 and the second band-pass filter F2 are located in the upper half of the ceramic block Sub; and the compact and miniaturized product design is realized by using the stacked structure of the hybrid bridge and the filter, and the technical problem that the realization of the hybrid bridge coupling filter combining module in the prior art contains two same 90° electric bridges and channel filters, thereby resulting in a large volume in the traditional cavity scheme is solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of wireless communication, and relates to a hybrid electric bridge coupling filter combining module, in particular to a miniaturized hybrid electric bridge coupling filter combining module based on a copper-based LTCC. BACKGROUND

[0002] A microwave multiplexer is used for separating or synthesizing microwave spectrum signals and is an important component in a communication system. Modern microwave systems, especially full flexible payload systems, have higher and higher requirements for the reconfigurability and frequency multiplexing characteristics of the microwave multiplexer. A scheme based on a hybrid electric bridge coupling filter combining module can follow modular design, which allows additional channels to be added to the system in the future without affecting the existing design of the multiplexer. Moreover, the module is a four-port network, which makes it possible to flexibly implement a frequency multiplexing system. However, the implementation of the hybrid electric bridge coupling filter combining module includes two identical 90° electric bridges and channel filters, which results in a large volume in a traditional cavity scheme and thus the module is not adopted.

[0003] Therefore, there is an urgent need for a miniaturized hybrid electric bridge coupling filter combining module based on a copper-based LTCC, which can provide a key technical scheme for the miniaturization and integration of modern microwave systems, especially full flexible payload systems. SUMMARY

[0004] In view of the deficiencies in the prior art, the purpose of the present application is to provide a miniaturized hybrid electric bridge coupling filter combining module based on a copper-based LTCC, which solves the technical problem that the implementation of the hybrid electric bridge coupling filter combining module in the prior art includes two identical 90° electric bridges and channel filters, resulting in a large volume in a traditional cavity scheme.

[0005] To solve the above technical problems, the present application adopts the following technical solutions:

[0006] A miniaturized hybrid electric bridge coupling filter combining module based on a copper-based LTCC, comprising a ceramic block Sub, wherein the inside bottom side of the ceramic block Sub is provided with a symmetrically distributed first orthogonal hybrid bridge C1 and a second orthogonal hybrid bridge C2; the inside top side of the ceramic block Sub is provided with a parallel first band-pass filter F1 and a second band-pass filter F2; the inside middle part of the ceramic block Sub is provided with a third metal ground GND3; the top and bottom of the ceramic block Sub are respectively provided with a first metal ground GND1 and a second metal ground GND2, and the sidewall of the ceramic block Sub is provided with a fourth metal ground GND4.

[0007] The inside of the ceramic block Sub is provided with a plurality of third metalized blind holes V3 penetrating the third metal ground GND3, and the plurality of third metalized blind holes V3 are electrically connected with the first quadrature hybrid bridge C1 and the first and second band pass filters F1 and F2, and the second quadrature hybrid bridge C2 and the first and second band pass filters F1 and F2, respectively.

[0008] The first and second band pass filters F1 and F2 each include at least one resonator, and the resonator includes four layers of metal layers arranged alternately.

[0009] The first and second quadrature hybrid bridges C1 and C2 are provided with a row of second metalized blind holes V2 connected with the third metal ground GND3 and the second metal ground GND2 at two ends, respectively, and the second metalized blind holes V2 are located at the center of the input port connection line or the center of the stop port connection line of the first and second quadrature hybrid bridges C1 and C2.

[0010] The first and second band pass filters F1 and F2 are provided with two rows of first metalized blind holes V1 connected with the first metal ground GND1 and the third metal ground GND3.

[0011] The application also includes the following technical features:

[0012] The center connection line of the first and second band pass filters F1 and F2 is 90 degrees with the center connection line of the first and second quadrature hybrid bridges C1 and C2.

[0013] The fourth layer of metal layer of the first band pass filter F1 is provided with a first input end feed line E11 and a second input end feed line E12, and the fourth layer of metal layer of the second band pass filter F2 is provided with a first output end feed line E21 and a second output end feed line E22; the through port and the coupling port of the first quadrature hybrid bridge C1 are connected with the second input end feed line E12 and the second output end feed line E22 of the first and second band pass filters F1 and F2, respectively; and the through port and the coupling port of the second quadrature hybrid bridge C2 are connected with the first input end feed line E11 and the first output end feed line E21 of the first and second band pass filters F1 and F2, respectively.

[0014] The first and second layers and the third and fourth layers of the resonator are formed with loading capacitors.

[0015] The second and third layers of the resonator are connected through blind holes Rp.

[0016] The ceramic block Sub is obtained by sintering a plurality of layers of ceramic paste.

[0017] Compared with the prior art, the present application has the beneficial technical effects that:

[0018] (I) In the present application, the first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2 are located in the lower half of the ceramic block Sub, and the first band-pass filter F1 and the second band-pass filter F2 are located in the upper half of the ceramic block Sub, and a third metal ground GND3 is introduced between them to realize electromagnetic isolation between the first orthogonal hybrid bridge C1, the second orthogonal hybrid bridge C2, the first band-pass filter F1 and the second band-pass filter F2, and the signal line is realized by slotting on the third metal ground GND3 in the middle and setting the third metalized blind hole V3. At the same time, the second metalized blind hole V2 is arranged between the centers of the connection lines of the first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2, and the first metalized blind hole V1 is arranged at the center of the connection line of the first band-pass filter F1 and the second band-pass filter F2, and the first metalized blind hole V1 and the second metalized blind hole V2 constitute an effective ground shielding hole array, which can effectively eliminate the parasitic coupling between the two hybrid bridges and the two band-pass filters, greatly reduce the electromagnetic signal interference between the first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2 and between the first band-pass filter F1 and the second band-pass filter F2, and realize compact and small product design by using the hybrid bridge and filter stacked structure, solving the technical problem that the implementation of the hybrid bridge coupling filter combining module in the prior art contains two same 90° electric bridges and channel filters, resulting in a large volume in the traditional cavity scheme.

[0019] (II) The present application is composed of two band-pass filters with the same structure and two orthogonal hybrid bridges, the signal input from the port P1 enters the input end of the two same channel filters through the main road hybrid electric bridge, and after the output hybrid bridge, the signal in the passband of the band-pass filter is output from the port P4, and other frequency signals are output from the port P2, at this time, the port P3 is in an isolated state to the channel signal. After the signal input from the port P3 passes through the hybrid electric bridge coupling filter combining module, the signal in the passband of the band-pass filter will be output from the port P2, and other frequency component signals will be output from the port P1, thereby realizing signal frequency multiplexing.

[0020] (III) The first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2 adopt a two-order structure and are arranged in the same metal layer, and the same structure improves the performance consistency of the orthogonal hybrid bridge in the processed product. Similarly, the first band-pass filter F1 and the second band-pass filter F2 also adopt the same structure and are arranged in the same metal layer, and the same connection structure is adopted, which improves the performance consistency of the two band-pass filters and the phase consistency of the connection structure in the actual processed product. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The oblique axis drawing of the present application;

[0022] Figure 2 This is a side view of the present invention;

[0023] Figure 3 This is a top view of the present invention;

[0024] Figure 4 This is an oblique axonometric view of the first orthogonal hybrid bridge C1 in this invention;

[0025] Figure 5 This is a top view of the first orthogonal hybrid bridge C1 in this invention;

[0026] Figure 6 This is an oblique axonometric view of bandpass filter F1 in this invention;

[0027] Figure 7 This is a top view of the first bandpass filter F1 in this invention;

[0028] Figure 8 The principle block diagram of the hybrid bridge coupled filter combining module;

[0029] Figure 9 The above is the simulation response curve obtained from the simulation example in this invention.

[0030] It should be noted that the accompanying drawings in this invention are used to illustrate the spatial relationship between the various components.

[0031] The specific content of the present invention will be further explained in detail below with reference to the embodiments. Detailed Implementation

[0032] It should be noted that, unless otherwise specified, all components in this invention are those known in the art.

[0033] The following are specific embodiments of the present invention. It should be noted that the present invention is not limited to the following specific embodiments. All equivalent modifications made based on the technical solutions of this application fall within the protection scope of the present invention.

[0034] This invention provides a miniaturized hybrid bridge coupled filter combining module based on copper-based LTCC, such as... Figures 1-8 As shown, the device includes a ceramic block Sub. Symmetrically distributed orthogonal hybrid bridges C1 and C2 are arranged on the bottom side of the ceramic block Sub. Parallel bandpass filters F1 and F2 are arranged on the top side of the ceramic block Sub. A metal ground GND3 is arranged in the middle of the ceramic block Sub. Metal grounds GND1 and GND2 are arranged on the top and bottom of the ceramic block Sub, respectively. A metal ground GND4 is arranged on the sidewall of the ceramic block Sub.

[0035] The ceramic block Sub has multiple metallized blind vias V3 that penetrate the third metal ground GND3. The multiple metallized blind vias V3 are electrically connected to the first orthogonal hybrid bridge C1 and the first bandpass filter F1 and the second bandpass filter F2, respectively, as well as the second orthogonal hybrid bridge C2 and the first bandpass filter F1 and the second bandpass filter F2.

[0036] Both the first bandpass filter F1 and the second bandpass filter F2 include resonators R1, R2, R3, R4 and R5 arranged sequentially. Each of the resonators R1, R2, R3, R4 and R5 includes four metal layers arranged in an alternating manner.

[0037] A row of metallized blind vias V2 is provided between the first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2. The two ends of the vias V2 are connected to the third metal ground GND3 and the second metal ground GND2 respectively. The second metallized blind via V2 is located at the center of the line connecting the input ports of the first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2 or at the center of the line connecting the cut-off ports.

[0038] Bandpass filter F1 and bandpass filter F2 are provided with two rows of metallized blind vias V1 that connect to metal ground GND1 and metal ground GND3.

[0039] In the above technical solution, the input port and cutoff port of the first orthogonal hybrid bridge C1 can be used as the isolation port P3 and output port P4 of the module; the input port and cutoff port of the second orthogonal hybrid bridge C2 can be used as the input port P1 and suppression port P2 of the module.

[0040] Inside the ceramic substrate, two orthogonal hybrid bridges symmetrically distributed at the bottom and two identical bandpass filters arranged parallel to each other at the top form a dual-channel network through vertical interconnection. Each bandpass filter contains a resonator composed of four interlaced metal layers, ensuring high performance and miniaturization. When a signal is input from port P1, it is split into two orthogonal signals by the main hybrid bridge and passed through the two filters respectively. The signal within the passband is superimposed in phase in the output hybrid bridge and output from port P4, while the out-of-band signal is canceled out of phase and output from port P2. Conversely, when the signal is input from port P3, the signal within the passband is output from port P2, and the out-of-band signal is output from port P1, thereby achieving frequency selection and separation and completing the signal duplexing function.

[0041] In this design, all metals used inside the ceramic block Sub are made of copper.

[0042] The first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2 are located in the lower half of the ceramic block Sub, while the first bandpass filter F1 and the second bandpass filter F2 are located in the upper half of the ceramic block Sub. The third metal ground GND3 is introduced between them to achieve electromagnetic isolation between the first orthogonal hybrid bridge C1, the second orthogonal hybrid bridge C2, the first bandpass filter F1, and the second bandpass filter F2. The signal line is implemented by slotting the third metal ground GND3 in the middle and setting the third metallized blind via V3. Meanwhile, a second metallized blind via V2 is set between the center of the connecting lines of the first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2, and a first metallized blind via V1 is set at the center of the connecting lines of the first bandpass filter F1 and the second bandpass filter F2. The first metallized blind via V1 and the second metallized blind via V2 constitute an effective grounding shielding via array, which can effectively eliminate parasitic coupling between the two hybrid bridges and between the two bandpass filters, greatly reducing electromagnetic signal interference between the first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2 and between the first bandpass filter F1 and the second bandpass filter F2. Furthermore, the stacked structure of the hybrid bridges and filters realizes a compact and miniaturized product design, solving the technical problem that the implementation of the hybrid bridge coupling filter combining module in the prior art involves two identical 90° bridges and channel filters, resulting in a large volume in the traditional cavity scheme.

[0043] The center line connecting bandpass filter F1 and bandpass filter F2 forms a 90-degree angle with the center line connecting orthogonal hybrid bridge C1 and orthogonal hybrid bridge C2.

[0044] In the above technical solution, the connection wire lengths of the first orthogonal hybrid bridge C1 and the second orthogonal hybrid bridge C2 are equal to those of the first bandpass filter F1 and the second bandpass filter F2.

[0045] The fourth metal layer of bandpass filter F1 has a first input feed line E11 and a second input feed line E12. The fourth metal layer of bandpass filter F2 has a first output feed line E21 and a second output feed line E22. The through port and coupling port of quadrature hybrid bridge C1 are respectively connected to the second input feed line E12 and the second output feed line E22 of bandpass filter F1 and bandpass filter F2. The through port and coupling port of quadrature hybrid bridge C2 are respectively connected to the first input feed line E11 and the first output feed line E21 of bandpass filter F1 and bandpass filter F2.

[0046] In the above technical solution, it consists of two identical bandpass filters and two orthogonal hybrid bridges. The signal input at port P1 enters the input terminals of the two identical channel filters through the main hybrid bridge. After passing through the output hybrid bridge, the signal within the passband of the bandpass filter is output from port P4, while other frequency signals are output from port P2. At this time, port P3 is isolated from the channel signals. The signal input at port P3, after passing through the hybrid bridge coupling filter combining module, will have the signal within the passband of the bandpass filter output from port P2, while other frequency components will be output from port P1, thereby achieving signal frequency multiplexing.

[0047] A loading capacitance is formed between the first and second layers and between the third and fourth layers of each resonator.

[0048] In the above technical solution, this configuration is used to increase the electrical length of the resonator, thereby achieving miniaturization of the first bandpass filter F1 and the second bandpass filter F2.

[0049] The second and third layers of the resonator are connected by blind holes Rp.

[0050] In the above technical solution, this configuration can effectively improve the unloaded Q value of the resonator.

[0051] The ceramic block Sub is obtained by sintering multiple layers of ceramic slurry.

[0052] Preferably, the quantity and thickness of the ceramic slurry layer are determined according to the actual process, and the thickness of the ceramic slurry layer can be selected as 0.1 mm.

[0053] Simulation example:

[0054] The designed filter combining module was subjected to full-wave electromagnetic simulation in Ansys EM Suite 2020 simulation software, and its S-parameter simulation response curve is shown in Figure 9. The simulation results clearly verify the working principle and performance of the module: when the signal is input from port P1, within the passband frequency range of the bandpass filter, the signal is mainly output from port P4; while the frequency components outside the passband (i.e., the stopband signal) are routed to port P2 for output. At the same time, port P3 maintains high isolation from the input signal throughout the entire frequency band. The center frequency of the module is 4.25 GHz, and its 1 dB bandwidth is approximately 0.5 GHz. Within the passband, the return loss (S11, S22, S33, S44) of all four ports (P1, P2, P3, P4) is better than 20 dB, indicating good port matching and extremely low reflected energy, demonstrating the excellent performance of the proposed solution.

Claims

1. A miniaturized hybrid bridge coupled filter combining module based on copper-based LTCC, comprising a ceramic block (Sub), characterized in that, The ceramic block (Sub) has a symmetrically distributed first orthogonal hybrid bridge (C1) and second orthogonal hybrid bridge (C2) on its inner bottom side; a parallel first bandpass filter (F1) and second bandpass filter (F2) are arranged on the inner top side of the ceramic block (Sub); a third metal ground (GND3) is arranged in the middle of the ceramic block (Sub); a first metal ground (GND1) and a second metal ground (GND2) are arranged at the top and bottom of the ceramic block (Sub) respectively; and a fourth metal ground (GND4) is arranged on the side wall of the ceramic block (Sub). The ceramic block (Sub) has multiple metallized blind vias (V3) that penetrate the third metal ground (GND3) inside. The multiple metallized blind vias (V3) are electrically connected to the first orthogonal hybrid bridge (C1) and the first bandpass filter (F1) and the second bandpass filter (F2), respectively, as well as the second orthogonal hybrid bridge (C2) and the first bandpass filter (F1) and the second bandpass filter (F2). Both the first bandpass filter (F1) and the second bandpass filter (F2) include at least one resonator, and the resonator includes four staggered metal layers; Between the first orthogonal hybrid bridge (C1) and the second orthogonal hybrid bridge (C2), there is a row of second metallized blind vias (V2) with both ends connected to the third metal ground (GND3) and the second metal ground (GND2) respectively. The second metallized blind vias (V2) are located at the center of the line connecting the input ports of the first orthogonal hybrid bridge (C1) and the second orthogonal hybrid bridge (C2) or at the center of the line connecting the cut-off ports. The first bandpass filter (F1) and the second bandpass filter (F2) are provided with two rows of first metallized blind vias (V1) connecting the first metal ground (GND1) and the third metal ground (GND3).

2. The miniaturized hybrid bridge coupled filter combining module based on copper-based LTCC as described in claim 1, characterized in that, The center line connecting the first bandpass filter (F1) and the second bandpass filter (F2) forms a 90-degree angle with the center line connecting the first orthogonal hybrid bridge (C1) and the second orthogonal hybrid bridge (C2).

3. The miniaturized hybrid bridge coupled filter combining module based on copper-based LTCC as described in claim 1, characterized in that, The first bandpass filter (F1) has a first input feed line (E11) and a second input feed line (E12) on its fourth metal layer. The second bandpass filter (F2) has a first output feed line (E21) and a second output feed line (E22) on its fourth metal layer. The through port and coupling port of the first quadrature hybrid bridge (C1) are respectively connected to the second input feed line (E12) and the second output feed line (E22) of the first bandpass filter (F1) and the second bandpass filter (F2). The through port and coupling port of the second quadrature hybrid bridge (C2) are respectively connected to the first input feed line (E11) and the first output feed line (E21) of the first bandpass filter (F1) and the second bandpass filter (F2).

4. The miniaturized hybrid bridge coupled filter combining module based on copper-based LTCC as described in claim 1, characterized in that, Loading capacitors are formed between the first and second layers and between the third and fourth layers of the resonator.

5. The miniaturized hybrid bridge coupled filter combining module based on copper-based LTCC as described in claim 1, characterized in that, The second and third layers of the resonator are connected by blind vias (Rp).

6. The miniaturized hybrid bridge coupled filter combining module based on copper-based LTCC as described in claim 1, characterized in that, The ceramic block (Sub) is obtained by sintering multiple layers of ceramic slurry.

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