Liquid cooling server and cabinet

Abstract

The liquid cooling server comprises a case, and the case is provided with a first installation area, a second installation area, a third installation area and a fourth installation area which are sequentially arranged in the length direction of the case; the hard disk device is installed in the first installation area, and the hard disk device comprises a hard disk module and a hard disk heat dissipation module which are in heat transfer connection; the liquid preparation device is arranged in the second mounting area, and the liquid preparation device is communicated with a liquid path of the hard disk heat dissipation module; the mainboard device is mounted in the third mounting area, the mainboard device comprises a mainboard module and a mainboard heat dissipation module which are in heat transfer connection, and the mainboard heat dissipation module is communicated with a liquid path of the liquid preparation device; the expansion device is arranged in the fourth mounting area, the expansion device comprises an expansion module and an expansion heat dissipation module which are in heat transfer connection, and the expansion heat dissipation module is communicated with a liquid path of the liquid preparation device; the liquid conveying pipeline and the liquid return pipeline are both communicated with the liquid preparation device.

Description

Technical Field

[0001] This application relates to the technical field of servers, and in particular to a liquid-cooled server and cabinet. Background Technology

[0002] With the rapid development of technologies such as artificial intelligence, big data, and cloud computing, global demand for computing power continues to rise. As a computing infrastructure, servers are experiencing increasingly higher power densities, and the power consumption of functional components such as CPUs and GPUs is rising rapidly. Traditional air cooling methods are no longer sufficient to meet the cooling needs of servers. Instead, liquid cooling technology is being widely adopted. Because liquids have higher specific heat capacity and thermal conductivity than air, liquid cooling media can absorb and transfer heat more quickly, ensuring that servers maintain low temperatures during high-load operation and improving stability and reliability.

[0003] Because servers have a large number of heat sources that are dispersed, traditional cold plates and their piping structures are complex, and the fluid flow paths are complex and long, which to some extent restricts the heat dissipation efficiency and effectiveness of the cold plates for heat sources. Summary of the Invention

[0004] Therefore, it is necessary to provide a liquid-cooled server and cabinet to address the problem that the complex layout and fluid flow path of traditional technologies affect heat dissipation efficiency and effectiveness.

[0005] A first aspect of this application provides a liquid-cooled server, comprising:

[0006] The chassis has a first mounting area, a second mounting area, a third mounting area and a fourth mounting area arranged sequentially along its length.

[0007] A hard disk device, wherein the hard disk device is installed in the first installation area, and the hard disk device includes a hard disk module and a hard disk heat dissipation module that are thermally connected.

[0008] A liquid dispensing device is installed in the second installation area and is connected to the liquid circuit of the hard disk heat dissipation module;

[0009] A motherboard device is installed in the third installation area, and the motherboard device includes a motherboard module and a motherboard heat dissipation module that are heat-transfer connected, and the motherboard heat dissipation module is connected to the liquid distribution device liquid circuit.

[0010] An expansion device, installed within the fourth installation area, comprising a heat-transferring expansion module and a heat-dissipating expansion module, the heat-dissipating expansion module being connected to the liquid distribution device's liquid path; and

[0011] The infusion line and the return line are both connected to the liquid preparation device.

[0012] In this liquid-cooled server design, the chassis is divided along its length into four sequentially arranged installation areas: a first installation area, a second installation area, a third installation area, and a fourth installation area. Hard drives are installed in the first installation area, a cooling medium distribution device in the second installation area, motherboards in the third installation area, and expansion units in the fourth installation area. Inlet and outlet lines are connected to the cooling medium distribution device, allowing it to deliver cooling medium during operation. The distribution device then distributes the cooling medium appropriately to the hard drive cooling modules, motherboard cooling modules, and expansion units, enabling heat exchange between them. Heat is absorbed and carried away by these modules, and the cooled medium carrying heat flows back to the distribution device and finally exits the liquid-cooled server through the outlet lines, thus completing the liquid-cooled server's cooling process. Compared to traditional technologies, by placing the liquid dispensing device between the hard drive, motherboard, and expansion units, the path length of the cooling medium entering and exiting the liquid dispensing device can be shortened, the length of intermediate pipes can be shortened, and the pipe layout structure can be simplified, thereby achieving more efficient heat dissipation and improving the heat dissipation efficiency and effect of liquid cooling services.

[0013] The technical solution of this application will be further described below:

[0014] In one embodiment, the liquid dispensing device includes a mounting base, a liquid supply distributor, and a liquid return distributor. The mounting base is disposed on the chassis, and the liquid supply distributor and the liquid return distributor are respectively mounted on the mounting base. The liquid supply distributor is provided with an inlet connector and multiple liquid supply connectors. The inlet connector is connected to the liquid delivery pipeline. Each liquid supply connector is connected to a liquid delivery branch pipe, and the multiple liquid delivery branch pipes are connected to the hard disk cooling module, the motherboard cooling module, and the extended cooling module, which are respectively disposed thereon.

[0015] The liquid return distributor is provided with a liquid outlet connector and multiple liquid return connectors. The liquid outlet connector is connected to the liquid return pipeline. Each liquid return connector is connected to a liquid return branch pipe. The multiple liquid return branch pipes are respectively connected to the hard drive heat dissipation module, the motherboard heat dissipation module and the expansion heat dissipation module.

[0016] In one embodiment, a plurality of liquid supply connectors are arranged side by side at intervals along the length of the liquid dispensing device, a plurality of liquid return connectors are arranged side by side at intervals along the length of the liquid dispensing device, the liquid supply connectors and the liquid return connectors are arranged alternately along the length of the liquid dispensing device, and adjacent liquid supply connectors and liquid return connectors are staggered along the width of the liquid dispensing device.

[0017] The liquid supply distributor is equipped with at least two liquid inlet connectors, and the liquid delivery pipeline is provided with at least two lines, which are connected to the liquid inlet connectors one by one; the liquid return distributor is equipped with at least two liquid outlet connectors, and the liquid return pipeline is provided with at least two lines, which are connected to the liquid outlet connectors one by one.

[0018] In one embodiment, the hard disk heat dissipation module includes a mounting bracket, a first heat dissipation plate, and a heat-conducting component. The first heat dissipation plate is mounted on the mounting bracket and communicates with the liquid distribution device. A first liquid cooling channel is formed inside the first heat dissipation plate.

[0019] The heat-conducting component includes a first heat-conducting part and a second heat-conducting part connected to each other. The first heat-conducting part is used for heat transfer connection with the hard disk module, and the second heat-conducting part is used for heat transfer connection with the first heat dissipation plate.

[0020] In one embodiment, the second heat-conducting part includes a first heat-conducting plate and a second heat-conducting plate. The first heat-conducting plate and the second heat-conducting plate are arranged side by side along the height direction of the hard disk heat dissipation module and form an accommodating cavity at intervals. The first heat dissipation cold plate is installed in the accommodating cavity and is heat-transferringly connected to both the first heat-conducting plate and the second heat-conducting plate.

[0021] In one embodiment, the first heat dissipation plate includes a heat dissipation shell, a first liquid inlet connector, and a first liquid outlet connector. The heat dissipation shell has a liquid inlet hole and a liquid outlet hole respectively opened at opposite ends along the length direction of the hard disk heat dissipation module. The first liquid inlet connector is installed at the liquid inlet hole, and the first liquid outlet connector is installed at the liquid outlet hole. The interior of the heat dissipation shell forms a first liquid cooling channel, which communicates with the liquid inlet hole and the liquid outlet hole.

[0022] Multiple heat transfer baffles are arranged side by side at intervals inside the first liquid cooling channel. All of the heat transfer baffles extend along the direction from the liquid inlet to the liquid outlet, and a heat dissipation channel is formed between two adjacent heat transfer baffles.

[0023] In one embodiment, the motherboard module includes a motherboard on which a CPU, a memory module, and a voltage regulator are respectively mounted. The motherboard heat dissipation module includes a second heat dissipation plate, a third heat dissipation plate, and a fourth heat dissipation plate. The second heat dissipation plate is thermally connected to the CPU, the third heat dissipation plate is thermally connected to the memory module, and the fourth heat dissipation plate is thermally connected to the voltage regulator. The second, third, and fourth heat dissipation plates are connected in liquid circuits and are all connected in liquid circuits to the liquid dispensing device.

[0024] In one embodiment, the liquid-cooled server further includes a heat transfer tray disposed inside the chassis, the motherboard mounted on the heat transfer tray, and the heat transfer tray being heat-transfer connected to the liquid dispensing device.

[0025] In one embodiment, the expansion module includes a power module, the power module includes a power body, the power body has a heat source inside, the expansion heat dissipation module includes a fifth heat dissipation cold plate, the fifth heat dissipation cold plate is disposed on the outside of the power body, and a gap is formed between the fifth heat dissipation cold plate and the heat source, the gap is filled with potting compound, and the heat source is heat-transferring with the fifth heat dissipation cold plate through the potting compound.

[0026] In one embodiment, the fifth heat dissipation plate includes a side plate and an end plate connected to each other. A second liquid cooling channel is formed inside the side plate, and the end plate has an inlet and an outlet. Both the inlet and the outlet are connected to the second liquid cooling channel.

[0027] In one embodiment, the power module further includes a fixed bracket, a cold plate base, a second liquid inlet connector, and a second liquid outlet connector. The cold plate base is connected to the second liquid inlet connector and the second liquid outlet connector, and the cold plate base is mounted on the fixed bracket. The second liquid inlet connector is mounted at the liquid inlet, and the second liquid outlet connector is mounted at the liquid outlet.

[0028] The cold plate base includes a base body, a liquid inlet connector, a liquid supply connector, a liquid return connector, and a liquid drain connector. The interior of the base body has a first flow channel and a second flow channel arranged at intervals. The liquid inlet connector and the liquid supply connector are mounted on the base body and are connected through the first flow channel. The liquid supply connector is detachably connected to the second liquid inlet connector. The liquid return connector and the liquid drain connector are mounted on the base body and are connected through the second flow channel. The liquid return connector is detachably connected to the second liquid outlet connector.

[0029] In one embodiment, the expansion module further includes a network card module, which includes a housing and a network card body and an optical module respectively mounted on the housing. The expansion heat dissipation module further includes a heat dissipation assembly, which includes a sixth heat dissipation plate and a heat transfer component. The sixth heat dissipation plate is used to be installed with the network card body to achieve heat transfer cooperation. A third liquid cooling channel is formed inside the sixth heat dissipation plate for the flow of cooling medium. The heat transfer component is used to be installed with the optical module to achieve heat transfer cooperation, and the heat transfer component is heat-transferringly connected to the sixth heat dissipation plate.

[0030] In one embodiment, the heat transfer component includes a heat transfer main board and a heat transfer auxiliary board. The heat transfer main board is used to cover the top of the optical module, and the heat transfer auxiliary board is connected to the end of the heat transfer main board near the sixth heat dissipation plate, so that the heat transfer auxiliary board and the sixth heat dissipation plate are heat-transfer connected.

[0031] The heat transfer component further includes a first auxiliary plate and a second auxiliary plate. The first auxiliary plate is connected to one side of the heat transfer auxiliary plate, and the second auxiliary plate is connected to the other side of the heat transfer auxiliary plate and spaced apart from the first auxiliary plate. Both the first auxiliary plate and the second auxiliary plate are used for heat transfer connection with the side of the optical module.

[0032] In one embodiment, the heat dissipation assembly further includes a fastener with a receiving groove. The fastener is installed on the outside of the heat transfer motherboard by the receiving groove. The fastener has a first snap-fit ​​portion and a second snap-fit ​​portion on opposite sides. The first snap-fit ​​portion is used to snap-fit ​​with a first mating portion on the optical module, and the second snap-fit ​​portion is used to snap-fit ​​with a second mating portion on the optical module.

[0033] In one embodiment, the expansion module further includes a GPU, and the expansion heat dissipation module further includes a seventh heat dissipation plate, which is thermally connected to the GPU.

[0034] A second aspect of this application also proposes a cabinet comprising a cabinet body and a liquid-cooled server as described in any of the above embodiments, the liquid-cooled server being installed in the cabinet body. Attached Figure Description

[0035] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of a liquid-cooled server according to one embodiment.

[0038] Figure 2 for Figure 1 A schematic diagram of the liquid-cooled server chassis as seen from an explosion-proof perspective.

[0039] Figure 3 This is a schematic diagram of the structure of a hard disk device according to an embodiment.

[0040] Figure 4 This is a schematic diagram of the structure of a hard drive heat dissipation module according to one embodiment.

[0041] Figure 5 for Figure 4 A side view structural diagram.

[0042] Figure 6 This is a schematic diagram of the liquid preparation device according to one embodiment.

[0043] Figure 7 This is a schematic diagram of the structure of a motherboard device according to an embodiment.

[0044] Figure 8 This is a schematic diagram of the structure of a power supply module according to one embodiment.

[0045] Figure 9 for Figure 8 A structural diagram from another perspective.

[0046] Figure 10 for Figure 8 A schematic diagram of the explosion structure.

[0047] Figure 11 for Figure 8 A structural diagram from the rear view.

[0048] Figure 12 for Figure 11 A schematic diagram of the cross-sectional structure at point AA.

[0049] Figure 13 for Figure 12 A magnified schematic diagram of the structure at point B in the middle.

[0050] Figure 14 This is a schematic diagram of the structure of a network interface card (NIC) module according to one embodiment.

[0051] Figure 15 for Figure 14 A partial exploded view of the network card module.

[0052] Figure 16 This is a schematic diagram of the structure of a heat transfer element according to one embodiment.

[0053] Figure 17 This is a schematic diagram showing how the motherboard conducts heat to the liquid dispensing device through thermal pads and a heat transfer tray.

[0054] Explanation of reference numerals in the attached figures:

[0055] 100. Liquid-cooled server; 10. Chassis; 11. First mounting area; 12. Second mounting area; 13. Third mounting area; 14. Fourth mounting area; 20. Hard disk unit; 21. Hard disk module; 22. Hard disk heat dissipation module; 221. Mounting bracket; 222. First heat dissipation plate; 2221. Heat dissipation shell; 2222. First liquid inlet connector; 2223. First liquid outlet connector; 223. Thermal conductive component; 2231. First thermal conductive part; 2232. Second thermal conductive part; 2232a. First thermal conductive plate; 223 2b. Second heat-conducting plate; 2232c. Receptacle; 30. Liquid dispensing device; 31. Mounting base; 32. Liquid supply distributor; 321. Liquid inlet connector; 322. Liquid supply connector; 33. Liquid return distributor; 331. Liquid outlet connector; 332. Liquid return connector; 40. Mainboard assembly; 41. Mainboard module; 411. Mainboard; 412. CPU; 413. Memory module; 414. Voltage regulator; 42. Mainboard heat dissipation module; 421. Second heat dissipation plate; 422. Third heat dissipation plate; 423. Fourth heat dissipation plate. 43. Cold plate; 50. Heat transfer tray; 51. Expansion device; 52. Power module; 53. Power supply body; 54. Heat source; 55. Fifth heat dissipation cold plate; 56. Side plate; 57.21. Second liquid cooling channel; 58. End plate; 59.2a. Gap; 50.2b. Potting compound; 51.3. Fixing bracket; 51.4. Cold plate base; 51.41. Base body; 51.42. Liquid inlet connector; 51.43. Liquid supply connector; 51.44. Liquid return connector; 51.45. Liquid drain connector; 51.5. Second liquid inlet connector; 51.6. Second liquid outlet connector 53. Network card module; 531. Network card body; 532. Optical module; 5321. First mating part; 5322. Second mating part; 533. Sixth heat dissipation plate; 534. Heat transfer component; 5341. Heat transfer main board; 5342. Heat transfer auxiliary board; 5343. First auxiliary board; 5344. Second auxiliary board; 535. Fastener; 5351. Receiving slot; 5352. First snap-fit ​​part; 5353. Second snap-fit ​​part; 54. Seventh heat dissipation plate; 60. Infusion pipeline; 70. Return pipeline; 80. Thermal pad. Detailed Implementation

[0056] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0057] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0058] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0059] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0060] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0061] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0062] See Figure 1 and Figure 2 This application illustrates a liquid-cooled server 100 according to an embodiment, which includes a chassis 10, a hard disk drive 20, a liquid dispensing device 30, a motherboard device 40, an expansion device 50, and infusion lines 60 and return lines 70. In this application, the chassis 10 serves as a carrier component, playing the role of mounting and integrating the hard disk drive 20, the liquid dispensing device 30, the motherboard device 40, and the expansion device 50.

[0063] For example, the chassis 10 is rectangular in shape and is assembled from a detachable chassis and a cover, which facilitates production, installation, and subsequent maintenance.

[0064] Please continue reading. Figure 2 , Figure 3 and Figure 7The chassis 10 has a first mounting area 11, a second mounting area 12, a third mounting area 13, and a fourth mounting area 14 arranged sequentially along its length. A hard disk drive 20 is installed in the first mounting area 11, and the hard disk drive 20 includes a hard disk module 21 and a hard disk heat dissipation module 22 connected by heat transfer. A liquid dispensing device 30 is installed in the second mounting area 12, and the liquid dispensing device 30 is connected to the liquid path of the hard disk heat dissipation module 22. A motherboard device 40 is installed in the third mounting area 13, and the motherboard device 40 includes a motherboard module 41 and a motherboard heat dissipation module 42 connected by heat transfer, and the motherboard heat dissipation module 42 is connected to the liquid path of the liquid dispensing device 30. An expansion device 50 is installed in the fourth mounting area 14, and the expansion device 50 includes an expansion module and an expansion heat dissipation module connected by heat transfer, and the expansion heat dissipation module is connected to the liquid path of the liquid dispensing device 30. An infusion line 60 and a return line 70 are both connected to the liquid dispensing device 30.

[0065] In summary, implementing the technical solution of this embodiment will achieve the following beneficial effects: In the liquid-cooled server 100 of this solution, the chassis 10 is divided along its length to form a first installation area 11, a second installation area 12, a third installation area 13, and a fourth installation area 14 arranged sequentially. This allows the hard disk drive 20 to be installed in the first installation area 11, the liquid dispensing device 30 in the second installation area 12, the motherboard device 40 in the third installation area 13, and the expansion device 50 in the fourth installation area 14. Finally, the infusion line 60 and the return line 70 are respectively connected to the liquid dispensing device 30, so that during operation, the infusion line 60... Cooling medium can be supplied to the liquid distribution device 30, which then rationally distributes and delivers the cooling medium to the hard drive cooling module 22, the motherboard cooling module 42, and the expansion cooling module. This enables heat exchange between the hard drive cooling modules 22 and 21, between the motherboard cooling modules 42 and 41, and between the expansion cooling modules. Heat is absorbed and carried away by these modules, and the cooling medium carrying heat flows back to the liquid distribution device 30 and finally exits the liquid-cooled server 100 through the return pipe 70, thus completing the cooling of the liquid-cooled server 100. Compared to traditional technologies, by placing the liquid distribution device 30 between the hard drive unit 20, the motherboard unit 40, and the expansion unit 50, the path length of the cooling medium entering and exiting the device 30 is shortened, the length of intermediate pipes is reduced, and the pipe layout is simplified, resulting in more efficient heat dissipation and improved cooling efficiency and effectiveness of the liquid cooling service.

[0066] Please continue reading. Figure 2 and Figure 6In one embodiment, the liquid dispensing device 30 includes a mounting base 31, a liquid supply distributor 32, and a liquid return distributor 33. The mounting base 31 is disposed on the chassis 10. The liquid supply distributor 32 and the liquid return distributor 33 are respectively mounted on the mounting base 31. The liquid supply distributor 32 is provided with an inlet connector 321 and multiple liquid supply connectors 322. The inlet connector 321 is connected to the liquid delivery pipeline 60. Each liquid supply connector 322 is connected to a liquid delivery branch pipe. The multiple liquid delivery branch pipes are connected to the corresponding hard disk heat dissipation module 22, motherboard heat dissipation module 42, and expansion heat dissipation module.

[0067] Mounting base 31 is assembled with chassis 10 by at least one of the following methods: threaded connection, snap-fit ​​connection, etc., so as to achieve a stable assembly of liquid dispensing device 30 in chassis 10.

[0068] The liquid return distributor 33 is equipped with a liquid outlet connector 331 and multiple liquid return connectors 332. The liquid outlet connector 331 is connected to the liquid return pipeline 70. Each liquid return connector 332 is connected to a liquid return branch pipe. The multiple liquid return branch pipes are respectively connected to the hard disk heat dissipation module 22, the motherboard heat dissipation module 42 and the expansion heat dissipation module.

[0069] The infusion line 60 and return line 70 are connected to an external liquid supply device. During operation, the infusion line 60 introduces the cooling medium into the liquid-cooled server 100, specifically through the inlet connector 321 into the liquid supply distributor 32. The cooling medium then flows evenly through multiple supply connectors 322 and their connected branch pipes into the corresponding hard drive cooling module 22, motherboard cooling module 42, and expansion cooling module. This allows the cooling medium to absorb the heat generated by the hard drive module 21, motherboard module 41, and expansion module, achieving the purpose of cooling these modules. After absorbing heat, the cooling medium flows out from the hard drive cooling module 22, motherboard cooling module 42, and expansion cooling module, and flows through the return branch pipes to the corresponding return connectors 332, ultimately flowing into the return distributor 33. Finally, the cooling medium carrying heat converges into the return line 70 and flows back to the liquid supply device.

[0070] The short flow path of the cooling medium between the components helps to improve the circulation efficiency of the cooling medium, thereby allowing more cooling medium to absorb the heat generated by each heat source 512 per unit time, thus achieving a better heat dissipation effect.

[0071] Please continue reading. Figure 6Furthermore, based on the above embodiments, multiple liquid supply connectors 322 are arranged side-by-side at intervals along the length of the liquid distribution device 30, and multiple liquid return connectors 332 are arranged side-by-side at intervals along the length of the liquid distribution device 30. The liquid supply connectors 322 and liquid return connectors 332 are arranged alternately along the length of the liquid distribution device 30, and adjacent liquid supply connectors 322 and liquid return connectors 332 are staggered along the width of the liquid distribution device 30. This arrangement ensures that each liquid supply connector 322 and liquid return connector 332 is staggered by sufficient distance and space to facilitate pipeline connection and subsequent operation and maintenance.

[0072] The liquid supply distributor 32 is equipped with at least two inlet connectors 321, and the liquid delivery pipeline 60 has at least two lines, each corresponding to one of the inlet connectors 321. The return distributor 33 is equipped with at least two outlet connectors 331, and the return pipeline 70 has at least two lines, each corresponding to one of the outlet connectors 331. This configuration allows at least two inlet connectors 321 to simultaneously allow cooling medium to flow into the liquid supply distributor 32, increasing the cooling medium supply. Simultaneously, at least two outlet connectors 331 increase the cooling medium discharge rate per unit time, further improving the inflow and outflow efficiency of the cooling medium and meeting the heat dissipation needs of applications with higher heat generation.

[0073] Please continue reading. Figures 3 to 5 In one embodiment, the hard disk heat dissipation module 22 includes a mounting bracket 221, a first heat dissipation plate 222 and a heat conduction component 223. The first heat dissipation plate 222 is mounted on the mounting bracket 221 and is connected to the liquid distribution device 30. A first liquid cooling channel is formed inside the first heat dissipation plate 222.

[0074] The heat-conducting component 223 includes a first heat-conducting part 2231 and a second heat-conducting part 2232 connected to each other. The first heat-conducting part 2231 is used for heat transfer connection with the hard disk module 21, and the second heat-conducting part 2232 is used for heat transfer connection with the first heat dissipation plate 222.

[0075] When the hard disk module 21 is working, the large amount of heat generated can be conducted to the heat conduction component 223 through the first heat conduction part 2231, and then to the first heat dissipation plate 222 through the second heat conduction part 2232. Since the first heat dissipation plate 222 has a first liquid cooling channel inside, and the cooling medium is continuously circulating in the first liquid cooling channel, the heat conducted to the first heat dissipation plate 222 can be quickly absorbed by the cooling medium through heat exchange with the cooling medium, and finally discharged to the outside of the first heat dissipation plate 222, thereby achieving timely and effective heat dissipation and cooling of the hard disk module 21. Compared to traditional technologies, on the one hand, by using the heat-conducting component 223 in conjunction with the first heat dissipation plate 222 to achieve direct contact heat dissipation of the hard disk module 21, the heat conduction and dissipation efficiency is higher. Therefore, it can better meet the heat dissipation requirements of the hard disk module 21 with high heat generation, and avoid the hard disk module 21 being in an overheated state for a long time due to insufficient heat dissipation, which will affect its performance. On the other hand, the heat dissipation combination of the heat-conducting component 223 and the first heat dissipation plate 222 replaces the high-power fan, which can significantly reduce operating energy consumption and noise, and ensure a comfortable and healthy working environment in the computer room.

[0076] For example, the first heat-conducting part 2231 and the second heat-conducting part 2232 can be an integral structure or detachable assembly, which can be flexibly selected according to actual needs. Optionally, in this application, the first heat-conducting part 2231 and the second heat-conducting part 2232 are designed as an integral structure, so that the heat-conducting component 223 has better overall structural performance, improves durability and heat transfer reliability, while reducing the number of parts, reducing installation and processing steps, and improving the production efficiency of the liquid-cooled server 100.

[0077] Please continue reading. Figure 4 and Figure 5 Furthermore, in one embodiment, the second heat-conducting part 2232 includes a first heat-conducting plate 2232a and a second heat-conducting plate 2232b. The first heat-conducting plate 2232a and the second heat-conducting plate 2232b are arranged side by side along the height direction of the hard disk heat dissipation module 22 and form an accommodating cavity 2232c at intervals. The first heat dissipation cold plate 222 is installed in the accommodating cavity 2232c and is heat-conductingly connected to both the first heat-conducting plate 2232a and the second heat-conducting plate 2232b.

[0078] During installation, the first heat dissipation plate 222 can be inserted into the accommodating cavity 2232c through the opening. The first heat-conducting plate 2232a and the second heat-conducting plate 2232b simultaneously clamp the first heat dissipation plate 222 from both sides, achieving pre-positioning of the first heat dissipation plate 222 and the second heat-conducting part 2232. The installation method is simple and the connection reliability is high. Furthermore, the heat conducted to the heat-conducting component 223 can be simultaneously conducted to the first heat dissipation plate 222 through the two heat transfer paths formed by the first heat-conducting plate 2232a and the second heat-conducting plate 2232b, increasing the amount of heat absorbed and dissipated by the first heat dissipation plate 222 per unit time and improving its heat dissipation efficiency.

[0079] In one optional embodiment, the first heat-conducting plate 2232a and / or the second heat-conducting plate 2232b are recessed on the side of the cavity 2232c to form a mounting groove, and the hard disk heat dissipation module 22 also includes a heat spreader plate, which is embedded in the mounting groove.

[0080] On the one hand, the heat spreader is embedded in the mounting slot, and the side wall of the slot forms a circumferential contact and clamping with the heat spreader, which can ensure that the heat spreader is installed firmly and is not easy to loosen or fall off. At the same time, this clamping installation method does not require the use of threaded parts, adhesives or other auxiliary installation materials, which helps to reduce production costs. On the other hand, since the heat spreader has a capillary structure inside, it can provide phase change heat transfer capability. Combined with the dynamic heat absorption effect of the cooling medium inside the heat sink, the heat dissipation efficiency can be improved by 3 to 6 times, which further significantly improves the heat dissipation efficiency of the hard drive heat dissipation module 22 over the hard drive module 21.

[0081] Please continue reading. Figure 4 and Figure 5 In one embodiment, the first heat dissipation plate 222 includes a heat dissipation shell 2221, a first liquid inlet connector 2222 and a first liquid outlet connector 2223. The heat dissipation shell 2221 has a liquid inlet hole and a liquid outlet hole respectively opened at opposite ends along the length direction of the hard disk heat dissipation module 22. The first liquid inlet connector 2222 is installed at the liquid inlet hole and the first liquid outlet connector 2223 is installed at the liquid outlet hole. A first liquid cooling channel is formed inside the heat dissipation shell 2221, and the first liquid cooling channel is connected to the liquid inlet hole and the liquid outlet hole.

[0082] By setting the first liquid inlet connector 2222 and the first liquid outlet connector 2223, the first heat dissipation plate 222 can be quickly and effectively connected to the cooling medium supply device, so that the cooling medium supply device can deliver circulating cooling medium to the first heat dissipation plate 222, enabling the first heat dissipation plate 222 to obtain the ability to continuously and reliably dissipate heat and cool down the hard disk module 21 for a long time.

[0083] For example, the first liquid inlet connector 2222 and the first liquid outlet connector 2223 adopt quick-connect and quick-disconnect connectors to improve the convenience and effectiveness of installation and disassembly operations.

[0084] Multiple heat transfer baffles are arranged side-by-side at intervals inside the first liquid cooling channel. These baffles extend along the direction from the liquid inlet to the liquid outlet, forming a heat dissipation channel between adjacent baffles. The multiple heat transfer baffles effectively increase the heat exchange area between the heat and the cooling medium flowing within the heat dissipation channel, reducing the temperature difference between the heat-conducting component 223 and the first heat dissipation plate 222, thereby improving the heat exchange efficiency of the first heat dissipation plate 222.

[0085] Please continue reading. Figure 2 and Figure 7 In one embodiment, the motherboard module 41 includes a motherboard 411 on which a CPU 412, a memory module 413, and a voltage regulator 414 are respectively installed. The motherboard heat dissipation module 42 includes a second heat dissipation plate 421, a third heat dissipation plate 422, and a fourth heat dissipation plate 423. The second heat dissipation plate 421 is thermally connected to the CPU 412, the third heat dissipation plate 422 is thermally connected to the memory module 413, and the fourth heat dissipation plate 423 is thermally connected to the voltage regulator 414. The second heat dissipation plate 421, the third heat dissipation plate 422, and the fourth heat dissipation plate 423 are connected by liquid channels and are all connected to the liquid distribution device 30. Therefore, during operation, the second heat sink 421 can be used to absorb and cool the CPU 412, the third heat sink 422 can be used to absorb and cool the memory module 413, and the fourth heat sink 423 can be used to cool the voltage regulator 414, so that the cooling medium in the second heat sink 421, the third heat sink 422 and the fourth heat sink 423 carries the heat back to the liquid distribution device 30, and is finally discharged from the liquid-cooled server 100 through the return pipe 70.

[0086] In actual operation, the cooling medium flowing out of the liquid dispensing device 30 first flows into the fourth heat dissipation plate 423 to dissipate heat from the voltage regulator 414; then the cooling medium flowing out of the fourth heat dissipation plate 423 flows into the second heat dissipation plate 421 to dissipate heat from the CPU 412; finally, the cooling medium flowing out of the second heat dissipation plate 421 flows into the third heat dissipation plate 422 to dissipate heat from the memory module 413, and then flows out of the third heat dissipation plate 422 and back into the liquid dispensing device 30.

[0087] Please see Figure 7Furthermore, considering the excessive heat generated by the motherboard 411, in another embodiment, the liquid-cooled server 100 further includes a heat transfer tray 43. The heat transfer tray 43 is disposed inside the chassis 10, and the motherboard 411 is mounted on the heat transfer tray 43. The heat transfer tray 43 is heat-transfer connected to the liquid dispensing device 30. Therefore, the heat transfer tray 43 can serve as a heat transfer medium, directly conducting a portion of the heat from the motherboard 411 to the liquid dispensing device 30, where it is absorbed and carried away by the cooling medium, thereby enhancing the heat dissipation and cooling effect on the motherboard module 41.

[0088] like Figure 17 As shown, furthermore, heat transfer efficiency can be improved by placing a thermally conductive pad 80 between the motherboard 411 and the heat transfer tray 43. For example, the thermally conductive pad 80 can be installed on the heat transfer tray 43 using processes such as bonding or filling. The choice can be made flexibly according to actual needs, and no specific limitation is made here.

[0089] Please continue reading. Figures 8 to 13 In addition, in one embodiment, the expansion module includes a power module 51, which includes a power body 511 and a heat source 512 inside the power body 511. The expansion heat dissipation module includes a fifth heat dissipation plate 52, which is disposed on the outside of the power body 511 and forms a gap 52a between the fifth heat dissipation plate 52 and the heat source 512. The gap 52a is filled with potting compound 52b, and the heat source 512 is heat-transferring with the fifth heat dissipation plate 52 through the potting compound 52b.

[0090] When the power supply unit 511 is working, the heat source 512 generates heat, which needs to be dissipated in time to prevent the power supply unit 511 from being in an overheated working environment for a long time. In order to meet the heat dissipation requirements, a fifth heat dissipation plate 52 is wrapped around the outside of the power supply unit 511, and potting compound 52b is filled into the gap 52a between the heat source 512 and the fifth heat dissipation plate 52. The potting compound 52b completely fills the gap 52a, which can greatly reduce the air thermal resistance caused by the gap 52a. This allows the heat generated by the heat source 512 during operation to be quickly and effectively conducted to the fifth heat dissipation plate 52 through the potting compound 52b, and then dissipated by the fifth heat dissipation plate 52. This achieves efficient heat dissipation of the power supply unit 511 and improves the heat dissipation efficiency and effect of the power module 51.

[0091] Optionally, the potting compound 52b used in this application is specifically thermally conductive silicone. Thermally conductive silicone not only has excellent thermal conductivity, but can also be used to provide support, shock absorption, and corrosion protection for the power supply body 511 and the fifth heat dissipation plate 52, so that the power supply module 51 can operate stably and reliably in harsh environments.

[0092] Furthermore, in one embodiment, the fifth heat dissipation plate 52 includes a side plate 521 and an end plate 522 connected to each other. A second liquid cooling channel 5211 is formed inside the side plate 521, and the end plate 522 has an inlet and an outlet, both of which are connected to the second liquid cooling channel 5211. The inlet and outlet on the end plate 522 are used to allow cooling medium to enter and exit the second liquid cooling channel 5211, so that the cooling medium absorbs the heat conducted from the power supply unit 511 to the heat dissipation plate through heat exchange and dissipates the heat, thereby achieving the purpose of cooling the power supply unit 511.

[0093] Furthermore, the second liquid cooling channel 5211 is provided with partition ribs to form an S-shaped structure, which can significantly extend the length of the second liquid cooling channel 5211 and increase the residence time of the cooling medium in the second liquid cooling channel 5211, so as to absorb heat more fully and enhance the heat dissipation efficiency of the fifth heat dissipation plate 52.

[0094] Please continue reading. Figure 10 and Figure 11 In one embodiment, the power module 51 further includes a fixed bracket 513, a cold plate base 514, a second liquid inlet connector 515, and a second liquid outlet connector 516. The cold plate base 514 is connected to the second liquid inlet connector 515 and the second liquid outlet connector 516. The cold plate base 514 is mounted on the fixed bracket 513, the second liquid inlet connector 515 is mounted at the liquid inlet, and the second liquid outlet connector 516 is mounted at the liquid outlet.

[0095] The cold plate base 514 includes a base body 5141, a liquid inlet connector 5142, a liquid supply connector 5143, a liquid return connector 5144, and a liquid drain connector 5145. The interior of the base body 5141 has a first flow channel and a second flow channel that are spaced apart. The liquid inlet connector 5142 and the liquid supply connector 5143 are mounted on the base body 5141 and are connected through the first flow channel. The liquid supply connector 5143 is detachably connected to the second liquid inlet connector 515. The liquid return connector 5144 and the liquid drain connector 5145 are mounted on the base body 5141 and are connected through the second flow channel. The liquid return connector 5144 is detachably connected to the second liquid outlet connector 516.

[0096] By connecting the liquid supply connector 5143 to the second liquid inlet connector 515 and the liquid return connector 5144 to the second liquid outlet connector 516, the second liquid cooling channel 5211 inside the fifth heat dissipation plate 52 can be connected to the first channel and the second channel respectively. While assembling the base body 5141 and the fixed bracket 513, the fifth heat dissipation plate 52 and the power supply body 511 are installed and positioned. At the same time, it is convenient for the cooling medium to enter and exit the second liquid cooling channel 5211 to achieve circulation, ensuring the continuous heat dissipation capacity of the fifth heat dissipation plate 52 to the power supply body 511.

[0097] Optionally, a first solenoid valve and a second solenoid valve may also be installed on the base 5141 to control the opening and closing of the first flow channel and the second flow channel, respectively. For example, the first solenoid valve may be installed on any one of the liquid inlet connector 5142, the first flow channel, and the liquid supply connector 5143, and the second solenoid valve may be installed on any one of the second liquid outlet connector 516, the second flow channel, and the liquid drain connector 5145.

[0098] Please continue reading. Figure 14 and Figure 15 In one embodiment, the expansion module further includes a network card module 53, which includes a housing and a network card body 531 and an optical module 532 respectively mounted on the housing. The expansion heat dissipation module further includes a heat dissipation component, which includes a sixth heat dissipation plate 533 and a heat transfer component 534. The sixth heat dissipation plate 533 is used to be installed with the network card body 531 to achieve heat transfer cooperation. A third liquid cooling channel is formed inside the sixth heat dissipation plate 533 for the circulation of cooling medium. The heat transfer component 534 is used to be installed with the optical module 532 to achieve heat transfer cooperation, and the heat transfer component 534 is heat-transferringly connected to the sixth heat dissipation plate 533.

[0099] Therefore, when the network card body 531 and the optical module 532 generate a large amount of heat during operation, on the one hand, the heat of the network card body 531 is absorbed and carried away by the cooling medium flowing in the third liquid cooling channel through heat transfer with the sixth heat dissipation plate 533, thereby achieving heat dissipation and cooling of the network card body 531; on the other hand, the heat of the optical module 532 is first conducted to the heat transfer component 534, and then quickly conducted to the sixth heat dissipation plate 533 through the heat transfer component 534, and finally absorbed and carried away by the cooling medium, thereby achieving heat dissipation and cooling of the optical module 532. Compared with traditional technology, this solution integrates the sixth heat dissipation plate 533 with the heat transfer component 534, which can achieve simultaneous heat dissipation and cooling of the network card body 531 and the optical module 532. The installation structure of the sixth heat dissipation plate 533 and the heat transfer component 534 is simple and the heat dissipation path is short, which can greatly improve the speed of heat conduction and dissipation, thereby obtaining higher heat dissipation efficiency and better heat dissipation effect.

[0100] Optionally, the cooling medium in this application can be any one of water, oil, or a mixture of water and oil, whichever has flowability, and can be flexibly selected according to actual needs.

[0101] The sixth heat dissipation plate 533 has a first mounting plate and a second mounting plate protruding from opposite sides. The first mounting plate is provided with a first connecting post extending toward the carrier shell, and the second mounting plate is provided with a second connecting post extending toward the carrier shell. The first connecting post and the second connecting post are used to connect with the carrier shell.

[0102] For example, the first mounting plate and the second mounting plate are respectively set on opposite sides of the length direction of the sixth heat dissipation plate 533 in a rectangular structure, and the heat transfer element 534 contacts one side of the width direction of the sixth heat dissipation plate 533 to transfer heat. At this time, the connection with the carrier shell via the first and second connecting posts ensures that the sixth heat dissipation plate 533 is assembled and fixed on the carrier shell, guaranteeing the structural and positional stability of the sixth heat dissipation plate 533 and ensuring good heat transfer conditions between the sixth heat dissipation plate 533 and the network card body 531, allowing the sixth heat dissipation plate 533 to effectively dissipate heat from the network card body 531. On the other hand, the first and second connecting posts also provide support and positioning for the sixth heat dissipation plate 533, forming an installation state where the sixth heat dissipation plate 533 effectively contacts the network card body 531 but avoids excessive compressive stress, preventing deformation and damage to the network card body 531 due to pressure. Furthermore, two or more first and second connecting posts can be provided to provide more balanced and stable support for the sixth heat dissipation plate 533.

[0103] Optionally, in one embodiment, both the first and second connecting posts are provided with threaded holes for screwing into threaded components on the carrier shell. The carrier shell is installed and fixed to the first and second connecting posts by threaded connection, which is simple in structure, convenient and labor-saving in assembly and disassembly, and highly feasible.

[0104] Of course, it should be noted that in some other optional embodiments, the first connecting post and the second connecting post can also be assembled and fixed to the carrier shell by any of the following methods, such as snap-fitting, bonding, welding, riveting, etc., and can be flexibly selected according to actual needs.

[0105] Please continue reading. Figure 15 and Figure 16 Furthermore, based on the above embodiments, the heat transfer component 534 includes a heat transfer main board 5341 and a heat transfer auxiliary board 5342. The heat transfer main board 5341 is used to cover the optical module 532, and the heat transfer auxiliary board 5342 is connected to one end of the heat transfer main board 5341 near the sixth heat dissipation plate 533, so that the heat transfer auxiliary board 5342 and the sixth heat dissipation plate 533 are heat-transfer connected.

[0106] The heat transfer main plate 5341 and the heat transfer auxiliary plate 5342 can be an integral structure or they can be detached and assembled. For example, in this embodiment, the heat transfer main plate 5341 and the heat transfer auxiliary plate 5342 adopt an integral structure to enable the heat transfer component 534 to obtain better overall structural performance, while reducing the number of parts and facilitating the manufacturing and installation of the heat transfer component 534.

[0107] Optionally, the optical module 532 is rectangular in shape, with the heat transfer main board 5341 and the heat transfer auxiliary board 5342 connected at a 90-degree bend. The heat transfer main board 5341 is mounted on the side with the largest surface area on the upper surface of the optical module 532, while the heat transfer auxiliary board 5342 is in contact with a side of the optical module 532 along its length and close to the network card body 531. In this way, the heat generated by the optical module 532 during operation can be conducted to both the heat transfer main board 5341 and the heat transfer auxiliary board 5342 through both sides, thereby improving heat transfer efficiency and enabling the optical module 532 to dissipate heat and cool down more quickly.

[0108] The heat transfer component 534 also includes a first auxiliary plate 5343 and a second auxiliary plate 5344. The first auxiliary plate 5343 is connected to one side of the heat transfer auxiliary plate 5342, and the second auxiliary plate 5344 is connected to the other side of the heat transfer auxiliary plate 5342 and spaced apart from the first auxiliary plate 5343. Both the first auxiliary plate 5343 and the second auxiliary plate 5344 are used for heat transfer connection with the side of the optical module 532. The first auxiliary plate 5343 and the second auxiliary plate 5344 can further increase the contact area between the heat transfer auxiliary plate 5342 and the optical module 532, thereby increasing the heat conduction area and allowing more heat to be conducted from the optical module 532 to the heat transfer auxiliary plate 5342 per unit time, thus improving the heat dissipation efficiency and effect of the optical module 532.

[0109] For example, the first additional plate 5343 and the second additional plate 5344 can be integrally formed with the heat transfer auxiliary plate 5342, or they can be detachably assembled. In this embodiment, the first additional plate 5343, the second additional plate 5344, and the heat transfer auxiliary plate 5342 are integrally formed to ensure that the first additional plate 5343 and the second additional plate 5344 have higher structural strength and stability, while reducing the number of parts and facilitating the installation of the first additional plate 5343 and the second additional plate 5344 and their contact and cooperation with the optical module 532. Optionally, thermal pads can also be provided between the first additional plate 5343 and the second additional plate 5344 and the optical module 532 to reduce contact thermal resistance and improve heat transfer efficiency.

[0110] Furthermore, based on the above embodiments, the heat dissipation assembly also includes a fastener 535. The fastener 535 is provided with a receiving groove 5351. The fastener 535 is fastened and installed on the outside of the heat transfer main board 5341 through the receiving groove 5351. The fastener 535 is provided with a first snap-fit ​​part 5352 and a second snap-fit ​​part 5353 on opposite sides. The first snap-fit ​​part 5352 is used to snap-fit ​​with the first mating part 5321 on the optical module 532, and the second snap-fit ​​part 5353 is used to snap-fit ​​with the second mating part 5322 on the optical module 532.

[0111] Understandably, the receiving slot 5351 is designed to accommodate the heat transfer mainboard 5341, allowing the fastener 535 to be pressed onto the outside of the heat transfer mainboard 5341 while partially enclosing the optical module 532 inside. Furthermore, by utilizing the corresponding snap-fit ​​connections between the first snap-fit ​​part 5352 and the first mating part 5321, and between the second snap-fit ​​part 5353 and the second mating part 5322, the fastener 535 can press the heat transfer mainboard 5341 tightly against the upper surface of the optical module 532, ensuring complete and effective contact between the heat transfer mainboard 5341 and the upper surface of the optical module 532, obtaining sufficient heat transfer area, and guaranteeing heat transfer performance. Moreover, the snap-fit ​​installation method of the fastener 535 facilitates the installation and removal of the heat transfer component 534 and the optical module 532, improving the convenience of use and subsequent maintenance.

[0112] Please continue reading. Figure 2 Furthermore, based on any of the above embodiments, the expansion module also includes a GPU, and the expansion heat dissipation module also includes a seventh heat dissipation plate 54, which is thermally connected to the GPU. In use, the seventh heat dissipation plate 54 is connected to the liquid dispensing device 30 through a liquid inlet branch pipe and a liquid return branch pipe, so that the cooling medium flows into the seventh heat dissipation plate 54, enabling the seventh heat dissipation plate 54 to continuously absorb heat and cool the GPU, thereby enhancing the cooling effect on the GPU.

[0113] In addition to the above, this application also proposes a server rack, which includes a rack body and a liquid-cooled server 100 as described in any of the above embodiments, wherein the liquid-cooled server 100 is installed in the rack body. Optionally, multiple compartments are arranged in the rack body along its horizontal and / or vertical directions, and multiple liquid-cooled servers 100 are provided, with one server 100 placed in each compartment, so as to increase the number of liquid-cooled servers 100 that the server rack can accommodate and enhance the working performance of the server rack.

[0114] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments have been described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0115] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. The protection scope of this patent application shall be determined by the appended claims.

Claims

1. A liquid-cooled server, characterized in that, include: The chassis has a first mounting area, a second mounting area, a third mounting area and a fourth mounting area arranged sequentially along its length. A hard disk device, wherein the hard disk device is installed in the first installation area, and the hard disk device includes a hard disk module and a hard disk heat dissipation module that are thermally connected. A liquid dispensing device is installed in the second installation area and is connected to the liquid circuit of the hard disk heat dissipation module; A motherboard device is installed in the third installation area, and the motherboard device includes a motherboard module and a motherboard heat dissipation module that are heat-transfer connected, and the motherboard heat dissipation module is connected to the liquid distribution device liquid circuit. An expansion device is installed in the fourth installation area, and the expansion device includes a heat-transferring expansion module and an expansion heat dissipation module, the expansion heat dissipation module being connected to the liquid circuit of the liquid dispensing device; as well as The infusion line and the return line are both connected to the liquid preparation device.

2. The liquid-cooled server according to claim 1, characterized in that, The liquid dispensing device includes a mounting base, a liquid supply distributor, and a liquid return distributor. The mounting base is disposed on the chassis. The liquid supply distributor and the liquid return distributor are respectively mounted on the mounting base. The liquid supply distributor is provided with an inlet connector and multiple liquid supply connectors. The inlet connector is connected to the liquid delivery pipeline. Each liquid supply connector is connected to a liquid delivery branch pipe. The multiple liquid delivery branch pipes are connected to the hard disk cooling module, the motherboard cooling module, and the extended cooling module, which are respectively disposed thereon. The liquid return distributor is provided with a liquid outlet connector and multiple liquid return connectors. The liquid outlet connector is connected to the liquid return pipeline. Each liquid return connector is connected to a liquid return branch pipe. The multiple liquid return branch pipes are respectively connected to the hard drive heat dissipation module, the motherboard heat dissipation module and the expansion heat dissipation module.

3. The liquid-cooled server according to claim 2, characterized in that, Multiple liquid supply connectors are arranged side by side at intervals along the length of the liquid dispensing device, and multiple liquid return connectors are arranged side by side at intervals along the length of the liquid dispensing device. The liquid supply connectors and the liquid return connectors are arranged alternately along the length of the liquid dispensing device, and adjacent liquid supply connectors and liquid return connectors are staggered along the width of the liquid dispensing device. The liquid supply distributor is equipped with at least two liquid inlet connectors, and the liquid delivery pipeline is provided with at least two lines, which are connected to the liquid inlet connectors one by one; the liquid return distributor is equipped with at least two liquid outlet connectors, and the liquid return pipeline is provided with at least two lines, which are connected to the liquid outlet connectors one by one.

4. The liquid-cooled server according to claim 1, characterized in that, The hard drive heat dissipation module includes a mounting bracket, a first heat dissipation plate, and a heat-conducting component. The first heat dissipation plate is mounted on the mounting bracket and connected to the liquid distribution device. A first liquid cooling channel is formed inside the first heat dissipation plate. The heat-conducting component includes a first heat-conducting part and a second heat-conducting part connected to each other. The first heat-conducting part is used for heat transfer connection with the hard disk module, and the second heat-conducting part is used for heat transfer connection with the first heat dissipation plate.

5. The liquid-cooled server according to claim 4, characterized in that, The second heat-conducting part includes a first heat-conducting plate and a second heat-conducting plate. The first heat-conducting plate and the second heat-conducting plate are arranged side by side along the height direction of the hard disk heat dissipation module and form an accommodating cavity at intervals. The first heat dissipation cold plate is installed in the accommodating cavity and is heat-transferringly connected to both the first heat-conducting plate and the second heat-conducting plate.

6. The liquid-cooled server according to claim 4, characterized in that, The first heat dissipation plate includes a heat dissipation shell, a first liquid inlet connector, and a first liquid outlet connector. The heat dissipation shell has a liquid inlet hole and a liquid outlet hole at opposite ends along the length of the hard disk heat dissipation module. The first liquid inlet connector is installed at the liquid inlet hole, and the first liquid outlet connector is installed at the liquid outlet hole. The heat dissipation shell forms a first liquid cooling channel, which communicates with the liquid inlet hole and the liquid outlet hole. Multiple heat transfer baffles are arranged side by side at intervals inside the first liquid cooling channel. All of the heat transfer baffles extend along the direction from the liquid inlet to the liquid outlet, and a heat dissipation channel is formed between two adjacent heat transfer baffles.

7. The liquid-cooled server according to claim 1, characterized in that, The motherboard module includes a motherboard on which a CPU, memory modules, and a voltage regulator are mounted. The motherboard heat dissipation module includes a second heat dissipation plate, a third heat dissipation plate, and a fourth heat dissipation plate. The second heat dissipation plate is thermally connected to the CPU, the third heat dissipation plate is thermally connected to the memory modules, and the fourth heat dissipation plate is thermally connected to the voltage regulator. The second, third, and fourth heat dissipation plates are connected in liquid circuits and are all connected in liquid circuits to the liquid dispensing device.

8. The liquid-cooled server according to claim 7, characterized in that, The liquid-cooled server also includes a heat transfer tray, which is disposed inside the chassis. The motherboard is mounted on the heat transfer tray, and the heat transfer tray is heat-transfer connected to the liquid dispensing device.

9. The liquid-cooled server according to claim 1, characterized in that, The expansion module includes a power module, which includes a power body and a heat source inside the power body. The expansion heat dissipation module includes a fifth heat dissipation plate, which is disposed on the outside of the power body and forms a gap between the fifth heat dissipation plate and the heat source. The gap is filled with potting compound, and the heat source is in heat transfer cooperation with the fifth heat dissipation plate through the potting compound.

10. The liquid-cooled server according to claim 9, characterized in that, The fifth heat dissipation plate includes a side plate and an end plate connected to each other. A second liquid cooling channel is formed inside the side plate. The end plate has a liquid inlet and a liquid outlet, both of which are connected to the second liquid cooling channel.

11. The liquid-cooled server according to claim 10, characterized in that, The power module further includes a fixed bracket, a cold plate base, a second liquid inlet connector, and a second liquid outlet connector. The cold plate base is connected to the second liquid inlet connector and the second liquid outlet connector, and the cold plate base is mounted on the fixed bracket. The second liquid inlet connector is mounted at the liquid inlet, and the second liquid outlet connector is mounted at the liquid outlet. The cold plate base includes a base body, a liquid inlet connector, a liquid supply connector, a liquid return connector, and a liquid drain connector. The interior of the base body has a first flow channel and a second flow channel that are spaced apart. The liquid inlet connector and the liquid supply connector are mounted on the base body and connected through the first flow channel liquid path. The liquid supply connector is detachably connected to the second liquid inlet connector. The liquid return connector and the liquid outlet connector are mounted on the base body and connected through the second flow channel liquid path. The liquid return connector is detachably connected to the second liquid outlet connector.

12. The liquid-cooled server according to claim 1, characterized in that, The expansion module further includes a network card module, which includes a housing and a network card body and an optical module respectively mounted on the housing. The expansion heat dissipation module further includes a heat dissipation component, which includes a sixth heat dissipation plate and a heat transfer element. The sixth heat dissipation plate is used to be installed with the network card body to achieve heat transfer cooperation. A third liquid cooling channel is formed inside the sixth heat dissipation plate for the flow of cooling medium. The heat transfer element is used to be installed with the optical module to achieve heat transfer cooperation, and the heat transfer element is heat-transferringly connected to the sixth heat dissipation plate.

13. The liquid-cooled server according to claim 12, characterized in that, The heat transfer component includes a heat transfer main board and a heat transfer auxiliary board. The heat transfer main board is used to cover the top of the optical module, and the heat transfer auxiliary board is connected to the end of the heat transfer main board near the sixth heat dissipation plate, so that the heat transfer auxiliary board and the sixth heat dissipation plate are connected in a heat transfer connection. The heat transfer component further includes a first auxiliary plate and a second auxiliary plate. The first auxiliary plate is connected to one side of the heat transfer auxiliary plate, and the second auxiliary plate is connected to the other side of the heat transfer auxiliary plate and spaced apart from the first auxiliary plate. Both the first auxiliary plate and the second auxiliary plate are used for heat transfer connection with the side of the optical module.

14. The liquid-cooled server according to claim 13, characterized in that, The heat dissipation assembly also includes a fastener with a receiving groove. The fastener is installed on the outside of the heat transfer motherboard by the receiving groove. The fastener has a first snap-fit ​​part and a second snap-fit ​​part on opposite sides. The first snap-fit ​​part is used to snap-fit ​​with a first mating part on the optical module, and the second snap-fit ​​part is used to snap-fit ​​with a second mating part on the optical module.

15. The liquid-cooled server according to claim 1, characterized in that, The expansion module also includes a GPU, and the expansion heat dissipation module also includes a seventh heat dissipation plate, which is thermally connected to the GPU.

16. A server rack, characterized in that, It includes a cabinet and a liquid-cooled server as described in any one of claims 1 to 15, wherein the liquid-cooled server is installed in the cabinet.

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