Ultrashort wave solid-state source equipment

Abstract

The invention relates to the technical field of radio frequency modules, in particular to ultrashort wave solid state source equipment which comprises a shielding assembly, a heat dissipation assembly, an isolation plate assembly and a circuit board assembly, the heat dissipation assembly is detachably installed on the upper portion of the shielding assembly, the circuit board assembly is installed in the shielding assembly, and the circuit board assembly comprises a PCB. A frequency synthesis unit, a power management unit, a harmonic filtering and protecting unit and a power amplification unit are integrated on the PCB; the isolation plate assembly is arranged in the shielding assembly and is used for isolating all units of the circuit board assembly so as to reduce mutual interference; the ultra-short wave solid-state source module solves the technical problems that in the prior art, an ultra-short wave solid-state source module is poor in heat dissipation effect, poor in electromagnetic shielding effect, difficult in consideration of efficiency and linearity, poor in integration level, electromagnetic compatibility and structural stability and the like.

Description

Technical Field

[0001] This invention relates to the field of radio frequency module technology, and more specifically to an ultra-shortwave solid-state source device. Background Technology

[0002] The UHF solid-state source module is an integrated, high-performance radio frequency module with an operating frequency range of 30MHz to 300MHz (UHF band). It uses solid-state devices (such as transistors and integrated circuits) to replace traditional vacuum tubes, and features small size, high efficiency, and strong stability. It is widely used in communication, radar, medical and industrial fields.

[0003] The following problems exist in the practical use of UHF solid-state source modules: 1) Poor heat dissipation. The high power density within the module leads to a surge in local heat flux. If traditional aluminum substrate heat dissipation is used, the excessive thermal resistance can easily cause the junction temperature of the device to exceed the standard; 2) Poor electromagnetic shielding. UHF signals are susceptible to external electromagnetic interference, and the coexistence of high-frequency circuits and digital control circuits within the module can easily cause crosstalk; 3) Trade-off between efficiency and linearity. High efficiency (e.g., above 90%) usually relies on switching amplifiers (e.g., Class D), but the linearity is poor; 4) Conflict between integration and electromagnetic compatibility. Miniaturization design leads to reduced signal trace spacing and increased parasitic capacitance / inductance, which can easily cause resonance and crosstalk; 5) Structural stability. Significantly affected by environmental stress, vibration, temperature shock (e.g., wide operating temperature range of -40℃ to 85℃), and humidity changes may cause package cracking, connector loosening, or material expansion coefficient mismatch. Summary of the Invention

[0004] This invention provides an ultra-shortwave solid-state source device to solve the technical problems of existing ultra-shortwave solid-state source modules, such as poor heat dissipation, poor electromagnetic shielding, difficulty in balancing efficiency and linearity, poor integration and electromagnetic compatibility, and poor structural stability.

[0005] To solve the above problems, the ultra-shortwave solid-state source device provided by the present invention adopts the following technical solution: An ultra-shortwave solid-state source device includes a shielding component, a heat dissipation component, an isolation plate component, and a circuit board component. The heat dissipation component is detachably installed on the upper part of the shielding component. The circuit board component is installed inside the shielding component. The circuit board component includes a PCB board, on which a frequency synthesis unit, a power management unit, a harmonic filtering and protection unit, and a power amplification unit are integrated. The isolation plate assembly is installed inside the shielding assembly to separate the various units of the circuit board assembly, thereby reducing mutual interference.

[0006] The beneficial effects of the ultra-shortwave solid-state source device provided by this invention are as follows: the PCB board integrates four core units: frequency synthesis, power management, harmonic filtering and protection, and power amplification, which can adapt to miniaturized application scenarios; the isolation plate assembly directly separates the functional units of the circuit board, blocking electromagnetic crosstalk between units, and significantly improving electromagnetic compatibility (EMC) to address the problem of easy interference of ultra-shortwave band (30MHz-300MHz) signals; through the coordinated design of shielding components, heat dissipation components, and isolation plate components, the core defects of poor heat dissipation, weak electromagnetic shielding, and insufficient structural stability in the prior art are overcome; and the technical problems of poor heat dissipation, poor electromagnetic shielding, difficulty in balancing efficiency and linearity, poor integration and electromagnetic compatibility, and poor structural stability of existing ultra-shortwave solid-state source modules are solved.

[0007] Furthermore, the shielding assembly includes a shielding cover, a base plate, and a connecting plate. The shielding cover is open at both the top and bottom. The base plate is installed at the bottom of the shielding cover, and the connecting plate is installed at the top of the shielding cover. The connecting plate is used to connect the heat dissipation assembly, and the circuit board assembly is located between the base plate and the connecting plate.

[0008] The beneficial effects of the above solution are as follows: the shielding cover, together with the base plate and connecting plate, forms a closed cavity that completely encloses the circuit board assembly, blocking external electromagnetic interference and internal signal leakage; the connecting plate, as the top connector of the shielding cover, provides a stable mounting base for the heat dissipation assembly, and at the same time constructs a heat conduction path from the circuit board to the connecting plate to the heat dissipation assembly, taking into account both shielding and heat dissipation; the base plate, connecting plate and shielding cover form a rigid frame that fixes the circuit board assembly in the middle area, enhancing the equipment's resistance to vibration, temperature shock and humidity changes, and avoiding problems such as encapsulation cracking and connector loosening.

[0009] Furthermore, the heat dissipation assembly includes a cover plate and a heat sink. The cover plate is fixed to the connecting plate, and the heat sink is fixed to the side of the cover plate facing away from the connecting plate. The heat sink includes a heat sink base and a heat sink plate. The heat sink base is connected to the cover plate, and a plurality of heat sink plates extend upward from the side of the heat sink base facing away from the cover plate. The cover plate is used for signal shielding and heat conduction.

[0010] The beneficial effects of the above solution are: the cover plate serves as a closed structure at the top of the shielding cover, enhancing the electromagnetic shielding effect, and also undertakes the function of heat conduction, transferring the heat transferred by the connecting plate to the heat sink, achieving dual use and improving the utilization rate of structural space; the heat dissipation component and the connecting plate can be detachably connected, which facilitates the later inspection or replacement of the heat sink and circuit board components, reducing maintenance costs.

[0011] Furthermore, the heat sink is provided with mounting holes, and the adjacent heat sink plates corresponding to the mounting holes are all provided with notches. The cross-sections of the two notches are opposite to each other and form a guide channel extending vertically. The mounting holes are located at the bottom of the guide channel. The guide channel is used to guide the fixing screws to be inserted into the mounting holes so as to fix the heat sink to the cover plate.

[0012] The beneficial effects of the above solution are as follows: the notches and grooves of adjacent heat sinks form a guide channel, providing precise installation guidance for the fixing screws, avoiding screw misalignment during installation, shortening assembly time, and improving mass production efficiency; moreover, the guide channel, in conjunction with the mounting holes, makes the connection between the heat sink and the cover plate more secure, reducing loosening of the connection due to vibration and temperature shock, and improving the structural stability of the equipment; finally, the notches and grooves are only set in the area corresponding to the mounting holes, which will not reduce the effective heat dissipation area of ​​the heat sink, thus balancing installation convenience and heat dissipation efficiency.

[0013] Furthermore, the heat sink also has a liquid cooling channel inside, with the inlet and outlet of the liquid cooling channel located on the side of the heat sink to allow coolant to be introduced to remove heat. The heat sink is used to connect the heat sink plate to the cover plate, and the liquid cooling channel inside enables further heat dissipation.

[0014] The advantages of the above solution are: the liquid cooling channel achieves liquid cooling and the heat sink achieves air cooling, thus forming a dual heat dissipation system. Even if a single heat dissipation path fails, the basic heat dissipation capacity can still be maintained, improving the reliability of the equipment. The inlet / outlet of the liquid cooling channel is located on the side of the heat sink, avoiding the installation area of ​​other components, and does not affect the layout of components such as circuit boards and connectors.

[0015] Furthermore, the connecting plate has a through groove that extends through the plate thickness, and the part that does not penetrate is a solid part. The through groove and the solid part each occupy half of the area of ​​the connecting plate. The through groove is used to increase the upward speed of heat, and the solid part is used to connect the cover plate.

[0016] The beneficial effects of the above solution are: the through slot on the connecting plate reduces the thermal conduction resistance, allowing the heat generated by the circuit board to rise quickly to the heat dissipation components, avoiding slow heat conduction and local heat accumulation; the through slot and the solid part each occupy 50% of the area, the solid part ensures the connection strength with the cover plate, and the through slot ensures the heat dissipation effect, avoiding sacrificing structural stability for the sake of heat dissipation, or hindering heat dissipation by strengthening the connection; at the same time, the through slot reduces the amount of material used in the connecting plate, achieving equipment lightweighting without reducing performance.

[0017] Furthermore, the frequency synthesis unit includes a crystal oscillator, a phase-locked loop chip, and a loop filter for generating a stable ultra-shortwave reference signal; the power management unit includes multiple low-noise, low-dropout linear regulators and a switching power supply for providing clean and efficient power to the frequency synthesis unit and the power amplification unit.

[0018] Furthermore, the harmonic filtering and protection unit includes a harmonic suppression low-pass filter and a standing wave ratio (VSWR) detection circuit; the power amplification unit includes a driver stage amplifier and a final stage power amplifier, used to amplify the power of the reference signal.

[0019] Furthermore, transistors are soldered onto the PCB board, the transistor surfaces are coated with thermal grease, and the transistors are connected to the connecting board to conduct heat to the heat sink.

[0020] Furthermore, the isolation panel assembly includes a long isolation panel and a short isolation panel, which are perpendicular to each other and connected to each other to isolate different functional areas and reduce mutual interference.

[0021] The beneficial effects of the above solution are: the long isolation plate and the short isolation plate are connected perpendicularly to each other, dividing the circuit board into multiple independent functional areas, blocking electromagnetic crosstalk between different areas. At the same time, the isolation plate assembly enhances the internal support strength of the circuit board assembly, improves the equipment's resistance to vibration and temperature shock, and further improves the structural stability.

[0022] Furthermore, the frequency synthesis unit is located in the shielded cavity in the upper left corner of the PCB board. It consists of a temperature-compensated crystal oscillator (TCXO), a high-performance phase-locked loop (PLL) chip, and its peripheral loop filter (LF). The charge pump power supply (VCP) and voltage-controlled oscillator (VCO) of the PLL chip are independently provided by an ultra-low noise LDO (U1), while the TCXO is powered by another LDO (U2) to ensure that its frequency stability is not affected by other circuits.

[0023] Furthermore, in the protection unit, a microstrip directional coupler samples the forward power and reflected power of the output signal, and after detection, sends them to comparator U5. The threshold of U5 is set to a corresponding VSWR of 3:1. When the reflected power exceeds the limit, U5 outputs a low level, immediately pulling down the EN signal of U3, shutting down the power amplifier power supply, and achieving millisecond-level protection. Attached Figure Description

[0024] The above and other objects, features, and advantages of exemplary embodiments of the present invention will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the invention are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein: Figure 1 A three-dimensional schematic diagram of the ultra-shortwave solid-state source device provided by the present invention. Figure 1 ; Figure 2 A three-dimensional schematic diagram of the ultra-shortwave solid-state source device provided by the present invention. Figure 2 ; Figure 3This is a top view of the ultra-shortwave solid-state source device provided by the present invention; Figure 4 This is an internal schematic diagram of the ultra-shortwave solid-state source device provided by the present invention (the shielding cover is not shown). Figure 5 This is an internal schematic diagram of the ultra-shortwave solid-state source device provided by the present invention (the shielding cover and heat sink are not shown). Figure 6 This is an internal schematic diagram of the ultra-shortwave solid-state source device provided by the present invention (showing the connection plate). Figure 7 This is an internal schematic diagram of the ultra-shortwave solid-state source device provided by the present invention (showing the partition assembly). Figure 8 This is a schematic diagram of the internal structure of the heat sink in this invention (showing the liquid cooling channel).

[0025] Explanation of reference numerals in the attached figures: 1. Shielding cover; 2. Base plate; 3. Connecting plate; 4. Cover plate; 5. Heat sink; 501. Heat sink base; 502. Heat sink plate; 6. Notch; 7. Guide channel; 8. Fixing screw; 9. PCB board; 10. RF connector; 11. Through slot; 12. Solid part; 13. Long isolation plate; 14. Short isolation plate; 15. Power quick connector; 16. USB connection port; 5011. Liquid cooling channel; 5012. Inlet; 5013. Outlet. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Those skilled in the art should understand that the embodiments described below are only some, not all, of the embodiments disclosed. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0027] The principles and spirit of the present invention will be explained in detail below with reference to several representative embodiments.

[0028] Embodiments of the ultra-shortwave solid-state source device provided by the present invention: like Figures 1 to 7 As shown, the ultra-shortwave solid-state source device includes a shielding component, a heat dissipation component, an isolation plate component, and a circuit board component. The heat dissipation component is detachably installed on the upper part of the shielding component. The circuit board component is installed inside the shielding component and includes a PCB board 9. The PCB board 9 integrates a frequency synthesis unit, a power management unit, a harmonic filtering and protection unit, and a power amplification unit. The isolation plate component is installed inside the shielding component to separate the various units of the circuit board component to reduce mutual interference.

[0029] Specifically, the shielding assembly includes a shielding cover 1, a base plate 2, and a connecting plate 3. The shielding cover 1 is open at both the top and bottom. The base plate 2 is installed at the bottom of the shielding cover 1, and the connecting plate 3 is installed at the top of the shielding cover 1. The connecting plate 3 is used to connect the heat dissipation assembly, and the circuit board assembly is located between the base plate 2 and the connecting plate 3. The shielding cover 1, together with the base plate 2 and the connecting plate 3, forms a closed cavity that completely encloses the circuit board assembly, blocking external electromagnetic interference and internal signal leakage. The connecting plate 3 serves as the top connector of the shielding cover 1, providing a stable mounting base for the heat dissipation assembly, and simultaneously constructing a heat conduction path from the circuit board to the connecting plate 3 to the heat dissipation assembly, thus balancing shielding and heat dissipation. The base plate 2, the connecting plate 3, and the shielding cover 1 form a rigid frame that fixes the circuit board assembly in the middle area, enhancing the equipment's resistance to vibration, temperature shock, and humidity changes, and preventing problems such as encapsulation cracking and connector loosening.

[0030] like Figure 1 As shown, the shielding cover 1 is equipped with an RF connector 10, a power quick-connect connector 15, and a USB connection port 16. The USB connection port adopts a USB 3.0 high-speed connection port for convenient high-speed data transmission.

[0031] In this embodiment, the shielding cover 1 and the connecting plate 3 are made of a metal material with good conductivity, and a conductive sealing strip is provided between them, which can effectively shield external electromagnetic interference and prevent internal electromagnetic signal leakage. The radio frequency connector 10 is used for the transmission of ultra-shortwave signals.

[0032] like Figure 2 and Figure 3 As shown, the heat dissipation assembly includes a cover plate 4 and a heat sink 5. The cover plate 4 is fixed to the connecting plate 3, and the heat sink 5 is fixed to the side of the cover plate 4 facing away from the connecting plate 3. The heat sink 5 includes a heat sink base 501 and heat sink plates 502. The heat sink base 501 is connected to the cover plate 4, and multiple heat sink plates 502 extend upward from the side of the heat sink base 501 facing away from the cover plate 4. The cover plate 4 is used for signal shielding and heat conduction. The cover plate 4 serves as both a closed structure at the top of the shielding cover 1, enhancing the electromagnetic shielding effect, and a heat conduction function, transferring the heat from the connecting plate 3 to the heat sink 5, achieving dual functionality and improving the utilization of structural space. The heat dissipation assembly is detachably connected to the connecting plate 3, facilitating future inspection or replacement of the heat sink 5 and circuit board assembly, reducing maintenance costs.

[0033] The heat sink 501 and the cover plate 4 are connected by fixing screws 8. Specifically, the heat sink 501 has mounting holes, and the adjacent heat sinks 502 corresponding to the mounting holes each have notched grooves 6. The cross-sections of two notched grooves 6 are opposite to each other, forming a vertically extending guide channel 7. The mounting holes are located at the bottom of the guide channel 7, which guides the fixing screws 8 to be inserted into the mounting holes to fix the heat sink 501 to the cover plate 4. The notched grooves 6 of adjacent heat sinks 502 forming the guide channel 7 provide precise installation guidance for the fixing screws 8, avoiding screw misalignment during installation, shortening assembly time, and improving mass production efficiency. Furthermore, the guide channel 7, in conjunction with the mounting holes, makes the connection between the heat sink 501 and the cover plate 4 more secure, reducing loosening caused by vibration and temperature shock, and improving the structural stability of the equipment. Finally, the notched grooves 6 are only provided in the area corresponding to the mounting holes, so they do not reduce the effective heat dissipation area of ​​the heat sinks 502, balancing installation convenience and heat dissipation efficiency.

[0034] In addition, such as Figure 8 As shown, the heat sink 501 also has a liquid cooling channel 5011 inside. The inlet 5012 and outlet 5013 of the liquid cooling channel 5011 are located on the side of the heat sink 501 to allow coolant to flow in and remove heat. The heat sink 501 is used to connect the heat sink 502 to the cover plate 4, and the liquid cooling channel 5011 inside further dissipates heat. The liquid cooling channel 5011 provides liquid cooling, and the heat sink 502 provides air cooling, thus forming a dual heat dissipation system. Even if a single heat dissipation path fails, the basic heat dissipation capacity can still be maintained, improving the reliability of the equipment. The inlet / outlet of the liquid cooling channel is located on the side of the heat sink 501, avoiding the installation area of ​​other components and not affecting the layout of components such as circuit boards and connectors.

[0035] In this embodiment, as Figure 8 As shown, the liquid cooling channel 5011 is a serpentine channel. In other embodiments, the liquid cooling channel may also be a V-shaped channel.

[0036] like Figure 6 As shown, the connecting plate 3 has a through groove 11 that penetrates the plate thickness, and the part that does not penetrate is the solid part 12. The through groove 11 and the solid part 12 each occupy half of the area of ​​the connecting plate 3. The through groove 11 is used to improve the upward speed of heat, and the solid part 12 is used to connect the cover plate 4. The through groove 11 on the connecting plate 3 reduces the heat conduction resistance, allowing the heat generated by the circuit board to rise quickly to the heat dissipation component, avoiding slow heat conduction and local heat accumulation. The through groove 11 and the solid part 12 each occupy 50% of the area. The solid part 12 ensures the connection strength with the cover plate 4, and the through groove 11 ensures the heat dissipation effect, avoiding sacrificing structural stability for the sake of heat dissipation, or hindering heat dissipation by strengthening the connection. At the same time, the through groove 11 reduces the amount of material used in the connecting plate 3, achieving lightweighting of the equipment without reducing performance.

[0037] In this embodiment, the frequency synthesis unit includes a crystal oscillator, a phase-locked loop chip, and a loop filter to generate a stable UHF reference signal; the power management unit includes multiple low-noise, low-dropout linear regulators and a switching power supply to provide clean and efficient power to the frequency synthesis unit and the power amplification unit.

[0038] In this embodiment, the harmonic filtering and protection unit includes a harmonic suppression low-pass filter and a standing wave ratio (VSWR) detection circuit; the power amplification unit includes a driver stage amplifier and a final stage power amplifier, used to amplify the power of the reference signal.

[0039] In this embodiment, transistors are soldered onto the PCB board 9, the transistor surfaces are coated with thermal grease, and the transistors are connected to the connecting plate 3 to conduct heat to the heat sink 5. Specifically, the transistors are secured to the heat sink 5 and the connecting plate 3 with screws 8.

[0040] It should be noted that the core of the module is an eight-layer PCB. Its layer stack-up, from top to bottom, is as follows: top component layer (L1), RF signal layer (L2), analog ground layer (L3), power layer 1 (L4), power layer 2 (L5), digital ground layer (L6), digital signal layer (L7), and bottom solder layer (L8). Analog ground (L3) and digital ground (L6) are connected at a single point near the power input interface of the PCB through a 0-ohm resistor R0.

[0041] The frequency synthesis unit, located in the shielded cavity at the upper left corner of the PCB, consists of a temperature-compensated crystal oscillator (TCXO), a high-performance phase-locked loop (PLL) chip, and its peripheral loop filter (LF). The charge pump power supply (VCP) and voltage-controlled oscillator (VCO) power supply of the PLL chip are independently provided by an ultra-low noise LDO (U1). The TCXO is powered by another LDO (U2) to ensure that its frequency stability is not affected by other circuits.

[0042] The power amplifier unit is located on the right side of the PCB. The RF signal generated by the phase-locked loop passes through a driver amplifier PA_Dri before being sent to the core balanced amplifier circuit. Figure 2 The circuit consists of a 3dB 90° bridge coupler HYB implemented using L4 / L5 layer striplines, a pair of precisely matched LDMOS power transistors Q1 and Q2, and a 50-ohm isolation load Riso. The input signal is split into two signals with equal amplitude and 90° phase difference by the bridge HYB, which drive Q1 and Q2 respectively. The two amplified signals are recombined at the output bridge, and the inverted signal is absorbed by Riso. This structure significantly suppresses return loss and second harmonic at the output port.

[0043] In terms of the power management unit, a high-efficiency switching power supply chip U3 (such as a step-down DC-DC converter) primarily powers the high-current power amplifier unit. Its enable pin EN is connected to a GPIO pin of the microcontroller U4. When the system powers on, U4 first ensures that the frequency synthesis unit is operating stably and receives the PLL lockout detection signal LOCK. After a delay of approximately 10ms, U4 pulls the EN signal high to turn on the power amplifier, achieving sequential power-on and avoiding interference from the current surge at the moment the power amplifier turns on to the PLL circuit.

[0044] In the protection unit, a microstrip directional coupler samples the forward and reflected power of the output signal, and after detection, sends the data to comparator U5. The threshold of U5 is set to correspond to a VSWR of 3:1. When the reflected power exceeds the limit, U5 outputs a low level, immediately pulling the EN signal of U3 low and shutting down the power amplifier, achieving millisecond-level protection.

[0045] This invention successfully provides a high-performance, high-reliability ultra-shortwave solid-state source module solution through a balanced amplification architecture, a precise multi-layer PCB electromagnetic compatibility design, an efficient hybrid heat dissipation technology, and an intelligent power management and protection strategy.

[0046] like Figure 4 and Figure 7 As shown, the isolation plate assembly includes a long isolation plate 13 and a short isolation plate 14. The long isolation plate 13 and the short isolation plate 14 are perpendicular to each other and connected to each other to isolate different functional areas and reduce mutual interference. The perpendicular connection between the long isolation plate 13 and the short isolation plate 14 divides the circuit board into multiple independent functional areas, blocking electromagnetic crosstalk between different areas. At the same time, the isolation plate assembly enhances the internal support strength of the circuit board assembly, improves the equipment's resistance to vibration and temperature shock, and further improves structural stability.

[0047] The working principle of the ultra-shortwave solid-state source device provided by this invention is as follows: Excellent linearity and harmonic suppression: By adopting a balanced amplification architecture, it naturally absorbs the reflected signals inside the transistor and dissipates nonlinear products such as second harmonics on the isolated load. Excellent harmonic suppression can be achieved without adding complex external filters, simplifying the design and improving efficiency; Extremely high stability and reliability: The balanced structure is not sensitive to load mismatch. Even in the case of severe mismatch at the antenna port (such as open circuit or short circuit), it can effectively protect the expensive power transistors from being burned out. Combined with a high-efficiency embedded heat pipe heat dissipation substrate, it ensures long-term stable operation of the module at full power output; Excellent electromagnetic compatibility and spectral purity: Through the precise stack-up design of the eight-layer PCB, digital / analog ground separation, and star grounding, the digital phase-locked loop noise and analog RF signals are completely isolated. The graded power supply and sequential power-on strategy eliminates interference from power supply switching transients on sensitive frequency synthesis circuits, resulting in extremely low phase noise and spurious levels. The built-in VSWR detection and protection circuit monitors the output status in real time and quickly cuts off the power amplifier in abnormal situations, providing robust protection for the module in complex field environments. Liquid cooling channel 5011 provides liquid cooling, while heat sink 502 provides air cooling, forming a dual heat dissipation system. Even if a single heat dissipation path fails, basic heat dissipation capacity is maintained, ensuring long-term stable system operation. Frequency band coverage: Based on multi-level frequency multiplication and spatial multi-layer technology, it supports signal output from 30 MHz to 300 MHz. High reliability: The coordinated design of the power supply and control protection units effectively addresses load fluctuations and overheating risks, extending module lifespan.

[0048] Based on the above description in this specification, those skilled in the art will also understand that the following terms, such as "upper," "lower," "front," "rear," "left," "right," "width," "horizontal," "top," "bottom," "inner," and "outer," which indicate orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings of this specification. They are only for the purpose of facilitating the explanation of the present invention and simplifying the description, and do not explicitly or implicitly suggest that the device or element involved must have the specific orientation, or be constructed and operated in a specific orientation. Therefore, the above-mentioned orientation or positional relationship terms should not be understood or interpreted as limitations on the present invention.

[0049] In addition, in the description of this specification, "multiple" means at least two, such as two, three or more, etc., unless otherwise expressly and specifically defined.

Claims

1. An ultra-shortwave solid-state source device, characterized in that: It includes a shielding component, a heat dissipation component, an isolation plate component, and a circuit board component. The heat dissipation component is detachably installed on the upper part of the shielding component. The circuit board component is installed inside the shielding component. The circuit board component includes a PCB board, which integrates a frequency synthesis unit, a power management unit, a harmonic filtering and protection unit, and a power amplification unit. The isolation plate assembly is installed inside the shielding assembly to separate the various units of the circuit board assembly, thereby reducing mutual interference.

2. The ultra-shortwave solid-state source device according to claim 1, characterized in that: The shielding assembly includes a shielding cover, a base plate, and a connecting plate. The shielding cover is open at both the top and bottom. The base plate is installed at the bottom of the shielding cover, and the connecting plate is installed at the top of the shielding cover. The connecting plate is used to connect the heat dissipation assembly, and the circuit board assembly is located between the base plate and the connecting plate.

3. The ultra-shortwave solid-state source device according to claim 2, characterized in that: The heat dissipation assembly includes a cover plate and a heat sink. The cover plate is fixed to the connecting plate, and the heat sink is fixed to the side of the cover plate facing away from the connecting plate. The heat sink includes a heat sink base and a heat sink plate. The heat sink base is connected to the cover plate, and multiple heat sink plates extend upward from the side of the heat sink base facing away from the cover plate. The cover plate is used for signal shielding and heat conduction.

4. The ultra-shortwave solid-state source device according to claim 3, characterized in that: The heat sink has mounting holes, and the adjacent heat sink plates corresponding to the mounting holes have notches. The cross-sections of the two notches are opposite to each other and form a guide channel extending vertically. The mounting holes are located at the bottom of the guide channel. The guide channel is used to guide the fixing screws to be inserted into the mounting holes so as to fix the heat sink to the cover plate.

5. The ultra-shortwave solid-state source device according to claim 4, characterized in that: The heat sink also has a liquid cooling channel inside, with the inlet and outlet of the liquid cooling channel located on the side of the heat sink to allow coolant to be introduced to remove heat. The heat sink is used to connect the heat sink plate to the cover plate, and the liquid cooling channel inside enables further heat dissipation.

6. The ultra-shortwave solid-state source device according to any one of claims 1 to 5, characterized in that: The frequency synthesis unit includes a crystal oscillator, a phase-locked loop chip, and a loop filter to generate a stable UHF reference signal; the power management unit includes multiple low-noise, low-dropout linear regulators and a switching power supply to provide clean and efficient power to the frequency synthesis unit and the power amplification unit.

7. The ultra-shortwave solid-state source device according to claim 6, characterized in that: The harmonic filtering and protection unit includes a harmonic suppression low-pass filter and a standing wave ratio (VSWR) detection circuit; the power amplification unit includes a driver stage amplifier and a final stage power amplifier, used to amplify the power of the reference signal.

8. The ultra-shortwave solid-state source device according to claim 7, characterized in that: Transistors are soldered onto the PCB board, the transistor surfaces are coated with thermal grease, and the transistors are connected to the connecting board to conduct heat to the heat sink.

9. The ultra-shortwave solid-state source device according to claim 8, characterized in that: The frequency synthesis unit is located in the shielded cavity in the upper left corner of the PCB board. It consists of a temperature compensated crystal oscillator (TCXO), a high-performance phase-locked loop (PLL) chip, and its peripheral loop filter (LF). The charge pump power supply (VCP) and voltage-controlled oscillator power supply (VCO) of the PLL chip are independently provided by an ultra-low noise LDO (U1), while the TCXO is powered by another LDO (U2) to ensure that its frequency stability is not affected by other circuits.

10. The ultra-shortwave solid-state source device according to claim 9, characterized in that: In the protection unit, a microstrip directional coupler samples the forward and reflected power of the output signal, and after detection, sends it to comparator U5. The threshold of U5 is set to a corresponding VSWR of 3:

1. When the reflected power exceeds the limit, U5 outputs a low level, immediately pulling down the EN signal of U3, shutting down the power amplifier power supply, and achieving millisecond-level protection.

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