The invention relates to the technical field of
integrated circuit power supply, in particular to a modular multi-stage
distributed power supply architecture and method for a whole
wafer computing
system, the architecture comprises a computing
wafer, a power supply module, a bearing substrate and an integrated heat dissipation
system, the computing
wafer is integrated with various computing units with different
voltage requirements, and the power supply module is connected with the integrated heat dissipation
system. The power supply module is integrated with the computing wafer through a high-density
interconnection interface, a multi-stage power supply topology is adopted in the power supply module, the power supply module comprises a first-stage central
power management unit, a second-stage distributed
voltage regulation unit array, a high-density embedded
capacitor array and a global multi-domain
power management integrated circuit, and the bearing substrate is used for bearing related parts. The integrated heat dissipation system carries out
differential heat dissipation according to different heat dissipation densities. According to the invention,
global optimization of power supply efficiency, precision and thermal management can be realized, and the complex power supply problem of the whole wafer system can be effectively solved.