Industrial camera

Abstract

The embodiment of the invention provides an industrial camera, and relates to the technical field of machine vision. The industrial camera comprises a control assembly which comprises a mainboard, a sensor module, an interface board and a light source driving board; a front side plate; the front side plate and the rear side plate are located on the two opposite sides in the width direction of the sensor module, and the bottom of the front side plate and the bottom of the rear side plate are both connected with the sensor module; one side, facing the sensor module, of the upper cover assembly is connected with the top of the front side plate and the top of the rear side plate; the two end covers are arranged on the two opposite sides in the length direction of the sensor module respectively, and each end cover is connected with the front side plate, the rear side plate and the upper cover assembly; a containing space is defined by the sensor module, the front side plate, the rear side plate, the upper cover assembly and the two end covers. The mainboard, the interface board and the light source driving board are located in the containing space. By adopting the industrial camera, the size of the industrial camera can be reduced, so that the space occupation of the industrial camera is reduced.

Description

Technical Field

[0001] This application relates to the field of machine vision technology, and in particular to an industrial camera. Background Technology

[0002] Currently, common industrial cameras consist of a motherboard and a sensor module. In related technologies, the motherboard and sensor module are typically mounted as two separate modules in two different housings. The motherboard housing and the sensor module housing need to be connected by a mechanical structure.

[0003] However, because the motherboard and sensor module are mounted in separate housings, the industrial camera has two housings. Furthermore, the industrial camera requires additional mechanical structures to connect the two housings. This results in a large overall size and a significant space requirement for the industrial camera. Summary of the Invention

[0004] The purpose of this application is to provide an industrial camera that reduces its size and thus its space occupation. The specific technical solution is as follows:

[0005] This application provides an industrial camera, including:

[0006] The control components include the motherboard, sensor module, interface board, and light source driver board;

[0007] Front side panel;

[0008] The rear side plate, the front side plate and the rear side plate are located on opposite sides along the width direction of the sensor module, and the bottom of the front side plate and the bottom of the rear side plate are both connected to the sensor module;

[0009] A top cover assembly, the side of which faces the sensor module is connected to the top of the front panel and the top of the rear panel;

[0010] Two end caps are respectively disposed on opposite sides along the length direction of the sensor module, and each end cap is connected to the front side plate, the rear side plate and the upper cover assembly;

[0011] The sensor module, the front side plate, the rear side plate, the top cover assembly, and the two end caps enclose a receiving space; the motherboard, the interface board, and the light source driver board are located within the receiving space.

[0012] In some embodiments of this application, the sensor module includes a sensor housing and a sensor circuit board mounted therein;

[0013] The bottom of both the front and rear side panels facing the sensor housing are connected to the side wall of the sensor housing.

[0014] The top of the sensor housing has an opening, through which the sensor interface of the sensor circuit board is exposed;

[0015] The motherboard is located on the top of the sensor housing, and a motherboard interface is provided on the side of the motherboard facing the sensor housing. The motherboard interface and the sensor interface are electrically connected via a cable.

[0016] The interface board is located on the side of the motherboard away from the sensor housing and is electrically connected to the motherboard;

[0017] The light source driver board is mounted on the side of the rear panel facing the front panel and is electrically connected to the main board.

[0018] In some embodiments of this application, a fixing bolt is provided on the top of the sensor housing, and the motherboard is fixed to the top of the sensor housing by the fixing bolt and is spaced apart from the sensor housing;

[0019] The fixing bolt passes through the motherboard and fixes the interface board to the side of the motherboard away from the sensor housing, and is spaced apart from the motherboard.

[0020] In some embodiments of this application, the number of sensor circuit boards is at least two, and the at least two sensor circuit boards are sequentially spliced ​​together along the length direction of the sensor module;

[0021] The number of motherboards is at least one, and each motherboard corresponds to at least one sensor circuit board. The motherboard interface on the motherboard is electrically connected to the sensor interface on the corresponding sensor circuit board.

[0022] In some embodiments of this application, at least one of the motherboards is electrically connected to one of the interface boards.

[0023] In some embodiments of this application, the industrial camera further includes a heat dissipation component;

[0024] The heat dissipation assembly includes a first heat dissipation sheet metal, a second heat dissipation sheet metal, a heat dissipation block, a first thermal pad, a second thermal pad, and a third thermal pad;

[0025] The first heat dissipation sheet metal is mounted on the side of the motherboard away from the sensor module, and is arranged side by side with the interface board along the length direction of the sensor module;

[0026] The heat sink penetrates the first heat sink sheet metal along the thickness direction of the first heat sink sheet metal. The first thermal pad is located between the heat sink and the motherboard and abuts against the heat sink and the motherboard. The second thermal pad is disposed between the heat sink and the upper cover assembly and abuts against the heat sink and the upper cover assembly.

[0027] The second heat dissipation sheet metal has a vertical part and a bent part connected to each other. The vertical part is fixed to the side of the rear side plate facing the front side plate, and the bent part is located between the motherboard and the interface board. The third thermal pad is located between the bent part and the motherboard, and abuts against the bent part and the motherboard.

[0028] In some embodiments of this application, the top cover assembly includes heat dissipation fins and a cooling fan;

[0029] The heat dissipation fins include a plurality of fin plates and fin mounting plates extending along the length direction of the sensor module. The plurality of fin plates are spaced apart along the width direction of the sensor module on the side of the fin mounting plate away from the sensor module. A fan mounting groove is provided on the side of the heat dissipation fin away from the sensor module. The heat dissipation fan is embedded in the fan mounting groove.

[0030] In some embodiments of this application, the number of control components is at least two, and at least two control components are sequentially spliced ​​together along the length direction of the sensor module.

[0031] In some embodiments of this application, the front panel is provided with a motherboard power interface, a light source power interface, an aviation head interface, an optical port, and an indicator light that penetrate the front panel along the thickness direction of the front panel;

[0032] The motherboard's cables pass through the motherboard's power interface and are electrically connected to the aviation connector interface.

[0033] The cables of the light source driver board are routed through the light source power interface;

[0034] The cables of the interface board are threaded through the optical port.

[0035] In some embodiments of this application, a first overlapping foam is provided on the bottom of the front panel facing the sensor housing and on the bottom of the rear panel facing the sensor housing.

[0036] The top of the front panel and the top of the rear panel are both provided with a second overlapping foam.

[0037] The sensor housing has overlapping portions on both sides facing the front and rear side panels; the first overlapping foam on the front side panel and the first overlapping foam on the rear side panel overlap the overlapping portions on both sides of the sensor housing.

[0038] The second overlapping foam located on the front side panel and the second overlapping foam located on the rear side panel both overlap with the side of the top cover assembly facing the sensor module.

[0039] Beneficial effects of the embodiments in this application:

[0040] This application provides an industrial camera in which a sensor module from the control assembly is used as the bottom structural component. This sensor module is assembled with the front panel, rear panel, top cover assembly, and end cover to form a housing space, allowing the motherboard, interface board, and light source driver board to be installed within this space. In other words, this application assembles the sensor module directly as a structural component of the industrial camera. After assembly, the sensor module becomes part of the overall housing of the industrial camera. Thus, the industrial camera has only one housing, effectively reducing its size and the space it occupies.

[0041] Compared to the design of industrial cameras in related technologies, which have separate housings for the motherboard and sensor module, this application directly splices the structure on the basis of the sensor module, making the sensor module part of the industrial camera housing. This effectively reduces the number of housings in the industrial camera. Furthermore, since the industrial camera of this application only has one housing, there is no need to set up an additional mechanical structure between the sensor module and the motherboard to connect the two housings, further reducing the overall size of the industrial camera and the space occupied by the industrial camera.

[0042] Meanwhile, industrial cameras have fewer structural components, consisting only of a sensor module, front panel, rear panel, top cover assembly, and end caps, making assembly convenient. The front panel, rear panel, and top cover assembly are manufactured using profile molds, resulting in fixed shapes that only require cutting to different lengths to fit various camera models, offering high versatility. This reduces the number of structural components required for industrial cameras and simplifies disassembly and maintenance.

[0043] Of course, implementing any product or method of this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0045] Figure 1 This is a schematic diagram of the structure of the industrial camera provided in this application;

[0046] Figure 2 for Figure 1 A schematic diagram of the structure of an industrial camera from another perspective;

[0047] Figure 3a for Figure 1 The industrial camera shown is not illustrated with a schematic diagram of the top cover assembly and front panel.

[0048] Figure 3b for Figure 3a A magnified view of a portion of the image;

[0049] Figure 4 for Figure 1 A schematic diagram of the sensor module of the industrial camera shown;

[0050] Figure 5 for Figure 4 The diagram shows the structural arrangement of the sensor circuit boards of the industrial camera shown.

[0051] Figure 6 for Figure 1 A bottom view of the motherboard of the industrial camera shown;

[0052] Figure 7 for Figure 3a A schematic diagram of the connection cable structure for the control components of the industrial camera shown.

[0053] Figure 8 for Figure 1 A schematic diagram of the structure of the rear panel of the industrial camera shown.

[0054] Figure 9 for Figure 1 A schematic diagram of the front panel of the industrial camera shown.

[0055] Figure 10 for Figure 1 A schematic diagram of the structure of the top cover assembly of the industrial camera shown;

[0056] Figure 11 for Figure 1 The diagram shows the structure of the top cover assembly of the industrial camera without a cooling fan installed.

[0057] Figure 12 for Figure 10 The top view of the cover assembly is shown.

[0058] Figure label:

[0059] Control component 1, main board 11, main board interface 111, sensor module 12, sensor housing 121, opening 1211, fixing bolt 1212, overlapping part 1213, sensor circuit board 122, sensor interface 1221, interface board 13, light source driver board 14.

[0060] Front panel 2, mainboard power interface 21, light source power interface 22, aviation head interface 23, aviation head circuit board 231, light port 24, indicator light 25;

[0061] Rear side panel 3;

[0062] Top cover assembly 4, heat dissipation fins 41, fin plate 411, fin mounting plate 412, fan mounting slot 413, heat dissipation fan 42, metal heat conduction block 43;

[0063] End cap 5;

[0064] Heat dissipation component 6, first heat dissipation sheet metal 61, second heat dissipation sheet metal 62, vertical part 621, bending part 622, heat dissipation block 63, first thermal pad 64, second thermal pad 65, third thermal pad 66, fourth thermal pad 67.

[0065] First overlapping foam 71, second overlapping foam 72, third overlapping foam 73;

[0066] Length direction X, width direction Y. Detailed Implementation

[0067] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0068] This application provides an industrial camera, such as Figures 1 to 3b As shown, Figure 1 This is a schematic diagram of the structure of the industrial camera provided in this application; Figure 2 for Figure 1 A schematic diagram of the structure of an industrial camera from another perspective; Figure 3a for Figure 1 The industrial camera shown is not illustrated in the structural diagram of the top cover assembly and front side panel. Figure 3b for Figure 3aA partial enlarged view. The industrial camera includes: a control component 1, including a main board 11, a sensor module 12, an interface board 13, and a light source driver board 14; a front side plate 2; a rear side plate 3, the front side plate 2 and the rear side plate 3 being located on opposite sides along the width direction Y of the sensor module 12, and the bottom of the front side plate 2 and the bottom of the rear side plate 3 being connected to the sensor module 12; a top cover assembly 4, the side of the top cover assembly 4 facing the sensor module 12 being connected to the top of the front side plate 2 and the top of the rear side plate 3; two end caps 5, respectively disposed on opposite sides along the length direction X of the sensor module 12, each end cap 5 being connected to the front side plate 2, the rear side plate 3, and the top cover assembly 4; the sensor module 12, the front side plate 2, the rear side plate 3, the top cover assembly 4, and the two end caps 5 enclosing a receiving space; the main board 11, the interface board 13, and the light source driver board 14 being located within the receiving space.

[0069] In this embodiment, the sensor module 12 in the control component 1 is used as the bottom structural component of the industrial camera, and is spliced ​​with the front side plate 2, rear side plate 3, top cover assembly 4, and end cover 5 to form a receiving space, so that the main board 11, interface board 13, and light source driver board 14 can be installed in the receiving space. That is to say, this application assembles the sensor module 12 directly as a structural component of the industrial camera. After assembly, the sensor module 12 becomes part of the overall housing of the industrial camera. In this way, the industrial camera has only one housing, effectively reducing the size of the industrial camera and the space occupied by the industrial camera.

[0070] Compared to the design of industrial cameras in related technologies, which have separate housings for the motherboard and sensor module, this application directly splices the structure on the basis of the sensor module 12, making the sensor module 12 part of the industrial camera housing. This effectively reduces the number of housings in the industrial camera. Furthermore, since the industrial camera of this application has only one housing, there is no need to set up an additional mechanical structure between the sensor module 12 and the motherboard 11 to connect the two housings, further reducing the overall size of the industrial camera and the space occupied by the industrial camera.

[0071] Meanwhile, the industrial camera has fewer structural components, consisting only of a sensor module 12, a front side plate 2, a rear side plate 3, a top cover assembly 4, and an end cover 5, making assembly convenient. The front side plate 2, rear side plate 3, and top cover assembly 4 are manufactured using profile molds, requiring only cutting to different lengths to fit various camera models, resulting in high versatility. This reduces the number of structural components required for the industrial camera and also lowers the difficulty of disassembly and maintenance.

[0072] Furthermore, industrial cameras in related technologies typically have decorative sheet metal parts installed around the housing for decoration purposes only. The industrial camera provided in this application does not have any decorative sheet metal parts, which further reduces the overall size of the industrial camera.

[0073] In some implementations of this application, such as Figure 4 and Figure 5 As shown, Figure 4 for Figure 1 A schematic diagram of the sensor module of the industrial camera shown; Figure 5 for Figure 4 The diagram shows a structural schematic of the sensor circuit board assembly for an industrial camera. Sensor module 12 includes a sensor housing 121 and a sensor circuit board 122 mounted therein; see [link / reference]. Figure 1 and Figure 2 The bottom of both the front side panel 2 and the rear side panel 3 facing the sensor housing 121 are connected to the side wall of the sensor housing 121; see also Figure 4 The sensor housing 121 has an opening 1211 at its top, through which the sensor interface 1221 of the sensor circuit board 122 is exposed; the main board 11 is located at the top of the sensor housing 121, as shown below. Figure 6 As shown, Figure 6 for Figure 1 The image shows a bottom view of the motherboard of the industrial camera. The motherboard 11 has a motherboard interface 111 on the side facing the sensor housing 121, as shown... Figure 7 As shown, Figure 7 for Figure 3a The diagram shows the structural structure of the control component connection cables for the industrial camera. The mainboard interface 111 and sensor interface 1221 are electrically connected via cables; the interface board 13 is located on the side of the mainboard 11 furthest from the sensor housing 121 and is electrically connected to the mainboard 11; as shown... Figure 8 As shown, Figure 8 for Figure 1 The diagram shows the structure of the rear panel of the industrial camera. The light source driver board 14 is mounted on the side of the rear panel 3 facing the front panel 2 and is electrically connected to the main board 11.

[0074] In this embodiment, see Figure 1 and Figure 2The bottom of the front panel 2 and rear panel 3 of the industrial camera, facing the sensor housing 121, can be detachably connected to the side wall of the sensor housing 121 with screws. The end cap 5 is detachably connected to the front panel 2 and rear panel 3 on both sides along the width Y direction of the sensor module 12 with screws, and the side of the end cap 5 away from the sensor module 12 is detachably connected to the top cover assembly 4 with screws. The sensor circuit board 122, main board 11, and interface board 13 of the sensor module 12 are stacked vertically and installed using the longitudinal space within the accommodating space. The light source driver board 14 is installed on the side of the rear panel 3 facing the front panel 2, located on the side of the main board 11 in the horizontal direction, and installed using the lateral space within the accommodating space. The light source driver board 14 directly contacts the rear panel 3 for heat dissipation, eliminating the need for other heat dissipation intermediate components, making the internal structure of the industrial camera more compact. In this way, the sensor circuit board 122, motherboard 11, interface board 13 and light source driver board 14 are stacked in the housing space in a simple and highly scalable manner. They also make full use of the horizontal and vertical space inside the industrial camera, resulting in high space utilization. This further reduces the overall volume required by the industrial camera and the space occupied by the industrial camera.

[0075] In some embodiments of this application, such as Figure 3a , Figure 5 and Figure 7 As shown, there are at least two sensor circuit boards 122, and the at least two sensor circuit boards 122 are sequentially spliced ​​along the length direction X of the sensor module; there is at least one main board 11, and each main board 11 corresponds to at least one sensor circuit board 122. The main board interface 111 on the main board 11 is electrically connected to the sensor interface 1221 on the sensor circuit board 122 corresponding to the main board 11.

[0076] In this embodiment, the number of sensor circuit boards 122 can be increased or decreased based on different production needs. See also Figure 5 When it is necessary to increase or decrease the number of sensor circuit boards 122, the sensor circuit boards 122 can be directly disassembled and assembled sequentially along the length direction X, which can conveniently realize the expansion and simplification of the sensor circuit boards 122 in the industrial camera. Multiple sensor circuit boards 122 are installed using the lateral space within the housing, which effectively improves the space utilization rate, reduces the overall size required by the industrial camera, and reduces the space occupied by the industrial camera.

[0077] In this embodiment, increasing the number of sensor circuit boards 122 can improve the recognition width of the industrial camera; that is, the more sensor circuit boards 122 there are, the wider the width that the industrial camera can recognize. Of course, only one sensor circuit board 122 can also be set according to actual needs.

[0078] Specifically, in some embodiments, there may be one motherboard 11, and two corresponding sensor circuit boards 122; the motherboard 11 is positioned on top of one of the sensor circuit boards 122. Figure 5 As shown, each sensor circuit board 122 has multiple sensor interfaces 1221 arranged at equal intervals along the length X of the sensor module 12. For example... Figure 6 As shown, the motherboard 11 has six motherboard interfaces 111. These six interfaces 111 are arranged in two parallel rows along the width Y direction of the sensor module 12; each row has three motherboard interfaces 111 arranged at equal intervals along the length X direction of the sensor module 12. One row of motherboard interfaces 111 is connected to sensor interfaces 1221 on the sensor circuit board 122 located below the motherboard 11 via three first cables of equal length; the other row of motherboard interfaces 111 is connected to sensor interfaces 1221 on another sensor circuit board 122 via three second cables of equal length; the second cables are longer than the first cables. By limiting the length of the first cables to a small range, after one end of the first cable is connected to a motherboard interface 111, the other end can only be connected to a sensor interface 1221 on the sensor circuit board 122 located at the bottom of the motherboard 11, which is relatively close to the motherboard 11. Even when the first cable is extremely short, the other end of the first cable can only be connected to the single sensor interface 1221 closest to that motherboard interface 111, and cannot be connected to other sensor interfaces 1221. This enables a fixed restriction on the connection relationship between the motherboard interface 111 and the sensor interface 1221, and completes the foolproof design for the mating of the motherboard 11 and the sensor circuit board 122.

[0079] Alternatively, in some embodiments, such as Figure 3a As shown, there are two mainboards 11 and two sensor circuit boards 122. Each sensor circuit board 122 has a mainboard 11 on its top.

[0080] In this embodiment, the number of motherboards 11 is increased to two. This allows the industrial camera to have more logic resources, enhancing its information processing capabilities and enabling functions such as color image recognition. For details, see [link to documentation]. Figure 3a and Figure 7A communication circuit board can be placed between the two motherboards 11. This communication circuit board has two connection interfaces, which are respectively plugged into the two motherboards 11 to establish a communication connection between them. Furthermore, the two motherboards 11 are electrically connected via a power supply cable. The arrangement of the sensor interfaces 1221 on the sensor circuit board 122 and the motherboard interfaces 111 on the motherboard 11 is the same as in the previous embodiment. In this case, the three motherboard interfaces 111 located in the same row on each motherboard 11 are respectively connected to the sensor interfaces 1221 of the sensor circuit board 122 located below that motherboard 11 via three cables of the same length. The function of the cables of the same length is the same as described above and will not be elaborated further here.

[0081] In some embodiments of this application, at least one motherboard 11 is electrically connected to an interface board 13.

[0082] In this embodiment, each motherboard 11 is electrically connected to at least one interface board 13. That is, when there is only one motherboard 11, that motherboard 11 is electrically connected to one interface board 13. When there are multiple motherboards 11, only one interface board 13 can be provided, with one motherboard 11 electrically connected to the interface board 13, and the other motherboards 11 communicating with the motherboard 11 directly connected to the interface board 13. Alternatively, the same number of interface boards 13 as motherboards 11 can be provided, with each motherboard 11 having its own dedicated interface board 13, and the two being electrically connected.

[0083] Similarly, in actual production, the number of light source driver boards 14 installed on the rear panel 3 can be increased or decreased according to actual needs. In other words, the industrial camera provided in this application can connect sensor circuit boards 122 in series, and correspondingly increase or decrease the main board 11, interface board 13, and light source driver boards 14, thereby achieving modular designs of different lengths. Since the industrial camera of this application is always spliced ​​along the length direction X during modular expansion, different models of industrial cameras only differ in length, while their height and width remain unchanged. This allows the end cover 5 to be suitable for models of different lengths. That is, when modular expansion of the industrial camera is required, it is only necessary to manufacture the front panel 2, rear panel 3, and top cover assembly 4 by opening profile molds, and cut them to appropriate lengths according to the required length to adapt to models of the required length, while the end cover 5 does not need to be replaced.

[0084] In some embodiments of this application, the number of control components 1 is at least two, and at least two control components 1 are sequentially spliced ​​along the length direction X of the sensor module.

[0085] In this embodiment, not only can the main board 11, sensor module 12, interface board 13, and light source driver board 14 in the control component 1 be added or removed individually, but the complete control component 1 can also be spliced ​​together to form a cluster, thereby achieving modularity among multiple control components 1. Taking an example where each control component 1 has one main board 11, one sensor module 12, one interface board 13, and one light source driver board 14, if two control components 1 are directly spliced ​​together, the industrial camera can have two control components 1. The resulting industrial camera has two main boards 11, two sensor modules 12, two interface boards 13, and two light source driver boards 14.

[0086] In some implementations of this application, such as Figure 3a and Figure 7 As shown, a fixing bolt 1212 is provided on the top of the sensor housing 121. The main board 11 is fixed to the top of the sensor housing 121 by the fixing bolt 1212 and is spaced apart from the sensor housing 121. The fixing bolt 1212 passes through the main board 11 and fixes the interface board 13 to the side of the main board 11 away from the sensor housing 121 and is spaced apart from the main board 11.

[0087] In this embodiment, the main board 11 and the interface board 13 are sequentially fixed to the top of the sensor housing 121 using fixing bolts 1212. The fixing bolts 1212 pass through the main board 11 and connect to the interface board 13, achieving structural reuse of the fixing bolts 1212 and eliminating the need for additional connecting parts, thus effectively saving space. Simultaneously, the fixing bolts 1212 support the main board 11 on the top of the sensor housing 121, creating a gap between the main board 11 and the sensor housing 121. The interface board 13 is supported on the side of the main board 11 away from the sensor housing 121, also creating a gap between the main board 11 and the interface board. This facilitates cable passage and heat dissipation.

[0088] In some embodiments of this application, such as Figure 8 and Figure 3bAs shown. The industrial camera also includes a heat dissipation assembly 6; the heat dissipation assembly 6 includes a first heat dissipation sheet metal 61, a second heat dissipation sheet metal 62, a heat sink 63, a first thermal pad 64, a second thermal pad 65, and a third thermal pad 66; the first heat dissipation sheet metal 61 is mounted on the side of the motherboard 11 away from the sensor module 12, and is arranged side by side with the interface board 13 along the length direction X of the sensor module 12; the heat sink 63 penetrates the first heat dissipation sheet metal 61 along the thickness direction of the first heat dissipation sheet metal 61, and the first thermal pad 64 is located between the heat sink 63 and the motherboard 11. The second thermal pad 65 is disposed between the heat sink 63 and the top cover assembly 4, and abuts against the heat sink 63 and the top cover assembly 4; the second heat dissipation sheet metal 62 has a vertical part 621 and a bent part 622 connected to each other, the vertical part 621 is fixed to the side of the rear side plate 3 facing the front side plate 2, and the bent part 622 is located between the main board 11 and the interface board 13; the third thermal pad 66 is located between the bent part 622 and the main board 11, and abuts against the bent part 622 and the main board 11.

[0089] In this embodiment, the first heat dissipation sheet metal 61 can be supported on the side of the motherboard 11 away from the sensor housing 121 using fixing bolts 1212 passing through the motherboard 11, so that the two are spaced apart. The first heat dissipation sheet metal 61 is stacked on top of the motherboard, utilizing the vertical space within the accommodating space; and, it is arranged side by side with the interface board 13 along the length direction X, utilizing the lateral space within the accommodating space. The second heat dissipation sheet metal 62 is installed on the side of the rear side plate 3 facing the front side plate 2, utilizing the lateral space within the accommodating space. In this way, the space utilization rate of the heat dissipation component 6 is improved, the overall size of the industrial camera is further reduced, and the space occupied by the industrial camera is reduced.

[0090] Meanwhile, a first thermal pad 64 is placed between the heat sink 63 and the motherboard 11, and a second thermal pad 65 is placed between the heat sink 63 and the upper cover assembly 4 to transfer heat from the motherboard 11 to the upper cover assembly 4 for heat dissipation. The bent portion 622 of the second heat dissipation sheet metal 62 extends into the motherboard 11 and the interface board 13, and a third thermal pad 66 is placed between the motherboard 11 and the bent portion, allowing heat from the motherboard 11 to be transferred from the bent portion 622 to the vertical portion 621, and finally to the rear side plate 3 for heat dissipation. Thus, by transferring heat from the motherboard 11 to the rear side plate 3 and the upper cover assembly 4 through the first heat dissipation sheet metal 61, the second heat dissipation sheet metal 62, and the heat sink 63, multi-channel heat dissipation of the motherboard 11 can be achieved, thereby increasing the cooling effect and improving the heat dissipation efficiency of the motherboard 11. The rear side plate 3 of this application serves multiple functions, including fixing the light source circuit board 14, connecting the overall casing, and heat dissipation.

[0091] In some implementations of this application, such as Figure 8As shown, a first overlapping foam 71 is provided on the bottom of the front side panel 2 facing the sensor housing 121 and the bottom of the rear side panel 3 facing the sensor housing 121; a second overlapping foam 72 is provided on the top of the front side panel 2 and the top of the rear side panel 3; an overlapping portion 1213 is provided on both sides of the sensor housing 121 facing the front side panel 2 and the rear side panel 3; the first overlapping foam 71 on the front side panel 2 and the first overlapping foam 71 on the rear side panel 3 overlap with the overlapping portions 1213 on both sides of the sensor housing 121; the second overlapping foam 72 on the front side panel 2 and the second overlapping foam 72 on the rear side panel 3 overlap with the side of the upper cover assembly 4 facing the sensor module 12.

[0092] In this embodiment, the front side panel 2 and the rear side panel 3 are connected to the sensor module 12 via the first overlapping foam 71 and to the upper cover assembly 4 via the second overlapping foam 72. Thus, the industrial camera as a whole is formed as an equipotential body, thereby achieving electromagnetic compatibility (EMC), enabling the industrial camera to operate normally in an electromagnetic environment. The rear side panel 3 of this application also serves as an electromagnetic protection element.

[0093] In some implementations of this application, such as Figure 10 As shown, Figure 10 for Figure 1 The diagram shows the structure of the top cover assembly of the industrial camera. The top cover assembly 4 includes heat dissipation fins 41 and a heat dissipation fan 42; the heat dissipation fins 41 include multiple finned plates 411 extending along the length direction X of the sensor module 12 and finned mounting plates 412, with the multiple finned plates 411 spaced apart along the width direction Y of the sensor module 12 on the side of the finned mounting plate 412 away from the sensor module 12; as shown... Figure 11 As shown, Figure 11 for Figure 1 The diagram shows the structure of the top cover assembly of the industrial camera without a cooling fan. A fan mounting slot 413 is provided on the side of the heat sink fins away from the sensor module 12; the cooling fan 42 is embedded in the fan mounting slot 413.

[0094] In this embodiment, the heat dissipation fins 41 are used as the main body of the upper cover assembly 4, so that the heat dissipation fins 41 can be covered on the top of the industrial camera, effectively increasing the area of ​​the heat dissipation fins 41. Furthermore, a cooling fan 42 is used to dissipate heat from the heat dissipation fins 41, reducing the number of cooling fans 42 and further reducing the overall size of the industrial camera, thus reducing the space occupied by the industrial camera.

[0095] Specifically, the heat from the motherboard 11 is transferred to the finned mounting plate 412, and heat is exchanged with the external environment of the industrial camera through the finned plates 411 on the finned mounting plate 412. Since the finned plates 411 extend along the length X of the sensor module 12 and face away from the sensor module 12 towards the finned mounting plate 412, they have a large vertical extension space, resulting in a larger length and depth of the heat dissipation fins 41, thus improving the heat dissipation efficiency of the heat dissipation fins 41. The cooling fan 42 embedded in the fan mounting slot 413 can further improve the heat dissipation efficiency of the heat dissipation fins 41.

[0096] Specifically, the fin plates 411 of the heat dissipation fins 41 are spaced apart along the width direction Y of the sensor module 12. Multiple adjacent fin plates 411 located at the middle position of the width direction Y of the sensor module 12 have recessed structures. The recessed structures of multiple fin plates 411 are correspondingly arranged to form a fan mounting groove 413, so that the cooling fan 42 can be embedded in the heat dissipation fins 41 through the fan mounting groove 413.

[0097] In some embodiments of this application, such as Figure 12 As shown, Figure 12 for Figure 10 The diagram shows a bottom view of the top cover assembly. A fourth thermal pad 67 and a third overlapping foam 73 can be provided between the heat dissipation fins 41 and the interface plate 13. The fourth thermal pad 67 allows heat from the interface plate 13 to be transferred to the heat dissipation fins 41. The third overlapping foam 73 overlaps with both sides of the heat dissipation fins 41 and the interface plate 13, making them electrically conductive. This improves the heat dissipation efficiency of the industrial camera while further enhancing its electromagnetic protection capabilities.

[0098] Furthermore, due to the large distance between the interface plate 13 and the heat sink fins 41, the required thickness of the fourth thermal pad 67 and the third overlapping foam 73 is relatively large in order to ensure that both sides of the fourth thermal pad 67 and the third overlapping foam 73 can contact the interface plate 13 and the heat sink fins 41. In this case, a metal thermally conductive block 43 can be provided on the side of the fin mounting plate 412 of the heat sink fins 41 facing the interface plate 13, and the fourth thermal pad 67 and the third overlapping foam 73 can be installed on the side of the metal thermally conductive block 43 facing the interface plate 13. In this way, the metal thermally conductive block 43 can reduce the distance between the interface plate 13 and the heat sink fins 41, narrowing the gap between them, thereby reducing the required thickness of the fourth thermal pad 67 and the third overlapping foam 73.

[0099] In some implementations of this application, such as Figure 9 As shown, Figure 9 for Figure 1The diagram shows the structure of the front panel of the industrial camera. The front panel 2 is provided with a mainboard power interface 21, a light source power interface 22, an aviation head interface 23, an optical port 24, and an indicator light 25 that run through the front panel 2 along its thickness direction. The cables of the mainboard 11 pass through the mainboard power interface 21 and are electrically connected to the aviation head interface 23. The cables of the light source driver board 14 pass through the light source power interface 22. The cables of the interface board 13 pass through the optical port 24.

[0100] In this embodiment, the motherboard power interface 21 and the light source power interface 22 can be fixed to the front panel 2 with their own nuts, so that the cable can extend into the housing space of the industrial camera through the motherboard power interface 21 and the light source power interface 22. The aviation head interface 23 can be fixed with external screws, and the aviation head interface 23 is electrically connected to the motherboard 11 through the aviation head circuit board 231. The indicator light 25 can be directly fixed to the front panel 2 with glue. The optical ports 24 are set to correspond to the interfaces on the interface board 13. For example, if there is one interface board 13 and two interfaces on the interface board 13, then there are two optical ports 24 on the front panel 2, and they are respectively set to correspond to the two interfaces on the interface board 13. Alternatively, if there are two interface boards 13 and two interfaces on the interface board 13, then the control component 1 has four interfaces on the interface board 13. Four optical ports 24 can be set on the front panel 2, and the four optical ports 24 are respectively set to correspond to the four interfaces on the two interface boards 13.

[0101] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0102] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0103] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. An industrial camera, characterized in that, include: The control component (1) includes a motherboard (11), a sensor module (12), an interface board (13), and a light source driver board (14). Front side panel (2); The rear side plate (3), the front side plate (2) and the rear side plate (3) are located on opposite sides along the width direction (Y) of the sensor module (12), and the bottom of the front side plate (2) and the bottom of the rear side plate (3) are both connected to the sensor module (12). The top cover assembly (4) is connected to the top of the front side panel (2) and the top of the rear side panel (3) on the side facing the sensor module (12); Two end caps (5) are respectively disposed on opposite sides along the length direction (X) of the sensor module (12), and each end cap (5) is connected to the front side plate (2), the rear side plate (3) and the upper cover assembly (4); The sensor module (12), the front side plate (2), the rear side plate (3), the top cover assembly (4), and the two end caps (5) are arranged to form an accommodating space; the main board (11), the interface board (13), and the light source driver board (14) are located within the accommodating space.

2. The industrial camera according to claim 1, characterized in that, The sensor module (12) includes a sensor housing (121) and a sensor circuit board (122) installed therein. The bottom of both the front side plate (2) and the rear side plate (3) facing the sensor housing (121) are connected to the side wall of the sensor housing (121); The top of the sensor housing (121) has an opening (1211), and the sensor interface (1221) of the sensor circuit board (122) is exposed to the opening (1211). The motherboard (11) is located on the top of the sensor housing (121). The motherboard (11) has a motherboard interface (111) on the side facing the sensor housing (121). The motherboard interface (111) and the sensor interface (1221) are electrically connected by a cable. The interface board (13) is located on the side of the main board (11) away from the sensor housing (121) and is electrically connected to the main board (11); The light source driver board (14) is installed on the side of the rear side plate (3) facing the front side plate (2) and is electrically connected to the main board (11).

3. The industrial camera according to claim 2, characterized in that, A fixing bolt (1212) is provided on the top of the sensor housing (121), and the main board (11) is fixed to the top of the sensor housing (121) by the fixing bolt (1212) and is spaced apart from the sensor housing (121). The fixing bolt (1212) passes through the motherboard (11) and fixes the interface board (13) to the side of the motherboard (11) away from the sensor housing (121), and is spaced apart from the motherboard (11).

4. The industrial camera according to claim 2, characterized in that, The number of sensor circuit boards (122) is at least two, and at least two sensor circuit boards (122) are sequentially spliced ​​together along the length direction (X) of the sensor module; The number of motherboards (11) is at least one, and each motherboard (11) corresponds to at least one sensor circuit board (122). The motherboard interface (111) on the motherboard (11) is electrically connected to the sensor interface (1221) on the sensor circuit board (122) corresponding to the motherboard (11).

5. The industrial camera according to claim 4, characterized in that, At least one of the motherboards (11) is electrically connected to one of the interface boards (13).

6. The industrial camera according to claim 2, characterized in that, The industrial camera also includes a heat dissipation component (6). The heat dissipation assembly (6) includes a first heat dissipation sheet metal (61), a second heat dissipation sheet metal (62), a heat dissipation block (63), a first thermal pad (64), a second thermal pad (65), and a third thermal pad (66). The first heat dissipation sheet metal (61) is installed on the side of the motherboard (11) away from the sensor module (12), and is arranged side by side with the interface board (13) along the length direction (X) of the sensor module (12); The heat sink (63) penetrates the first heat sink sheet metal (61) along the thickness direction of the first heat sink sheet metal (61), the first thermal pad (64) is located between the heat sink (63) and the motherboard (11), and abuts against the heat sink (63) and the motherboard (11), and the second thermal pad (65) is disposed between the heat sink (63) and the upper cover assembly (4), and abuts against the heat sink (63) and the upper cover assembly (4); The second heat dissipation sheet metal (62) has a vertical part (621) and a bent part (622) connected to each other. The vertical part (621) is fixed to the side of the rear side plate (3) facing the front side plate (2). The bent part (622) is located between the main board (11) and the interface board (13). The third heat-conducting pad (66) is located between the bent part (622) and the main board (11), and abuts against the bent part (622) and the main board (11).

7. The industrial camera according to claim 1, characterized in that, The upper cover assembly (4) includes heat dissipation fins (41) and a heat dissipation fan (42). The heat dissipation fins (41) include a plurality of fin plates (411) extending along the length direction (X) of the sensor module (12) and a fin mounting plate (412). The plurality of fin plates (411) are spaced apart along the width direction (Y) of the sensor module (12) on the side of the fin mounting plate (412) away from the sensor module (12). A fan mounting groove (413) is provided on the side of the heat dissipation fins (41) away from the sensor module (12). The heat dissipation fan (42) is embedded in the fan mounting groove (413).

8. The industrial camera according to claim 1, characterized in that, The number of control components (1) is at least two, and at least two control components (1) are sequentially spliced ​​along the length direction (X) of the sensor module.

9. The industrial camera according to claim 1, characterized in that, The front panel (2) is provided with a motherboard power interface (21), a light source power interface (22), an aviation head interface (23), an optical port (24) and an indicator light (25) that pass through the front panel (2) along the thickness direction of the front panel (2). The cables of the motherboard (11) are passed through the motherboard power interface (21) and electrically connected to the aviation head interface (23); The cable of the light source driver board (14) is threaded through the light source power interface (22). The cable of the interface board (13) is threaded through the optical port (24).

10. The industrial camera according to claim 2, characterized in that, The bottom of the front side panel (2) facing the sensor housing (121) and the bottom of the rear side panel (3) facing the sensor housing (121) are both provided with first overlapping foam (71). The top of the front side panel (2) and the top of the rear side panel (3) are both provided with a second overlapping foam (72). The sensor housing (121) has overlapping portions (1213) on both sides facing the front side plate (2) and the rear side plate (3); the first overlapping foam (71) located on the front side plate (2) and the first overlapping foam (71) located on the rear side plate (3) overlap the overlapping portions (1213) on both sides of the sensor housing (121). The second overlapping foam (72) located on the front side panel (2) and the second overlapping foam (72) located on the rear side panel (3) both overlap with the side of the top cover assembly (4) facing the sensor module (12).

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