Power amplifier pin compatible circuit and radio frequency front end device
The differences in pin definitions between Qualcomm PAs and third-party PAs are resolved by using universal pin-compatible modules and zero-resistance conduction components, enabling low-cost and high-flexibility RF front-end devices.
Patent Information
- Application Number
- CN202511655550.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-12
- Publication Date
- 2026-02-10
AI Technical Summary
In existing technologies, the pin definitions of Qualcomm PAs and third-party PAs are different, making it impossible to achieve interchangeable mounting, resulting in high development costs, high maintenance costs, and poor flexibility.
It adopts a universal pin-compatible module, which includes multiple RF signal lines and surface mount positions. It enables signal transmission and reception of different types of power amplifiers through surface mount zero-resistance conduction components, avoiding the need to redesign the printed circuit board.
It reduces the development and maintenance costs of RF front-end devices, improves device flexibility, and enables compatible reception of different types of power amplifiers.
Smart Images
Figure CN121508469A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of radio frequency communication technology, and more specifically, to a power amplifier pin-compatible circuit and a radio frequency front-end device. Background Technology
[0002] In the RF front-end design of wireless communication terminal equipment, the power amplifier (PA) is a key component for achieving efficient RF signal transmission. With the development of multi-band and multi-standard communication standards, the RF front-end needs to support a wide frequency range from low-frequency (LB) and mid-frequency (MB) to high-frequency (HB). Therefore, wideband PA chips with multi-input / output structures are typically used to meet system requirements. However, although these PA chips have similar functions, their pin definitions differ in some key control signals. Especially in the allocation of RF input pins, Qualcomm PAs and third-party PAs have interchangeable pins. Qualcomm PAs define PIN7 as the high-frequency input and PIN8 as the mid-frequency input; while third-party PAs define PIN7 as the mid-frequency input and PIN8 as the high-frequency input. This difference in pin definitions makes it impossible to interchangeably mount the two types of PA chips during the printed circuit board hardware design stage.
[0003] In related technologies, the problem of incompatibility between different PA pins is often solved in the following two ways: the first solution is to redesign the traces of the printed circuit board or use a dedicated adapter board to adapt to different PAs; the second solution is to use flying wires or jumpers to manually adjust the pin wiring to adapt to different PAs.
[0004] However, when addressing compatibility issues between different PA pins using related technologies, the first approach lacks versatility and scalability, and has a long development cycle; the second approach is not conducive to automated production and subsequent maintenance. Therefore, these technologies suffer from high development costs, high maintenance costs, and poor flexibility. Summary of the Invention
[0005] The purpose of this application is to provide a power amplifier pin-compatible circuit and an RF front-end device, which can reduce the development and maintenance costs of the RF front-end device and improve its flexibility.
[0006] The embodiments of this application are implemented as follows: A first aspect of this application provides a power amplifier pin-compatible circuit, which includes a general pin-compatible module and a power amplifier. The general pin-compatible module includes multiple radio frequency signal lines, and each radio frequency signal line has at least one surface mountable position reserved. The first input terminal of the universal pin-compatible module is used to input high-frequency radio frequency signals, the second input terminal of the universal pin-compatible module is used to input mid-frequency radio frequency signals, the first output terminal of the universal pin-compatible module is connected to the seventh pin of the power amplifier, and the second output terminal of the universal pin-compatible module is connected to the eighth pin of the power amplifier. When the power amplifier is a target type power amplifier, a zero-resistance conduction component is placed on each surface mount position of each RF signal line corresponding to the target type in the general pin compatible module, so that at least one RF signal line is connected to the power amplifier and the power amplifier can transmit and receive signals normally.
[0007] As one possible implementation, the aforementioned multiple radio frequency signal lines include: a first radio frequency signal line, a second radio frequency signal line, a third radio frequency signal line, and a fourth radio frequency signal line; The input terminals of both the first and second RF signal lines are used to receive high-frequency RF signals. The output terminal of the first RF signal line is connected to the seventh pin of the power amplifier, and the output terminal of the second RF signal line is connected to the eighth pin of the power amplifier. The input terminals of the third and fourth RF signal lines are both used to input intermediate frequency (IF) RF signals. The output terminal of the third RF signal line is connected to the eighth pin of the power amplifier, and the output terminal of the fourth RF signal line is connected to the seventh pin of the power amplifier.
[0008] As one possible implementation, if the target type is the first type, a zero-resistance conductive component is mounted on each of the mountable positions of the first RF signal line, and a zero-resistance conductive component is mounted on each of the mountable positions of the third RF signal line.
[0009] As one possible implementation, the first radio frequency signal line includes a first mountable position and a second mountable position, the third radio frequency signal line includes a third mountable position and a fourth mountable position, and the zero-resistance conduction component includes: a first resistor, a second resistor, a third resistor and a fourth resistor; If the power amplifier is a first type of power amplifier, a first resistor is mounted at a first surface mount position and a second resistor is mounted at a second surface mount position to connect the high-frequency radio frequency signal to the seventh pin of the first type of power amplifier; at the same time, a third resistor is mounted at a third surface mount position and a fourth resistor is mounted at a fourth surface mount position to connect the high-frequency radio frequency signal to the eighth pin of the first type of power amplifier.
[0010] As one possible implementation, if the target type is the second type, a zero-resistance conductive component is mounted on each of the mountable positions of the second RF signal line, and a zero-resistance conductive component is mounted on each of the mountable positions of the fourth RF signal line.
[0011] As one possible implementation, the second RF signal line includes a fifth and a sixth mountable position, the fourth RF signal line includes a seventh and an eighth mountable position, and the zero-resistance conduction component further includes a fifth resistor, a sixth resistor, a seventh resistor, and an eighth resistor. If the power amplifier is a type 2 power amplifier, a fifth resistor is placed at the fifth surface mount position and a sixth resistor is placed at the sixth surface mount position to connect the high-frequency radio frequency signal to the eighth pin of the type 2 power amplifier; at the same time, a seventh resistor is placed at the seventh surface mount position and an eighth resistor is placed at the eighth surface mount position to connect the high-frequency radio frequency signal to the seventh pin of the type 2 power amplifier.
[0012] As one possible implementation, the aforementioned zero-resistance conducting component is a zero-ohm resistor.
[0013] As one possible implementation, the power amplifier of the first type mentioned above is a high-pass power amplifier.
[0014] As one possible implementation, the power amplifier of the second type mentioned above is a third-party power amplifier.
[0015] A second aspect of this application provides a radio frequency front-end device, which includes the power amplifier pin-compatible circuit described in the first aspect above.
[0016] The beneficial effects of the embodiments of this application include: This application provides a power amplifier pin-compatible circuit that provides RF paths for different types of power amplifiers through a universal pin-compatible module. The universal pin-compatible module contains multiple RF signal lines, and each RF signal line has at least one surface mount position. The first input terminal of the universal pin-compatible module is used to receive high-frequency RF signals output from the pre-amplifier RF circuit, and the second input terminal is used to receive mid-frequency RF signals output from the pre-amplifier RF circuit. The first output terminal of the universal pin-compatible module is connected to the seventh pin of the power amplifier, and the second output terminal is connected to the eighth pin of the power amplifier. When the user selects a power amplifier, the surface mount machine, according to the type of power amplifier, surfaces zero-resistance conductive components at each surface mount position of the corresponding RF signal line in the universal pin-compatible module to make the corresponding RF signal line conductive, so that the power amplifier can normally transmit and receive RF signals. The universal pin-compatible module utilizes multiple built-in RF signal lines and pre-reserved surface-mount positions on each line to achieve a RF transmission path compatible with various pin definitions. Only zero-resistance conductive components need to be surface-mounted at the corresponding surface-mount positions on the RF signal lines corresponding to different types of power amplifiers. This allows different types of power amplifiers to successfully receive RF signals transmitted from the front-end RF circuitry regardless of pin definitions, eliminating the need to redesign and develop new printed circuit board layouts for different types of power amplifiers. This reduces the development and maintenance costs of RF front-end devices and improves their flexibility. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 A schematic diagram of the structure of a first type of power amplifier pin-compatible circuit provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of a second power amplifier pin-compatible circuit provided in an embodiment of this application; Figure 3 A schematic diagram of the third power amplifier pin-compatible circuit provided in the embodiments of this application; Figure 4 A schematic diagram of the fourth power amplifier pin-compatible circuit provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of a radio frequency front-end device provided in an embodiment of this application.
[0019] Figure reference numerals: 10: Power amplifier pin-compatible circuit; 101: General-purpose pin-compatible module; 1011: RF signal line; 111: First RF signal line; 112: Second RF signal line; 113: Third RF signal line; 114: Fourth RF signal line; 1101: Surface mount position; 1111: First surface mount position; 1112: Second surface mount position; 1131: Third surface mount position; 1132: Fourth surface mount position; 1121: Fifth surface mount position; 1 122: Sixth surface mount position; 1141: Seventh surface mount position; 1142: Eighth surface mount position; 1012: Zero resistance conduction component; 121: First resistor; 122: Second resistor; 123: Third resistor; 124: Fourth resistor; 125: Fifth resistor; 126: Sixth resistor; 127: Seventh resistor; 128: Eighth resistor; 102: Power amplifier; 1021: Qualcomm power amplifier; 1022: Third-party power amplifier; 20: RF front-end device. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0021] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0023] In the description of this application, it should be noted that the terms "first," "second," and "third," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance. It should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0024] Currently, to overcome the issue of inverse pin definitions between Qualcomm power amplifiers and third-party power amplifiers, two common approaches are used to implement RF transceiver functionality for different power amplifiers. The first approach involves redesigning the printed circuit board (PCB) traces for different types of power amplifiers or using dedicated adapter boards. The second approach involves manually adjusting pin connections using jumpers or flying wires to adapt to different power amplifiers. However, the first approach lacks versatility and scalability, and the development cycle for dedicated converters and PCBs is lengthy. The second approach relies on manual adjustments, which is detrimental to automated production and subsequent mass maintenance. Therefore, existing technologies suffer from high development and maintenance costs, as well as poor flexibility.
[0025] To address this, this application provides a power amplifier pin-compatible circuit. This circuit includes a universal pin-compatible module and a power amplifier. The universal pin-compatible module provides multiple RF signal lines, reserving at least one surface-mount position on each RF signal line. The first input of the universal pin-compatible module is connected to a high-frequency RF signal output from a pre-amplifier RF circuit, and the second input is connected to a mid-frequency RF signal output from the pre-amplifier RF circuit. The signal is then output to the seventh pin of the power amplifier via the first output of the universal pin-compatible module and to the eighth pin of the power amplifier via the second output of the universal pin-compatible module. Based on the target type of the power amplifier, zero-resistance conduction components are packaged at each surface-mount position of the corresponding RF signal line in the universal pin-compatible module to ensure conduction of the RF signal line corresponding to the target type of power amplifier, allowing the power amplifier to transmit and receive RF signals normally. This reduces the development and maintenance costs of the RF front-end device and improves its flexibility.
[0026] The following description, in conjunction with the accompanying drawings, provides a detailed explanation of the power amplifier pin-compatible circuit and RF front-end device provided in the embodiments of this application.
[0027] Figure 1A schematic diagram of a power amplifier pin-compatible circuit provided in this application is shown below. Figure 1 This application provides a power amplifier pin-compatible circuit 10, which includes a general pin-compatible module 101 and a power amplifier 102. The general pin-compatible module 101 includes multiple radio frequency signal lines 1011, and each radio frequency signal line 1011 has at least one surface mountable position 1101 reserved on it.
[0028] The universal pin-compatible module 101 includes multiple radio frequency signal lines 1011, which provide radio frequency transmission paths for different types of power amplifiers 102 through the multiple radio frequency signal lines.
[0029] Furthermore, each RF signal line 1011 in the universal pin-compatible module 101 has at least one surface mount position 1101 reserved, so that the pick-and-place machine can package a zero-resistance conducting component 1012 on each surface mount position on the matching RF signal line 1011 according to the type of power amplifier 102 selected by the user, so that the RF signal line 1011 is turned on, thereby realizing the signal transmission and reception functions of different types of power amplifiers 102.
[0030] Therefore, the power amplifier pin-compatible circuit 10 provided in this application embodiment can realize the transmission of radio frequency signals with different types of power amplifiers 102 through multiple radio frequency signal lines 1011 in the general pin-compatible module 101. There is no need to design corresponding radio frequency signal paths for different types of power amplifiers 102, which can reduce the development cost of radio frequency front-end devices and shorten the development cycle of radio frequency front-end devices.
[0031] It should also be noted that the reserved surface mount positions 1101 on each RF signal line 1011 refer to the positions reserved in advance for the zero resistance conduction component 1012 at specific locations on the RF signal line 1011. If the selected power amplifier 102 does not need to transmit RF signals through a certain RF signal line 1011, then the RF signal line 1011 does not need to be turned on, and therefore it is not necessary to encapsulate the zero resistance conduction component 1012 on the reserved surface mount position 1101 of this RF signal line 1011.
[0032] The first input terminal of the universal pin compatible module 101 is used to receive high-frequency radio frequency signals, the second input terminal of the universal pin compatible module 101 is used to receive mid-frequency radio frequency signals, the first output terminal of the universal pin compatible module 101 is connected to the seventh pin of the power amplifier 102, and the second output terminal of the universal pin compatible module 101 is connected to the eighth pin of the power amplifier 102.
[0033] Optionally, the high-frequency radio frequency signal refers to the high-frequency radio frequency signal that the pre-stage radio frequency circuit wants to transmit to the power amplifier 102, and the mid-frequency radio frequency signal refers to the mid-frequency radio frequency signal that the pre-stage radio frequency circuit wants to transmit to the power amplifier 102. This application does not specifically limit the frequency of the high-frequency radio frequency signal or the frequency of the mid-frequency radio frequency signal.
[0034] Optionally, the first input terminal of the universal pin compatible module 101 refers to the input terminal of a portion of the RF signal lines 1011 in the universal pin compatible module 101. The input terminal of this portion of the RF signal lines 1011 is connected to the output terminal of the high-frequency RF signal of the front-end RF circuit. This portion of the RF signal lines 1011 is used to receive the high-frequency RF signal output by the front-end RF circuit.
[0035] Optionally, the second input terminal of the universal pin compatible module 101 refers to the input terminal of another part of the RF signal line 1011 in the universal pin compatible module 101. The input terminal of this part of the RF signal line 1011 is connected to the output terminal of the intermediate frequency band RF signal of the front-end RF circuit. This part of the RF signal line 1011 is used to receive the intermediate frequency band RF signal output by the front-end RF circuit.
[0036] It should be noted that the input terminal of each RF signal line 1011 in the general pin compatible module 101 can only be connected to the output terminal of a certain frequency band RF signal. For example, if the input terminal of RF signal line A is connected to a high-frequency RF signal, the input terminal of RF signal line A can no longer receive a mid-frequency RF signal. This application does not make specific limitations in this regard.
[0037] Optionally, the definition of the seventh pin of the power amplifier 102 varies depending on the type of the power amplifier 102. For example, in a high-pass power amplifier, the seventh pin is defined as the input terminal of the high-frequency radio frequency signal of the high-pass power amplifier, and in a third-party power amplifier, the seventh pin is defined as the input terminal of the mid-frequency radio frequency signal of the third-party power amplifier.
[0038] Optionally, the definition of the eighth pin of the power amplifier 102 varies depending on the type of the power amplifier 102. For example, in a high-pass power amplifier, the eighth pin is defined as the input terminal of the mid-frequency radio frequency signal of the high-pass power amplifier, and in a third-party power amplifier, the eighth pin is defined as the input terminal of the high-frequency radio frequency signal of the third-party power amplifier.
[0039] Optionally, the first output terminal of the universal pin compatible module 101 refers to the output terminal of the radio frequency signal line 1011 in which part of the universal pin compatible module 101 is connected to the seventh pin of the power amplifier 102; the second output terminal of the universal pin compatible module 101 refers to the output terminal of the radio frequency signal line 1011 in which another part of the universal pin compatible module 101 is connected to the eighth pin of the power amplifier 102.
[0040] It should be noted that the output of each RF signal line 1011 in the general pin compatible module 101 can only output an RF signal of a certain frequency band. The output of each RF signal line 1011 can only output an RF signal of the same frequency band as the RF signal received from the preceding RF circuit. For example, if the input of RF signal line A is connected to a high-frequency RF signal, then the output of RF signal line A can only output a high-frequency RF signal. If RF signal line A is used as the RF path corresponding to a high-pass power amplifier, the output of RF signal line A is connected to the seventh pin of the high-pass power amplifier; if RF signal line A is used as the RF path corresponding to a third-party power amplifier, the output of RF signal line A is connected to the eighth pin of the third-party power amplifier. This application does not make specific limitations in this regard.
[0041] When the power amplifier 102 is a target type power amplifier, a zero-resistance conduction component 1012 is placed on each surface mount position 1101 of each RF signal line 1011 corresponding to the target type in the general pin compatible module 101, so that at least one RF signal line 1011 is connected to the power amplifier 102, and the power amplifier 102 can normally transmit and receive signals.
[0042] Optionally, the target type refers to the type of power amplifier currently packaged on the same printed circuit board as the general-purpose pin-compatible module 101. The target type may be a Qualcomm power amplifier or a third-party power amplifier. The target type of the power amplifier is randomly selected by the user according to their needs, and this application does not make any specific limitation on it.
[0043] It is worth noting that the architecture of the universal pin-compatible module 101 is pre-etched on the printed circuit board. The pick-and-place machine only needs to generate the pick-and-place production data of the universal pin-compatible module 101 according to the power amplifier 102 type selected by the user, and perform pick-and-place packaging on the reserved pick-and-place position 1101 on the corresponding RF signal line 1011 in the universal pin-compatible module 101 according to the pick-and-place production data, so that the RF signal line 1011 corresponding to the target type power amplifier 102 is turned on.
[0044] Optionally, after the user selects the power amplifier 102, according to the type of the power amplifier 102, zero-resistance conducting components 1012 are surface-mounted at each surface-mountable position 1101 of the RF signal line 1011 corresponding to the type of the power amplifier 102 in the general pin compatible module 101, so that the power amplifier 102 can transmit and receive RF signals normally. The zero-resistance conducting component 1012 can conduct the RF signal line 1011 it is located on without affecting the RF signal transmission quality.
[0045] For example, if RF signal lines A and B in the universal pin-compatible module are used as RF signal lines corresponding to a Qualcomm power amplifier, and RF signal lines C and D in the universal pin-compatible module are used as RF signal lines corresponding to a third-party power amplifier, when user X selects a Qualcomm power amplifier, the reserved surface mount positions on RF signal line A and RF signal line B in the universal pin-compatible module need to be surface mount packaged so that both RF signal lines A and B are turned on, and the Qualcomm power amplifier receives the RF signal transmitted by the front-end RF circuit through RF signal lines A and B.
[0046] In this embodiment, a universal pin-compatible module provides RF paths for different types of power amplifiers. The universal pin-compatible module contains multiple RF signal lines, and each RF signal line has at least one surface mount position. The first input terminal of the universal pin-compatible module is used to receive high-frequency RF signals output from the pre-amplifier RF circuit, and the second input terminal is used to receive mid-frequency RF signals output from the pre-amplifier RF circuit. The first output terminal of the universal pin-compatible module is connected to the seventh pin of the power amplifier, and the second output terminal is connected to the eighth pin of the power amplifier. When the user selects a power amplifier, the surface mount machine, according to the type of power amplifier, surfaces and encapsulates zero-resistance conductive components at each surface mount position of the corresponding RF signal line in the universal pin-compatible module, so that the corresponding RF signal line is conductive, and the power amplifier can normally transmit and receive RF signals. The universal pin-compatible module utilizes multiple built-in RF signal lines and pre-reserved surface-mount positions on each line to achieve a RF transmission path compatible with various pin definitions. Only zero-resistance conductive components need to be surface-mounted at the corresponding surface-mount positions on the RF signal lines corresponding to different types of power amplifiers. This allows different types of power amplifiers to successfully receive RF signals transmitted from the front-end RF circuitry regardless of pin definitions, eliminating the need to redesign and develop new printed circuit board layouts for different types of power amplifiers. This reduces the development and maintenance costs of RF front-end devices and improves their flexibility.
[0047] In one alternative implementation, see [link to implementation details]. Figure 2The multiple radio frequency signal lines 1011 in the general pin compatibility module 101 of the power amplifier pin compatibility circuit 10 provided in this application embodiment include: a first radio frequency signal line 111, a second radio frequency signal line 112, a third radio frequency signal line 113 and a fourth radio frequency signal line 114.
[0048] The input terminals of the first RF signal line 111 and the second RF signal line 112 are both used to access high-frequency RF signals. The output terminal of the first RF signal line 111 is connected to the seventh pin of the power amplifier 102, and the output terminal of the second RF signal line 112 is connected to the eighth pin of the power amplifier 102.
[0049] Optionally, the first RF signal line 111 and the second RF signal line 112 serve as high-frequency RF signal transceiver paths in the universal pin-compatible module 101. The first RF signal line 111 is used to transmit high-frequency RF signals to the seventh pin, and the second RF signal line 112 is used to transmit high-frequency RF signals to the eighth pin. That is, the first RF signal line 111 serves as the high-frequency RF signal transmission path of the high-pass power amplifier, and the second RF signal line 112 serves as the high-frequency RF signal transmission path of the third-party power amplifier.
[0050] The input terminals of the third RF signal line 113 and the fourth RF signal line 114 are both used to input intermediate frequency RF signals. The output terminal of the third RF signal line 113 is connected to the eighth pin of the power amplifier 102, and the output terminal of the fourth RF signal line 114 is connected to the seventh pin of the power amplifier 102.
[0051] Optionally, the third RF signal line 113 and the fourth RF signal line 114 serve as intermediate frequency (IF) RF signal transceiver paths in the general pin compatible module 101. The third RF signal line 113 is used to transmit IF RF signals to the eighth pin, and the fourth RF signal line 114 is used to transmit IF RF signals to the seventh pin. In other words, the third RF signal line 113 serves as the IF RF signal transmission path for the high-pass power amplifier, and the fourth RF signal line 114 serves as the IF RF signal transmission path for the third-party power amplifier.
[0052] In one alternative implementation, see [link to implementation details]. Figure 3 If the target type is the first type, a zero-resistance conductive component 1012 is mounted on each of the mountable positions 1101 of the first RF signal line 111, and a zero-resistance conductive component 1012 is mounted on each of the mountable positions 1101 of the third RF signal line 113.
[0053] The target type of power amplifier 102 is the first type, that is, the power amplifier 102 is a high-pass power amplifier 1021.
[0054] Optionally, when the target type of the power amplifier 102 selected by the user is a Qualcomm power amplifier 1021, the pick-and-place machine will surface mount zero-resistance conductive components 1012 on each surface mountable position 1101 of the first RF signal line 111 in the universal pin compatible module 101, and simultaneously surface mount zero-resistance conductive components 1012 on each surface mountable position 1101 of the third RF signal line 113 in the universal pin compatible module 101, so that both the first RF signal line 111 and the third RF signal line 113 are conductive.
[0055] It should be noted that all surface mountable positions 1101 on the second RF signal line 112 and the fourth RF signal line 114, which are unrelated to the Qualcomm power amplifier 1021, remain unpackaged.
[0056] In one alternative implementation, see [link to implementation details]. Figure 3 The first RF signal line 111 in the universal pin compatible module 101 of the power amplifier pin compatible circuit 10 provided in this application embodiment includes a first surface mount position 1111 and a second surface mount position 1112, the third RF signal line 113 includes a third surface mount position 1131 and a fourth surface mount position 1132, and the zero resistance conduction component 1012 includes a first resistor 121, a second resistor 122, a third resistor 123 and a fourth resistor 124.
[0057] If the power amplifier 102 is a first type of power amplifier 102, a first resistor 121 is mounted at the first mountable position 1111 and a second resistor 122 is mounted at the second mountable position 1112 to connect the high-frequency radio frequency signal to the seventh pin of the first type of power amplifier 102; at the same time, a third resistor 123 is mounted at the third mountable position 1131 and a fourth resistor 124 is mounted at the fourth mountable position 1132 to connect the high-frequency radio frequency signal to the eighth pin of the first type of power amplifier 102.
[0058] Optionally, if the power amplifier 102 selected by the user is a Qualcomm power amplifier 1021, the pick-and-place machine will mount a first resistor 121 on the first mountable position 1111 of the first RF signal line 111 and mount a second resistor 122 on the second mountable position 1112 of the first RF signal line 111 to transmit the high-frequency RF signal generated by the front-end RF circuit to the seventh pin of the Qualcomm power amplifier 1021; at the same time, the pick-and-place machine will mount a third resistor 123 on the third mountable position 1131 of the third RF signal line 113 and mount a fourth resistor 124 on the fourth mountable position 1132 of the third RF signal line 113 to transmit the mid-frequency RF signal generated by the front-end RF circuit to the eighth pin of the Qualcomm power amplifier 1021.
[0059] In one alternative implementation, see [link to implementation details]. Figure 4 If the target type is the second type, a zero-resistance conductive component 1012 is mounted on each of the mountable positions 1101 of the second RF signal line 112, and a zero-resistance conductive component 1012 is mounted on each of the mountable positions 1101 of the fourth RF signal line 114.
[0060] The target type of power amplifier 102 is the second type, that is, it indicates that power amplifier 102 is a third-party power amplifier 1022.
[0061] Optionally, when the target type of the power amplifier 102 selected by the user is a third-party power amplifier 1022, the pick-and-place machine will surface mount zero-resistance conductive components 1012 on each surface mountable position 1101 of the second RF signal line 112 in the universal pin compatible module 101, and simultaneously surface mount zero-resistance conductive components 1012 on each surface mountable position 1101 of the fourth RF signal line 114 in the universal pin compatible module 101, so that both the second RF signal line 112 and the fourth RF signal line 114 are turned on.
[0062] It should be noted that all surface mountable positions 1101 on the first RF signal line 111 and the third RF signal line 113, which are unrelated to the third-party power amplifier 1022, remain unpackaged.
[0063] In one alternative implementation, see [link to implementation details]. Figure 4 The second RF signal line 112 in the universal pin compatible module 101 of the power amplifier pin compatible circuit 10 provided in this application embodiment includes a fifth surface mount position 1121 and a sixth surface mount position 1122, and the fourth RF signal line 114 includes a seventh surface mount position 1141 and an eighth surface mount position 1142. The zero resistance conduction component 1012 also includes a fifth resistor 125, a sixth resistor 126, a seventh resistor 127 and an eighth resistor 128.
[0064] If the power amplifier 102 is a second type of power amplifier, a fifth resistor 125 is mounted at the fifth surface mount position 1121 and a sixth resistor 126 is mounted at the sixth surface mount position 1122 to connect the high-frequency radio frequency signal to the eighth pin of the second type of power amplifier 102; at the same time, a seventh resistor 127 is mounted at the seventh surface mount position 1141 and an eighth resistor 128 is mounted at the eighth surface mount position 1142 to connect the high-frequency radio frequency signal to the seventh pin of the second type of power amplifier 102.
[0065] Optionally, if the power amplifier 102 selected by the user is a third-party power amplifier 1022, the pick-and-place machine will surface mount a fifth resistor 125 on the fifth surface mountable position 1121 of the second RF signal line 112 and a sixth resistor 126 on the sixth surface mountable position 1122 of the second RF signal line 112 to transmit the high-frequency RF signal generated by the front-end RF circuit to the eighth pin of the third-party power amplifier 1022; at the same time, the pick-and-place machine will surface mount a seventh resistor 127 on the seventh surface mountable position 1141 of the fourth RF signal line 114 and an eighth resistor 128 on the eighth surface mountable position 1142 of the fourth RF signal line 114 to transmit the mid-frequency RF signal generated by the front-end RF circuit to the seventh pin of the third-party power amplifier 1022.
[0066] In one optional implementation, the zero-resistance conduction component 1012 in the power amplifier pin-compatible circuit 10 provided in this application embodiment is a zero-ohm resistor.
[0067] Optionally, a zero-ohm resistor refers to a resistor with a resistance value of zero. The zero-resistance conducting component 1012 is a zero-ohm resistor, that is, the first resistor 121, the second resistor 122, the third resistor 123, the fourth resistor 124, the fifth resistor 125, the sixth resistor 126, the seventh resistor 127 and the eighth resistor 128 are all zero-ohm resistors.
[0068] In one alternative implementation, the power amplifier of the first type described above is a high-pass power amplifier 1021.
[0069] The Qualcomm Power Amplifier 1021 refers to a power amplifier designed and sold by Qualcomm.
[0070] In one alternative implementation, the power amplifier of the second type described above is a third-party power amplifier 1022.
[0071] Among them, the third-party power amplifier 1022 refers to a power amplifier designed and manufactured by a company other than Qualcomm.
[0072] Figure 5 A schematic diagram of the structure of a radio frequency front-end device provided in this application is shown below. Figure 5 The radio frequency front-end device 20 provided in this application includes the power amplifier pin compatible circuit 10 described above. The working principle of the radio frequency front-end device 20 receiving radio frequency signal lines of different frequency bands from the front-end radio frequency circuit is the same as the working principle of the power amplifier pin compatible circuit 10 receiving radio frequency signals of different frequency bands described in the previous embodiment. This application will not repeat the details here.
[0073] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
[0074] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A pin-compatible circuit for a power amplifier, characterized in that, The power amplifier pin-compatible circuit includes: a general pin-compatible module and a power amplifier. The general pin-compatible module includes: multiple radio frequency signal lines, each radio frequency signal line having at least one surface mountable position. The first input terminal of the universal pin-compatible module is used to receive high-frequency radio frequency signals, the second input terminal of the universal pin-compatible module is used to receive mid-frequency radio frequency signals, the first output terminal of the universal pin-compatible module is connected to the seventh pin of the power amplifier, and the second output terminal of the universal pin-compatible module is connected to the eighth pin of the power amplifier. When the power amplifier is a target type power amplifier, a zero-resistance conduction component is placed on each surface mount position of each RF signal line corresponding to the target type in the universal pin compatible module, so that at least one RF signal line is connected to the power amplifier and the power amplifier can perform signal transmission and reception normally.
2. The power amplifier pin-compatible circuit according to claim 1, characterized in that, The multiple radio frequency signal lines include: a first radio frequency signal line, a second radio frequency signal line, a third radio frequency signal line, and a fourth radio frequency signal line; The input terminals of the first and second RF signal lines are both used to receive high-frequency RF signals. The output terminal of the first RF signal line is connected to the seventh pin of the power amplifier, and the output terminal of the second RF signal line is connected to the eighth pin of the power amplifier. The input terminals of the third and fourth radio frequency signal lines are both used to access intermediate frequency radio frequency signals. The output terminal of the third radio frequency signal line is connected to the eighth pin of the power amplifier, and the output terminal of the fourth radio frequency signal line is connected to the seventh pin of the power amplifier.
3. The power amplifier pin-compatible circuit according to claim 2, characterized in that, If the target type is the first type, a zero-resistance conductive component is mounted on each of the mountable positions of the first RF signal line, and a zero-resistance conductive component is mounted on each of the mountable positions of the third RF signal line.
4. The power amplifier pin-compatible circuit according to claim 3, characterized in that, The first radio frequency signal line includes a first mountable position and a second mountable position, the third radio frequency signal line includes a third mountable position and a fourth mountable position, and the zero resistance conduction component includes: a first resistor, a second resistor, a third resistor and a fourth resistor; If the power amplifier is a first type of power amplifier, a first resistor is mounted at a first surface mount position and a second resistor is mounted at a second surface mount position to connect the high-frequency radio frequency signal to the seventh pin of the first type of power amplifier; at the same time, a third resistor is mounted at a third surface mount position and a fourth resistor is mounted at a fourth surface mount position to connect the high-frequency radio frequency signal to the eighth pin of the first type of power amplifier.
5. The power amplifier pin-compatible circuit according to claim 2, characterized in that, If the target type is the second type, a zero-resistance conductive component is mounted on each of the mountable positions of the second RF signal line, and a zero-resistance conductive component is mounted on each of the mountable positions of the fourth RF signal line.
6. The power amplifier pin-compatible circuit according to claim 5, characterized in that, The second radio frequency signal line includes a fifth and a sixth mountable position, the fourth radio frequency signal line includes a seventh and an eighth mountable position, and the zero-resistance conduction component further includes a fifth resistor, a sixth resistor, a seventh resistor, and an eighth resistor; If the power amplifier is a second type of power amplifier, a fifth resistor is mounted at the fifth surface mount position and a sixth resistor is mounted at the sixth surface mount position to connect the high-frequency radio frequency signal to the eighth pin of the second type of power amplifier; at the same time, a seventh resistor is mounted at the seventh surface mount position and an eighth resistor is mounted at the eighth surface mount position to connect the high-frequency radio frequency signal to the seventh pin of the second type of power amplifier.
7. The power amplifier pin-compatible circuit according to claim 1, characterized in that, The zero-resistance conducting component is a zero-ohm resistor.
8. The power amplifier pin-compatible circuit according to claim 4, characterized in that, The first type of power amplifier is a high-pass power amplifier.
9. The power amplifier pin-compatible circuit according to claim 6, characterized in that, The second type of power amplifier is a third-party power amplifier.
10. A radio frequency front-end device, characterized in that, Includes a power amplifier pin-compatible circuit as described in any one of claims 1 to 9.