Optical assembly, vehicle lamp and reflector installation method

Abstract

The invention provides an optical assembly, a vehicle lamp and a reflector mounting method, and relates to the technical field of vehicle lamps. The optical assembly comprises a circuit board and a reflector, a welding area is divided on the reflector, and the reflector is welded on the circuit board through the welding area. The reflecting mirror in the optical assembly is fixed on the circuit board in a welding mode, the relative offset of the reflecting mirror and the circuit board is smaller, the position accuracy is higher, and the positioning accuracy between the reflecting mirror and the light source is higher. In addition, the reflecting mirror can also be welded on the functional area on the circuit board, so that the reflecting mirror has other functions except for reflecting light.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicle lamps, in particular to an optical assembly, a vehicle lamp and a mirror mounting method. BACKGROUND

[0002] The mirror is a commonly used optical device of the vehicle lamp, which is usually arranged near the light source and functions to reflect the divergent light emitted by the light source once. In the prior art, the mirror and the circuit board are usually fixed together by clamping or bolt connection. This mounting method is prone to cause poor positioning of the mirror and the light source, and the function of the mirror is only to reflect the divergent light emitted by the light source once, which is relatively single. SUMMARY

[0003] The present application aims at the deficiencies in the prior art, and provides an optical assembly, a vehicle lamp and a mirror mounting method to solve the problems of poor positioning of the mirror and the light source and single function of the mirror.

[0004] To achieve the above object, the technical solutions adopted by the embodiments of the present application are as follows.

[0005] In a first aspect, the present application provides an optical assembly, comprising a circuit board and a mirror, the mirror being divided into a welding area, and the mirror being welded on the circuit board through the welding area.

[0006] Optionally, the circuit board is provided with a ground network connection area, and the mirror is welded on the ground network connection area through the welding area.

[0007] Optionally, the mirror comprises a mirror body and a solder pad arranged on the mirror body, and the solder pad is the welding area of the mirror.

[0008] Optionally, the material of the mirror body is plastic, and the material of the solder pad is metal.

[0009] Optionally, the surface of the solder pad facing the circuit board is flush with the surface of the mirror body facing the circuit board, or the surface of the solder pad facing the circuit board is closer to the circuit board than the surface of the mirror body facing the circuit board.

[0010] Optionally, the mirror is a metal mirror, and the surface of the metal mirror facing the circuit board is the welding area.

[0011] In a second aspect, the present application provides a vehicle lamp comprising the optical assembly according to any one of the above.

[0012] In a third aspect, the present application provides a mirror mounting method, comprising: providing a mirror and a circuit board; and welding a welding area of the mirror on the circuit board.

[0013] Optionally, the soldering of the soldering area of the reflector on the circuit board comprises soldering the soldering area of the reflector on a ground network connection area of the circuit board.

[0014] Optionally, the reflector mounting method comprises providing a metal reflector and a circuit board; and soldering the soldering area of the reflector on the circuit board by using a reflow soldering process.

[0015] Optionally, the reflector mounting method comprises providing a circuit board and manufacturing a reflector by using a metal insert injection molding process, wherein the reflector comprises a reflector body and a soldering pad, the material of the reflector body is plastic, and the material of the soldering pad is metal; and soldering the soldering pad on the circuit board.

[0016] The beneficial effects of the present application include:

[0017] The present application provides an optical assembly, comprising a circuit board and a reflector, the reflector being divided by a soldering area, and the reflector being soldered on the circuit board through the soldering area. The reflector in the optical assembly is fixed on the circuit board by soldering, the relative offset between the reflector and the circuit board is smaller, the position accuracy is higher, and the positioning accuracy between the reflector and the light source is also higher. In addition, the reflector can also be soldered on the functional area of the circuit board, thereby having other functions in addition to reflecting light. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 One of the structural schematic diagrams of the optical assembly provided by the embodiments of the present application;

[0020] Figure 2 The second structural schematic diagram of the optical assembly provided by the embodiments of the present application;

[0021] Figure 3 The structural schematic diagram of the reflector in the optical assembly provided by the embodiments of the present application;

[0022] Figure 4 The third structural schematic diagram of the optical assembly provided by the embodiments of the present application;

[0023] Figure 5 One of the flowcharts of the reflector mounting method provided by the embodiments of the present application;

[0024] Figure 6Flowchart II of the mirror mounting method provided by the embodiment of the present application;

[0025] Figure 7 Flowchart III of the mirror mounting method provided by the embodiment of the present application;

[0026] Figure 8 Flowchart IV of the mirror mounting method provided by the embodiment of the present application.

[0027] Icon: 100-optical assembly; 110-circuit board; 111-ground network connection area; 120-mirror; 121-mirror body; 122-solder pad; 130-light source; 140-radiator. DETAILED DESCRIPTION

[0028] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. It should be noted that, in the case of no conflict, various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the protection scope of the present application.

[0030] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0031] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0032] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] The first aspect of the embodiments of this application is referred to. Figure 1 An optical component 100 is provided, including a circuit board 110 and a reflector 120. The reflector 120 is divided into a soldering area and is soldered to the circuit board 110 through the soldering area.

[0034] It is understandable that after the reflector 120 is welded, its reflective surface should face the light source 130 in order to reflect the light emitted from the light source 130.

[0035] The reflector 120 in the aforementioned optical component 100 is fixed to the circuit board 110 by welding. The relative offset between the reflector 120 and the circuit board 110 is smaller, resulting in higher positional accuracy. The positioning accuracy between the reflector 120 and the light source 130 is also higher. In addition, the reflector 120 can also be welded to a functional area on the circuit board 110, thereby possessing other functions besides reflecting light.

[0036] Optionally, please refer to the following: Figure 2 The circuit board 110 has a ground network connection area 111, and the reflector 120 is soldered to the ground network connection area 111 through the soldering area.

[0037] The reflector 120 is electrically connected to the ground network connection area 111 on the circuit board 110, thereby enabling the reflector 120 to provide ESD (Electro-Static Discharge) protection. In this way, the reflector 120 can fulfill both optical functions and ESD protection, achieving multiple benefits and increasing the product's value.

[0038] Optionally, there are two ground network connection areas 111 arranged opposite to each other, and the welding area of ​​the reflector 120 is simultaneously welded to both ground network connection areas 111. This makes the installation of the reflector 120 more secure.

[0039] In this embodiment, the reflector 120 is directly soldered onto the circuit board 110 as a device. If the reflector 120 is a metal reflector, the surface of the metal reflector facing the circuit board 110 is the soldering area, and the metal reflector can be directly soldered onto the circuit board 110 through the soldering area.

[0040] For example, the metal reflector is soldered onto the circuit board 110 using a reflow soldering process.

[0041] If the reflector 120 cannot be directly soldered onto the circuit board 110 due to material limitations or other reasons, a special design for the structure of the reflector 120 is required. Alternatively, please refer to... Figure 1 and Figure 3 The reflector 120 includes a reflector body 121 and a pad 122 disposed on the reflector body 121. The reflector 120 is soldered to the circuit board 110 through the pad 122.

[0042] The reflector body 121 is used to reflect the light emitted by the light source 130. This application embodiment does not limit its material or structure, as long as the reflective function of the reflector 120 can be achieved. The solder pads 122 are fixed to the reflector body 121 and can be soldered to the circuit board 110. The surface of the solder pads 122 facing the circuit board 110 is the soldering area of ​​the reflector 120. The reflector body 121 is fixed to the circuit board 110 via the solder pads 122.

[0043] Generally, the reflector body 121 is made of plastic, and the pad 122 is made of metal. The reflector body 121 and the pad 122 can be connected using a metal insert injection molding process. Specifically, the metal pad 122 is pre-fixed in an appropriate position in the mold, and then plastic is injected into the mold. After mold opening, a portion of the pad 122 is encased by the cooled and solidified plastic, which forms the reflector body 121.

[0044] Optionally, there are two pads 122, which are located on the outer sides of the two opposite edges of the reflective surface on the reflector body 121.

[0045] The pads 122 are located on the outer edge of the reflective surface on the reflector body 121, which can prevent the pads 122 from affecting the reflection of light by the reflector surface. Setting the number of pads 122 to two, and placing them on the outer edges of the two opposite edges of the reflective surface respectively, allows both ends of the reflector body 121 to be soldered and fixed to the circuit board 110, thereby making the installation of the reflector 120 more secure.

[0046] Optionally, the surface of the pad 122 facing the circuit board 110 is flush with the surface of the reflector body 121 facing the circuit board 110.

[0047] That is, the surface of the pad 122 facing the circuit board 110 and the surface of the reflector body 121 facing the circuit board 110 are located in the same plane. During soldering, the reflector 120 is placed on the circuit board 110, and the surface of the pad 122 facing the circuit board 110 can naturally contact the circuit board 110, thus facilitating soldering. At this time, the surface of the reflector body 121 facing the circuit board 110 is also in contact with the circuit board 110.

[0048] Alternatively, the surface of the pad 122 facing the circuit board 110 may be closer to the circuit board 110 than the surface of the reflector body 121 facing the circuit board 110.

[0049] That is, the surface of the pad 122 facing the circuit board 110 and the surface of the reflector body 121 facing the circuit board 110 are not on the same plane; the surface of the pad 122 facing the circuit board 110 protrudes beyond the surface of the reflector body 121 facing the circuit board 110. During soldering, when the reflector 120 is placed on the circuit board 110, the surface of the pad 122 facing the circuit board 110 can naturally contact the circuit board 110, thus facilitating soldering. At this time, the surface of the reflector body 121 facing the circuit board 110 does not contact the circuit board 110, and there is a gap between them.

[0050] Optionally, the optical assembly 100 also includes a light source 130 fixed on the circuit board 110, the light emitted by the light source 130 hitting the reflective surface of the reflector 120 and being reflected by the reflective surface.

[0051] Alternatively, please refer to Figure 4 The optical component 100 also includes a heat sink 140, and the side of the circuit board 110 facing away from the reflector 120 is connected to the heat sink 140.

[0052] The heat sink 140 is used to dissipate heat from the circuit board 110 and the components fixed on the heat sink to prevent high temperatures from affecting the function of the circuit board 110 and the components fixed on the circuit board 110. After the reflector 120 is soldered onto the circuit board 110, the assembly consisting of the reflector 120 and the circuit board 110 can be directly fixed to the heat sink 140.

[0053] In a second aspect of this embodiment, a vehicle lamp is provided, including an optical component 100 as described above.

[0054] The vehicle headlight includes the same structure and beneficial effects as the optical component 100 in the foregoing embodiments. The structure and beneficial effects of the optical component 100 have been described in detail in the foregoing embodiments and will not be repeated here.

[0055] For the third aspect of this embodiment, please refer to Figure 5 A method for mounting a reflector is provided, comprising:

[0056] S100: Provides a reflector and circuit board.

[0057] S200: The soldering area of ​​the reflector is soldered onto the circuit board.

[0058] Please refer to the reference. Figure 1 It is understandable that after the reflector 120 is welded, its reflective surface should face the light source 130 in order to reflect the light emitted from the light source 130.

[0059] The above-described reflector mounting method fixes the reflector 120 to the circuit board 110 by welding. This results in a smaller relative offset between the reflector 120 and the circuit board 110, higher positional accuracy, and higher positioning precision between the reflector 120 and the light source 130. Furthermore, the reflector 120 can also be welded to a functional area on the circuit board 110 to perform functions other than reflecting light.

[0060] Alternatively, please refer to Figure 6 Soldering the soldering area of ​​the reflector onto the circuit board includes:

[0061] S210: Solder the soldering area of ​​the reflector onto the ground network connection area of ​​the circuit board.

[0062] Please refer to the reference. Figure 2 The circuit board 110 has connection pads for a ground network connection area 111 on its surface. The reflector 120 is soldered onto the connection pads, thereby electrically connecting to the ground network connection area 111, enabling the reflector 120 to provide ESD (Electro-Static Discharge) protection. In this way, the reflector 120 can fulfill both optical functions and ESD protection, achieving multiple benefits and increasing the product's value.

[0063] Alternatively, please refer to Figure 7 The mirror installation methods include:

[0064] S110: Provides metal reflectors and circuit boards.

[0065] S220: The soldering area of ​​the reflector is soldered onto the circuit board using a reflow soldering process.

[0066] Please refer to the reference. Figure 1 If the reflector 120 is a metal reflector, then the surface of the metal reflector facing the circuit board 110 is the soldering area, and the soldering area of ​​the metal reflector can be directly soldered onto the circuit board 110 through the reflow soldering process.

[0067] Alternatively, please refer to Figure 8 The mirror installation methods include:

[0068] S120: Provides a circuit board and manufactures a reflector using a metal insert injection molding process. The reflector includes a reflector body and pads. The reflector body is made of plastic and the pads are made of metal.

[0069] S230: Solder the pads onto the circuit board.

[0070] Please refer to the reference. Figure 1 and Figure 4 The metal pads 122 are pre-fixed in appropriate positions within the mold, and then plastic is injected into the mold for molding. After the mold is opened, a portion of the pads 122 is encased by the cooled and solidified plastic, which forms the reflector body 121. After the reflector 120 is prepared, the pads 122 of the reflector 120 are soldered onto the circuit board 110 to fix the reflector 120.

[0071] Alternatively, please refer to Figure 5 After soldering the reflector's soldering area onto the circuit board, the reflector mounting method also includes:

[0072] S300: Provides a heat sink to mount the circuit board.

[0073] Please refer to the reference. Figure 4 After the reflector 120 is soldered onto the circuit board 110, the assembly consisting of the reflector 120 and the circuit board 110 can be directly fixed to the heat sink 140.

[0074] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An optical component, characterized in that, include: A circuit board and a reflector, wherein the reflector is divided into soldering areas, and the reflector is soldered to the circuit board through the soldering areas.

2. The optical component as described in claim 1, characterized in that, The circuit board has a ground network connection area, and the reflector is soldered onto the ground network connection area through the soldering area.

3. The optical component as described in claim 1, characterized in that, The reflector includes a reflector body and pads disposed on the reflector body, and the reflector is soldered to the circuit board via the pads.

4. The optical component as described in claim 3, characterized in that, The material of the reflector body is plastic, and the material of the solder pad is metal.

5. The optical component as described in claim 3, characterized in that, The surface of the pad facing the circuit board is flush with the surface of the reflector body facing the circuit board, or the surface of the pad facing the circuit board is closer to the circuit board than the surface of the reflector body facing the circuit board.

6. The optical component as claimed in claim 1, characterized in that, The reflector is a metal reflector, and the surface of the metal reflector facing the circuit board is the soldering area.

7. A vehicle light, characterized in that, Includes the optical components as described in any one of claims 1 to 6.

8. A method for installing a reflector, characterized in that, include: Provide reflectors and circuit boards; The soldering area of ​​the reflector is soldered onto the circuit board.

9. The mirror mounting method as described in claim 8, characterized in that, The step of welding the soldering area of ​​the reflector to the circuit board includes: The soldering area of ​​the reflector is soldered onto the ground network connection area of ​​the circuit board.

10. The mirror mounting method as described in claim 8, characterized in that, include: We provide metal reflectors and circuit boards; The soldering area of ​​the reflector is soldered onto the circuit board using a reflow soldering process.

11. The mirror mounting method as described in claim 8, characterized in that, include: A circuit board is provided, and a reflector is fabricated using a metal insert injection molding process. The reflector includes a reflector body and solder pads. The reflector body is made of plastic, and the solder pads are made of metal. The pads are soldered onto the circuit board.

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