Preparation method of display module, display module and display device

Abstract

The invention provides a preparation method of a display module, the display module and a display device. The display module comprises a display panel and a polaroid arranged on the light emitting side of the display panel. The display panel comprises a substrate, a display area formed on the substrate, a hole opening area and an isolation area located between the display area and the hole opening area, and the isolation area comprises an inner isolation area, a middle isolation area and an outer isolation area which are sequentially distributed in the direction from the display area to the hole opening area. The isolation region comprises a first metal layer and a multi-layer functional film layer which are sequentially stacked on the substrate, the first metal layer is at least partially located in the outer isolation region, and the multi-layer functional film layer is provided with a via hole penetrating to the first metal layer in the outer isolation region; the orthographic projection of the first metal layer on the substrate covers the orthographic projection of the via hole on the substrate, and the via hole is filled with a first colloid for connecting the first metal layer and the polaroid.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display. More particularly, it relates to a preparation method of display module, display module and display device. BACKGROUND

[0002] With the extreme pursuit of full-screen display effect of smart phones, tablet computers and other electronic devices, the AA hole in the display area has become the mainstream technical direction. This technology cuts a specific hollow pattern in the display area through laser and other methods after the manufacturing process of the OLED panel is completed, to reserve a light window for the camera module, thereby maximizing the display area while ensuring the imaging function of the camera module.

[0003] However, the film layer structure of the OLED panel is becoming more and more complex. In the lamination (Lami) process, laser cutting process and subsequent reliability test or use process of the device, the back plate BP around the camera module opening and the light emitting layer EL are prone to peeling, resulting in visible hole black spots (GDSH). SUMMARY

[0004] The purpose of the present disclosure is to provide a preparation method of display module, display module and display device to solve at least one of the above technical problems.

[0005] To achieve the above purpose, the present disclosure adopts the following technical solutions: The first aspect of the present disclosure provides a display module, comprising a display panel and a polarizer arranged on the light-emitting side of the display panel, the display panel comprising a substrate, a display area formed on the substrate, an opening area, and an isolation area between the display area and the opening area, the isolation area comprising an inner isolation area, a middle isolation area and an outer isolation area distributed in turn from the display area towards the opening area, the isolation area comprising a first metal layer and a plurality of functional film layers stacked in turn on the substrate, the first metal layer being at least partially located in the outer isolation area, the plurality of functional film layers being provided with a via hole penetrating to the first metal layer in the outer isolation area, the first metal layer covering the via hole on the substrate, and the via hole being filled with a first adhesive connecting the first metal layer and the polarizer.

[0006] Optionally, the display area comprises a light-shielding metal layer and a gate layer arranged on the substrate, and the first metal layer is arranged in the same layer as the light-shielding metal layer or the gate layer.

[0007] Optionally, the outer isolation area comprises an edge region close to the opening area, and the via hole is arranged in the edge region.

[0008] Optionally, the multi-layer functional film layer comprises a source-drain metal layer, the source-drain metal layer forms a plurality of inner isolation columns located in the inner isolation region and a plurality of outer isolation columns located in the outer isolation region, the plurality of outer isolation columns at least comprises a first outer isolation column and a second outer isolation column which are sequentially distributed from the opening region to the display region, the orthogonal projection of the via on the substrate is located on a first side of a first boundary line of the orthogonal projection of the second outer isolation column on the substrate, the first boundary line is a boundary line of the orthogonal projection of the second outer isolation column on the substrate close to the display region, and the first side is a side of the first boundary line away from the display region.

[0009] Optionally, the number of vias is a plurality, and the plurality of vias are distributed along the circumferential direction of the opening region.

[0010] Optionally, the cross-sectional shape of the via is annular around the opening region.

[0011] Optionally, the length of the first metal layer in the direction from the opening region to the display region is 20-200 microns, and the aperture of the via in the direction from the opening region to the display region is 20-200 microns.

[0012] Optionally, the first metal layer is provided in the same layer as the light-shielding metal layer, and the multi-layer functional film layer comprises a gate insulating layer, a gate layer, a dielectric layer, a passivation layer, a source-drain metal layer, a light-emitting material layer, an encapsulation layer, and a protective layer which are sequentially stacked away from the substrate.

[0013] Optionally, the first adhesive is a modulus control type frame sealant.

[0014] The second aspect of the present disclosure provides a preparation method of a display module, comprising the following steps: Preparation of a display panel, the display panel comprises a substrate, a display region formed on the substrate, an opening region, and an isolation region between the display region and the opening region, the isolation region comprises an inner isolation region, an intermediate isolation region, and an outer isolation region which are sequentially distributed from the display region to the opening region, the isolation region comprises a first metal layer and a multi-layer functional film layer which are sequentially stacked on the substrate, the first metal layer is at least partially located in the outer isolation region, the multi-layer functional film layer is provided with a via penetrating to the first metal layer in the outer isolation region, and the orthogonal projection of the first metal layer on the substrate covers the orthogonal projection of the via on the substrate. Attaching a polarizing plate on the light-emitting side of the display panel, and filling the via with a first adhesive connecting the first metal layer and the polarizing plate after attaching the polarizing plate.

[0015] Optionally, the step of attaching a polarizing plate on the light-emitting side of the display panel comprises: The polarizing plate is attached on the light-emitting side of the display panel after coating the modulus control type frame sealant, and the modulus control type frame sealant filled in the via hole forms the first adhesive; The polarizing plate provided with the modulus control type frame sealant is attached on the light-emitting side of the display panel, and the modulus control type frame sealant is filled into the via hole to form the first adhesive during the attachment process.

[0016] The third aspect of the present disclosure provides a display device comprising the display module as described above.

[0017] The beneficial effects of the present disclosure are as follows: The display module of the present disclosure embodiment is provided with a via hole penetrating to the first metal layer in the outer isolation area, and the first adhesive is filled in the via hole, at this time the first adhesive forms a rivet structure with the first metal layer close to the bottom of the display panel, which can enhance the longitudinal bonding strength of each film layer of the display panel at the position of the outer isolation area, avoid the crack extending to the middle isolation area or even the inner isolation area during the subsequent laser cutting camera hole cutting, reduce the peeling risk of the light-emitting layer and the lower film layer, and improve the hole black spot. BRIEF DESCRIPTION OF DRAWINGS

[0018] The specific embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0019] Figure 1 The plane schematic diagram of an embodiment of the display module provided by the present disclosure; Figure 2 The plane schematic diagram of an embodiment of the display module provided by the present disclosure; Figure 1 The top view of the middle isolation area and the hole cutting area; Figure 3 The cross-sectional view of the outer isolation area of the display module provided by the present disclosure along the A-A' direction; Figure 4 The film layer structure schematic diagram of the display module at the position of the via hole; Figure 5 The top view of another embodiment of the display module provided by the present disclosure; Figure 6 The flowchart of the preparation method of the display module provided by the present disclosure. DETAILED DESCRIPTION

[0020] To make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present disclosure.

[0021] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0022] Please refer to Figures 1 to 4 , Figure 1 This is a plan view of an embodiment of the display module provided in this disclosure. Figure 2 for Figure 1 Top view of the central isolation zone and the opening zone. Figure 3 for Figure 2 A cross-sectional view of the isolation zone along the A-A' direction. Figure 4 This is a schematic diagram of the membrane structure of the module at the via location, such as... Figures 1 to 4 As shown, the display module includes a display panel (PNL) 100 and a polarizer 200 disposed on the light-emitting side of the display panel 100. The display panel 100 includes a substrate 10, a display area AA, an aperture area HH formed on the substrate 10, and an isolation area BB located between the display area AA and the aperture area HH. The isolation area BB includes an inner isolation area BB1, a middle isolation area BB2, and an outer isolation area BB3 sequentially distributed from the display area AA toward the aperture area HH. The isolation area BB encompasses... The first metal layer 11 and the multilayer functional film layer 12 are sequentially stacked on the substrate 10. The first metal layer 11 is at least partially located in the outer isolation region BB3. The multilayer functional film layer 12 has a via 121 in the outer isolation region BB3 that extends through the first metal layer 11. The orthographic projection of the first metal layer 11 on the substrate 10 covers the orthographic projection of the via 121 on the substrate 10. The via 121 is filled with a first colloid 122 that connects the first metal layer 11 and the polarizer 200.

[0023] Compared with the related art, the display module of the embodiment of the present disclosure is provided with a via hole penetrating to the first metal layer in the outer isolation area, and the via hole is filled with the first glue body. At this time, the first glue body and the first metal layer close to the bottom of the display panel form a rivet structure. The rivet structure can enhance the longitudinal bonding strength of each film layer of the display panel at the position of the outer isolation area, avoid the crack extending to the middle isolation area or even the inner isolation area during subsequent laser cutting of the camera opening, reduce the peeling risk of the light-emitting layer and the lower film layer, and improve the hole black spot.

[0024] In a possible implementation, the display area AA includes a light-shielding metal layer BSM and a gate layer Gate arranged on the substrate 10, and the first metal layer 11 is arranged in the same layer as the light-shielding metal layer BSM or the gate layer Gate.

[0025] In a specific implementation, the display area AA generally includes a light-shielding metal layer BSM, an insulating layer, a driving circuit layer, a light-emitting functional layer, an encapsulation layer, and a protective layer TOC arranged in sequence on the substrate 10, wherein the driving circuit layer at least includes an active layer Active, a gate insulating layer GI, a gate layer Gate, a dielectric layer ILD, and a source-drain metal layer SD.

[0026] In the embodiment of the present disclosure, unless otherwise specified, the term "arranged in the same layer" means that two layers, components, members, elements, or parts can be formed by the same preparation process (for example, a patterning process, etc.), and the two layers, components, members, elements, or parts are generally formed by the same material. For example, the arrangement of two or more functional layers in the same layer means that these functional layers arranged in the same layer can be formed by using the same material layer and the same preparation process, so as to simplify the preparation process and cost of the display panel.

[0027] In the embodiment of the present disclosure, since the light-shielding metal layer BSM or the gate layer Gate is close to the substrate 10, which is the bottom film layer of the display panel, when the via hole 121 penetrates to the light-shielding metal layer BSM or the gate layer Gate, a larger via hole depth can be achieved. At this time, the rivet structure formed by the first metal layer 11 and the first glue body 122 is more stable, which can further enhance the longitudinal bonding strength of each film layer at the AA Hole position and improve the environmental reliability of the opening area.

[0028] In a possible implementation, the outer isolation area BB3 includes an edge region close to the opening area HH, and the via hole 121 is arranged in the edge region.

[0029] In the process of forming the camera opening AA Hole in the display module by the laser cutting process, the crack caused by the MDL cutting will extend inward from the MDL cutting path position, that is, extend toward the display area AA. In order to avoid the crack extending to the display area AA and causing the separation of the back plate and the light-emitting layer, the rivet structure formed by the first adhesive 122 and the first metal layer 11 is arranged in the outer isolation area BB3 in the embodiments of the present disclosure. Further, the rivet structure is located in the edge area of the outer isolation area BB3 closer to the opening area HH, so that the crack can be intercepted earlier and the crack can be prevented from entering the middle isolation area BB2 and the inner isolation area BB1.

[0030] According to product tests and experience, when the crack extends to the second circle of outer isolation columns, the risk of hole black spots appearing in the display module is low, and when the crack extends to the middle isolation area, the risk of hole black spots appearing in the display module will significantly increase. Based on this, the via hole 121 can be further arranged outside the second circle of outer isolation columns.

[0031] In some embodiments, the multi-layer functional film layer 12 includes a source-drain metal layer 121, which forms a plurality of inner isolation columns PS1 in the inner isolation area BB1 and a plurality of outer isolation columns PS2 in the outer isolation area BB3. The plurality of outer isolation columns PS2 at least includes a first circle of outer isolation columns and a second circle of outer isolation columns distributed in turn from the opening area HH toward the display area AA. The orthographic projection of the via hole 121 on the substrate 10 is located on a first side of a first boundary line L1 of the orthographic projection of the second circle of outer isolation columns on the substrate 10. The first boundary line L1 is the boundary line of the orthographic projection of the second circle of outer isolation columns on the substrate 10 close to the display area AA, and the first side is the side of the first boundary line away from the display area AA.

[0032] Wherein, the inner isolation columns PS1 and the outer isolation columns PS2 are both distributed with multiple circles, and the specific number of circles can be adjusted according to the actual isolation effect of the product. For example, the inner isolation area BB1 is distributed with 2, 3, 4, 5, 6, or 7 inner isolation columns PS1, and the outer isolation area BB3 is distributed with 2, 3, 4, 5, 6, or 7 outer isolation columns PS2.

[0033] For example, in the inner isolation area BB1, the first circle of inner isolation columns PS1 is arranged in the inner isolation area BB1, and the second circle of inner isolation columns PS1 is arranged in the inner isolation area BB1 and is closer to the display area AA than the first circle of inner isolation columns PS1. Figure 2In the illustrated embodiment, the outer isolation region BB3 is distributed with 7 rings of outer isolation pillars PS2. Assuming that in the direction from the opening region HH to the display region AA, the i-th ring of outer isolation pillars is denoted as PS2i, where i is greater than or equal to 1 and less than or equal to 7, then the first ring of outer isolation pillars is denoted as PS21, and the second ring of outer isolation pillars is denoted as PS22. The orthogonal projection of the via 121 on the substrate 10 is located on the first side of the first boundary line L1 of the orthogonal projection of the second ring of outer isolation pillars PS22 on the substrate 10. This can also be understood as the via 121 being located before the boundary line of the second ring of outer isolation pillars PS22 near the display region AA. This arrangement can block cracks outside the second ring of outer isolation pillars PS22, preventing cracks from extending to the middle isolation region BB2 or even the inner isolation region BB1.

[0034] It is understood that in other embodiments, the via 121 can also be located at other positions in the outer isolation area BB3, such as between the third outer isolation pillar PS23 and the fourth outer isolation pillar PS24, as long as it can achieve the effect of preventing the crack from extending to the display area AA and avoiding the appearance of black spots on the hole.

[0035] In addition, in other embodiments, the isolation zone BB may further include an isolation dam Dam located within the intermediate isolation zone BB2. The isolation dam Dam Dam may be formed by a portion of the multilayer functional membrane layer 12. The isolation dam Dam Dam in the embodiments of this disclosure may be implemented using related technologies, which will not be elaborated here.

[0036] In one possible implementation, there are multiple vias 121, and the multiple vias 121 are spaced apart along the circumferential direction of the opening area HH.

[0037] For example, such as Figure 2 As shown, the camera opening AA Hole is a circular opening, and the isolation zone BB is an annular area surrounding the opening area HH. Multiple through holes 121 are distributed at intervals along the circumferential direction of the opening area HH within the outer isolation zone BB3, thus forming multiple rivet structures surrounding the opening area HH. In specific implementations, the multiple through holes 121 can be evenly distributed at equal intervals along the circumference of the opening area HH, or they can be distributed at unequal intervals.

[0038] The cross-sectional shape of the via 121 can be circular, rectangular, square, or polygonal, etc., and this embodiment does not limit it.

[0039] In one possible implementation, the cross-sectional shape of the via 121 is an annular shape surrounding the opening region HH.

[0040] For example, please refer to Figure 5 , Figure 5 This is a schematic diagram of the planar distribution of vias in another embodiment, as shown below. Figure 4As shown, the camera hole AA Hole is a circular hole, the isolation area BB is an annular area surrounding the hole area HH, the through hole 121 surrounding the hole area HH is distributed in the outer isolation area BB3, the through hole 121 is an annular structure in a whole circle, at this time, the through hole 121 and the first adhesive 122 form a whole circle of rivet structure, which can block the crack from extending to the middle isolation area BB2 or the inner isolation area BB1 at various positions.

[0041] In a possible implementation, the length of the first metal layer 11 in the direction of the display area AA from the hole area HH is 20-200 microns, and the aperture of the through hole 121 in the direction of the display area AA from the hole area HH is 20-200 microns.

[0042] For example, the aperture of the through hole 121 in the direction of the display area AA from the hole area HH is 20 microns, 30 microns, 50 microns, 150 microns, 180 microns, 200 microns, etc.

[0043] Here, the laser spot size during laser drilling is generally about 20 microns, so the minimum aperture of the through hole 121 can be set to 20 microns, and considering the width of the isolation area BB, the aperture of the through hole 121 can be set to 20-200 microns.

[0044] Preferably, the aperture of the through hole 121 is 20-50 microns, and the smaller the aperture of the through hole 121, the greater the distance between the through hole 121 and the display area AA, so that the crack can be blocked at a position farther away from the display area AA, and the hole black spot can be better avoided.

[0045] In a possible implementation, the first metal layer 11 is arranged in the same layer as the light-shielding metal layer BSM, and the multi-layer functional film layer 12 includes, in sequence from the direction away from the substrate 10, a gate insulating layer 123, a gate layer 124, a dielectric layer 125, a passivation layer 126, a source-drain metal layer 127, a light-emitting material layer 128, an encapsulation layer, and a protective layer.

[0046] Here, the multi-layer functional film layer 12 in the isolation area BB is arranged in the same layer as part of the film layers in the display area AA, that is, some film layers in the display area AA extend to the isolation area BB to form the multi-layer functional film layer 12 in the isolation area BB.

[0047] For example, the display area AA includes, in sequence on the substrate 10, a light-shielding metal layer BSM, an insulating layer, a driving circuit layer, a light-emitting functional layer, an encapsulation layer, and a protective layer, and the multi-layer functional film layer 12 in the isolation area BB is formed by part of the film layers in the driving circuit layer, the light-emitting functional layer, the encapsulation layer, and the protective layer in the display area.

[0048] The substrate 10 can be a flexible substrate made of polyimide (PI), polyethylene naphthalate (PEN), thermoplastic polyester (PET), etc., or a rigid substrate made of glass, quartz, etc. The light-shielding metal layer BSM is located below the active layer in the driving circuit layer, and is used to shield the active layer or channel region of the transistor, so as to prevent light from the back side of the substrate 10 from irradiating the transistor, thereby reducing the risk of leakage current of the transistor caused by light, reducing power consumption, and improving the stability of picture display. The insulating layer covers the light-shielding metal layer BSM. For example, the insulating layer can include a barrier layer (Barrier) and a buffer layer (Buffer), wherein the barrier layer can be made of inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride, and the buffer layer can also be made of inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride. The barrier layer is beneficial to prevent water and oxygen from entering the light-emitting device formed thereafter from the bottom, and the buffer layer is beneficial to the quality of subsequent material deposition. The driving circuit layer usually includes an active layer Active formed on the buffer layer by a patterning process, a gate insulating layer GI formed on the active layer Active by deposition or the like, a gate layer Gate formed on the gate insulating layer GI by a patterning process, a dielectric layer ILD formed on the gate layer Gate by deposition or the like, a source-drain metal layer SD formed on the dielectric layer ILD, and a planar layer PLN covering the source-drain metal layer SD and the exposed dielectric layer ILD. The source-drain metal layer SD forms the source electrode Source and the drain electrode Drain of the thin-film transistor, and the source electrode Source is electrically connected to the active layer Active through a via hole in the dielectric layer ILD.

[0049] In one specific embodiment, the display area AA includes, in sequence from top to bottom, a buffer layer Buffer, a light-shielding metal layer BSM, a barrier layer Barrier, an active layer Active, a first gate insulating layer GI1 covering the active layer Active, a first gate layer Gate1 formed on the first gate insulating layer GI1, a second gate insulating layer GI2 covering the first gate layer Gate1, a second gate Gate2 formed on the second gate insulating layer GI2, a dielectric layer ILD covering the second gate layer Gate2, a first source-drain metal layer SD1 formed on the dielectric layer ILD, a passivation layer PVX formed on the first source-drain metal layer SD1, a first planar layer PLN1 covering the passivation layer PVX and the exposed first source-drain metal layer SD1, a second source-drain metal layer SD2 formed on the first planar layer PLN1, a second planar layer PLN2 covering the second source-drain metal layer SD2, a pixel definition layer PDL formed on the second planar layer PLN2, an anode layer Anode, a light-emitting material layer EL, a cathode layer Cathode, a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP, a second inorganic encapsulation layer CVD2, and a protective layer TOC.

[0050] The first gate insulating layer GI1, the first gate layer Gate1, the second gate layer Gate2, the second gate insulating layer GI2, the dielectric layer ILD, the passivation layer PVX, the second source-drain metal layer SD2, the light-emitting material layer EL, the first inorganic encapsulation layer CVD1, the second inorganic encapsulation layer CVD2, and the protective layer TOC extend to the isolation area BB to form a multi-layer functional film layer 12. Specifically, the gate insulating layer 123 is arranged in the same layer as the first gate insulating layer GI1 and the second gate insulating layer GI2 in the display area AA, the gate layer 124 is arranged in the same layer as the first gate layer Gate1 and the second gate layer Gate2 in the display area AA, the dielectric layer 125 is arranged in the same layer as the dielectric layer ILD in the display area AA, the passivation layer 126 is arranged in the same layer as the passivation layer PVX in the display area AA, the source-drain metal layer 127 is arranged in the same layer as the second source-drain metal layer SD2 in the display area AA, the source-drain metal layer 127 forms the inner isolation column PS1 and the outer isolation column PS2 in the isolation area BB, the light-emitting material layer 128 is arranged in the same layer as the light-emitting material layer EL in the display area AA, the encapsulation layer is arranged in the same layer as the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 in the display area AA, and the protective layer is arranged in the same layer as the protective layer TOC in the display area AA.

[0051] In a possible implementation, the first adhesive 122 is a modulus control type frame sealant (Modulus Control Lamination, referred to as MCL).

[0052] The main feature of the MCL adhesive is modulus control. The modulus here mainly refers to the elastic modulus, which is an index for measuring the difficulty of deformation of a material after being stressed. The modulus of the MCL adhesive is controllable or optimized, and the MCL adhesive has a moderate and balanced elastic modulus after curing.

[0053] The display module provided in the embodiments of the present disclosure is filled into the via hole 121 during the process of bonding the display panel 100 and the polarizing sheet 200, and is cured to form a rivet-shaped structure. One end of the MCL adhesive (i.e., the first adhesive 121) is connected with the first metal layer 11, and the other end is connected with the polarizing sheet 200, so as to physically lock the substrate 10, the first metal layer 11, and the polarizing sheet 200 together.

[0054] When the camera aperture AA Hole is cut with a laser, as the edge crack extends from the MDL cutting path toward the display area AA, it encounters the rivet structure formed by the first metal layer 11 and the first colloid 121. Due to the flexibility of the colloid, the stress at the crack tip is released, thereby preventing further extension. At the same time, the rivet structure enhances the adhesion between the substrate 10, the first metal layer 11, and the polarizer 200 through mechanical interlocking, which also enhances the longitudinal bonding strength of the various film layers around the camera aperture AA Hole. This can effectively prevent delamination, avoid separation of the backplate and the light-emitting layer, and reduce the risk of black spots in the aperture.

[0055] Based on the same inventive concept, the second aspect of this disclosure provides a method for manufacturing a display module, such as... Figure 6 As shown, it includes the following steps: Step S101: Prepare a display panel. The display panel includes a substrate, a display area formed on the substrate, an aperture area, and an isolation area located between the display area and the aperture area. The isolation area includes an inner isolation area, a middle isolation area, and an outer isolation area that are sequentially distributed from the display area toward the aperture area. The isolation area includes a first metal layer and multiple functional film layers that are sequentially stacked on the substrate. The first metal layer is at least partially located in the outer isolation area. The multiple functional film layers have vias that penetrate to the first metal layer in the outer isolation area. The orthographic projection of the first metal layer on the substrate covers the orthographic projection of the vias on the substrate. Step S102: A polarizer is attached to the light-emitting side of the display panel. After the polarizer is attached, the via is filled with a first colloid that connects the first metal layer and the polarizer.

[0056] Optionally, the step of attaching a polarizer to the light-emitting side of the display panel includes: After applying a modulus-controlled sealant to the light-emitting side of the display panel, a polarizer is attached, and the modulus-controlled sealant filling the vias forms the first colloid.

[0057] The manufacturing process of the display module can be described as follows: preparing the display panel to be opened with vias → opening vias 121 in the outer isolation area BB3 by laser → applying MCL adhesive, which at least fills vias 121 → bonding polarizer 200 → applying MCL adhesive → performing pad cutting, i.e., Pad cut → COP process → FOP process → Dispenser process → Alami process → Shape cut process → AA Hole process.

[0058] In the embodiment of the present disclosure, before the polarizing sheet 200 is attached, a point or a surface is coated on the light-emitting side of the display panel 100 using MCL glue, wherein the MCL glue fills the via hole 121, and then the polarizing sheet 200 is attached.

[0059] Optionally, the polarizing sheet attached on the light-emitting side of the display panel is provided with a modulus control type frame sealing glue, and the modulus control type frame sealing glue is filled into the via hole to form the first glue body during the attachment process.

[0060] The preparation process of the display module can be represented as: preparing a display panel to be provided with a via hole—>providing the via hole 121 in the outer isolation area BB3 by laser—>attaching the polarizing sheet 200, the polarizing sheet 200 carrying MCL glue on the side close to the display panel 100, the MCL glue carried by the polarizing sheet 200 being squeezed and filled into the via hole 121 during the attachment process of the polarizing sheet 200—>coating the MCL glue—>pad cutting, i.e., Pad cut—>COP process—>FOP process—>Dispenser process—>A lami process—>Shape cut process—>AA Hole process.

[0061] In the embodiment of the present disclosure, the display panel 100 is first prepared, and then the polarizing sheet 200 is attached on the light-emitting side of the display panel 100 by a lamination process, the first metal layer 11 and the first glue body 122 forming a rivet structure after the polarizing sheet 200 is attached, and the specific implementation process is as described in the above two implementation manners.

[0062] Based on the same inventive concept, the third aspect of the present disclosure provides a display device comprising the display module as described above. Illustratively, the display device can be a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or any product or component having a display function, and the present embodiment does not limit the same. Preferably, the display device can also have a mirror function.

[0063] The display panel can be an OLED display panel. It can be understood that the display panel can also be set to other types according to actual needs, for example, the display panel can also be a Quantum Dot Light Emitting Diode (QLED) display panel or a Micro Light Emitting Diode (Micro LED) display panel, etc.

[0064] Obviously, the above embodiments of the present disclosure are merely examples for clearly illustrating the present disclosure, and are not intended to limit the implementation manners of the present disclosure. Based on the above description, other different forms of changes or variations can be made by those skilled in the art, and here, all the implementation manners cannot be enumerated, and any changes or variations that are derived from the technical solutions of the present disclosure and are obvious to those skilled in the art are still within the protection scope of the present disclosure.

Claims

1. A display module, characterized by The display panel comprises a substrate, a display area formed on the substrate, an aperture area, and an isolation area between the display area and the aperture area, the isolation area comprises an inner isolation area, an intermediate isolation area, and an outer isolation area distributed in sequence from the display area to the aperture area, the isolation area comprises a first metal layer and a multi-layer functional film layer stacked in sequence on the substrate, the first metal layer is at least partially located in the outer isolation area, the multi-layer functional film layer is provided with a via hole penetrating to the first metal layer in the outer isolation area, the orthographic projection of the first metal layer on the substrate covers the orthographic projection of the via hole on the substrate, and the via hole is filled with a first adhesive connecting the first metal layer and the polarizing sheet.

2. The display module of claim 1, wherein, The display area comprises a light-shielding metal layer and a gate layer provided on the substrate, and the first metal layer is provided in the same layer as the light-shielding metal layer or the gate layer.

3. The display module of claim 2, wherein, The outer isolation area comprises an edge region close to the aperture area, and the via hole is arranged in the edge region.

4. The display module of claim 2, wherein, The multi-layer functional film layer comprises a source-drain metal layer, the source-drain metal layer forms a plurality of inner isolation columns in the inner isolation area and a plurality of outer isolation columns in the outer isolation area, the plurality of outer isolation columns at least comprises a first outer isolation column and a second outer isolation column distributed in sequence from the aperture area to the display area, the orthographic projection of the via hole on the substrate is located on a first side of a first boundary line of the orthographic projection of the second outer isolation column on the substrate, the first boundary line is a boundary line of the orthographic projection of the second outer isolation column on the substrate close to the display area, and the first side is a side of the first boundary line away from the display area.

5. The display module of any one of claims 1 to 4, wherein, The number of via holes is multiple, and multiple via holes are distributed along the circumferential direction of the aperture area.

6. The display module of any one of claims 1 to 4, wherein, The cross-sectional shape of the via hole is annular around the aperture area.

7. The display module of any one of claims 1 to 4, wherein, The length of the first metal layer in the direction from the aperture area to the display area is 20-200 microns, and the aperture diameter of the via hole in the direction from the aperture area to the display area is 20-200 microns.

8. The display module of claim 2, wherein, The first metal layer is provided in the same layer as the light-shielding metal layer, and the multi-layer functional film layer comprises a gate insulating layer, a gate layer, a dielectric layer, a passivation layer, a source-drain metal layer, a light-emitting material layer, an encapsulation layer, and a protective layer stacked in sequence away from the substrate.

9. The display module of claim 1, wherein, The first adhesive is a modulus control type frame sealant.

10. A method for manufacturing a display module, characterized by, The method comprises the following steps: A display panel is prepared, which comprises a substrate, a display area formed on the substrate, an aperture area, and an isolation area between the display area and the aperture area, the isolation area comprises an inner isolation area, a middle isolation area and an outer isolation area distributed in sequence from the display area to the aperture area, the isolation area comprises a first metal layer and a multi-layer functional film layer stacked in sequence on the substrate, the first metal layer is at least partially located in the outer isolation area, the multi-layer functional film layer is provided with a via hole penetrating to the first metal layer in the outer isolation area, and the orthographic projection of the first metal layer on the substrate covers the orthographic projection of the via hole on the substrate; A polarizing plate is attached on the light-emitting side of the display panel, and the via hole is filled with a first adhesive connecting the first metal layer and the polarizing plate after the attachment of the polarizing plate.

11. The method for manufacturing a display module according to claim 10, characterized in that, The step of attaching the polarizing plate on the light-emitting side of the display panel comprises: A modulus control type frame sealant is coated on the light-emitting side of the display panel before the attachment of the polarizing plate, and the modulus control type frame sealant filled in the via hole forms the first adhesive; or A polarizing plate provided with a modulus control type frame sealant is attached on the light-emitting side of the display panel, and the modulus control type frame sealant is filled into the via hole to form the first adhesive during the attachment process.

12. A display device comprising: A display module comprising any one of claims 1 to 9.

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