A laser grinding mechanism

Abstract

This application relates to a laser grinding mechanism, belonging to the field of laser grinding technology. It includes a base, a frame, an X-axis moving component, a Y-axis moving component, a chuck, a rotating component, a Z-axis moving component, a mounting plate, an adjusting component, and a laser. The frame is mounted on the base, the X-axis moving component is mounted on the base, the Y-axis moving component is located at the moving end of the X-axis moving component, the rotating component is located at the moving end of the Y-axis moving component, the chuck, used to hold the grinding material, is mounted on the rotating component, and the rotating component drives the chuck to rotate around a vertical axis, thus rotating the grinding material. The Z-axis moving component is mounted on the frame, the mounting plate is located at the moving end of the Z-axis moving component, the adjusting component is mounted on the mounting plate, and the laser is mounted on the adjusting component. The adjusting component adjusts the angle between the laser's emitting end and the horizontal direction so that the generated laser irradiates the grinding material. This application facilitates the processing of ultrahard materials.

Description

Technical Field

[0001] This application relates to the field of laser polishing technology, and in particular to a laser polishing mechanism. Background Technology

[0002] Superhard materials (such as diamond, cubic boron nitride, and tungsten carbide) possess extremely high hardness, wear resistance, and chemical stability, making them crucial for applications in precision machining, optical components, semiconductor manufacturing, and cutting tools. However, these superior properties also make their machining extremely difficult. Traditional methods for machining superhard materials mainly include mechanical grinding, electrical discharge machining (EDM), chemical mechanical polishing (CMP), and ultrasonic vibration-assisted machining.

[0003] Mechanical grinding typically uses diamond wheels or abrasives, but due to the extremely high hardness of superhard materials, the machining process suffers from problems such as rapid tool wear, low processing efficiency, and the easy introduction of subsurface damage and microcracks. Furthermore, the thermal stress generated during mechanical grinding can easily lead to thermal damage to the material surface, affecting the final workpiece's surface quality and dimensional accuracy.

[0004] Electrical discharge machining (EDM) is suitable for conductive materials, but it is limited in processing non-conductive superhard materials. Furthermore, the surface often forms a recast layer and micropores after machining, requiring subsequent treatment.

[0005] While chemical mechanical polishing can achieve good surface quality, it suffers from low material removal rates and long processing cycles, making it difficult to meet the demands of high-efficiency production. Ultrasonic vibration-assisted machining can reduce cutting forces and improve machining accuracy to some extent, but its equipment is complex, machining parameters are difficult to adjust, and tool head wear remains significant.

[0006] Therefore, it is necessary to propose a novel laser grinding mechanism and method to overcome the shortcomings of the existing technology and achieve high-efficiency, high-precision, and quantitative high-quality processing of superhard material surfaces. Summary of the Invention

[0007] To facilitate the processing of superhard materials, this application provides a laser grinding mechanism.

[0008] The laser polishing mechanism provided in this application adopts the following technical solution:

[0009] A laser polishing mechanism includes a base, a frame, an X-axis moving component, a Y-axis moving component, a chuck, a rotating component, a Z-axis moving component, a mounting plate, an adjusting component, and a laser. The frame is mounted on the base, the X-axis moving component is mounted on the base, the Y-axis moving component is located at the moving end of the X-axis moving component, the rotating component is located at the moving end of the Y-axis moving component, the chuck is used to hold polishing material and is mounted on the rotating component, the rotating component is used to drive the chuck to rotate about a vertical axis, thereby driving the polishing material to rotate, the Z-axis moving component is mounted on the frame, the mounting plate is located at the moving end of the Z-axis moving component, the adjusting component is mounted on the mounting plate, and the laser is mounted on the adjusting component. The X-axis moving component drives the Y-axis moving component to move along the X-axis direction, the Y-axis moving component drives the chuck to move along the Y-axis direction, the Z-axis moving component drives the mounting plate to move in the Z-axis direction, and the adjusting component is used to adjust the angle between the laser's emitting end and the horizontal direction so that the generated laser irradiates the polishing material.

[0010] Optionally, the chuck includes a cylinder, jaws, and a first driving member. The cylinder is mounted on a rotating member, and three jaws are evenly distributed on the cylinder. The first driving member is used to drive the jaws to move and clamp the grinding material. The jaws are L-shaped and have arc-shaped grooves on their vertical parts. The vertical parts of the jaws are lower than the top surface of the grinding material.

[0011] Optionally, the rotating end of the rotating component is provided with a rotating plate, the chuck is fixedly mounted on the rotating plate, a flip plate is rotatably mounted on the rotating plate, a rotating motor is provided on the rotating plate to drive the flip plate to rotate, the flip plate is located between two adjacent jaws, the rotation axis of the flip plate is parallel to the surface of the rotating plate, a disc is provided on the top surface of the flip plate, a clamping member is provided on the disc, the clamping member is used to clamp the edge of the polishing material, a flip motor is provided on the flip plate, the disc is mounted on the output shaft of the flip motor, the flip plate rotates and drives the clamping member to approach the polishing material to clamp the polishing material, then the flip plate rotates to fit against the rotating plate, then the disc drives the polishing material to rotate 180 degrees to change the polishing surface of the polishing material, and then the flip plate drives the polishing material back to the chuck.

[0012] Optionally, the clamping component includes a first sliding plate, two clamping plates, a bidirectional lead screw, and a clamping motor mounted on a disc. The clamping plates are slidably mounted on the first sliding plate, and the bidirectional lead screw is coaxially mounted on the clamping motor. The clamping plates are threadedly connected to the threaded section of the bidirectional lead screw. The first sliding plate is slidably mounted on the disc, and the sliding direction of the first sliding plate is parallel to the length direction of the flipping plate. The clamping component also includes an electric push rod mounted on the disc, and the first sliding plate is fixedly mounted on the output shaft of the electric push rod.

[0013] Optionally, a driven wheel is rotatably mounted on the first slide plate. The driven wheel is located in the middle of the two clamping plates and is sleeved on the middle of the bidirectional lead screw. The driven wheel is rotatably mounted on the bidirectional lead screw. After the grinding material is located between the two clamping plates, the circumferential of the grinding material abuts against the peripheral wall of the driven wheel. A second driving member is also provided on the flip plate. The second driving member is used to drive the grinding material to rotate and throw off impurities on the grinding material.

[0014] Optionally, the second driving component includes a vertical plate disposed on the flip plate, the vertical plate being located outside the clamping plate, and a horizontal plate disposed on the vertical plate, the horizontal plate being located on the surface of the vertical plate facing the clamping plate. The second driving component includes two driving wheels disposed on the horizontal plate, the rotation axis of the driving wheels being parallel to the rotation axis of the driven wheel, the two driving wheels being located on the same horizontal line and spaced apart. The second driving component also includes a first motor disposed on the horizontal plate, any one of the driving wheels being coaxially disposed on the output shaft of the first motor, and the grinding material being clamped in the triangular space surrounded by the driven wheel and the driving wheel.

[0015] Optionally, the horizontal plate is provided with two second slide plates corresponding to the two drive wheels. The drive wheels are disposed on the second slide plates, and the second slide plates are slidably disposed on the horizontal plate. The second drive component also includes a third drive component for driving the two second slide plates to slide and thereby moving the drive wheels to abut against the grinding material.

[0016] Optionally, the peripheral walls of the drive wheels are all recessed to form limiting grooves, and the edge of the grinding material is located in the limiting groove. Multiple positioning balls are provided in the limiting groove. The positioning balls are located on the drive wheel that does not correspond to the first motor. The positioning balls are slidably disposed on the side wall of the limiting groove. After the grinding material enters the limiting groove, the positioning balls slide and abut against the edge of the grinding material.

[0017] Optionally, the vertical plate is a telescopic structure, and the horizontal plate is located at the end of the vertical plate. The end of the vertical plate is provided with a lateral moving member, which is used to drive the horizontal plate to move horizontally and be positioned directly above the grinding material.

[0018] Optionally, the frame is equipped with a universal curved tube and a dust suction tube. The universal curved tube is used to blow towards the grinding surface of the grinding material, and the dust suction tube is used to suck up the blown debris and dust.

[0019] In summary, this application includes at least one of the following beneficial technical effects:

[0020] 1. When surface treating superhard materials, the grinding material is clamped in a chuck. The chuck is then moved onto the laser path via X-axis and Y-axis moving parts. The height and angle of the laser are then adjusted via the Y-axis moving part and adjustment part. The laser is then activated, and the laser beam is obliquely irradiated onto the grinding surface of the grinding material. The chuck is then rotated via a rotating part, causing the grinding material to rotate. The X-axis moving part then moves the chuck laterally, causing the laser to apply grinding points to the grinding material in a continuous ring shape, moving laterally in sequence. This ensures the laser acts on the entire grinding surface of the material, completing the overall grinding. Additionally, after the top surface of the grinding material is ground, the laser irradiates the side edges of the material for grinding, facilitating the grinding of superhard materials.

[0021] 2. After the top surface of the grinding material is ground, the grinding material is flipped over using a flipping plate, clamping plate, and disc. The flipped grinding material is then placed on a chuck and clamped before grinding. The operation is simple and convenient, and improves the safety of installers. In addition, after the grinding material is clamped on the clamping plate, impurities on the grinding material are removed by the rotation of the disc and the rotation of the grinding material itself, thus improving the forming quality of the grinding material. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of a laser polishing mechanism according to an embodiment of this application;

[0023] Figure 2 This is a side view of a laser polishing mechanism according to an embodiment of this application;

[0024] Figure 3 This is a schematic diagram of the base in a laser polishing mechanism according to an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of the structure of the flipping plate in a laser polishing mechanism according to an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of the structure of the disk in a laser polishing mechanism according to an embodiment of this application;

[0027] Figure 6 yes Figure 5 An enlarged schematic diagram of part A in the middle;

[0028] Figure 7 yes Figure 5 Enlarged diagram of part B.

[0029] Explanation of reference numerals in the attached diagram: 1. Base; 2. Frame; 3. X-axis moving component; 4. Y-axis moving component; 5. Chuck; 6. Rotating component; 7. Z-axis moving component; 8. Mounting plate; 9. Adjusting component; 10. Laser; 11. Laser detection head; 12. Claw; 13. Arc groove; 14. Grinding material; 15. Rotating plate; 16. Flipping plate; 17. Rotating motor; 18. Slide; 19. Sliding push rod; 20. Disc; 21. Clamping component; 211. First sliding plate; 212. Clamping plate; 213. Bidirectional lead screw; 214. Clamping motor; 215. Electric push rod;

[0030] 22. Tilting motor; 23. Driven wheel;

[0031] 24. Second driving component; 241. Vertical plate; 242. Horizontal plate; 243. Drive wheel; 244. First motor; 245. Second sliding plate; 246. Second motor; 247. Bidirectional screw;

[0032] 25. Limiting groove; 26. Positioning ball; 27. Lateral push rod; 28. Universal curved tube; 29. ​​Dust suction tube. Detailed Implementation

[0033] The following is in conjunction with the appendix Figure 1 -Appendix Figure 7 This application will be described in further detail.

[0034] This application discloses a laser polishing mechanism. (Refer to...) Figure 1 and Figure 2 The laser polishing mechanism includes a base 1, a frame 2, an X-axis moving part 3, a Y-axis moving part 4, a chuck 5, a rotating part 6, a Z-axis moving part 7, a mounting plate 8, an adjusting part 9, and a laser 10;

[0035] Reference Figure 1 and Figure 2 The frame 2 is mounted on the base 1, the X-axis moving part 3 is mounted on the base 1, the Y-axis moving part 4 is mounted on the moving end of the X-axis moving part 3, the rotating part 6 is mounted on the moving end of the Y-axis moving part 4, the chuck 5 is used to hold the polishing material 14 and is mounted on the rotating part 6, and the rotating part 6 is used to drive the chuck 5 to rotate around the vertical axis and drive the polishing material 14 to rotate.

[0036] Reference Figure 1 and Figure 2The Z-axis moving part 7 is mounted on the frame 2, the mounting plate 8 is mounted on the moving end of the Z-axis moving part 7, the adjusting part 9 is mounted on the mounting plate 8, the laser 10 is mounted on the adjusting part 9, the X-axis moving part 3 is used to drive the Y-axis moving part 4 to move along the X-axis direction, the Y-axis moving part 4 is used to drive the chuck 5 to move along the Y-axis direction, the Z-axis moving part 7 is used to drive the mounting plate 8 to move in the Z-axis direction, and the adjusting part 9 is used to adjust the angle between the emitting end of the laser 10 and the horizontal direction so that the generated laser irradiates the polishing material 14.

[0037] When surface treating superhard materials, the polishing material 14 is clamped in the chuck 5. Then, the chuck 5 is moved to the laser path via the X-axis moving part 3 and the Y-axis moving part 4. The height and angle of the laser 10 are then adjusted via the Y-axis moving part 4 and the adjusting part 9. The laser 10 is then activated, and the light generated by the laser 10 is obliquely irradiated onto the polishing surface of the polishing material 14. The chuck 5 is then driven to rotate via the rotating part 6. The rotation of the chuck 5 causes the polishing material 14 to rotate. The X-axis moving part 3 then drives the chuck 5 to move laterally, so that the polishing points of the laser on the polishing material 14 are in a continuous ring and move laterally in sequence. This allows the laser to act on the entire polishing surface of the polishing material 14, thus completing the overall polishing of the polishing material 14. In addition, after the top surface of the polishing material 14 is polished, the laser irradiates the side edge of the polishing material 14 to polish the side surface of the polishing material 14, which facilitates the polishing of superhard materials.

[0038] Reference Figure 1 and Figure 2 In this embodiment, both the X-axis moving part 3 and the Y-axis moving part 4 include a lead screw drive device and a fixed plate. The fixed plate is fixedly mounted on the moving end of the lead screw drive device. The two lead screw drive devices are perpendicular to each other and are respectively fixedly mounted on the base 1 and the fixed plate. The chuck 5 is mounted on the fixed plate on the Y-axis moving part 4.

[0039] Reference Figure 1 and Figure 2 In this embodiment, the Z-axis moving part 7 includes a lead screw transmission device mounted on the frame 2, and a mounting plate 8 is fixedly mounted on the moving end of the lead screw transmission device.

[0040] Reference Figure 1 and Figure 2 In this embodiment of the application, the rotating component 6 includes a rotating cylinder mounted on a fixed plate, and the chuck 5 is mounted on the rotating end of the rotating cylinder.

[0041] Reference Figure 1 and Figure 2 In this embodiment, the adjusting member 9 includes a rotating slide table disposed on the mounting plate 8, and the laser 10 is fixedly disposed at the rotating end of the rotating slide table.

[0042] Reference Figure 1 and Figure 2 In this embodiment of the application, a laser detection head 11 is also provided on the frame 2. The laser detection head 11 is vertically arranged and faces the base 1. The laser emitted by the laser detection head 11 irradiates the polishing material 14 to detect the flatness of the polishing material 14, which facilitates the subsequent polishing operation.

[0043] Reference Figure 2 and Figure 3 In this embodiment, the chuck 5 includes a cylinder, jaws 12, and a first driving member. The cylinder is mounted on the rotating member 6. Three jaws 12 are evenly distributed on the cylinder. The first driving member drives the jaws 12 to move and clamp the grinding material 14. The first driving member includes a movable hydraulic cylinder mounted inside the cylinder. The jaws 12 are located at the moving end of the movable hydraulic cylinder. The jaws 12 are L-shaped, and their vertical portions have arc-shaped grooves 13. The vertical portions of the jaws 12 are lower than the top surface of the grinding material 14. After the grinding material 14 is placed on the jaws 12, the movable hydraulic cylinder drives the jaws 12 to move closer together and clamp the grinding material 14. The operation is simple and convenient. In addition, the vertical portions of the jaws 12 are lower than the top surface of the grinding material 14, which facilitates the laser 10 to perform grinding operations on the top surface of the grinding material 14 and the peripheral wall above the jaws 12.

[0044] Reference Figure 3 and Figure 4 When the top and side surfaces of the polishing material 14 are polished, the temperature of the polishing material 14 rises, making it difficult for the polishing personnel to replace the polishing surface of the polishing material 14 immediately. At the same time, the polishing personnel need to wait for the polishing material 14 to cool down before they can replace the polishing material 14, resulting in low polishing efficiency. Therefore, in this embodiment of the application, the rotating end of the rotating component 6 is provided with a rotating plate 15, the rotating plate 15 is provided at the rotating end of the rotating cylinder, and the chuck 5 is fixedly provided on the rotating plate 15.

[0045] Reference Figure 3 and Figure 4 A flip plate 16 is rotatably mounted on a rotating plate 15. A rotating motor 17 is mounted on the rotating plate 15 to drive the flip plate 16 to rotate. The length direction of the output shaft of the rotating motor 17 is parallel to the rotating plate 15. The flip plate 16 is located between two adjacent jaws 12. The rotation axis of the flip plate 16 is parallel to the surface of the rotating plate 15. The flip plate 16 is long and narrow.

[0046] Reference Figure 4 and Figure 5Furthermore, the rotating plate 15 is provided with a slide block 18 and a sliding push rod 19, the flip plate 16 is provided on the slide block 18, the slide block 18 is fixedly provided on the output shaft of the sliding push rod 19, the bottom of the rotating motor 17 is supported on the rotating plate 15 and slides on the rotating plate 15; the distance between the flip plate 16 and the polishing material 14 is adjusted by the sliding push rod 19 and the slide block 18.

[0047] Reference Figure 5 and Figure 6 A disc 20 is provided on the top surface of the flip plate 16, and a clamping member 21 is provided on the disc 20. The clamping member 21 is used to clamp the edge of the polishing material 14. A flipping motor 22 is provided on the flip plate 16, and the disc 20 is located on the output shaft of the flipping motor 22. The flip plate 16 rotates and drives the clamping member 21 to approach the polishing material 14 and clamp the polishing material 14. Then the flip plate 16 rotates to fit against the rotating plate 15. Then the disc 20 drives the polishing material 14 to rotate 180 degrees to change the polishing surface of the polishing material 14. Then the flip plate 16 drives the polishing material 14 back to the chuck 5.

[0048] After the top surface of the polishing material 14 is finished by laser polishing, the rotary motor 17 is started first. The rotary motor 17 drives the rotating plate 16 to rotate. The rotating plate 16 moves closer to the polishing material 14, so that the clamping member 21 moves closer to the polishing material 14. The clamping member 21 then clamps the polishing material 14. Then, the rotary motor 17 drives the rotating plate 16 to rotate to a horizontal position. Then, the rotating motor 22 is started. The rotating motor 22 drives the disc 20 to rotate 180 degrees. The disc 20 drives the polishing material 14 to rotate 180 degrees, thus changing the polishing surface of the polishing material 14. The rotary motor 17 then drives the rotating plate 16 to rotate, which drives the polishing material 14 back to the chuck 5. The chuck 5 then clamps the polishing material 14, and the polishing operation of the polishing material 14 is performed again.

[0049] Reference Figure 5 and Figure 6 In this embodiment, the clamping member 21 includes a first sliding plate 211, two clamping plates 212, a bidirectional lead screw 213, and a clamping motor 214 disposed on the disc 20. The clamping plates 212 are slidably disposed on the first sliding plate 211, and the bidirectional lead screw 213 is coaxially disposed on the clamping motor 214. The thread directions of the threaded sections at both ends of the bidirectional lead screw 213 are opposite. The clamping plates 212 are threadedly connected to the threaded sections of the bidirectional lead screw 213. The first sliding plate 211 is slidably disposed on the disc 20, and the sliding direction of the first sliding plate 211 is parallel to the length direction of the flip plate 16. The clamping member 21 also includes an electric push rod 215 disposed on the disc 20, and the first sliding plate 211 is fixedly disposed on the output shaft of the electric push rod 215.

[0050] When the flip plate 16 approaches the polishing material 14, the sides of the polishing material 14 enter the two clamping plates 212. Then, the clamping motor 214 is started, which drives the bidirectional lead screw 213 to rotate. The rotation of the bidirectional lead screw 213 causes the two clamping plates 212 to move closer to each other and clamp the polishing material 14. The operation is simple and convenient. When clamping polishing materials 14 of the same batch, the flip plate 16 first moves the material closer to the polishing material 14, so that the polishing material 14 is located between the two clamping plates 212. Then, the electric push rod 215 is started, which pushes the first slide plate 211 to slide. The sliding of the first slide plate 211 causes the two clamping plates 212 to move, so that the polishing material 14 is located in the middle of the two clamping plates 212, which makes it easier for the clamping plates 212 on both sides to move closer to each other and clamp the polishing material 14. When dealing with polishing materials 14 of different thicknesses, the position of the first slide plate 211 is adjusted by the electric push rod 215 so that the polishing material 14 is located between the two clamping plates 212, which facilitates the clamping operation of the polishing material 14.

[0051] Reference Figure 4 , Figure 6 and Figure 7 When the polishing material 14 is clamped in the clamping plate 212, the polishing material 14 is in a vertical state, and impurities on the polishing material 14 fall off. However, during this process, some impurities will adhere to the polishing material 14, resulting in a relatively poor impurity removal effect. Therefore, in this embodiment, a passive wheel 23 is rotatably provided on the first sliding plate 211. The passive wheel 23 is located in the middle of the two clamping plates 212 and is sleeved in the middle of the bidirectional lead screw 213. The passive wheel 23 is rotatably provided on the bidirectional lead screw 213. After the polishing material 14 is located between the two clamping plates 212, the circumference of the polishing material 14 abuts against the circumferential wall of the passive wheel 23.

[0052] Reference Figure 4 , Figure 6 and Figure 7 The flip plate 16 is also provided with a second driving member 24, which is used to drive the polishing material 14 to rotate and throw out the impurities on the polishing material 14.

[0053] When the polishing material 14 enters between the two clamping plates 212, the peripheral wall of the polishing material 14 abuts against the peripheral wall of the driven wheel 23. Then, the rotating motor 22 drives the rotating plate 16 to a horizontal state, so that the polishing material 14 is in a vertical state. Then, the second driving member 24 drives the polishing material 14 to rotate at high speed. When the polishing material 14 rotates at high speed, impurities on the polishing material 14 are thrown out, thereby improving the removal effect of impurities, improving the forming quality of the polishing material 14, and reducing the subsequent process of removing impurities from the polishing material 14, thus improving the polishing efficiency of the polishing material 14.

[0054] Reference Figure 4 , Figure 6 and Figure 7 In this embodiment, the second driving member 24 includes a vertical plate 241 disposed on the flip plate 16, the vertical plate 241 being located outside the clamping plate 212, a horizontal plate 242 disposed on the vertical plate 241, the length direction of the horizontal plate 242 being perpendicular to the length direction of the vertical plate 241, the horizontal plate 242 being located on the surface of the vertical plate 241 facing the clamping plate 212, the second driving member 24 includes two driving wheels 243 disposed on the horizontal plate 242, the rotation axis of the driving wheels 243 being parallel to the rotation axis of the driven wheel 23, the two driving wheels 243 being located on the same horizontal line and spaced apart, the second driving member 24 also includes a first motor 244 disposed on the horizontal plate 242, any one of the driving wheels 243 being coaxially disposed on the output shaft of the first motor 244, and the grinding material 14 being clamped in the triangular space surrounded by the driven wheel 23 and the driving wheel 243.

[0055] When the polishing material 14 is in a vertical position, it is located below the horizontal plate 242. At this time, the peripheral wall of the polishing material 14 abuts against the peripheral wall of the drive wheel 243. Then, the first motor 244 is started, which drives the drive wheel 243 to rotate. The rotation of the drive wheel 243 causes the polishing material 14 to rotate at high speed. The operation is simple and convenient.

[0056] Reference Figure 4 , Figure 6 and Figure 7 In this embodiment, the horizontal plate 242 is provided with two second sliding plates 245 corresponding to the two drive wheels 243. The drive wheels 243 are disposed on the second sliding plates 245, and the second sliding plates 245 are slidably disposed on the horizontal plate 242. The second drive member 24 also includes a third drive member for driving the two second sliding plates 245 to slide and drive the drive wheels 243 to move and abut against the polishing material 14. The third drive member includes a second motor 246 and a bidirectional screw 247 disposed on the horizontal plate 242. The bidirectional screw 247 is coaxially disposed on the output shaft of the second motor 246, and the two second sliding plates 245 are threadedly connected to the threaded section of the bidirectional screw 247. When the drive wheels 243 are directly above the polishing material 14, the second motor 246 is started. The second motor 246 drives the bidirectional screw 247 to rotate. The rotation of the bidirectional screw 247 drives the two sliding plates to move closer to each other and clamp the polishing material 14 between the two drive wheels 243, thus adapting to polishing materials 14 of different specifications.

[0057] Reference Figure 4 , Figure 6 and Figure 7In this embodiment, the peripheral wall of the drive wheel 243 is recessed to form a limiting groove 25. The edge of the grinding material 14 is located in the limiting groove 25. A plurality of positioning balls 26 are provided in the limiting groove 25. The positioning balls 26 are located on the drive wheel 243 that does not correspond to the first motor 244. The positioning balls 26 are slidably disposed on the side wall of the limiting groove 25. After the grinding material 14 enters the limiting groove 25, the positioning balls 26 slide and abut against the edge of the grinding material 14. Furthermore, a telescopic rod is provided on the side wall of the limiting groove 25. The positioning balls 26 are disposed at the end of the telescopic rod. A spring is provided in the telescopic rod to drive the telescopic rod to extend. When the drive wheel 243 enters the limiting groove 25, the drive wheel 243 abuts against the positioning balls 26 and drives the telescopic rod to move back. After the grinding material 14 passes the positioning balls 26, the positioning balls 26 abut against both sides of the grinding material 14, thereby limiting the grinding material 14 and facilitating the removal of impurities from the grinding material 14.

[0058] Reference Figure 4 , Figure 6 and Figure 7 In this embodiment, the vertical plate 241 is a telescopic structure, and an extension push rod is provided on the vertical plate 241. The moving end of the vertical plate 241 is fixedly mounted on the output shaft of the extension push rod. The horizontal plate 242 is located at the moving end of the vertical plate 241. A lateral moving member is provided at the moving end of the vertical plate 241. The lateral moving member is used to drive the horizontal plate 242 to move horizontally and be positioned directly above the polishing material 14. The lateral moving member includes a lateral push rod 27 provided on the vertical plate 241. The horizontal plate 242 is fixedly mounted on the output shaft of the lateral push rod 27. When the polishing material 14 is in a horizontal state, the horizontal plate 242 is first driven to move by the lateral push rod 27. The horizontal plate 242 moves to be directly above the polishing material 14. Then, through the extension push rod, the extension push rod drives the horizontal plate 242 to move vertically, so that the polishing material 14 enters the limiting groove 25, which facilitates driving the polishing material 14 to rotate at high speed.

[0059] Reference Figure 1 and Figure 2 In this embodiment of the application, the frame 2 is provided with a universal curved tube 28 and a dust suction tube 29. The universal curved tube 28 is used to blow towards the grinding surface of the grinding material 14, and the dust suction tube 29 is used to suck up the blown debris and dust.

[0060] The implementation principle of a laser polishing mechanism according to an embodiment of this application is as follows:

[0061] When surface treating superhard materials, the polishing material 14 is clamped in the chuck 5. Then, the chuck 5 is moved to the laser path via the X-axis moving part 3 and the Y-axis moving part 4. The height and angle of the laser 10 are then adjusted via the Y-axis moving part 4 and the adjusting part 9. The laser 10 is then activated, and the light generated by the laser 10 is obliquely irradiated onto the polishing surface of the polishing material 14. The chuck 5 is then driven to rotate via the rotating part 6. The rotation of the chuck 5 causes the polishing material 14 to rotate. The X-axis moving part 3 then drives the chuck 5 to move laterally, so that the polishing points of the laser on the polishing material 14 are in a continuous ring and move laterally in sequence. This allows the laser to act on the entire polishing surface of the polishing material 14, thus completing the overall polishing of the polishing material 14. In addition, after the top surface of the polishing material 14 is polished, the laser irradiates the side edge of the polishing material 14 to polish the side surface of the polishing material 14, which facilitates the polishing of superhard materials. After the top surface of the polishing material 14 is polished, it is flipped over by the cooperation of the flipping plate 16, the clamping plate 212 and the disc 20. The flipped polishing material 14 is then placed on the chuck 5 for clamping and polishing. The operation is simple and convenient and improves the safety of the installers. In addition, after the polishing material 14 is clamped on the clamping plate 212, the impurities on the polishing material 14 are removed by the rotation of the disc 20 and the rotation of the polishing material 14 itself, thereby improving the forming quality of the polishing material 14.

[0062] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A laser polishing mechanism, characterized in that: The assembly includes a base (1), a frame (2), an X-axis moving part (3), a Y-axis moving part (4), a chuck (5), a rotating part (6), a Z-axis moving part (7), a mounting plate (8), an adjusting part (9), and a laser (10). The frame (2) is mounted on the base (1), the X-axis moving part (3) is mounted on the base (1), the Y-axis moving part (4) is mounted on the moving end of the X-axis moving part (3), and the rotating part (6) is mounted on the moving end of the Y-axis moving part (4). The chuck (5) is used to hold the grinding material (14) and is mounted on the rotating part (6). The rotating part (6) is used to drive the chuck (5) to rotate around the vertical axis, thereby driving the grinding material. The material (14) rotates, the Z-axis moving part (7) is set on the frame (2), the mounting plate (8) is set on the moving end of the Z-axis moving part (7), the adjusting part (9) is set on the mounting plate (8), the laser (10) is set on the adjusting part (9), the X-axis moving part (3) is used to drive the Y-axis moving part (4) to move along the X-axis direction, the Y-axis moving part (4) is used to drive the chuck (5) to move along the Y-axis direction, the Z-axis moving part (7) is used to drive the mounting plate (8) to move in the Z-axis direction, and the adjusting part (9) is used to adjust the angle between the laser (10) emitting end and the horizontal direction so that the generated laser irradiates the polishing material (14); The chuck (5) includes a cylinder, jaws (12) and a first driving member. The cylinder is mounted on a rotating member (6). There are three jaws (12) evenly distributed on the cylinder. The first driving member is used to drive the jaws (12) to move and clamp the polishing material (14). The jaws (12) are L-shaped and the vertical part of the jaws (12) has an arc groove (13). The vertical part of the jaws (12) is lower than the top surface of the polishing material (14). The rotating end of the rotating component (6) is provided with a rotating plate (15), the chuck (5) is fixedly mounted on the rotating plate (15), a flip plate (16) is rotatably mounted on the rotating plate (15), and a rotating motor (17) for driving the flip plate (16) to rotate is provided on the rotating plate (15). The rotating plate (15) is provided with a slide (18) and a sliding push rod (19). The flip plate (16) is provided on the slide (18). The slide (18) is fixedly provided on the output shaft of the sliding push rod (19). The bottom of the rotating motor (17) is supported on the rotating plate (15) and slides on the rotating plate (15). The flip plate (16) is located between two adjacent jaws (12). The rotation axis of the flip plate (16) is parallel to the surface of the rotating plate (15). A disc (20) is provided on the top surface of the flip plate (16). A clamping member (21) is provided on the disc (20). The clamping member (21) is used to clamp the edge of the polishing material (14). A flip motor (22) is provided on the flip plate (16). The disc (20) is located on the output shaft of the flip motor (22). The flip plate (16) rotates and drives the clamping member (21) to approach the polishing material (14) and clamp the polishing material (14). Then the flip plate (16) rotates to fit against the rotating plate (15). Then the disc (20) drives the polishing material (14) to rotate 180 degrees to change the polishing surface of the polishing material (14). Then the flip plate (16) drives the polishing material (14) back to the chuck (5). The clamping member (21) includes a first sliding plate (211) disposed on the disc (20), two clamping plates (212), a bidirectional lead screw (213) and a clamping motor (214); A passive wheel (23) is rotatably mounted on the first sliding plate (211). The passive wheel (23) is located in the middle of the two clamping plates (212) and sleeved in the middle of the double-acting screw (213). The passive wheel (23) is rotatably mounted on the double-acting screw (213). After the grinding material (14) is located between the two clamping plates (212), the circumferential of the grinding material (14) abuts against the circumferential wall of the passive wheel (23). A second driving member (24) is also provided on the flipping plate (16). The second driving member (24) is used to drive the grinding material (14) to rotate and throw out the impurities on the grinding material (14). The second driving member (24) includes a vertical plate (241) disposed on the flip plate (16), the vertical plate (241) being located outside the clamping plate (212), a horizontal plate (242) disposed on the vertical plate (241), the horizontal plate (242) being located on the surface of the vertical plate (241) facing the clamping plate (212), the second driving member (24) includes two driving wheels (243) disposed on the horizontal plate (242), the rotation axis of the driving wheel (243) being parallel to the rotation axis of the driven wheel (23), the two driving wheels (243) being located on the same horizontal line and spaced apart, the second driving member (24) also includes a first motor (244) disposed on the horizontal plate (242), any one of the driving wheels (243) being coaxially disposed on the output shaft of the first motor (244), and the grinding material (14) being clamped in the triangular space surrounded by the driven wheel (23) and the driving wheel (243).

2. The laser polishing mechanism according to claim 1, characterized in that: The clamping plate (212) is slidably mounted on the first sliding plate (211), the bidirectional lead screw (213) is coaxially mounted on the clamping motor (214), the clamping plate (212) is threadedly connected to the threaded section of the bidirectional lead screw (213), the first sliding plate (211) is slidably mounted on the disc (20), the sliding direction of the first sliding plate (211) is parallel to the length direction of the flip plate (16), the clamping member (21) also includes an electric push rod (215) mounted on the disc (20), and the first sliding plate (211) is fixedly mounted on the output shaft of the electric push rod (215).

3. The laser polishing mechanism according to claim 1, characterized in that: The horizontal plate (242) is provided with two second slide plates (245) corresponding to two drive wheels (243). The drive wheels (243) are disposed on the second slide plates (245). The second slide plates (245) are slidably disposed on the horizontal plate (242). The second drive member (24) further includes a third drive member for driving the two second slide plates (245) to slide and drive the drive wheels (243) to move and abut against the polishing material (14).

4. The laser polishing mechanism according to claim 1, characterized in that: The peripheral walls of the drive wheel (243) are all recessed to form a limiting groove (25). The edge of the polishing material (14) is located in the limiting groove (25). A plurality of positioning balls (26) are provided in the limiting groove (25). The positioning balls (26) are located on the drive wheel (243) that does not correspond to the first motor (244). The positioning balls (26) are slidably disposed on the side wall of the limiting groove (25). After the polishing material (14) enters the limiting groove (25), the positioning balls (26) slide and abut against the edge of the polishing material (14).

5. A laser polishing mechanism according to claim 1, characterized in that: The vertical plate (241) is a telescopic structure, and the horizontal plate (242) is located at the end of the vertical plate (241). The end of the vertical plate (241) is provided with a horizontal moving member, which is used to drive the horizontal plate (242) to move horizontally and be located directly above the polishing material (14).

6. The laser polishing mechanism according to claim 1, characterized in that: The frame (2) is provided with a universal curved tube (28) and a dust suction tube (29). The universal curved tube (28) is used to blow towards the grinding surface of the grinding material (14), and the dust suction tube (29) is used to suck up the blown debris and dust.

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